MSLU402中文资料

TL400 – TL410KBL005–KBL104A Bridge Rectifier4A Bridge RectifierFeatures• Ideal for printed circuit boards •Low forward voltage drop•High current capability • High reliability• High surge current capability• High temperature soldering guaranteed: 260˚C/10 seconds /.375”(9.5mm) lead length at 5lbs., (2.3kg) tension• This series is UL recognized under component index, File number E194718 • RoHS CompliantMechanical DataCase: TL, molded plasticEpoxy: Plastic package has UL flammability 94V-0Terminals: Plated leads solderable per MIL-STD-202, Method 208 Polarity: As marked on body Weight:5.6 gramMaximum Ratings And Electrical Characteristics (T amb =25˚C)TL400 TL401 TL402 TL404 TL406 TL408 TL410 SymbolDescriptionKBL005 KBL01KBL02KBL04KBL06KBL08 KBL10 UnitConditionsMarking Code TL400 KBL005TL401 KBL01TL402 KBL02TL404 KBL04TL406 KBL06TL408 KBL08TL410 KBL10V RRM Max. Repetitive PeakReverse Voltage 50 100 200 400 600 800 1000 V V RMS Max. RMS Voltage 3570140280420560700VV DC Max. DC BlockingVoltage50 100 200 400 600 800 1000 VI F(AV) Max. Average Forward Current4.0 A T A =50°CI FSMPeak Forward Surge Current200 A 8.3ms single halfsine-wavesuperimposed onrated load (JEDEC Method)TLFig.2-Max. Non-repetitive Peak Forward SurgeCurrent per legNumber of Cycles at 60HzFig.1-Max. Forward Current Derating CurveAmbient Temperature (°C)TL400 TL401 TL402 TL404 TL406 TL408 TL410 Symbol Description KBL005KBL01KBL02KBL04KBL06KBL08KBL10Unit ConditionsV F Max. Instantaneous Forward Voltage drop per leg1.1 V I F =4.0A5.0 µA T A =25°C I R Maximum DC Reverse Current at Rated DC Blocking Voltage per leg1.0 mA T A =125°CI²t Rating for Fusing (t<8.3ms)166 A²sNote 1R thJA 19 Note 2R thJL Typical Thermal Resistance per leg 2.4 °C / WNote 3 T J,T STGOperating Junction and StorageTemperature Range-50 to +150°CNote: 1.Non-repetitive for t > 1ms and < 8.3ms.2. Thermal resistance from junction to ambient with units mounted on3.0 x 3.0 x 0.11” think(75 × 75 × 3.0mm) Al. plate.3. Thermal resistance from junction to lead with units mounted on P.C.B. at 0.375” (9.5mm)lead length with 0.5 x 0.5” (12 x 12mm) copper pads.Typical Characteristics CurvesP e a k F o r w a r d S u r g e C u r r e n t (A )A v e r a g e F o r w a r d C u r r e n t (A )Fig.4-Typical Reverse Characteristicsper legPercent of Rated Peak Reverse Voltage (%)I n s t a n t a n e o u s R e v e r s e C u rr e n t (µA )Fig.3-Typical Instantaneous Forward Characteristic per legInstantaneous Forward voltage (V)I n s t a n t a n e o u s F o r w a r d C u r r e nt (A )Fig.5- Typical Junction Capacitanceper legReverse Voltage (V)J u n c t i o n C a p a c i t a n c e (p F )Marking Information:Dimensions in mmTLHow to contact us。

yInternal SMD Constructiony UL 94V-0 Package Material y Temperature Performance -25] to +75]y Output 3.3, 5, 12, 15, {5, {12 and {15VDC y Input 5, 12 and 24VDCy Low Costy 3000VDC Isolation y Efficiency up to 79%Key Features1W, High Isolation SMD, Single & Dual Output DC/DC ConvertersMinmax's MSLU300 1W DC/DC's are in "gull-wing" SMT package. The series is designed to provide high levels of isolation 3000VDC. It consists of 21 models with input voltages of 5V,12V and 24VDC which offers standard output voltages of 3.3V, 5V, 12V, 15V, {5V, {12V and {15VDC for the choice.Their impressive guaranteed efficiencies enable all models to deliver their fully rated output power from -25] to +75] without heat sinking or forced-air cooling.The MSLU300 series is an excellent selection for a variety of applications including data communication equipments, distributed power systems, telecommunication equipments and industrial robot systems.The MSLU300 units are available in tape and reel package.Leadfree Reflow Solder Process as per IPC/JEDEC J-STD-020C peak temp. 245C/10 sec.Exceeding the absolute maximum ratings of the unit could cause damage.These are not continuous operating ratings.Free-Air ConvectionCoolingmW550---Internal Power Dissipation%95--Humidity ]300---Lead Temperature (1.5mm from case for 10 Sec.)]+125-25Storage Temperature VDC 30-0.724VDC Input Models]+90-25CaseOperating Temperature VDC 18-0.712VDC Input Models ]+75-25Ambient Operating Temperature VDC 9-0.75VDC Input Models Input Surge Voltage( 1000 mS )Unit Max.Min.Conditions ParameterUnit Max.Min.ParameterEnvironmental SpecificationsAbsolute Maximum RatingsREV:5 2009/01/20MINMAX179554{0.7{34{15MSLU32979553{0.8{42{12MSLU32873857{2{100{5MSLU326795531.56715MSLU3257955328412MSLU3247385742005MSLU322701085152603.324(21.6 ~ 26.4)MSLU321805106{0.7{34{15MSLU319805105{0.8{42{12MSLU318768110{2{100{5MSLU3168151031.56715MSLU31580510528412MSLU31476811042005MSLU3127310159852603.312(10.8 ~ 13.2)MSLU311807255{0.7{34{15MSLU309797255{0.8{42{12MSLU3087510267{2{100{5MSLU3068072511.56715MSLU30579725528412MSLU304751026742005MSLU30272103023852603.35(4.5 ~ 5.5)MSLU301% (Typ.)%(Max.)mA (Typ.)mA (Typ.)mA mA VDC VDC@Max. Load @No Load @Max. Load Min.Max.EfficiencyLoad RegulationInput CurrentOutput CurrentOutput VoltageInput VoltageModel NumberModel Selection Guide# For each outputuF2.22.2104.74.73333Maximum Capacitive Load Unit {15V #{12V #{5V #15V 12V 5V 3.3V Models by VoutCapacitive Load100mA Slow - Blow Type200mA Slow - Blow Type500mA Slow - Blow Type24V Input Models 12V Input Models 5V Input Models Input Fuse Selection GuideInput SpecificationsInternal CapacitorInput FilterA 0.3------All ModelsReverse Polarity Input Current 26.42421.624V Input Models13.21210.812V Input Models VDC 5.554.55V Input Models Input Voltage RangeUnitMax.Typ.Min.Model Parameter2MINMAX REV:5 2009/01/20M Hours------2MIL-HDBK-217F @ 25], Ground BenignMTBFKHz 15010050Switching Frequency pF 10060---100KHz,1VIsolation Capacitance G[------10500VDC Isolation Resistance VDC ------3300Flash Tested for 1 SecondIsolation Voltage Test VDC ------300060 SecondsIsolation Voltage Rated Unit Max.Typ.Min.Conditions ParameterGeneral Specifications0.5 Second Max.Output Short Circuit%/]{0.02{0.01---Temperature Coefficient mV rms 15------Ripple & Noise (20MHz)mV P-P 150------Over Line, Load & Temp.Ripple & Noise (20MHz)mV P-P 10075---Ripple & Noise (20MHz)%See Model Selection GuideIo=20% to 100%Load Regulation %{1.5{1.2---For Vin Change of 1%Line Regulation %{1.0{0.1---Dual Output, Balanced LoadsOutput Voltage Balance Unit Max.Typ.Min.ConditionsParameterOutput SpecificationsNotes :1. Specifications typical at Ta=+25], resistive load, nominal input voltage, rated output current unless otherwise noted.2. Ripple & Noise measurement bandwidth is 0-20 MHz.3. These power converters require a minimum output loading to maintain specified regulation.4. Operation under no-load conditions will not damage these modules; however, they may not meet all specifications listed.5. All DC/DC converters should be externally fused on the front end for protection.6. Other input and output voltage may be available, please contact factory.7. Specifications subject to change without notice.8. It is not recommended to use water-washing process on SMT units.Block DiagramDual OutputSingle OutputREV:5 2009/01/20MINMAX3Tolerance Envelopes Graph (All other Output)Tolerance Envelopes Graph (3.3V & 5V Output)4MINMAX REV:5 2009/01/20Test ConfigurationsPeak-to-Peak Output Noise Measurement TestUse a Cout 0.33uF ceramic capacitor.Scope measurement should be made by using a BNC socket, measurement bandwidth is 0-20 MHz. Position the load between 50 mm and 75 mm from the DC/DC Converter.Maximum Capacitive LoadThe MSLU300 series has limitation of maximum connected capacitance at the output.The power module may be operated in current limiting mode during start-up, affecting the ramp-up and the startup time.The maximum capacitance can be found in the data sheet.Input Source ImpedanceThe power module should be connected to a low ac-impedance input source. Highly inductive source impedances can affect the stability of the power module.In applications where power is supplied over long lines and output loading is high, it may be necessary to use a capacitor at the input to ensure startup.Capacitor mounted close to the power module helps ensure stability of the unit, it is recommended to use a good quality low Equivalent Series Resistance (ESR < 1.0[ at 100KHz) capacitor of a 2.2uF for the 5V input devices, a 1.0uF for the 12V input devices and a 0.47uF for the 24V devices.Output Ripple ReductionA good quality low ESR capacitor placed as close as practicable across the load will give the best ripple and noise performance.To reduce output ripple, it is recommended to use 1.0uF capacitors at the output.Thermal ConsiderationsMany conditions affect the thermal performance of the power module, such as orientation, airflow over the module and board spacing. To avoid exceeding the maximum temperature rating of the components inside the power module, the case temperature must be kept below 90°C.The derating curves are determined from measurements obtained in an experimental apparatus.REV:5 2009/01/20MINMAX5Top View ( 2.54 mm / 0.1 inch grids )Connecting Pin PatternsMechanical Dimensions{0.002{0.05Pin X.XXX{0.005X.XX{0.13X.XX{0.01X.X{0.25Inches Millimeters Tolerance NA : Not Available for Electrical ConnectionNANA12NA NA 11NA NA 10UL94V-0:Flammability+Vout +Vout 8NA NA 7 2g :Weight -Vout NA 6Common -Vout 5Non-Conductive Black Plastic :Case Material NA NA 3+Vin +Vin 20.64*0.31*0.30 inches -Vin -Vin 116.3*8.0*7.67 mm :Case SizeDual OutputSingle OutputPin Physical CharacteristicsPin Connections6MINMAX REV:5 2009/01/20。

LM4040Precision Micropower Shunt Voltage ReferenceGeneral DescriptionIdeal for space critical applications,the LM4040precision voltage reference is available in the sub-miniature SC70and SOT-23surface-mount package.The LM4040’s advanced design eliminates the need for an external stabilizing capaci-tor while ensuring stability with any capacitive load,thus making the LM4040easy to use.Further reducing design effort is the availability of several fixed reverse breakdown voltages:2.048V,2.500V,3.000V,4.096V,5.000V,8.192V,and 10.000V.The minimum operating current increases from 60µA for the LM4040-2.5to 100µA for the LM4040-10.0.All versions have a maximum operating current of 15mA.The LM4040utilizes fuse and zener-zap reverse breakdown voltage trim during wafer sort to ensure that the prime parts have an accuracy of better than ±0.1%(A grade)at 25˚C.Bandgap reference temperature drift curvature correction and low dynamic impedance ensure stable reverse break-down voltage accuracy over a wide range of operating tem-peratures and currents.Also available is the LM4041with two reverse breakdown voltage versions:adjustable and 1.2V.Please see the LM4041data sheet.Featuresn Small packages:SOT-23,TO-92and SC70n No output capacitor requiredn Tolerates capacitive loadsn Fixed reverse breakdown voltages of 2.048V,2.500V,3.000V,4.096V,5.000V,8.192V,and 10.000VKey Specifications (LM4040-2.5)j Output voltage tolerance(A grade,25˚C)±0.1%(max)j Low output noise(10Hz to 10kHz)35µV rms (typ)j Wide operating current range 60µA to 15mA j Industrial temperature range −40˚C to +85˚C j Extended temperature range −40˚C to +125˚C j Low temperature coefficient100ppm/˚C (max)Applicationsn Portable,Battery-Powered Equipment n Data Acquisition Systems n Instrumentation n Process Controln Energy Management n Product Testing n AutomotivenPrecision Audio ComponentsConnection DiagramsSOT-23TO-92SC7001132301*This pin must be left floating or connected to pin 2.Top ViewSee NS Package Number MF03A (JEDEC Registration TO-236AB)01132303Bottom ViewSee NS Package Number Z03A01132330*This pin must be left floating or connected to pin1.Top ViewSee NS Package Number MAA05AApril 2005LM4040Precision Micropower Shunt Voltage Reference©2005National Semiconductor Corporation Ordering InformationIndustrial Temperature Range (−40˚C to +85˚C)Reverse Breakdown Voltage Tolerance at 25˚C and Average Reverse Breakdown Voltage Temperature CoefficientPackageNS Package NumberM3(SOT-23)M7(SC70)Z (TO-92)Supplied as 1000Units Tape andReelSupplied as 3000Units tape andReelSupplied as 1000Units Tape andReelSupplied as 3000Units Tape andReel±0.1%,100ppm/˚C max (A grade)LM4040AIM3-2.0LM4040AIM3-2.5LM4040AIM3-3.0LM4040AIM3-4.1LM4040AIM3-5.0LM4040AIM3-8.2LM4040AIM3-10.0LM4040AIM3X-2.0LM4040AIM3X-2.5LM4040AIM3X-3.0LM4040AIM3X-4.1LM4040AIM3X-5.0LM4040AIM3X-8.2LM4040AIM3X-10.0LM4040AIZ-2.0LM4040AIZ-2.5LM4040AIZ-3.0LM4040AIZ-4.1LM4040AIZ-5.0LM4040AIZ-8.2LM4040AIZ-10.0MF03A,Z03A±0.2%,100ppm/˚C max (B grade)LM4040BIM3-2.0LM4040BIM3-2.5LM4040BIM3-3.0LM4040BIM3-4.1LM4040BIM3-5.0LM4040BIM3-8.2LM4040BIM3-10.0LM4040BIM3X-2.0LM4040BIM3X-2.5LM4040BIM3X-3.0LM4040BIM3X-4.1LM4040BIM3X-5.0LM4040BIM3X-8.2LM4040BIM3X-10.0LM4040BIM7-2.0LM4040BIM7-2.5LM4040BIM7-3.0LM4040BIM7-4.1LM4040BIM7-5.0LM4040BIM7X-2.0LM4040BIM7X-2.5LM4040BIM7X-3.0LM4040BIM7X-4.1LM4040BIM7X-5.0LM4040BIZ-2.0LM4040BIZ-2.5LM4040BIZ-3.0LM4040BIZ-4.1LM4040BIZ-5.0LM4040BIZ-8.2LM4040BIZ-10.0MF03A,Z03A,MAA05A ±0.5%,100ppm/˚C max (C grade)LM4040CIM3-2.0LM4040CIM3-2.5LM4040CIM3-3.0LM4040CIM3-4.1LM4040CIM3-5.0LM4040CIM3-8.2LM4040CIM3-10.0LM4040CIM3X-2.0LM4040CIM3X-2.5LM4040CIM3X-3.0LM4040CIM3X-4.1LM4040CIM3X-5.0LM4040CIM3X-8.2LM4040CIM3X-10.0LM4040CIM7-2.0LM4040CIM7-2.5LM4040CIM7-3.0LM4040CIM7-4.1LM4040CIM7-5.0LM4040CIM7X-2.0LM4040CIM7X-2.5LM4040CIM7X-3.0LM4040CIM7X-4.1LM4040CIM7X-5.0LM4040CIZ-2.0LM4040CIZ-2.5LM4040CIZ-3.0LM4040CIZ-4.1LM4040CIZ-5.0LM4040CIZ-8.2LM4040CIZ-10.0MF03A,Z03A,MAA05A ±1.0%,150ppm/˚C max (D grade)LM4040DIM3-2.0LM4040DIM3-2.5LM4040DIM3-3.0LM4040DIM3-4.1LM4040DIM3-5.0LM4040DIM3-8.2LM4040DIM3-10.0LM4040DIM3X-2.0LM4040DIM3X-2.5LM4040DIM3X-3.0LM4040DIM3X-4.1LM4040DIM3X-5.0LM4040DIM3X-8.2LM4040DIM3X-10.0LM4040DIM7-2.0LM4040DIM7-2.5LM4040DIM7-3.0LM4040DIM7-4.1LM4040DIM7-5.0LM4040DIM7X-2.0LM4040DIM7X-2.5LM4040DIM7X-3.0LM4040DIM7X-4.1LM4040DIM7X-5.0LM4040DIZ-2.0LM4040DIZ-2.5LM4040DIZ-3.0LM4040DIZ-4.1LM4040DIZ-5.0LM4040DIZ-8.2LM4040DIZ-10.0MF03A,Z03A,MAA05A ±2.0%,150ppm/˚C max (E grade)LM4040EIM3-2.0LM4040EIM3-2.5LM4040EIM3-3.0LM4040EIM3X-2.0LM4040EIM3X-2.5LM4040EIM3X-3.0LM4040EIM7-2.0LM4040EIM7-2.5LM4040EIM7-3.0LM4040EIM7X-2.0LM4040EIM7X-2.5LM4040EIM7X-3.0LM4040EIZ-2.0LM4040EIZ-2.5LM4040EIZ-3.0MF03A,Z03A,MAA05AL M 4040 2Extended Temperature Range(−40˚C to+125˚C)Reverse BreakdownVoltage Tolerance at25˚C and Average Reverse Breakdown Voltage Temperature CoefficientPackageM3(SOT-23) See NS Package Number MF03A±0.5%,100ppm/˚C max(C grade)LM4040CEM3-2.0,LM4040CEM3-2.5,LM4040CEM3-3.0,LM4040CEM3-5.0±1.0%,150ppm/˚C max(D grade)LM4040DEM3-2.0,LM4040DEM3-2.5,LM4040DEM3-3.0,LM4040DEM3-5.0±2.0%,150ppm/˚C max(E grade)LM4040EEM3-2.0,LM4040EEM3-2.5,LM4040EEM3-3.0LM40403SOT-23AND SC70Package Marking InformationOnly three fields of marking are possible on the SOT-23’s and SC70’s small surface.This table gives the meaning of the three fields.Part Marking Field DefinitionRJA SOT-23only First Field:R2A SOT-23only RKA SOT-23only R4A SOT-23only R =Reference R5A SOT-23onlySecond Field:J =2.048V Voltage Option 2=2.500V Voltage OptionR8A SOT-23only K =3.000V Voltage Option R0A SOT-23only4=4.096V Voltage Option RJB R2B 5=5.000V Voltage Option RKB R4B 8=8.192V Voltage Option R5B 0=10.000V Voltage Option R8B SOT-23only R0B SOT-23onlyThird Field:RJC R2C A–E =Initial Reverse Breakdown Voltage or Reference Voltage Tolerance RKC R4C A =±0.1%,B =±0.2%,C =+0.5%,D =±1.0%,E =±2.0%R5C R8C SOT-23only R0C SOT-23onlyRJD R2D RKD R4D R5D R8D SOT-23only R0D SOT-23onlyRJE R2E RKEL M 4040 4Absolute Maximum Ratings(Note1)If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Reverse Current20mA Forward Current10mA Power Dissipation(T A=25˚C)(Note2)M3Package306mW Z Package550mW M7Package241mW Storage Temperature−65˚C to+150˚C Lead TemperatureM3PackageVapor phase(60seconds)+215˚C Infrared(15seconds)+220˚C Z PackageSoldering(10seconds)+260˚C ESD SusceptibilityHuman Body Model(Note3)2kVMachine Model(Note3)200V See AN-450“Surface Mounting Methods and Their Effect on Product Reliability”for other methods of soldering surface mount devices.Operating Ratings(Notes1,2) Temperature Range(T min≤T A≤T max) Industrial Temperature Range−40˚C≤T A≤+85˚C Extended Temperature Range−40˚C≤T A≤+125˚C Reverse CurrentLM4040-2.060µA to15mA LM4040-2.560µA to15mA LM4040-3.062µA to15mA LM4040-4.168µA to15mA LM4040-5.074µA to15mA LM4040-8.291µA to15mA LM4040-10.0100µA to15mALM4040-2.0Electrical Characteristics(Industrial Temperature Range)Boldface limits apply for T A=T J=T MIN to T MAX;all other limits T A=T J=25˚C.The grades A and B designate initial Re-verse Breakdown Voltage tolerances of±0.1%and±0.2%,respectively.Symbol Parameter Conditions Typical(Note4)LM4040AIM3LM4040AIZ(Limit)(Note5)LM4040BIM3LM4040BIZLM4040BIM7(Limit)(Note5)Units(Limit)V R Reverse Breakdown Voltage I R=100µA 2.048VReverse Breakdown Voltage Tolerance(Note6)I R=100µA±2.0±4.1mV(max)±15±17mV(max)I RMIN Minimum Operating Current45µA6060µA(max)6565µA(max)∆V R/∆T Average Reverse BreakdownVoltage TemperatureCoefficient(Note6)I R=10mA±20ppm/˚CI R=1mA±15±100±100ppm/˚C(max) I R=100µA±15ppm/˚C∆V R/∆I R Reverse Breakdown VoltageChange with OperatingCurrent Change(Note*NOTARGET FOR*)I RMIN≤I R≤1mA0.3mV0.80.8mV(max)1.0 1.0mV(max) 1mA≤I R≤15mA2.5mV6.0 6.0mV(max)8.08.0mV(max)Z R Reverse DynamicImpedance I R=1mA,f=120Hz,I AC=0.1I R0.3Ω0.80.8Ω(max)e N Wideband Noise I R=100µA35µV rms10Hz≤f≤10kHzLM40405LM4040-2.0Electrical Characteristics (Industrial Temperature Range)(Continued)Boldface limits apply for T A =T J =T MIN to T MAX ;all other limits T A =T J =25˚C.The grades A and B designate initial Re-verse Breakdown Voltage tolerances of ±0.1%and ±0.2%,respectively.Symbol Parameter ConditionsTypical (Note 4)LM4040AIM3LM4040AIZ (Limit)(Note 5)LM4040BIM3LM4040BIZ LM4040BIM7(Limit)(Note 5)Units (Limit)∆V RReverse Breakdown Voltage Long Term Stability t =1000hrs T =25˚C ±0.1˚CI R =100µA 120ppmV HYSTThermal Hysteresis (Note 8)∆T =−40˚C to +125˚C0.08%LM4040-2.0Electrical Characteristics (Industrial Temperature Range)Boldface limits apply for T A =T J =T MIN to T MAX ;all other limits T A =T J =25˚C.The grades C,D and E designate initial Reverse Breakdown Voltage tolerances of ±0.5%,±1.0%and ±2.0%,respectively.SymbolParameterConditionsTypical (Note 4)LM4040CIM3LM4040CIZ LM4040CIM7(Limit)(Note 5)LM4040DIM3LM4040DIZ LM4040DIM7(Limit)(Note 5)LM4040EIM7LM4040EIZ (Limit)(Note 5)Units(Limit)V RReverse Breakdown VoltageI R =100µA 2.048VReverse Breakdown Voltage Tolerance (Note 6)I R =100µA ±10±20±41mV (max)±23±40±60mV (max)I RMINMinimum Operating Current45µA 606565µA (max)657070µA (max)∆V R /∆TAverage Reverse Breakdown Voltage Temperature Coefficient (Note 6)I R =10mA ±20ppm/˚CI R =1mA ±15±100±150±150ppm/˚C (max)I R =100µA±15ppm/˚C ∆V R /∆I RReverse Breakdown Voltage Change with Operating Current Change (Note *NO TARGET FOR *)I RMIN ≤I R ≤1mA 0.3mV 0.8 1.0 1.0mV (max)1.01.21.2mV (max)1mA ≤I R ≤15mA 2.5mV 6.08.08.0mV (max)8.010.010.0mV (max)Z R Reverse Dynamic Impedance I R =1mA,f =120Hz 0.3ΩI AC =0.1I R 0.91.11.1Ω(max)e N Wideband NoiseI R =100µA 35µV rms10Hz ≤f ≤10kHz∆V RReverse Breakdown Voltage Long Term Stability t =1000hrsT =25˚C ±0.1˚C 120ppmI R =100µA V HYSTThermal Hysteresis (Note 8)∆T =−40˚C to +125˚C0.08%L M 4040 6LM4040-2.0Electrical Characteristics(Extended Temperature Range)Boldface limits apply for T A=T J=T MIN to T MAX;all other limits T A=T J=25˚C.The grades C,D and E designate initial Reverse Breakdown Voltage tolerances of±0.5%,±1.0%and±2.0%,respectively.Symbol Parameter Conditions Typical(Note4)LM4040CEM3(Limit)(Note5)LM4040DEM3(Limit)(Note5)LM4040EEM3(Limit)(Note5)Units(Limit)V R Reverse BreakdownVoltageI R=100µA 2.048VReverse Breakdown Voltage Tolerance (Note6)I R=100µA±10±20±41mV(max)±30±50±70mV(max)I RMIN Minimum OperatingCurrent 45µA606565µA(max)687373µA(max)∆V R/∆T Average ReverseBreakdown VoltageTemperatureCoefficient(Note6)I R=10mA±20ppm/˚CI R=1mA±15±100±150±150ppm/˚C(max) I R=100µA±15ppm/˚C∆V R/∆I R Reverse BreakdownVoltage Change withOperating CurrentChange(Note7)I RMIN≤I R≤1mA0.3mV0.8 1.0 1.0mV(max)1.0 1.2 1.2mV(max) 1mA≤I R≤15mA2.5mV6.08.08.0mV(max)8.010.010.0mV(max)Z R Reverse DynamicImpedance I R=1mA,f=120Hz,I AC=0.1I R0.3Ω0.9 1.1 1.1Ω(max)e N Wideband Noise I R=100µA35µV rms10Hz≤f≤10kHz∆V R Reverse BreakdownVoltage Long TermStability t=1000hrsT=25˚C±0.1˚CI R=100µA120ppmV HYST Thermal Hysteresis(Note8)∆T=−40˚C to+125˚C0.08%LM4040-2.5Electrical Characteristics(Industrial Temperature Range)Boldface limits apply for T A=T J=T MIN to T MAX;all other limits T A=T J=25˚C.The grades A and B designate initial Re-verse Breakdown Voltage tolerances of±0.1%and±0.2%,respectively.Symbol Parameter Conditions Typical(Note4)LM4040AIM3LM4040AIZ(Limit)(Note5)LM4040BIM3LM4040BIZLM4040BIM7Limits(Note5)Units(Limit)V R Reverse Breakdown Voltage I R=100µA 2.500VReverse Breakdown Voltage Tolerance(Note6)I R=100µA±2.5±5.0mV(max)±19±21mV(max)I RMIN Minimum Operating Current45µA6060µA(max)6565µA(max)LM40407LM4040-2.5Electrical Characteristics (Industrial Temperature Range)(Continued)Boldface limits apply for T A =T J =T MIN to T MAX ;all other limits T A =T J =25˚C.The grades A and B designate initial Re-verse Breakdown Voltage tolerances of ±0.1%and ±0.2%,respectively.Symbol Parameter ConditionsTypical (Note 4)LM4040AIM3LM4040AIZ (Limit)(Note 5)LM4040BIM3LM4040BIZ LM4040BIM7Limits (Note 5)Units (Limit)∆V R /∆TAverage Reverse Breakdown Voltage Temperature Coefficient (Note 6)I R =10mA ±20ppm/˚CI R =1mA ±15±100±100ppm/˚C (max)I R =100µA±15ppm/˚C ∆V R /∆I R Reverse Breakdown Voltage Change with Operating Current Change (Note 7)I RMIN ≤I R ≤1mA0.3mV0.80.8mV (max)1.01.0mV (max)1mA ≤I R ≤15mA2.5mV 6.0 6.0mV (max)8.08.0mV (max)Z R Reverse Dynamic Impedance I R =1mA,f =120Hz,I AC =0.1I R 0.3Ω0.80.8Ω(max)e N Wideband NoiseI R =100µA 35µV rms10Hz ≤f ≤10kHz∆V RReverse Breakdown Voltage Long Term Stability t =1000hrs T =25˚C ±0.1˚CI R =100µA 120ppmV HYSTThermal Hysteresis (Note 8)∆T =−40˚C to +125˚C0.08%LM4040-2.5Electrical Characteristics (Industrial Temperature Range)Boldface limits apply for T A =T J =T MIN to T MAX ;all other limits T A =T J =25˚C.The grades C,D and E designate initial Reverse Breakdown Voltage tolerances of ±0.5%,±1.0%and ±2.0%,respectively.SymbolParameterConditionsTypical (Note 4)LM4040CIM3LM4040DIZ LM4040CIM7Limits (Note 5)LM4040DIM3LM4040DIZ LM4040DIM7Limits (Note 5)LM4040EIM7LM4040EIZ Limits(Note 5)Units(Limit)V RReverse Breakdown VoltageI R =100µA 2.500VReverse Breakdown Voltage Tolerance (Note 6)I R =100µA ±12±25±50mV (max)±29±49±74mV (max)I RMINMinimum Operating Current45µA 606565µA (max)657070µA (max)∆V R /∆TAverage Reverse Breakdown Voltage TemperatureCoefficient(Note 6)I R =10mA ±20ppm/˚C I R =1mA ±15±100±150±150ppm/˚C (max)I R =100µA±15ppm/˚CL M 4040 8LM4040-2.5Electrical Characteristics(Industrial Temperature Range)(Continued)Boldface limits apply for T A=T J=T MIN to T MAX;all other limits T A=T J=25˚C.The grades C,D and E designate initial Reverse Breakdown Voltage tolerances of±0.5%,±1.0%and±2.0%,respectively.Symbol Parameter Conditions Typical(Note4)LM4040CIM3LM4040DIZLM4040CIM7Limits(Note5)LM4040DIM3LM4040DIZLM4040DIM7Limits(Note5)LM4040EIM7LM4040EIZLimits(Note5)Units(Limit)∆V R/∆I R Reverse BreakdownVoltage Change withOperating CurrentChange(Note7)I RMIN≤I R≤1mA0.3mV0.8 1.0 1.0mV(max)1.0 1.2 1.2mV(max) 1mA≤I R≤15mA2.5mV6.08.08.0mV(max)8.010.010.0mV(max)Z R Reverse DynamicImpedance I R=1mA,f=120Hz0.3ΩI AC=0.1I R0.9 1.1 1.1Ω(max)e N Wideband Noise I R=100µA35µV rms10Hz≤f≤10kHz∆V R Reverse BreakdownVoltage Long TermStability t=1000hrsT=25˚C±0.1˚C120ppm I R=100µAV HYST Thermal Hysteresis(Note8)∆T=−40˚C to+125˚C0.08%LM4040-2.5Electrical Characteristics(Extended Temperature Range)Boldface limits apply for T A=T J=T MIN to T MAX;all other limits T A=T J=25˚C.The grades C,D and E designate initial Reverse Breakdown Voltage tolerances of±0.5%,±1.0%and±2.0%,respectively.Symbol Parameter Conditions Typical(Note4)LM4040CEM3Limits(Note5)LM4040DEM3Limits(Note5)LM4040EEM3Limits(Note5)Units(Limit)V R Reverse BreakdownVoltageI R=100µA 2.500VReverse Breakdown VoltageTolerance(Note6)I R=100µA±12±25±50mV(max)±38±63±88mV(max)I RMIN Minimum OperatingCurrent 45µA606565µA(max)687373µA(max)∆V R/∆T Average ReverseBreakdown VoltageTemperatureCoefficient(Note6)I R=10mA±20ppm/˚CI R=1mA±15±100±150±150ppm/˚C(max) I R=100µA±15ppm/˚C∆V R/∆I R Reverse BreakdownVoltage Change withOperating CurrentChange(Note7)I RMIN≤I R≤1mA0.3mV0.8 1.0 1.0mV(max)1.0 1.2 1.2mV(max)1mA≤I R≤15mA 2.5mV6.08.08.0mV(max)8.010.010.0mV(max)LM40409LM4040-2.5Electrical Characteristics (Extended Temperature Range)(Continued)Boldface limits apply for T A =T J =T MIN to T MAX ;all other limits T A =T J =25˚C.The grades C,D and E designate initial Reverse Breakdown Voltage tolerances of ±0.5%,±1.0%and ±2.0%,respectively.SymbolParameterConditionsTypical (Note 4)LM4040CEM3Limits (Note 5)LM4040DEM3Limits (Note 5)LM4040EEM3Limits (Note 5)Units(Limit)Z R Reverse Dynamic Impedance I R =1mA,f =120Hz,I AC =0.1I R 0.3Ω0.91.11.1Ω(max)e N Wideband NoiseI R =100µA 35µV rms10Hz ≤f ≤10kHz∆V RReverse Breakdown Voltage Long Term Stabilityt =1000hrsT =25˚C ±0.1˚CI R =100µA 120ppmV HYSTThermal Hysteresis(Note 8)∆T =−40˚C to +125˚C0.08%LM4040-3.0Electrical Characteristics (Industrial Temperature Range)Boldface limits apply for T A =T J =T MIN to T MAX ;all other limits T A =T J =25˚C.The grades A and B designate initial Re-verse Breakdown Voltage tolerances of ±0.1%and ±0.2%,respectively.Symbol Parameter ConditionsTypical (Note 4)LM4040AIM3LM4040AIZ (Limit)(Note 5)LM4040BIM3LM4040BIZ LM4040BIM7Limits (Note 5)Units (Limit)V R Reverse Breakdown Voltage I R =100µA 3.000VReverse Breakdown Voltage Tolerance (Note 6)I R =100µA ±3.0±6.0mV (max)±22±26mV (max)I RMINMinimum Operating Current47µA 6262µA (max)6767µA (max)∆V R /∆TAverage Reverse Breakdown Voltage Temperature Coefficient (Note 6)I R =10mA ±20ppm/˚C I R =1mA ±15±100±100ppm/˚C (max)I R =100µA±15ppm/˚C ∆V R /∆I R Reverse Breakdown Voltage Change with Operating Current Change (Note 7)I RMIN ≤I R ≤1mA0.6mV0.80.8mV (max)1.11.1mV (max)1mA ≤I R ≤15mA2.7mV 6.0 6.0mV (max)9.09.0mV (max)Z R Reverse Dynamic Impedance I R =1mA,f =120Hz,I AC =0.1I R 0.4Ω0.90.9Ω(max)e N Wideband NoiseI R =100µA 35µV rms10Hz ≤f ≤10kHz∆V RReverse Breakdown Voltage Long Term Stability t =1000hrs T =25˚C ±0.1˚CI R =100µA 120ppmV HYSTThermal Hysteresis (Note 8)∆T =−40˚C to +125˚C0.08%L M 4040 10LM4040-3.0Electrical Characteristics(Industrial Temperature Range)Boldface limits apply for T A=T J=T MIN to T MAX;all other limits T A=T J=25˚C.The grades C,D and E designate initial Reverse Breakdown Voltage tolerances of±0.5%,±1.0%and±2.0%,respectively.Symbol Parameter Conditions Typical(Note4)LM4040CIM3LM4040DIZLM4040CIM7Limits(Note5)LM4040DIM3LM4040DIZLM4040DIM7Limits(Note5)LM4040EIM7LM4040EIZLimits(Note5)Units(Limit)V R Reverse BreakdownVoltageI R=100µA 3.000VReverse Breakdown Voltage Tolerance (Note6)I R=100µA±15±30±60mV(max)±34±59±89mV(max)I RMIN Minimum OperatingCurrent 45µA606565µA(max)657070µA(max)∆V R/∆T Average ReverseBreakdown VoltageTemperatureCoefficient(Note6)I R=10mA±20ppm/˚CI R=1mA±15±100±150±150ppm/˚C(max) I R=100µA±15ppm/˚C∆V R/∆I R Reverse BreakdownVoltage Change withOperating CurrentChange(Note7)I RMIN≤I R≤1mA0.4mV0.8 1.1 1.1mV(max)1.1 1.3 1.3mV(max) 1mA≤I R≤15mA2.7mV6.08.08.0mV(max)9.011.011.0mV(max)Z R Reverse DynamicImpedance I R=1mA,f=120Hz0.4ΩI AC=0.1I R0.9 1.2 1.2Ω(max)e N Wideband Noise I R=100µA35µV rms10Hz≤f≤10kHz∆V R Reverse BreakdownVoltage Long TermStability t=1000hrsT=25˚C±0.1˚C120ppm I R=100µAV HYST Thermal Hysteresis(Note8)∆T=−40˚C to+125˚C0.08%LM4040-3.0Electrical Characteristics(Extended Temperature Range)Boldface limits apply for T A=T J=T MIN to T MAX;all other limits T A=T J=25˚C.The grades C,D and E designate initial Reverse Breakdown Voltage tolerances of±0.5%,±1.0%and±2.0%,respectively.Symbol Parameter Conditions Typical(Note4)LM4040CEM3Limits(Note5)LM4040DEM3Limits(Note5)LM4040EEM3Limits(Note5)Units(Limit)V R Reverse BreakdownVoltageI R=100µA 3.000VReverse Breakdown VoltageTolerance(Note6)I R=100µA±15±30±60mV(max)±45±75±105mV(max)I RMIN Minimum OperatingCurrent 47µA626767µA(max)707575µA(max)LM4040LM4040-3.0Electrical Characteristics (Extended Temperature Range)(Continued)Boldface limits apply for T A =T J =T MIN to T MAX ;all other limits T A =T J =25˚C.The grades C,D and E designate initial Reverse Breakdown Voltage tolerances of ±0.5%,±1.0%and ±2.0%,respectively.SymbolParameterConditionsTypical (Note 4)LM4040CEM3Limits (Note 5)LM4040DEM3Limits (Note 5)LM4040EEM3Limits (Note 5)Units(Limit)∆V R /∆TAverage Reverse Breakdown Voltage TemperatureCoefficient (Note 6)I R =10mA ±20ppm/˚CI R =1mA ±15±100±150±150ppm/˚C (max)I R =100µA±15ppm/˚C ∆V R /∆I R Reverse Breakdown Voltage Change with Operating Current Change (Note 7)I RMIN ≤I R ≤1mA0.4mV 0.8 1.1 1.1mV (max)1.11.31.3mV (max)1mA ≤I R ≤15mA2.7mV 6.08.08.0mV (max)9.011.011.0mV (max)Z R Reverse Dynamic Impedance I R =1mA,f =120Hz,I AC =0.1I R 0.4Ω0.91.21.2Ω(max)e N Wideband NoiseI R =100µA 35µV rms10Hz ≤f ≤10kHz∆V RReverse Breakdown Voltage Long Term Stabilityt =1000hrsT =25˚C ±0.1˚CI R =100µA 120ppmV HYSTThermal Hysteresis(Note 8)∆T =−40˚C to +125˚C0.08%LM4040-4.1Electrical Characteristics (Industrial Temperature Range)Boldface limits apply for T A =T J =T MIN to T MAX ;all other limits T A =T J =25˚C.The grades A and B designate initial Re-verse Breakdown Voltage tolerances of ±0.1%and ±0.2%,respectively.SymbolParameterConditionsTypical (Note 4)LM4040AIM3LM4040AIZ Limits (Note 5)LM4040BIM3LM4040BIZ LM4040BIM7Limits (Note 5)Units (Limit)V R Reverse Breakdown Voltage I R =100µA 4.096VReverse Breakdown Voltage Tolerance (Note 6)I R =100µA ±4.1±8.2mV (max)±31±35mV (max)I RMINMinimum Operating Current50µA 6868µA (max)7373µA (max)∆V R /∆TAverage Reverse Breakdown Voltage Temperature Coefficient(Note 6)I R =10mA ±30ppm/˚C I R =1mA ±20±100±100ppm/˚C (max)I R =100µA±20ppm/˚C ∆V R /∆I R Reverse Breakdown Voltage Change with Operating Current Change (Note 7)I RMIN ≤I R ≤1mA0.5mV0.90.9mV (max)1.21.2mV (max)1mA ≤I R ≤15mA3.0mV 7.07.0mV (max)10.010.0mV (max)L M 4040LM4040-4.1Electrical Characteristics(Industrial Temperature Range)(Continued)Boldface limits apply for T A=T J=T MIN to T MAX;all other limits T A=T J=25˚C.The grades A and B designate initial Re-verse Breakdown Voltage tolerances of±0.1%and±0.2%,respectively.Symbol Parameter Conditions Typical(Note4)LM4040AIM3LM4040AIZLimits(Note5)LM4040BIM3LM4040BIZLM4040BIM7Limits(Note5)Units(Limit)Z R Reverse DynamicImpedance I R=1mA,f=120Hz,0.5ΩI AC=0.1I R 1.0 1.0Ω(max)e N Wideband Noise I R=100µA80µV rms10Hz≤f≤10kHz∆V R Reverse Breakdown VoltageLong Term Stability t=1000hrsT=25˚C±0.1˚CI R=100µA120ppmV HYST Thermal Hysteresis(Note8)∆T=−40˚C to+125˚C0.08%LM4040LM4040-4.1Electrical Characteristics (Industrial Temperature Range)Boldface limits apply for T A =T J =T MIN to T MAX ;all other limits T A =T J =25˚C.The grades C and D designate initial Re-verse Breakdown Voltage tolerances of ±0.5%and ±1.0%,respectively.SymbolParameterConditionsTypical (Note 4)LM4040CIM3LM4040CIZ LM4040CIM7Limits (Note 5)LM4040DIM3LM4040BIZ LM4040DIM7Limits (Note 5)Units (Limit)V R Reverse Breakdown Voltage I R =100µA 4.096VReverse Breakdown Voltage Tolerance (Note 6)I R =100µA ±20±41mV (max)±47±81mV (max)I RMINMinimum Operating Current50µA 6873µA (max)7378µA (max)∆V R /∆T Average Reverse Breakdown Voltage Temperature Coefficient (Note 6)I R =10mA±30ppm/˚C I R =1mA ±20±100±150ppm/˚C (max)I R =100µA ±20ppm/˚C ∆V R /∆I R Reverse Breakdown Voltage Change with Operating Current Change (Note 7)I RMIN ≤I R ≤1mA 0.5mV0.9 1.2mV (max)1.21.5mV (max)1mA ≤I R ≤15mA3.0mV 7.09.0mV (max)10.013.0mV (max)Z R Reverse Dynamic Impedance I R =1mA,f =120Hz,0.5ΩI AC =0.1I R 1.01.3Ω(max)e N Wideband NoiseI R =100µA 80µV rms 10Hz ≤f ≤10kHz∆V RReverse Breakdown Voltage Long Term Stability t =1000hrs T =25˚C ±0.1˚CI R =100µA 120ppmV HYSTThermal Hysteresis (Note 8)∆T =−40˚C to +125˚C0.08%L M 4040LM4040-5.0Electrical Characteristics(Industrial Temperature Range)Boldface limits apply for T A=T J=T MIN to T MAX;all other limits T A=T J=25˚C.The grades A and B designate initial Re-verse Breakdown Voltage tolerances of±0.1%and±0.2%,respectively.Symbol Parameter Conditions Typical(Note4)LM4040AIM3LM4040AIZLimits(Note5)LM4040BIM3LM4040BIZLM4040BIM7Limits(Note5)Units(Limit)V R Reverse Breakdown Voltage I R=100µA 5.000VReverse Breakdown Voltage Tolerance(Note6)I R=100µA±5.0±10mV(max)±38±43mV(max)I RMIN Minimum Operating Current54µA7474µA(max)8080µA(max)∆V R/∆T Average Reverse Breakdown Voltage TemperatureCoefficient(Note6)I R=10mA±30ppm/˚CI R=1mA±20±100±100ppm/˚C(max) I R=100µA±20ppm/˚C∆V R/∆I R Reverse Breakdown VoltageChange with OperatingCurrent Change(Note7)I RMIN≤I R≤1mA0.5mV1.0 1.0mV(max)1.4 1.4mV(max) 1mA≤I R≤15mA 3.5mV8.08.0mV(max)12.012.0mV(max)Z R Reverse DynamicImpedance I R=1mA,f=120Hz,0.5ΩI AC=0.1I R 1.1 1.1Ω(max)e N Wideband Noise I R=100µA80µV rms10Hz≤f≤10kHz∆V R Reverse Breakdown VoltageLong Term Stability t=1000hrsT=25˚C±0.1˚C120ppm I R=100µAV HYST Thermal Hysteresis(Note8)∆T=−40˚C to+125˚C0.08%LM4040。

1FeaturesInputs/Outputs •Accepts differential or single-ended input •LVPECL, LVDS, CML, HCSL, LVCMOS •Two precision LVPECL outputs •Operating frequency up to 750 MHzPower •Options for 2.5 V or 3.3 V power supply •Core current consumption of 49 mA•On-chip Low Drop Out (LDO) Regulator for superior power supply rejectionPerformance •Ultra low additive jitter of 39 fs RMSApplications•General purpose clock distribution •Low jitter clock trees •Logic translation•Clock and data signal restoration•Wired communications: OTN, SONET/SDH, GE, 10 GE, FC and 10G FC•PCI Express generation 1/2/3 clock distribution •Wireless communications•High performance microprocessor clock distributionApril 2014Figure 1 - Functional Block DiagramZL40200Precision 1:2 LVPECL Fanout BufferData SheetOrdering InformationZL40200LDG1 16 Pin QFN TraysZL40200LDF116 Pin QFN Tape and ReelMatte TinPackage size: 3 x 3 mm-40o C to +85o CTable of ContentsFeatures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Inputs/Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Change Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41.0 Package Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52.0 Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53.0 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .63.1 Clock Inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .63.2 Clock Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .113.3 Device Additive Jitter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .153.4 Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .163.4.1 Sensitivity to power supply noise. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .163.4.2 Power supply filtering. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .163.4.3 PCB layout considerations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .164.0 AC and DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .175.0 Performance Characterization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .206.0 Typical Behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .217.0 Package Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .238.0 Mechanical Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24List of FiguresFigure 1 - Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Figure 2 - Pin Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 3 - LVPECL Input DC Coupled Thevenin Equivalent . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 4 - LVPECL Input DC Coupled Parallel Termination. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Figure 5 - LVPECL Input AC Coupled Termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Figure 6 - LVDS Input DC Coupled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Figure 7 - LVDS Input AC Coupled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Figure 8 - CML Input AC Coupled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Figure 9 - HCSL Input AC Coupled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Figure 10 - CMOS Input DC Coupled Referenced to VDD/2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 11 - CMOS Input DC Coupled Referenced to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 12 - Simplified Output Driver. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 13 - LVPECL Basic Output Termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 14 - LVPECL Parallel Output Termination. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 15 - LVPECL Parallel Thevenin-Equivalent Output Termination. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 16 - LVPECL AC Output Termination for Externally Terminated LVPECL Inputs . . . . . . . . . . . . . . . . . . . . 13 Figure 17 - LVPECL AC Output Termination for Internally Terminated LVPECL Inputs. . . . . . . . . . . . . . . . . . . . . 13 Figure 18 - LVPECL AC-Coupled Output Termination for CML Inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 19 - Additive Jitter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 20 - Decoupling Connections for Power Pins. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 21 - Differential Voltage Parameter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Figure 22 - Input To Output Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19Change SummaryPage ItemChange1Applications Added PCI Express clock distribution.5Pin Description Added exposed pad to Pin Description.Removed 22 O hm series resistors from Figure 3 and 4.These resistor s are not required; however there is no impact to performance if the resistors are included.6, 7Figure 3 and Figure 413Figure 16Corrected LVPECL interface circuit.18Figure 21Below are the changes from the February 2013 ti the April 2014 issue:Page Item Change7Figure 4Changed text to indicate the circuit is not recommended for VDD_driver=2.5V.7Figure 5Changed pull-up and pull-down resistors from 2kOhm to 100 Ohm.Below are the changes from the November 2012 issue to the February 2013 issue:Clarification of V ID and V OD.The device is packaged in a 16 pin QFN1416642NCvddNCN Cc l k _pvddgndNCo u t 1_no u t 1_po u t 0_n81210o u t 0_pc l k _nN CNCgndFigure 2 - Pin Connections2.0 Pin DescriptionPin Description Pin # Name Description1, 4clk_p, clk_n,Differential Input (Analog Input). Differential input signals.12, 11, 10, 9out0_p, out0_n out1_p, out1_n Differential Output (Analog Output). Differential outputs.8, 13vdd Positive Supply Voltage. 2.5V DC or 3.3 V DC nominal.5, 16gnd Ground. 0 V.2, 3, 6, 7, 14, 15NCNo Connection. Leave unconnected.Exposed Pad Device GND .The ZL40200 is an LVPECL clock fanout buffer with two identical output clock drivers capable of operating at frequencies up to 750MHz.Inputs to the ZL40200 are externally terminated to allow use of precision termination components and to allow full flexibility of input termination. The ZL40200 can accept DC coupled LVPECL or LVDS and AC coupled LVPECL, LVDS, CML or HCSL input signals; single ended input signals can also be accepted. A pin compatible device with internal termination is also available.The ZL40200 is designed to fan out low-jitter reference clocks for wired or optical communications applications while adding minimal jitter to the clock signal. An internal linear power supply regulator and bulk capacitors minimize additive jitter due to power supply noise. The device operates from 2.5V+/-5% or 3.3V+/-5% supply. Its operation is guaranteed over the industrial temperature range -40°C to +85°C.The device block diagram is shown in Figure 1; its operation is described in the following sections.3.1 Clock InputsThe device can accept LVPECL, LVDS, CML, HCSL and single-ended inputs.Figure 3 - LVPECL Input DC Coupled Thevenin EquivalentFigure 4 - LVPECL Input DC Coupled Parallel TerminationFigure 5 - LVPECL Input AC Coupled TerminationFigure 6 - LVDS Input DC CoupledFigure 7 - LVDS Input AC CoupledFigure 8 - CML Input AC CoupledFigure 9 - HCSL Input AC CoupledFigure 10 - CMOS Input DC Coupled Referenced to VDD/2Figure 11 - CMOS Input DC Coupled Referenced to GroundVDD_driver R1 (kΩ)R2 (kΩ)R3 (kΩ)RA (kΩ) C (pF) 1.5 1.25 3.075open10101.81 3.8open10102.50.33 4.2open10103.30.75open4.21010Table 1 - Component Values for Single Ended Input Reference to Ground * For frequencies below 100 MHz, increase C to avoid signal integrity issues.3.2 Clock OutputsLVPECL has a very low output impedance and a differential signal swing between 1V and 1.6 V. A simplified diagram for the output stage is shown in Figure 12.The LVPECL to LVDS output termination is not shown since there is a separate device that has the same input and LVDS outputs.out_pout_nFigure 12 - Simplified Output DriverThe methods to terminate the ZL40200 LVPECL drivers are shown in the following figures.Figure 15 - LVPECL Parallel Thevenin-Equivalent Output TerminationFigure 16 - LVPECL AC Output Termination for Externally Terminated LVPECL InputsFigure 17 - LVPECL AC Output Termination for Internally Terminated LVPECL InputsFigure 18 - LVPECL AC-Coupled Output Termination for CML Inputs3.3 Device Additive JitterThe ZL40200 clock fan out buffer is not intended to filter clock jitter. The jitter performance of this type of device is characterized by its additive jitter. Additive jitter is the jitter the device would add to a hypothetical jitter-free clock as it passes through the device. The additive jitter of the ZL40200 is random and as such it is not correlated to the jitter of the input clock signal.The square of the resultant random RMS jitter at the output of the ZL40200 is equal to the sum of the squares of the various random RMS jitter sources including: input clock jitter; additive jitter of the buffer; and additive jitter due to power supply noise. There may be additional deterministic jitter sources that are not shown in Figure 19.Figure 19 - Additive Jitter3.4 Power SupplyThis device operates with either a 2.5V supply or 3.3V supply.3.4.1 Sensitivity to power supply noisePower supply noise from sources such as switching power supplies and high-power digital components such as FPGAs can induce additive jitter on clock buffer outputs. The ZL40200 is equipped with a low drop out (LDO) power regulator and on-chip bulk capacitors to minimize additive jitter due to power supply noise. The LDO regulator on the ZL40200 allows this device to have superior performance even in the presence of external noise sources. The on-chip regulation, recommended power supply filtering, and good PCB layout all work together to minimize the additive jitter from power supply noise.The performance of these clock buffers in the presence of power supply noise is detailed in ZLAN-403, “Power Supply Rejection in Clock Buffers” which is available from Applications Engineering.3.4.2 Power supply filteringFor optimal jitter performance, the device should be isolated from the power planes connected to its power supply pins as shown in Figure 20.•10 µF capacitors should be size 0603 or size 0805 X5R or X7R ceramic, 6.3 V minimum rating•0.1 µF capacitors should be size 0402 X5R ceramic, 6.3 V minimum rating•Capacitors should be placed next to the connected device power pins• a 0.3 Ohm resistor is recommended for the filter shown in Figure 20Figure 20 - Decoupling Connections for Power Pins3.4.3 PCB layout considerationsThe power nets in Figure 20 can be implemented either as a plane island or routed power topology without changing the overall jitter performance of the device.Absolute Maximum Ratings*Parameter Sym.Min.Max.Units 1Supply voltage V DD_R-0.5 4.6V 2Voltage on any digital pin V PIN-0.5V DD V 3LVPECL output current I out30mA 4Soldering temperature T260 °C 5Storage temperature T ST-55125 °C 6Junction temperature T j125 °C 7Voltage on input pin V input V DD V 8Input capacitance each pin C p500fF 4.0 AC and DC Electrical Characteristics* Exceeding these values may cause permanent damage. Functional operation under these conditions is not implied.* Voltages are with respect to ground (GND) unless otherwise statedRecommended Operating Conditions*Characteristics Sym.Min.Typ.Max.Units1Supply voltage 2.5 V mode V DD25 2.375 2.5 2.625V2Supply voltage 3.3 V mode V DD33 3.135 3.3 3.465V3Operating temperature T A-402585°C* Voltages are with respect to ground (GND) unless otherwise statedDC Electrical Characteristics - Current ConsumptionCharacteristics Sym.Min.Typ.Max.Units Notes 1Supply current LVPECL drivers -unloadedI dd_unload49mA Unloaded2Supply current LVPECL drivers - loaded (all outputs are active)I dd_load88mA Including powerto R L = 50DC Electrical Characteristics - Inputs and Outputs - for 3.3 V SupplyCharacteristics Sym.Min.Typ.Max.Units Notes 1Differential input common modevoltageV CM 1.1 2.0V2Differential input voltage difference V ID0.251V3LVPECL output high voltage V OH V DD-1.40V Measured at 10MHz4LVPECL output low voltage V OL V DD-1.62V Measured at 10MHz*The VOD parameter was measured from 125 MHz to 750 MHz.*The VOD parameter was measured from 125 MHz to 750 MHz.Figure 21 - Differential Voltage Parameter*Supply voltage and operating temperature are as per Recommended Operating Conditions5LVPECL output differential voltageV OD0.50.9VDC Electrical Characteristics - Inputs and Outputs - for 2.5 V SupplyCharacteristicsSym.Min.Typ.Max.Units Notes1Differential input common mode voltageV CM 1.1 1.6V 2Differential input voltage difference V ID 0.251V 3LVPECL output high voltage V OH V DD -1.40V 4LVPECL output low voltage V OL V DD -1.62V 5LVPECL output differential voltage*V OD0.40.9VAC Electrical Characteristics* - Inputs and Outputs (see Figure 22) - for 3.3 V supply.CharacteristicsSym.Min.Typ.Max.Units Notes1Maximum Operating Frequency 1/t p 750MHz 2input to output clock propagation delay t pd 012ns 3output to output skew t out2out 50100ps 4part to part output skewt part2part 80300ps 5Output clock Duty Cycle degradation t PWH / t PWL-2%0%2%Duty Cycle 6LVPECL Output Slew Rater sk0.75 1.2V/nsDC Electrical Characteristics - Inputs and Outputs - for 3.3 V SupplyCharacteristicsSym.Min.Typ.Max.Units NotesAC Electrical Characteristics* - Inputs and Outputs (see Figure 22) - for 2.5 V supply.Characteristics Sym.Min.Typ.Max.Units Notes 1Maximum Operating Frequency1/t p750MHz2input to output clock propagation delay t pd012ns3output to output skew t out2out50100ps4part to part output skew t part2part80300ps5Output clock Duty Cycle degradation t PWH/ t PWL-202Percent6LVPECL Output Slew Rate r sk0.75 1.2ps* Supply voltage and operating temperature are as per Recommended Operating ConditionsInputt Pt PWL t pdt PWHOutputFigure 22 - Input To Output TimingAdditive Jitter at 2.5 V*Output Frequency (MHz)Jitter MeasurementFilterTypical RMS (fs)Notes112512 kHz - 20 MHz 1122212.512 kHz - 20 MHz 803311.0412 kHz - 20 MHz 70442512 kHz - 20 MHz 65550012 kHz - 20 MHz 566622.0812 kHz - 20 MHz 43775012 kHz - 20 MHz39Additive Jitter at 3.3 V*Output Frequency (MHz)Jitter MeasurementFilterTypical RMS (fs)Notes112512 kHz - 20 MHz 1122212.512 kHz - 20 MHz 823311.0412 kHz - 20 MHz 72442512 kHz - 20 MHz 63550012 kHz - 20 MHz 526622.0812 kHz - 20 MHz 43775012 kHz - 20 MHz395.0 Performance Characterization*The values in this table were taken with an approximate slew rate of 0.8 V/ns.*The values in this table were taken with an approximate slew rate of 0.8 V/ns.* The values in this table are the additive periodic jitter caused by an interfering tone typically caused by a switching power supply. For this test, measurements were taken over the full temperature and voltage range for V DD = 3.3 V. The magnitude of the interfering tone is measured at the DUT.Additive Jitter from a Power Supply Tone*CarrierFrequency (MHz)ParameterTypicalUnitsNotes125MHz 25 mV at 100 kHz 159fs RMS 750MHz25 mV at 100 kHz82fs RMS6.0 Typical BehaviorTypical Phase Noise at 622.08 MHzTypical Waveform at 155.52 MHzInput Slew Rate versus Additive Jitter Propagation Delay versus TemperatureNote:This is for a single device. For more details see thecharacterization section.V ODversus FrequencyPower Supply Tone Magnitude versus PSRR (at 100 kHz) at 125 MHz Power Supply Tone Magnitude versus Additive Jitter (at 100 kHz) at 125 MHzPower Supply Tone Frequency (at 25 mV) versus PSRR at 125 MHz Power Supply Tone Frequency (at 25 mV) versus Additive Jitter at 125 MHz7.0 Package Thermal Characteristics*Proper thermal management must be practiced to ensure that T jmax is not exceeded.Thermal DataParameterSymbolTest ConditionValue UnitJunction to Ambient Thermal ResistanceΘJAStill Air 1 m/s 2 m/s 67.961.658.1oC/WJunction to Case Thermal Resistance ΘJC Still Air 44.1o C/W Junction to Board Thermal Resistance ΘJB Still Air23.2oC/WMaximum Junction Temperature*T jmax 125o C Maximum Ambient TemperatureT A85oC© 2014 Microsemi Corporation. All rights reserved. Microsemi and the Microsemi logo are trademarks of Microsemi Corporation. All other trademarks and service marks are the property of their respective owners.Microsemi Corporation (NASDAQ: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense and security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world’s standard for time; voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif. and has approximately 3,400 employees globally. Learn more at .Microsemi Corporate Headquarters One One Enterprise, Aliso Viejo CA 92656 USA Within the USA: +1 (800) 713-4113Outside the USA: +1 (949) 380-6100Sales: +1 (949) 380-6136Fax: +1 (949) 215-4996E-mail: ***************************Information relating to products and services furnished herein by Microsemi Corporation or its subsidiaries (collectively “Microsemi”) is believed to be reliable. However, Microsemi assumes no liability for errors that may appear in this publication, or for liability otherwise arising from the application or use of any such information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application or use. Neither the supply of such information or purchase of product or service conveys any license, either express or implied, under patents or other intellectual property rights owned by Microsemi or licensed from third parties by Microsemi, whatsoever. Purchasers of products are also hereby notified that the use of product in certain ways or in combination with Microsemi, or non-Microsemi furnished goods or services may infringe patents or other intellectual property rights owned by Microsemi.This publication is issued to provide information only and (unless agreed by Microsemi in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. The products, their specifications, services and other information appearing in this publication are subject to change by Microsemi without notice. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user’s responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. Manufacturing does not necessarily include testing of all functions or parameters. These products are not suitable for use in any medical and other products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to Microsemi’s conditions of sale which are available on request.For more information about all Microsemi productsvisit our website at TECHNICAL DOCUMENTATION – NOT FOR RESALE。