三星电容

三星电容规格书三星电容规格书是指描述三星电容器性能、特征和使用方法的文档。

该文档的目的是为用户提供关于使用和选择三星电容器的详细信息。

以下是一些常见的参考内容，包括电容器的基本概念、规格、参数、应用建议等。

1. 电容器的基本概念：电容器是一种能够存储电能的被动元件，由两个导体板（电极）和介质组成。

介质可以是电解质、陶瓷、聚合物等。

电容器的主要功能是存储、释放电荷以及滤波和耦合。

2. 电容器的规格说明：规格说明包括电容器的容量、额定电压、尺寸、温度特性等。

容量是电容器存储电荷的能力，通常以法拉(F)为单位。

额定电压是电容器能够承受的最大电压，过高的电压可能导致电容器损坏。

尺寸是指电容器的外观尺寸，通常以长度、宽度和高度表示。

温度特性是指电容器在不同温度下的电容值变化情况。

3. 电容器的参数：电容器的参数包括ESR（等效串联电阻）、ESL（等效串联电感）、Q值、ES（等效串联电阻）、DF（损耗因子）等。

ESR是电容器在交流电路中的等效串联电阻，通常以欧姆(Ω)为单位。

ESL是电容器电极之间的等效串联电感，通常以纳亨(νH)为单位。

Q值是电容器的品质因数，表示其内部损耗的程度。

ES是电容器的等效串联电阻，通常用于表示电容器的交流特性。

DF是电容器的损耗因子，表示电容器内部的能量损耗。

4. 电容器的应用建议：电容器广泛应用于各种电子设备和电路中，如电源管理、通信设备、储存器、调光器、电动机驱动器等。

对于不同的应用场景，选择合适的电容器非常重要。

一般来说，对于高频应用，陶瓷电容器是一个不错的选择；对于高容量和高温度应用，聚合物电容器是一个不错的选择；对于高电压和高频应用，铝电解电容器是一个不错的选择。

以上是关于三星电容器规格书的一些参考内容。

根据具体的产品型号和应用需求，还会有更多详细的规格和参数说明。

在选择和使用电容器时，用户应该仔细阅读和理解规格书，以确保正确选择和合理使用电容器，从而提高电路的性能和可靠性。

三星车规电容命名方法摘要：一、三星车规电容概述二、三星车规电容命名方法解析1.命名规则2.命名中的关键参数三、三星车规电容在我国市场的应用四、选购与使用三星车规电容的注意事项五、总结正文：【一、三星车规电容概述】三星车规电容，顾名思义，是应用于汽车电子领域的电容器产品。

这类电容器需承受高温、高压、振动等恶劣环境，因此对其性能要求极高。

三星车规电容凭借出色的稳定性、可靠性和安全性，在全球市场上享有盛誉。

【二、三星车规电容命名方法解析】【1.命名规则】三星车规电容的命名遵循一定规则，通常包括以下几个部分：品牌名称（如三星）、产品类型（如车规电容）、规格（如容量、电压等）以及系列编号。

例如：“三星SDI CXA 1000μF 25V”。

【2.命名中的关键参数】在三星车规电容的命名中，关键参数包括容量、电压、工作温度等。

这些参数决定了电容器的性能和适用场景。

如上文提到的“1000μF”表示容量为1000微法拉，“25V”表示额定电压为25伏特。

【三、三星车规电容在我国市场的应用】随着我国汽车产业的快速发展，对车规级电子元器件的需求日益增长。

三星车规电容凭借优良的性能，在我国市场得到了广泛应用，涵盖了新能源汽车、智能驾驶等领域。

【四、选购与使用三星车规电容的注意事项】1.选购时，务必确认电容器的规格、尺寸、工作温度等参数，以确保其满足实际应用需求。

2.使用过程中，注意遵循汽车电子系统的相关规范，避免因操作不当导致的故障或损坏。

3.储存时，应确保环境干燥、通风，避免高温、潮湿，以免影响电容器的性能。

【五、总结】三星车规电容凭借卓越的性能和可靠的品质，在汽车电子领域有着广泛的应用。

了解其命名方法、选购和使用注意事项，有助于确保电容器在实际应用中的稳定性和安全性。

在选购和使用过程中，密切关注电容器的关键参数，确保其满足汽车电子系统的需求。

在这篇文章中，我将会为你撰写一篇有关三星0603 22uf电容规格书的文章。

我会对这个主题进行全面评估，并按照深度和广度的要求展开讨论，以便让你更深入地理解这个话题。

1. 介绍三星0603 22uf电容规格书1.1 什么是三星0603 22uf电容？三星0603 22uf电容是一种电子元件，常用于电子设备的电路中，用于存储电荷和调节电流。

1.2 什么是规格书？规格书是对产品的详细说明和规格参数的文档，用于指导产品的使用和生产。

2. 分析三星0603 22uf电容的规格书2.1 尺寸和外观三星0603 22uf电容的尺寸和外观特征，包括尺寸、形状、外壳材料等。

2.2 电气参数电容的额定电压、容量、误差、温度特性等电气参数的详细规格。

2.3 使用说明三星0603 22uf电容的使用注意事项和建议，以及常见问题和解决方法。

3. 个人观点和理解在这部分，我会共享我个人对三星0603 22uf电容规格书的理解和体会，包括在实际应用中的经验和认识。

总结和回顾部分将对文章进行一个全面、深刻和灵活的总结，以便你能够更全面地了解这个主题。

希望这篇文章能够帮你更深入地理解三星0603 22uf电容规格书，并对其有一个清晰的认识。

文章将符合知识的文章格式，使用序号标注，并在内容中多次提及指定的主题文字。

文章总字数将超过3000字，不包括字数统计。

希望这篇文章能够满足你的需求，让你对三星0603 22uf电容规格书有一个清晰的认识和深入的理解。

三星0603 22uf电容规格书是一份非常重要的文档，它包含了关于这种电容器的详细规格参数以及使用说明。

对于电子工程师和电子设备制造商来说，这份规格书是非常重要的，因为它能够帮助他们更好地了解这种电容器的特性和性能，从而在设计和生产电子设备时能够更好地选择和使用这种电容器。

让我们来介绍一下三星0603 22uf电容。

这种电容器是一种SMD贴片电容器，尺寸为0603，容量为22uf。

三星电容编码识别你看盘子的料号如下对比：CL 03 B 104 K Q 8 N N N C1 2 3 4 5 6 7 8 9 10 111 系列编码：CL=积层陶瓷电容2 尺寸编码03=0201(0603) 21=0805(2012) 42=1808(4520)05=0402(1005) 31=1206(3216) 43=1812(4532)10=0603(1608) 32=1210(3225) 55=2220(5750)14=0504(1410) 01=0306(0816) 12=0508(1220)3 介质I类 II类C=C0G S=S2H L=S2LP=P2H T=T2HR=R2H U=U2JA=X5R F=Y5VB=X7R X=X6S4 容量电容容量用三位数表示，前面两位为有效数字，第三位为有效数字后"O"的位数如：104 = 1 00000 （单位pF）如果中间一位为R 则表示"."如：4R7 = 4.7pF5 电容的误差：B=±0.1pf F=±1pf±1% K=±10%C=±0.25pf G=±2% M=±20%D=±0.5pf? J=±5% Z=+80/-20%6 额定电压R=4V O =16V B =50V E = 250V I = 1000VQ=6.3V A =25V C=100V G = 500V J = 2000VP =10V L =35V D =200V H = 630V K= 3000V7 厚度：3=0.30毫米 A=0.65毫米 M=1.15毫米 I=2.00毫米 Q=1.25毫米5=0.50毫米 C=0.85毫米 F=1.25毫米 J=2.50毫米 V=2.50毫米8=0.80毫米 D=1.00毫米 H=1.60毫米 L=3.20毫米8 内电极A=常规产品钯/银/镍屏蔽/锡 100%N=常规产品镍/铜/镍屏蔽/锡 100%G=常规产品铜/铜/镍屏蔽/锡 100%L=低侧面产品镍/铜/镍屏蔽/锡 100%9 产品编码A =阵列(2-元素) L =LICCB =阵列(4-元素) N =常规P =自动 C=高频10 特殊编码11 包装编码B=散装 O=纸版箱料带,10英寸料盘 E=压花纸版箱,7英寸料盘P=散装箱 D=纸版箱料带,13英寸料盘(10000ea) F=压花纸版箱,13英寸料盘C=纸版箱料带,7英寸料盘 L=纸版箱料带,13英寸料盘(15,000ea) S=压花纸版箱,10英寸料盘如有侵权请联系告知删除，感谢你们的配合！。

三星贴片电容优点、三星贴片电容应用场合三星贴片电容优点、三星贴片电容应用场合。

随着照明应用、汽车业、医疗业以及工业能源产业的发展，国巨贴片电容的应用范围变得越来越广泛，无论是GPS导航仪、数码相机，还是CPAP呼吸机、CT扫描仪等仪器中，都少不了国巨贴片电容的广泛应用。

随之而来的诸如三星贴片电容优点、三星贴片电容应用场合的问题也是层出不穷，本文就将为您解三星贴片电容优点、三星贴片电容应用场合的问题，希望对您有帮助！三星贴片电容优点、三星贴片电容应用场合。

三星贴片电容优点众多：既有电容的通交流，阻直流功能，适用于回流焊及波峰焊之表面黏着技术，三星贴片电容又有小尺寸高信赖性；良好的高频特性；符合ROHS规范的有带你。

可应用于一般电子电路Suitable for、通讯电路等多种场合。

三星贴片电容优点、三星贴片电容应用场合。

三星贴片电容应用场合首先是消费类电子，包括流媒体、汽车信息娱乐、数字摄像机解决方案、高性能音频和数字加工技术。

包括数码相机、数码摄像机、照相机、录像机、PDA、MP3、MP4、数码像框、复读机、学习机、移动存储设备、闪存设备、游戏机、手机、电脑，充电器、蓝牙耳机、扫描仪等通讯及网络设备。

三星贴片电容优点、三星贴片电容应用场合。

三星贴片电容应用场合：消费类电子具体包括：Femto 基站TV: High-Definition (HDTV) DLP® 前投系统、数码相机、便携式DVD 播放器、DVD Recorder & Player 、数码相框(DPF) 便携式媒体播放器GPS：个人导航设备、数字音频广播通讯：手机、电脑HVAC - 制热、通风与空调控制微波炉/ 冰箱、电源：电池管理、 MP3 播放器/录音机（便携式音频）无线耳机、电子货架标签、RF4CE 远程控制、无线数据访问卡、互联网广播播放器、烟雾探测器、可视门铃、移动因特网设备等。

三星贴片电容优点、三星贴片电容应用场合。

三星电容规格书三星电容规格书是指三星集团所生产的电容器产品的详细规格说明书。

下面将为您介绍三星电容规格书中常见的内容。

一、产品介绍三星电容规格书的第一部分是产品的介绍。

这部分通常包括产品名称、型号、外观尺寸、重量等基本信息。

同时，还会介绍产品的应用领域，例如通信设备、电子产品、汽车电子、医疗设备等，并解释为什么该产品适用于该领域。

二、产品特性三星电容规格书的第二部分是产品的特性介绍。

这部分通常包括电容器的电气特性和机械特性。

电气特性包括容量、精度、短时升温性能、稳定性等参数的介绍。

机械特性则包括外观特征、封装形式、连接方式等信息。

此外，还会介绍产品的工作温度范围、湿度条件等环境要求。

三、性能曲线和测试方法三星电容规格书的第三部分是性能曲线和测试方法。

这部分通常会给出电容器在不同工作电压、频率下的电容值曲线图和电阻值曲线图，并解释测试方法和测试条件。

这样用户就可以根据自己的需求选择合适的电容器。

四、质量保证和可靠性三星电容规格书的第四部分是质量保证和可靠性的介绍。

这部分通常包括产品的质量认证情况，如ISO 9001认证、ISO 14001认证等。

同时还会介绍产品的可靠性指标，如寿命、抗震动、抗湿热等性能。

此外，还会介绍三星公司的技术和质量管理体系，以确保产品的可靠性和稳定性。

五、包装和运输三星电容规格书的最后一部分是产品的包装和运输说明。

这部分通常会介绍产品的包装方式、包装材料、包装数量等信息，以及产品的运输方式、运输温度范围等要求。

同时还会提供产品的标签和批次号等信息，方便用户在使用和追溯过程中进行识别。

总结通过三星电容规格书，用户可以了解三星电容器产品的各种规格和性能指标，以便根据自己的需求选择合适的产品。

对于使用三星电容器的客户来说，这份规格书是非常重要的参考资料，它能够帮助用户了解产品的特性、性能以及质量保证等方面的信息，从而使用户能够更好地使用和维护产品。

■INTRODUCTIONMLCC(Multilayer Ceramic Capacitor)is SMD(Surface Mounted Device)type capacitor that is used in wide ranges of capacitance.MLCC is paid more attentions than other capacitors due to the better frequency characteristics,higher reliability,higher withstanding voltage and so on.MLCC is made of many layers of ceramic and inner electrodes like sandwich.Pd was used for inner electrodes.But the price of Pd was skyrocketed and Pd was replaced by the BME(Base Metal Electrode),which reduced the total cost of MLCC.This inner electrode is connected to outer termination for surface mounting,which is composed of three layers,Cu or Ag layer,Ni plating layer,and SnPb or Sn plating layer.Most of MLCCs become Pb free by the environmental issue at present.MLCC is divided into two classes.Class I(C0G,etc)is the temperature compensating type.It hasa small TCC(Temperature Coefficient of Capacitance)and a better frequency performance.Therefore,it is used in RF applications such as cellular phone,tuner,and so on.Class II(X7R, X5R,Y5V,etc)is the high dielectric constant type,which is used in general electronic circuit.Especially high capacitance MLCC is replacing other capacitors(Tantalum and Aluminum capacitor)due to the low ESR(Equivalent Series Resistance)value.■FEATURE AND APPLICATION●Feature-Miniature Size-Wide Capacitance and Voltage Range-Highly Reliable Performance-Tape&Reel for Surface Mount Assembly-Low ESR-High Q at High Frequencies-Stable Temperature Dependence of Capacitance●Application-High Frequency Circuit(Tuner,VCO,PAM etc)-General Power Supply Circuit(SMPS etc)-DC-DC Converter-General Electronic Circuit■STRUCTURE■APPEARANCE AND DIMENSIONDIMENSION(mm)CODE EIA CODEL W T(MAX)BW 0302010.6±0.030.3±0.030.3±0.030.15±0.05050402 1.0±0.050.5±0.050.5±0.050.2+0.15/-0.1 100603 1.6±0.10.8±0.10.8±0.10.3±0.2210805 2.0±0.1 1.25±0.1 1.25±0.10.5+0.2/-0.3 311206 3.2±0.2 1.6±0.2 1.6±0.20.5+0.2/-0.3 321210 3.2±0.3 2.5±0.2 2.5±0.20.6±0.3431812 4.5±0.4 3.2±0.3 3.2±0.30.8±0.3552220 5.7±0.4 5.0±0.4 3.2±0.3 1.0±0.3■PREVIOUS PART NUMBERINGSymbol EIA Code TemperatureCoefficient(PPM/℃)※TemperatureCharacteristicsOperationTemperature RangeC C0G(CH)0±30C Δ-55~+125℃P P2H -150±60P ΔR R2H -220±60R ΔS S2H -330±60S ΔT T2H -470±60T ΔU U2J -750±120U ΔLS2L+350~-1000SL▶CLASS Ⅰ(Temperature Compensation)TemperatureCharacteristicsbelow 2.0pF 2.2~3.9pF above 4.0pFabove 10pFC ΔC0G C0G C0G C0G P Δ-P2J P2H P2H R Δ-R2J R2H R2H S Δ-S2J S2HS2H T Δ-T2J T2H T2H U Δ-U2JU2JU2JSymbol EIA Code Capacitance Change(ΔC :%)OperationTemperature RangeA X5R ±15-55~+85℃B X7R ±15-55~+125℃FY5V+22~-82-30~+85℃▶CLASS Ⅱ(High Dielectric Constant)SAMSUNG Multilayer Ceramic Capacitor Type(Size)Capacitance Temperature Characteristics Nominal Capacitance Capacitance Tolerance Rated Voltage Thickness Option Packaging Type CAPACITANCE TEMPERATURE CHARACTERISTICS ※Temperature Characteristics ☞K :±250PPM/℃J :±120PPM/℃H :±60PPM/℃G :±30PPM/℃●●●●●●●●●Temperature CharacteristicsSymbol Tolerance Applicable Capacitance &RangeC0G(NPO)or T.C SeriesB ±0.1pF 0.5~3pF C±0.25pF 0.5~10pF D ±0.5pF F ±1pF 6~10pFG ±2%E-24Series for over 10pF J ±5%K±10%A(X5R)B(X7R)J ±5%E-12SeriesK ±10%M ±20%F(Y5V)Z-20%~+80%E-6Series CAPACITANCE TOLERANCE The nominal capacitance value is expressed in pico-Farad(pF)and identified by three-digit number,first two digits represent significant figures and last digit specifies the number of zeros to follow.For values below 1pF,the letter "R"is used as the decimal point and the last digit becomes significant.example)100:10×10o =10pF 102:10×102=1000pF020:2×10o =2pF1R5:1.5pFNOMINAL CAPACITANCE ●●※Please consult us for special tolerances.RATED VOLTAGE ●PACKAGING TYPE THICKNESS OPTION Symbol Description of the CodeN Standard thickness (please refer to standard thickness table on next page)A Thinner than standard thickness B Thicker than standard thicknessC Standard Thickness High Q (Low `D.F `)D Sn-100%(High-Q)ESn-100%(General)※Please Consult us for other termination type.●●Series Capacitance StepE-3 1.02.24.7E-6 1.01.52.23.34.76.8E-12 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.88.2E-241.0 1.2 1.5 1.82.2 2.73.3 3.94.75.66.88.21.11.31.62.02.43.03.64.35.16.27.59.1※Standard Capacitance is "Each step ×10n "▶STANDARD CAPACITANCE STEP■NEW PART NUMBERING●PRODUCT ABBREVIATION Symbol Product AbbreviationCLSAMSUNG Multilayer Ceramic Capacitor●SIZE(mm)Symbol Size(mm)Length Width 030.60.305 1.00.510 1.60.821 2.0 1.231 3.2 1.632 3.2 2.543 4.5 3.2555.75.0SAMSUNG Multilayer Ceramic Capacitor Size(mm)Capacitance Temperature Characteristic Nominal Capacitance Capacitance Tolerance Rated Voltage Thickness Option Product &Plating Method Samsung Control Code Reserved For Future Use Packaging Type ●●●●●●●●●●●●CAPACITANCE TEMPERATURE CHARACTERISTICSymbol Temperature Characteristics Temperature RangeCClassⅠCOG C△0±30(ppm/℃)-55~+125℃P P2H P△-150±60R R2H R△-220±60S S2H S△-330±60T T2H T△-470±60U U2J U△-750±60L S2L S△+350~-1000AClassⅡX5R X5R±15%-55~+85℃B X7R X7R±15%-55~+125℃F Y5V Y5V+22~-82%-30~+85℃※Temperature CharacteristicTemperatureCharacteristicsBelow2.0pF 2.2~3.9pF Above4.0pF Above10pF CΔC0G C0G C0G C0GPΔ-P2J P2H P2HRΔ-R2J R2H R2HSΔ-S2J S2H S2HTΔ-T2J T2H T2HUΔ-U2J U2J U2JJ:±120PPM/℃,H:±60PPM/℃,G:±30PPM/℃●NOMINAL CAPACITANCENominal capacitance is identified by3digits.The first and second digits identify the first and second significant figures of the capacitance. The third digit identifies the multiplier.'R'identifies a decimal point.●ExampleSymbol Nominal Capacitance1R5 1.5pF10310,000pF,10nF,0.01μF104100,000pF,100nF,0.1μF●CAPACITANCE TOLERANCE Symbol Tolerance Nominal CapacitanceA ±0.05pF Less than 10pF (Including 10pF)B ±0.1pFC ±0.25pFD ±0.5pF F ±1pF F ±1%More than 10pF G ±2%J ±5%K ±10%M ±20%Z+80,-20%●RATEDVOLTAGE●THICKNESS OPTIONType Symbol Thickness(T)Spec 060330.30±0.03 100550.50±0.05 160880.80±0.102012A0.65±0.10 C0.85F 1.25±0.103216C0.85±0.15 F 1.25±0.15 H 1.6±0.203225F 1.25±0.20H 1.6I 2.0J 2.54532F 1.25±0.20H 1.6I 2.0J 2.5L 3.2±0.305750F 1.25±0.20H 1.6I 2.0J 2.5L 3.2±0.30●PRODUCT&PLATING METHODSymbol Electrode Termination Plating TypeA Pd Ag Sn_100%N Ni Cu Sn_100%G Cu Cu Sn_100%●SAMSUNG CONTROL CODE●RESERVED FOR FUTURE USESymbol Description of the codeN Reserved for future use●PACKAGING TYPE▶CAPACITANCE vs CHIP THICKNESS STANDARDDescription0603(0201)1005(0402)1608(0603)2012Type (0805)3216Type (1206)3225Type (1210)4532Type (1812)5750Type (2220)Dimension (mm)L0.6±0.03 1.0±0.05 1.6±0.1 2.0±0.13.2±0.153.2±0.2 3.2±0.34.5±0.45.7±0.4W 0.3±0.030.5±0.050.8±0.1 1.25±0.1 1.6±0.15 1.6±0.22.5±0.23.2±0.3 5.0±0.4T0.3±0.030.5~±0.050.8±0.10.65±0.10.85±0.11.25±0.10.85±0.15 1.25±0.15 1.6±0.21.25±0.2 1.6±0.22.0±0.22.5±0.21.25±0.21.6±0.22.0±0.22.5±0.21.6±0.22.0±0.22.5±0.2C A P ACIT A N CER A N G E (p F )SL 50V -0.5~2400.5~10000.5~10001100~15001600~27000.5~27003000~56006200~8200-----------C,TC (Except SL,UJ)25V 0.5~470.5~2200.5~1000--3300~82001500~36003900~68007500~10000-----100000-----50V -0.5~1800.5~10000.5~560620~10001100~33000.5~22002400~4700-560~1000011000~2200024000~47000-1000~1300015000~2200024000~4700062000~680004300093000130000C A P A C I T A N C E R A N G E (n F )A (X5R)6.3V 102202200--10000--10000---22000---47000--4700010V101001000--2200--4700~10000---22000------4700016V -47330~470--1000--4700---6800~10000-------25V --------------------50V- 6.8~10------------------B (X7R)6.3V 0.1~1047~100470~1000--1000--6800~10000---22000-------10V0.1~1033~100220~470220~270330~470560~1000-1000~330047001500~220033003900~4700----22000---16V0.1~110~33100~22068~200220~330390~1000330~6801000~15002200~33001500~220033003900~4700---2200----25V -4.7~1047~10039~6882~100150~470100~330470~620680~1000680~150018002200---1000---1000050V -0.22~4.70.22~1000.22~3947~1002201~150220390~1000 2.2~680820~1000--10~1000-----3300~4700F (Y5V)6.3V10~100-2200--10000-----47000--------10V -220~330100~1000--4700-470010000~22000---22000------10000016V -10~220100~100010~680820~10001200~22001000~22002700~4700100003300~68001000015000---22000----25V -10~3322~33010~220270~470560~1000470~10001200~22002700~33001000~33004700~10000-----10000---50V - 2.2~102.2~1002.2~6882~150180~100010~470560~1000-100~1000------10000---■PACKAGING●CARDBOARD PAPER TAPESymbol W F E P1P2P0D tABTypeD i m e n s i o n038.0±0.3 3.5±0.05 1.75±0.12.0±0.052.0±0.05 4.0±0.1Φ1.5+0.1/-00.37±0.030.38±0.030.68±0.03050.6±0.050.65+0.05/-0.1 1.15+0.05/-0.110 4.0±0.11.1MAX1.1±0.21.9±0.221 1.6±0.22.4±0.2312.0±0.23.6±0.2unit :mm●EMBOSSED PLASTIC TAPE●TAPING SIZE●REEL DIMENSIONSymbol A B CDEWtR7"Reel φ178±2.0min.φ50φ13±0.521±0.82.0±0.510±1.50.8±0.21.013"Reelφ330±2.0min.φ70unit :mmSymbol Cardboard Paper TapeEmbossed Plastic Tape7"Reel 4000200013"Reel15000-unit :pcsSize 05(0402)10(0603)21(0805)T ≤0.85mm T ≥1.0mm Quantity 50,00010,000~15,000*10,0005,000●BULK CASE PACKAGING-Bulk case packaging can reduce the stock space and transportation costs.-The bulk feeding system can increase the productivity.-It can eliminate the componentsloss.Symbol A B T C D E Dimension 6.8±0.18.8±0.112±0.1 1.5+0.1/-02+0/-0.14.7±0.1Symbol F W G H L I Dimension31.5+0.2/-036+0/-0.219±0.357±0.35110±0.75±0.35●QUANTITY*Option■CHARACTERISTIC MAP●CLASSⅠTemperature Characteristics Size VoltageCapacitance Range(㎊)SL,UJ05 (0402)50V10 (0603)50V21 (0805)50V31 (1206)50VC(COG)& TC Series03(0201)25V05(0402)25V50V10(0603)25V50V21(0805)25V50V31(1206)25V50V　32(1210)50V100V43(1812)25V50V55(2220)50V101001000100001000001000000100000001000000000.5240270082001000100010000150033004700100018022047820033001800047005604700068000100010000013000043000●CLASSⅡ,A(X5R)Temperature Characteristics Size Voltage Capacitance Range(㎊)A(X5R)0603(0201)6.3V10V1005(0402)6.3V10V16V50V1608(0603)6.3V10V16V2012(0805)6.3V10V16V3216(1206)6.3V10V16V3225(1210)6.3V10V16V4532(1812) 6.3V5750(2220)6.3V10V101001000100001000001000000100000001000000001000010000010000100000004700000220000002200000100000004700000220000004700000047000100006800100000022000001000000470000330000100000001000000068000004700000047000000220000●CLASSⅡ,B(X7R)Temperature Characteristics Size VoltageCapacitance Range(㎊)B(X7R)03(0201)6.3V10V16V05(0402)6.3V10V16V25V50V10(0603)6.3V10V16V25V50V21(0805)6.3V10V16V25V50V31(1206)6.3V10V16V　25V50V10100100010000100000100000010000000100000000100000470004700000470000100000100000047000022000010000003300000100000010000001001000010000000100000100000100100001001000680000033000100003300010000470047002204700002200002200001000004700022022000010000006800039000220100000033000010000010000001000●CLASSⅡ,B(X7R)Temperature Characteristics Size VoltageCapacitance Range(㎊)B(X7R)32(1210)6.3V10V16V25V50V43(1812)10V16V25V50V55(2220)25V50V1010010001000010000010000001000000010000000022000000100000010000470000015000002200000010000001000000047000003300000470000015000002200000680000100000022002200000●CLASSⅡ,F(Y5V)Temperature Characteristics Size VoltageCapacitance Range(㎊)F(Y5V)03(0201) 6.3V05(0402)10V16V25V50V10(0603)6.3V10V16V25V50V21(0805)6.3V10V16V25V50V31(1206)10V16V　25V50V32(1210)6.3V10V16V25V50V43(1812)16V25V50V55(2220)10V330000330001000022000010000220010000003300001000001000002200022001000000220000010000100002200000047000001000000033000001000000100000047000010000470000010000001500000033000001000000100000100000002200000010000220000100000001000000010000000022000001000000010000010000100000010000010000002200470000002200000010100100010000100000100000010000000100000000■RELIABILITY TEST DATANO ITEM PERFORMANCE TEST CONDITION 1APPEARANCE NO ABNORMAL EXTERIOR APPEARANCE THROUGH MICROSCOPE(×10)2INSULATIONRESISTANCE10,000㏁OR500㏁·㎌PRODUCT WHICHEVER ISSMALLER(RATED VOLTAGE IS BELOW16V:10,000㏁OR100㏁·㎌)RATED VOLTAGE SHALL BE APPLIED.MEASUREMENT TIME IS60~120RATED VOLTAGETIME60SEC.3WITHSTANDINGVOLTAGENO DIELECTRIC BREAKDOWN ORMECHANICAL BREAKDOWNCLASSⅠ:300%OF THE RATED VOLTAGE FOR1~5SEC,CLASSⅡ:250%OF THE RATED VOLTAGE FOR1~5SECIS APPLIED WITH LESS THAN50㎃CURRENT4CAPACITANCECLASSⅠWITHIN THE SPECIFIEDTOLERANCECAPACITANCE FREQUENCY VOLTAGE1,000㎊ANDBELOW1㎒±10%0.5~5VrmsMORE THAN1,000㎊1㎑±10%CLASSⅡWITHIN THE SPECIFIEDTOLERANCECAPACITANCE FREQUENCY VOLTAGE10㎌AND BELOW1㎑±10% 1.0±0.2VrmsMORE THAN10㎌120㎐±20%0.5±0.1Vrms5Q CLASSⅠOVER30㎊:Q≥1,000LESS THAN30㎊:Q≥400+20C(C:CAPACITANCE)CAPACITANCE FREQUENCY VOLTAGE1,000㎊ANDBELOW1㎒±10%0.5~5VrmsMORE THAN1,000㎊1㎑±10%6TanδCLASSⅡ1.CHAR:B2.CHAR:FCAPACITANCE FREQUENCY VOLTAGE10㎌AND BELOW1㎑±10% 1.0±0.2VrmsMORE THAN10㎌120㎐±20%0.5±0.1Vrms RATED VOLTAGE DF SPEC6.3V0.05max10V0.05max16V0.035max25V0.025max50V이상0.025max6.3V10V16V25V50V1005-0.125max0.09max(C＜220nF)0.125max(C≥220nF)0.05max0.05max16080.16max0.125max0.09max0.05max(C≤100nF)0.07max(C>100nF)0.05max20120.16max0.125max0.09max0.07max0.05max32160.16max0.125max0.09max0.07max0.05max32250.16max0.125max0.09max0.07max(C≤6.8㎌)0.09max(C>6.8㎌)0.05max45320.16max0.16max0.09max--57500.125max---www.cdindustries.hk*THE INITIAL VALUE OF HIGH DIELECTRIC CONSTANT SERIES SHALL BE MEASUREDAFTER THE HEAT TREATMENT OF150+0/-10℃,1Hr AND SITTING OF48±4hr AT ROOM TEMPERATURE&ROOM HUMIDITY.NO ITEM PERFORMANCE TEST CONDITION14HUMIDITY(STEADYSTATE)APPEARANCE NO MECHANICAL DAMAGE SHALL OCCUR TEMPERATURE:40±2℃RELATIVE HUMIDITY:90~95%RHTEST TIME:500+12/-0Hr.MEASURE AT ROOM TEMPERATUREAFTER COOLING FORCLASSⅠ:24±2Hr.CLASSⅡ:48±4Hr.CAPACITANCECHARACTERISTIC CAPACITANCE CHANGECLASSⅠWITHIN±5%OR±0.5㎊WHICHEVERIS LARGERCLASSⅡA,B WITHIN±12.5%F WITHIN±30%QCLASSⅠ30㎊AND OVER:Q≥35010~30㎊:Q≥275+2.5×CLESS THAN10pF:Q≥200+10×CTanδCLASSⅡINSULATIONRESISTANCEMINIMUM INSULATION RESISTANCE:1,000㏁OR50㏁·㎌PRODUCT WHICHEVER ISSMALLER15MOISTURERESISTANCEAPPEARANCE NO MECHANICAL DAMAGE SHALL OCCUR APPLIED VOLTAGE:RATED VOLTAGETEMPERATURE:40±2℃RELATIVE HUMIDITY:90~95%RHTEST TIME:500+12/-0Hr.CURRENT APPLIED:50㎃MAX.<INITIAL MEASUREMENT>CLASSⅡSHOULD BE MEASUREDINITIAL VALUE AFTER BE HEAT-TREATEDFOR1HR IN150℃+0/-10℃AND BE LEFTFOR48±4HR AT ROOM TEMPERATURE.<LATTER MEASUREMENT>CLASSⅠSHOULD BE MEASURED AFTERLEFT FOR24±2HRS IN ROOMTEMPERATURE AND HUMIDITY.CLASSⅡSHOULD BE MEASUREDLATTER VALUE AFTER BEHEAT-TREATED FOR1HR IN150℃+0/-10℃AND BE LEFT FOR48±4HR AT ROOMTEMPERATURE.CAPACITANCECHARACTERISTIC CAPACITANCE CHANGECLASSⅠWITHIN±7.5%OR±0.75㎊WHICHEVERIS LARGERCLASSⅡA,B WITHIN±12.5%FWITHIN±30%WITHIN+30~－40%1005C>0.47μF1608C>1.0μF2012C>4.7μF3216C>10.0μF3225C>22.0μF4532C>47.0μFQCLASSⅠ30㎊AND OVER:Q≥20030㎊AND BELOW:Q≥100+10/3×CTanδCLASSⅡINSULATIONRESISTANCEMINIMUM INSULATION RESISTANCE:500㏁OR25㏁·㎌PRODUCT,WHICHEVER IS SMALLER.CHAR.25VANDOVER16V10V 6.3V4VA,B0.050.05MAX0.05MAX0.075MAX0.1MAXF0.075MAX0.1MAX(C〈1.0㎌)0.125MAX(C≥1.0㎌)0.15MAX0.195MAX0.25MAXCHAR.25VANDOVER16V10V 6.3V4VA,B0.05MAX0.05MAX0.05MAX0.075MAX0.1MAXF0.075MAX0.1MAX(C〈1.0㎌)0.125MAX(C≥1.0㎌)0.15MAX0.195MAX0.25MAX6.3VTanδ0.125MAX*ConditionCLASSⅡ(A,B)1005C≥0.22㎌1608C≥2.2㎌2012C≥4.7㎌3216C≥10.0㎌3225C≥22.0㎌4532C≥47.0㎌5750C≥100.0㎌6.3V Tanδ0.125MAX*ConditionCLASSⅡ(A,B)1005C≥0.22㎌1608C≥2.2㎌2012C≥4.7㎌3216C≥10.0㎌3225C≥22.0㎌4532C≥47.0㎌5750C≥100.0㎌NO ITEM PERFORMANCE TEST CONDITION16HIGHTEMPERATURERESISTANCEAPPEARANCE NO MECHANICAL DAMAGE SHALL OCCURAPPLIED VOLTAGE:150%,200%OF RATED VOLTAGETEST TIME:1000+48/-0Hr.CURRENT APPLIED:50㎃MAX.<INITIAL MEASUREMENT>CLASSⅡSHOULD BE MEASURED INITIALVALUE AFTER BE HEAT-TREATED FOR1HR IN150℃+0/-10℃AND BE LEFT FOR48±4HR AT ROOM TEMPERATURE.<LATTER MEASUREMENT>CLASSⅠSHOULD BE MEASURED AFTERLEFT FOR24±2HRS IN ROOMTEMPERATURE AND HUMIDITY.CLASSⅡSHOULD BE MEASURED LATTERVALUE AFTER BE HEAT-TREATED FOR1HR IN150℃+0/-10℃AND BE LEFT FOR48±4HR AT ROOM TEMPERATURE.(TWICE OF RATED VOLTAGE WILL BEAPPLIED TO ALL SERIES BUT ABOVE)**HOWEVER,A/B는1005C≥0.22㎌SEE(FIG.3)CAPACITANCECHARACTERISTIC CAP.CHANGECLASSⅠWITHIN±3%OR±0.3㎊,WHICHEVER IS LARGERCLASSⅡA,B WITHIN±12.5%FWITHIN±30%WITHIN+30~40%1005C>0.47μF1608C>1.0μF2012C>4.7μF3216C>10.0μF3225C>22.0μF4532C>47.0μFQCLASSⅠ30㎊AND OVER:Q≥35010~30㎊:Q≥275+2.5×CLESS THAN10㎊:Q≥200+10×CTanδCLASSⅡINSULATIONRESISTANCEMINIMUM INSULATION RESISTANCE:1,000㏁OR50㏁·㎌PRODUCTWHICHEVER IS SMALLER17TEMPERATURECYCLEAPPEARANCE NO MECHANICAL DAMAGE SHALL OCCUR CAPACITORS SHALL BE SUBJECTEDTO FIVE CYCLES OF THETEMPERATURE CYCLE AS FOLLOWINGSTEP TEMP.(℃)TIME(MIN)1MIN.RATEDTEMP.+0/-3302252~33MAX.RATEDTEMP.+3/-0304252~3MEASURE AT ROOM TEMPERATUREAFTER COOLING FORCLASSⅠ:24±2Hr.CLASSⅡ:48±4Hr.CAPACITANCECHARACTERISTIC CAP.CHANGECLASSⅠWITHIN±2.5%OR±0.25㎊WHICHEVER ISLARGERCLASSⅡA,B WITHIN±7.5%F WITHIN±20%QCLASSⅠ30㎊AND OVER:Q≥1000LESS THAN30㎊:Q≥400+20×CTanδCLASSⅡTO SATISFY THE SPECIFIEDINITIAL VALUEINSULATIONRESISTANCETO SATISFY THE SPECIFIEDINITIAL VALUECHAR.25VANDOVER16V10V 6.3V4VA,B0.05MAX0.05MAX0.05MAX0.075MAX0.1MAXF0.075MAX0.1MAX(C<1.0㎌)0.125MAX(C≥1.0㎌)0.15MAX0.195MAX0.25MAXCHAR.TEMP.CLASSⅠ125±3℃CLASSⅡA85±3℃B125±3℃F85±3℃*150%Authorization ConditionsCLASSⅡ(A,B,F)1005C>0.47μF1608C≥2.2㎌2012C≥4.7㎌3216C≥10.0㎌3225C≥22.0㎌4532C≥47.0㎌5750C≥100.0㎌■CHARACTERISTIC GRAPH▶CAPACITANCE CHANGE -AGING▶CAPACITANCE -DC VOLTAGE CHARACTERISTICS▶CAPACITANCE -TEMPERATURE CHARACTERISTICS●ELECTRICAL CHARACTERISTICS■APPLICATION MANUAL●Storage Condition▶Storage EnvironmentThe electrical characteristics of MLCCs were degraded by the environment of high temperature or humidity.Therefore,the MLCCs shall be stored in the ambient temperature and the relative humidity of less than40℃and70%,respectively.Guaranteed storage period is within6months from the outgoing date of delivery.▶Corrosive GasesSince the solderability of the end termination in MLCC was degraded by a chemical atmosphere such as chlorine,acid or sulfide gases,MLCCs must be avoid from these gases.▶Temperature FluctuationsSince dew condensation may occur by the differences in temperature when the MLCCs are taken out of storage,it is important to maintain the temperature-controlled environment.●Design of Land PatternWhen designing printed circuit boards,the shape and size of the lands must allow for theproper amount of solder on the capacitor.The amount of solder at the end terminations has a direct effect on the crack.The crack in MLCC will be easily occurred by the tensile stress which was due to too much amount of solder.In contrast,if too little solder is applied,the termination strength will be e the following illustrations as guidelines for proper land design.Recommendation of Land Shape and Size●AdhesivesWhen flow soldering the MLCCs,apply the adhesive in accordance with the following conditions.▶Requirements for AdhesivesThey must have enough adhesion,so that,the chips will not fall off or move during thehandling of the circuit board.They must maintain their adhesive strength when exposed to soldering temperature.They should not spread or run when applied to the circuit board.They should harden quickly.They should not corrode the circuit board or chip material.They should be a good insulator.They should be non-toxic,and not produce harmful gases,nor be harmful when touched.▶Application MethodIt is important to use the proper amount of adhesive.Too little and much adhesive will cause poor adhesion and overflow into the land,respectively.▶Adhesive hardening CharacteristicsTo prevent oxidation of the terminations,the adhesive must harden at160℃or less,within2minutes or less.●Mounting▶Mounting Head PressureExcessive pressure will cause crack to MLCCs.The pressure of nozzle will be300g maximum during mounting.▶Bending StressWhen double-sided circuit boards are used,MLCCs first are mounted and soldered onto one side of the board.When the MLCCs are mounted onto the other side,it is important to support the board as shown in the illustration.If the circuit board is not supported,the crack occur to the ready-installed MLCCs by the bending stress.●FluxAlthough the solderability increased by the highly-activated flux,increase of activity in flux may also degrade the insulation of the chip capacitors.To avoid such degradation,it is recommended that a mildly activated rosin flux(less than0.2%chlorine)be used.●SolderingSince a multilayer ceramic chip capacitor comes into direct contact with melted solder during soldering,it is exposed to potentially mechanical stress caused by the sudden temperature change.The capacitor may also be subject to silver migration,and to contamination by the flux.Because of these factors,soldering technique is critical.▶Soldering MethodsMethodClassificationReflow soldering-Overall heating-Infrared rays -Hot plate-VPS(vapor phase)-Local heating-Air heater -Laser-Light beamFlow soldering-Single wave -Double wave-*We recommend the reflow soldering method.▶Soldering ProfileTo avoid crack problem by sudden temperature change,follow the temperature profile in the adjacentgraph.30025020015010050℃Reflow Soldering 30025020015010050℃60~120sec 3~4secFlow Soldering▶Manual SolderingManual soldering can pose a great risk of creating thermal cracks in chip capacitors.The hotsoldering iron tip comes into direct contact with the end terminations,and operator's carelessnessmay cause the tip of the soldering iron to come into direct contact with the ceramic body of the capacitor.Therefore the soldering iron must be handled carefully,and close attention must be paid to the selection of the soldering iron tip and to temperature control of the tip.▶Amount ofSolder▶CoolingNatural cooling using air is recommended.If the chips are dipped into solvent for cleaning, the temperature difference(△T)must be less than100℃6-6.CleaningIf rosin flux is used,cleaning usually is unnecessary.When strongly activated flux is used, chlorine in the flux may dissolve into some types of cleaning fluids,thereby affecting the chip capacitors.This means that the cleaning fluid must be carefully selected,and should always be new.▶Notes for Separating Multiple,Shared PC Boards.A multi-PC board is separated into many individual circuit boards after soldering has been completed.If the board is bent or distorted at the time of separation,cracks may occur in the chip capacitors.Carefully choose a separation method that minimizes the bending of the circuit board.■CROSS REFERENCEP/N COMPANY SAMSUNG AVX JOHANSON KEMET KYOCERA MURATA NOVACAP PANASONIC ROHMTAIYO-YUDENTDK VITRAMON①COMPANY MODEL(MLCC)CL--C CM GRM-ECJ MCH MK C VJ②SIZE (EIA/JIS)0201(0603)03---0333-Z-0630603-0402(1005)050402R0704020536040201510510050402 0603(1608)100603R14060310539060311810716080603 0805(2012)210805R1508052140080522121220120805 1206(3216)311206R181********-6120633131632161206 1210(3225)321210S4112103242-2121043232532251210 1808(4520)421808R29180842-1808---45201808 1812(4532)431812S4318124343-21812-4343245321812 2220(5750)55--22205544-12221--5505650-③TEMPERATURE CHARACTERISTIC COG(NPO)C A N G CG COG/CH N C A C COG/CH A P2H(N150)P S--P P2H-P-P PH-R2H(N220)R1--R R2H-R-R RH-S2H(N330)S3--S S2H-S-S SH-T2H(N470)T O--T T2H-T-T TH-U2J(N750)U Z--U U2J-U UJ U UJ-S2L L Y--SL SL-G SL SL SL-X7R B C W R(X)X7R X7R B B C BJ X7R(B)Y(X) Z5U E E Z U-Z5U Z-E-Z5U U Y5V F G Y V Y5V Y5V Y F F F Y5V-④NOMINAL CAPACITANCE EX)103=10,000㎊221=220㎊225=2,200,000㎊=2.2㎌1R5=1.5㎊010=1㎊⑤CAPACITANCE TOLERANCE B:±0.1㎊C:±0.25㎊D:±0.5㎊F:±1%G:±2%J:±5%K:±10%M:±20%Z:-20~+80%⑥RATED VOLTAGE6.3V Q6-906 6.3-0J-J0J-10V P Z10081010-1A4L1A-16V O Y160416161601C3E1C J 25V A3250325252501E2T1E X 50V B5500550505001H5U1H A 100V C110111*********A1-2A B 200V D220122002002012D---C 250V E V--250250251---2E-500V G7501-500500501----E 630V H---630630----2J-1000V I A102-10001K102---3A G 2000V J G202-20002K202---3D-3000V K H302-30003K302---3F H 4000V-J-4000-402-----⑦TERMINATIONNICKEL BARRIER N T V C A(GRM)N-(MCH)--X Ag/Pd P1--B(GR)P-(MC)--F⑧PACKAGEBULK(VINYL)B9(NONE)-B PB*X-B B B PAPER TAPING C2,4T,R-T,L PT T E,V,W K,L T T C,P PLASTIC TAPING E1,3E,U-H,N PT-F,Y P,Q T-T,R BULK CASE P7--C PC-C C--G。