PCB English3

流程Board cut 开料Carbon printing 碳油印刷Inner dry film 内层干膜Peelable blue mask 蓝胶Inner etching 内层蚀刻ENIG(Electroless nickel immersion gold) 沉镍金Inner dry film stripping 内层干膜退膜HAL(hot air leveling) 喷锡AOI（Automatic Optical Inspection）自动光学检测OSP（Organic solderability preservative）有机保焊Pressing 压板Punching 啤板Drilling 钻孔Profiling 外形加工Desmear 除胶渣，去钻污 E-Test 电性测试PTH 镀通孔，沉铜FQC(final quality control) 最终品质控制Panel plating 整板电镀FQA(Final quality audit) 最终品质保证Outer dry film 外层干膜Packing 包装Etching 蚀刻IPQA(In-process quality audit) 流程QA Tin stripping 退锡IPQC(In-process quality control) 流程QC EQC（QC after etching）蚀检QCIQC(Incoming quality control) 来料检查Solder mask 感阻MRB(material review board) 材料评审委员会Component mark 字符QA(Quality assurance) 品质保证Physical Laboratory 物理实验室QC(Quality control) 品质控制Chemistry Laboratory 化学实验室Document control center 文件控制中心2nd Drilling 二钻Routing 锣板，铣板Brown oxidation 棕化Waste water treatment 污水处理V-cut V坑WIP（work in process）半成品Store/stock 仓库 F.G(Finished goods) 成品概述Printed Circuit Board 印制电路板Flexible Printed Circuit, FPC 软板Double-Side Printed Board 双面板IPC（The Institute for Interconnecting and Packing Electronic Circuits）电子电路互连与封装协会CPAR（Corrective & Preventive Action Request）要求纠正预防措施Flammability Rate燃性等级Characteristic impedance 特性阻抗BUM（Build-up multilayer）积层多层板Date Code周期代码CCL（Copper-clad laminate）覆铜板Ionic contamination 离子性污染Acceptance Quality Level (AQL)允收水平HDI（High density interconnecting）高密度互连板Base Material基材Radius 半径Capacity 生产能力Diameter 直径Capability 工艺能力PPM(Parts Per Million) 百万分之几CAM（computer-aided manufacturing) 计算机辅助制造Underwriters Laboratories Inc. 美国保险商实验所CAD (computer-aided design) 计算机辅助设计Statistical Process Control 统计过程控制Specification 规格，规范Via 导通孔Dimension 尺寸Buried /blind via 埋/盲孔Tolerance 公差Tooling hole 定位孔Oven 焗炉Output/throughput 产量湿流程PTH（plated through hole）镀通孔（俗称沉铜）Acid cleaning 酸性除油PP(Panel Plating) 板电Acid dip 酸洗Pattern plating 图电Pre-dip 预浸Line width 线宽Alkaline cleaning 碱性除油Spacing 线隙Flux 松香Deburring 去毛刺（沉铜前磨板）Hot air leveling 喷锡Carbon treatment 碳处理Skip plating 跳镀，漏镀Track/conductor 导线Undercut 侧蚀Aspect ratio深径比Water rinsing水洗Etch Factor 蚀刻因子Transportation 行车Back Light Test背光测试Rack挂架Pink ring粉红圈Maintenance 保养干流程Hole location孔位Annular ring 孔环Image Transfer图象转移Component Side(C/S) 元件面Artwork 底片Solder Side(S/S) 焊接面Mylar 胶片Matte Solder Mask 哑绿油Silkscreen/legend/Component Mark文字Hole breakout 破孔Fiducial mark 基点，对光点Scrubbing 磨板Expose 曝光Developing 显影内层制作Core material 内层芯板Thermal pad 散热PAD Pre-preg PP片Resin content 树脂含量Kraft Paper牛皮纸Brown oxidation 棕化Lay up 排版Black Oxidation 黑化Registration 对位Base material 板材Delamination 分层其它Wicking灯芯效应Hole size 孔径(尺寸) Yield良品率Touch Up修理Warp and Twist 板曲度Solvent Test 溶剂测试Peel off 剥离Company Logo 公司标识Tape Test 胶纸试验UL Mark UL 标记Cosmetic 外观Function 功能Tin/Lead Ratio 锡/铅比例Reliability Tests 可靠性试验Hole Wall Roughness 孔壁粗糙度Base Copper Thickness 底铜厚度PCB专业英语(PCB SPECIAL ENGLISH)1.PCB=Printed Circuit Board 电路板2.CAM=Computer aided manufacture 计算机辅助3.Pad 焊盘4.Annular ring 焊环5.AOI=automatic optical inspection 自动光学检测6.Charge of free 免费7.WIP=work in process 在线板8.DCC=document control center 文控中心9.Legend 字符10.CS=Component Side =Top Side （顶层）元件面11.SS=Solder Side =Bottom Side （底层）焊锡面12.Gold Plated 电金，镀金13.Nickel Plated 电镍，镀镍14.Immersion Gold 沉金=沉镍金15.Carbon Ink Print 印碳油16.Microsection Report 切片报告，横切面报告17.X-out=Cross-out 打"X"报告18.Panel （客户称）拼板，（生产线称）工作板19.Marking 标记，UL 标记20.Date code 生产周期21.Unit 单元，单位22.Profile 外形，轮廓<outline>23.Profile By Routing 锣(铣)外形24.Wet Film 湿菲林,湿绿油,湿膜25.Slot 槽,方坑26.Base Material=Base Laminate 基材,板料27.V-out =V-score V形槽28.Finished 成品29.Marketing 市场部30.Gerber File GERBER文件31.UL LOGO UL标记32.E-Test=Electric Open/Short Test 电子测试33.PO=Purchase Order 订单34.Tolerance 公差35.Rigid,Flexible Board 刚性,软性板36.Board cut 开料37.Board baking 焗板38.Drill 钻孔39.PTH=Plated Through Hole 镀通孔,沉铜40.Panel plating 板面电镀,全板电镀41.Photo Image 图象,线路图形42.Pattern plating 线路电镀43.Etching 蚀板,蚀刻44.SM=Solder Mask 防焊,阻焊,绿油45.SR=Solder Resist 防焊,阻焊,绿油46.Gold finger 金手指47.Silkscreen 丝印字符48.HAL=HASL=Hot air(Solder)leveling 热风整平喷锡49.Routing 锣板,铣板50.Punching 冲板,啤板51.FOC=final quality checking 终检,最后检查52.FOA=final quality audit 最后稽查(抽查)53.Shippment 出货54.Flux 松香55.Au金,Cu铜,Ni镍,Pb铅,Tn锡,Tin-lead锡铅合金56.Lead free 无铅57.COC=compliance of certificate 材料证明书58.Microsection=cross section 微切片,横切片59.Chamical gold 沉镍金60.Mould=punch die 模具,啤模61.MI=manufacture instruction 制作批示62.QA=quality assurance 品质保证63.CAD=computer aided design 计算机辅助设计64.Drill bit size钻咀直径<diameter>65.Bow and twist 板弯和板曲66.Hit 击打,孔数67.Bonding 邦定,点焊68.Test coupon 测试模块(科邦)69.Thieving copper 抢电流铜皮70.Rail-web71.Break-up tab 工艺边72.Break away tab 工艺边73.GND=ground 地线,大铜皮74.Hole edge 孔边,孔内75.Stamp hole 邮票孔76.Template 天坯,型板,钻孔样板(首板)77.Dry film 干菲林,干膜78.LPI=liquid photo image 液态感光=湿绿油79.Multilayer 多层板80.SMD=surface mouted device 贴片,表面贴装器件81.SMT=surface mouted technology 表面贴装技术82.Peelable mask=blue gel 蓝胶83.Tooling hole 工艺孔,管位,定位孔,工具孔84.Fiducial mask 测光点,光学对位点,对光点,电眼85.Copper foil 铜箔86.Dimension 尺寸87.Nagative负的,positive正的88.Flash gold 闪镀金,镀薄金89.Engineering department 工程部90.Delivery date 交货期91.Bevelling 斜边92.Spacing=gap 间隙,气隙,线隙PCB的各层定义及描述为了方便与印制板厂家的技术沟通，提高对PCB的技术认知一致度，特在此将我司常用PCB的有关板层特性做简单说明，请爱好者参考此说明进行设计和制造。

pcb专业术语英文及翻译摘要：本文介绍了PCB（Printed Circuit Board，印刷电路板）专业术语的英文表达和翻译，根据内容实际需求分为三大类：PCB制造术语、PCB组装术语和PCB测试术语。

在每个类别下，将列举相关术语及其英文表达和翻译，从而帮助读者更好地理解和运用PCB专业术语。

正文：I. PCB制造术语1. 单、双面板 (Single-sided, Double-sided board)单面板：一种仅在板的一侧进行布线和元件安装的印刷电路板。

双面板：一种在两侧布线和元件安装的印刷电路板。

2. 环氧树脂 (Epoxy Resin)环氧树脂是一种常用的PCB基材，具有良好的绝缘性和耐热性。

3. 铜盖膜 (Copper Foil)铜盖膜是覆盖在印刷电路板表面的一层铜箔，用于电气连接。

4. 阻焊层 (Solder Mask Layer)阻焊层是一种覆盖在印刷电路板表面的保护层，用于防止元件的误焊。

5. 玻璃纤维布 (Glass Fiber Cloth)玻璃纤维布是PCB制造中一种常用的增强材料，用于提高印刷电路板的强度和耐磨性。

6. 焊盘 (Pad)焊盘是印刷电路板上用于连接元件引脚的焊接区域。

7. 过孔 (Through-hole)过孔是印刷电路板上贯穿两侧的孔洞，用于连接不同电子元器件。

8. 排针 (Pin Header)排针是一种插针式连接器，常用于将PCB与其他设备连接。

9. 焊接 (Soldering)焊接是将电子元件与印刷电路板焊接在一起的一种连接方法。

II. PCB组装术语1. 表面贴装技术 (Surface Mount Technology, SMT)表面贴装技术是一种将电子元件直接焊接在印刷电路板表面的组装方法。

2. 波峰焊接 (Wave Soldering)波峰焊接是一种通过将印刷电路板浸入焊锡浪涌中来实现电子元件的连接。

3. 焊接膏 (Solder Paste)焊接膏是表面贴装技术中使用的一种黏性材料，用于在印刷电路板上确定元件的位置并进行焊接。

A aA.O.I(Automatic Optical Inspection)自动光学检查Acceptable quality level (AQL)可接受质量水平Accuracy精确度Activating活化Active carbon treatment活性碳处理After Pressed Thickness压板后之厚度Alignment校直，结盟Annular ring锡圈Anti-Static Bag静电胶袋Apparatus设备，仪器Area面积Artwork菲林Artwork Drawing菲林图形Artwork Film原装菲林Artwork Modification菲林修改Artwork No.菲林编号Assembly组装，装配Axis轴B bBackplane背板Back-up垫板Baking 烘板Ball Grid Array (BGA)球栅阵列Bare board裸板Base Copper底铜Base material基材Bevelling斜边Black Oxide黑氧化Blind via hole盲孔Blistering起泡/水泡Board Cutting开料Board Thickness板厚Bottom side底层Breakaway tab打断点Brushing磨刷Build-up积层Bullet pad子弹盘Buried hole埋孔C cC/M(Component Marking)元件字符Carbon ink碳油Carrier带板Ceramic substrate陶瓷Certificate of Compliance合格证书Chamfer倒角Chemical cleaning化学清洗Chemical corrosion化学腐蚀Chip Scale Package (CSP)晶片比例包装Circuit线路Clearance间距/间隙Color颜色Component Side(C/S)元件面Composite layers复合层Computer Aided Design (CAD)电脑辅助设计Computer Aided Manufacturing (CAM)电脑辅助制作Computer Numerial Control (CNC)数控Conductor导体Conductor width/space导体线宽/线隙Contact接点Copper area铜面积Copper clad铜箔Copper foil铜箔Copper plating0电镀铜Corner角线Corner mark板角记号Corner REG.Hole角位对位孔Cracking裂缝Creasing皱折Criteria规格,标准Crossection area切面Cu/Sn Plating镀铜锡Current efficiency电流效率Customer客户Customer Drilling File客户钻孔资料Customer P/N客户产品编号D dD/F Registration Hole干菲林对位孔D/F(Dry Film)干膜Date Code日期代号Datum hole基准参考孔Daughter board子板Deburring去毛刺Defect缺陷Definition定义Delamination分层Delay耽搁Delivery交货Densitomefer透光度计Density密度Department部门Description说明Design origin设计原点Desmear去钻污,除胶Dessicant防潮珠Developer显影液,显影机Diamond钻石Diazo film重氮片Dielectric breakdown介电击穿Dielectric constant介电常数Dielectric Thickness介电层厚度Dielectric Voltage Test绝缘测试Dimension尺寸Dimensional stability尺寸稳定性Direct/indirect直接/间接Distribution发放Document type文件种类Documentation Control文件控制Double sided board双面板Drill bit钻咀Drilling钻孔Drilling Roughness钻孔粗糙度Dry Film 干菲林Dry Film-Pattern干膜线路Dynamic动态okE eECN(Engineering Change Notification)工程更改通知Effective date有效期Electrical Test Fixture电测试 针床Electro migration漏电Electroconductive paste导电胶Electroless无电沉Electroless copper无电沉铜Electroless Ni无电沉镍Electroless Gold/Au无电沉金Engineering drawing工程图纸Entek有机涂覆Epoxy glass substrate环氧玻璃基板Epoxy resin环氧基树脂Etch蚀刻Etchback凹蚀Etching蚀刻E-Test Marking电测试标记E-Test(Electrical Test)电测试Exposure曝光External layer外层F fFiducial mark基准点Filling填充Film Fabrication菲林制作Final QC最终检查Finish Overall Board Thickness成品总板厚度Fixture夹具Flammability可燃性Flash Gold薄金Flexible易曲的,能变形的Flux助焊剂G gGeneral information一般资料Ghost image重影Glass transition temperature玻璃化湿度Gold Finger(G/F)金手指Golden board金板Grid网格Ground plane地线层H hHAL(Hot Air Leveling)热风整平Hand Rout手锣Hardness硬度Heat Sealed热密封Heat Shrink-warp热收缩Holding time停留时间Hole孔Hole breakout破环Hole density孔的密度Hole Diameter孔径Hole location孔位Hole Location Chart孔位坐标表Hole Position Tolerance孔位误差Hole size孔尺寸Hot Air Leveling(HAL)热风整平Humidity湿度IIdentification标识,指标Image影像Imaging transfer图形转移Impedance阻抗Impedance Test阻抗测试Inner copper foil 内层铜箔Inspection检验Insulation resistance Test绝缘测试Inter Plane Separation内层分离Interleave Paper隔纸Internal layer内层Internal stress内应力Ionic cleanliness离子清洁度Isolation孤立Isolation Resistance绝缘电阻Item项目K kKEY board按键盘Key slot槽孔Kraft paper牛皮纸L lLaminate板材Laminate Thickness材料厚度Lamination void 层间空洞Landless hole破孔Laser plotter激光绘图机Laser plotting激光绘图Laser via hole激光穿孔Layup层压配本Lay-up Instruction压板指示Legend字符Legend Width字符宽度Length长度Lifted Lands残铜Line Width线宽Liquid液体Location位置Logic diagram逻辑图形Logo唛头,标记Lot size批卡M mMark标记Master drawing菲林图形Material Thickness材料厚度Material Type材料类型Max. X-out坏板上限Max.Board Thickness After Plating电镀后总板厚度之上限Measling白斑Mech Drawing No.图纸编号Mechanical cleaning机械清洗Metal金属Method方法MI(Manufacturing Instruction)生产制作指示Microstrip微条线Min Conductor Copper Thickness最小线路铜厚Min Hole Wall Copper Thickness最小孔壁铜厚Min. Gold Plating Thickness最小金厚Min. Nickel Thickness最小镍厚Min. Tin-Lead Thickness (After HAL)（喷锡后）最小锡厚Min.Annular Ring最小环宽Min.Spacing between Line to Line线与线之间的最小距离Min.Spacing between Line to Pad线与焊盘之间的最小距离Min.Spacing between Pad to Pad焊盘与焊盘之间的最小距离Minimum 最小Mirroring镜像Missing 缺少Model No.产品名称Molded模塑Mother board主板Moulding模房Mounting hole安装孔Multilayer多层板Multi-layer Laminate多层板材料N nNegative反面的Net list网络表Network网络Nick缺口No. of holes孔数No.of Array/Panel每个拼板套板数No.of Panel per Stack每叠板数No.of Panel/Sheet每张大料拼板数No.of Pcs Per Bag每包数量No.of Unit/Array每套单元数Normal value标准值O oOblong椭圆形的Offset 偏移Open/short开路/短路Optimization(design)最佳化(设计)Organic Solerability Peservatives(OSP)有机保护剂Originator原作者Outer copper foil外层铜箔Outline外形P pPacking包装Packing包装Pad焊盘Panel Area拼板面积Panel Plated Crack板镀缺口Panel plating整板电镀Panel Size拼板尺寸Panel Size After Outerlayer Cutting外层切板后拼板尺寸Panel Utilization拼板利用率Pass rate通过率Passivation钝化Pattern线路Pattern Inspection线路检查Pattern plating图形电镀PCB(Printed Circuit Board)印制线路板Peck drilling啄钻Peel strength 剥离强度Peelable可剥性Peelable 剥离强度Peelable Mask可脱油Peeling剥离Permanent永久性PH value PH值Photo plotting图形输出Photo via hole菲林过孔Photographers照片靶标Photoplotler光绘机Physical物理的Pin hole销定孔Pink ring粉红环Pinning hole钻孔管位Pitch间距Placement放置Plated Though Hole(PTH)沉铜Plating电镀Plating Crack电镀裂缝Plating line电镀线Plating rack电镀架Plating Void电镀针孔Plug Hole塞孔Polymer聚合体Porosity孔隙率Positive绝对的Power plane电源层Prepreg半固化片Primary side首面Print印刷Probe point针床测点Process工序Process flow工序流程Product Planning Dept.生产计划部Production生产板Profile外形Profiling 外形加工Profiling Process外形加工Project No.产品编号PTH Thermal Stress Test PTH热冲击测试PTH(Plating Through Hole)沉铜Pull away拉离Punch啤模Punching冲切Punching Mould Drawing啤模图形Q qQA Audit品质审计QA(Quanlity Assurance)品质部Quad Palt Pack (QFP)四边扁平林整器件Quality质量Quantity数量R rRaw Material Utilization原材料利用率Recall回收Rectifier整流器Register mark对位点Registration重合点Remark备注Resin树脂Resin Recession流胶Resist抗蚀剂Resolution分辨率Rigid精密的Roller coating涂覆Roughening粗化Round pad圆盘Routing外形加工,铣板S sS/M Material绿油物料S/M(Solder Mask)阻焊Sales 销售Sample样板Sampling inspection抽样检验Scaling factor缩放比例因素Scope范围Scoring刻槽Scratch划痕Secondary side第二面Section Code组别代号Section Code Change组别代号更改Segment部分,片段Separated分离Sequence顺序Sets套Sheet Size大料尺寸Shematic diagram原理图Shiny有光泽的,发光的Silk screen丝印Silver film银盐片Single/double单层/双面Slot 槽,坑Smear污点Solder Mask阻焊Solder mask on bare copper (smobc)裸铜覆盖阻焊膜Solder side焊接面Solder Side C/M阻焊面字符Solder Side Cir.焊接面线路Solder Side Circuit焊接面Solder Side S/M焊接面阻焊Solderability可焊性Solvent Test可溶性测试Spacing线距Special requirement 特殊要求Specification详细说明，规范Spindle主轴Split裂片Square pad方块Standard标准值Static静态Stencial网版Step drilling分布钻Step scale光梯尺Store货仓Supplier供应商Supported hole支撑点Surface表面Surface mount technology表面组装技术Swimming滑移T tTack堆起Tape Programming铬带制作Tape Test胶带测试Target Hole目标孔Teardrop 泪珠Template天平Tenting封孔Test测试Test coupon图样Test Parameter测试参数Test Pattern测试孔Testing Voltage电压Thermal shock热冲击Thermal stress热应力Thickness厚度Tin Content锡含量Tin/Lead Stripping退铅锡Tin-lead plating电镀铅锡Tolerance公差Top side板面Touch up修理(执漏) Training训练Transmission传输线Transmittance传送Trim line修剪U uUltrasonic cleaning超声波清洗Undercut侧蚀Unit Arrangement单元排版Unit Layout Per Panel单元拼板图Uv-blocking 阻挡紫外线V vVacunm Pack真空包装Vacuum lamination真空压制V-Cut V- 坑View From…观察方向由…Visual & Warpage可视性和翘曲度Visual inspection目检Voltage 电压W wW/F(Wet Film)湿膜Warp & Twist翘曲和弯曲Wet Film湿模Width宽度Wiring线路。

一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (PCB)5、印制线路板：printed wiring board(PWB)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(SSB)11、双面印制板：double-sided printed board(DSB)12、多层印制板：multilayer printed board(MLB)13、多层印制电路板：multilayer printed circuit board14、多层印制线路板：multilayer printed wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed board17、刚性双面印制板：rigid double-sided printed board18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (FPC)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：multi-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electro-conductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated multilayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：build-up printed board40、积层多层印制板：build-up multilayer printed board (BUM)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (SLC)43、埋入凸块连印制板：B2it printed board44、多层膜基板：multi-layered film substrate(MFS)45、层间全内导通多层印制板：ALIVH multilayer printed board46、载芯片板：chip on board (COB)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away plane56、电缆：cable57、挠性扁平电缆：flexible flat cable (FFC)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：print77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (CCL)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：pre-preg14、粘结片：bonding sheet15、预浸粘结片：pre-impregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive face34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：UV blocking copper-clad laminates三、基材的材料1、A阶树脂：A-stage resin2、B阶树脂：B-stage resin3、C阶树脂：C-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluorin resin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (WPE)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adhesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsaturated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (PI)38、聚四氟乙烯：polytetrafluoroethylene (PTFE)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (FEP)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、E玻璃纤维：E-glass fibre43、D玻璃纤维：D-glass fibre44、S玻璃纤维：S-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：coupling agent77、处理织物：finished fabric78、聚酰胺纤维：polyamide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whiteness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ED copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (RA copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (RCC)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：schematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(CAD)7、计算机辅助制造：computer-aided manufacturing.(CAM)8、计算机集成制造：computer integrate manufacturing.(CIM)9、计算机辅助工程：computer-aided engineering.(CAE)10、计算机辅助测试：computer-aided test.(CAT)11、电子设计自动化：electric design automation .(EDA)12、工程设计自动化：engineering design automaton .(EDA2)13、组装设计自动化：assembly aided architectural design. (AAAD)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display .(CCD)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circuit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout efficiency26、机器描述格式：machine description format .(MDF)27、机器描述格式数据库：MDF database28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics display40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router (CAD)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (PDP)59、交互式制图设计：interactive drawing design60、费用矩阵：cost matrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：maze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：Manhattan distance70、欧几里德距离：Euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer No.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、V形盘：V-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：nonfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (PTH)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (ALIVH)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum reference。

PCB专业英语(PCB SPECIAL ENGLISH)1.PCB=Printed Circuit Board 电路板2.CAM=Computer aided manufacture 计算机辅助3.Pad 焊盘4.Annular ring 焊环5.AOI=automatic optical inspection 自动光学检测6.Charge of free 免费7.WIP=work in process 在线板8.DCC=document control center 文控中心9.Legend 字符10.CS=Component Side =Top Side （顶层）元件面11.SS=Solder Side =Bottom Side （底层）焊锡面12.Gold Plated 电金，镀金13.Nickel Plated 电镍，镀镍14.Immersion Gold 沉金=沉镍金15.Carbon Ink Print 印碳油16.Microsection Report 切片报告，横切面报告17.X-out=Cross-out 打“X”报告18.Panel （客户称）拼板，（生产线称）工作板19.Marking 标记，UL 标记20.Date code 生产周期21.Unit 单元，单位22.Profile 外形，轮廓<outline>23.Profile By Routing 锣(铣)外形24.Wet Film 湿菲林,湿绿油,湿膜25.Slot 槽,方坑26.Base Material=Base Laminate 基材,板料27.V-out =V-score V形槽28.Finished 成品29.Marketing 市场部30.Gerber File GERBER文件31.UL LOGO UL标记32.E-Test=Electric Open/Short Test 电子测试33.PO=Purchase Order 订单34.Tolerance 公差35.Rigid,Flexible Board 刚性,软性板36.Board cut 开料37.Board baking 焗板38.Drill 钻孔39.PTH=Plated Through Hole 镀通孔,沉铜40.Panel plating 板面电镀,全板电镀41.Photo Image 图象,线路图形42.Pattern plating 线路电镀43.Etching 蚀板,蚀刻44.SM=Solder Mask 防焊,阻焊,绿油45.SR=Solder Resist 防焊,阻焊,绿油46.Gold finger 金手指47.Silkscreen 丝印字符48.HAL=HASL=Hot air(Solder)leveling 热风整平喷锡49.Routing 锣板,铣板50.Punching 冲板,啤板51.FOC=final quality checking 终检,最后检查52.FOA=final quality audit 最后稽查(抽查)53.Shippment 出货54.Flux 松香55.Au金,Cu铜,Ni镍,Pb铅,Tn锡,Tin-lead锡铅合金56.Lead free 无铅57.COC=compliance of certificate 材料证明书58.Microsection=cross section 微切片,横切片59.Chamical gold 沉镍金60.Mould=punch die 模具,啤模61.MI=manufacture instruction 制作批示62.QA=quality assurance 品质保证63.CAD=computer aided design 计算机辅助设计64.Drill bit size钻咀直径<diameter>65.Bow and twist 板弯和板曲66.Hit 击打,孔数67.Bonding 邦定,点焊68.Test coupon 测试模块(科邦)69.Thieving copper 抢电流铜皮70.Rail-web71.Break-up tab 工艺边72.Break away tab 工艺边73.GND=ground 地线,大铜皮74.Hole edge 孔边,孔内75.Stamp hole 邮票孔76.Template 天坯,型板,钻孔样板(首板)77.Dry film 干菲林,干膜78.LPI=liquid photo image 液态感光=湿绿油79.Multilayer 多层板80.SMD=surface mouted device 贴片,表面贴装器件81.SMT=surface mouted technology 表面贴装技术82.Peelable mask=blue gel 蓝胶83.Tooling hole 工艺孔,管位,定位孔,工具孔84.Fiducial mask 测光点,光学对位点,对光点,电眼85.Copper foil 铜箔86.Dimension 尺寸87.Nagative负的,positive正的88.Flash gold 闪镀金,镀薄金89.Engineering department 工程部90.Delivery date 交货期91.Bevelling 斜边92.Spacing=gap 间隙,气隙,线隙PCB的各层定义及描述为了方便与印制板厂家的技术沟通，提高对PCB的技术认知一致度，特在此将我司常用PCB的有关板层特性做简单说明，请爱好者参考此说明进行设计和制造。

PCB专业术语中英文翻译很多PCB的书上使用的是英文，但是大多数的人又看不懂英文，这时候怎么办呢，我们需要翻译，但是如果每看到一个不会的词儿就去翻译，那么就太耗费时间了，所以我们捷多邦总结了一些常用的专业术语的中英文对照，希望能对大家有用。

1.印制电路：printed circuit2.印制线路：printed wiring3.印制板：printed board4.印制板电路：printed circuit board (pcb)5.印制线路板：printed wiring board(pwb)6.印制元件：printed component7.印制接点：printed contact8.印制板装配：printed board assembly9.板：board 110.表面层合电路板：surface laminar circuit (slc)11.埋入凸块连印制板：b2it printed board12.多层膜基板：multi-layered film substrate(mfs)13.层间全内导通多层印制板：alivh multilayer printed board14.载芯片板：chip on board (cob)15.埋电阻板：buried resistance board16.母板：mother board17.单面印制板：single-sided printed board(ssb)18.双面印制板：double-sided printed board(dsb)19.多层印制板：mulitlayer printed board(mlb)20.多层印制电路板：mulitlayer printed circuit board21.多层印制线路板：mulitlayer prited wiring board22.刚性印制板：rigid printed board23.刚性单面印制板：rigid single-sided printed borad24.刚性双面印制板：rigid double-sided printed borad25.刚性多层印制板：rigid multilayer printed board26.子板：daughter board27.背板：backplane28.裸板：bare board29.键盘板夹心板：copper-invar-copper board30.动态挠性板：dynamic flex board31.静态挠性板：static flex board32.可断拼板：break-away planel33.电缆：cable34.挠性扁平电缆：flexible flat cable (ffc)35.薄膜开关：membrane switch36.混合电路：hybrid circuit37.厚膜：thick film38.厚膜电路：thick film circuit39.薄膜：thin film40.挠性多层印制板：flexible multilayer printed board41.挠性印制板：flexible printed board42.挠性单面印制板：flexible single-sided printed board43.挠性双面印制板：flexible double-sided printed board44.挠性印制电路：flexible printed circuit (fpc)45.挠性印制线路：flexible printed wiring46.刚性印制板：flex-rigid printed board, rigid-flex printedboard47.刚性双面印制板：flex-rigid double-sided printed board,rigid-flex double-sided printed48.刚性多层印制板：flex-rigid multilayer printed board,rigid-flex multilayer printed board49.齐平印制板：flush printed board50.金属芯印制板：metal core printed board51.金属基印制板：metal base printed board52.多重布线印制板：mulit-wiring printed board53.陶瓷印制板：ceramic substrate printed board54.导电胶印制板：electroconductive paste printed board55.模塑电路板：molded circuit board56.模压印制板：stamped printed wiring board57.顺序层压多层印制板：sequentially-laminated mulitlayer58.散线印制板：discrete wiring board59.微线印制板：micro wire board60.积层印制板：buile-up printed board61.积层多层印制板：build-up mulitlayer printed board (bum)62.积层挠印制板：build-up flexible pr上面是一些比较常见的专业用语，有一些不是特别常用的有时候我们也会遇到，所以我们捷多邦也总结了一些不怎么常用的中英文对照，希望对你来说是有用的：1.Absorption 吸收、吸入2.Accelerated Test（Aging）加速试验、加速老化3.Accelerator 加速剂、速化剂4.Accept/Acceptance 允收5.Acceptable Quality Level（AQL）允收品质水准6.Accuracy 准确度ACF：7.Adhesive copper foil 有胶铜箔8.Activator 活化剂、添加剂比称为9.Activator Active parts（Devices）主动零件，指积体电路或电晶体10.Addition Agent 添加剂11.Additive Process 加成法、分全加成、半加成及部份加成12.Back Light（Back Lighting）背光法13.Back-UP 垫板14.Backpanels/ Backplanes 背板、支持板，厚度较厚，15.Ball Grid Array（BGA）球脚车列（封装）16.Barrel 孔壁17.Base Material 基材18.Batch 批（同时间发料某一数量的板子）19.Bevelling 切斜边20.Binder 黏结剂21.Capacitance 电容22.Carbide 碳化物、碳化钨钻头23.CAR: Corrective Action Report 改善报告24.Carbon Treatment 活性碳处理25.Card 卡板26.Carrier 载体27.Cartridge 滤芯28.Cathode 阴极L: Copper Clad Laminates 铜箔基板30.Ceramics 陶瓷31.Certificate 证明书32.CFC 氟氯碳化物33.Chloro-Fluoro-Carbon Chamfer 倒角、去掉直角34.Characteristic Impedance 特性阻抗35.Cheek list 检察清单36.Chip 晶粒、晶片37.Chip On Board 晶片黏著板38.Clean Room 无尘室(Class 100)39.Cleanliness 清洁度40.Clearance 余隙、余环41.COB（Chip on Board）晶片在板上直接组装42.COC（Certificate of Compliance）出货合格书。