Breakdown Reduction Overview

IntroductionThe year 2021 has been a challenging yet rewarding period for our company. We have overcome numerous obstacles and achieved remarkable progress in various aspects. This annual report aims to provide a comprehensive overview of our company's performance, achievements, and challenges faced during the year.1. Financial PerformanceIn 2021, our company achieved a revenue of $50 million, a 15% increase compared to the previous year. This growth can be attributed to the successful launch of new products, expansion into new markets, and improved operational efficiency.Revenue Breakdown:- Product Sales: $30 million, representing a 12% increase from the previous year.- Service Revenue: $15 million, a 20% increase.- Licensing Revenue: $5 million, a 10% increase.Profitability:Our net profit for the year was $5 million, with an operating margin of 10%. This improvement in profitability can be attributed to cost reduction measures, efficient resource allocation, and increased sales.2. Product DevelopmentIn 2021, we focused on innovation and product development to meet the ever-changing market demands. We successfully launched three new products, which received positive feedback from our customers.- Product A: A revolutionary technology that addresses a significant market gap. It has generated $10 million in sales since its launch.- Product B: An upgraded version of our existing product, offering enhanced features and performance. It has captured a 15% market share in its first six months.- Product C: A new service offering that complements our existing product line. It has generated $2 million in revenue.3. Market ExpansionWe expanded our market presence in 2021 by entering new geographical regions and targeting new customer segments. Our efforts in market expansion resulted in the following achievements:- New Markets: We successfully entered the European market, generating $2 million in revenue.- New Customer Segments: We targeted small and medium-sized enterprises (SMEs) in our existing markets, resulting in a 10% increase in sales to this segment.4. Operations and Process ImprovementTo enhance our operational efficiency, we implemented several process improvement initiatives in 2021:- Lean Manufacturing: We adopted lean manufacturing principles to reduce waste and improve productivity. As a result, our manufacturing costs decreased by 5%.- Supply Chain Optimization: We renegotiated our supplier contracts and optimized our supply chain, resulting in a 10% reduction in procurement costs.- IT Infrastructure Upgrade: We upgraded our IT infrastructure to improve data management and streamline operations, resulting in a 20% reduction in IT-related costs.5. Challenges and Future OutlookDespite our achievements, we faced several challenges in 2021:- Global Supply Chain Disruptions: The disruptions in the global supply chain affected our production timelines and increased our costs.- Economic Uncertainty: The ongoing economic uncertainty due to the COVID-19 pandemic impacted consumer spending and business investments.Looking ahead, we are optimistic about our future prospects. We plan to continue investing in research and development, expand our market presence, and enhance our operational efficiency. Our focus areas for the next fiscal year include:- Launching new products and services to cater to evolving market demands.- Expanding our global footprint by entering new markets and targeting new customer segments.- Enhancing our operational efficiency through continuous process improvement initiatives.ConclusionIn conclusion, 2021 has been a year of significant achievements for our company. We have successfully navigated through challenging times and achieved remarkable growth in various aspects. As we move forward, we remain committed to delivering value to our customers, stakeholders, and employees. We are confident that our strategic initiatives and continuous improvement efforts will enable us to achieve greater success in the coming years.。

现象解释类英语作文模板四级英文回答：Explanation of Phenomena Essay Template for Level 4 English。

Introduction:State the phenomenon being explained.Provide a brief overview of the topic.Body:Paragraph 1:Explain the first aspect or factor that contributes to the phenomenon.Provide evidence or examples to support yourexplanation.Paragraph 2:Explain a second aspect or factor that contributes to the phenomenon.Provide evidence or examples to support your explanation.Paragraph 3:Explain a third aspect or factor that contributes to the phenomenon.Provide evidence or examples to support your explanation.Conclusion:Summarize the main points of the explanation.Reiterate the phenomenon being explained.Example Essay:Why Do Leaves Change Color in Autumn?Introduction:The vibrant reds, oranges, and yellows of autumn leaves are a beautiful sight. But what causes these changes in color?Body:Paragraph 1:One factor that contributes to leaf color change is the reduction in sunlight during autumn. This decrease in sunlight triggers the breakdown of chlorophyll, a green pigment in leaves that absorbs sunlight for photosynthesis. As chlorophyll breaks down, other pigments, such as carotenoids and anthocyanins, become more visible.Paragraph 2:Carotenoids are yellow, orange, and red pigments that are always present in leaves, but are masked by chlorophyll during the summer. When chlorophyll breaks down, carotenoids become more visible, contributing to the warm colors of autumn leaves.Paragraph 3:Anthocyanins are red, purple, and blue pigments that are produced in leaves in response to cold temperatures and bright sunlight. The intensity of anthocyanin production varies depending on the species of tree and the weather conditions. Anthocyanins contribute to the brilliant reds and purples that are characteristic of some autumn leaves.Conclusion:The changes in leaf color during autumn are caused by the combination of reduced sunlight, the breakdown ofchlorophyll, and the production of carotenoids and anthocyanins. These factors work together to create the stunning colors of autumn foliage.中文回答：现象解释类英语作文模板四级。

Charged Device Model (CDM) Qualification IssuesPurpose /Abstract•IC design for performance constraints make it increasingly difficult to meet the current CDM levels as the technologies continue to shrink and the circuitspeed demands continue to increase•This work shows that devices with CDM levels below the general target of 500 V can safely be handled with CDM control methods available in the industry today •Based on these observations and constraints it will be shown through this work that 250V is a safe and practical target CDM levelOutline•Relevance of CDM•CDM Technology & Design Issues •CDM Qualification Methods•ESD Control Methods Addressing CDM •Analysis of Field Return Data •Summary•Conclusion•RoadmapRelevance of CDM•CDM is a unique and important test method for IC component ESD testing•There are proven damage signatures for field returns due to fast ESD discharges with high peak current that cannot be reproduced by HBM (or MM)•CDM testing can effectively replicate these failure signatures•Typical discharge scenarios have been simulated in IC testing and observed in manufacturing which cause CDM failure signaturesCDM is a necessary and important qualification testCDM Technology & Design Issues•CDM protection design is primarily driven by the peak current from the IC package discharge at the required (targeted) CDM voltage level.•Increasing package size (and capacitance) lead to increasing peak CDM current for a given CDM stressvoltage.•Additionally, CDM protection design is increasingly limited by reduction in breakdown voltage of gate dielectrics and junctions.IC Circuit Speed DemandIC Die and Package SizeTechnology Scaling ICBreakdown Voltage Reduced ESD Design WindowPractical CDM LevelsCDM Technology & Design IssuesParasitics from ESD DevicesIC design requirements create severe limitations for CDM protectionCDM Discharge Current Customer/ Design Requirements Impact on ESD IssuesSolutionDifficult to meet currently accepted CDM levelsImpact of Package on CDM Discharge Current @500VIt1AI t12-15A8-Pin DIP2400-Pin LGAWide variations (>12X) in the peak discharge current from the smallest to the largest IC packages500 1000 1500 2000 2500 30002002P i n C o u n t2004200620082010Calendar YearTrends in IC Package Pin Counts: Microprocessors20122014 20164000 5000 •Higher pin count devices at every new tech node are market driven towards HSS pins on microprocessors370423603604T JB1B2B3H1H2H3G1G2G3RLSN (479)Number of contactsLaunch year Next socket targetTrends in IC Package Pin Counts: Server SocketsCalendar Year******************************(PackageArea)2 4 6 8 10 12 14 0 1000 20003000Package Area (mm 2)C D M P e a k C u r r e n t (A )10030001000 500Pin CountVariations in Peak Current•Capacitive loading of ESD protection for high speed serial (HSS) link design is limited to ~ 100 fF. •The limitation to 100 fF only allows a maximum peak current of 4 A in this example. •For BGA with more than 300 pins this limits the CDM level to 250 V at best.CDM Analysis - Example for High Speed Serial LinkHigh Speed Serial Links - 45nm Bulk CMOS 0 1020 30 40 50 60 70 80 0 100 200 300 400 500 600ESD Capacitive Loading Budget [fF]D a t a R a t e [G i g a b i t s /s e c ]0 12 3 4 5 6 Peak CDM Current [A] Max. HSS data rate vs. capacitive loading CDM peak current - double diodes + RC- Clamp (Substrate charged neg) CDM peak current - DTSCR + RC-Clamp (Substrate charged neg)Overview of CDM Design Capability for Advanced Nodes with 10-20 GB/s Speed PerformanceTech. Node Design Type Max Achievable CDM PeakCurrent Corresponding CDM Level65nm High Speed Serial Link5-6 Amps300-400V45nm High Speed Serial Link4-5 Amps250-300V45nm Radio Frequency (RF)2-3 Amps200-250V200-250V becomes the new practical level that is achievableRelevance of ESD Control for Safe Manufacturing•For CDM, as with HBM, ESD control in the production areas is an essential part of a safemanufacturing process•Effective ESD control measures covering CDM events include the grounding of metallic machine parts, control of metal-to-metal contact with the device leads AND control of insulators •Control of insulators requires assessment of the various handling stepsBasic ESD Control Program addressing CDMIonizer if there are process relevant insulators that are considered a threatRemove all non-process relevant insulatorsE-Field measurements by Field Meter or Field MillBelow Threat LevelDissipative WorksurfaceThreat level per ANSI/ESD S20.20 and IEC 61340-5-1Relationship between General ESD Control and CDM Specific ControlAnalysis of FAR Data•FAR data was collected from various Council members for over 11 billion shipped IC's.•Field returns include returns from handling and testing by IC suppliers, manufacturing of the PCBs and end-customerreturns.•949 designs have been included covering automotive, consumer, memory and discrete products.•The presented data were collected in the time frame from 2003 to 2007.FAR Data versus CDM voltageImportant Observations:•EOS/ESD failure rates do not show a clear trend with respect to dependence of the CDM voltage• A few designs with high return rates (outliers) dominate the statistics Further Limitations:•Devices not always tested to failure voltage•Discrepancy between JEDEC and ESDA testers •Rel. Humidity during testing not controlled/recorded<=200>200 =<30>300=<400>400=<50>500<=750>750 <=1000>1000=<1250>1250 =<1500>1500 =<1750>1750 =<2000>2000,00,20,40,60,81,01,21,41,61,82,01280 M1260 M2210 M86 M600 M460 M2300 M1000 M1200 M390 M730 Mbased on 11.6 billion devicesu p p e r l i m i t o f E O S /E S D f a i l u r e r a t eCDM robustness [V]FAR Data versus CDM voltage w/o OutliersImportant Observations : •Excludes 15 designs classified as FAR outliers (defined by > 100 field returns per type)•Remaining designs (934 out of 949) show a FAR rate < 1 dpm•No increase in the average return rate of parts with lower CDM levels<=200>200=<30>300=<400>400=<500>500<=750>750 <=1000>1000=<125>1250=<150>1500=<1750>1750=<2000>2000,00,10,20,30,40,50,60,70,80,91,01,11200 M870 M2200 M220 M1040 M290 M2260 M220 M360 M570 M1 dpm linebased on 9.5 billion devicesu p p e r l i m i t o f E O S /E S D f a i l u r e r a t eCDM robustness [V]FAR Data versus CDM peak currentContains one outlier in TQFP 100 with 409 fails out of 36 Mio (V CDM = 1000V)•Limitations: Some peak currents were measured with a 1GHz scope, others with 4GHz scope (up to a factor of two difference in peak value)•BUT: EOS/ESD failures occur at all CDM peak currents levels (even at very high values)0<=22-<=33-<=44-<=55-<=66-<=77-<=88-<=99-<=1010-<=1111-<=1212-<=1414-<=16>160,00,51,01,52,02,531 M i o s o l d100 M i o s o l d150 M i o s o l d200 M i o s o l d280 M i o s o l d480 M i o s o l d260 M i o s o l d370 M i o s o l d540 M i o s o l d1170 M i o s o l d990 M i o s o l d470 M i o s o l d910 M i o s o l d280 M i o s o l dbased on 6,2 Billion devicesE O S /E S D f a i l u r e [d p m ]CDM peak current [A]Analysis of FAR of a CDM Weak DeviceLow CDM Effect on FAR•140-Pin BGA shows 30 failures out of 67M units shipped •CDM performance = <125V•FA shows clear damage on IO gate due to marginal design •Identical damage was detected on units stressed at 125V•Implementing advanced CDM controls resulted in 0 FAR for 105M shipped → Control measures can be effective, even for low CDMDesign Issue & Failure Effect•High speed IO performance required lowcapacitance ESD solution in 90nm •Low capacitance solution = Low CDM •Device pins were therefore clearly susceptible to field failures•At the failure threshold current level for CDM discharge, IO damage is expected→FA indicated this expected damageIODamageAnalysis of FAR Outlier (CDM Robust Device) •Outlier in TQFP 100 shows 409 failsout of 36 M devices sold•CDM robustness voltage = 1000V•Failure showed molten metallization•Failure is due to EOS but not CDMAnalysis of EOS related FARs •Example of 130nm product with medium CDM•1681-LGA Product has 320 High Speed pins •300V CDM performance on all 320 HS Pins •All other pins >500V•Some customer returns, but Failure Analysis shows only EOS damage•No EOS damage on any of the 300V pins •EOS on only Power Supply Pin with >500V CDMEOS on returns not correlated to CDM levelEOS Fail Pin300V Pins300V Pins EOS Damage•EOS/ESD FARs can appear for any level of CDM from <100 V to >2000 V•FARs with clear CDM damage can be seen for ICs with very low CDM passing level•Proven CDM-type events occasionally occur during the ramp-up phase of a new handling/testing process at the IC supplier. •FARs during ramp-up can also occur for devices with greater than 500 V CDM robustness.•Addressing the failure mechanism with proper ESD control measures solves the problem. Usually only a minor effort combined with a low investment in cost is required.CDM field fails can occasionally occur with significant return rates during ramp-up. This has to be solved by ESD control measures.Conclusions from FAR Data Analysis (II)•Case studies show that a number of field failures in the FAR data are due to EOS or Charged Board Events (CBE).•There was no observed correlation of CDM weak pins and EOS fails.•Due to the high energies involved, it is not possible to address EOS and CBE hazards by on-chip CDM protection design. •CBE is a factory protection issue and must be addressed by assembly protection measures.CDM qualification levels should not be based on protection requirements against EOS and/or CBE.Summary – HBM vs CDM•For HBM it is well known that with basic ESD control measures, safe handling of IC components can beguaranteed in an EPA•But for CDM additional control measures may be necessary for specific handling processes in the EPA •Additional measures for CDM should include a process specific assessment to control charging of insulators in the manufacturing environment as a requirement.New Recommended CDM Classification Based on Factory CDM ControlCDM classification level(tested acc. to JEDEC)ESD control requirementsVCDM ≥ 250V•Basic ESD control methods with grounding of metallic machineparts and control of insulators125V ≤ VCDM < 250V •Basic ESD control methods with grounding of metallic machineparts and control of insulators +•Process specific measures to reduce the charging of the deviceOR to avoid a hard discharge (high resistive material in contact withthe device leads).VCDM < 125V •Basic ESD control methods with grounding of metallic machineparts and control of insulators +•Process specific measures to reduce the charging of the deviceAND to avoid a hard discharge (high resistive material in contactwith the device leads) +•Charging/discharging measurements at each process step.Published as JEP157Summary – Protection Design Constraints •Technology downscaling combined with increased IC performance requirements and the trend towards larger package sizes have all placed severe constraints on CDM protection design.•These constraints are even more limiting for high capacity packages with high speed interfaces. •Because of these technology and performance constraints, the old standard of 500 V CDM cannot be maintained.CDM Qualification Roadmap 1000V750V500V250V125V CDM Control MethodsCDM Target LevelCDM Roadmap16nm22nm 28nm 45nm 65nm 90nm 130nm 180nm 250nm 500nm 1978-20082009-20142015Q & AQ: If the production areas have basic control for ESD, would these methods also provide the necessary protection for CDM?A: If the basic controls are in place and include control of insulators, then the chances for ESD events of any kind would be minimizedQ: What are the main weak points for CDM ESD control in manufacturing?A: In contrast to controls for HBM, ESD controls for CDM rely on controlling the charge on insulators and controlling discharges to the conductors of the manufactured devices.Q: How is it determined that lower than 500V CDM are really safe?A: It has been proven that even 100V CDM parts can be manufactured if appropriate CDM control measures aretaken. The same assessment of ESD control measures and fail return data show that devices with 250V CDM are equally safe as 500V parts in typical modern manufacturing sites. Q: If the specifications are meant for all pins of a package, would it not make sense to require higher levels for thecorner pins?A: With the automated pick and place tools today, any of the pins could make first contact. All of the pins need to beconsidered, the corner pins should not be treated differently.Q: What if the customers are not confident that the subcons have the control measures to match the new requirementsA: Simply staying at the old levels will not address the design challenges. It should be noted that:•Customer demands for better IO performance will place more stress on achieving the old target levels.•Efforts to improve CDM protection in the manufacturing facilities need to continue to be a focus area if we are to meet these challenges.•In addition to the basic CDM protection measures, an analysis of the production lines should be completed. This is especially critical during introduction of new process steps or during product ramp-upQ: Will CDM change from die to package level? Will the die have greater risk in assembly onto a boardA: In most cases, bare die or wafer level MLF show higher peak current levels than the same die in a package. If the die has the same connectivity to the board as the package, it could have a higher risk of charged board damage. Care must be taken to place the die away from insulators on the board that couldcharge up during assembly.Q: Are charge board events (CBE) related to CDM and shouldn’t IC pins be designed to handle CBE?A: Board level aspects of CBE (much greater capacitance) results in failures that are much more severe, like EOS. Component IC protection cannot be designed to handle CBE events, which can be large and vary from application to application. Additional system level EOS protection must be provided.Confirmed CDM failure @ Semiconductor Testing 0,00,51,01,52,02,5correctioncontrol measures device in special 8 pin packagewith high capacitanceCDM pass level = 500VCD Mf ai l u r er at e [d pm ]time•CDM fails during a ramp-up phase canalso occur for partswith 500 V CDM and beyond.。

电机常用英文对照表电机行业常用的中英文对照(1)induction machine 感应式电机horseshoe magnet 马蹄形磁铁magnetic field 磁场eddy current 涡流right-hand rule 右手定则left-hand rule 左手定则slip 转差率induction motor 感应电动机rotating magnetic field 旋转磁场winding 绕组stator 定子rotor 转子induced current 感生电流time-phase 时间相位exciting voltage 励磁电压solt 槽lamination 叠片laminated core 叠片铁芯short-circuiting ring 短路环squirrel cage 鼠笼rotor core 转子铁芯cast-aluminum rotor 铸铝转子bronze 青铜horsepower 马力random-wound 散绕insulation 绝缘ac motor 交流环电动机end ring 端环alloy 合金coil winding 线圈绕组form-wound 模绕performance characteristic 工作特性frequency 频率revolutions per minute 转/分motoring 电动机驱动generating 发电per-unit value 标么值breakdown torque 极限转矩breakaway force 起步阻力overhauling 检修wind-driven generator 风动发电机revolutions per second 转/秒number of poles 极数speed-torque curve 转速力矩特性曲线plugging 反向制动synchronous speed 同步转速percentage 百分数locked-rotor torque 锁定转子转矩full-load torque 满载转矩prime mover 原动机inrush current 涌流magnetizing reacance 磁化电抗line-to-neutral 线与中性点间的staor winding 定子绕组leakage reactance 漏磁电抗no-load 空载full load 满载Polyphase 多相(的)iron-loss 铁损complex impedance 复数阻抗rotor resistance 转子电阻leakage flux 漏磁通locked-rotor 锁定转子chopper circuit 斩波电路separately excited 他励的compounded 复励dc motor 直流电动机de machine 直流电机speed regulation 速度调节shunt 并励series 串励armature circuit 电枢电路optical fiber 光纤nteroffice 局间的waveguide 波导波导管bandwidth 带宽light emitting diode 发光二极管silica 硅石二氧化硅regeneration 再生, 后反馈放大coaxial 共轴的,同轴的high-performance 高性能的carrier 载波mature 成熟的Single Side Band(SSB) 单边带coupling capacitor 结合电容propagate 传导传播modulator 调制器demodulator 解调器line trap 限波器shunt 分路器Amplitude Modulation(AM 调幅Frequency Shift Keying(FSK) 移频键控tuner 调谐器attenuate 衰减incident 入射的two-way configuration 二线制generator voltage 发电机电压dc generator 直流发电机polyphase rectifier 多相整流器boost 增压time constant 时间常数forward transfer function 正向传递函数error signal 误差信号regulator 调节器stabilizing transformer 稳定变压器time delay 延时direct axis transient time constant 直轴瞬变时间常数transient response 瞬态响应solid state 固体buck 补偿operational calculus 算符演算gain 增益pole 极点feedback signal 反馈信号dynamic response 动态响应voltage control system 电压控制系统mismatch 失配error detector 误差检测器excitation system 励磁系统field current 励磁电流transistor 晶体管high-gain 高增益boost-buck 升压去磁feedback system 反馈系统reactive power 无功功率feedback loop 反馈回路automatic Voltage regulator(A VR)自动电压调整器reference Voltage 基准电压magnetic amplifier 磁放大器amplidyne 微场扩流发电机self-exciting 自励的limiter 限幅器manual control 手动控制block diagram 方框图linear zone 线性区potential transformer 电压互感器stabilization network 稳定网络stabilizer 稳定器air-gap flux 气隙磁通saturation effect 饱和效应saturation curve 饱和曲线flux linkage 磁链per unit value 标么值shunt field 并励磁场magnetic circuit 磁路load-saturation curve 负载饱和曲线air-gap line 气隙磁化线polyphase rectifier 多相整流器circuit components 电路元件circuit parameters 电路参数electrical device 电气设备electric energy 电能primary cell 原生电池energy converter 电能转换器conductor 导体heating appliance 电热器direct-current 直流time invariant 时不变的self-inductor 自感mutual-inductor 互感the dielectric 电介质storage battery 蓄电池induction machine 感应式电机horseshoe magnet 马蹄形磁铁magnetic field 磁场eddy current 涡流right-hand rule 右手定则left-hand rule 左手定则slip 转差率本文转自IAC工业自动化(中国)商城:induction motor 感应电动机rotating magnetic field 旋转磁场winding 绕组stator 定子rotor 转子induced current 感生电流time-phase 时间相位exciting voltage 励磁电压solt 槽lamination 叠片laminated core 叠片铁芯short-circuiting ring 短路环squirrel cage 鼠笼rotor core 转子铁芯cast-aluminum rotor 铸铝转子bronze 青铜horsepower 马力random-wound 散绕insulation 绝缘ac motor 交流环电动机end ring 端环alloy 合金coil winding 线圈绕组form-wound 模绕performance characteristic 工作特性frequency 频率revolutions per minute 转/分motoring 电动机驱动generating 发电per-unit value 标么值breakdown torque 极限转矩breakaway force 起步阻力overhauling 检修wind-driven generator 风动发电机revolutions per second 转/秒number of poles 极数speed-torque curve 转速力矩特性曲线plugging 反向制动synchronous speed 同步转速percentage 百分数locked-rotor torque 锁定转子转矩full-load torque 满载转矩prime mover 原动机inrush current 涌流magnetizing reacance 磁化电抗line-to-neutral 线与中性点间的staor winding 定子绕组leakage reactance 漏磁电抗no-load 空载full load 满载Polyphase 多相(的) iron-loss 铁损complex impedance 复数阻抗rotor resistance 转子电阻leakage flux 漏磁通locked-rotor 锁定转子chopper circuit 斩波电路separately excited 他励的compounded 复励dc motor 直流电动机de machine 直流电机speed regulation 速度调节shunt 并励series 串励armature circuit 电枢电路optical fiber 光纤interoffice 局间的waveguide 波导波导管bandwidth 带宽light emitting diode 发光二极管silica 硅石二氧化硅regeneration 再生, 后反馈放大coaxial 共轴的,同轴的high-performance 高性能的carrier 载波mature 成熟的Single Side Band(SSB) 单边带coupling capacitor 结合电容propagate 传导传播modulator 调制器demodulator 解调器line trap 限波器shunt 分路器Amplitude Modulation(AM 调幅FrequencyShift Keying(FSK) 移频键控tuner 调谐器attenuate 衰减incident 入射的two-way configuration 二线制generator voltage 发电机电压dc generator 直流发电机polyphase rectifier 多相整流器boost 增压time constant 时间常数forward transfer function 正向传递函数error signal 误差信号regulator 调节器stabilizing transformer 稳定变压器time delay 延时direct axis transient time constant 直轴瞬transient response 瞬态响应solid state 固体buck 补偿operational calculus 算符演算gain 增益pole 极点feedback signal 反馈信号dynamic response 动态响应voltage control system 电压控制系统mismatch失配error detector 误差检测器excitation system 励磁系统field current 励磁电流transistor 晶体管high-gain 高增益boost-buck 升压去磁feedback system 反馈系统reactive power 无功功率feedback loop 反馈回路automatic Voltage regulator(A VR)自动电压调整器reference Voltage 基准电压magnetic amplifier 磁放大器amplidyne 微场扩流self-exciting 自励的limiter 限幅器manual control 手动控制block diagram 方框图linear zone 线性区completemotortype配带电机型号compoundmotor复励电动机compound-woundmotor复激电动机;复励电动机compressedairmotor气动电动机concatenatedmotor级联电动机;链系电动机;串级电动机concatenationmotor链系电动机;串级电动机condensermotor电容式电动机condenserrunmotor电容起动电动机condensershunttypeinductionmotor电容分相式感应电动机condenserstartmotor电容起动电动机condenser-startinductionmotor电容起动感应电动机connectormotormagnet回转电磁铁consequent-polesmotor变极式双速电动机;交替磁极式电动机constantcurrentmotor定流电动机constantdisplacementmotor定量马达constantfieldcommutatormotor定激励整流式电动机constantpowermotor恒定功率电动机constantpressuremotor等压内燃机constantspeedmotor等速电动机;恒速电动机;定速电动机constanttorqueasynchronousmotor恒力矩异步电动机constantvoltagemotor恒压电动机;定电压电动机constantvoltagemotorgenerator恒压电动机发电机constant-currentmotor恒流电动机constant-speedmotor等速马达constant-voltagemotor恒定电压电动机continuous-time-ratedmotor连续运行电动机continuouslyratedmotor连续额定运行电动机converter-fedmotor换流器供电电动机coolantpumpmotor冷却液泵电动机cooledmotor冷却式发动机corticalmotorarea皮层运动区corticalmotorareas皮质运动区cranemotor吊车电动机crawler-typemotorgrader履带式自动平地机crescentgearmotor内啮合齿轮马达crossfeedmotor交叉馈电式电动机cumulativecompoundmotor积复激电动机cupmotor杯形电机current-displacementmotor深槽电动机;深槽感应电动机cuttermotor截煤机电动机cycloidgearhydraulicmotor摆线齿轮油液压马达cycloidalgearreducingmotor摆线齿轮减速电动机cycloidalneedlewheeltypemotor摆线针轮电动机DCelectronicmotor离子式直流电动机DCseriesmotor串激直流电动机deadmotor关闭的电动机decompoundedmotor差复励电动机decussationmotoria运动交叉deep-barmotor深槽鼠笼式电动机deep-slotinductionmotor深槽感应电动机deep-slotmotor深槽感应电动机deep-slotsquirrelcagemotor深槽鼠笼式电动机definite-purposemotor专用电动机delugeproofmotor防水电动机Denisonmotor丹尼森液压电动机;轴向回转柱塞式液压电动机Derimotor德里电动机Derirepulsionmotor德里推斥电动机despunmotor反旋转电动机;反自转电动机diaphragmmotor膜片阀控制电动机;光阑驱动电动机die-castingmachineformotorrotor电机转子压铸机dieselmotor狄塞尔发动机dieselmotorroller柴油碾压机;柴油压路机differentialcompoundmotor差复激电动机;差复励电动机;差复励电视机;差复绕电动机;差绕复激电动机differentialmotor差绕电动机differentialselsynmotor差动自动同步电机differentialshuntmotor差并励电动机differentialwoundmotor差励电动机differential-fieldmotor他激差绕直流电动机differential-fieldseriesmotor串激差绕直流电动机differentially-compoundwoundmotor差复激电动机differentially-woundmotor差绕电动机directmotordrive电动机直接传动directmotordriven单电动机传动的direct-connectedmotor直连电动机direct-couplingmotorconverter连轴电动换流机direct-currentmotorcontrol电动机电子控制direct-motor-driven单电动机传动disabledmotorswitch电动机故障断路器dithermotor高频振动电动机;高频振动电机;高频振动用电动机doublearmaturemotor双电枢电动机doublecommutatormotor双整流子电动机;双换向器电动机doublemotor双电动机doublesquirrelcagemotor双鼠笼电动机double-casingmotor双层机壳式电机double-fedrepulsionmotor双馈推斥电动机double-reductionmotor两级减速电动机double-unitmotor双电动机机组drag-cupinductionmotor空心转子感应电动机drag-cupmotor拖杯式电动机;托杯形电动机drag-cuptyperotormotor空心转子电动机drill-motorrotorvane钻孔转子叶片drip-proofmotor防滴式电动机dual-capacitormotor双电容器式电动机dual-frequencymotor双频率电动机dual-thrustmotor双推力发动机duocentricmotor同心双转子电动机dust-tighttypemotor防尘式电动机dynamoelectricmotor旋转换流机E-Psignalmotor电动气动信号机eddycurrentsinattractiontypemotor吸引型电动机中的涡流drip-prooftypeinductionmotor防滴式感应电动机drivemotor传动马达drivermotor主驱动电动机drivingshaftmotor传动轴电机drop-prooftypemotor防滴水式电动机drummotor鼓形电动机。

2.4Motor switchover for induction motors(as of Performance 2)The “SIMODRIVE 611 digital” controller module has motor data sets for a maximum of 4 induction motors. There must be no gaps in the data sets.1.Motor data set (from MD:1000)2.Motor data set (from MD:2000)3.Motor data set (from MD:3000)4.Motor data set (from MD:4000)The motor data set is selected in accordance with the mode in MD 1013 with Bit 3 and Bit 4 in the control word for the drive.The active motor data set is shown by Bit 3 and Bit 4 in the status word for the drive.Motor bit 0 –> Bit 3Motor bit 1 –> Bit 42.4.1Variants for motor switchoverDepending on the setting of MD 1013 (motor switchover), the following switchovers can be implemented:Table 2-7Variants for motor switchover (MD 1013)General noteTable 2-7Variants for motor switchover (MD 1013), Fortsetzung1)Encoder switchover is not possible.2)Only 1 motor can be used with encoder.2.4.2Switchover of up to four motors, each with one data setFor this switchover variant (MD 1013: Bit 0 set), a maximum of 4 motors eachwith 1 associated motor data set can be switched.NoteFor each switchover, a pulse suppression is carried out.Switchover is performed by means of a relay between 4 motors with pulse sup-pression. Each motor has its own data set:S Motor bit 1 = 0; Motor bit 0 = 0–> Motor 1, Data Set 1S Motor bit 1 = 0; Motor bit 0 = 1–> Motor 2, Data Set 2S Motor bit 1 = 1; Motor bit 0 = 0–> Motor 3, Data Set 3S Motor bit 1 = 1; Motor bit 0 = 1–> Motor 4, Data Set 4Motor switchover passes through three states:1.Pulse disable2.Deactivate contactor, allow switch–off interlock time to elapse3.Allow contactor switch–on time to elapse, then enable pulses2.4.3Switchover of one motor with up to four data setsFor this switchover variant (MD 1013: Bit 1 set), for one motor, a maximum of 4motor data sets can be switched.NoteDuring switchover, no pulse suppression is carried out, i.e. switchover is also carried out when a pulse is enable applied.This variant can be use to adapt the motor and controller data.Switchover between 4 motor data sets without pulse suppression is performed by means of:S Motor bit 1 = 0; Motor bit 0 = 0–> Motor 1, Data Set 1S Motor bit 1 = 0; Motor bit 0 = 1–> Motor 1, Data Set 2S Motor bit 1 = 1; Motor bit 0 = 0–> Motor 1, Data Set 3S Motor bit 1 = 1; Motor bit 0 = 1–> Motor 1, Data Set 4DescriptionHow does aswitchover work?Description2.4.4Switchover of up to two motors, each with two data setsFor this switchover variant (MD 1013: Bit 0 + Bit 1 + Bit 2 set), up to 2 motorseach with 2 associated motor data sets can be switched.Motor bit 1 controls switchover with pulse suppression between 2 motors.Speed thresholds act on Motor bit 0 and control switchover without pulse sup-pression between the 2 data sets of a motor.Switchover is carried out via appropriately set speed thresholds in MD 1247 or MD 1248.The speed threshold for Motor 1 is parameterized in MD:1247.The speed threshold for Motor 2 is parameterized in MD:1248.A hysteresis of +/– 5% are applied around the speed thresholds to ensure di-stinct switch–on and switch–off speeds as well as an area in which switchover does not take place.Above the speed entered plus 5% hysteresis, the second motor data set is se-lected (MD 2xxx).Below the speed entered minus 5% hysteresis, the first motor data set is selec-ted (MD 1xxx).Above the speed entered plus 5% hysteresis, the fourth motor data set is selec-ted (MD 4xxx).Below the speed entered minus 5% hysteresis, the third motor data set is selec-ted (MD 3xxx).DescriptionThe following cases result:S Motor bit 1 = 0; Actual speed < 95% of MD1247–> Motor bit 0 = 0–> Motor 1, Data set 1 (MD 1xxx)S Motor bit 1 = 0; Actual speed > 95% and < 105% of MD1247–> Motor bit 0 = const.–> Motor 1, Data set 1 or 2 (depending on which is active) S Motor bit 1 = 0; Actual speed > 105% of MD1247–> Motor bit 0 = 1–> Motor 1, Data set 2 (MD 2xxx)S Motor bit 1 = 1; Actual speed < 95% of MD1248–> Motor bit 0 = 0–> Motor 2, Data set 3 (MD 3xxx)S Motor bit 1 = 1; Actual speed > 95% and < 105% of MD1248–> Motor bit 0 = const.–> Motor 2, Data set 3 or 4S Motor bit 1 = 1; Actual speed > 105% of MD1248–> Motor bit 0 = 1–> Motor 2, Data set 4 (MD 4xxx)Fig. 2-7Hysteresis2.4.5Motor data setsTable 2-8Motor data set dependent machine dataMotor data set Significance12341098209830984098Power section derating limit current 1099209930994099Power section limit current derating factor 1100210031004100Pulse–width modulation frequency1102210231024102Motor code numberNote:S When operating several list motors, the motor data isnot valid until the relevant motor code has been ent-ered and saved, and a POWER ON performed.S In the case of motor switchover with “gap” (e.g. frommotor 1 to 3), a dummy motor code must be entered forthe motor data set in between, i.e. the relevant parame-ter must not have the value 0.S After manual modification of the motor code number,the following parameters must be checked and set toappropriate values, if necessary:–MD 1401, MD 2401, MD 3401 or MD 4401(speed for maximum useful motor speed)–MD 1147, MD 2147, MD 3147 or MD 4147(speed limit)1103210331034103Rated motor current1117211731174117Motor moment of inertia1119211931194119Series reactor inductance1120212031204120P gain, current controller1121212131214121Reset time, current controller1125212531254125Ramp–up time 1 for U/f mode1126212631264126Ramp–up time 2 for U/f mode1127212731274127Voltage at f=0 U/f mode1129212931294129Cosine Phi power factor1130213031304130Rated motor output1132213231324132Rated motor voltage1134213431344134Rated motor frequency1135213531354135Motor no–load voltage1136213631364136Motor no–load current1137213731374137Stator resistance, cold1138213831384138Rotor resistance, cold1139213931394139Stator leakage reactanceTable 2-8Motor data set dependent machine data, FortsetzungMotor data set Significance32141140214031404140Rotor leakage reactance1141214131414141Magnetizing reactance1142214231424142Threshold speed field weakening 1143214331434143Upper speed, Lh characteristic 1144214431444144Gain factor, Lh characteristic 1145214531454145Breakdown torque reduction factor 1146214631464146Max. motor speed1147214731474147Speed limiting11481)214831484148Threshold speed, pull–out power 1150215031504150P gain, flux controller1151215131514151Reset time, flux controller 1160216031604160Threshold speed, flux sensing 1190219031904190Evaluation, torque limit value 1192219231924192Weight1230:82230:83230:84230:81st torque limit12312231323142312nd torque limit1232223232324232Switching speed from MD 1230 to MD 1231 1233:82233:83233:84233:8Generator limiting1234223432344234Hysteresis around MD 12321235:82235:83235:84235:81st power limit12362236323642362nd power limit1238223832384238Current limit1239223932394239Torque limit, setting–up operation 1245224532454245Threshold for speed–dependent Mset smoothing 1246224632464246Hysteresis for speed–dependent Mset smoothing 1400240034004400Rated motor speed1401:82401:83401:84401:8Max. useful motor speed1403240334034403Shutdown speed, pulse suppression1405:82405:83405:84405:8Monitoring speed, motor1407:82407:83407:84407:8P gain, speed controller1408:82408:83408:84408:8P–gain, upper adaptation speed1409:82409:83409:84409:8Reset time, speed controller1410:82410:83410:84410:8Reset time, upper adaptation speed 1411241134114411Lower adaptation speed1412241234124412Upper adaptation speedTable 2-8Motor data set dependent machine data, Fortsetzung Motor data setSignificance14321413241334134413Selection, speed controller adaptation 1417:82417:83417:84417:8nx for ”nact < nx” signal 1418:82418:83418:84418:8nmin for ”nact < nmin” signal 1426:82426:83426:84426:8Tolerance band for ”nset=nact” signal 1451:82451:83451:84451:8P gain, induction motor speed controller 1453:82453:83453:84453:8Reset time, induction motor speed controller 1458245834584458Current setpoint open–loop controlled range, IM 1459245934594459Torque smoothing time constant, IM 1465246534654465Switchover speed, MSD/IM1466246634664466Switchover speed, closed–loop/open–loop control, IM 1602260236024602Threshold for motor overtemperature warning 1607260736074607Shutdown limit, motor temperature 1608260836084608Fixed temperature1711271137114711Significance, speed representation 17121)271237124712Significance, rotor flux representation 17131)271337134713Significance, torque representation 1714271437144714Significance, rotor position representation 17251)272537254725Normalization, torque setpoint1)These parameters are read–only.A separate power section frequency pulse–width modulation can be configured for each motor data set (MD 1100).Switchover of the frequency pulse–width modulation permits better matching to the speed requirements of the motor. In this way, it is also possible to operate at higher speeds with a higher pulse frequency.The frequency pulse–width modulation should always be approx. 6 times that of the maximum motor frequency at least.High frequency pulse–width modulation also means high switching losses, ho-wever, and therefore poor utilization.At a frequency pulse–width modulation of 8 kHz, only 40–55% of the possible current at 3.2kHz is actually available.Pulse frequency switchover。

车间常用英语一、车间基本介绍车间是指工厂或生产单位中进行生产加工的场所，是生产流程中的核心部门。

车间通常由各种设备、机械、工具和工人组成，用于生产、制造和加工产品。

二、车间常用英语词汇1. Equipment（设备）- Machinery（机械）- Tools（工具）- Conveyor belt（传送带）- Crane（起重机）- Forklift（叉车）- Welding machine（焊接机）- Cutting machine（切割机）- Press machine（压力机）- Packaging machine（包装机）- Assembly line（装配线）2. Production（生产）- Manufacturing（制造）- Processing（加工）- Assembly（装配）- Inspection（检查）- Quality control（质量控制）- Efficiency（效率）- Productivity（生产率）- Output（产量）- Waste reduction（减少浪费）3. Safety（安全）- Protective equipment（防护设备）- Safety goggles（安全护目镜）- Safety helmet（安全头盔）- Safety gloves（安全手套）- Fire extinguisher（灭火器）- Emergency exit（紧急出口）- First aid kit（急救箱）- Safety training（安全培训）- Hazardous materials（危险物质）- Accident prevention（事故预防）4. Production Process（生产流程）- Raw materials（原材料）- Work in progress（生产中的产品）- Finished products（成品）- Assembly instructions（装配说明）- Production schedule（生产计划）- Quality inspection（质量检查）- Packaging and labeling（包装和标签）- Inventory management（库存管理）- Order fulfillment（订单执行）- Shipping and logistics（运输和物流）5. Job Positions（职位）- Supervisor（主管）- Operator（操作员）- Technician（技术员）- Engineer（工程师）- Quality inspector（质检员）- Maintenance staff（维修人员）- Production planner（生产计划员）- Warehouse manager（仓库经理）- Logistics coordinator（物流协调员）- Safety officer（安全员）6. Communication（沟通）- Instructions（指示）- Report（报告）- Meeting（会议）- Announcement（公告）- Memorandum（备忘录）- Email（电子邮件）- Conversation（对话）- Training session（培训会议）- Feedback（反馈）- Collaboration（合作）7. Quality（质量）- Defect（缺陷）- Non-conformance（不符合）- Standard（标准）- Specification（规格）- Quality control plan（质量控制计划）- Quality assurance（质量保证）- Continuous improvement（持续改进）- Root cause analysis（根本原因分析）- Corrective action（纠正措施）- Customer satisfaction（客户满意度）8. Maintenance（维护）- Preventive maintenance（预防性维护）- Breakdown（故障）- Repair（修理）- Lubrication（润滑）- Calibration（校准）- Replacement（更换）- Troubleshooting（故障排除）- Downtime（停机时间）- Spare parts（备件）- Equipment reliability（设备可靠性）9. Lean Manufacturing（精益生产）- Waste（浪费）- 5S methodology（5S方法论）- Value stream mapping（价值流图）- Kaizen（改善）- Just-in-time (JIT)（准时生产）- Kanban system（看板系统）- Poka-yoke（防错）- Standardized work（标准化工作）- Continuous flow（连续流）- Visual management（可视化管理）10. Performance Evaluation（绩效评估）- Key performance indicators (KPIs)（关键绩效指标）- Productivity rate（生产率）- Efficiency ratio（效率比率）- Defect rate（缺陷率）- Downtime percentage（停机时间百分比）- Cycle time（生产周期）- OEE (Overall Equipment Effectiveness)（设备综合效率）- Scrap rate（废品率）- Employee turnover rate（员工流动率）- Customer complaints（客户投诉）三、结语以上是车间常用英语的一些词汇和表达，通过学习这些常用术语，您可以更好地理解和参与车间的工作和沟通。

A B C D E F G H I J K L M N O P Q R S T U V W X Y ZABNORMAL FAILURE: An artificially induced failure of a component, usually as a result of “abnormals” testing for regulatory agency safety compliance.AMBIENT TEMPERATURE: The temperature of the environment, usually the still air in the immediate proximity of the power supply.APPARENT POWER: A value of power for AC circuits that is calculated as the product of RMS current times RMS voltage, without taking the power factor into account.BANDWIDTH: A range of frequencies over which a certain phenomenon is to be considered.BIPOLAR TRANSISTOR: A transistor operates by the action of minority carries across a P/N junction, and is a current controlled device as opposed to a voltage controlled device.BLEEDER RESISTOR: A resistor added to a circuit for the purpose of providing a small current drain, usually to provide a load for improving output voltage stability, or to assure discharge of capacitors.BOBBIN: A device upon which the windings of a transformer or inductor are wound which provides a form for the coil and insulates the windings from the core.BODE PLOT: A graphic plot of gain versus frequency for a control loop,typically used to verify control loop stability, including phase margin.BREAKDOWN VOLTAGE: A voltage level at which dielectric insulation fails by excessive leakage current or arcing. In reference to power supplies the breakdown voltage is the maximum AC or DC voltage that can be supplied from input to output and/or chassis.BRIDGE CONVERTER: A DC to DC converter topology(configuration)employing four active switching components in a bridge configuration across a power transformer.BRIDGE RECTIFIER: A full wave rectifier circuit employing four rectifiers in a bridge configuration.BROWNOUT:A reduction of the AC mains’ distribution voltage, usually caused deliberately by the utility company to reduce power consumption when demand exceeds generation or distribution capacity.BROWNOUT PROTECTION: The ability of a power supply to continue operating within specification through the duration of a brownout.BURN-IN: Operating a newly manufactured power supply, usually at rated load, for a period of time in order to force component infant mortality failures or other latent defects before the unit is delivered to a customer.CAPACITIVE COUPLING: Coupling of a signal between two circuits, due to discrete or parasitic capacitance between the circuits.CERTER TAP: An electrical connection made at the center of a transformer or inductor winding, usually so as to result in an equal number of turns on either side of the tap.CENTERING: The act of setting the output voltage of a power supply under specified load conditions, usually an auxiliary output of a multiple output power supply with all outputs at half load.COMMON MODE NOISE: Noise present equally on two conductors with respect to some reference point; often used specifically to refer to noise present on both the hot and neutral AC lines with respect to ground.CONSTANT CURRENT POWER SUPPLY: A power supply designed to regulate the output center for changes in line, load, ambient temperature, and drift resulting from time.CONSTANT VOLTAGE POWER SUPPLY: A power supply designed to regulate the output voltage for changes in line, load, ambient temperature, and drift resulting from time.CONTROL CIRCUIT: A circuit in a closed-loop system, typically containing an error amplifier, which controls the operation of the system to achieve regulation.CONVECTION: The transfer of thermal energy in a gas or liquid by currents resulting from unequal temperatures.CONVERTER: An electrical circuit accepts a DC input and generates a DC output of a different voltage, usually achieved by high frequency switching action employing inductive and capacitive filter elements.COOLING: Removal of heat in a power supply, is generated by transformation, rectification, regulation, and filtering. It can be accomplished using radiation, convection, forced air, or liquid means.CREST FACTOR: In an AC circuit, Crest Factor is the mathematical ratio of the peak to RMS values of a waveform. Crest factor is sometimes used for describing the current stress in AC mains supply wires, since for a given amount of power transferred, the RMS value, and hence the losses, become greater with increasing peak values. Crest Factor gives essentially the same information as Power Factor, and is being replaced by Power Factor in power supply technology.CROSS REGULATION: The effect of a load change on one output to the regulation of another output. It usually only applies to non-post-regulated (quasi) outputs.CROWBAR: An over-voltage protection method shorts the power supply output to ground in order to protect the load when an over-voltage fault is detected..CURRENT LIMITING: An overload protection circuit that limits the maximum output; current of a power supply in order to protect the load and/or the power supply.CURRENT MODE:A control method for switch-mode converters where the converter adjusts its regulating pulse width in response to measured output current and output voltage, using a dual loop control circuit. Since output current is measured, current mode control allows accurate sharing between power supplies.CURRENT MONITOR: An analog power supply signal which is linearly proportional to output current flow. Usually only feasible for single output power supplies.DERATING: A reduction is an operating specification to improve reliability. For power supplies, it is usually a specified reduction in output power to facilitate operation at higher temperatures.DESIGN LIFE: The expected lifetime of a power supply during which it will operate to its published specifications.DEFFERENTIAL MODE NOISE:Noise that is measured between two lines with respect to a common reference point excluding common-mode noise. The resultant measurement is the difference of the noise components of the two lines. The noise between the DC output and DC return is usually measured in power supplies.DRIFT: The change in an output voltage, after a warm-up period, as a function of time when all other variables such a line, load and operating temperature are held constant.DROPOUT: The lower limit of the AC input voltage where the power supply just begins to experience insufficient input to maintain regulation. The dropout voltage for linears is quite load dependent. For most switchers it is largely design dependent, and to a smaller degree load dependent.EFFICIENCY: The ratio of total output power to input power expressed as a percentage. Normally specified at full load and nominal input voltage.ELECTRONIC LOAD: An electronic device designed to provide a load to the outputs of a power supply, usually capable of dynamic loading, and frequently programmable or computer controlled.EMI: Abbreviation for Electromagnetic interference, which is the generation of unwanted noise during the operation of a power supply or other electrical or electronic equipment.ESR: Equivalent Series Resistance. The value of resistance in series with an ideal capacitor which duplicates the performance characteristics of a real capacitor.FAULT MODE INPUT CURRENT: The input current to a power supply with a short circuit on the output.FERRORESONANT POWER SUPPLY:Power supply used at higher power levels in fixedapplications, since they are very heavy. Can only be used effectively when the line frequency is very stable as they are sensitive to variations of input AC frequencies.FET: Field Effect Transistor, a majority carrier voltage controlled transistor.FILTER: A frequency-sensitive network that attenuates unwanted noise and ripple components of a rectified output.FLOATING OUTPUT: An output of a power supply that is not connected or referenced to any other output, usually denotes full galvanic isolation. They generally ca be used as either positive or negative outputs. Non-floating outputs share a common return line, and are hence DC referenced to one another.FLYBACK CONVERTER: The flyback converter is the simplest type of switcher. In most cases, it uses one switch and only needs one magnetic element- the transformer. Flybacks are limited to outputs of generally lower than 200 Watts.FOLDBACK CURRENT LIMITING: A type of protection circuit where the output current decreases as the overload increases. The output current reaches a minimum as the load approaches a short-circuit condition.FORWARD CONVERTER: Similar to flyback converter but the forward converter stores energy in the inductor instead of the transformer.FULL BRIDGE FORWARD CONVERTER: The full bridge is more complex than other switcher topologies. It has the capability for very high performance. It can product high power with four switchers and requires only two magnetic elements.GROUND: An electrical connection to earth or some other conductor that is connected to earth. Sometimes the term “ground” is used in place of “common”, but such usage is not correct unless the connection is also connected to earth.GROUND LOOP: An unintentionally induced feedback loop caused by two or more circuits sharing a common electrical ground.HA VERSINE: A waveform that is sinusoidal in nature, but consists of a portion of a sine wave superimposed on another waveform. The input current waveform to a typical off-line power supply has the form of a haversine.HEADROOM: Used in conjunction with series pass regulators, and is the difference between the input and output voltage.HEATSINK: Device used to conduct away and disperse the heat generated by electronic components.HIPOT: Abbreviation for High Potential, and generally refers to the high voltages used to test dielectric withstand capability for regulatory agency electrical safety requirements.HOLD-UP TIME: The length of time a power supply can operate in regulation after failure of the ACinput. Linears have very short hold-up times due to the CV squared energy storage product of their low voltage secondary side output capacitors. Switcher have longer times due to their higher voltage primary side energy storage capacitors.INDUCED NOISE: Noise generated in a circuit by a varying magnetic field produced by another circuit.INHIBIT: The ability to electrically turn off the output of a power supply from a remote location.INPUT LINE FILTER: An internally or externally mounted low pass or band-reject filter at the power supply input which reduces the noise fed into the power supply.INRUSH CURRENT: The peak current flowing into a power supply the instant AC power is applied. This peak is usually much higher than the steady state input current due to the charging of the input filter capacitors.INRUSH CURRENT LIMITING: A circuit which limits the amount of inrush current when a power supply is turned on.INVERTER: A power supply which produces an AC output, usually from a DC input.ISOLATION: Two circuits that are completely electrically separated with respect to DC potentials, and almost always also AC potentials. In power supplies, it is defined as the electrical seperation of the input and output via the transformer.ISOLATION VOLTAGE: The maximum AC or DC voltage which maybe continuously applied from input to output and/or chassis of a power supply.LAYER WINDING: A transformer winding technique where the primary and secondary windings are wound over each other and separated by an insulation layer.LEAKAGE CURRENT: A term relating to current flowing between the AC supply wires and earth ground. The term does not necessarily denote a fault condition. In power supplies, leakage current usually refers to the 60 Hz current which flows through the EMI filter capacitors which are connected between the AC lines and ground (Y caps).LINE REGULATION: The change in output voltage when the AC input voltage is changed from minimum to maximum specified. It is usually a small value, and may be near zero with current mode control.LINEAR REGULATOR: A regulating technique where a dissipative active device such as a transistor is placed in series with a power supply output to regulate the output voltage.LOAD REGULATION: The change in output voltage when the load on the output is changed.LOCAL SENSING: Using the voltage output terminals of the power supply as sense points forvoltage regulation.LOGIC ENABLE: The ability to turn a power on and off with a TTL signal. A logic low generally turns the supply off; a logic high turns it on.LONG TERM STABILITY: Power supply output voltage change due to time with all other factors held constant. This expressed in percent and is a function of component aging.MAGNETIC AMPLIFIER: Sometimes abbreviated “Mag Amp”, a saturating inductor which is placed in series with a power supply output for regulation purposes.MAINS: The utility AC power distribution wires.MARGINING: Adjusting a power supply output voltage up or down from its minimal setting in order to verify system performance margin with respect to supply voltage. This is usually done electrically by a system-generated control signal.MINIMUM LOAD: The minimum load current/power that must be drawn from the power supply in order for the supply to meet its performance specifications. Less frequently, a minimum load is required to prevent the power from failing.MODULAR: A physically descriptive term used to describe a power supply made up of a number of separate subsections, such as an input module, power module, or filter module. Modular construction tends to lower the MTBF.MTBF: (Mean Time Between Failures) may be calculated or demonstrated. The usual calculation is per Mil-Std 217 rev E. Demonstrated reliability is usually determined by temperature accelerated life testing. Demonstrated MTBF is almost always greater than calculated MTBF.NOISE: Noise is the aperiodic, random component of undesired deviations in output voltage. Usually specified in combination with ripple.See: PARD and also: Ripple.NORMAL V ALUE: A usual, average, normal, or expected operating condition. This stated value will probably not be equal to the value actually measured.OFF LINE: A power supply which receives its input power from the AC line, without using a 50/60 Hz power transformer prior to rectification a nd filter, hence the term “off line” power supply.OPEN FRAME: A power supply where there is no external metal chassis; the power supply is provided to the end user essentially as a printed circuit board which provides mechanical support as well as supporting the components and making electrical connections.OPTOISOLATOR: An electro-optical device which transmits a signal across a DC isolation boundary.OUTPUT GOOD:A power supply statue signal which indicates that the output voltage is within acertain tolerance. An output which is either too high or too low will deactivate the Output Good signal.OUTPUT IMPEDANCE: The ratio of change in output voltage to change in load current.OUTPUT NOISE:The AC component that may be present on the DC output of a power supply. Switch-mode power supply output noise has two components; a lower frequency component at the switching frequency og the converter and a high frequency component due to fast edges of the converter switching transitions. Noise should always be measured directly at the output terminals with a scope probe having an extremely short grounding lead.OVERLOAD PROTECTION: A power supply protection circuit that limits the output current under overload conditions.OVERSHOOT: A transient output voltage change which exceeds the high limit of the voltage accuracy specification and is caused by turning the power supply on or off, or abruptly changing line or load conditions.OVERTEMP WARNING: A TTL compatible signal which indicates that an over-temperature condition exists in the power supply. Most commercial power supplies are designed to shut down if an over-temperature condition exists.OVERVOLTAGE PROTECTION: A circuit which either shuts down the power supply or crowbars the output in the event of an over-voltage condition.PARALLEL OPERATION: Connecting the outputs of two or more power supplies with the same output voltage for the purpose of obtaining a higher output current. This requires power supplies specially designed for load sharing.PARD: Periodic and random deviation, referring to the sum of all ripple and noise components on the DC output of a power supply, regardless of nature or source.PEAK POWER: The absolute maximum output power that a power supply can produce without immediate damage. Peak power capability is typically well beyond the continuous reliable output power capability and should only be used infrequently.POST REGULATOR: A secondary regulating circuit on an auxiliary output of a power supply to provide full regulation on that output.POWER FACTOR: The ratio of true power to apparent power in an AC circuit. In power conversion technology, power factor is used in conjunction with describing the AC input current to the power supply.POWER FAIL: A power supply interface signal which gives a warning that the input voltage will no longer sustain full power regulated output.PRELOAD: A small amount of current drawn from a power supply to stabilize its operation. Preloadsare usually provided by a bleeder resistor.PRIMARY: The input section of an isolated power supply which is connected to the AC mains and hence has dangerous voltage levels present.PULSE WIDTH MODULATION (PWN): A switching power conversion technique where the on-line (or width) of a duty cycle is modulated to control power transfer for regulating power supply outputs.PUSH-PULL CONVERTER: A switch mode power supply topology which utilizes a center-tapped transformer and two power switches. The two switches are alternately driven on and off.QUASI REGULATED OUTPUT: The regulation of an auxiliary output that is accomplished by regulation of the main output. A transformer turns ratio, commensurate with the desired auxiliary output voltage, is used in conjunction with the output around which the main control loop is closed. Quasi regulated outputs can be reasonably well regulated, but are significantly affected by second order effects in the converter.RATED OUTPUT CURRENT: The maximum load current that a power supply can provide at a specified ambient temperature.REFLECTED RIPPLE CURRENT: The RMS or peak-to-peak AC current present at the input of the power supply which is a result of the switching frequency of the converter.REGULATION: The ability of a power supply to maintain an output voltage within a specified tolerance as referenced to changing conditions of input voltage and/or load.REGULATION BAND: The total error band allowable for an output voltage. This includes the effects of all of the types of regulation: line, load, and cross.REMOTE INHIBIT: A power supply interface signal, usually TTL compatible, which commands the power supply to shut down one or all outputs.REMOTE SENSE: Wires connected in parallel with power supply output cables such that the power supply can sense the actual voltage at the load to compensate for voltage drops in the output cables and/or isolation devices.RETURN: The designation of the common terminal for the power supply outputs. It carries the return current for the outputs.REVERSE VOLTAGE PROTECTION:A protection circuit that prevents the power supply from being damaged in the event that a reverse voltage is applied at the input or output terminals.RFI: An abbreviation for Radio Frequency Interference, which is undesirable noise produced by a power supply or other electrical or electronic device during its operation. In power supply technology, RFI is usually taken to mean the same thing as EMI.RIPPLE AND NOISE: The amplitude of the DC output of a power supply usually expressed in millivolts peak-to-peak or RMS. For a linear power supply it is usually the switching frequency of the converter stage.SAFETY GROUND: A conductive path to earth that is designed to protect persons from electrical shock by shunting away any dangerous currents that might occur due to malfunction or accident. SECONDARY: The output section of an isolated power supply which is isolated from the AC mains and specially for safety of personnel who night be working with power on the system.SELV:An abbreviation for Safety Extra Low V oltage, a term generally defined by the regulatory agencies as the highest voltage that can be contacted by a person and not cause injury. It is often specifically defined as 30 VAC or 42.4 VDC.SEQUENCING: The technique of establishing a desired order of activating the outputs of a multiple output power supply.SOFT LINE: A condition where there is substantial impedance present in the AC mains feeding input power to a power supply. The input voltage to the power supply drops significantly with increasing load.SOFT START: A technique for gradually activating a power supply circuit when the power supply is first turned on. This technique is generally used to provide a gradual rise in output voltage and inrush current limiting.SPLIT BOBBIN WINDING: A transformer winding technique where the primary and secondary are wound side-by-side on a bobbin with an insulation barrier between them.STANBY CURRENT: The input current drawn by a power supply when shut down by a control (remote inhibit) or under no load.STIFF LINE: A condition where there is no significant impedance in the AC mains feeding input power to a power supply. The input power supply does not change appreciably with load.SWITCHING FREQUENCY: The rate at which the DC voltage is switched on and off during the pulse width modulation process in a switching power supplyTEMPERATURE COEFFICIENT: The average output voltage change expressed as a percent per degree centigrade of ambient temperature change. This is usually specified for a pre-determined temperature range.TEMPERATURE DERATING: Reducing the output power of a power supply with increasing temperature to maintain reliable operation.THERMAL PROTECTION: A power supply protection circuit which shuts the power supply down in the event of unacceptably high internal temperatures.TOPOLOGY: The design type of a converter, indicative of the configuration of switching transistors, utilization of the transformer, and type of filtering. Examples of topologies are the Flyback, Forward, Half-Bridge, and Resonant.TRACKING: A characteristic in a multiple output power supply where any changes in the output voltage of one output caused by line, load, and/or temperature are proportional to similar changes in accompanying outputs.TRANSIENT RECOVERY TIME: The time required for an output voltage to be within specified accuracy limits after a step change in line or load conditions.TRUE POWER: In an AC circuit, true power is the actual power consumed. It is distinguished from apparent power by eliminating the reactive power component that may be present.UNDERSHOOT: A transient output voltage change which does not meet the low limit of the voltage accuracy specification and is caused by turning the power supply on or off, or abruptly changing line or load conditions.UPS: (Uninterruptible Power Supply). A power supply which continues to supply power during a loss of input power, Two types are the stand-alone UPS, which is located external to the equipment being powered, and the battery back-up power supply, which is embedded in the equipment being powered, such as a POWER-ONE SPM series high power product with a G5 battery back-up module.VOLTAGE BALANCE: The difference in magnitudes, in percent, of two output voltages that have equal nominal voltage magnitudes but opposite polarities.VOLTAGE MODE: A method of closed loop control of a switching converter where the pulse width is varied in response to changes in the output voltage to regulate the output.WARM-UP DRIFT: The initial change in the output voltage of a power supply in the time period between turn-on and when the power supply reaches thermal equilibrium at 25 degrees Centigrade, full load and nominal line.WARM-UP TIME: The time required after initial turn on for a power supply to achieve compliance to its performance specifications.。