IBM Rethinking Mobile Email

逸信通-手机移动信息服务平台北京华胜天成科技股份有限公司2007年4月什么是移动信息化?移动信息化是指将移动通信技术应用于信息化领域，或者是将企业内有线网络环境下的传统信息化方案扩展到无线网络环境中，从而帮助企业管理软件满足企业管理随时随地的需求。

移动信息化基本特征是随时、随地、随身，真正意义上的“以人为本”和个人特色紧密相连。

在这个意义上，只有实现了移动信息化，才最终实现了信息化。

我们身处的办公环境-移动当移动用户遇到这些问题怎么办?移动通讯手段第二天的会议需要尽快通知相关人员用户购买的产品需要提供支持服务行情大幅变化需要尽快调整股市投资商旅途中需要安排下一目的地的航班紧急公文需要老板签发招投标商务报价需要财务人员审核与客户谈判中需要获得公司业务报表远程维护需要现场的第一手材料逸信通移动信息化应用方向从行业应用角度讲，移动信息化应用正向纵深向发展，正逐步应用到商务、医疗、教育、城市建设、农业、工业改造等多个行业，而且在每一行业内的应用，已不单单是移动通信工具的简单使用，而是将移动网络和资源应用到某行业或企业的管理、财务、生产、运作、销售等价值链条上的多环节，实现融合应用，在每一个环节上的应用不仅要改善本环节的经济效益，更要考虑环节间的协调、共同发展，在一定程度上突破了地域、时间上的局限。

从业务或工程应用角度将，移动信息化正对一些传统产业进行一次革新，对流程重组、企业再造、数字化建设、服务提升、增强核心竞争力等方面有鲜明的改善。

移动信息化带来的价值提升客户服务感受提高面向客户服务的主动性缩短客户等待时间，加快服务进程 节省企业改造已有系统带来的原有投资的浪费 避免普通远程办公方式带来的通讯费用 促进虚拟团队的实现提高跨部门、跨地区工作的响应速度充分利用差旅途中的时间缩短日常工作的处理周期减少通过电话授权方式带来的不确定的因素促进企业文化的建设形成高效与协作的工作氛围形成主动服务的工作态度捕获更多的市场商机无需借助笨重的PC 设备即可了解互联网信息 远程快速获取企业内部信息 及时跟进市场动态避免错失时机造成不必要的损失 高效的服务感受带来稳定的客户合作逸信通移动信息化是必然趋势创”移动+互联”的新型信息化之路!大型企业移动信息化典型需求¾要适用于原不同复杂IT系统的手机应用延伸，包括ERP、OA、CRM、SCM邮件和企业门户等,建设无线应用门户；¾应用系统接入要简单，避免原IT系统改造,避免原IT系统集成商配合；¾手机终端要能够集中展现不同原系统的完整应用操作；¾安全性要高，不能影响原IT系统的操作和系统结构，不能直接对原IT系统数据库进行读写操作,保证通过GPRS网络访问企业内部系统时是安全可靠的；产品背景当前移动信息化解决方法绝大部分都是基于SMS、MMS或 WAP方式的解决方案，这些类型的解决方案存在如下问题： 一、对于用户而言，SMS、MMS或WAP方式表现能力较弱， 用户很难通过简单的文本短信或WAP页面实现在企业运营中的 OA、ERP、CRM、MAIL等业务的显示和操作。

IBM System x3400 M3 (Withdrawn)Product Guide (withdrawn product)The System x3400 M3 servers are self-contained, high-performance, 5U tower systems designed for web and business server applications in remote or distributed environments. These servers are highly scalable in configuration, performance, and availability. They offer two-way SMP power with the latest Intel Xeon 5600 series processors, a dual connector 8-port SAS/SATA RAID controller on hot-swap models, an embedded Gigabit Ethernet controller, and six PCI Express 2.0 slots. These servers support SATA or SAS HDDs.These servers are flexible tower models that deliver the best blend of power, manageability, expandability, and serviceability. They meet the requirements of server applications in the small-to-medium businesses that need an affordable general-purpose network server. These servers fit into business environments where tower configurations are required. Figure 1 shows the IBM® System x3400 M3.Figure 1. The IBM System x3400 M3Did you know?The System x3400 M3 server supports optional spare DIMMs, memory mirroring, and RAID-0, RAID-1, and RAID-1E support standard with optional RAID-5, RAID-6, RAID-10, and RAID-50 available. It features large amounts of internal expansion and I/O support. Comprehensive systems management tools such as advanced diagnostics, Predictive Failure Analysis, and the ability to control resources from a single point make it easy to deploy, integrate, service, and manage from any location.Click here to check for updatesFigure 2. Front view of the IBM System x3400 M3Figure 3. Rear view of the IBM System x3400 M3Figure 4 shows the locations of key components inside the server.Figure 4. Inside view of the IBM System x3400 M3 Standard specificationsThe following table lists the standard specifications. Table 1. Standard specificationsStandard modelsThe following table lists the standard models. Table 2. Standard modelsModel†Intel Processor*(2 maximum)RAM DiskcontrollerDisk bays(std/max)Disks Network Optical PowersupplyModels announced February 20117378/ 7379-A2x 1x E5603 4C 1.60GHz4 MB 1066 MHz1x 2GBIntegratedSATA(no RAID)4x 3.5"SS / 4Open 2 x GbE DVD1x 670 WFixed7378/ 7379-A4x 1x E5603 4C 1.60GHz4 MB 1066 MHz1x 2GBServeRAIDBR10il v24x 3.5"HS / 4Open 2 x GbE DVD1x 670 WFixed7378/ 7379-B2x 1x E5606 4C 2.13GHz8 MB 1066 MHz1x 2GBIntegratedSATA(no RAID)4x 3.5"SS / 4Open 2 x GbE DVD1x 670 WFixed7378/ 7379-B4x 1x E5606 4C 2.13GHz8 MB 1066 MHz1x 2GBServeRAIDBR10il v24x 3.5"HS / 4Open 2 x GbE DVD1x 670 WFixed7378/ 7379-C2x 1x E5607 4C 2.26GHz8 MB 1066 MHz1x 2GBServeRAIDBR10il v24x 3.5"HS / 4Open 2 x GbE DVD1x 670 WFixed7378/ 7379-56x 1x E5620 4C 2.40GHz12 MB 1066 MHz1x 4GBServeRAIDBR10il v24x 3.5"HS / 4Open 2 x GbE DVD1x 670 WFixed7378/ 7379-58x 1x E5620 4C 2.40GHz12 MB 1066 MHz1x 4GBServeRAIDM10158x 2.5"HS / 16Open 2 x GbE DVD 1 x 920 WHot-swap7378/ 7379-D2x 1x E5645 6C 2.40GHz12 MB 1333 MHz1x 4GBServeRAIDM10158x 2.5"HS / 8Open 2 x GbE DVD1x 670 WFixed7378/ 7379-F2x 1x E5649 6C 2.53GHz12 MB 1333 MHz1x 4GBServeRAIDM501416x 2.5"HS / 16Open 2 x GbE DVD 1 x 920 WHot-swap† The x3400 M3 is available as machine type 7378 with a 1-year warranty (AP only) or as machine type 7379 with a 3-year warranty. This is the only difference between systems of the same model (for example, comparing 7378-A2x and 7379-A2x).* In the processor column: Standard quantity of processors, processor model, core speed, cores, L3 cache, memory speed.Refer to the Standard Specifications section for information about standard features of the server.Express modelsThe following table lists the region-specific Express models. Express models are preconfigured with additional components, such as processors and memory, to make the ordering and installation process simpler.Table 3. Express modelsRegion/ model Processor* (2maximum)Memory RAIDcontrollerDiskbays(std /max)Disks Network Optical PowersupplyNA and LA7379-E1U 1x Xeon E5503 2.0GHz 2C 4 MB 800MHz3x 2 GB BR10il v24x 3.5"SS / 4Optional2x GbE DVD-ROM1x 670W7379-E2U 1x Xeon E5506 2.13GHz 4C 4 MB 800MHz3x 4 GB BR10il v24x 3.5"HS / 4Optional2x GbE DVD-ROM1x 670W7379-E3U 1x Xeon E5620 2.40GHz 4C 12 MB 1066MHz3x 4 GB M10158x 2.5"HS / 16Optional2x GbE DVD-ROM1x 920WNE and SW IOT7379-K1G 1x Xeon E5503 2.0GHz 2C 4 MB 800MHz1x 2 GB BR10il v24x 3.5"SS / 4Optional2x GbE DVD-ROM1x 920W7379-K2G 1x Xeon E5506 2.13GHz 4C 4 MB 800MHz1x 4 GB M10154x 3.5"HS / 8Optional2x GbE Multiburner1x 920W7379-K3G 1x Xeon E5507 2.26GHz 4C 4 MB 800MHz1x 4 GB M1015 +AdvanceFeatureKey8x 2.5"HS / 16Optional2x GbE Multiburner1x 920W7379-K4G 1x Xeon E5620 2.40GHz 4C 12 MB 1066MHz1x 4 GB M1015 +AdvanceFeatureKey8x 2.5"HS / 16Optional2x GbE Multiburner2x 920W7379-K8G 1x Xeon E5506 2.13GHz 4C 4 MB 800MHz1x 4 GB M50144x 3.5"HS / 8Optional2x GbE Multiburner2x 920W7379-KDG 1x Xeon E5620 2.40GHz 4C 12 MB 1066MHz1x 4 GB M50148x 2.5"HS / 162x 146 GB2x GbE Multiburner1x 920W7379KXG1x Xeon E5607 2.26GHz 4C 8 MB 1333MHz 1x 4 GB M10158x 2.5"HS / 8Optional2x GbE Multiburner1x 670W7379KZG1x Xeon E5620 2.4GHz 4C 12 MB 1333MHz 1x 2 GB M50146x 2.5"HS / 8Optional2x GbE Multiburner1x 670WCEE and MEA IOT7379-K5G 1x Xeon E5506 2.13GHz 4C 4 MB 800MHz2x 4 GB M10154x 3.5"HS / 8Optional2x GbE Multiburner1x 920W7379-K6G 1x Xeon E5506 2.13GHz 4C 4 MB 800MHz1x 4 GB M50148x 2.5"HS / 162x 146 GB2x GbE Multiburner2x 920W7379-K8G 1x Xeon E5506 2.13GHz 4C 4 MB 800MHz1x 4 GB M50144x 3.5"HS / 8Optional2x GbE Multiburner2x 920W7379-KDG 1x Xeon E5620 2.40GHz 4C 12 MB 1066MHz1x 4 GB M50148x 2.5"HS / 162x 146 GB2x GbE Multiburner1x 920W7379-KBG 1x Xeon E5620 2.40GHz 4C 12 MB 1066MHz1x 4 GB M50144x 3.5"HS / 8Optional2x GbE Multiburner1x 920WRCIS7379-K9G 1x Xeon E5506 2.13GHz 4C 4 MB 800MHz1x 4 GB M50144x 3.5"HS / 8Optional2x GbE Multiburner1x 920W7379-KAG 1x Xeon E5506 2.13GHz 4C 4 MB 800MHz1x 4 GB M5014 +Battery4x 3.5"HS / 8Optional2x GbE Multiburner1x 920W7379-KBG 1x Xeon E5620 2.40GHz 4C 12 MB 1066MHz1x 4 GB M50144x 3.5"HS / 8Optional2x GbE Multiburner1x 920W7379-KCG 1x Xeon E5620 2.40GHz 4C 12 MB 1066MHz2x 4 GB M5015 +Battery8x 2.5"HS / 16Optional2x GbE Multiburner1x 920WJapan7379-PAM 1x Xeon E5503 2.0GHz 2C 4 MB 800MHz2x 2 GB BR10il v24x 3.5"HS / 82x 1 TB2x GbE DVD-ROM1x 920W7379-PAN 1x Xeon E5506 2.13GHz 4C 4 MB 800MHz2x 2 GB M5014 +Battery4x 3.5"HS / 83x 300 GB2x GbE DVD-ROM1x 920WChina7379-I011x Xeon E5506 2.13GHz 4C 4 MB 800MHz 1x 4 GB M10158x 2.5"HS / 81x 146 GB2x GbE DVD-ROM1x 670W7379-I051x Xeon E5506 2.13GHz 4C 4 MB 800MHz 1x 4 GB M5015 (nobattery)8x 2.5"HS / 81x 146 GB2x GbE DVD-ROM1x 670W7379-I211x Xeon E5620 2.40GHz 4C 12 MB 1066MHz 1x 4 GB M10158x 2.5"HS / 81x 146 GB2x GbE DVD-ROM1x 670W7379-I251x Xeon E5620 2.40GHz 4C 12 MB 1066MHz 1x 4 GB M5015 (nobattery)8x 2.5"HS / 81x 146 GB2x GbE DVD-ROM1x 670WISA7379-I4S1x Xeon E5506 2.13GHz 4C 4 MB 800MHz 1x 2 GB BR10i4x 3.5"SS / 41x 250 GB2x GbE DVD-ROM1x 670W7379-I3S1x Xeon E5507 2.26GHz 4C 4 MB 800MHz 1x 4 GB BR10i8x 2.5"HS / 161x 146 GB2x GbE DVD-ROM2x 920WHong Kong7379-I5H1x Xeon E5506 2.13GHz 4C 4 MB 800MHz 2x 2 GB M50144x 3.5"HS / 4Optional2x GbE DVD-ROM1x 670W* In the processor column: standard quantity of processors, processor model, core speed, cores, L3 cache, memory speed.Processor optionsThe server supports the processor options listed in the following table. The server supports up to two processors. The table also shows which server models have each processor standard. If there is no corresponding where-used model for a particular processor, then this processor is only available through CTO.Table 4. Processor optionsFeature code**Description Standard modelswhere usedIntel Xeon 5600 series processorsA0VC / A0VD Intel Xeon Processor E5603 4C 1.60GHz 4 MB Cache 1066MHz 80w A2x, A4xA0VE / A0VF Intel Xeon Processor E5606 4C 2.13GHz 8 MB Cache 1066MHz 80w B2x, B4xA0VG / A0VH Intel Xeon Processor E5607 4C 2.26GHz 8 MB Cache 1066MHz 80w C2x4493 / 4631Intel Xeon Processor E5620 4C 2.40GHz 12 MB Cache 1066MHz 80w52x, 54x, 56x, 58x 4494 / 4632Intel Xeon Processor E5630 4C 2.53GHz 12 MB Cache 1066MHz 80w62x4495 / 4633Intel Xeon Processor E5640 4C 2.66GHz 12 MB Cache 1066MHz 80w72x, 74xA0VJ / A0VK Intel Xeon Processor E5645 6C 2.40GHz 12 MB Cache 1333MHz 80w D2xA0VL / A0VM Intel Xeon Processor E5649 6C 2.53GHz 12 MB Cache 1333MHz 80w F2x0723 / 7683Intel Xeon Processor L5609 4C 1.86GHz 12 MB Cache 1066MHz 40w-0722 / 7682Intel Xeon Processor L5630 4C 2.13GHz 12 MB Cache 1066MHz 40w-0721 / 7681Intel Xeon Processor L5640 6C 2.26GHz 12 MB Cache 1333MHz 60w-4496 / 4634Intel Xeon Processor X5650 6C 2.66GHz 12 MB Cache 1333MHz 95w-4497 / 4635Intel Xeon Processor X5660 6C 2.80GHz 12 MB Cache 1333MHz 95w-4498 / 4636Intel Xeon Processor X5670 6C 2.93GHz 12 MB Cache 1333MHz 95w-A0VS / A0VT Intel Xeon Processor X5675 6C 3.06GHz 12 MB Cache 1333MHz 95w-Intel Xeon 5500 series processors0705 / 4639*Intel Xeon Processor E5503 2C 2.0 GHz 4 MB Cache 800 MHz 80w22x, 24x6656 / 6955Intel Xeon Processor E5504 4C 2.00 GHz 4 MB Cache 800MHz 80w-4428 / 4427Intel Xeon Processor E5506 4C 2.13 GHz 4 MB Cache 800MHz 80w32x, 34x0706 / 4640*Intel Xeon Processor E5507 4C 2.26 GHz 4 MB Cache 800MHz 80w42x4425 / 4424Intel Xeon Processor E5540 4C 2.53 GHz 8 MB Cache 1066MHz 80w-** The first feature code is for Processor 1. The second feature code is for Processor 2.* Withdrawn from marketing.Memory optionsFigure 5. Internal drive configurationsPart number FeaturecodeDescription Maximumsupported*3.5" Simple-Swap SATA and NL SATA HDDs81Y9778A280IBM 3TB 7.2K 6Gbps NL SATA 3.5" SS HDD4 42D07875416IBM 2 TB 7200 NL SATA 3.5" SS HDD4 39M45145288500 GB 7200 RPM 3.5" Simple-Swap SATA II4 3.5" Hot-Swap SATA and NL SATA HDD81Y9774A27Z IBM 3 TB 7.2K 6Gbps NL SATA 3.5" HS HDD8 42D07825415IBM 2 TB 7200 NL SATA 3.5" HS HDD8 43W76265560IBM 1 TB 7200 SATA 3.5" HS HDD8 39M45305196500 GB 7200 RPM 3.5" Hot-Swap SATA II83.5" Hot-Swap SAS HDDs44W22445313IBM 600 GB 15 K 6 Gbps SAS 3.5" Hot-Swap HDD844W22395312IBM 450 GB 15 K 6 Gbps SAS 3.5" Hot-Swap HDD844W22345311IBM 300 GB 15 K 6 Gbps SAS 3.5" Hot-Swap HDD83.5" Hot-Swap NL SAS HDDs81Y9758A281IBM 3 TB 7.2K 6Gbps NL SAS 3.5" HS HDD842D07675417IBM 2 TB 7.2 K 6 Gbps NL SAS 3.5" HS HDD842D07775418IBM 1 TB 7.2 K 6 Gbps NL SAS 3.5" HS HDD82.5" Hot-swap SAS-SSD Hybrid Drive00AD102A4G7IBM 600GB 10K 6Gbps SAS 2.5'' G2HS Hybrid162.5" Hot-Swap NL SATA HDDs81Y9730A1AV IBM 1TB 7.2K 6Gbps NL SATA 2.5" SFF HS HDD1681Y9726A1NZ IBM 500GB 7.2K 6Gbps NL SATA 2.5" SFF HS HDD1681Y9722A1NX IBM 250GB 7.2K 6Gbps NL SATA 2.5" SFF HS HDD162.5" Hot-Swap 10K SAS HDDs00AD075A48S IBM 1.2TB 10K 6Gbps SAS 2.5'' G2HS HDD1681Y9650A282IBM 900GB 10K 6Gbps SAS 2.5" Slim-HS HDD1649Y20035433IBM 600 GB 10 K 6 Gbps SAS 2.5" SFF Slim-HS HDD1642D06375599IBM 300 GB 10 K 6 Gbps SAS 2.5" SFF Slim-HS HDD162.5" Hot-Swap 15K SAS HDDs81Y9670A283IBM 300GB 15K 6Gbps SAS 2.5" SFF HS HDD1642D06775536IBM 146 GB 15 K 6 Gbps SAS 2.5" SFF Slim-HS HDD162.5" Hot-Swap NL SAS HDDs81Y9690A1P3IBM 1TB 7.2K 6Gbps NL SAS 2.5" SFF HS HDD1642D07075409IBM 500 GB 7200 6 Gbps NL SAS 2.5" SFF Slim-HS HDD162.5" Solid state drives00W1125A3HR IBM 100GB SATA 2.5" MLC HS Enterprise SSD1643W7718A2FN IBM 200GB SATA 2.5" MLC HS SSD1649Y5839A3AS IBM 64GB SATA 2.5" MLC HS Enterprise Value SSD1649Y5844A3AU IBM 512GB SATA 2.5" MLC HS Enterprise Value SSD1690Y8643A2U3IBM 256GB SATA 2.5" MLC HS Enterprise Value SSD1690Y8648A2U4IBM 128GB SATA 2.5" MLC HS Enterprise Value SSD16* If the server has a 670 W fixed power supply, then only 4x 3.5-inch drives or 8x 2.5-inch drives can be installed.Internal backup unitsStorage host bus adaptersThe following table lists storage HBAs supported by the x3400 M3 server. Table 12. Storage adaptersPart number FeaturecodeDescription Maximumquantity supportedFibre Channel59Y19873885Brocade 4 Gb FC Single-port HBA for IBM System x359Y19933886Brocade 4 Gb FC Dual-port HBA for IBM System x346M60493589Brocade 8 Gb FC Single-port HBA for IBM System x346M60503591Brocade 8 Gb FC Dual-port HBA for IBM System x381Y1668A2XU Brocade 16Gb FC Single-port HBA for IBM System x381Y1675A2XV Brocade 16Gb FC Dual-port HBA for IBM System x342C20691698Emulex 4 Gbps FC Single-Port PCI-e HBA for IBM System x642C20711699Emulex 4 Gbps FC Dual-Port PCI-e HBA for IBM System x642D04853580Emulex 8 Gb FC Single-port HBA for IBM System x642D04943581Emulex 8 Gb FC Dual-port HBA for IBM System x681Y1655A2W5Emulex 16Gb FC Single-port HBA for IBM System x381Y1662A2W6Emulex 16Gb FC Dual-port HBA for IBM System x339R65253567QLogic 4 Gb FC Single-Port PCIe HBA for IBM System x639R65273568QLogic 4 Gb FC Dual-Port PCIe HBA for IBM System x642D05013578QLogic 8 Gb FC Single-port HBA for IBM System x642D05103579QLogic 8 Gb FC Dual-port HBA for IBM System x600Y3337A3KW QLogic 16Gb FC Single-port HBA for IBM System x300Y3341A3KX QLogic 16Gb FC Dual-port HBA for IBM System x3Converged Network Adapters (CNA)*42C18005751QLogic 10 Gb Dual Port CNA for IBM System x342C18201637Brocade 10 Gb Dual-port CNA for IBM System x3iSCSI39Y61462976QLogic iSCSI Single-Port PCIe HBA for IBM System x642C17702977QLogic iSCSI Dual-Port PCIe HBA for IBM System x6SAS44E87003583IBM 3 Gb SAS HBA v2346M09075982IBM 6 Gb SAS HBA Controller346M09123876IBM 6Gb Performance Optimized HBA1* Converged Network Adapters require SFP+ optical transceivers or DAC cables that must be purchased separately.For more information, see the list of IBM Redbooks Product Guides in the Host bus adapters category: /portals/systemx?Open&page=pg&cat=hbaPCIe SSD adaptersPCIe SSD adaptersThe server does not support High IOPS SSD adapters.Power suppliesThe server supports either one 670 W AC fixed power supply or up to two 920 W AC hot-swap redundant power supplies, providing N+N redundancy. Standard models come with one power supply, either fixed or hot-swap, depending on the model as listed in Table 2. For models with one 920 W AC hot-swap redundant power supply, you can add a second power supply by ordering the option listed in the following table.Note: If the server has a 670 W fixed power supply installed, then only up to four 3.5-inch drives can be installed or up to eight 2.5-inch drives can be installed.Table 13. Power suppliesPart number Feature code Description Maximum supported44X03815056IBM Redundant Power Supply for x3400/3500 2 (One power supply comesstandard with every model.)The power supply ships without a line cord. A line cord must be ordered separately.Note: Power supply option 44X0381 is for both the x3400 M3 and the x3500 M3. The power supply option includes three fans however these fans are only for use with the x3500 M3. They are not used in the x3400 M3. (The x3400 M3 includes physical space for the fans but there is no electrical connection for the fans in the x3400 M3.)Integrated virtualizationThe server supports VMware ESXi installed on a USB memory key. The key is installed in a USB socket inside the server. The following table lists the virtualization options.Table 14. Virtualization optionsPart number FeaturecodeDescription Maximumsupported41Y82781776IBM USB Memory Key for VMware ESXi 41 41Y82873033IBM USB Memory Key for VMware ESXi 4.11 41Y8296A1NP IBM USB Memory Key for VMware ESXi 4.1 Update 11 41Y8300A2VC IBM USB Memory Key for VMware ESXi 5.01 41Y8307A383IBM USB Memory Key for VMware ESXi 5.0 Update 11 41Y8311A2R3IBM USB Memory Key for VMware ESXi 5.11Remote managementExternal backup unitsThe server supports the external backup attachment options listed in the following table. Table 22. External backup optionsPart number DescriptionExternal tape expansion enclosures for internal tape drives87651UX1U Tape Drive Enclosure8767HHX Half High Tape Drive Enclosure87651NX1U Tape Drive Enclosure (with Nema 5-15P LineCord)8767HNX Half High Tape Drive Enclosure (with Nema 5-15P LineCord)Tape enclosure adapters (with cables)44E8869USB Enclosure Adapter Kit40K2599SAS Enclosure Adapter KitInternal backup drives supported by external tape enclosures46C5364IBM RDX Removable Hard Disk Storage System - Internal USB 160 GB Bundle 46C5387IBM RDX Removable Hard Disk Storage System - Internal USB 320 GB Bundle 46C5388IBM RDX Removable Hard Disk Storage System - Internal USB 500 GB Bundle 46C5399IBM DDS Generation 5 USB Tape Drive39M5636IBM DDS Generation 6 USB Tape Drive43W8478IBM Half High LTO Gen 3 SAS Tape Drive44E8895IBM Half High LTO Gen 4 SAS Tape Drive49Y9898IBM Half High LTO Gen 5 Internal SAS Tape DriveExternal backup units*362516X IBM RDX Removable Hard Disk Storage System - External USB 160 GB Bundle362532X IBM RDX Removable Hard Disk Storage System - External USB 320 GB Bundle362550X IBM RDX Removable Hard Disk Storage System - External USB 500 GB Bundle3628L3X IBM Half High LTO Gen 3 External SAS Tape Drive (with US line cord)3628L4X IBM Half High LTO Gen 4 External SAS Tape Drive (with US line cord)3628L5X IBM Half High LTO Gen 5 External SAS Tape Drive (with US line cord)3628N3X IBM Half High LTO Gen 3 External SAS Tape Drive (without line cord)3628N4X IBM Half High LTO Gen 4 External SAS Tape Drive (without line cord)3628N5X IBM Half High LTO Gen 5 External SAS Tape Drive (without line cord)3580S3V System Storage TS2230 Tape Drive Express Model H3V3580S4V System Storage TS2240 Tape Drive Express Model H4V3580S5E System Storage TS2250 Tape Drive Express Model H5S3580S5X System Storage TS2350 Tape Drive Express Model S533572S4R TS2900 Tape Library with LTO4 HH SAS drive & rack mount kit3572S5R TS2900 Tape Library with LTO5 HH SAS drive & rack mount kit35732UL TS3100 Tape Library Model L2U Driveless35734UL TS3200 Tape Library Model L4U Driveless46X2682†LTO Ultrium 5 Fibre Channel Drive46X2683†LTO Ultrium 5 SAS Drive Sled46X2684†LTO Ultrium 5 Half High Fibre Drive Sled46X2685†LTO Ultrium 5 Half High SAS Drive Sled46X6912†LTO Ultrium 4 Half High Fibre Channel Drive Sled46X7117†LTO Ultrium 4 Half High SAS DriveV2 Sled46X7122†LTO Ultrium 3 Half High SAS DriveV2 Sled* Note: The external tape drives listed can be ordered through System x sales channel. Server may support other IBM tape drives that are not listed in this table. Refer to IBM System Storage Interoperability Center for further information.† Note: These part numbers are the tape drives options for 35732UL and 35734UL.For more information, see the list of IBM Redbooks Product Guides in the Backup units category:/portals/systemx?Open&page=pg&cat=tapeTop-of-rack Ethernet switchesThe server supports the following top-of-rack Ethernet switches from IBM System Networking.Table 23. IBM System Networking - Top-of-rack switchesPart number DescriptionIBM System Networking - 1 Gb top-of-rack switches0446013IBM System Networking RackSwitch G8000R7309CFC IBM System Networking RackSwitch G8000F7309CD8IBM System Networking RackSwitch G8000DC7309G52IBM System Networking RackSwitch G8052R730952F IBM System Networking RackSwitch G8052F427348E IBM Ethernet Switch J48E6630010Juniper Networks EX2200 24 Port6630011Juniper Networks EX2200 24 Port with PoE6630012Juniper Networks EX2200 48 Port6630013Juniper Networks EX2200 48 Port with PoEIBM System Networking - 10 Gb top-of-rack switches7309DRX IBM System Networking RackSwitch G8264CS (Rear to Front)7309DFX IBM System Networking RackSwitch G8264CS (Front to Rear)7309BD5IBM System Networking RackSwitch G8124DC7309BR6IBM System Networking RackSwitch G8124ER7309BF7IBM System Networking RackSwitch G8124EF7309G64IBM System Networking RackSwitch G8264R730964F IBM System Networking RackSwitch G8264F7309CR9IBM System Networking RackSwitch G8264TR7309CF9IBM System Networking RackSwitch G8264TF0719410Juniper Networks EX4500 - Front to Back Airflow0719420Juniper Networks EX4500 - Back to Front AirflowIBM System Networking - 40 Gb top-of-rack switches8036ARX IBM System Networking RackSwitch G8316R8036AFX IBM System Networking RackSwitch G8316FFor more information, see the list of IBM Redbooks Product Guides in the Top-of-rack switches category: /portals/systemx?Open&page=pg&cat=torPart number DescriptionSwitched and Monitored PDUs46M4002IBM 1U 9 C19/3 C13 Active Energy Manager DPI® PDU46M4003IBM 1U 9 C19/3 C13 Active Energy Manager 60A 3 Phase PDU46M4004IBM 1U 12 C13 Active Energy Manager DPI PDU46M4005IBM 1U 12 C13 Active Energy Manager 60A 3 Phase PDU46M4167IBM 1U 9 C19/3 C13 Switched and Monitored 30A 3 Phase PDU46M4116IBM 0U 24 C13 Switched and Monitored 30A PDU46M4119IBM 0U 24 C13 Switched and Monitored 32A PDU46M4134IBM 0U 12 C19/12 C13 Switched and Monitored 50A 3 Phase PDU46M4137IBM 0U 12 C19/12 C13 Switched and Monitored 32A 3 Phase PDUEnterprise PDUs71762MX IBM Ultra Density Enterprise PDU C19 PDU+ (WW)71762NX IBM Ultra Density Enterprise PDU C19 PDU (WW)71763MU IBM Ultra Density Enterprise PDU C19 3 phase 60A PDU+ (NA)71763NU IBM Ultra Density Enterprise PDU C19 3 phase 60A PDU (NA)39M2816IBM DPI C13 Enterprise PDU without linecord39Y8923DPI 60A Three Phase C19 Enterprise PDU with IEC309 3P+G (208 V) fixed line cord 39Y8941DPI Single Phase C13 Enterprise PDU without line cord39Y8948DPI Single Phase C19 Enterprise PDU without line cordFront-End PDUs39Y8934DPI 32amp/250V Front-end PDU with IEC 309 2P+Gnd connector39Y8935DPI 63amp/250V Front-end PDU with IEC 309 2P+Gnd connector39Y893830amp/125V Front-end PDU with NEMA L5-30P connector39Y893930amp/250V Front-end PDU with NEMA L6-30P connector39Y894060amp/250V Front-end PDU with IEC 309 60A 2P+N+Gnd connectorUniversal PDUs39Y8951DPI Universal Rack PDU w/ US LV and HV line cords 39Y8952DPI Universal Rack PDU w/ CEE7-VII Europe LC39Y8953DPI Universal Rack PDU w/ Denmark LC39Y8954DPI Universal Rack PDU w/ Israel LC39Y8955DPI Universal Rack PDU w/Italy LC39Y8956DPI Universal Rack PDU w/South Africa LC39Y8957DPI Universal Rack PDU w/UK LC39Y8958DPI Universal Rack PDU with AS/NZ LC39Y8959DPI Universal Rack PDU w/China LC39Y8962DPI Universal Rack PDU (Argentina)39Y8960DPI Universal Rack PDU (Brazil)39Y8961DPI Universal Rack PDU (India)0U Basic PDUs46M4122IBM 0U 24 C13 16A 3 Phase PDU46M4125IBM 0U 24 C13 30A 3 Phase PDU46M4128IBM 0U 24 C13 30A PDU46M4131IBM 0U 24 C13 32A PDU46M4140IBM 0U 12 C19/12 C13 60A 3 Phase PDU46M4143IBM 0U 12 C19/12 C13 32A 3 Phase PDURack cabinetsThe server supports the rack cabinets listed in the following table. Tower-to-Rack Conversion Kit (part number 69Y0893, 5Ux26" Tower to Rack Conversion Kit for x3400/x3500) is required for the server to be installed in a rack.Table 26. Rack cabinetsPart number Description69Y08935Ux26" Tower to Rack Conversion Kit for x3400/x3500201886X IBM 11U Office Enablement Kit14102RX IBM eServer Cluster 25U Rack93072PX IBM 25U Static S2 Standard Rack93072RX IBM 25U Standard Rack93074RX IBM 42U Standard Rack93074XX IBM 42U Standard Rack Extension14104RX IBM 42U S2 standard rack93084EX IBM 42U Enterprise Expansion Rack93084PX IBM 42U Enterprise Rack93604EX IBM 42U 1200 mm Deep Dynamic Expansion Rack93604PX IBM 42U 1200 mm Deep Dynamic Rack93614EX IBM 42U 1200 mm Deep Static Expansion Rack93614PX IBM 42U 1200 mm Deep Static Rack93624EX IBM 47U 1200 mm Deep Static Expansion Rack93624PX IBM 47U 1200 mm Deep Static RackFor more information, see the IBM 47U and 42U 1200mm Deep Racks at-a-glance guide, available from: /abstracts/tips0796.html?OpenTrademarksLenovo and the Lenovo logo are trademarks or registered trademarks of Lenovo in the United States, other countries, or both. A current list of Lenovo trademarks is available on the Web athttps:///us/en/legal/copytrade/.The following terms are trademarks of Lenovo in the United States, other countries, or both:Lenovo®BladeCenter®RackSwitchServeRAIDServerGuideServerProven®System x®The following terms are trademarks of other companies:Intel® and Xeon® are trademarks of Intel Corporation or its subsidiaries.Linux® is the trademark of Linus Torvalds in the U.S. and other countries.Microsoft®, Windows Server®, and Windows® are trademarks of Microsoft Corporation in the United States, other countries, or both.Other company, product, or service names may be trademarks or service marks of others.。

IBM MQVersion 9.1.x Quick Start GuideUse this guide to get started with IBM MQ Version 9.1.x Continuous DeliveryNational Language Version:The Quick Start Guide is available in other languages from the Quick Start Guide eImage.Product overviewIBM ®MQ is robust messaging middleware that simplifies and accelerates the integration of diverse applications and business data across multiple platforms. IBM MQ facilitates the assured, secure and reliable exchange of information betweenapplications, systems, services and files by sending and receiving message data via messaging queues, thereby simplifying the creation and maintenance of business applications. It delivers Universal Messaging with a broad set of offerings to meet enterprise-wide messaging needs, and can be deployed across a range of different environments including on-premise, in cloud environments and supporting hybrid cloud deployments.IBM MQ supports a number of different application programming interfaces (APIs) including Message Queue Interface (MQI),Java ™Message Service (JMS), .NET, IBM MQ Light, MQTT, and the messaging REST API.For more information about downloading the product IBM Passport Advantage, see Downloading IBM MQ Version 9.1.(https:///support/docview.wss?uid=swg24042009) and the Passport Advantage and Passport Advantage Express (https:///software/passportadvantage/) website for more information.Product documentation for all supported versions of IBM MQ is available through IBM Knowledge Center(https:///support/knowledgecenter/SSFKSJ). Specifically, the documentation for IBM MQ Version 9.1.x Continuous Delivery releases is published as part of the IBM MQ Version 9.1.x product documentation(https:///support/knowledgecenter/SSFKSJ_9.1.0/com.ibm.mq.helphome.v91.doc/WelcomePagev9r1.htm)in IBM Knowledge Center.Service and support information is provided in the documentation.Information about how to use MQ Explorer can be accessed either from within MQ Explorer or in the product documentation.3Step 3: Review the installation architectureIBM MQ architectures range from simple architectures that use a single queue manager, to more complex networks of interconnected queue managers. For more information about planning your IBM MQ architecture, see the Planning section of the product documentation in IBM Knowledge Center (https:///support/knowledgecenter/en/SSFKSJ_9.1.0/com.ibm.mq.pla.doc/q004690_.htm).For links to additional information, see the IBM MQ information roadmap in IBM Knowledge Center(https:///support/knowledgecenter/en/SSFKSJ_9.1.0/com.ibm.mq.pro.doc/q123810_.htm).IBM®4Step 4: Install the productFor installation instructions for IBM MQ on all supported platforms, and for details of the hardware and softwareconfigurations that are required, see the Installing section of the product documentation in IBM Knowledge Center (https:///support/knowledgecenter/en/SSFKSJ_9.1.0/com.ibm.mq.ins.doc/q008250_.htm).started quickly.For more tutorials to help you get started with IBM MQ, see LearnMQ (https:///messaging/learn-mq/) on the IBM Developer website.More informationFor more information about IBM MQ, see the following resources:IBM FAQ for Long Term Support and Continuous Delivery releasesFrom IBM MQ Version 9.0, IBM MQ introduced a Continuous Delivery (CD) support model. Following the initialrelease of a new version, new function and enhancements are made available by incremental updates within thesame version and release. There is also a Long Term Support release available for deployments that requiresecurity and defect fixes only. For more information, see IBM MQ FAQ for Long Term Support and ContinuousDelivery releases (https:///support/docview.wss?uid=swg27047919).Online product readme fileThe latest version of the online product readme file is available on the IBM MQ product readmes web page(https:///support/docview.wss?rs=171&uid=swg27006097).IBM Support informationSupport information includes the following resources:v IBM Support web page (https:///support/home/)v IBM Support Assistant (https:///software/support/isa/)v Social Media Channels within Hybrid Cloud Technical Support (https:///support/docview.wss?uid=swg21410956#2)IBM MQ Version 9.1.x Licensed Materials - Property of IBM. © Copyright IBM Corp. 2006, 2018. U.S. Government Users Restricted Rights - Use, duplication or disclosure restricted by GSA ADP Schedule Contract with IBM Corp. IBM, the IBM logo, , and Passport Advantage are trademarks or registered trademarks of International Business Machines Corp., registered in many jurisdictions worldwide. Java and all Java-based trademarks and logos are trademarks or registered trademarks of Oracle and/or its affiliates. Microsoft and Windows are trademarks of Microsoft Corporation in the United States, other countries, or both. Other product and service names might be trademarks of IBM or other companies. A current list of IBM trademarks is available on the Web at “Copyright and trademark information” (/legal/copytrade.shtml).Part Number:CNV69MLPrinted in Ireland。

The original text of Unit 4 Text A without adaptations:以下是Unit4 Text A的原文，未删减版：===========================================================Outsourcing InnovationMarch 21, 2005First came manufacturing. Now companies are farming out R&D to cut costs and get new products to market faster. Are they going too far?farm out: arranged for contracted work to be done by others 外包As the Mediterranean sun bathed the festive cafés and shops of the Côte d'Azur town of Cannes, banners with the logos of Motorola (MOT), Royal Philips Electronics (PHG), palmOne (PLMO), and Samsung fluttered from the masts of plush yachts moored in the harbor. On board, top execs hosted nonstop sales meetings during the day and champagne dinners at night to push their latest wireless gadgets. Outside the city's convention hall, carnival barkers, clowns on stilts, and vivacious models with bright red wigs lured passersby into flashy exhibits. For anyone in the telecom industry wanting to shout their achievements to the world, there was no more glamorous spot than the sprawling 3GSM World Congress in Southern France in February.flutter: move back and forth very rapidly 飘动yacht: an expensive vessel propelled by sail or power and used for cruising or racing 游艇；plush yacht: 豪华游艇moor: come into or dock at a wharf 停泊gadget: a device that is very useful for a particular job 有用的小装置convention hall: conference hall会议中心carnival barkers：狂欢节的娱乐场所外高声招徕顾客者clowns on stilts:踩高跷的小丑vivacious：vigorous and active 活泼的、快活的flashy：浮华的glamorous：having an air of allure, romance and excitement 富有魅力的，迷人的Yet many of the most intriguing product launches in Cannes took place far from the limelight. HTC Corp., a red-hot developer of multimedia handsets, didn't even have its own booth. Instead, the Taiwanese company showed off its latest wireless devices alongside partners that sell HTC's models under their own brand names. Flextronics Corp. demonstrated several concept phones exclusively behind closed doors. And Cellon International rented a discrete three-room apartment across from the convention center to unveil its new devices to a steady stream of telecom executives. The new offerings included the C8000, featuring eye-popping software. Cradle the device to your ear and it goes into telephone mode. Peer through the viewfinder and it automatically shifts into camera mode. Hold the end of the device to your eye and it morphs into a videocam.yet: conj. And despite this; nevertheless:“She said she would be late, yet she arrived on time.”limelight：a focus of public attention 公众关注的中心far from the limelight: far from the public attention 远离公众焦点red-hot:newest or most recent 最新的morph:cause to change shape in a computer animation （电脑动画中）变形HTC? Flextronics? Cellon? There's a good reason these are hardly household names. The multimedia devices produced from their prototypes will end up on retail shelves under the brands of companies that don't want you to know who designs their products. Yet these and other little-known companies, with names such asQuanta Computer, Premier Imaging, Wipro Technologies (WIT ), and Compal Electronics, are fast emerging as hidden powers of the technology industry.They are the vanguard of the next step in outsourcing -- of innovation itself. When Western corporations began selling their factories and farming out manufacturing in the '80s and '90s to boost efficiency and focus their energies, most insisted all the important research and development would remain in-house.But that pledge is now passé. Today, the likes of Dell (DELL ), Motorola, (MOT ) and Philips are buying complete designs of some digital devices from Asian developers, tweaking them to their own specifications, and slapping on their own brand names. It's not just cell phones. Asian contract manufacturers and independent design houses have become forces in nearly every tech device, from laptops and high-definition TVs to MP3 music players and digital cameras. "Customers used to participate in design two or three years back," says Jack Hsieh, vice-president for finance at Taiwan's Premier Imaging Technology Corp., a major supplier of digital cameras to leading U.S. and Japanese brands. "But starting last year, many just take our product. Because of price competition, they have to."While the electronics sector is furthest down this road, the search for offshore help with innovation is spreading to nearly every corner of the economy. On Feb. 8, Boeing Co. (BA ) said it is working with India's HCL Technologies to co-develop software for everything fromthe navigation systems and landing gear to the cockpit controls for its upcoming 7E7 Dreamliner jet. Pharmaceutical giants such as GlaxoSmithKline (GSK ) and Eli Lilly (LLY )are teaming up with Asian biotech research companies in a bid to cut the average $500 million cost of bringing a new drug to market. And Procter & Gamble Co. (PG ) says it wants half of its new product ideas to be generated from outside by 2010, compared with 20% now.Competitive DangersUnderlying this trend is a growing consensus that more innovation is vital -- but that current R&D spending isn't yielding enough bang for the buck. After spending years squeezing costs out of the factory floor, back office, and warehouse, CEOs are asking tough questions about their once-cloistered R&D operations: Why are so few hit products making it out of the labs into the market? How many of those pricey engineers are really creating game-changing products or technology breakthroughs? "R&D is the biggest single remaining controllable expense to work on," says Allen J. Delattre, head of Accenture Ltd.'s (ACN ) high-tech consulting practice. "Companies either will have to cut costs or increase R&D productivity."The result is a rethinking of the structure of the modern corporation. What, specifically, has to be done in-house anymore? At a minimum, most leading Western companies are turning toward a new model of innovation, one that employs global networks of partners. These can include U.S. chipmakers, Taiwanese engineers, Indian software developers, and Chinese factories. IBM (IBM ) is even offering the smarts of its famed research labs and a new global team of 1,200 engineers to help customers develop future products using next-generation technologies. When the whole chain works in sync,there can be a dramatic leap in the speed and efficiency of product development.The downside of getting the balance wrong, however, can be steep. Start with the danger of fostering new competitors. Motorola hired Taiwan's BenQ Corp. to design and manufacture millions of mobile phones. But then BenQ began selling phones last year in the prized China market under its own brand. That prompted Motorola to pull its contract. Another risk is that brand-name companies will lose the incentive to keep investing in new technology. "It is a slippery slope," says Boston Consulting Group Senior Vice-President Jim Andrew. "If the innovation starts residing in the suppliers, you could incrementalize yourself to the point where there isn't much left."Such perceptions are a big reason even companies that outsource heavily refuse to discuss what hardware designs they buy from whom and impose strict confidentiality on suppliers. "It is still taboo to talk openly about outsourced design," says Forrester Research Inc. (FORR ) consultant Navi Radjou, an expert on corporate innovation.The concerns also explain why different companies are adopting widely varying approaches to this new paradigm. Dell, for example, does little of its own design for notebook PCs, digital TVs, or other products. Hewlett-Packard Co. (HPQ ) says it contributes key technology and at least some design input to all its products but relies on outside partners to co-develop everything from servers to printers. Motorola buys complete designs for its cheapest phones but controls all of the development of high-end handsets like its hot-selling Razr. The key, execs say, is to guard some sustainable competitive advantage, whether it's control over the latest technologies, the lookand feel of new products, or the customer relationship. "You have to draw a line," says Motorola CEO Edward J. Zander. At Motorola, "core intellectual property is above it, and commodity technology is below."Wherever companies draw the line, there's no question that the demarcation between mission-critical R&D and commodity work is sliding year by year. The implications for the global economy are immense. Countries such as India and China, where wages remain low and new engineering graduates are abundant, likely will continue to be the biggest gainers in tech employment and become increasingly important suppliers of intellectual property. Some analysts even see a new global division of labor emerging: The rich West will focus on the highest levels of product creation, and all the jobs of turning concepts into actual products or services can be shipped out. Consultant Daniel H. Pink, author of the new book A Whole New Mind, argues that the "left brain" intellectual tasks that "are routine, computer-like, and can be boiled down to a spec sheet are migrating to where it is cheaper, thanks to Asia's rising economies and the miracle of cyberspace." The U.S. will remain strong in "right brain" work that entails "artistry, creativity, and empathy with the customer that requires being physically close to the market."You can see this great divide already taking shape in global electronics. The process started in the 1990s when Taiwan emerged as the capital of PC design, largely because the critical technology was standardized, on Microsoft Corp.'s (MSFT ) operating system software and Intel Corp.'s (INTC ) microprocessor. Today, Taiwanese "original-design manufacturers" (ODMS), so named because they both design and assemble products for others, supply some 65% of the world's notebook PCs. Quanta Computer Inc. alone expects to churn out 16million notebook PCs this year in 50 different models for buyers that include Dell, Apple Computer (AAPL ), and Sony (SNE ).Now, Taiwanese ODMs and other outside designers are forces in nearly every digital device on the market. Of the 700 million mobile phones expected to be sold worldwide this year, up to 20% will be the work of ODMs, estimates senior analyst Adam Pick of the El Segundo (Calif.) market research firm iSuppli Corp. About 30% of digital cameras are produced by ODMs, 65% of MP3 players, and roughly 70% of personal digital assistants (PDAs). Building on their experience with PCs, they're increasingly creating recipes for their own gizmos, blending the latest advances in custom chips, specialized software, and state-of-the-art digital components. "There is a lot of great capability that has grown in Asia to develop complete products," says Doug Rasor, worldwide strategic marketing manager at chipmaker Texas Instruments Inc. TI often supplies core chips, along with rudimentary designs, and the ODMs take it from there. "They can do the system integration, the plastics, the industrial design, and the low-cost manufacturing, and they are happy to put Dell's name on it. That is a megatrend in the industry," says Rasor.Taiwan's ODMs clearly don't regard themselves as mere job shops. Just ask the top brass at HTC, which creates and manufactures smart phones for such wireless service providers as Vodafone and Cingular as well as equipment makers it doesn't identify. "We know this kind of product category a lot better than our customers do," says HTC President Peter Chou. "We have the capability to integrate all the latest technologies. We do everything except the Microsoft operating system."Or stop in to Quanta's headquarters in the Huaya Technology Park outside Taipei. Workers are finishing a dazzling structure the size of several football fields, with a series of wide steps leading past white columns supporting a towering Teflon-and-glass canopy. It will serve as Quanta's R&D headquarters, with thousands of engineers working on next-generation displays, digital home networking appliances, and multimedia players. This year, Quanta is doubling its engineering staff, to 7,000, and its R&D spending, to $200 million.Why? To improve its shrinking profit margins -- and because foreign clients are demanding it. "What has changed is that more customers need us to design the whole product," says Chairman Barry Lam. For future products, in fact, "it's now difficult to get good ideas from our customers. We have to innovate ourselves."Sweeping OverhaulIndia is emerging as a heavyweight in design, too. The top players in making the country world-class in software development, including HCL and Wipro, are expected to help India boost its contract R&D revenues from $1 billion a year now to $8 billion in three years. One of Wipro's many labs is in a modest office off dusty, congested Hosur Road in Bangalore. There, 1,000 young engineers partitioned into brightly lit pods jammed with circuit boards, chips, and steel housings hunch over 26 development projects. Among them is a hands-free telephone system that attaches to the visor of a European sports car. At another pod, designers tinker with a full dashboard embedded with a satellite navigation system. Inside other Wipro labs in Bangalore, engineers are designing prototypes for everything from high-definition TVs to satellite set-top boxes.Perhaps the most ambitious new entrant in design is Flextronics. The manufacturing behemoth already builds networking gear, printers, game consoles, and other hardware for the likes of Nortel Networks (NT ), Xerox (XRX ), HP, Motorola, and Casio Computer. But three years ago, it started losing big cell-phone and PDA orders to Taiwanese ODMs. Since then, CEO Michael E. Marks has shelled out more than $800 million on acquisitions to build a 7,000-engineer force of software, chip, telecom, and mechanical designers scattered from India and Singapore to France and Ukraine. Marks's splashiest move was to pay an estimated $30 million for frog design Inc., the pioneering Sunnyvale (Calif.) firm that helped design such Information Age icons as Apple Computer Inc.'s original Mac in 1984. So far, Flextronics has developed its own basic platforms for cell phones, routers, digital cameras, and imaging devices. His goal is to make Flextronics a low-cost, soup-to-nuts developer of consumer-electronics and tech gear.Marks has an especially radical take on where all this is headed: He believes Western tech conglomerates are on the cusp of a sweeping overhaul of R&D that will rival the offshore shift of manufacturing. In the 1990s, companies like Flextronics "completely restructured the world's electronics manufacturing," says Marks. "Now we will completely restructure design." When you get down to it, he argues, some 80% of engineers in product development do tasks that can easily be outsourced -- like translating prototypes into workable designs, upgrading mature products, testing quality, writing user manuals, and qualifying parts vendors. What's more, most of the core technologies in today's digital gadgets are available to anyone. And circuit boards for everything from cameras to network switches are becoming simpler because more functions are embedded onsemiconductors. The "really hard technology work" is migrating to chipmakers such as Texas Instruments, Qualcomm (QCOM ), Philips, Intel, and Broadcom (BRCM ), Marks says. "All electronics are on the same trajectory of becoming silicon surrounded by plastic."Why then, Marks asks, should Nokia (NOK ), Motorola, Sony-Ericsson, Alcatel (ALA ), Siemens (SI ), Samsung, and other brand-name companies all largely duplicate one another's efforts? Why should each spend $30 million to develop a new smartphone or $200 million on a cellular base station when they can just buy the hardware designs? The ultimate result, he says: Some electronics giants will shrink their R&D forces from several thousand to a few hundred, concentrating on proprietary architecture, setting key specifications, and managing global R&D teams. "There is no doubt the product companies are going to have fewer people design stuff," Marks predicts. "It's going to get ugly."Granted, Marks's vision is more than a tad extreme. True, despite the tech recovery, many corporate R&D budgets have been tightening. HP's R&D spending long hovered around 6% of sales, but it's down to 4.4% now. Cisco Systems' (CSCO ) R&D budget has dropped from its old average of 17% to 14.5%. The numbers also are falling at Motorola, Lucent Technologies (LU ), and Ericsson. In November, Nokia Corp. said it aims to trim R&D spending from 12.8% of sales in 2004 to under 10% by the end of 2006.Close to the HeartStill, most companies insist they will continue to do most of the critical design work -- and have no plans to take a meat ax to R&D. A Motorola spokesman says it plans to keep R&D spending at around10% for the long term. Lucent says its R&D staff should remain at about 9,000, after several years of deep cuts. And while many Western companies are downsizing at home, they are boosting hiring at their own labs in India, China, and Eastern Europe. "Companies realize if they want a sustainable competitive advantage, they will not get it from outsourcing," says President Frank M. Armbrecht of the Industrial Research Institute, which tracks corporate R&D spending.Companies also worry about the message they send investors. Outsourcing manufacturing, tech support, and back-office work makes clear financial sense. But ownership of design strikes close to the heart of a corporation's intrinsic value. If a company depends on outsiders for design, investors might ask, how much intellectual property does it really own, and how much of the profit from a hit product flows back into its own coffers, rather than being paid out in licensing fees? That's one reason Apple Computer lets the world know it develops its hit products in-house, to the point of etching "Designed by Apple in California" on the back of each iPod.Yet some outsourcing holdouts are changing their tune. Nokia long prided itself on developing almost everything itself -- to the point of designing its own chips. No longer. Given the complexities of today's technologies and supply chains, "nobody can master it all," says Chief Technology Officer Pertti Korhonen. "You have to figure out what is core and what is context." Lucent says outsourcing some development makes sense so that its engineers can concentrate on next-generation technologies. "This frees up talent to work on new product lines," says Dave Ayers, vice-president for platforms and engineering. "Outsourcing isn't about moving jobs. It's about the flexibility to put resources in the right places at the right time."It's also about brutal economics and the relentless demands of consumers. To get shelf space at a Best Buy (BBY ) or Circuit City often means brand-name companies need a full range of models, from a $100 point-and-shoot digital camera with 2 megapixels, say, to a $700 8-megapixel model that doubles as a videocam and is equipped with a powerful zoom lens. On top of this, superheated competition can reduce hit products to cheap commodities within months. So they must get out the door fast to earn a decent margin. "Consumer electronics have become almost like produce," says Michael E. Fawkes, senior vice-president of HP's Imaging Products Div. "They always have to be fresh."Such pressures explain outsourcing's growing allure. Take cell phones, which are becoming akin to fashion items. Using a predesigned platform can shave 70% of development costs off a new model, estimates William S. Wong, a senior vice-president for marketing at Cellon. That can be a huge savings. As a rule of thumb, it takes around $10 million and up to 150 engineers to develop a new cell phone from scratch. If Motorola or Nokia guess wrong about the market trends a year into the future, they can lose big. So they must develop several versions.With most of its 800 engineers in China and France, Cellon creates several basic designs each year and spreads the costs among many buyers. It also has the technical expertise to morph that basic phone into a bewildering array of models. Want a 2-megapixel camera module instead of 1-megapixel? Want to include a music player, or change the style from a gray clamshell to a flaming-red candy-bar shape? No problem: Cellon engineers can whip up a prototype, run allthe tests, and get it into mass production in a Chinese factory in months.Moving Up the Food ChainCompanies are still figuring out exactly what to outsource. PalmOne Inc.'s collaboration with Taiwan's HTC on its popular Treo 650 smart phone illustrates one approach. Palm has long hired contractors to assemble hardware from its own industrial designs. But in 2001, it decided to focus on software and shifted hardware production to Taiwanese ODMs. PalmOne designers still determine the look and feel of the product, pick key components like the display and core chips, and specify performance requirements. But HTC does much of the mechanical and electrical design. "Without a doubt, they've become a part of the innovation process," says Angel L. Mendez, senior global operations vice-president at palmOne. "It's less about outsourcing and more about the collaborative way in which design comes together." The result: PalmOne has cut months off of development times, reduced defects by 50%, and boosted gross margins by around 20%.Hewlett-Packard, a company with such a proud history of innovation that its advertising tag line is simply "invent," also works with design partners on all the hardware it outsources. "Our strategy is now to work with global networks to leverage the best technologies on the planet," says Dick Conrad, HP's senior vice-president for global operations. According to iSuppli, HP is getting design help from Taiwan's Quanta and Hon Hai Precision for PCs, Lite-On for printers, Inventec for servers and MP3 players, and Altek for digital cameras. HP won't identify specific suppliers, but it says the strategy has brought benefits. Conrad says it now takes 60% less time to get a newconcept to market. Plus, the company can "redeploy our assets and resources to higher value-added products" such as advanced printer inks and sophisticated corporate software, he says.How far can outsourced design go? When does it get to the point where ODMs start driving truly breakthrough concepts and core technologies? It's not here yet. Distance is one barrier. "To be a successful product company requires intimacy with the customer," says Azim H. Premji, chairman of India's Wipro. "That is very hard to offshore in fast-changing markets." Another hurdle is that R&D spending by ODMs remains relatively low. Even though Premier develops most of its own cameras and video projectors, "the really core technology," such as the digital signal processors, is invented in the U.S., says vice-president Hsieh. Premier's latest wallet-size video projector, for example, was based on a rough design by Texas Instruments, developer of the core chip. With margins shrinking fast in the ODM business, however, Premier and other Taiwanese companies know they need to move up the innovation food chain to reap higher profits.That's where Flextronics and its design acquisitions could get interesting. Inside frog's hip Sunnyvale office, designers are working to create a radically new multimedia device, for an unnamed corporate client, that won't hit the market until 2007. The plan, says Patricia Roller, frog's co-CEO, is to use Flextronics software engineers in Ukraine or India to develop innovative applications, and for Flextronics engineers to design the working prototype. Flextronics then would mass-produce the gadgets, probably in China.Who will ultimately profit most from the outsourcing of innovationisn't clear. The early evidence suggests that today's Western titans can remain leaders by orchestrating global innovation networks. Yet if they lose their technology edge and their touch with customers, they could be tomorrow's great shrinking conglomerates. Contractors like Quanta and Flextronics that are moving up the innovation ladder, meanwhile, have a shot at joining the world's leading industrial players. What is clear is that an army of in-house engineers no longer means a company can control its fate. Instead, the winners will be those most adept at marshaling the creativity and skills of workers around the world.。

一、设置高级系统管理信息(ASM Information)：完成下列步骤来设置Remote Supervisor Adapter II的系统信息：1、登陆到需要设置系统信息的Remote Supervisor Adapter II上；2、在左边的导航栏中，点击System Settings，一个如下图的页面将会显示出来：注意：图中System Settings中的空白的区域内容是由所进入的远程服务器决定的。

3、在ASM Information部分的Name区域，输入Remote Supervisor Adapter II的名称。

使用这个名称可以指定一台服务器中的Remote Supervisor Adapter II，这个名称在e-mail、简单网络管理协议(SNMP)和数字传呼机的报警通知中用于识别来源时都会被用到。

注意：a、如果用户计划建立起一个SMTP简单邮件传输服务器来做邮件方式的报警通知，必须确认在Name区域的名称是可用的邮件地址的一部分。

b、Remote Supervisor Adapter II的名称(在Name区域)和IP主机名称(在Network Interfa ces页面的Host Name区域)不能使用自动共用的同一个名称，因为名称在ASM的Name 区域中被限制在15个字符之内，而在Host Name区域中可以包含63个字符。

为了减少混淆，将Name区域的名称设置为IP Host Name主机名称的一部分。

这个部分的IP Host N ame由完整的IP Host Name的第一段组成。

例如，完整的IP Host Name主机名称是asm ，那么部分的IP Host Name就是asmcard1。

4、在ID number区域，可以为Remote Supervisor Adapter II分配一个唯一的辨认数字。

5、在Contact区域，可以输入联系信息。

例如，用户可以指定一个如果这台服务器发生故障时需要联系的人的名字和电话号码。

国际商业机器科技产品(深圳)有限公司(ITPC)中国深圳南山区科技工业园长城大厦四层电话： 86-755-86362888 传真： 86-755-26728236邮政编码： 518057 Confidential编号：C074ST41发布日期：2007年第四季度IBM Storage DS3000 CFT 经销商奖励计划(文件号码： C074ST41)尊敬的IBM Storage产品CFT经销商：我谨代表国际商业机器科技产品（深圳）有限公司（ITPC）, 在此向您宣布,2007年第四季度IBM System Storage DS3000 CFT经销商奖励计划已正式推出了！一、前言：此2007年第四季度IBM Storage DS3000 CFT经销商奖励计划是以直接销售IBM Storage产品给最终用户的经销商（简称 “CFT 经销商”）提供的产品序列号和销售发票复印件将作为申请奖励的基础和依据，并与IBM DS3000系列总经销商(Distributor)提供的销售报告(DSR)进行核对，按销售的IBM Storage产品数量核算奖金，由国际商业机器科技产品（深圳）有限公司（“ITPC” ）以现金的形式将奖金分别发给符合条件的CFT经销商。

二、奖励计划的适用对象：所有在IBM Partner World网站上成功注册并在线签署了IBM Partner World Agreement的当前有效的IBM Storage产品的CFT经销商。

三、奖励计划适用的指定产品：IBM 存储产品，包括下列型号：Low End Disk: DS3000: 172621X/172622X/172641X/172642X/172631x/172632x说明：上述IBM产品必须是国际商业机器科技产品（深圳）有限公司公司在2007年4月1日后销售给IBM DS3000系列总经销商（Distributor）的产品，且不包括IBM DS3000系列总经销商使用SPECIAL BID价格或Demo价格购买的产品。

Package‘ibmAcousticR’October13,2022Title Connect to Your'IBM Acoustic'DataVersion0.2.1Description Authentication can be the most difficult part aboutworking with a new API.'ibmAcousticR'facilitates making aconnection to the'IBM Acoustic'email campaign management APIand executing various queries.The'IBM Acoustic'APIdocumentation is available at<https:///customer-engagement/docs/>.Thispackage is not supported by'IBM'.License CC0Encoding UTF-8LazyData trueDepends R(>=4.0.0)Imports jsonlite(>=1.7.0),httr(>=1.4.1),XML(>=3.99-0.5)RoxygenNote7.1.1NeedsCompilation noAuthor Chris Umphlett[aut,cre],Avinash Panigrahi[aut]Maintainer Chris Umphlett<******************************>Repository CRANDate/Publication2020-08-2805:20:03UTCR topics documented:acoustic_auth (2)get_all_contacts (3)get_contact_list (5)get_job_status (6)get_programs (7)Index812acoustic_auth acoustic_auth Connect to API and Obtain Access TokenDescriptionPrior to attempting this you must have a Client Id,Client Secret and Refresh Token.Thefirst two are assigned on an organization level;the latter must be created by someone with an admin role in Acoustic and assigned to you.Usageacoustic_auth(org_client_id,org_client_secret,my_refresh_token,pod_number)Argumentsorg_client_id Organization’s Client Id.org_client_secretOrganization’s Client Secret.my_refresh_tokenYour personal Refresh Token.pod_number Pod number is the number in the URL,.DetailsAccess tokens expire after four hours.Thus,this function should be run each time you utilize the package and may need to be re-called periodically if you have a session open for a long duration.It is not recommended that these authentication parameters be stored directly in your code.There are various methods and packages available that are more secure;this package does not require you to use any one in particular.More information on this available at https:///customer-engagement/tutorials/ getting-started-oauth-watson-campaign-automation/.ValueA vector with the session’s access token.Examples##Not run:access_token<-acoustic_auth(org_client_id="abc",org_client_secret="xyz",my_refresh_token="123")##End(Not run)get_all_contacts Get Export of All Email Contact EventsDescriptionThis function submits a job to Acoustic that exports all email contact events.Various criteria are available tofilter the export.Some,but not all,of these have been built into the parameters of this function.Reading the IBM Acoustic documentation is useful:https:///customer-engagement/tutorials/export-raw-contact-events/Usageget_all_contacts(pod_number,session_access_token,start_date,end_date,date_type="EVENT",event_types="<ALL_EVENT_TYPES/>",export_format=0,move_to_ftp=FALSE,exclude_deleted=FALSE,optional_columns=TRUE,file_name_prefix="",confirm_email="")Argumentspod_number Pod number is the number in the URL,.session_access_tokenAccess token obtained during this session.start_date Filter for emails sent on or after this date.end_date Filter for emails sent on or before this date.date_type Select whether the datefilters should be on the event date or the email sent date ("EVENT"or"SENT").event_types There are18different events.By default all event types are returned.This parameter takes XML arguments where you can override the default and specifyall of the events you want.See the Acoustic documentation for the full list.export_format Acoustic provides three delimiterfile types:0(CSV),1(PIPE),or2(TAB).CSV is the default used here.move_to_ftp If TRUE(default is FALSE)will sendfiles to SFTP server instead of being able to download manually from the portal.exclude_deletedDo you want to exclude contacts that have been deleted,can be TRUE/FALSE.Per Acoustic,"Inclusion of this element can greatly decrease the time to gener-ate the metricsfile and is useful whenever metrics for deleted contacts are notrequired."optional_columnsDo you want to include six optional columns in the results,can be TRUE/FALSE.These columns are the mailing name,mailing subject,from email address,fromemail name,CRM campaign Id,and program Id.file_name_prefixOptional argument that should be used if you want to add a particular prefix tothefile that you will download from your portal.confirm_email Optional argument to specify an email address where IBM will let you know when the job has completed.DetailsThe date type is set to EVENT by default.If youfilter by the sent date you may not get all applicable events,as some events(a future click)will not yet have happened.If you dofilter by SENT date and are incrementally updating your data you should plan to go back and retroactively update past dates.Job results are available as exports in the Silverpop portal by going to Resources->Data Jobs.It is not recommended that these authentication parameters be stored directly in your code.There are various methods and packages available that are more secure;this package does not require you to use any one in particular.ValueA vector with the Job Id.Examples##Not run:access_token<-acoustic_auth(org_client_id="abc",org_client_secret="xyz",my_refresh_token="123")job_id<-get_all_contacts(pod_number,access_token,"2020-01-01","2020-01-05",event_types="<CLICKS/>",1,exclude_deleted=TRUE,optional_columns=TRUE)##End(Not run)get_contact_list5 get_contact_list Get Export of a Database or contact ListDescriptionThis function submits a job to Acoustic that exports a particular database or contact list based on the list id.Various criteria are available tofilter the export.Some,but not all,of these have been built into the parameters of this function.Reading the IBM Acoustic documentation is useful: https:///customer-engagement/tutorials/export-from-a-database/Usageget_contact_list(pod_number,session_access_token,list_id,start_date,end_date,export_format="CSV",move_to_ftp=FALSE,confirm_email="")Argumentspod_number Pod number is the number in the URL,.session_access_tokenAccess token obtained during this session.list_id Acoustic id for the database or contact list(string).start_date Filter for emails sent on or after this date.end_date Filter for emails sent on or before this date.export_format Acoustic provides three delimiterfile types:CSV,PIPE,TAB.CSV is the default used here.move_to_ftp If TRUE(default is FALSE)will sendfiles to SFTP server instead of being able to download manually from the portal.confirm_email Optional argument to specify an email address where IBM will let you know when the job has completed.DetailsJob results are available as exports in the Silverpop portal by going to Resources->Data Jobs.It is not recommended that these authentication parameters be stored directly in your code.There are various methods and packages available that are more secure;this package does not require you to use any one in particular.6get_job_statusValueA vector with the Job Id.Examples##Not run:access_token<-acoustic_auth(org_client_id="abc",org_client_secret="xyz",my_refresh_token="123")job_id<-get_contact_list(pod_number,access_token,list_id,"2020-01-01","2020-01-05","PIPE")##End(Not run)get_job_status Get the Status of a Submitted JobDescriptionPrior to attempting this you must authenticate and obtain an access token,and then submit a call that is processed as a job to retrieve from the Acoustic portal.The function used to submit that job will provide the Job Id.Usageget_job_status(pod_number,session_access_token,desired_job_id)Argumentspod_number Pod number is the number in the URL,.session_access_tokenAccess token obtained during this session.desired_job_id Id for job for which you want the status.ValueA vector with the session’s access token.Examples##Not run:access_token<-acoustic_auth(org_client_id="abc",org_client_secret="xyz",my_refresh_token="123")job_id<-get_all_contacts(access_token)get_job_status(1,access_token,"123456789")##End(Not run)get_programs7 get_programs Get List of ProgramsDescriptionGet list of all programs in a particular date range.Prior to attempting this you must authenticate and obtain an access token.Usageget_programs(pod_number,session_access_token,start_date,end_date)Argumentspod_number Pod number is the number in the URL,e.g.1in .session_access_tokenAccess token obtained during this session.start_date Filter for programs created on or after this date.end_date Filter for programs created on or before this date.ValueA data frame with the programs and program details.Examples##Not run:access_token<-acoustic_auth(org_client_id="abc",org_client_secret="xyz",my_refresh_token="123")get_programs(1,access_token,"2020-01-01","2020-05-31")##End(Not run)Indexacoustic_auth,2get_all_contacts,3get_contact_list,5get_job_status,6get_programs,78。

在产品保修期后,为继续向用户提供高质星的使用保障和技术服务，用户可根据需要选择IBM的维护协议服务项目,继续向IBM购买高质臺的技术服务。

1.1非现场维护支持系统IBM公司将以IBM信息支持中心(800免费技术支持热线)和信息系统服务事业部观场设备维护维修)为服务支持体系提供售后服务。

服务内容包括：热线电话服务、E-Mail.远程诊断和现场服务四种方式。

"IBM就是服务"在全国31个城市提供免费电话支持;信息支持中心的技术服务人员会在24小时内回复客户电话。

信息支持中心的规模和投入1.1.1信息支持中心的实力和承诺作为IBM在中国最重要的投资项目,中心集合各种先逬技术,采取综合管理措施，以确保信息服勢中心高效运作。

不仅于此,还有数百名训练有素的技术专家为您解决难题。

更有全球IBM的世界级专家随时调用。

另外，IBM分布在全球的其他信息支持中心也可通过网络系统对IBM中国信息支持中心提供支援。

1.1.2信息支持中心提供的服务(1) 中国信息支持中心为客户、合作伙借是供售前、售中、售后，从信息推广到技术支持的全方位服务，如下图：(2)信息支持中心的架构IBM中国信息支持中心整和了IBM的市场推广中心,客户关系中心，技术支持中心，产品支持服务中心等部门。

市场推广中心和客户关系中心主要负责市场信息推广；通过各种通讯方式与顾客建立联系，提供最新产品信息；制订市场计划；对IBM已装机客户提供走期行业信息服务,满足不同行业客户对IBM产品和解决方案的咨询需求。

并受理客户投诉事宜。

技术支持中心针对客户和业务伙伴的技术问题指派技术专家，提供IBM全线产品远程和技术支持，包括：S/390、P系列、AS/400. PC、网络与软件、打印机等。

为客户提供售前产品技术问答及系统配置检查、解答售后技术安装问题。

并提供跨平台的系统支持。

产品支持服务中心通过热线为IBM的工程技术人员提供技术支持和服务。

确保工程进展顺利，节省用户宝贵时间。