SHARP PC357 光耦芯片

产品规格书SPECIFICATION产品名称：光敏晶体管输出型光耦合器DESCRIPTION:Photo-transistor Output Opto-coupler产品型号：HPC357×PART NO.：HPC357×电话Tel ：86-0592-*******传真Fax ：86-0592-*******网址Web ：地址：厦门市翔安区舫阳南路189号Add ：No.189,Fangyang South Road,Xiangan District,Xiamen China.拟制Prepared 审核Verified 批准Approved厦门华联电子股份有限公司Xiamen Hualian Electronics Corp.,Ltd.1概述GeneralHPC357×是光敏晶体管输出型光耦合器，将红外LED芯片和光敏晶体管芯片封装在一起，以实现电一光一电转换。

The HPC357×is Photo-transistor Output Opto-coupler,that infrared LED chip andPhoto-transistor chip are assembled on lead frame,in order to change theelectricity-light-electricity.图1产品Figure1-Product 2特点Features●光敏晶体管输出Phototransistor output●输入、输出端之间绝缘电压高Isolation voltage between input and output VISO≥3750Vrms●双列贴片式4L塑料封装SOP4L Plastic Package●UL安全认证Safety certification of UL●VDE安全认证Safety certification of VDE●符合RoHS指令最新要求及REACH法规最新要求。

_________________________________概述MAX3570/MAX3571/MAX3573低成本、宽带、两次变频调谐器芯片设计用于数字电视接收机。

每款芯片集成了所有必需的射频功能模块，其中包括一个集成的高中频滤波器、全集成VCO、中频VGA。

工作频率范围从50MHz 至878MHz，同时提供超过60dB的RF及IF可控增益范围。

MAX3570/MAX3571具有以44MHz为中心的中频频率，而MAX3573具有以36MHz为中心的中频输出。

这三款芯片都包括了可变增益射频前端，噪声系数仅为8dB。

双频合成器产生两个本振(LO)频率，提供优异的相位噪声性能，在10kHz频偏时相位噪声为-86dBc/Hz。

集成的高中频(HI-IF)滤波器有55dBc (典型值)的镜像抑制。

仅需要一个中频SAW滤波器、无源环路滤波器和晶体振荡器即可构建完整的单芯片调谐器。

MAX3570芯片编程和配置由3线串行接口完成，而MAX3571/MAX3573芯片编程和配置由2线串行接口完成。

MAX3570/MAX3571/MAX3573采用48引脚QFN-EP封装，可工作于商业温度范围(0°C 至+70°C)。

_________________________________应用DVB-C数字电视接收机ATSC数字电视接收机有线电视调制解调器DOCSIS/EURO DOCSIS调制解调器ITU J.83数字机顶盒___________________________________特性♦全集成HI-IF滤波器♦全集成VCO，无需外部元器件和走线。

♦8dB低噪声系数♦高线性—大于54dBc, CSO, CTB, X-MOD。

♦业界最小的封装♦优异的相位噪声，可用于256-QAM、8-VSB和COFDM。

MAX3570/MAX3571/MAX3573高中频(HI-IF)单片宽带调谐器________________________________________________________________Maxim Integrated Products1_____________________引脚排列和功能框图______________________________定购信息*EP = 裸露焊盘。

pc357光耦参数摘要：1.PC357 光耦概述2.PC357 光耦参数列表3.PC357 光耦参数详解3.1 输入参数3.2 输出参数3.3 其他参数4.PC357 光耦参数应用实例5.PC357 光耦参数总结正文：【PC357 光耦概述】PC357 是一款光电耦合器，它是由发光二极管、光敏三极管以及相应的驱动和接收电路组成的。

光电耦合器具有电气绝缘、抗干扰能力强、传输信号速度快等特点，广泛应用于数字电路、模拟电路、功率驱动等领域。

【PC357 光耦参数列表】以下是PC357 光耦的主要参数：- 输入参数：IF=10mA，VCEO=3.0V，VCC=5.0V- 输出参数：IOH=100mA，VCOL=2.0V，VCC=5.0V- 其他参数：传输速率=100kbps，响应时间=500ns，电源电压范围=3.0-5.5V，工作温度范围=-40°C 至+85°C【PC357 光耦参数详解】【3.1 输入参数】- IF：输入电流，表示光电耦合器正常工作时所需的最小电流，PC357 的IF 为10mA。

- VCEO：发射极开路电压，表示光电耦合器正常工作时，发射极与集电极之间的电压，PC357 的VCEO 为3.0V。

- VCC：电源电压，表示光电耦合器正常工作时所需的电源电压，PC357 的VCC 为5.0V。

【3.2 输出参数】- IOH：输出电流，表示光电耦合器正常工作时所能提供的最大输出电流，PC357 的IOH 为100mA。

- VCOL：集电极开路电压，表示光电耦合器正常工作时，集电极与发射极之间的电压，PC357 的VCOL 为2.0V。

- VCC：电源电压，表示光电耦合器正常工作时所需的电源电压，PC357 的VCC 为5.0V。

【3.3 其他参数】- 传输速率：表示光电耦合器传输信号的速度，PC357 的传输速率为100kbps。

- 响应时间：表示光电耦合器接收到输入信号后输出信号的反应速度，PC357 的响应时间为500ns。

FEATURES* Current transfer ratio( CTR : MIN. 50% at I F =5mA, V CE =5V )* High input-output isolation voltage( V iso =3,750Vrms )* High collector-emitter voltage( V CEO = 80V )* Employs double transfer mold technology* Subminiature type( The volume is smaller than that of conventional DIP type by as far as 30% ) * Mini-flat package :2.0mm profile : LTV-357T* UL approved ( No. E113898 )* CUL approved ( No. E113898 , 01SC19287 )* CSA approved ( No. 1243207 )* FIMKO approved ( No. FI-16420 )* NEMKO approved ( No. P0******* )* DEMKO approved ( No. 310475-01 )* SEMKO approved ( No. 0109173 / 01-08 )* VDE approved ( No. 138213 )* RoHS complianceAPPLICATIONS* Hybrid substrates that require high density mounting.* Programmable controllersABSOLUTE MAXIMUM RATING( Ta = 25°C ) PARAMETER SYMBOL RATING UNITForward Current I F50 mA INPUTReverse Voltage V R 6 VPower Dissipation P 70 mWCollector - Emitter Voltage V CEO80 VEmitter - Collector Voltage V ECO 6 V OUTPUTCollector Current I C50 mACollector Power Dissipation P C150 mW Total Power Dissipation P tot170 mW*1 Isolation Voltage V iso3,750 Vrms Operating Temperature T opr-55 ~ +110 °CStorage Temperature T stg-55 ~ +150 °C*2 Soldering Temperature T sol260 °C Junction Temperature Tj 125 °C*1. AC For 1 Minute, R.H. = 40 ~ 60%Isolation voltage shall be measured using the following method.(1) Short between anode and cathode on the primary side and between collector andemitter on the secondary side.(2) The isolation voltage tester with zero-cross circuit shall be used.(3) The waveform of applied voltage shall be a sine wave.*2. For 10 SecondsRANK TABLE OF CURRENT TRANSFER RATIO CTRMODEL NO. RANK MARK CTR ( % )A 80 ~ 160B 130 ~ 260C 200 ~ 400D 300 ~ 600E 50 ~ 150F 100 ~ 300LTV-357TA orB orC orD or No mark 50 ~ 600CONDITIONS I F = 5 mA V CE = 5 V Ta = 25 °Ctr Fig.9 Collector Dark Current vs.Ambient TemperatureFig.10 Response Time vs. LoadFig.11 Frequency Response 0C E Ambient temperature Ta ( C)Ambient temperature Ta ( C)Ambient temperature Ta ( C)Frequency f (kHz)e ( s )R e l a t i v e c u r r e n t t r a n s f e r r a t i o (%)V o l t a g e g a i n A v (d B )C o l l e c t o r -e m i t t e r s a t u r a t i o n v o l t a g e V (s a t ) (V )ooooo2040608010050100150 020408010020406080100501002005000.52010210100500Resistance0.020.040.060.080.1015205060C o l l e c t o r d a r k c u r r e n t I C E O (n A )V CE =20VI F =5mA V CE =2V I F =20mA I C =1mA V CE =2V I C =2mA Ta=25 CR L =10k Ω1k Ω100ΩV CE =2V I C =2mA Ta=25 C1101000010001000Ambient temperature T a ( C)R e l a t i v e c u r r e n t t r a n s f e r r a t i o (%)o2040608010050100150I F =5mAV CE =2VC E Ambient temperature Ta ( C)V (s a t ) (V )o2040801000.020.040.060.080.1060I F =20mAI C =1mATEMPERATURE PROFILE OF SOLDERING REFLOW(1)One time soldering reflow is recommended within the condition of temperature and timeprofile shown below.LITE-ON TECHNOLOGY CORPORATIONProperty of LITE-ON OnlyTEMPERATURE PROFILE OF SOLDERING REFLOW - Lite-On is continually improving the quality, reliability, function or design andLite-On reserves the right to make changes without further notices.- The products shown in this publication are designed for the general use in electronicapplications such as office automation equipment, communications devices,audio/visual equipment, electrical application and instrumentation.- For equipment/devices where high reliability or safety is required, such as spaceapplications, nuclear power control equipment, medical equipment, etc, pleasecontact our sales representatives.- When requiring a device for any ”specific” application, please contact our sales inadvice.- If there are any questions about the contents of this publication, please contact us atyour convenience.- The contents described herein are subject to change without prior notice.Do not immerse unit’s body in solder paste.Part No. :LTV-357T Page :11 of 11 BNS-OD-C131/A4。

proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes couldDIFFERENTIAL PHASEFigure 3. Multiburst (CCIR 18) Test Pattern (PAL) Figure 4. Multipulse Test Pattern (PAL)Figure 5. CCIR 17 Test Pattern (PAL)Gain errors most commonly appear as attenuation or peaking of the chrominance information. This shows up in the picture as incorrect color saturation. Delay distortion will cause color smearing or bleeding, particularly at the edges of objects in the picture. It may also cause poor reproduction of sharp luminence transitions.All waveforms in Figure 3 through Figure 5 were taken using the sag correction feature of OPA360. Figure 3 through Figure 5 show that the OPA360 causes no visible distortion or change in gain throughout the entire video frequency range.INTERNAL LEVEL SHIFTMany common video DACs embedded in digital media processors like TI’s TMS320DM270 and the new OMAP2420 processors operate on a single supply (no negative supply). Typically, the lowest point of the sync pulse output by these Video DACs corresponds to 0V. With a 0V input, the output of common single-supply op amps saturates at a voltage > 0V. This effect would clip the tip of the sync pulse and therefore degrade the video signal integity. The OPA360 employs an internal level shift circuit to avoid clipping. The input signal is typically shifted byFigure 6. Internal Level Shifter, Shifts Input Signal by Approximately 60mV to Prevent SyncTip ClippingThe level shift function is particularly useful when the output of the OPA360 is DC-coupled to the video load. However, it is also helpful when sag correction is employed. The offset helps to shift the video signal closer to the positive rail, so that with even a small 33µF coupling capacitor, the output is well outside the saturation limits of the OPA360. Figure 7 shows the output swing of the OPA360, operated on 3.0V supplies, with a 22µF sag correction capacitor and a 33µF output coupling capacitor. The test signal is a 50Hz signal constructed to generate a 1/2 black, 1/2 white screen. This video pattern is one of the most difficult patterns to display because it is the worst case signal regarding signal swing. A worst case signal such as this is highly unlikely in normal operation. Any other signal has a lower swing range. Note in Figure 7 that neither the white nor the black portion of the video signal is clipped.Figure 7. Output Swing with 33m F on 3V Supply OUTPUT SWING TO GND (SYNC PULSE)Figure 8 shows the true output swing capability of the OPA360 by taking the tip of the input sync pulse to a slightly negative voltage. Even when the output sync tip is at 8mV, the output shows no clipping of the sync pulse.Figure 8. Input Sync Tip at −30mV (Output ShowsNo Sign of Clipping)Figure 10. Standard Video Circuit with 220m F Capacitor (top trace) vs OPA360 with 22m F and47m F CapacitorsA field tilt equivalent to that achieved using the standard 220µF coupling capacitor can be achieved with a 22µF/67µF combination − see Figure 11. These capacitor values are optimized—sag correction capacitors larger than 22µF do not provide significant improvement. Smaller sag correction capacitors will lead to higher tilt.Figure 11. 220m F Standard Video Circuit (top trace) vs OPA360 with 22m F/67m FFigure 12. Output Swing with 47m F on 3V Supply Figure 13. Output Swing with 67m F on 3V SupplyC OUT 47µF R OUT 75ΩGND75Ω++OUT2−Pole Filter(1)SAGC SAG 22µF AC Gain =2DC Gain =2.8Television or VCROPA360Video DACNOTE:(1)Optional 200Ωfor use with TI’s Digital Media Processors.Level ShifterV+V+=2.7V to 3.3VFigure 14. DC-Coupled Input/AC-Coupled OutputFigure 16. DC-Coupled OutputPACKAGING INFORMATIONORDERABLE DEVICE STATUS(1)PACKAGE TYPEPACKAGE DRAWINGPINS PACKAGE QTYOPA360AIDCKR ACTIVE SOP DCK 63000OPA360AIDCKTACTIVESOPDCK6250(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,butTI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.PACKAGE OPTION ADDENDUM20-Jul-2004元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. 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T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. 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PC357NJ0000F Series1.Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. PC357)2. Package resin : UL flammability grade (94V-0)■ Features■ Agency approvals/Compliance1. Hybrid substrates that require high density mounting2. Programmable controllers■ ApplicationsMini-flat Package,General Purpose Photocoupler1. 4-pin Mini-flat package2. Double transfer mold package (Ideal for Flow Soldering)3. High collector-emitter voltage (V CEO : 80V)4. Current transfer ratio (CTR) : MIN. 50% at I F =5mA, V CE =5V5. Several CTR ranks available6. High isolation voltage between input and output (V iso(rms) : 3.75kV)7. RoHS directive compliant■ DescriptionPC357NJ0000F Series contains an IRED optically coupled to a phototransistor.It is packaged in a 4-pin Mini-flat package.Input-output isolation voltage(rms) is 3.75kV.Collector-emitter voltage is 80V and CTR is 50% to 600% at input current of 5mA.Notice The content of data sheet is subject to change without prior notice.In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP■ Internal Connection DiagramAnode Cathode Emitter Collector■ Outline Dimensions(Unit : mm)Plating material : SnCu (Cu : TYP. 2%)Date code (2 digit)Rank markRefer to the Model Line-up tableA.D.199019911992199319941995199619971998199920002001MarkABCDEFHJKLMN Mark P R S T U V W X A B C Mark 123456789O N DMonth January February March April May June July August September October November December A.D 20022003200420052006200720082009201020112012······2nd digitMonth of production 1st digitYear of productionFactory identification markPlease contact the local SHARP sales representative to see the actual status of the productionrepeats in a 20 year cycle■ Electro-optical CharacteristicsParameterConditionsForward voltageReverse current Terminal capacitance Collector dark current Collector-emitter breakdown voltage Transfer charac-teristicsEmitter-collector breakdown voltage Collector current Collector-emitter saturation voltage Isolation resistance Floating capacitance MIN.−−−6802.5−−5×1010−−−TYP.1.2−30−−50.11×10110.643MAX.1.410250−−300.2−1.01818Unit V µA pF nA −100V V mA V ΩpF µs µsSymbol V F I R C t I CEO BV CEO BV ECO I C V CE (sat)C ft rt fR ISO Response timeRise time Fall time InputOutputI F =20mA V R =4V V =0, f =1kHz V CE =50V, I F =0 I C =0.1mA, I F =0 I E =10µA, I F =0 I F =5mA, V CE =5V I F =20mA, I C =1mA V =0, f =1MHzV CE =2V, I C =2mA, R L =100ΩDC500V, 40 to 60%RH(T a =25˚C)■ Absolute Maximum Ratings(T a =25˚C)Parameter SymbolUnit I n p u tForward currentmA *1Peak forward current A Power dissipationmWO u t p u t Collector-emitter voltage V Emitter-collector voltage V Collector current mA Collector power dissipation mW Total power dissipation mW *2Isolation voltage Operating temperature˚C Storage temperature ˚C*3Soldering temperature I F I FM P V CEO V ECO I C P C P totV iso (rms)T opr T stg T sol˚C*1 Pulse width ≤100µs, Duty ratio : 0.001*2 40 to 60%RH, AC for 1 minute, f =60Hz *3 For 10sRating 50170Reverse voltage V V R680650150170−30 to +100−40 to +1252603.75kV■Model Line-upModel No.with or withoutABCDA or BB or CC or DA, B or CB, C or DA, B, C or DI C [mA](I F=5mA, V CE=5V, T a=25˚C)2.5 to 30.04.0 to 8.06.5 to 13.010.0 to 20.015.0 to 30.04.0 to 13.06.5 to 20.010.0 to 30.04.0 to 20.06.5 to 30.04.0 to 30.0PC357NJ0000FPC357N1J000FPC357N2J000FPC357N3J000FPC357N4J000FPC357N5J000FPC357N6J000FPC357N7J000FPC357N8J000FPC357N9J000FPC357N0J000F3 000pcs/reelTapingPC357NTJ000FPC357N1TJ00FPC357N2TJ00FPC357N3TJ00FPC357N4TJ00FPC357N5TJ00FPC357N6TJ00FPC357N7TJ00FPC357N8TJ00FPC357N9TJ00FPC357N0TJ00F750pcs/reelRank markPackagePlease contact a local SHARP sales representative to inquire about production status.30025020015010050017005010025T o t a l p o w e r d i s s i p a t i o n P t o t (m W )−30Ambient temperature T a (˚C)Fig.4 Total Power Dissipation vs. AmbientTemperatureF o r w a r d c u r r e n t I F (m A )Forward voltage V F (V)00.51 1.52 2.53 3.5101001Fig.6 Forward Current vs. Forward VoltageDuty ratio10100P e a k f o r w a r d c u r r e n t I F M (m A )10−310−210−1Pulse width ≤100µs T a =25˚C10 0001 0001Fig.5 Peak Forward Current vs. Duty Ratio255075100125706050403020100F o r w a r d c u r r e n t I F (m A ) −30Ambient temperature T a (˚C)Fig.1 Forward Current vs. AmbientTemperatureD i o d e p o w e r d i s s i p a t i o n P (m W )1008012060402000505510070−30Ambient temperature T a (˚C)Fig.2 Diode Power Dissipation vs. AmbientTemperature0025507510012520015010050C o l l e c t o r p o w e r d i s s i p a t i o n P C (m W )−30Ambient temperature T a (˚C)Fig.3 Collector Power Dissipation vs.Ambient TemperatureC o l l e c t o r d a r k c u r r e n t I C E O (A )Ambient temperature T a (˚C)806040200−3010010−510−610−710−810−910−1010−11V CE =50VFig.11 Collector Dark Current vs. AmbientTemperature0.010.1110100.11100R e s p o n s e t i m e (µs )V CE =2V I C =2mA T a =25˚Ct st dt ft rLoad resistance R L (k Ω)Fig.12 Response Time vs. Load Resistance806004050100150R e l a t i v e c u r r e n t t r a n s f e r r a t i o (%)−30020100Ambient temperature Ta (˚C)I F =5mA V CE =5VFig.9 Relative Current Transfer Ratio vs.Ambient Temperature10020−30C o l l e c t o r -e m i t t e r s a t u r a t i o n v o l t a g e V C E (s a t ) (V )0.160.10.0640060800.020.040.080.120.14Ambient temperature T a (˚C)I F =20mA I C =1mAFig.10 Collector - emitter Saturation Voltagevs. Ambient Temperature504020101086420305m A10m A20m AC o l l e c t o r c u r r e n t I C (m A )Collector-emitter voltage V CE (V)T a =25˚CP C (MAX.)I F =30mA Fig.8 Collector Current vs. Collector-emitterVoltage1001010.1C u r r e n t t r a n s f e r r a t i o C T R (%)2004000100300500Forward current I F (mA)V CE =5V T a =25˚CFig.7 Current Transfer Ratio vs. ForwardCurrentRemarks : Please be aware that all data in the graph are just for reference and not for guarantee.10%90%Please refer to the conditions in Fig.12CEFig.13 Test Circuit for Response Time81230C o l l e c t o r -e m i t t e r s a t u r a t i o n v o l t a g e V C E (s a t ) (V )76543211569Forward current I F (mA)Fig.14 Collector-emitter Saturation Voltagevs. Forward Current■ Design Considerations While operating at I F <1.0mA, CTR variation may increase.Please make design considering this fact.This product is not designed against irradiation and incorporates non-coherent IRED.● DegradationIn general, the emission of the IRED used in photocouplers will degrade over time.In the case of long term operation, please take the general IRED degradation (50% degradation over 5 years) into the design consideration.✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes.● Design guide● Recommended Foot Print (reference)(Unit : mm)■ Manufacturing Guidelines Reflow Soldering:Reflow soldering should follow the temperature profile shown below.Soldering should not exceed the curve of temperature profile and time.Please don't solder more than twice.● Soldering Method Flow Soldering :Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines.Flow soldering should be completed below 260˚C and within 10s.Preheating is within the bounds of 100 to 150˚C and 30 to 80s.Please don't solder more than twice.Hand solderingHand soldering should be completed within 3s when the point of solder iron is below 400˚C.Please don't solder more than twice.Other noticesPlease test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions.12343002001000(˚C)(min)● Cleaning instructionsSolvent cleaning:Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or lessUltrasonic cleaning:The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device.Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production.Recommended solvent materials:Ethyl alcohol, Methyl alcohol and Isopropyl alcoholIn case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin.● Presence of ODCThis product shall not contain the following materials.And they are not used in the production process for this product.Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominateddiphenyl ethers (PBDE).■ Package specification ● Tape and Reel package 1. 3 000pcs/reel Package materialsCarrier tape : A-PET (with anti-static material)Cover tape : PET (three layer system)Reel : PSCarrier tape structure and DimensionsA 12.0±0.3B 5.5±0.1C1.75±0.1D 8.0±0.1E 2.0±0.1H 7.4±0.1I 0.3±0.05J 3.1±0.1K 4.0±0.1F 4.0±0.1Gφ1.5+0.1 −0Dimensions List(Unit : mm)a 370b 13.5±1.5c 80±1.0d 13±0.5e 21±1.0f 2.0±0.5g 2.0±0.5Dimensions List(Unit : mm)[Packing : 3 000pcs/reel]Reel structure and DimensionsDirection of product insertion2. 750pcs/reelPackage materialsCarrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system)Reel : PSCarrier tape structure and DimensionsA 12.0±0.3B5.5±0.1C1.75±0.1D8.0±0.1E2.0±0.1H 7.4±0.1I0.3±0.05J3.1±0.1K4.0±0.1F4.0±0.1Gφ1.5+0.1−0a180b13.5±1.5c80±1.0d13±0.5e21±1.0f2.0±0.5g2.0±0.5Dimensions List(Unit : mm)[Packing : 750pcs/reel] Reel structure and DimensionsDirection of product insertion· The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices.· Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice.· Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions:(i) The devices in this publication are designed for use in general electronic equipment designs such as:--- Personal computers--- Office automation equipment--- Telecommunication equipment [terminal]--- Test and measurement equipment --- Industrial control--- Audio visual equipment --- Consumer electronics(ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connectionwith equipment that requires higher reliability such as:--- Transportation control and safety equipment (i.e.,aircraft, trains, automobiles, etc.)--- Traffic signals--- Gas leakage sensor breakers --- Alarm equipment--- Various safety devices, etc.(iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as:--- Space applications--- Telecommunication equipment [trunk lines]--- Nuclear power control equipment--- Medical and other life support equipment (e.g.,scuba).· If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices.· This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party.· Contact and consult with a SHARP representative if there are any questions about the contents of this publication.■Important Notices。

YX3157功放板（光耦版）说明书YX3157宽电压功放板，集成MP3解码，DC12到40V超宽电压输入，自带32M bit存储器，使用方便，稳定可靠。

特色功能：➢MP3 无损音频，音频还原度高；➢工业级设计标准，用于工控设备，安防设备，及家电应用产品较为广范；➢宽电压输入：DC12-40V；➢功放功率输出15W，带音量调节功能；➢开关量触发8段音频播放；播放模式可以通过配置文件设置；➢无需任何软件，USB直接更换声音；应用场合：➢安防类：语音播放系统插播；安防语音提示；➢讲解类：景区语音讲解；博物馆，展览馆，艺术画廊项目讲解；语音提示：➢玩具类：儿童语音玩具；模拟语音音效产品；➢功放类：用于背景音乐播放，广告播放等功能。

➢包装类：工艺品包装；礼品包装；产品图(按触发电平分为两款)：功能配置：MP3功放板我们采用的是IO按键的方式，取代了AD键盘的接法，我们MP3功放板默认配置8个按键的功能分配，这样做的好处是可以在任何恶劣的场合随意的控制，甚至也可以作为与MCU的通信接口。

我们的按键分配多种不同类型的功能。

按键功能配置：由于我们的方案支持FAT文件系统，所以设备中的文件的内容，可以很轻易的读出来，所以我们就扩展了此功能，通过设备内的read.cfg文件来读取按键的配置。

(1)、配置文件必须命名为read.cfg，这样才能被系统所识别，其它的命名系统则不识别，原理是这样的，MP3功放板上电之后初始化文件系统，会首先搜索read.cfg。

这个文件，搜索到之后，对里面的数据进行读取和处理。

请严格的按照我们给出的配置参数的方法(2)、配置文件在同一个设备中，最多只能有一个，可以没有，但是一定不能出现两个或者以上，否则会导致识别出错。

(3)、配置文件的参数取值为0-B，每个IO口对应1个数值，后两位对应音量，共12位。

如下图：这几个数据一般只用在一组按键上，直接对应数值表中的功能，如：第一位数据为“A”时，则K1按一下音量就会加一级，共30级。