SMD常用术语

 SMD常用术语

微组装技术﹕MPT/Microelectronic Packaging echnology

混装技术﹕Mixed Component Mounting Technology

封装﹕ Package

贴片﹕ Pick and Place

拆焊﹕ Desoldering

再流﹕Reflow

浸焊﹕ Dip Soldering

拖焊﹕ Drag soldering

印制电路﹕Printed Circuit

印制线路﹕ Printed Wiring

印制电路板﹕ printed circuit board

印制线路板﹕printed wiring board

层压板﹕laminate

覆铜薄层压板﹕copper-clad laminate

基材﹕base material

成品板﹕production board

印刷﹕printing

导电图形﹕conductive pattern

印制组件﹕printed component

单面印制板﹕single-sided printed board

双面印制板﹕double-sided printed board

多层印制板﹕multilayer printed board

电烙铁﹕ Iron

热风嘴﹕ hot air reflowing noozle

吸锡带﹕soldering wick

吸锡器﹕tin extractor

焊后检验﹕post-soldering inspection

目视检验﹕visual inspection

机器检验﹕ machine inspection

焊点质量﹕ soldering joint quality

焊电缺陷﹕ soldering jont defect

错焊﹕ solder wrong

漏焊﹕ solder skips

虚焊﹕ pseudo soldering

冷焊﹕ cold soldering

桥焊﹕ solder bridge

脱焊﹕ open soldering

焊点剥离﹕ solder off

不润湿焊点﹕ soldering nonwetting

锡珠﹕ solder ball

拉尖﹕ icicle ； solder projection

孔洞﹕ void 焊料爬越﹕ solder wicking

过热焊点﹕ overheated solder connection

不饱和焊点﹕ insufficient solder connection

过量焊点﹕ excess solder connection

微组装技术﹕MPT/Microelectronic Packaging echnology

混装技术﹕Mixed Component Mounting Technology

封装﹕ Package

贴片﹕ Pick and Place

拆焊﹕ Desoldering

再流﹕Reflow

浸焊﹕ Dip Soldering

拖焊﹕ Drag soldering

印制电路﹕Printed Circuit

印制线路﹕ Printed Wiring

印制电路板﹕ printed circuit board

印制线路板﹕printed wiring board

层压板﹕laminate

覆铜薄层压板﹕copper-clad laminate

基材﹕base material

成品板﹕production board

印刷﹕printing

导电图形﹕conductive pattern

印制组件﹕printed component

单面印制板﹕single-sided printed board

双面印制板﹕double-sided printed board

多层印制板﹕multilayer printed board

电烙铁﹕ Iron

热风嘴﹕ hot air reflowing noozle

吸锡带﹕soldering wick

吸锡器﹕tin extractor

焊后检验﹕post-soldering inspection

目视检验﹕visual inspection

机器检验﹕ machine inspection

焊点质量﹕ soldering joint quality

焊电缺陷﹕ soldering jont defect

错焊﹕ solder wrong

漏焊﹕ solder skips

虚焊﹕ pseudo soldering

冷焊﹕ cold soldering

桥焊﹕ solder bridge

脱焊﹕ open soldering

焊点剥离﹕ solder off

不润湿焊点﹕ soldering nonwetting

锡珠﹕ solder ball 拉尖﹕ icicle ； solder projection

孔洞﹕ void

焊料爬越﹕ solder wicking

过热焊点﹕ overheated solder connection

不饱和焊点﹕ insufficient solder connection

过量焊点﹕ excess solder connection

助焊剂剩余﹕ flux residue

焊料裂纹﹕ solder crazeing

焊角翘起﹕ fillet-lifting ；lift-off

AI :Auto-Insertion 自动插件

AQL :acceptable quality level 允收水平

ATE :automatic test equipment 自动测试

ATM :atmosphere 气压

BGA :ball grid array 球形矩阵

CCD :charge coupled device 监视连接组件(摄影机)

CLCC :Ceramic leadless chip carrier 陶瓷引脚载具

COB :chip-on-board 芯片直接贴附在电路板上

cps :centipoises(黏度单位) 百分之一

CSB :chip scale ball grid array 芯片尺寸BGA

CSP :chip scale package 芯片尺寸构装

CTE :coefficient of thermal expansion 热膨胀系数

DIP :dual in-line package 双内线包装(泛指手插组件)

FPT :fine pitch technology 微间距技术

FR-4 :flame-retardant substrate 玻璃纤维胶片(用来制作PCB材质)

IC :integrate circuit 集成电路

IR :infra-red 红外线

Kpa :kilopascals(压力单位)

LCC :leadless chip carrier 引脚式芯片承载器

MCM :multi-chip module 多层芯片模块

MELF :metal electrode face 二极管

MQFP :metalized QFP 金属四方扁平封装

NEPCON :National Electronic Package and

Production Conference 国际电子包装及生产会议

ppm:parts per million 指每百万PAD(点)有多少个不良PAD(点)

psi :pounds/inch2 磅/英吋2

PWB :printed wiring board 电路板

QFP :quad flat package 四边平坦封装

SIP :single in-line package

SIR :surface insulation resistance 绝缘阻抗

SMC :Surface Mount Component 表面黏着组件

SMD :Surface Mount Device 表面黏着组件

SMEMA :Surface Mount Equipment

Manufacturers Association 表面黏着设备制造协会

SMT :surface mount technology 表面黏着技术 SOIC :small outline integrated circuit

SOJ :small out-line j-leaded package

SOP :small out-line package 小外型封装

SOT :small outline transistor 晶体管

SPC :statistical process control 统计过程控制

SSOP :shrink small outline package 收缩型小外形封装

TAB :tape automaticed bonding 带状自动结合

TCE :thermal coefficient of expansion 膨胀(因热)系数

Tg :glass transition temperature 玻璃转换温度

THD :Through hole device 须穿过洞之组件(贯穿孔)

TQFP :tape quad flat package 带状四方平坦封装

UV :ultraviolet 紫外线

uBGA :micro BGA 微小球型矩阵

cBGA :ceramic BGA 陶瓷球型矩阵

PTH lated Thru Hole 导通孔

IA Information Appliance 信息家电产品

MESH 网目

OXIDE 氧化物

FLUX 助焊剂

LGA (Land Grid Arry)封装技术 LGA封装不需植球，适合轻薄短小产品

应用。

TCP (Tape Carrier Package)

ACF Anisotropic Conductive Film 异方性导电胶膜制程

Solder mask 防焊漆

Soldering Iron 烙铁

Solder balls 锡球

Solder Splash 锡渣

Solder Skips 漏焊

Through hole 贯穿孔

Touch up 补焊

Briding 穚接(短路)

Solder Wires 焊锡线

Solder Bars 锡棒

Green Strength 未固化强度(红胶)

Transter Pressure 转印压力(印刷)

Screen Printing 刮刀式印刷

Solder Powder 锡颗粒

Wetteng ability 润湿能力

Viscosity 黏度

Solderability 焊锡性

Applicability 使用性

Flip chip 覆晶

Depaneling Machine 组装电路板切割机