变压器8D报告(骨架pin距尺寸偏小)实例
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XXX 精密机械有限公司America XXpin short XX由于产品不良给贵司带来的麻烦深表歉意,收到贵司的信息后,我们即将展开调查。
Very sorry for the defect makes you getting in trouble, while received your information, we investigated the matter immediately:Feedback date:ITEM NO:Resin blister排针骨架起泡Defect content: pin short defect500ppmDefect rate: 500ppm该产品骨架材料为尼龙PA46,具有易吸水的材料特性。
周转和存储条件对于排针骨架有很大的影响.当环境湿度较大时,产品吸水大,过炉后骨架中水分受高温,骨架起泡的不良率高。
目前我司在生产前,原材料都要求在温度100-105C烘箱中先干燥24hr,然后按照规定的成型条件注塑生产。
但对于配组品的排针配件,内部在周转时用布袋包装,没有特殊的防水措施,产品在出货时,有在箱子中放20包干燥剂防止产品吸水。
因此我们认为起泡不良产品周转中因包装不妥,储存时间长后在环境中吸水导致骨架过炉起泡的。
The resin material of the product is PA46, and it has the sop characteristic.The flow process and the storage conditions have great influence to the resin.The higher of humidity of environment, the more water the resin sop ,and after the resin through oven ,the higher blister defect rate it will get.Before production in my company, the raw material is need to be baked in the temperature of 1000~105 for 24 hrs. Then molding under the required mounding condition. In the flow process we use cloth bag to pack for we have consider special waterproof measures before shipment we put 20pcs of seals to preventThe suck of water. Therefore we think the reason of the blister is the bad packing. The resin will suck after long time storage.:1. 我司产品内部过炉时,因都没有装排针,因此检验时没有发现。
Vender(厂商)Failure Q'ty(不良数)P/N(料号)Failure rate(不良率)D/C(生产周期)How much(产生费用)Lot(生产批号)Who(客诉类型)D2紧急处理(Urgent Deal)Function(职务)Function(职务)Team Leader(主导者)主管工程师QA 经理主管生产部经理高管工艺部经理高管Owner(责任人)Due day(完成日期)Owner(责任人)Due day(完成日期)拿我司库存进行现在测量发现排距偏下限,(如图所示)2019.07.042019.07.04Due day(完成日期)2019.07.04排距偏下限1.因此产品本体总宽及内宽尺寸均做到下限值,最终导致产品排距尺寸出现偏小的不良现象2.插PIN调机员在调机时没把图纸带在身边误把0.1的公差当成0.2的,导致不良品流入下一工站3.巡检、FQC抽检是按送样确认OK后的标准检验的,未把排距列入重点检验对象,导致不良品外流1.现已安排将模具进行修正,将总宽及内宽尺寸做到中心值偏上,以确保产品排距尺寸在公差之内,杜绝排距不良现象再发生2.要求插PIN 调机员在调机时必须把图纸放在旁边,以便确定排距的尺寸,从而杜绝不良产生及流出3.巡检,FQC 抽检台面前必须贴张排距表,以便随时测量排距尺寸 ﹙如图所示﹚,从而杜绝不良品外流库存:1500 我司品检夹角,再测量每一个产品的排距尺寸,确保在管控范围内在制品: 无客户库存: 2000已交货产品烦请协助退回我司,我司再用良品进行补回。
D3现状分析(Problem Analysis)D4初步分析及暂时对策(PreliminaryAnalysis &Short term action)D5根本原因及长期对策(Root cause &long term action)D6效果确认 (Verification ofthe CA's effectiveness)Team numbers (分析成员)Problem Analysis(对不良品进行现状分析)Before(改善前) :After(改善后):Short term action(暂时对策)Root cause analysis(根本原因分析):Long term action(长期对策)Owner(责任人)//Preliminary Analysis and why why escaped (初步原因分析&不良品外流原因确认):从贵司反馈的不良信息在厂内对实物进行确认分析为:因此产品本体总宽及内宽尺寸均做到下限值,且本体总宽及内宽尺寸公差值均为L+/-0.2,排距尺寸公差值为+/-0.1,此相关连的尺寸在公差定义上有冲突,最终导致产品排距尺寸出现偏小的不良现象。
8D报告模板及实例公司D1.小组成员(部门/姓名)T eam Member(Dept/Name):D2.问题描述Problem Descrption:D3.确认并执行临时纠正措施Identify and Implement Containment Actions:(品质部负责)D4.根本原因分析Identify and Define Root Cause(s):(48小时内回覆)D5.确认永久纠正措施Identify Corrective Actions:(48小时内回覆)为什么会发生:针对发生原因:责任部门:生产部 X 车间签名/日期:XXX 日期为什么会未及时检出:针对流出原因:责任部门:品质部签名/日期:XXX 日期为什么会流出:针对未检出原因:责任部门:签名/日期:XXX 日期D7.预防再发生Actions to Prevent Recurrence:提交工程更改,验证更改工艺一个月周期,如无不良产生,修改CP ,PFMEA ,PPAP 文件。
D8.总结经验:□□□产品类别:XXX防错方式:预防再发生□□□□其他:缺陷图片:1)产品冲扁部位中段尺寸不合格,偏小,低于设计要求3.12mm 表单编号:XXX相关文件及标准更新:PFMEA 程序文件控制计划部门管理制度工艺文件/作业指导书PPAP文件2014-6-6进行中顾客现场0无需处理XXX已完成运输途中完成情况责任人公司英文名纠正预防措施8D报告D6.执行并验证永久纠正措施Implement and Verify Corrective Actions待验证工程部:品质部:生产部:业务部:生产部:采购部:物控部:生产线1生产线2管理层支持部门经理厂长总/副总经理说明首次发生重复发生三次以上发生---48小时无结果72小时无结果生产部:类别问题点描述:产品规格Φ5×113/Φ5×101数量区域24001955普通□较重□严重□发现人员客户IQC 发现地点客户进料区产品图号XXX顾客图号XXX发现时间XXX 成品库备注不良品/可疑品处置方式(24小时内反应)现场挑选不良品XXX 已完成调出库存,返工卡尺全检XXX 已完成XXX 通知各工序,已制品增加卡尺厚度测量,成品全数检验。
XXX精密机械有限公司To:Fax:ATTN: CC:Phone:Date:20XX-5-6RE:由于产品不良给贵司带来的麻烦深表歉意,收到贵司的信息后,我们立即展开调查。
Very sorry for the defect makes you getting in trouble, while received your information, we investigated the matter immediately反馈日:Feedback date:品名:ITEM NO:不良内容:插芯变形Defect content: pin bent不良率:7%·Defect rate: 7%発生原因(happen reason)根据客户寄送的不良样品,内部用PCB板进行了确认。
1. 标示平面度在0.6mm以下所有样品,插入PCB后均没有翘起,是OK品。
2. 标示平面度超过0.6mm的所有样品,框架面明显变形,插入PCB后均有明显翘起,而且不能插入插板。
3. 框架面变形推定发生原因之一可能为工序中拿取不注意导致。
工序F插座铆装或插板检验时拔取不规范可以再现类似的产品变形。
4. 另外还有可能为落下品混入。
The un-plat defect samples have been sent to my company, and confirm it with our PCBboard.Confirm result:1.If the un-flatness is below 0.6mm, it seems no obvious gap between the partsand PCB.It is OK parts.They can not be inserted into the PCB board and our jig. We can see that the parts bentobserved from the appearance. We think the bent maybe caused for the careless whenthe parts was take out from the jig in the caulking process. And also maybe it is thedefect parts mixed which had been dropped to the floor before. they can be reappeared forthe abnormal operation when drawing off the parts in the F connector caulking or jigcheck process .流出原因(outflow reason):1. 该产品的平面度没有在图纸上明确定义,因此内部并无列入管控。