PCB专业英语培训教材(1)

pcb生产流程培训英文版Here is the English essay on the topic of "PCB production process training" with a word count of over 1000 words:The production of printed circuit boards (PCBs) is a crucial process in the electronics industry, as these components serve as the backbone for a wide range of electronic devices, from smartphones to industrial equipment. Ensuring the proper training and understanding of the PCB production process is essential for maintaining high standards of quality and efficiency. In this essay, we will delve into the various stages of the PCB production process, providing a comprehensive overview for trainees and professionals alike.The first step in the PCB production process is the design phase. This involves the creation of a digital schematic or layout, which outlines the placement and interconnections of the various components that will be mounted on the board. The design phase requires a thorough understanding of electrical engineering principles, as well as the specific requirements and constraints of the intended application. Designers must consider factors such as component size, heat dissipation, and signal routing to ensure the PCB will function asintended.Once the design is complete, the next step is the fabrication of the PCB itself. This process begins with the creation of the base material, which is typically a thin, rigid substrate made of fiberglass or other insulating materials. The substrate is then coated with a thin layer of copper, which will serve as the conductive pathways for the electronic components. The copper layer is then etched away, leaving behind the desired circuit patterns.After the basic PCB structure has been created, the next step is the drilling process. This involves the use of specialized machinery to create the necessary holes and vias that will allow the components to be mounted and interconnected. The drilling process must be carried out with a high degree of precision, as the placement and size of these holes can have a significant impact on the overall performance and reliability of the PCB.Following the drilling process, the PCB undergoes a series of cleaning and preparation steps to ensure that the surface is ready for the next stage of production. This may include the application of a solder mask, which is a protective coating that helps to prevent short circuits and corrosion, as well as the application of a surface finish, such as gold or tin, to improve the solderability of the board.Once the PCB has been prepared, the next step is the component placement and soldering process. This involves the use of specialized equipment, such as pick-and-place machines, to accurately position the various electronic components on the board. The components are then secured in place using a process called soldering, which involves the melting of a metal alloy to create a strong, conductive bond between the component and the PCB.After the component placement and soldering process, the PCB undergoes a series of quality control checks to ensure that it meets the required standards for performance and reliability. This may include visual inspections, electrical testing, and even more advanced techniques such as automated optical inspection (AOI) and X-ray analysis.Finally, the completed PCB is packaged and prepared for shipment to the end customer. This may involve the addition of protective coatings, the installation of connectors or other hardware, and the labeling and documentation of the PCB.Throughout the entire PCB production process, it is essential that workers and trainees receive comprehensive training on the various techniques and equipment involved. This training should cover not only the practical aspects of the production process, but also the underlying principles and best practices that guide the industry. Byensuring that all personnel involved in the PCB production process are well-trained and knowledgeable, companies can ensure that their products meet the highest standards of quality and reliability.In conclusion, the PCB production process is a complex and multifaceted endeavor that requires a deep understanding of electrical engineering, materials science, and manufacturing techniques. By providing comprehensive training to all personnel involved in the process, companies can ensure that their PCBs are produced to the highest possible standards, helping to drive innovation and advancement in the electronics industry.。

Expedition PCB基础培训教程Copyright(c) Mentor Graphics Corporation 2010All rights reserved本文档记录的信息属于Mentor Graphics公司所有，未经Mentor Graphics公司书面许可，严禁以任何方式复制其中的任何章节或全文内容。

本文档接收者，应当尽力避免对文档信息采取未经授权的使用行为。

目 录第一章 库的使用 (9)第二章 焊盘的创建 (13)第三章 创建Cell (20)第四章 创建Symbol (34)第五章 创建Part (46)第六章 创建Template (56)第七章 DxDesigner的使用 (61)第八章 PCB Editor的使用 (80)第九章 PCB设计设定 (98)第十章 创建Board Geometries (108)第十一章 布局 (117)第十二章 Layout 设定 (127)第十三章 布线 (143)第十四章 测试点 (156)第十五章 生成Plane (160)第十六章 设计检查 (170)第十七章 生成丝印 (177)第十八章 生成Gerber和Drill (185)第十九章 尺寸标注与文件编制设计 (193)关于本书本书是Expedition PCB Introduction的培训教程,书中介绍了熟练使用Mentor Graphics Expedition PCB工具进行印刷电路板的设计需要掌握的相关概念。

读者该培训课程,主要面向使用Mentor Graphics Expedition PCB工具来设计和编辑印刷电路板,并具有以下预备知识的设计师和工程师。

课程特点z本课程关注Expedition PCB在设计流程中的使用，而不是对Expedition PCB的所有功能进行详尽介绍；z阐述印刷电路板技术及其设计方法，也不是本课程的重点。

预备知识●用户应该掌握基本的PCB布局布线设计思想。

PCB英语培训资料一. 流程英语及相关词汇❖PCB(Printed Circuit Board) 印制线路板❖Marketing Department市场部❖PE – Product Engineering Department 产品工程部❖MI - Manufacturing Instruction生产制作指示/生产流程单❖CAD/CAM - Computer Aided Design计算机辅助设计/制造❖TQ—Engineering Technical Query 工程问题1. Inner board cutting: 内层开料-1❖Sheet Size大料尺寸❖Panel Size拼板尺寸❖Material Type材料类型❖Supplier供应商❖Base material基材❖Thickness厚度❖Board Thickness板厚❖Laminate Thickness材料厚度❖inner core 芯板/内层板料❖Comparative Tracking Index 比较漏电痕迹指数CTI❖Glass Transition Temperature玻璃态转化温度Tg1. Inner board cutting: 内层开料-2❖Dielectric Thickness介电层厚度❖Dielectric constant介电常数Er❖Base Copper底铜/基铜❖Delamination分层❖Flammability可燃性❖Baking烘板❖Single/double单层/双面❖Double sided board双面板❖Multilayer board 多层板❖Bare board裸板(board without copper)2. Inner Image Transfer:内层图像转移/内光成像3. Inner Etching 内层蚀板4. Inner AOI—Automatic Optical Inspection自动光学检查5. Pressing 层压❖Lamination 压板❖Lay-up structure压板结构❖PP - Prepreg半固化片❖Copper clad/ Copper foil铜箔Cu foil❖Resin树脂❖After Pressed Thickness压板后之厚度6. Drilling 钻孔-1❖Hole孔❖Hole Type孔类型❖Hole Tolerance 孔径公差❖Hole chart 孔表/分孔图❖Plated Though Hole 金属化孔PTH❖Non-Plated Though Hole 非金属化孔NPTH❖Drill tape钻带❖Blind via hole盲孔❖Buried hole埋孔❖Hole Diameter孔径6. Drilling 钻孔-2❖Hole location孔位❖Hole Position Tolerance孔位误差❖Hole Position Deviation孔位置偏差❖2nd Drilling 重钻❖Mounting hole安装孔❖Pin hole销定孔❖Target Hole目标孔❖Slot 槽,坑❖No. of holes孔数❖Laser via hole激光穿孔❖Roughness粗糙度7. Plate Through Hole (PTH)沉铜/孔化❖Hole wall copper thick 孔壁铜厚❖Defect缺陷❖Cracking裂缝8. Outer Dry Film 外层干菲林/外光成像-1❖Dry Film干菲林/干膜D/F❖External layer外层❖Internal layer内层❖Component Side 零件面C/S❖Solder Side焊接面S/S❖Top side/ layer 顶层❖Bottom side/layer底层❖Primary side首面❖Secondary side第二面❖(提示: 层的写法尽量按客户的习惯书写)8. Outer Dry Film 外光成像-2❖Power plane电源层❖Ground 接地层❖Layer层❖Dry-film tenting D/F封孔❖Surface mounting Device表面粘贴装置SMD❖Line Width线宽—LW❖Line Space线隙—LS: Line-Line/Line-Pad/Pad-Pad❖Conductor导体❖Circuit线路❖Pattern线路❖Artwork菲林❖Master drawing菲林图形❖Artwork Modification菲林修改❖Outer Dry Film外光成像-3❖Annular ring锡圈❖Min.Annular Ring最小环宽/焊盘宽❖Hole breakout 破环/崩孔❖Pad焊盘❖Round pad圆盘❖Teardrop泪珠❖Clearance/space间距/间隙❖Minimum 最小---Min.❖Maximum 最大---Max.❖Min.Spacing between Line to Line线与线间的最小距离❖Test coupon图样❖Registration Deviation 对位偏差9. Pattern Plating 线路电镀/图形电镀❖Plating电镀❖Chemical corrosion化学腐蚀❖Copper plating电镀铜❖Copper thickness on hole wall 孔内铜厚❖Max.Board Thickness After Plating电镀后总板厚度之上限10. Outer Etching 外蚀板❖Undercut侧蚀11. Solder Resist 湿绿油/阻焊-1❖S/M(Solder Mask) 阻焊❖Solder resist film阻焊菲林❖SM print SM印油菲林❖SM imaging SM曝光菲林❖Solder Mask opening 阻焊开窗/曝光窗❖Solder Mask material/Type 绿油材料/类型❖Color颜色❖Shiny有光泽的,发光的(光亮油,)❖Matte哑光油的❖Matte Green 哑光绿油❖Liquid Photo-Imaginable (LPI)液态光固化剂11. Solder Mask 湿绿油/阻焊-2❖W/F(Wet Film) 湿膜/湿绿油❖Ball Grid Array (BGA) 球栅阵列❖S/M Bridge 绿油桥❖Cover 盖(油入孔)❖Tenting封孔/盖油❖Via Plugging 封孔❖Plug Hole塞孔❖Filled with solder resist 塞孔❖Solder mask on bare copper (SMOBC) 裸铜覆盖阻焊膜❖Encroach 侵占, 蚕食❖Encroach into holes 入孔12. Carbon Ink 印碳油❖Carbon ink碳油❖Carbon Resistance 碳油电阻13. Component Mark 印字符❖Silk Screen丝印❖Component Marking 元件字符C/M❖Legend字符❖Corner mark板角记号❖Logo标记❖Date Code周期代号❖Cust. P/N: customer part number客户型号❖Revision/Version:版本号14. Gold Finger Plating 金手指❖Bevelling斜边❖Gold Finger(G/F) 金手指❖Chamfer倒角❖Key slot槽孔❖Au/Ni 金/镍15. Hot Air Leveling 喷锡❖HAL(Hot Air Leveling) 热风整平❖HASL Hot Air Solder Leveling❖Impedance阻抗IMP❖Surface Treatment表面处理16. Immersion Silver 沉银17. OSP抗氧化处理18. Immersion Tin 沉锡19. Immersion Gold/Imm Au 沉金20. Solder/Tin/Lead Stripping 退锡❖ENIG----Electroless Nickel/Immersion Gold 沉金(工艺) ❖Ag银21. V-Cutting V-坑❖V-Cut V - 坑❖Remain Thickness 保留厚度❖Scoring==V-CUT刻槽❖Scratch划痕❖V-groove V- 坑22. Routing (铣/锣板)/ Punching 啤板❖Profiling外围成型❖Engineering drawing工程图纸❖Fiducial mark基准点❖Dimension尺寸❖Length 长度❖Width 宽度❖Breakaway tab/area板边位❖Datum hole基准参考孔❖Punching die /Punch 啤模❖Offset偏移量❖Outline外形❖Shape 外形23. Electrical Testing 电测试❖E-test fixture E-T 夹具❖Electrical Test Fixture电测试夹具❖V oltage电压❖Open/short开路/短路❖Probe point测试点24. Outer Final QC 最后检查❖Warpage翘曲度❖Bow and twist 板弯曲25. Peelable Mask 印蓝胶❖Peelable Mask/Blue Mask蓝胶❖Peelable可剥性26. Packing&Shipment 包装出货❖Vacunm Pack真空包装❖No.of Pcs Per Bag每包数量❖Packing包装27. Other其它相关-1❖Gerber Data 客户资料打包文件❖Checklist检查表❖production film 生产菲林❖Paste film粘贴/贴键菲林/钢网❖Solder coating上锡❖Reliability可靠性❖Assembly安装性❖Correspondance符合性❖Pin gauge 针规❖Backplane背板❖Customer客户27. Other其它相关-2❖Customer P/N客户产品编号❖Delivery交货❖Description说明❖Golden board金板❖Missing 缺少❖Mother board 主机板❖Ionic cleanliness离子清洁度/离子污染度❖Location位置❖Max. X-out坏板上限/最大允许报废板数❖No.of Array/Panel每个拼板套板数❖Negative反面的❖Positive正的27. Other其它相关-3❖Production生产板❖Sample样板❖Remark备注❖Special requirement特殊要求❖Specification详细说明，制作规范❖Wiring线路❖Square方形的❖View From…观察方向由…❖Lead free process 无铅处理❖Dummy Pad 为圆形或方形的PAD(加在板边位/标位或空白处起平衡电镀作用)❖Dummy copper实心的铜皮❖Thermal Pad 散热盘❖Fibre纤维面二. 问题之基本模式❖Title: Engineering technical question of 021D2002R2 (JOVE P/N: 20LN21119)==On Hold/Go on with suggestion❖Hello Ye jian,❖Nice to contact with you! I'm Jack, an Engineer from Engineering department in Jove.❖For the captioned project, we found some questions need you to confirm with customer.❖Question 1: As there are PTH (plated-hole) between the edge of unit, after doing V-cut, the holes will be scratched, and after customer divide them into two parts along the v-cut line, the copper showing in A part on the hole wall and that on the board may be picked off, which will lead to solder failure. Please refer to fig01❖Suggestion: a)To avoid this potential fault, we will modify the cad data: to add two PTH holes as position B to insure the connection between top and bottom sides. And to add two NPTH holes as position C (use 2nd drill) at the end-point of V-cut line which closed to that big PTH hole to cut the copper off so as to avoid copper being picked off. Please kindly confirm this modification can be acceptable.❖b) Or we will do sample board to let our customer to approve. Please have one, a) or b)? ❖Question 2: Same case as question 1 except that the PTH holes is only on one edge of unit. Please refer to fig02❖Suggestion: a) We will do them NPTH holes and will shave the copper around holes to get about 8 mil clearance.❖ b) We only add two NPTH holes (use 2nd drill) at the end-point of V-cut line whichclosed to that big PTH hole to avoid that potential fault. Please kindly confirm these modification can be acceptable.❖❖Have a nice day!❖B.Regards❖Ding, you de**********************❖Engineering technical question of 021D2002R2 (JOVE P/N: 20LN21119)==On Hold/Go on with suggestion❖Dear John(名字)❖Hello Mr Smith(姓)❖Hi Miss Green❖Nice day John❖Good Morning Jack❖Nice to contact with you! / I’m glad to cooperate with you!❖I'm Jack, an Engineer from Engineering department in Jove.❖1) After checking the captioned new project/updated gerber data, we have some questions as below. Would you please help to settle them. 在检查完此新板后，我们有如下问题。

PCB培训资料1一、PCB 简介PCB（Printed Circuit Board），中文名称为印制电路板，是电子元器件电气连接的提供者。

它是在绝缘基材上，按预定设计形成点间连接及印制元件的印制板。

PCB 的主要功能是为电子元器件提供固定、装配的机械支撑，实现电子元器件之间的布线和电气连接，以及为电子设备提供电路信号传输和散热等功能。

PCB 的发展历史可以追溯到上世纪初。

随着电子技术的不断进步，PCB 的制造工艺和设计水平也在不断提高。

从最初的单面板到双面板，再到多层板，以及如今的高密度互联板（HDI）和柔性电路板（FPC），PCB 的技术不断创新，以满足日益复杂的电子设备需求。

二、PCB 的分类PCB 按照层数可以分为单面板、双面板和多层板。

单面板是指在最基本的 PCB 上，零件集中在其中一面，导线则集中在另一面上。

因为单面板在设计线路上有许多严格的限制，所以只有早期的电路才使用这类的板子。

双面板的两面都有布线，不过要用上两面的导线，必须要在两面间有适当的电路连接才行。

这种电路间的“桥梁”叫做导孔（via）。

导孔是在 PCB 上充满或涂上金属的小洞，它可以与两面的导线相连接。

多层板是指具有三层或更多层的导电图形层与其间的绝缘材料以相隔层压而成，且其间导电图形按要求互连的印制板。

多层板使用更多的布线层，可以容纳更复杂的电路设计。

此外，根据材质的不同，PCB 还可以分为刚性 PCB 和柔性 PCB。

刚性 PCB 具有较高的机械强度，常用于大多数电子设备中。

柔性 PCB 则具有可弯曲、折叠的特点，适用于一些对空间和形状有特殊要求的产品，如手机、平板电脑等。

三、PCB 的制造流程PCB 的制造是一个复杂且精细的过程，主要包括以下几个步骤：1、设计原理图在开始制造 PCB 之前，需要先设计电路原理图。

原理图是用特定的符号和线条来表示电路中各个元件之间的连接关系。

2、设计 PCB 布局根据原理图，设计 PCB 的布局。

培训教材目录第一章基础培训教材第一节常用术语解释（一） (1)1．组装图 (1)2．轴向引线元件 (1)3．单端引线元件 (1)4．印刷电路板 (1)5．成品电路板 (1)6．单面板 (1)7．双面板 (1)8．层板 (2)9．焊盘 (2)10．元件面 (2)11．焊接面 (2)12．元件符号 (2)一三．母板 (2)14．金属化孔（PTH） (2)一五．连接孔 (2)16．极性元件 (2)17．极性标志 (2)一八．导体 (2)19．绝缘体 (2)20．半导体 (3)21．双面直插 (3)22．套管 (3)23．阻脚 (3)24．管脚打弯 (3)25．预面型 (3)第一节常用术语解释（二） (4)1．空焊 (4)2．假焊 (4)3．冷焊 (4)4．桥接 (4)5．错件 (4)6．缺件 (4)7．极性反向 (4)8．零件倒置 (4)9．零件偏位 (4)10．锡垫损伤 (4)11．污染不洁 (4)12．爆板 4一三．包焊 (4)14．锡球 4一五．异物416．污染 417．跷皮 4一八板弯变形 (4)19．撞角、板伤 (4)20．爆板 (4)21．跪脚 (4)22．浮高 (4)23．刮伤 (4)24．PCB板异物 (4)25．修补不良 (4)26．实体 (5)27．过程 (5)28．程序 (5)29．检验 (5)30．合格 (5)31．不合格 (5)32．缺陷 (5)33．质量要求 (5)34．自检 (5)35．服务 (5)第二节电子元件基础知识 (6)（一）阻器和电容器 (6)1．种类 (6)2．电阻的单位 (6)3．功率 (6)4．误差 (6)5．电阻的标识方法 ··································································································· 6-86．功率电阻 (8)7．电阻网络 ············································································································ 8-98．电位器 (9)9．热敏电阻器 (9)10．可变电阻器 (9)（二）电容器 (10)1．概念和作用 (10)2．电路符号 (10)3．类型 (10)4．电容量 (10)5．直流工作电压 (10)6．电容器上的工程编码 (10)7．习题 ················································································································11-12 二、变压器（Transformer）和电感器（Inductor）·············································································一三（一）变压器············································································································一三（二）电感器............................................................................................................一三三、二极管(diodc) (14)1．稳压二极管 (14)2．发光二极管(LED) (14)四、三极管(triode) ···················································································································一五1．习题 (16)五、晶体（crystal） (17)六、晶振（振荡器） (17)七、集成电路（IC） (17)八、稳压器 ·······························································································································一八九、IC插座（Socket） ················································································································一八十、其它各种元件 (19)1．开关(Rwitch) (19)2．继电器(Relayo) (20)3．连接器(Connector) (20)4．混合电(mixed circuit) (20)5．延迟器 (20)6．篇程连接器 (20)7．保险丝(fuse) (20)8．光学显示器(optic monitor) (20)9．信号灯(signal lamp) (20)十一、静电防护知识 (20)1．手带 (21)2．脚带 (21)3．工作台表层材料 (21)4．导电地板胶和导电腊 (21)5．导电框 (21)6．防静电袋 (22)7．空气电离器 (22)8．抗静电链 (22)十二、储蓄过程 (23)十三、元件符号归类 (23)一、公司产品生产工艺流程 (24)二、插件技术 (24)1．电阻的安装 (24)2．电容的插装······································································································ 25-263．二极管的插装 (27)4．三极管的安装 (27)5．晶体的安装 (27)6．振荡器的安装 (27)7．IC的安装 (27)8．电感器的发装 (27)9．变压器的安装 (27)三、补焊技术 (28)四、测试技术............................................................................................................... 28-29 第二章品质管制的演进史 (30)第一节、品质管制演进史 (30)一、品质管制的进化史 (30)第二节、品管教育之实施 (31)一、品质意识的灌输 (31)二、品管方法的训练及导入 (32)三、全员参与，全员改善 (33)第三节品管应用手法 (34)一、层别法 (34)二、柏拉图法·····················································································································35/36三、特性要因图法 (37)（一）特性要因图使用步骤 (37)（二）特性要因图与柏拉图之使用 (38)（三）特性要因图再分析 (38)四、散布图法 (39)五、直方图法 (40)六、管制图法 (41)（一）管制图的实施循环 (41)（二）管制图分类 (42)1．计量值管制图 (42)2．计数值管制图 (42)（三）X—R管制图 (43)七、查核表（Check Sheet） ....................................................................................................44/45 第四节品管抽样检验 . (46)（一）抽样检验的由来 (46)（二）抽样检验的定义 (46)（三）用语说明 (46)1．交货者及检验收者 (46)2．检验群体 (46)3．样本 (46)4．合格判定个数 (46)5．合格判定值 (46)6．缺点 (46)7．不良品 (47)四、抽样检验的型态分类 (47)1．规准型抽样检验 (47)2．选别型抽样检验 (47)3．调整型的抽样检验 (47)4．连续生产型抽样检验 (47)五、抽样检验与全数检验之采用 (48)1．检验的场合 (48)2．适应全数检验的场合 (48)六、抽样检验的优劣 (48)1．优点 (48)2．缺点 (48)七、规准型抽样检验 (48)1．允收水准（Acceptable Quality Level） (48)2．AQL型抽样检验 (49)八、MIL-STD-105EⅡ抽样步骤 ·························································································49/50九、抽取样本的方法 (50)第三章5S 活动与ISO9000知识第一节5S活动 (51)一、5S活动的兴起 (51)二、定义51 ··························································································································三、整理整顿与5S活动··········································································································52/53四、推行5S活动的心得 (54)五、5S活动的作用 (54)第二节ISO9000基础知识 (55)一、前言 (55)二、ISO9000：94版标准的构成 (55)三、重要的术语 (5556)四、现场质量管理 (56)1．目标 (56)2．精髓 (56)3．任务 (56)4．要求 (57)ISO9001：2000版 (58)1．范围 (58)2．参考标准 (58)3．名词与定义 (58)4．品质管理系统 ·······················································································································58/69。

pcb生产流程培训英文版**Introduction**PCB, short for Printed Circuit Board, is the foundation of any electronic device. It's where all the components are connected and make the device function. Understanding the PCB production process is crucial for engineers, designers, and anyone involved in the electronics industry. In this comprehensive PCB production process training, we'll delve into each step, from concept to completion.**1. PCB Design**The first step is PCB design, which involves converting the electrical schematic into a physical layout. This is done using PCB design software, where components are placed and connected using tracks or wires. The designer needs to consider factors like component size, spacing, and heat dissipation during this stage.**2. Gerber File Generation**Once the design is complete, it's converted into a Gerber file. This is a standard file format used in PCB manufacturing, which contains all the necessary informationabout the board's layers, tracks, and components. TheGerber file is sent to the PCB fabricator for manufacturing. **3. PCB Fabrication**Fabrication involves cutting the PCB board from alarger sheet of copper-clad laminate. This is done using a machine called a router, which follows the patterns in the Gerber file. After cutting, the board goes through various processes like drilling, etching, and plating to create the necessary circuits and connections.**4. Component Placement**The next step is component placement, where the electronic components are soldered onto the PCB. This is done either manually or using automated machines, depending on the complexity and scale of production. Components like resistors, capacitors, and ICs are carefully placed on the board according to the design.**5. soldering and Testing**After component placement, the board goes through a soldering process to ensure secure connections. This is followed by rigorous testing to ensure the board functionsas designed. Tests include visual inspection, continuity checks, and functional testing.**6. Assembly and Final Testing**Once the PCB passes the initial tests, it's assembled with other components and subsystems to form the final product. The assembled product then goes through final testing to ensure it meets all specifications and is ready for market.**Conclusion**The PCB production process is a complex yet fascinating field. It involves multiple stages, each requiring precision and attention to detail. This training has provided a comprehensive overview of the PCB production process, from design to final testing. With this knowledge, you'll be well-equipped to handle any PCB-related task confidently.**PCB生产流程培训中文版****介绍**PCB，即印刷电路板，是任何电子设备的基础。

基础培训教材线路生成的原理是，用一整块铜面，将需要保留的铜保护起来，将不要的铜蚀掉，这样就形成了线路。

对于孔，是用化学反应，将化学液中的铜离子通过氧化还原反应，变成金属铜，并且附着在孔壁上，形成金属化孔，同线路相连从而导通。

A 按层分。

单面板:流程：开料――钻孔――丝印湿菲林—显影—蚀板—丝印阻焊油――丝印字符――喷锡(沉金，OSP,沉锡，沉银)—冲板(孔)—洗板――电测试――终检－包装出货双面板流程：开料――钻孔――沉铜――板面电镀――丝印湿菲林（或压干菲林）――显影—－图形电镀――蚀板――退锡――中检（e-test）--丝印阻焊油――丝印字符――喷锡(沉金，OSP,沉锡，沉银)—冲板(孔)—洗板――电测试――终检－包装出货多层板流程：内层开料--钻孔--丝印湿菲林（或压干菲林）--显影-—蚀板—电测试（AOI）--黑化――压板—后面同双面板是一样的软板类工艺同硬板差不多，主要是中间的板料变成了聚酰亚胺类(PI),这种料比较软，可以适当的弯曲，B,按板料FR1，FR2：纸基板，是做单面板的料，用在一些便宜，要求不高的电子产品上CEM-1，CEM-3：玻纤板中的低端产品，只能做单面板和双层板FR4：用的最多的一种板料，单面，双层，多层都能用。

另外从普通FR4衍生出来的有高TG的FR4 ,无卤的FR4，价格会贵一些高频板料： Roger.Aton,等板料，目前这种国内还不能生产，都是国外生产，我公司目前还没有做过这种类型的板C:按表面处理:HASL(喷锡) LEAD FREE HASL（无铅喷锡） .. PLATING GOLD/Flash Gold（电金）IMMERSION GOLD（沉金） IMMERSION SILVER（沉银） IMMERSION TIN（沉锡） OSP （表面有机膜《抗氧化》）常用的中英文对照1．Front End Engineering前后工程处理i)PAR (Produceability Analysis Review)PAR可制作性评审ii)Product Engineering工程制作iii)CAM(Computer Aided Manufacturing) 计算机辅助制造iv)Photoplotting 光绘2．Manufacturing Process 制作过程i)lnner Layer 内层ii)Multilayer 层压iii)NC Drilling数控钻床iv)Electroless Copper 化学沉铜v)Outer Layer lmaging外光成像vi)Wet Processes湿法流程vii)Soldermask阻焊viii)Solderable Finishes(HASL & Alternatives)表面涂覆（热风整平或其他可以选择的方法）ix)Tab Gold Plating镀金手指x)Idents字符xi)NC Routing数控铣外形xii)QC Inspection QC检查3．Frequently Asked Questions常见问题i)Solderability可焊性ii)Ionic Cleanliness离子污染度iii)Controlled Impedance阻抗控制iv)Blind & Buried Vias盲埋孔第一部分Basic PCB Construction & Terminology 基本PCB构造和技术Basic Multilayer Foll Build多层板叠合结构Copper Foil铜箔Prepreg半固化片Core芯片半固化片Core芯片Prepreg半固化片Example：Foil Build - 6 layer board样板：6层板结构Basic PCB Construction Materials制造原料Laminates (cores,C-Stage)铜箔（芯板、C－阶段）·fully cured fiberglass-resin system完全胶连的玻璃树脂系统·copper clad铜箔·identified by core thickness,copper weight鉴别芯片厚度、铜箔重量“Prepregs”(B-stage)半固化片（B阶段）·Pre-impregnated Bonding Layers提前注入连接层·Partially cured fiberglass-resin system部分胶连的玻璃布树脂系统·identified by glass type根据玻璃布类型鉴别Copper Foils铜箔·Electrodeposited(ED)Std & DSTE电解铜或压延铜过程·1Oz = 0.0014”第二部分Quotations报价Information Required to Quote要求客户提供信息·Gerber File Data 光绘文件·Aperture File(except with 274*format) 光圈文件·Drill File 钻孔文件·Specifications(IPC standards,specifications,notes)标准（IPC标准、说明和注意事项等）·Mechanical Drawing(dimensions) 机械加工图纸Electronic Data Transfer数据传输方式·MODEM·E-mail,FTPacwaaq·Scaned Film扫描底片·Optimize action of panelization done at quoting stage报价阶段将板规格最优化·Standard manufacturing panels ：14*24；18*24（preferred）；21*24标准拼板尺寸：14*24；18*24；21*24·Usable space：0.600” border for double sided；0.750”border for multiplayer 可使用范围:双面板，0.6英寸；多层板：0.75英寸·Clearance:0.150”between boards for pinned routing净空：板与板间预留0.15英寸外形定位空间·Yield: <60% Poor；>75% excellent yield利用率：小于60%不好；大于75%利用率非常佳·We cost by manufacturing panel, not board!我们的报价是根据生产拼板，而不是交货板·Standard 0.5”*6”coupons added to all multiplayer board标准的0.5*6英寸付联板增加到所有的多层板上·Multiple orientations are permissible多层次的定位是允许的·Tab gold fingers require busing, can limit orientation金手指可控制朝向·Registration requirements can limit panel size·Some special restrictions: customer data size(Mb)；immersion gold tank size；etc.一些特殊限制：客户数据大小；沉金槽尺寸；其他·Small boards preferred in array format小板需要通过排布格式优化Printed Circuit Board Cost Driver Hierarchy 对PCB成本影响的趋势Layer Count 层数Physical Size(Panelization) 尺寸大小Surface Finishes 表面涂覆类型Board Thickness 板厚Surface Density 表面路线密度Specifications 规范特殊要求Drilling钻孔Depanelization板边大小Greater Impact影响大lesser Impact影响小and of course, Quantity and Delivery!!!当然，数量和交货期也是非常重要的因素。