0288215_V1.0(19010257《AM600-CPU1608TP+CPU模块用户手册》)20150923

Confidential BMediaTek Roadmap UpdateDecember/27/2013Copyright © MediaTek Inc. All rights reserved.Confidential BAgenda▪ WiFi Market Update ▪ WiFi Networking Roadmap ▪ Beyond WiFiCopyright © MediaTek Inc. All rights reserved.2013/12/27-2-Confidential BWiFi Market UpdateCopyright © MediaTek Inc. All rights reserved.Smart Phone Say Hello to 802.11acConfidential BHTC New OneSamsung S4Sony Xperia Z Ultra C6802MediaTek13’Feb13’Mar13’Jun14’Q1Copyright © MediaTek Inc. All rights reserved.2013/12/27-4-11n vs. 11ac Transition100% 90% 80% 70% 60% 50% 40% 30% 20% 10% 0% 2013 2014 20152013/12/27 5Confidential BN300 takes entry level positionAC750/AC1200 replace N600 and get growth momentumAC-4SS (DBC) AC-3SS (DBC) AC-2SS (DBC) AC-2SS (FE, DBC) AC-1SS (DBC) 3SS (DBC) 2SS (DBC) 3SS 2SS 1SS20162017Copyright © MediaTek Inc. All rights reserved.Source: ABI, In-Stat, Mediatek IntelligenceMarket Dynamic▪ Router SKU Transition– – – – – –Confidential BN300 replaced N150 as 11n entry level router 11ac DBC router replaced 11n DBC router (AC1200 $79) LTE Smart Phone drive 11ac and NFC demand Normal power router + repeater to extend coverage Router 2.0 - Internet router (public cloud) + home router (personal cloud) Deep Packet Inspection (DPI) becomes mandatory function in mid-/high-end router▪ Next Generation Hotspot (Passpoint R2) moves Wi-Fi to the heart of the carrier network ▪ Home Security & Automation– – – – – Cloud & App, +touch panel for control Surveillance: WiFi Cloud IPC Security: BT Door Lock Home Automation: +Zigbee/Sub-1G for sensor network Healthcare: +BTLE2013/12/27 -6-Copyright © MediaTek Inc. All rights reserved.Confidential BWiFi Networking RoadmapCopyright © MediaTek Inc. All rights reserved.Confidential BAgenda▪ Chip Roadmap ▪ MT7620 Highlights ▪ MT7620 11ac Solutions ▪ MT7621 11ac Solutions ▪ MT7612 11ac SolutionsCopyright © MediaTek Inc. All rights reserved.2013/12/27-8-11n Router RoadmapN600(GbE) N750(GbE) N900(GbE)RT6856 RT3593 RT3593 MT7530 • MIPS34KEc (700 MHz) • DDRI/DDRII, NAND/SPI • FE SW, 802.3az • USB2.0 (2), rGMII, PCIe (2) • IPSec Engine (140Mbps) • AES256-CBC • Storage AcceleratorCPUMPConfidential BMT7620ART3593 MT7530MT7620ART5592 MT7530• MT7530 GbE SW • 5p+2 rGMII • 802.3az EEE • Jumbo FrameN600MT7620ART5592MT7620AMT7530N300MT7620AMT7620N• • • • • • • • • •2x2 802.11n (300 Mbps) MIPS24KEc (580/600 MHz) SDR/DDRI/DDRII, NAND/SPI/SD-XC/eMMC FE SW, 802.3az USB, rGMII(2), PCIe 2Gbps HWNAT (IPv6) Storage Accelerator Lowest Power Consumption Best IOT w/ Intel6300 eCos IPv6 logo ready turnkey (2/8)MT762x• • • • • • • • • •2x2 802.11n (300 Mbps) MIPS24KEc (580 MHz) DDRI/DDRII, SPI/SD-XC/eMMC FE SW, 802.3az USB, PCIe AES128/256-CBC Calibration Free 5V/0.6A power adapter DRAM embedded ULC rBOM, PCBN300GMPQ1’14Q2’14Q3’14Q4’14Q1’15Q2’1511ac Router Roadmap• MIPS1004K dual-core (880MHz) • 256KB L2 • DDRII/DDRIII, NAND/SPI/SD-XC • GbE SW, 802.3az EEE • USB 3.0, USB 2.0, rGMII, PCIe (3) • IPSec Engine (> 400Mbps) • HWNAT(IPv6)+BW Control • Storage Accelerator • NFC: MT6605 • SATAIII(2): 3rd PCIeCPUMPConfidential BAC1750(GbE)MT7621AMT7605E MT7615EAC1200(GbE)MT7621AMT7612E MT7602EMT7602E • LDPC, Beamforming • 256QAMMT7621AMT7612E MT7603EAC1200MT7603E • ULC • MCC • Airtime Fairness • 802.11v, 802.11j • Samples: Q1 2014• 4x4/4SS, 11ac stage2 • LDPC, Beamforming, MU-MIMO • 802.11v, 802.11j • CPU offload • Samples: Q4 2014MT7620AMT7612E• iPA • LDPC, Beamforming • Calibration FreeAC750MT7620AMT7610E• BeamformeeMPQ1’14Q2’14Q3’14Q4’14Q1’15Q2’15Dongle RoadmapAC1300CPUMPConfidential BAC866MT7612U • USB 3.0 • LDPC, Beamforming • Calibration Free, iPAMT7662U • USB 3.0 • BT 4.0+HS, LDPC, Beamforming • Calibration Free, iPA • Linux, Android MT7650U • USB 2.0 • BT 4.0+HS • Beamformee • Linux, AndroidAC433MT7610U • USB 2.0 • BeamformeeN450RT3573N300RT5572 RT5372 • USB 2.0 • Calibration Free, SoftAP mode • QFN40-5x5 (Smallest) MT7670U • USB 2.0 • High Power MT7603U • USB 2.0 • Calibration Free • ULCN150MT7601U RT3070MPQ1’14Q2’14Q3’14Q4’14Q1’15Q2’15PCIe Roadmap>AC1300CPUMPConfidential BMT7615E • 4x4/4SS, 11ac stage2 • LDPC, Beamforming, MU-MIMOAC866MT7612E • LDPC, Beamforming • Calibration Free, iPAAC433MT7610E • BeamformeeN450RT3593 • Calibration Free • LDPC, Beamforming • 256QAM • Calibration Free • 802.11j, 802.11v • 64QAMN300RT5592/EP RT5392MT7602E • USB 2.0 • Calibration Free, SoftAP mode • QFN40-5x5 (Smallest)MT7603EN150MT7601U RT3070MPQ1’14Q2’14Q3’14Q4’14Q1’15Q2’15MT7621 VPN Performance (>400Mbps)Confidential BVPN TunnelLAN:10.10.10.254Encrypti on DES 3DES AES-128 AES-192 AES-256 3DES AES-128 AES-192 AES-256 Authentication SHA-1 MD5 SHA-1 MD5 SHA-1 MD5 SHA-1 MD5 SHA-1 MD5 SHA-1 MD5 SHA-1 MD5 SHA-1 MD5 SHA-1 MD5 DH Group DH2 DH2 DH2 DH2 DH2 DH2 DH2 DH2 DH2 DH2 DH5 DH5 DH5 DH5 DH5 DH5 DH5 DH5NetScreen第一次 第二次 第三次503.963 415.579 450.942 552.657 597.048 546.626 507.185 588.509 422.110 380.032 457.272 455.986 444.925 332.600 448.310 422.465 423.996 505.989 507.322 504.105 421.491 549.283 399.405 395.676 382.091 510.567 398.124 381.551 540.925 508.904 360.313 562.598 420.892 473.680 420.030 472.003 510.725 476.088 517.963 512.740 380.029 502.125 454.674 420.783 557.360 478.124 421.747 552.370TCPTCPTCP平均449.617 465.0827 459.4313 509.5883 509.7547 523.999 474.851 498.975 394.7433 464.2413 436.69 419.44 514.4033 439.876 410.1233 512.4777Copyright © MediaTek Inc. All rights reserved.2013/12/27- 13 -MediaTek Technology RoadmapConfidential B20152014 {BBP} 1. BW 5/10 2. Airtime Fairness {MAC} 1. MCC 2. WiFi Positioning {SoC} KGD2013 {RF} DPD, 11ac iPA {BBP} LDPC, TxBF {MAC} STA-Proxy {SoC} HNAT+HQoS, VPN, Storage AcceleratorCopyright © MediaTek Inc. All rights reserved.{RF} 1. DPA 2. 4x4/4ss, 3. 11ac stage2 {BBP} 1. Smart Antenna v3 2. MU-MIMO2013/12/27- 14 -Software RoadmapReadyOpenWRT trunkOpenWRT (MT7620, 3.x)Confidential B2013 Q1 Q2 Q3 Q4 Q12014 Q2 Q3 Q42015 Q1 Q2●● OpenWRT(MT7620, 2.6.36)(RT5350, 3.x)● OpenWRT● OpenWRT(MT7621, 3.x)Linux SDK● SDK 4.1(MT7620, 2.6.36)● SDK 4.2(MT7621, 2.6.36)● SDK 5.0(Kernel 3.x)eCos OpenBSD● MT7620N/ ● MT7620NMT5350 SDK 2.4.1.4 (2/8M)● AC750 SDK2.4.3.0 (2/16M)● AC750 SDK2.4.5.0 (2/8M)eCos –IPv6 FreeBSD● MT7620N ● AC750 SDK3.0.3.0 (2/8M) - 15 2013/12/27IPv6 SDK 3.0.1.0 (2/16M)IPv6 SDK 3.0.2.0 (2/8M)● AC1200 SDK3.0.4.0 (2/8M)Copyright © MediaTek Inc. All rights reserved.Confidential BSDK 4.2 vs. 4.1 ComparisonSDK 4.1Kernel Chip 2.6.21 2.6.36 (RT6856, MT7620) RT3050, RT3052 RT3883, RT3662 RT3352, RT5350 RT6856, MT7620 GCC 3.4.2SDK 4.22.6.21 2.6.36 (RT6856, MT7620, MT7621) RT3050, RT3052 RT3883, RT3662 RT3352, RT5350 RT6856, MT7620 MT7621 GCC 4.6.3 (MT7621 default) (MT7620 option) uClibc 0.9.33.2 (MT7621 default) (MT7620 option) Fast path (MT7620, MT7621) Fast path (MT7620, MT7621) lighthttpd web server (BSD license) Linux 2.6.36 support 2.6.38 MT7620+MT7530 RT3883+MT7530 WM8960 YES (MT7621) 400Mbps (MT7621) YES xHCI (MT7621) Win8- 16 -DescriptionGccUser LibraryuClibc 0.9.28PPTP L2TP HTTP Server Layer7 QoS Openswan Gigabit Switch Audio DAC HQoS VPN SPDIF USB Windows certificationn/a n/a Go-ahead Linux 2.6.21 only 2.6.22 RT3883+Vitesse WM8750 n/a 150Mbps (RT6856) n/a EHCI (RT6856/MT7620) Vista/Win7MT720 performance gain ~120% MT7620 performance gain ~100% /QDMACopyright © MediaTek Inc. All rights reserved.2013/12/27Value Added SoftwareDPI +iQoS DPI +iQoS (Broadweb) CAPWAP user kernel driverConfidential BSamba, Airplay, Airprint, DLNA DMSVPN NTFS (Paragon) (MediaTek)NTFS (Paragon)Remote USBUSB Printer Audio StorageIPv6 HNAT HQoS (MediaTek)Storage Accelerator (MediaTek)VoW (MediaTek)Mesh (TerraNet)IP cam H.264 (AIT/Sonix) Audio DAC (WM8960)Copyright © MediaTek Inc. All rights reserved.2013/12/27- 17 -Confidential BAgendaChip Roadmap ▪ MT7620 Highlights ▪ MT7620 11ac Solutions ▪ MT7621 11ac Solutions ▪ MT7612 11ac SolutionsCopyright © MediaTek Inc. All rights reserved.2013/12/27- 18 -Confidential BMT7620A Functional Block3.3V 20/40MHz Crystal PMU 2.5/1.0V Clock/Timer/Reset/PLL DRAM Controller NAND/SD-XC/eMMC SPI RF FEM RF FEM MAC BBP UART Full+ UART Lite USB 2.0 Host/Device CTRL/PHY I2C PPE w/ IPv6 I2S PCM 2 3 4 External Interface TransformerSDRAM(512Mbits) DDR1(1Gbits) DDR2(2Gbits) NAND Flash(8Gbits) SPI Flash/Codec UART Interface USB 2.0 Interface EEPROM/Control Audio Interface Codec GPIO/LEDMIPS 24KEc (580/600 MHz) 64K I-Cache 32K D-Cache5G WiFi 2x2 11n: RT5592 2x2 11n: RT5592EP (HP) 3x3 11n: RT3593 1x1 11ac: MT7610ERGMIIPCIe Storage Accelerator Ethernet SwitchRGMII01Copyright © MediaTek Inc. All rights reserved.2013/12/27- 19 -MT7620 Highlights• Best DBC TP w/ Intel 6300 • Best TP w/ mutiSTAs • No. 1 HNAT in smallnetbuilder • First IPv6 HNATConfidential BBest DBC Throughput w/ Intel63002Gbps IPv6 HNATMT7620Lowest Power Consumption• Lowest power consumption • Thermal PK w/ E900USB 2.0 Samba Performance• Perform same performance w/ EA3500 and E4200v2Copyright © MediaTek Inc. All rights reserved.2013/12/27- 20 -HNAT (Chariot) Benchmarkipv6 HNATConfidential B2Gbps HNATOutperform in iPv6 benchmarkCopyright © MediaTek Inc. All rights reserved.2013/12/27- 21 -Confidential BPower Consumption BenchmarkD-LINK DIR-605L RTL8196C+ RTL8192CE 2.31 2.64 1.42 1.38 1.37MT7620NSDRTenda W308R BCM5357TP-LINK TL-WR841N AR9341Uplink Downlink STA associated STA unassociated Radio off1.80 2.18 1.03 0.83 0.613.42 4.41 2.88 2.79 2.072.632 3.290 2.444 2.350 2.068Copyright © MediaTek Inc. All rights reserved.2013/12/27- 22 -Confidential BDBC TP Benchmark (vs. Intel6300)Copyright © MediaTek Inc. All rights reserved.2013/12/27- 23 -Peak Throughput Benchmark APto1STA or APto2STAsConfidential BCopyright © MediaTek Inc. All rights reserved.2013/12/27- 24 -N300/600, AC750/1200(GbE) Solution▪ MT7620A (580MHz)– – – – – 2x2 11n 2.4GHz GbE LAN(4)+WAN USB 2.0, SD-XC, I2S DDR2, SPI Flash PCIe: 802.11 a/n/acMT7620AConfidential B1x1/2x2 11ac▪ MT7530– 5p GbE SwitchMT7530▪ 4L PCB, double sides▪ OS– Linux SDKCopyright © MediaTek Inc. All rights reserved.2013/12/27- 25 -Outdoor AP Solution (Industry Spec.)▪ MT7620A (580MHz)– – – – – 2x2 11n 2.4GHz GbE(2) USB 2.0, PoE DDR1, NAND Flash PCIe• •Confidential BrGMII iNIC802.11 a/n/ac 802.11ac iNICMT7620A– rGMIIPCIe 1x1/2x2 11ac▪ HW Spec.– 4L PCB, double sides – -40~85 degrees (Industry Spec.) – Tx PowerMCS0: 26.8dbm per chain • Over temperature: +- 1dbm•PoE▪ OS– Linux SDKCopyright © MediaTek Inc. All rights reserved. 2013/12/27 - 26 -Confidential BAgendaChip Roadmap MT7620 Highlights ▪ MT7620 11ac Solutions ▪ MT7621 11ac Solutions ▪ MT7612 11ac SolutionsCopyright © MediaTek Inc. All rights reserved.2013/12/27- 27 -AC750 Products▪ Chip: MT7620A+7610EConfidential B▪ MT7620A HNAT, DPD, STA-Proxy, USB performance outperform among all 2x2 11n SoC ▪ eCos IPv6 turnkey for small memory footprint ▪ Shipping AC750 modelsD-Link (DIR-810)Copyright © MediaTek Inc. All rights reserved.IO-Data (WN-AC733GR)2013/12/27 - 28 -PCI (MZK-750DHP)AC750 Solution▪ MT7620A (580MHz)– – – – 2x2 11n 2.4GHz FE LAN(4)+WAN USB 2.0, SD-XC, I2S DDR2, SPI FlashMT7620AConfidential BMT7610E▪ MT7610E– 1x1 11ac (ePA)▪ 4L PCB, double sides▪ Power Consumption– 3.13w (power optimized) – 3.96w (rBOM optimized)▪ OS– Linux SDK – eCos turnkey (2/16)Copyright © MediaTek Inc. All rights reserved. 2013/12/27 - 29 -AC750 vs. HTC New One TP140 120 100 80 60 40 20 0 UplinkCopyright © MediaTek Inc. All rights reserved.Confidential BMbps119.288.890.311ac TPDnlink2013/12/27 - 30 -Bi-directionAC1200(FE) Solution▪ Chip: MT7620A+7612EConfidential B▪ HNAT, DPD, STA-Proxy, USB performance outperform among all 2x2 11n SoC ▪ enable 11ac iPA w/ industry lowest rBOM ▪ support ePA for better coverage ▪ eCos IPv6 turnkey for small memory footprintCopyright © MediaTek Inc. All rights reserved.2013/12/27- 31 -AC1200 Solution▪ MT7620A (580MHz)– – – – 2x2 11n 2.4GHz FE LAN(4)+WAN USB 2.0, SD-XC, I2S DDR2, SPI FlashConfidential BMT7612E▪ MT7612E– 2x2 11ac (iPA/ePA)MT7620A▪ 4L PCB, double sides ▪ Power Consumption– 3.13w (power optimized) – 3.96w (rBOM optimized)▪ OS– Linux SDKCopyright © MediaTek Inc. All rights reserved.2013/12/27- 32 -Confidential BAC1200 iPA Benchmark▪ Tx Power BenchmarkTX output (dBm) MT7612EBelkin AC1000 RTL8197D+ RTL8192ER+ RTL8812AR5GRF HW OFDM HT20 HT40 VHT20 VHT40 VHT80 6M 54M MCS0 MCS7 MCS0 MCS7 MCS0 MCS8 MCS0 MCS9 MCS0 MCS92x2 ac iPA 19 16.5 19 15.5 18.5 15.5 19 15 18.5 15 17.5 152x2 ac ePA 16 14DIR-860 AC1200 (BCM) 2x2 ac ePA 18 16 18 16 18 161218 14Copyright © MediaTek Inc. All rights reserved.2013/12/27- 33 -*TX Pout is single chain data at antenna port which includes 1.5dB loss (transmission line+diplexer+IPEX connector)Confidential BAgendaChip Roadmap MT7620 Highlights MT7620 11ac Solutions ▪ MT7621 11ac Solutions ▪ MT7612 11ac SolutionsCopyright © MediaTek Inc. All rights reserved.2013/12/27- 34 -Confidential BMT7621A Function Block20/25/40MHz Crystal DRAM Controller Clock/Timer/Reset/PLL NAND/SD-XC/eMMC SPI (2)DDR2(2Gbits, 1066) DDR3(4Gbits, 1200) NAND Flash(8Gbits) SPI Flash/Codec UART Interface USB 3.0 Interface USB 2.0 Interface SATA SATAIII (2) Audio Interface NFC MT6605 GPIO/LED11n WiFiPCIeMIPS 1004KEc (880 MHz) 32K I-Cache 32K D-Cache L2-Cache 256KB Storage AcceleratorMIPS 1004KEc (880 MHz) 32K I-Cache 32K D-Cache Cache Coherency Port HNAT+ BW CTRLUART Lite (3) USB 3.0 Host11ac WiFiPCIeUSB 2.0 Host PCIe I2S, PCM, S/PDIFCryptoGigabit SwitchRGMII01234I2C External InterfaceTransformerCopyright © MediaTek Inc. All rights reserved.2013/12/27- 35 -MT7621 ApplicationConfidential BEthernet USB dongle SPDIFeMMC SDXC USB/SATAUSBUSB (printer)Airplay WiFi MT7662 BT Sink play I2C MT6605 PCM (VoIP)I2S I2SSPITouch panelCopyright © MediaTek Inc. All rights reserved. 2013/12/27 - 36 -MT7621N/AMT7621A Package GbE Power Consumption PCB Heat Sink Application TFBGA 11.7x13.6 GbE(5)+rGMII 2.4W 2/4L Yes AC1200G-Router MT7621N TFBGA 11.7x13.6 rGMII 1.2W 2/4L NoConfidential BAC1200-Repeater NAS+GbE(1) AC1200-FE Internet RouterCopyright © MediaTek Inc. All rights reserved.2013/12/27- 37 -Confidential BMT7621 Introduction▪ Platform based network processor for 2x2/3x3 11ac, LTE cat4/5 with rich extensions– Rich I/O sets: 5p GbE switch, rGMII, PCIe(3), USB3, USB2, SD-XC, I2S, PCM, S/PDIF▪ HNAT+BW CTRL can work seamlessly– HNAT w/ 2Gbps wired speed IPv6 routing – HW bandwidth control to replace software scheduler▪ Upgradable L7 QoS database for “Auto QoS” ▪ Storage accelerator – GSO/GRO, fast DMA for write offload ▪ >400 Mbps VPN crypto engine ▪ NFC for WPS replacement ▪ Industry lowest power consumption ▪ World’s first 2x2 11ac iPA to save rBOM ▪ World’s first 2x2 11ac DBC 2L design to save rBOMCopyright © MediaTek Inc. All rights reserved. 2013/12/27 - 38 -AC1200AC1200 -GbE 4L RFB▪ 4L, double side ▪ DDR3 1200/NAND Flash ▪ On board dual band concurrent WIFI– 7612E: 2x2 11ac iPA/iLNA – 7602E: 2x2 11n iPA/iLNAGbE 5p GbEConfidential BU3U2 MT6605 (NFC)IC+ GbE PhyNAND Flash MT7621 A DDR3 (1200)▪ Co-crystal design ▪ External high power module– 7612E: 2x2 11ac – 7602E: 2x2 11n (256QAM) – 7603E: 2x2 11n (64QAM)SD-XCSATA3.0ASM1061 MT7602E (2.4GHz) MT7612E (11ac) S/PDIF▪ USB 3.0/2.0/SATA3.0Copyright © MediaTek Inc. All rights reserved. 2013/12/27 - 39 -*Note: PCB cost estimation by vendor “Newheart”AC1200AC1200 -GbE 2L RFB▪ PCB cost down 40%– Dimension: 168mm x 115mm x 1.6mm – Single side – FR4 PCB: 100pcs estimation – 4Layer:NTD 175 – 2Layer: NTD 105*U 2Confidential B5p GbESD-XC DDR2 (1066)▪ DDR2 800/1066, SPI flash ▪ Co-crystal design ▪ On board dual band concurrent WIFI– 7612E: 2x2 11ac iPA/iLNA – 7602E: 2x2 11ac iPA/iLNAMT7602E (2.4GHz)MT7621ASPI FlashMT7612E (11ac)▪ USB 2.0 HS host supportCopyright © MediaTek Inc. All rights reserved. 2013/12/27 - 40 -MT7621A HDK V31*Note: PCB cost estimation by vendor “Newheart”Benchmark with Dlink DIRDIR-860LBetter computing power Integrated RF front-endConfidential BBenchmark Chip Set AC1200-GbE MT7621A+ MT7612E+MT7602E iPA/iLNA Dual Core 880MHz TX:iPA performance better than competitor ePADlink DIR-860L BCM47081A0+ BCM4352+BCM43217 ePA/eLNA Single Core 800MHz Front-end module:RFMD RFFM4501CPU WIFI 5GMTK AC1200-GbERX:Low rate worst than competitor eLNA 0.5dB High rate better than competitorBetter RF performanceWIFI 2.4GTX:iPA performance better than competitor iPATX:iPARX: Dlink DIR-860L Excellent power consumption Lower thermal risk Cost advantage Power Consumption Thermal r-BOMiLNA better than competitor iLNARX: iLNAUplink: 7.21W Downlink: 7.45W Less heat sink, thermal pad and shielding case USD: 3.8638 Co-clock supportUplink: 9.03W Downlink: 10.98W More thermal strategy USD: 6.5361 w/ RF front-end USD: 5.3967 w/o RF front-endNote: rBOM cost is not including thermal strategy, and shielding case Copyright © MediaTek Inc. All rights reserved. 2013/12/27 - 41 -Benchmark with Netgear R6200v2Confidential BBenchmark Chip Set AC1200-GbE MT7621A+ MT7612E+MT7602E ePA/eLNA Dual Core 880MHz TX:ePA: SKYWORKS SKY85402-11Netgear R6200v2 BCM47081A0+ BCM4352+BCM43217 ePA/eLNA Single Core 800MHz Front-end module:RFMD RFFM4501Better computing power Better RF performance MTK AC1200-GbECPU WIFI 5GRX:eLNASKYWORKS SKY85601-11Better RF performanceWIFI 2.4GFront-end module:RFMD RFFM4203TX:ePA: SKYWORKS SE2528RX: Netgear R6200-V2 Power Consumption Lower thermal risk Cost advantage Thermal r-BOM Less heat sink, thermal pad and shielding case USD:3.8638* Co-clock support USD: 3.9684*eLNA: Richwave RTC6602Uplink: 9.55W Downlink: 12.48W*Note: rBOM cost is not including external RF front-end, thermal strategy, and shielding case Copyright © MediaTek Inc. All rights reserved. 2013/12/27 - 42 -Media Security Gateway (MT7621+STB+ZigBee)Confidential B11n WiFiDDR3 NAND11ac WiFiUSB 2.0 USB 3.0STB SoC (Slave )ASM 1060ZigBeeMT7621 (Host)PCIeHDDSLICUART rGMII Transformer (1000Mps)R J 1 1R J 1 1R J 4 5R J 4 5R J 4 5R J 4 5MocaCopyright © MediaTek Inc. All rights reserved.2013/12/27- 43 -MT762xA + 2.8”(240x320 Dots) TFT +Touch Panel (Resistive (Resistive) )Confidential BCopyright © MediaTek Inc. All rights reserved.2013/12/27- 44 -What’s QoS?▪ End to End ▪ Big Pipe to Small Pie ▪ QoS Components1 Classifier 2 Queue/BW Mgmt 3 Scheduler/ShaperConfidential BCopyright © MediaTek Inc. All rights reserved.2013/12/27- 45 -HWHW-BWBW-CTRL - UpstreamConfidential B1 2 3 4 3 2 1Copyright © MediaTek Inc. All rights reserved.2013/12/27- 46 -HWHW-BWBW-CTRL - DnstreamConfidential B1 2 3 4 3 2 1Copyright © MediaTek Inc. All rights reserved.2013/12/27- 47 -HWHW-BWBW-CTRL – Dnstream (2)1Confidential B2Copyright © MediaTek Inc. All rights reserved.2013/12/27- 48 -USB 3.0 Samba BenchmarkConfidential BAP Linksys EA6400 Buffalo AC1750 D-Link DIR-860L MT7621AFormatHDD Model NameRead (MByte/sec) 13.75Write (MByte/sec) 11.67 15.77test tool InterfaceFAT32Buffalo HD-LB131.45 37.93 72.30IOMETER USB3.0 16.55 29.50Copyright © MediaTek Inc. All rights reserved.2013/12/27- 49 -Confidential BAgendaChip Roadmap MT7620 Highlights MT7620 11ac Solutions MT7621 11ac Solutions ▪ MT7612 11ac SolutionsCopyright © MediaTek Inc. All rights reserved.2013/12/27- 50 -。

1608芯片
1608芯片是一种封装形式的电子元器件，其尺寸为16mm x 8mm。

该芯片具有多种功能，可以被广泛应用于不同的电子设备中。

首先，1608芯片具有很高的集成度，可以集成多个功能模块于一个芯片中。

这意味着在电路板上使用1608芯片时，可以减少元器件数量，从而降低系统成本并提高电路板的可靠性。

其次，1608芯片具有较高的性能。

它可以提供较高的计算速度和较大的存储容量，从而满足对高性能处理和大容量数据存储的需求。

此外，它还可以同时处理多个任务，提高系统的效率。

除此之外，1608芯片还具有较低的功耗。

它采用先进的制程工艺和功耗优化设计，可以在低功耗情况下实现高性能的运算和处理。

这使得1608芯片非常适合于便携式电子设备，如智能手机、平板电脑和可穿戴设备等。

1608芯片还具有较好的可靠性和稳定性。

它采用高质量的材料和生产工艺，经过严格的测试和筛选，以确保在各种条件下均能稳定运行。

因此，它可以满足各种严苛的工作环境和使用场景下的要求。

最后，1608芯片具有丰富的接口和通信功能。

它支持多种通信协议和接口标准，如UART、SPI、I2C、USB等，可以方便地接入其他设备和传输数据。

这进一步扩展了1608芯片的
应用范围，使其可以与其他设备进行联网和互联互通。

总之，1608芯片是一种功能强大、性能优良、功耗低、可靠稳定的电子元器件。

它在电子设备中有着广泛的应用，可以提供高性能的运算和处理能力，满足不同领域的需求。

随着科技的不断发展，相信1608芯片的性能将会不断提升，为各种电子设备带来更多的创新和进步。

F CI-6CON STA NTVOLUME The METALAIRE FCI series fan-powered terminal unit has been engineered to provide a balance between quiet operation, minimal footprint, and a broad flow range.The FCI is constructed from 20 gauge metal designed to mitigate vibration and increase rigidity. The unique 4-piece case allows for fewer seams to minimize leakage. Every FCI includes bottom motor/blower access panel: These simple-to-remove panels provide access to allow trouble-free maintenance of the fan motor and blower assembly. The control enclosure for the FCI allows critical component access. FCI units include 1" thick, matte-faced fiberglass insulation that complies with UL 181 horizontal burn test, NFPA 90A and UL 723/ASTM E 84 flame spread and smoke developed ratings of 25/50. Optional insulations include metal-foil-faced and fiber- and erosion-free ThermoPure (closed-cell foam), a polyolefin product with superior acoustical properties compared to solid metal duct liner.Optional electronically commutated motors (ECM) are available to minimize energy usage. Up to 75% energy savings is typical with the ECM option.STANDARD FEATURES■ Available in 6 casing sizes to handle 200–4400 CFM.■ 20 gauge galvanized steel casing.■ Low leakage construction.■ Low leakage inlet damper (< 1% at 3" static pressure).■ Optional factory calibrated controls per each job requirement.■ Metalaire inlet flow sensor provides +/- 5% accuracy even with 90 degree elbow at inlet. ■ Easy access, steel balancing taps.■ Energy efficient PSC motors with adjustable SCR solid state fan speed controller.■ External control cabinet with offset mounting plate.■ Single point electrical connections.■ Beaded primary inlet connection tube for added rigidity and secure flex duct connections.■ Round inlets available in sizes 6" through 16".■ 1" thick, dual density (1.5lb / ft 3 min.) fiberglass insulation with edges coated.■ Rectangular discharge with optional slip and drive cleat duct connection.■ Large removable bottom access panel provides access to fan motor / blower assembly.■ Independently tested and certified laboratory performance data.■ Full range of options and accessories available (heating coils, disconnects, attenuators, etc.).■ Full range of liners / insulation available.■ Auto and manual thermal resets on every electric heater.■ High efficiency six-pole, single speed permanent split capacitor (PSC) motors.■ Available fan motor voltages of 120, 277, and 208-240 (50 / 60 Hz).FCI-600 CONSTANT VOLUME FAN AIR TERMINAL UNITFCI-600CONSTANT VOLUME FAN FEATURES AND BENEFITS1 2 of casing.3 4 for added rigidity.5 6 7 8 9 10 thermoplastic bearing.View of FCI-600 with bottom access panels removed.F CI-6CON STA NTVOLUM E Top ViewInlet View Discharge ViewThe standard location for control enclosure is Left Hand on Model FCI.Looking in the direction of airflow, the control enclosure is on the left.Air Filter Sizes Are Equal To Induction Attenuator dimensions A & B Field Connected Induction Duct Dimensions Should Equal A - 2" & B - 2" with a 1" Flange Air Flow FCI-600 SERIES FAN POWERED AIR TERMINAL UNIT COOLING ONLY The standard location for control enclosure is Left Hand on Model FCI.Looking in the direction of airflow, the control enclosure is on the left.F CI-6CON STA NTVOLUM E FCI-600 SERIES FAN POWERED AIR TERMINAL UNIT WITH ELECTRIC HEAT Top ViewInlet View Discharge ViewThe standard location for control enclosure is Left Hand on Model FCI.Looking in the direction of airflow, the control enclosure is on the left.Air Filter Sizes Are Equal To Induction Attenuator dimensions A & B Field Connected Induction Duct Dimensions Should Equal A - 2" & B - 2" with a 1" Flange Air Flow The standard location for control enclosure is Left Hand on Model FCI.Looking in the direction of airflow, the control enclosure is on the left.The standard location for control enclosure is Left Hand on Model FCI.F CI-6CON STA NTVOLUM E FCI-600 ECM SERIES FAN POWERED AIR TERMINAL UNIT WITH HOT WATER COIL Top ViewInlet View Discharge ViewThe standard location for control enclosure is Left Hand on Model FCI.Looking in the direction of airflow, the control enclosure is on the left.Air Filter Sizes Are Equal To Induction Attenuator dimensions A & B Field Connected Induction Duct Dimensions Should Equal A - 2" & B - 2" with a 1" Flange Air Flow 3&4 Row The standard location for control enclosure is Left Hand on Model FCI.Looking in the direction of airflow, the control enclosure is on the left.The standard location for control enclosure is Left Hand on Model FCI.F C I -600 C O N S T A N T V O L U M E FCI-600 APPROXIMATE SHIPPING WEIGHTS FCI-600 FILTER SIZESPER CASE SIZEFilters are mounted on the fan induction and are available in 1" or 2" thickness.■ Units tested per ASHRAE Standard 130-2016.■ All model sizes certified in accordance with AHRI 880-2017 certification program.■ ETL listed to meet requirements of UL 1995 and CSA 236.■ Dual-density fiberglass insulation meets UL 181 and NFPA 90A/90B.■ Insulation meets ASHRAE 62.1 requirements for resistance to mold growth and erosion.■ Hot water coils are manufactured in accordance to AHRI Standard 410.CERTIFICATIONS AND STANDARDSF CI-6CON STA NTVOLUM E 1) AHRI certified data is highlighted while all other data are application ratings 2) Radiated sound is the noise transmitted through the unit casing 3) Sound power levels expressed in decibels, (dB) re 10-12 Watts 4) Min ΔPs is the minimum operating pressure requirement of the unit with the damper full open and is the static pressure drop from the unit inlet to the unit discharge 5) Performance data based on laboratory tests conducted in accordance with ASHRAE 130-2016 and AHRI 880-20176)NC values are calculated using attenuation credits outlined in AHRI 885-2008Appendix E 7) Blank spaces indicate Minimum Ps if unit exceeds the ΔPs across the unit8)Sound performance based on units lined with standard dual density fiberglass insulation9)Discharge (external) static pressure is 0.25” w.g. for all casesRADIATED SOUND MODEL FCI - PSC MOTORF CI-6CON STA NTVOLUM E FCI-600 PSC FAN MOTOR AMPERAGE RATINGSFCI-600 DAMPER LEAKAGE FCI-600 ECM FAN MOTOR AMPERAGE RATINGSPERFORMANCE NOTESF CI-6CON STA NTVOLUM E FCI-600 HOT WATER COILS When ordered with the air terminal, the hot water coil is shipped attached to the discharge of the terminal casing. The discharge end of the casing has slip and drive connections for easy connection to downstream ductwork. The hot water coil is constructed of aluminum fin and copper serpentine-type tubes with male sweat connections tested at 300 psig.Coil selection can be made using METALAIRE’s Air Terminal Unit Selection Software. Contact your representative for a copy. In the interest of energy conservation and due to the possibility of condensation, all hot water coils are marked “Coil must be externally insulated after installation in the field.” Hot water coils are tested in accordance with AHRI Standards 410. Hot water coils may be ordered with optional access doors for inspection and cleaning to meet requirements of ASHRAE Standard 62.1.HOT WATER COIL CONSTRUCTION DETAILS ■ Hot Water Coils are factory mounted to the discharge of the terminal and are available with an optional factory mounted discharge plenum section with access door. ■ Hot water coils are enclosed in a 20 gauge coated steel casing allowing for attachment to metal ductwork with a slip and drive connection.■ Fins are rippled and sine wave type constructed from heavy gauge aluminum and are mechanically bonded to the tubes.■ Tubes are copper with a minimum wall thickness of 0.016" with male sweat header connections.■ Coils are leak tested to 300 psi with minimum burst of 2000 psi at ambient temperature. Coil performance data is based on tests run in accordance withAHRI standard 410. Coils are AHRI certified and include an AHRI label.All accessories that can be attached to the Series Fan Boxes are not a part of the AHRI certification program but ratings can be affected by their use.FCI-600 COIL CONNECTION SIZEF CI-6CON STA NTVOLUM E1) All coil performance in accordance with AHRI Standard 410-20012) Heating capacities are in MBH 3) Performance data based on a temperature differential of 115°F (180°F entering water temperature and 65°F entering air temperature)4) For temperature differentials other than 115°F , multiply the MBH by the correction factors below 5) Head Loss is in feet of water6) Airside ΔPs is the air pressure drop of the hot water coil7) Aire temperature rise =927 x MBH/CFM8) Water temperature drop = 2.04 x MBH/GPM9) Values in tables are listed for 0 ft. of altitude and no glycol in the system MBH CORRECTION FACTORSELECTRIC HEATER ASSEMBLY CONSTRUCTION DETAILSElectric Reheat Coils are factory mounted on the discharge of the Air Terminal. The heaters are ETL® listed for zero clearance, are tested in accordance Standard 1995, CSA-C22.2 No. 236 and the National Electric Code (NEC). Heater casings are constructed of galvanized steel. Element wire is high grade nichrome alloy derated to 45 watts per square inch density. Element wire is supported by moisture-resistant steatite ceramics.F CI-6CON STA NTVOLUM E FCI-600 ELECTRIC HEATER CAPACITIES NOTES:1. Heaters less than 10 kW are specifiable to nearest 0.5 kW. Heaters greater than 10.0 kW are specifiable to nearest 1.0 kW.2. Minimum flow rate for electric heat is 70 CFM / kW. Lower CFM’s can cause nuisance tripping, excessive discharge temperatures, rapid cycling, and rapid element failure. Electric Heat units running below 70 CFM / kW will void all warranties.3. For optimum thermal comfort, the suggested discharge temperature should not exceed 20°F above room set point.4. We do not recommend discharge temperatures in excess of 115°F to protect heater coils.5. Maximum number of steps at “Min kW per Step” is one step.6. If more than 1 heater is wired into a building’s circuit breaker (multi-outlet branch circuit), each heater will require the additionof power side fusing.ELECTRIC HEAT SELECTION:A. Specify electric duct heaters using voltage, phase, kW, and number of steps.B. Use above chart to select voltage. Calculate required kW using following equations: kW = BTU / HR kW = CFM X Δ X 1.085 Δ = kW X 3413 3413 3413 CFM X 1.085 CFM = kW X 3413 CFM = kW X 3413Δ x 1.085 Δ x 1.085* air density at sea level — reduce by 0.036 for each 1000 feet of altitude above sea level Where: BTU / Hr = Required heating capacityCFM = volume of air during heating. Typically 100% of maximum cooling air volume Δ = desired air temperature rise across the electric heaterInlet air temperature = primary air temperature, usually 55°FF C I -600 C O N S T A N T V O L U M EFCI-600 FAN PERFORMANCE CURVES CASE SIZE 2FCI-600 FAN PERFORMANCE CURVES CASE SIZE 30 100 200300 400 500 600 700800 00.10.20.30.4 0.50.60.70.8A i r F l o w R a t e (C F M )Static Pressure (in.wg.)Standard HW Coil200300 400 500 600 700 800 900 1000 A i r F l o w R a t e (C F M )Standard HW CoilF C I -600 C O N S T A N T V O L U M EFCI-600 FAN PERFORMANCE CURVES CASE SIZE 6FCI-600 FAN PERFORMANCE CURVES CASE SIZE 7500100015002000250030000.10.20.30.4 0.50.60.70.8A i r F l o w R a t e (C F M )Static Pressure (in.wg.)Standard HW Coil6001100 1600 2100 2600 3100 3600 4100 4600 A i r F l o w R a t e (C F M )FCQ Case 7F C I -600 C O N S T A N T V O L U ME01000500150020000.20.3 0.4 0.50.70.10.6A i r F l o w R a t e (C F M )Standard HW CoilStatic Pressure (in.wg.)1600400FCI-600 ECM FAN PERFORMANCE CURVES CASE SIZE 4100050015002000A i r F l o w R a t e (C F M )Standard HW Coil25004002100FCI-600 ECM FAN PERFORMANCE CURVES CASE SIZE 5。

CMS80F251x数据手册ArrayCMS8S78xx数据手册增强型闪存8位1T 8051微控制器Rev. 1.01请注意以下有关CMS知识产权政策＊中微半导体（深圳）股份有限公司（以下简称本公司）已申请了专利，享有绝对的合法权益。

与本公司MCU或其他产品有关的专利权并未被同意授权使用，任何经由不当手段侵害本公司专利权的公司、组织或个人，本公司将采取一切可能的法律行动，遏止侵权者不当的侵权行为，并追讨本公司因侵权行为所受的损失、或侵权者所得的不法利益。

＊中微半导体（深圳）股份有限公司的名称和标识都是本公司的注册商标。

＊本公司保留对规格书中产品在可靠性、功能和设计方面的改进作进一步说明的权利。

然而本公司对于规格内容的使用不负责任。

文中提到的应用其目的仅仅是用来做说明，本公司不保证和不表示这些应用没有更深入的修改就能适用，也不推荐它的产品使用在会由于故障或其它原因可能会对人身造成危害的地方。

本公司的产品不授权适用于救生、维生器件或系统中作为关键器件。

本公司拥有不事先通知而修改产品的权利，对于最新的信息，请参考官方网站。

1. 产品特性1.1 功能特性◆兼容MCS-51的1T指令系统- 系统时钟频率最高支持48MHz- 机器周期最快支持1T SYS @ F SYS≤24MHz - 机器周期最快支持2T SYS @ F SYS＝48MHz ◆内存- 程序FLASH：16K×8Bit- Data FLASH：1K×8Bit- 通用RAM：256×8Bit- 通用XRAM：1K×8Bit- 支持BOOT功能区，1K/2K/4K可选- 程序FLASH支持分区保护◆4种振荡方式- HSI-内部高速振荡：48MHz- HSE-外部高速振荡：8MHz/16MHz- LSE-外部低速振荡：32.768KHz- LSI-内部低速振荡：125KHz◆GPIO- 最多可达26个GPIO- 均支持上/下拉电阻功能- 均支持边沿（上升沿/下降沿/双沿）中断- 均支持唤醒功能◆中断源- 支持所有的外部端口中断- 7个定时器中断- 其它外设中断◆定时器- WDT定时器（看门狗定时器）- Timer0/1，Timer2，Timer3/4- LSE_Timer（支持休眠唤醒功能）- WUT（唤醒定时器）- BRT（串口波特率时钟发生器）◆蜂鸣器驱动- 50%占空比，频率可自由设置◆增强型PWM- 4通道增强型PWM- 4个相互独立周期计数器- 支持独立/互补/同步/成组模式- 支持边沿对齐/中心对齐方式- 支持互补模式死区延时功能- 支持刹车功能以及刹车恢复功能◆通信模块- 1xSPI（通讯速率最高可达6Mb/s）- 1xI2C（通讯速率最高可达400Kb/s）- 1xUART（波特率最高可达1Mb/s）◆工作电压范围- 2.1V~5.5V◆工作温度范围- -40℃~105℃◆低压复位功能（LVR）- 1.8V/2.0V/2.5V/3.5V◆低压检测功能（LVD）- 2.0V~4.6V 16级可选◆内置温度传感器（TS）◆高精度12位ADC- 最多可达26个AD外部通道- 参考电压可选（1.2V/2.0V/2.4V/3.0V/VDD）- 可检测内部1.2V基准电压- 支持硬件触发启动转换功能- 支持一组结果数字比较功能◆支持软件LCD驱动- 软件驱动1/3偏置- 最多支持24COM或24SEG◆支持软件LED驱动- COM SEG驱动电流可选- 最多支持26COM或26SEG◆两路模拟比较器（ACMP0/1）- 正端最多可达4种选择，负端可选内部1.2V/VDD分压- 比较器支持单边/双边迟滞- 负端内部1.2V/VDD分压可接内部ADC通道◆低功耗模式- 空闲模式（IDLE）- 休眠模式（STOP）◆支持96位唯一ID号(UID)- 每颗芯片有独立的ID号◆支持两线串行编程与调试1.2 产品对比注：（1）通过系统配置寄存器设置APROM和BOOT空间大小，APROM与BOOT空间总共最大为16K。