企业常用英文缩写释义

5S : 整理(SEIRI)、整頓(SEITON)、清掃(SEISO)、清潔(SEIKETSU)及身美(SHITSUKE)五種行為ABC : 作業製成本制度(Activity-Based Costing)ABB : 實施作業制預算制度(Activity-Based Budgeting)ABM : 作業製成本管理(Activity-Base Management)APS : 先進規畫與排程系統(Advanced Planning and Scheduling)ASP : 應用程式服務供應商（Application Service Provider）ATP : 可承諾量(Available To Promise)AVL : 認可的供應商清單(Approved Vendor List)BOM : 物料清單(Bill Of Material)BPR : 企業流程再造(Business Process Reengineering)BSC : 平衡記分卡(Balanced ScoreCard)BTF : 計畫生產(Build To Forecast)BTO : 訂單生產(Build To Order)CPM : 要徑法(Critical Path Method)CPM : 每一百萬個使用者會有幾次抱怨(Complaint per Million)CRM : 客戶關係管理(Customer Relationship Management)CRP : 產能需求規劃(Capacity Requirements Planning)CTO : 客制化生產(Configuration To Order)DBR : 限制驅導式排程法(Drum-Buffer-Rope)DMT : 成熟度驗證(Design Maturing Testing)DVT : 設計驗證(Design Verification Testing)DRP : 運銷資源計畫(Distribution Resource Planning)DSS : 決策支援系統(Decision Support System)EC : 設計變更／工程變更(Engineer Change)EC : 電子商務(Electronic Commerce)ECRN : 原件規格更改通知(Engineer Change Request Notice)EDI : 電子資料交換(Electronic Data Interchange)EIS : 主管決策系統(Executive Information System)EMC : 電磁相容(Electric Magnetic Capability)EOQ : 基本經濟訂購量(Economic Order Quantity)ERP : 企業資源規劃(Enterprise Resource Planning)FAE : 應用工程師(Field Application Engineer)FCST : 預估(Forecast)FMS : 彈性製造系統(Flexible Manufacture System)FQC : 成品品質管制(Finish or Final Quality Control)IPQC : 制程品質管制(In-Process Quality Control)IQC : 進料品質管制(Incoming Quality Control)ISO : 國際標準組織(International Organization for Standardization) ISAR : 首批樣品認可(Initial Sample Approval Request)JIT : 即時管理(Just In Time)KM ：知識管理(Knowledge Management)L4L : 逐批訂購法(Lot-for-Lot)LTC : 最小總成本法(Least Total Cost)LUC : 最小單位成本(Least Unit Cost)MES : 製造執行系統(Manufacturing Execution System)MO : 制令(Manufacture Order)MPS : 主生產排程(Master Production Schedule)MRO : 請修(購)單(Maintenance Repair Operation)MRP : 物料需求規劃(Material Requirement Planning)MRPII : 製造資源計畫(Manufacturing Resource Planning)NFCF : 更改預估量的通知Notice for Changing ForecastOEM : 委託代工(Original Equipment Manufacture)ODM : 委託設計與製造(Original Design & Manufacture)OLAP : 線上分析處理(On-Line Analytical Processing)OLTP : 線上交易處理(On-Line Transaction Processing)OPT : 最佳生產技術(Optimized Production Technology)OQC : 出貨品質管制(Out-going Quality Control)PDCA : PDCA管理迴圈(Plan-Do-Check-Action)PDM : 產品資料管理系統(Product Data Management)PERT : 計畫評核術(Program Evaluation and Review Technique)PO : 訂單(Purchase Order)POH : 預估在手量(Product on Hand)PR : 採購申請Purchase RequestQA : 品質保證(Quality Assurance)QC : 品質管制(Quality Control)QCC : 品管圈(Quality Control Circle)QE : 品質工程(Quality Engineering)RCCP : 粗略產能規劃(Rough Cut Capacity Planning)RMA : 退貨驗收Returned Material ApprovalROP : 再訂購點(Re-Order Point)SCM : 供應鏈管理(Supply Chain Management)SFC : 現場控制(Shop Floor Control)SIS : 策略資訊系統(Strategic Information System)SO : 訂單(Sales Order)SOR : 特殊訂單需求(Special Order Request)SPC : 統計制程管制(Statistic Process Control)TOC : 限制理論(Theory of Constraints)TPM : 全面生產管理Total Production ManagementTQC : 全面品質管制(Total Quality Control)TQM : 全面品質管理(Total Quality Management)WIP : 在製品(Work In Process)ABC Absolute Best Cost (is a procurement strategy to secure the best costs fora part)AFR Annual Failure ReturnETD Estimated time of departure 估計出發時間ETA Estimated time of arriveAMO After Market OptionsWWAN (Wireless Wide Area Network) 是指傳輸範圍可跨越國家或不同城市之間的無線網路AN The product line code for MCD COMMERCIAL regionsAPJ Asia Pacific and JapanAPL Approved Partner ListFPC PCB" 柔性電路板(柔性RMAPCB): 簡稱"軟板", 又稱"柔性線路板", 也稱"軟性線路板、撓性線路板"或"軟性電路板、撓性電路板","FPCB, Flexible and Rigid-Flex".APO Advanced Planning OptimizationASN Advance Shipment NoticeASP Average Selling PriceATP Acknowledge to Production (order acknowledgement methodology)AUP Average Unit Price (sometimes used interchangeably with ASP)AV Refers to the Marketing Feature level of the BOM (2nd level). Is unique by family/platform/business modelAVL Approved Vendor ListAVLC Available Vendor List CandidateBCPL Blind Corporate Price List - When a product becomes "orderable" for the customerBDD Business Desktop Division - Is now defunct - the HP legacy busines desktop groupBOM Bill of MaterialBPN Business Products North America (Pre-Merger HP term for North America region…sometimes referred to as PPMD)BRD Business Requirements DocumentBRP Business Revenue PlanBT Build TriggerBTCO Build to Customer OrderBTO Build to OrderBTS Build-to-stock (situation where you ask factory to build units and stock FGI at their site before orders arrive)CDS Compal Direct ShipCFZ Code FreezeCIR Consumer IR(OEIC) 光電子集成電路CM Contract ManufacturersCNY Chinese New YearCO Customer Order (a term used in ICON - it is how daily demand is input into ICON) OR Change OrderCOA Certificate of Authenticity - most commonly refers to the Microsoft licensing label that is used on our PCsCRT 阴极射线管（Cathode Ray Tube）的显示器COGS Cost of Goods Sold (usually represented as a percentage of revenue)COS Cost of SalesCPB Company Performance BonusCPC Consumer PC Division - refers to the consumer desktop division based in Cupertino, CaliforniaCPL Corporate Price ListCPMO Region: China (refers to both their operations region and their regional manufacturing site)CPP Commodity Purchase PlanCPU Central Processing UnitCT Commodity TrackingCTO Configure to OrderCWSP Confirmed Weekly Shipment PlanDB Design BuildDC Distribution CenterDIB Drop in BoxDO Design Objective (Project or PLC Milestone - Establish Objectives of a project or new part)DoD Department of DefenseDOS Days of SupplyDR Delivery Request (An order placed by the region on the ODM for delivery) DRCD Driver CDDSM Demand Supply MatchingDSP Depot-Specific Supply Chain - ICON term to describe where/how a product is distributed in the MRP toolFW Firm wareECO Enterprise Core ObjectsECO Engineering Change OrderECR Engineering Change RecordEMEA Europe, Middle-East and Africa (is the Europe region)EOL End of LifeEPC Electronic Product Code (RFID technology provider)ESG Enteriprise Systems GroupEDID Extended Display Identification DATA，即扩展显示识别数据EURP End-User Replaceable PartsFCS First Customer ShipFCT Factory Cycle Time (measures the time it takes the factory to produce and ship the product once they have the ually measured in days)FDD Floppy Disk DriveFLC Factory Learning CurveFPU Factory Produce Unit (IPG term)FTO Flexible Time-off (HP term for vacation time)GBU General Base Unit (Pre-merger HP) OR…General Business Unit (new HP)GFI Go For Intro (PLC and project milestone - indicates this project is ready to start implementation)GPS Global Procurement ServicesHDD Hard Disk DriveHDCP (High-bandwidth Digital Content Protection)HOI HP-Owned InventoryHPD HP DirectHPS HP ServicesI/L Investigation to Lab (PLC milestone - freezes product definition)IDC Inventory Driven CostsIDP Individual Development PlanIDS International Direct ShipOOC Out of characterIES Inventec ChinaIPO International Procurement Organization - now called GPS in some entities IQDC Integrated Quality Data CollectionIUR IXXXX Unit RequestPP SAMPLE SP : 指產品的打樣制作；Sample PhasePP ：指產品小批量試做；Production PhaseMP ：指產品進入大量生產Mass PhaseIWT Inter Warehouse Transfer (a term used in ICON that gives the value of the demand plan per sku)KMAT Configurable Material (SAP term)KV The product line code for MCD RETAIL regionsKWL Keyboard Warning LabelLADO Region: Latin America (Latin America Distribution Organization)LCD Liquid Crystyal DisplayLCPL Live Customer Product List - product number and pricing visibleLi-ION Lithion-Ion: Battery technologyLT Lead TimeLTB Last Time Buy - is used when a component/product is going to become EOL MADP Most Accurate Demand PlanMAP Material Availability Plan OR Mobile Attainment Plan (used by Marketing Ops to outline the volumes we want to ship from a revenue standpoint)MAS Material Availbility Split - HP internal term to refer to our tool/process to support material availability visibility to the regionsMCD Mobile Computing Division (pre-merger HP Mobile Computing Division)MDL Module - is a MCD feature naming convention for Floppy Disk Drive or Optical Disk DriveMF Marketing ForecastMIR Mail In RebateMIT Multimedia Integration TestMOH Manufacturing OverheadMP Mass ProductionMR Manufacturing Release (PLC milestone - beginning of volume production) MRD Marketing Requirements DocumentMRP Materials Requirement PlanningMSP Master Shipment PlanMTD Month to DateMV Manufacturing ValidationNA Another name for North America COMMERCIALNACC North America Consumer Computing - refers to the NA consumer region NAM North America RegionNB NotebookNiMH Nickel-Metal Hydride: Battery technology (boy…this is old!)NPI New Product IntroductionNRP Net Requirement PlanOCT Order Cycle TimeODD Optical Disk DriveODM Original Design ManufacturerOEM Original Equipment ManufacturerOH On-Hand (usually refers to inventory)OP Order ProcessingOPEC Oem Product data management External Collaboration for PSGOS Operating SystemOSS Outsourced serviceOT OvertimeOTS Observation Tracking SystemPCB Printed Circuit BoardPCBA Printed Ciruit Board AssemblyPDD Program Definition DocumentsPDG Product Data GenerationPDM BOM Data Warehouse System (Product Data Management) 產品資料管理系統PL Product LinePLC Product Life CyclePMC Pre-Merger CompaqPMH Pre-Merger Hewlett-PackardPMP Process Management PlanPNOP Part number on PartPO Purchase order订单pxe 網絡啟動模式POD Print On DemandTPM Total Productive Management全面生產管理POR Plan of Record (a general "roadmap" of a product that indicates estimated product forecast, features, etc.)PPMD Region: North America (Personal Information Products Manufacturing & Distribution) or BPN (see above)PRISM Preinstall Reengineering Initiative of Software ManufacturingPSDA Region: Asia PacificPSDE Region: EuropePSG Personal Systems GroupPTRPTT Post, Telegraph and Telephone AuthorityPV Product ValidationPWSP Preliminary Weekly Shipping PlanQBR Quarterly Business ReviewR10 SCITS Material Availability report (is at subassembly level)R11 SCITS Open Orders at the ODMR12 SCITS Shipments from the factoryR16 SCITS Factory BOMR5 SCITS Inventory reportRACDRACD Region Applicatioin CDRAD Reseller Arrival DatesRAM Random Access MemoryRAR Regional Allocation RulesRASRCD Recovery Compact Disc (Includes Windows, etc.)RCTO Regional Configure to Order - describes the SC postponement model where regionally-managed factories configure notebook unitsRDP Regional Demand PlanRFS Required for SetupRICAR Regional Inventory Cost Allocation Rules (used for allocating inventory costs back to the regions)RMN Regulatory Model NumberRMA Return(ed) Material AuthorizationROW Rest of WorldRQM Release Qual MatrixRSBT Radically Simple Better Together (Marketing Value Proposition for HP products)RSL Recommended Spares ListRSN Regional Supply Netting (solution until SNP)RT MCD code name for the US retail regionRTF Read This FirstRTP Release to Production - describes an order management methodology where orders are released only to available supplySA Subassembly (is the 3rd level of the BOM) and is the level at which regional DSM occursSCBO Supply Chain Business Operations (formerly PSDE, Europe region)SCITS Supply Chain Information Transfer Standard - the standard we use to transfer data between ODM, regions and GBUSCM Support Configuration MatrixSI System IntegrationSKU Stock-Keeping Unit (HP classic uses sku to refer to a model number)SKU Store Keeping UnitSLA Service Level AgreementSMB Small-Medium BusinessSMBC Small-Medium Business and ConsumerSMI Supplier Managed InventorySMT Surface Mounted Technology (used in motherboard preparation)SNP APO Module: Supply Network PlanningSOI Supplier-Owned InventorySR Ship Release (What the delivery engineers must do before a sku can be ordered by the regions)SRP SKU Reengineering ProcessST Sell-ThroughSVTP System Validation Test PlanSWMR Software Manufacturing Release (?)TAC Transfer at Cost - often refers to units we sell internally (for new employee equipemnt setup, etc)TAT Turn Around TimeTCE Total Customer ExperienceUAT User Acceptance TestUCUDF Unit Configuration User Defined Format, pre-CompeqUI User InterfaceVAR Value-Added ResellerVCM Variable Contribution MarginVMI Vendor Managed InventoryWDP Weekly Demand Plan (the same as Weekly Shipping Plan)WIF "What-if" demand - used primarily by NACC to describe their uncommitted demand scenarioWOS Weeks of SupplyWPTR Worldwide Product Tracking Record, pre-HPWSP Weekly Shipping PlanWWF Worldwide FulfillmentWWP Worldwide PlanningWWSNRS World Wide Serial Number Repository。

企業常用縮寫5S : 5S管理ABC : 作業制成本制度 (Activity-Based Costing)ABB : 實施作業制預算制度 (Activity-Based Budgeting)ABM : 作業制成本管理 (Activity-Base Management)APS : 先進規畫與排程系統(Advanced Planning and Scheduling) ASP : 應用程式服務供應商（Application Service Provider）ATP : 可承諾量 (Available To Promise)AVL : 認可的供應商清單(Approved Vendor List)BOM : 物料清單 (Bill Of Material)BPR : 企業流程再造(Business Process Reengineering)BSC : 平衡記分卡 (Balanced ScoreCard)BTF : 計劃生產 (Build To Forecast)BTO : 訂單生產 (Build To Order)CPM : 要徑法(Critical Path Method)CPM : 每一百萬個使用者會有幾次抱怨(Complaint per Million) CRM : 客戶關係管理(Customer Relationship Management) CRP : 產能需求規劃(Capacity Requirements Planning)CTO : 客製化生產 (Configuration To Order)DBR : 限制驅導式排程法 (Drum-Buffer-Rope)DMT : 成熟度驗證(Design Maturing Testing)DVT : 設計驗證(Design Verification Testing)DRP : 運銷資源計劃 (Distribution Resource Planning)DSS : 決策支援系統(Decision Support System)EC : 設計變更／工程變更 (Engineer Change)EC : 電子商務 (Electronic Commerce)ECRN : 原件規格更改通知(Engineer Change Request Notice)EDI : 電子資料交換(Electronic Data Interchange)EIS : 主管決策系統(Executive Information System)EMC : 電磁相容(Electric Magnetic Capability)EOQ : 基本經濟訂購量(Economic Order Quantity)ERP: 企業資源規劃(Enterprise Resource Planning)FAE : 應用工程師(Field Application Engineer)FCST : 預估(Forecast)FMS : 彈性製造系統 (Flexible Manufacture System)FQC : 成品品質管制(Finish or Final Quality Control)IPQC : 製程品質管制 (In-Process Quality Control)IQC : 進料品質管制(Incoming Quality Control)ISO : 國際標準組織 (International Organization for Standardization) ISAR : 首批樣品認可(Initial Sample Approval Request)JIT : 即時管理 (Just In Time)KM ：知識管理 (Knowledge Management)L4L : 逐批訂購法 (Lot-for-Lot)LTC : 最小總成本法 (Least Total Cost)LUC : 最小單位成本 (Least Unit Cost)MES : 製造執行系統(Manufacturing Execution System)MO : 製令(Manufacture Order)MPS : 主生產排程(Master Production Schedule)MRO : 請修(購)單(Maintenance Repair Operation)MRP : 物料需求規劃 (Material Requirement Planning)MRPII : 製造資源計劃(Manufacturing Resource Planning)NFCF : 更改預估量的通知Notice for Changing ForecastOEM : 委託代工(Original Equipment Manufacture)ODM : 委託設計與製造(Original Design & Manufacture)OLAP : 線上分析處理 (On-Line Analytical Processing)OLTP : 線上交易處理 (On-Line Transaction Processing)OPT : 最佳生產技術 (Optimized Production Technology)OQC : 出貨品質管制(Out-going Quality Control)PDCA : PDCA管理循環 (Plan-Do-Check-Action)PDM : 產品資料管理系統(Product Data Management)PERT : 計畫評核術 (Program Evaluation and Review Technique)PO : 訂單(Purchase Order)POH : 預估在手量(Product on Hand)PR : 採購申請Purchase RequestQA : 品質保證(Quality Assurance)QC : 品質管制(Quality Control)QCC : 品管圈(Quality Control Circle)QE : 品質工程(Quality Engineering)RCCP : 粗略產能規劃(Rough Cut Capacity Planning)RMA : 退貨驗收Returned Material ApprovalROP : 再訂購點 (Re-Order Point)SCM : 供應鏈管理 (Supply Chain Management)SFC : 現場控制(Shop Floor Control)SIS : 策略資訊系統 (Strategic Information System)SO : 訂單(Sales Order)SOR : 特殊訂單需求(Special Order Request)SPC : 統計製程管制(Statistic Process Control)TOC : 限制理論 (Theory of Constraints)TPM : 全面生產管理Total Production ManagementTQC : 全面品質管制(Total Quality Control)TQM : 全面品質管理(Total Quality Management)WIP : 在製品(Work In Process)5S管理5S是由日本企業研究出來的一種環境塑造方案，其目的在藉由整理(SEIRI)、整頓(SEITON)、清掃(SEISO)、清潔(SEIKETSU)及身美(SHITSUKE)五種行為來創造清潔、明朗、活潑化之環境，以提高效率、品質及顧客滿意度。

企業常用英文縮寫5S : 5S管理ABC : 作業制成本制度 (Activity-Based Costing)ABB : 實施作業制預算制度 (Activity-Based Budgeting)ABM : 作業制成本管理 (Activity-Base Management)AD : 資訊稽核(Audit Data)AI : 自動插件(Auto Insertion)ANOVA: 方差分析(Analysis Of Variance)APD : 亞源科技股分有限公司(Asian Power Devices Inc)APQP : 產品質量先期規劃(Advanced Product QualityPlanning)APS : 先進規畫與排程系統 (Advanced Planning and Scheduling)ASP : 應用程式服務供應商（Application Service Provider）ATP : 可承諾量 (Available To Promise)AVL : 認可的供應商清單(Approved Vendor List)B : 料表(Bill Of Material)BOM : 物料清單 (Bill Of Material)BPR : 企業流程再造 (Business Process Reengineering) BSC : 平衡記分卡 (Balanced Score Card)BTF : 計劃生產 (Build To Forecast)BTO : 訂單生產 (Build To Order)CL : 中限(Center Limit)CPM :要徑法 (Critical Path Method)CPM : 每一百萬個使用者會有幾次抱怨(Complaint per Million) CRM :客戶關係管理 (Customer Relationship Management) CRP : 產能需求規劃 (Capacity Requirements Planning)CS : 客服部(Customer Service)CTO : 客製化生產 (Configuration To Order)DBR : 限制驅導式排程法 (Drum-Buffer-Rope)DCC : 資料中心(Data Control Center)DCP : 動態控制計劃(Dynamic Control Planning)Dept : 部門單位( Department)DFMEA: 設計失效模式與效能分析(Design Failure Model and Effects Analysis)DMT : 成熟度驗證(Design Maturing Testing)DOP : 試驗設計(Design Of Experiment)DPM : 每分鐘(Disintegrations Per Minute)DV : 設計確認/驗證(Design Validation/Verification)DVT : 設計驗證(Design Verification Testing)DRP : 運銷資源計劃 (Distribution Resource Planning)DSS : 決策支援系統 (Decision Support System)E : 線路圖(Electrics circuit)EC : 設計變更／工程變更 (Engineer Change)EC : 電子商務 (Electronic Commerce)ECRN : 原件規格更改通知(Engineer Change Request Notice) EE : 電子工程(Electrical Engineering)EDI : 電子資料交換 (Electronic Data Interchange)EIS : 主管決策系統 (Executive Information System)EMC : 電磁相容(Electric Magnetic Capability)EN : 工程部(Engineering)EOQ :基本經濟訂購量 (Economic Order Quantity)ERP : 企業資源規劃 (Enterprise Resource Planning)FAE : 應用工程師(Field Application Engineer)FCS : 預估(Forecast)FMEA : 潛在失效模式與效能分析(Failure Model and EffectsAnalysis)FMS : 彈性製造系統 (Flexible Manufacture System)FN : 財務(Finance)FN : 工程變更公告(Factory Notice)FQC : 成品品質管制 (Finish or Final Quality Control)GA : 總務(General Administration)HR : 人事,人力資源(Human Resource)IC : 集成塊,集成電路(Integrated Circuit)IE : 工業工程(Industrial Engineering)INF : 信息(Information)INT : 內控(Internal)IPQC : 製程品質管制 (In-Process Quality Control)IQC : 進料品質管制 (Incoming Quality Control)ISO : 國際標準組織 (International Organization for Standardization) ISAR : 首批樣品認可(Initial Sample Approval Request)JIT : 即時管理 (Just In Time)KM : 知識管理 (Knowledge Management)L : PCB圖(League)L4L : 逐批訂購法 (Lot-for-Lot)LSL : 下限(Lower Spec Limit )LTC : 最小總成本法 (Least Total Cost)LUC : 最小單位成本 (Least Unit Cost)ME : 材料工程(Material Engineering )MES : 製造執行系統 (Manufacturing Execution System)MG : 行政部,管理部(Management)MIS : 資訊中心(管理信息系統/服務)(Management InformationSystem / Service)MO : 製令(Manufacture Order)MPS : 主生產排程 (Master Production Schedule)MRO : 請修(購)單(Maintenance Repair Operation)MRP :物料需求規劃 (Material Requirement Planning) MRPI : 製造資源計劃 (Manufacturing Resource Planning) MSA : 量測系統分析(Measurement Systems Analysis ) MTBF : 平均故障間隔時間(Mean Time Between Failures) MTTFF: 平均首次故障時間(Mean Time First Failures)NA : 不適用,無關(Not Applicable)NFCF : 更改預估量的通知(Notice for Changing Forecast) NG : 不好的,缺點(Not Good)OEM : 委託代工 (Original Equipment Manufacture)ODM : 委託設計與製造 (Original Design & Manufacture) OLAP : 線上分析處理 (On-Line Analytical Processing) OLTP : 線上交易處理 (On-Line Transaction Processing) OM : 操作手冊(Operation Manual)OP : 環境秩序系統(0rder Program)OPC : 現行過程能力(Ongoing Process Capability)OPT : 最佳生產技術 (Optimized Production Technology) OQC :出貨品質管制 (Out-going Quality Control)ORT : 出貨信賴性測試(Outgoing Reliability Testing)P : 生產注意事項(Production)PCR : 制造變更需求(Process Change Request)PCS : 片,個(pieces)PDCA : PDCA管理循環 (Plan-Do-Check-Action)PDM :產品資料管理系統 (Product Data Management) PE : 製造工程(Production Engineering)PERT : 計畫評核術 (Program Evaluation and ReviewTechnique)PFMEA: 製造失效模式與效能分析(Production Failure Model and Effects Analysis)PG : 制程規劃(Process Guide)PM : 生管(Production Manage) PO : 訂單(Purchase Order)POH : 預估在手量 (Product on Hand)PPAP : 量產零組件承認程序(Production parts Approval Program)PPK : 初始制程能力分析(Pre-Process Analysis)PPM : 百萬分之……(Parts Per Million)PQC : 在線品管(Process Quality Control)PR : 採購申請(Purchase Request)PR : 制造部(Production)PR1 : 制造一課 (Production 1 )PR 2 : 制造二課(Production 2 )PR 3 : 制造三課(Production 3 )PT : 作業流程表(Operation Flow Chart)PU : 采購(Purchase)QA : 品質保證(Quality Assurance)QC : 品質管制(Quality Control)QCC :品管圈 (Quality Control Circle)QE : 品質工程(Quality Engineering)QS : 品質系統(Quality System)QSA : 質量體系評定(Quality System Assessment)Q`TY : 數量(Quantity)RC : 表單記錄(Record)RCCP : 粗略產能規劃 (Rough Cut Capacity Planning)RD : 研發(Research & Develop)REP : 可靠性工程計劃(Reliability Engineering Plan)REV : 版本,更新版本(Renewal Version)RMA : 退貨驗收(Returned Material Approval)RMS : 可靠性,維修性.保障性.(Reliability Maintainability Supportability) ROP : 再訂購點 (Re-Order Point)S : 電氣規格書畫(Specifications)SCM :供應鏈管理 (Supply Chain Management)SFC : 現場控制 (Shop Floor Control)SIS : 策略資訊系統 (Strategic Information System)SMD : 表面貼裝設備(Surface Mounting Device)SMT : 表面貼裝技術(Surface Mounting Technology)SO : 訂單(Sales Order)SOR : 特殊訂單需求(Special Order Request)SPC : 統計製程管制 (Statistic Process Control)SPS : 開關電源(Switch Power Supply)SQM : 平方米(Square Meter)ST : 貨倉,倉儲(Storage)T : 電氣測試項目(Test)TE : 測試工程(Test Engineering)TE : 教學提綱,教材(Teaching)TOC : 限制理論 (Theory of Constraints)TPM : 全面生產管理Total Production ManagementTQC : 全面品質管制 (Total Quality Control)TQM :全面品質管理 (Total Quality Management)U.S.A: 美國(United States Of America)USL : 上限(Upper Spec Limit)WG : 作業指導書(Working Guide)WIP : 在製品 (Work In Process)WS : 標準作業規範(Working Standard)。

企业常见英文缩写RM(raw material):原材料PP(purchased parts):外购件FP(finished products):完工产品QTY(quantity):数量品质人员名称类QC quality control 品质管理人员FQC final quality control 终点质量管理人员IPQC in process quality control 制程中的质量管理人员OQC output quality control 最终出货质量管理人员IQC incoming quality control 进料质量管理人员TQC total quality control 全面质量管理POC passage quality control 段检人员QA quality assurance 质量保证人员OQA output quality assurance 出货质量保证人员QE quality engineering 品质工程人员品质保证类FAI first article inspection 新品首件检查FAA first article assurance 首件确认CP capability index 能力指数媵CPK capability process index 模具制程能力参数SSQA standardized supplier quality audit 合格供货商品质评估FMEA failure model effectiveness analysis 失效模式分析FQC运作类AQL Acceptable Quality Level 运作类允收品质水准S/S Sample size 抽样检验样本大小ACC Accept 允收REE Reject 拒收CR Critical 极严重的MAJ Major 主要的MIN Minor 轻微的Q/R/S Quality/Reliability/Service 品质/可靠度/服务P/N Part Number 料号藊L/N Lot Number 批号AOD Accept On Deviation 特采UAI Use As It 特采FPIR First Piece Inspection Report 首件检查报告PPM Percent Per Million 百万分之一制程统计品管专类SPC Statistical Process Control 统计制程管制SQC Statistical Quality Control 统计质量管理GRR Gauge Reproductiveness & Repeatability 量具之再制性及重测性判断量可靠与否DIM Dimension 尺寸DIA Diameter 直径N Number 样品数其它品质术语类QIT Quality Improvement Team 品质改善小组ZD Zero Defect 零缺点QI Quality Improvement 品质改善QP Quality Policy 目标方针TQM Total Quality Management 全面品质管理RMA Return Material Audit 退料认可7QCTools 7 Quality Control Tools 品管七大手法通用之件类ECN Engineering Change Notice 工程变更通知(供货商)ECO Engineering Change Order 工程改动要求(客户)PCN Process Change Notice 工序改动通知PMP Product Management Plan 生产管制计划SIP Standard Inspection Procedure 制程检验标准程序SOP Standard Operation Procedure 制造作业规范 IS Inspection Specification 成品检验规范BOM Bill Of Material 物料清单PS Package Specification 包装规范SPEC Specification 规格DWG Drawing 图面系统文件类ES Engineering Standard 工程标准IWS International Workman Standard 工艺标准ISO International Standard Organization 国际标准化组织GS General Specification 一般规格部类PMC Production & Material Control 生产和物料控制PCC Product control center 生产管制中心PPC Production Plan Control 生产计划控制MC Material Control 物料控制DC Document Center 资料中心QE Quality Engineering 品质工程(部)QA Quality Assurance 品质保证(处)QC Quality Control 质量管理(课)PD Product Department 生产部LAB Laboratory 实验室IE Industrial Engineering 工业工程R&D Research & Design 设计开发部生产类PCs Pieces 个(根,块等)PRS Pairs 双(对等)CTN Carton 卡通箱PAL Pallet/skid 栈板PO Purchasing Order 采购订单MO Manufacture Order 生产单D/C Date Code 生产日期码ID/C Identification Code (供货商)识别码]SWR Special Work Request 特殊工作需求L/N Lot Number 批号P/N Part Number 料号OEM Original Equipment Manufacture 原设备制造PC Personal Computer 个人计算机CPU Central Processing Unit 中央处理器A.S.A.P As Soon As Possible 尽可能快的E-MAIL Electrical-Mail 电子邮件N/A Not Applicable 不适用QTY Quantity 数量I/O input/output 输入/输出NG Not Good 不行,不合格C=0 Critical=0 极严重不允许APP Approve 核准,认可,承认CHK Check 确认ASS''Y Assembly 装配,组装T/P True Position 真位度5WIH When, Where, Who, What, Why, How to6M Man, Machine, Material, Method, Measurement, Message4MTH Man, Material, Money, Method, Time, How 人力,物力,财务,技术,时间(资源)SQA Strategy Quality Assurance 策略品质保证DQA Design Quality Assurance 设计品质保证MQA Manufacture Quality Assurance 制造品质保证SSQA Sales and service Quality Assurance 销售及服务品质保证LRR Lot Reject Rate 批退率DVD Digital Video DiskVCD Video Compact DiskLCD Liquid Crystal DisplayCAD Computer Aided DesignCAM Computer Aided ManufacturingCAE Computer Aided EngineeringPCB Printed Circuit Board 印刷电路板CAR Correction Action Report 改善报告NG Not Good 不良WDR Weekly Delivery Requirement 周出货要求PPM Percent Per Million 百万分之一TPM Total Production Maintenance 全面生产保养MRP Material Requirement Planning 物料需计划OS Operation System 操作系统TBA To Be Assured 待定,定缺D/C Drawing ChangeP/P Plans & ProcedureEMI Electrical-Music Industry 电子音乐工业Electrical Magnetic Interference 电子干扰RFI Read Frequency Input 读频输入MMC Maximum Material ConditionMMS Maximum Material Size XsLMC Least Material ConditionLMS Least Material Size UmLED lighting-emitting diode 发光二极管QBR Quarter Business RecordCIP Continuous improvement processFGI Forecasted Goal InventoryCNC Computerized numeral controllerB2C Business to customerB2B Business to businessAVL Approved vendor listPOP Procedure of packagingEOL End of lifeVDCS Vender defect correcting sheetPDCS Process defect correcting sheetGRN Goods receiving noteA/R Accounting receivableA/P Accounting payable。

企业常用术语缩写全称及释义MTO――按订单生产〔Make to Order〕ETO――按订单设计MTS――库存生产〔Make-to-Stock〕PAPC――生产和流程控制〔Production and Process Control〕DHR――器械历史文件〔Device History Record〕NCR――不合格〔Non-conformance〕CAPA――纠正和预防措施〔Corrective And Preventive Activity〕NPV――净现值〔Net Present Value〕IRR――内部收益率〔Internal Rate of Return〕PP――回收期〔Payback Period〕SPC――统计过程控制〔Statistic process control〕B OM――物料清单〔Bill of Material〕OBOM――订单BOMMBOM――生产制造物料清单EBOM――工程设计BOMPBOM――工艺规划BOMSBOM――销售BOMPLM――产品生命周期管理〔Product Lifecycle Management〕PDM――产品数据管理〔Product Data Management〕CAD――电脑辅助设计〔Computer Added Design〕CAPP――电脑辅助工艺设计〔Computer Aided Process Planning〕KPI――关键绩效指标〔Key Performance Index〕SOA――面向服务架构〔Service Oriented Architecture〕WAN――广域网〔Wide Area Network〕LAN――局域网〔Local Area Network〕MAN――城域网〔Metropolitan Area Network〕TCP――传输控制协议〔Transfer Control Protocol〕IP――网际协议〔Internet Protocol〕ASN――预先发货通知〔Advanced Shipment Notice〕MHE――物料处理设备〔Material Handling Equipment〕EMEA―― 欧洲、中东和非洲CRM――客户关系管理〔Customer Relationship Management〕SCM――供给链管理〔Supply Chain Management〕BI――商业智能〔Business Intelligence〕LDAP――轻量级目录访问协议〔Lightweight Directory Access Protocol〕MRP――生产资源规划〔Manufacturing Resource Planning〕SFA――自动销售〔Sales Force Automation〕SCV――供给链可见性〔Supply Chain Visibility〕MDM――制造数据管理〔Manafacturing Data Management〕APS――高级计划系统〔Advanced Planning System〕CMMS――电脑化维修管理系统〔computerized maintenance management system〕HMI――人机界面〔Human Machine Interface〕OEM――原始设备制造商〔Original Equipment Manafacturer〕MES――制造执行系统〔Manufacturing Execution System〕CPG――消费包装产品〔Customer Packaged Goods〕Time to Market――即时上市/及时切入生产Time to Volume――即时量产/及时大量生产Time to Money――即时变现/及时大量交货AIT――自动验证技术〔Automated IDentification Technologies〕TAV――全部资产可视化〔Total Assets Visualization〕SCADA――数据采集和监视控制〔Supervisory Control and Data Acquisition〕OPC――用于过程控制的对象链接和嵌入〔OLE for Process Control〕ASRS――自动存贮与检索系统〔Automatic Storage and Retrieval System 〕BTO――订单生产〔Build-to-Order〕CTO――〔Configuration-to-Order〕VMI――供货商免费存放〔Vendor Managed Inventory〕MCT――制造周期时间〔Manufacturing Cycle Time〕ABC――作业制成本制度(Activity-Based Costing)ABB――实施作业制预算制度(Activity-Based Budgeting)ABM――作业制成本管理(Activity-Base Management)APS――先进规画与排程系统(Advanced Planning and Scheduling)ASP――应用程序服务供货商〔Application Service Provider〕ATP――可承诺量(Available To Promise)AVL――认可的供货商清单(Approved Vendor List)BPR――企业流程再造(Business Process Reengineering)BSC――平衡记分卡(Balanced ScoreCard)BTF――计划生产(Build To Forecast)CPM――要径法(Critical Path Method)CPM――每一百万个使用者会有几次抱怨(Complaint per Million)CRM――客户关系管理(Customer Relationship Management)CRP――产能需求规划(Capacity Requirements Planning)CTO――客制化生产(Configuration To Order)DBR――限制驱导式排程法(Drum-Buffer-Rope)DMT――成熟度验证(Design Maturing Testing)DVT――设计验证(Design Verification Testing)DRP――运销资源计划(Distribution Resource Planning)DSS――决策支持系统(Decision Support System)EC――设计变更／工程变更(Engineer Change)EC――电子商务(Electronic Commerce)ECRN――原件规格更改通知(Engineer Change Request Notice)EDI――电子数据交换(Electronic Data Interchange)EIS――主管决策系统(Executive Information System)EMC――电磁相容(Electric Magnetic Capability)EOQ ――基本经济订购量(Economic Order Quantity)ERP――企业资源规划(Enterprise Resource Planning)FAE――应用工程师(Field Application Engineer)FCST――预估(Forecast)FMS――弹性制造系统(Flexible Manufacture System)FQC――成品质量管理(Finish or Final Quality Control)IPQC――制程质量管理(In-Process Quality Control)IQC――进料质量管理(Incoming Quality Control)ISO――国际标准组织(International Organization for Standardization) ISAR――首批样品认可(Initial Sample Approval Request)JIT――实时管理(Just In Time)KM ―― 知识管理(Knowledge Management)L4L――逐批订购法(Lot-for-Lot)LTC――最小总成本法(Least Total Cost)LUC――最小单位成本(Least Unit Cost)MES――制造执行系统(Manufacturing Execution System)MO――制令(Manufacture Order)MPS――主生产排程(Master Production Schedule)MRO――请修(购)单(Maintenance Repair Operation)MR P――物料需求规划(Material Requirement Planning)MRPII――制造资源计划(Manufacturing Resource Planning) NFCF――更改预估量的通知Notice for Changing ForecastOEM――委托代工(Original Equipment Manufacture)ODM――委托设计与制造(Original Design & Manufacture) OLAP――在线分析处理(On-Line Analytical Processing)OLTP――在线交易处理(On-Line Transaction Processing)OPT――最正确生产技术(Optimized Production Technology) OQC――出货质量管理(Out-going Quality Control)PDCA――PDCA管理循环(Plan-Do-Check-Action)PDM――产品数据管理系统(Product Data Management)PERT――计划评核术(Program Evaluation and Review Technique) PO――订单(Purchase Order)POH――预估在手量(Product on Hand)PR――采购申请Purchase RequestQA――品质保证(Quality Assurance)QC――质量管理(Quality Control)QCC――品管圈(Quality Control Circle)QE――品质工程(Quality Engineering)RCCP――粗略产能规划(Rough Cut Capacity Planning)RMA――退货验收Returned Material ApprovalROP――再订购点(Re-Order Point)SCM――供给链管理(Supply Chain Management)SFC――现场控制(Shop Floor Control)SIS――策略信息系统(Strategic Information System)SO―― 订单(Sales Order)SOR――特殊订单需求(Special Order Request)SPC――统计制程管制(Statistic Process Control)TOC――限制理论(Theory of Constraints)TPM――全面生产管理Total Production ManagementTQC――全面质量管理(Total Quality Control)TQM――全面品质管理(Total Quality Management)WIP――在制品(Work In Process)企业管理常用缩写术语之中英文对照表〔含解释)5S:5S管理ABC:作业制成本制度(Activity-BasedCosting)ABB:实施作业制预算制度(Activity-BasedBudgeting)ABM:作业制成本管理(Activity-BaseManagement)APS:先进规画与排程系统(AdvancedPlanningandScheduling) ASP:应用程序服务供货商〔ApplicationServiceProvider〕ATP:可承诺量(AvailableToPromise)AVL:认可的供货商清单(ApprovedVendorList)BOM:物料清单(BillOfMaterial)BPR:企业流程再造(BusinessProcessReengineering)BSC:平衡记分卡(BalancedScoreCard)BTF:计划生产(BuildToForecast)BTO:订单生产(BuildToOrder)CPM:要径法(CriticalPathMethod)CPM:每一百万个使用者会有几次抱怨(ComplaintperMillion) CRM:客户关系管理(CustomerRelationshipManagement)CRP:产能需求规划(CapacityRequirementsPlanning)CTO:客制化生产(ConfigurationToOrder)DBR:限制驱导式排程法(Drum-Buffer-Rope)DMT:成熟度验证(DesignMaturingTesting)DVT:设计验证(DesignVerificationTesting)DRP:运销资源计划(DistributionResourcePlanning)DSS:决策支持系统(DecisionSupportSystem)EC:设计变更／工程变更(EngineerChange)EC:电子商务(ElectronicCommerce)ECRN:原件规格更改通知(EngineerChangeRequestNotice)EDI:电子数据交换(ElectronicDataInterchange)EIS:主管决策系统(ExecutiveInformationSystem)EMC:电磁相容(ElectricMagneticCapability)EOQ:基本经济订购量(EconomicOrderQuantity)ERP:企业资源规划(EnterpriseResourcePlanning)FAE:应用工程师(FieldApplicationEngineer)FCST:预估(Forecast)FMS:弹性制造系统(FlexibleManufactureSystem)FQC:成品质量管理(FinishorFinalQualityControl)IPQC:制程质量管理(In-ProcessQualityControl)IQC:进料质量管理(IncomingQualityControl)ISO:国际标准组织(InternationalOrganizationforStandardization)ISAR:首批样品认可(InitialSampleApprovalRequest) JIT:实时管理(JustInTime)KM:知识管理(KnowledgeManagement)L4L:逐批订购法(Lot-for-Lot)LTC:最小总成本法(LeastTotalCost)LUC:最小单位成本(LeastUnitCost)MES:制造执行系统(ManufacturingExecutionSystem)MO:制令(ManufactureOrder)MPS:主生产排程(MasterProductionSchedule)MRO:请修(购)单(MaintenanceRepairOperation)MRP:物料需求规划(MaterialRequirementPlanning) MRPII:制造资源计划(ManufacturingResourcePlanning) NFCF:更改预估量的通知NoticeforChangingForecast OEM:委托代工(OriginalEquipmentManufacture)ODM:委托设计与制造(OriginalDesign&Manufacture) OLAP:在线分析处理(On-LineAnalyticalProcessing) OLTP:在线交易处理(On-LineTransactionProcessing) OPT:最正确生产技术(OptimizedProductionTechnology) OQC:出货质量管理(Out-goingQualityControl)PDCA:PDCA管理循环(Plan-Do-Check-Action)PDM:产品数据管理系统(ProductDataManagement)PERT:计划评核术(ProgramEvaluationandReviewTechnique)PO:订单(PurchaseOrder)POH:预估在手量(ProductonHand)PR:采购申请PurchaseRequestQA:质量保证(QualityAssurance)QC:质量管理(QualityControl)QCC:品管圈(QualityControlCircle)QE:质量工程(QualityEngineering)RCCP:粗略产能规划(RoughCutCapacityPlanning) RMA:退货验收ReturnedMaterialApprovalROP:再订购点(Re-OrderPoint)SCM:供给链管理(SupplyChainManagement)SFC:现场控制(ShopFloorControl)SIS:策略信息系统(StrategicInformationSystem) SO:订单(SalesOrder)SOR:特殊订单需求(SpecialOrderRequest)SPC:统计制程管制(StatisticProcessControl) TOC:限制理论(TheoryofConstraints)TPM:全面生产管理TotalProductionManagement TQC:全面质量管理(TotalQualityControl) TQM:全面质量管理(TotalQualityManagement) WIP:在制品(WorkInProcess)------5S管理------5S是由日本企业研究出来的一种环境塑造方案，其目的在藉由整理(SEIRI)、整顿(SEITON)、清扫(SEISO)、清洁(SEIKETSU)及身美(SHITSUKE)五种行为来创造清洁、明朗、活泼化之环境，以提高效率、质量及顾客满意度。

企業常用縮寫5S : 5S管理ABC: 作業制成本制度(Activity-Based Costing)ABB : 實施作業制預算制度(Activity-Based Budgeting)ABM : 作業制成本管理(Activity-Base Management)APS : 先進規畫與排程系統(Advanced Planning and Scheduling) ASP: 應用程式服務供應商（Application Service Provider）ATP : 可承諾量(Available To Promise)AVL: 認可的供應商清單(Approved Vendor List)BOM: 物料清單(Bill Of Material)BPR: 企業流程再造(Business Process Reengineering)BSC: 平衡記分卡(Balanced ScoreCard)BTF : 計劃生產(Build To Forecast)BTO : 訂單生產(Build To Order)CPM : 要徑法(Critical Path Method)CPM: 每一百萬個使用者會有幾次抱怨(Complaint per Million) CRM: 客戶關係管理(Customer Relationship Management) CRP: 產能需求規劃(Capacity Requirements Planning)CTO : 客製化生產(Configuration To Order)DBR : 限制驅導式排程法(Drum-Buffer-Rope)DMT: 成熟度驗證(Design Maturing Testing)DVT: 設計驗證(Design Verification Testing)DRP : 運銷資源計劃(Distribution Resource Planning)DSS: 決策支援系統(Decision Support System)EC : 設計變更／工程變更(Engineer Change)EC : 電子商務(Electronic Commerce)ECRN: 原件規格更改通知(Engineer Change Request Notice)EDI : 電子資料交換(Electronic Data Interchange): 主管決策系統(Executive Information System)EMC: 電磁相容(Electric Magnetic Capability)EOQ: 基本經濟訂購量(Economic Order Quantity)ERP: 企業資源規劃(Enterprise Resource Planning)FAE: 應用工程師(Field Application Engineer)FCST: 預估(Forecast)FMS: 彈性製造系統(Flexible Manufacture System)FQC: 成品品質管制(Finish or Final Quality Control)IPQC: 製程品質管制(In-Process Quality Control)IQC: 進料品質管制(Incoming Quality Control)ISO: 國際標準組織(International Organization for Standardization) ISAR : 首批樣品認可(Initial Sample Approval Request)JIT : 即時管理(Just In Time)KM：知識管理(Knowledge Management)L4L: 逐批訂購法(Lot-for-Lot)LTC: 最小總成本法(Least Total Cost)LUC: 最小單位成本(Least Unit Cost)MES: 製造執行系統(Manufacturing Execution System)MO : 製令(Manufacture Order)MPS: 主生產排程(Master Production Schedule)MRO : 請修(購)單(Maintenance Repair Operation)MRP: 物料需求規劃(Material Requirement Planning)MRPII: 製造資源計劃(Manufacturing Resource Planning)NFCF : 更改預估量的通知Notice for Changing ForecastOEM : 委託代工(Original Equipment Manufacture)ODM : 委託設計與製造(Original Design & Manufacture)OLAP: 線上分析處理(On-Line Analytical Processing)OLTP: 線上交易處理(On-Line Transaction Processing)OPT: 最佳生產技術(Optimized Production T echnology)OQC: 出貨品質管制(Out-going Quality Control)PDCA : PDCA管理循環(Plan-Do-Check-Action)PDM: 產品資料管理系統(Product Data Management)PERT: 計畫評核術(Program Evaluation and Review Technique)PO : 訂單(Purchase Order)POH: 預估在手量(Product on Hand)PR : 採購申請Purchase RequestQA : 品質保證(Quality Assurance)QC : 品質管制(Quality Control)QCC: 品管圈(Quality Control Circle)QE : 品質工程(Quality Engineering)RCCP: 粗略產能規劃(Rough Cut Capacity Planning)RMA : 退貨驗收Returned Material ApprovalROP : 再訂購點(Re-Order Point)SCM: 供應鏈管理(Supply Chain Management)SFC : 現場控制(Shop Floor Control)SIS: 策略資訊系統(Strategic Information System)SO : 訂單(Sales Order)SOR : 特殊訂單需求(Special Order Request)SPC: 統計製程管制(Statistic Process Control)TOC : 限制理論(Theory of Constraints)TPM: 全面生產管理Total Production ManagementTQC : 全面品質管制(Total Quality Control)TQM: 全面品質管理(Total Quality Management)WIP : 在製品(Work In Process)5S管理5S是由日本企業研究出來的一種環境塑造方案，其目的在藉由整理(SEIRI)、整頓(SEITON)、清掃(SEISO)、清潔(SEIKETSU)及身美(SHITSUKE)五種行為來創造清潔、明朗、活潑化之環境，以提高效率、品質及顧客滿意度。

企业常用英文缩写5S : 整理(SEIRI)、整顿(SEITON)、清扫(SEISO)、清洁(SEIKETSU)及素养(SHITSUKE) AVL : 认可的供应商清单(Approved Vendor List)BPR : 企业流程再造 (Business Process Reengineering)CPI: 持续的过程改善Continuous Process ImprovementCPM : 客户抱怨比,每一百万个使用者会有几次抱怨(Complaint per Million)CRM : 客户关系管理 (Customer Relationship Management)CRP : 产能需求计划 (Capacity Requirements Planning)DRP : 分销资源计划 (Distribution Resource Planning)DSS : 决策支持系统 (Decision Support System)EC : 设计变更／工程变更 (Engineer Change)EC : 电子商务 (Electronic Commerce)EIS : 主管决策系统 (Executive Information System)EOQ : 基本经济订购量 (Economic Order Quantity)ERP : 企业资源规划 (Enterprise Resource Planning)IE: 工业工程（Industrial Engineering）JIT : 实时管理(Just In Time)KM ：知识管理(Knowledge Management)KPI 关键业绩指标（Key Process Indication）MRP : 物料需求计划 (Material Requirement Planning)MRPII : 制造资源计划 (Manufacturing Resource Planning)PDCA: P（ PLAN）--计划；D（Do)--执行；C（CHECK)--检查；A（Action)--行动）PDM : 产品数据管理系统 (Product Data Management)SCM : 供应链管理 (Supply Chain Management)SFC : 现场控制 (Shop Floor Control)SIS : 策略信息系统 (Strategic Information System)SPC : 统计过程控制 (Statistic Process Control)TPM全面设备维护保养(Total Productive Maintenance)TQC : 全面质量控制 (Total Quality Control)TQM : 全面质量管理 (Total Quality Management)VE：价值工程（value engineering）VA：价值分析（Value Analysis）部分说明：5S5S是由日本企业研究出来的一种环境塑造方案，其目的在通过整理(SEIRI)、整顿(SEITON)、清扫(SEISO)、清洁(SEIKETSU)及素养(SHITSUKE)五种行为来创造清洁、明朗、活泼化的环境，以提高效率、品质及顾客满意度。

企业英文缩写大全5S : 整理(SEIRI)、整頓(SEITON)、清掃(SEISO)、清潔(SEIKETSU)及身美(SHITSUKE)五種行為ABC : 作業製成本制度(Activity-Based Costing)ABB : 實施作業制預算制度(Activity-Based Budgeting)ABM : 作業製成本管理(Activity-Base Management)APS : 先進規畫與排程系統(Advanced Planning and Scheduling)ASP : 應用程式服務供應商（Application Service Provider）ATP : 可承諾量(Available To Promise)AVL : 認可的供應商清單(Approved Vendor List)BOM : 物料清單(Bill Of Material)BPR : 企業流程再造(Business Process Reengineering)BSC : 平衡記分卡(Balanced ScoreCard)BTF : 計畫生產(Build To Forecast)BTO : 訂單生產(Build To Order)CPM : 要徑法(Critical Path Method)CPM : 每一百萬個使用者會有幾次抱怨(Complaint per Million)CRM : 客戶關係管理(Customer Relationship Management)CRP : 產能需求規劃(Capacity Requirements Planning)CTO : 客制化生產(Configuration To Order)DBR : 限制驅導式排程法(Drum-Buffer-Rope)DMT : 成熟度驗證(Design Maturing Testing)DVT : 設計驗證(Design Verification Testing)DRP : 運銷資源計畫(Distribution Resource Planning)DSS : 決策支援系統(Decision Support System)EC : 設計變更／工程變更(Engineer Change)EC : 電子商務(Electronic Commerce)ECRN : 原件規格更改通知(Engineer Change Request Notice)EDI : 電子資料交換(Electronic Data Interchange)EIS : 主管決策系統(Executive Information System)EMC : 電磁相容(Electric Magnetic Capability)EOQ : 基本經濟訂購量(Economic Order Quantity)ERP : 企業資源規劃(Enterprise Resource Planning)FAE : 應用工程師(Field Application Engineer)FCST : 預估(Forecast)FMS : 彈性製造系統(Flexible Manufacture System)FQC : 成品品質管制(Finish or Final Quality Control)IPQC : 制程品質管制(In-Process Quality Control)IQC : 進料品質管制(Incoming Quality Control)SPC : 統計制程管制(Statistic Process Control)TOC : 限制理論(Theory of Constraints)TPM : 全面生產管理Total Production ManagementTQC : 全面品質管制(Total Quality Control)TQM : 全面品質管理(Total Quality Management)WIP : 在製品(Work In Process)ABC Absolute Best Cost (is a procurement strategy to secure thebest costs for a part)AFR Annual Failure ReturnETD Estimated time of departure 估計出發時間ETA Estimated time of arriveAMO After Market OptionsWWAN (Wireless Wide Area Network) 是指傳輸範圍可跨越國家或不同城市之間的無線網路AN The product line code for MCD COMMERCIAL regionsAPJ Asia Pacific and JapanAPL Approved Partner ListFPC PCB" 柔性電路板(柔性RMAPCB): 簡稱"軟板", 又稱"柔性線路板", 也稱"軟性線路板、撓性線路板"或"軟性電路板、撓性電路板","FPCB, Flexible and Rigid-Flex". APO Advanced Planning OptimizationASN Advance Shipment NoticeASP Average Selling PriceATP Acknowledge to Production (order acknowledgement methodology) AUP Average Unit Price (sometimes used interchangeably with ASP)AV Refers to the Marketing Feature level of the BOM (2nd level). Is unique by family/platform/business modelAVL Approved Vendor ListAVLC Available Vendor List CandidateBCPL Blind Corporate Price List - When a product becomes "orderable" for the customerBDD Business Desktop Division - Is now defunct - the HP legacy busines desktop groupBOM Bill of MaterialBPN Business Products North America (Pre-Merger HP term for North America region…sometimes referred to as PPMD)BRD Business Requirements DocumentBRP Business Revenue PlanBT Build TriggerBTCO Build to Customer OrderBTO Build to OrderBTS Build-to-stock (situation where you ask factory to build units and stock FGI at their site before orders arrive)CDS Compal Direct ShipCFZ Code FreezeCIR Consumer IR(OEIC) 光電子集成電路CM Contract ManufacturersCNY Chinese New YearCO Customer Order (a term used in ICON - it is how daily demand is input into ICON) OR Change OrderCOA Certificate of Authenticity - most commonly refers to the Microsoft licensing label that is used on our PCsCRT 阴极射线管（Cathode Ray Tube）的显示器COGS Cost of Goods Sold (usually represented as a percentage of revenue) COS Cost of SalesCPB Company Performance BonusCPC Consumer PC Division - refers to the consumer desktop division based in Cupertino, CaliforniaCPL Corporate Price ListCPMO Region: China (refers to both their operations region and their regional manufacturing site)CPP Commodity Purchase PlanCPU Central Processing UnitCT Commodity TrackingCTO Configure to OrderCWSP Confirmed Weekly Shipment PlanDB Design BuildDC Distribution CenterDIB Drop in BoxDO Design Objective (Project or PLC Milestone - Establish Objectives of a project or new part)DoD Department of DefenseDOS Days of SupplyDR Delivery Request (An order placed by the region on the ODM for delivery)DRCD Driver CDDSM Demand Supply MatchingDSP Depot-Specific Supply Chain - ICON term to describe where/how a product is distributed in the MRP toolFW Firm wareECO Enterprise Core ObjectsECO Engineering Change OrderECR Engineering Change RecordEMEA Europe, Middle-East and Africa (is the Europe region)EOL End of LifeEPC Electronic Product Code (RFID technology provider)ESG Enteriprise Systems GroupEDID Extended Display Identification DATA，即扩展显示识别数据EURP End-User Replaceable PartsFCS First Customer ShipFCT Factory Cycle Time (measures the time it takes the factory to produce and ship the product once they have the ually measured in days) FDD Floppy Disk DriveFLC Factory Learning CurveFPU Factory Produce Unit (IPG term)FTO Flexible Time-off (HP term for vacation time)GBU General Base Unit (Pre-merger HP) OR…General Business Unit (new HP)GFI Go For Intro (PLC and project milestone - indicates this project is ready to start implementation)GPS Global Procurement ServicesHDD Hard Disk DriveHDCP (High-bandwidth Digital Content Protection)HOI HP-Owned InventoryHPD HP DirectHPS HP ServicesI/L Investigation to Lab (PLC milestone - freezes product definition)IDC Inventory Driven CostsIDP Individual Development PlanIDS International Direct ShipOOC Out of characterIES Inventec ChinaIPO International Procurement Organization - now called GPS in some entitiesIQDC Integrated Quality Data CollectionIUR IXXXX Unit RequestPP SAMPLE SP : 指產品的打樣制作；Sample PhasePP ：指產品小批量試做；Production PhaseMP ：指產品進入大量生產Mass PhaseIWT Inter Warehouse Transfer (a term used in ICON that gives the value of the demand plan per sku)KMAT Configurable Material (SAP term)KV The product line code for MCD RETAIL regionsKWL Keyboard Warning LabelLADO Region: Latin America (Latin America Distribution Organization) LCD Liquid Crystyal DisplayLCPL Live Customer Product List - product number and pricing visibleLi-ION Lithion-Ion: Battery technologyLT Lead TimeLTB Last Time Buy - is used when a component/product is going to become EOLMADP Most Accurate Demand PlanMAP Material Availability Plan OR Mobile Attainment Plan (used by Marketing Ops to outline the volumes we want to ship from a revenue standpoint)MAS Material Availbility Split - HP internal term to refer to our tool/process to support material availability visibility to the regionsMCD Mobile Computing Division (pre-merger HP Mobile Computing Division)MDL Module - is a MCD feature naming convention for Floppy Disk Drive or Optical Disk DriveMF Marketing ForecastMIR Mail In RebateMIT Multimedia Integration TestMOH Manufacturing OverheadMP Mass ProductionMR Manufacturing Release (PLC milestone - beginning of volume production)MRD Marketing Requirements DocumentMRP Materials Requirement PlanningMSP Master Shipment PlanMTD Month to DateMV Manufacturing ValidationNA Another name for North America COMMERCIALNACC North America Consumer Computing - refers to the NA consumer regionNAM North America RegionNB NotebookNiMH Nickel-Metal Hydride: Battery technology (boy…this is old!)NPI New Product IntroductionNRP Net Requirement PlanOCT Order Cycle TimeODD Optical Disk DriveODM Original Design ManufacturerOEM Original Equipment ManufacturerOH On-Hand (usually refers to inventory)OP Order ProcessingOPEC Oem Product data management External Collaboration for PSGOS Operating SystemOSS Outsourced serviceOT OvertimeOTS Observation Tracking SystemPCB Printed Circuit BoardPCBA Printed Ciruit Board AssemblyPDD Program Definition DocumentsPDG Product Data GenerationPDM BOM Data Warehouse System (Product Data Management) 產品資料管理系統PL Product LinePLC Product Life CyclePMC Pre-Merger CompaqPMH Pre-Merger Hewlett-PackardPMP Process Management PlanPNOP Part number on PartPO Purchase order订单pxe 網絡啟動模式POD Print On DemandTPM Total Productive Management全面生產管理POR Plan of Record (a general "roadmap" of a product that indicates estimated product forecast, features, etc.)PPMD Region: North America (Personal Information Products Manufacturing & Distribution) or BPN (see above)PRISM Preinstall Reengineering Initiative of Software Manufacturing PSDA Region: Asia PacificPSDE Region: EuropePSG Personal Systems GroupPTRPTT Post, Telegraph and Telephone AuthorityPV Product ValidationPWSP Preliminary Weekly Shipping PlanQBR Quarterly Business ReviewR10 SCITS Material Availability report (is at subassembly level)R11 SCITS Open Orders at the ODMR12 SCITS Shipments from the factoryR16 SCITS Factory BOMR5 SCITS Inventory reportRACDRACD Region Applicatioin CDRAD Reseller Arrival DatesRAM Random Access MemoryRAR Regional Allocation RulesRASRCD Recovery Compact Disc (Includes Windows, etc.)RCTO Regional Configure to Order - describes the SC postponement model where regionally-managed factories configure notebook unitsRDP Regional Demand PlanRFS Required for SetupRICAR Regional Inventory Cost Allocation Rules (used for allocating inventory costs back to the regions)RMN Regulatory Model NumberRMA Return(ed) Material AuthorizationROW Rest of WorldRQM Release Qual MatrixRSBT Radically Simple Better Together (Marketing Value Proposition for HP products)RSL Recommended Spares ListRSN Regional Supply Netting (solution until SNP)RT MCD code name for the US retail regionRTF Read This FirstRTP Release to Production - describes an order management methodology where orders are released only to available supplySA Subassembly (is the 3rd level of the BOM) and is the level at which regional DSM occursSCBO Supply Chain Business Operations (formerly PSDE, Europe region) SCITS Supply Chain Information Transfer Standard - the standard we use to transfer data between ODM, regions and GBUSCM Support Configuration MatrixSI System IntegrationSKU Stock-Keeping Unit (HP classic uses sku to refer to a model number) SKU Store Keeping UnitSLA Service Level AgreementSMB Small-Medium BusinessSMBC Small-Medium Business and ConsumerSMI Supplier Managed InventorySMT Surface Mounted Technology (used in motherboard preparation) SNP APO Module: Supply Network PlanningSOI Supplier-Owned InventorySR Ship Release (What the delivery engineers must do before a sku can be ordered by the regions)SRP SKU Reengineering ProcessST Sell-ThroughSVTP System Validation Test PlanSWMR Software Manufacturing Release (?)TAC Transfer at Cost - often refers to units we sell internally (for new employee equipemnt setup, etc)TAT Turn Around TimeTCE Total Customer ExperienceUAT User Acceptance TestUCUDF Unit Configuration User Defined Format, pre-CompeqUI User InterfaceVAR Value-Added ResellerVCM Variable Contribution MarginVMI Vendor Managed InventoryWDP Weekly Demand Plan (the same as Weekly Shipping Plan)WIF "What-if" demand - used primarily by NACC to describe their uncommitted demand scenarioWOS Weeks of SupplyWPTR Worldwide Product Tracking Record, pre-HPWSP Weekly Shipping PlanWWF Worldwide FulfillmentWWP Worldwide PlanningWWSNRS World Wide Serial Number Repository。

企业常用术语缩写全称及释义MTO――按订单生产（Make to Order）ETO――按订单设计MTS――库存生产（Make-to-Stock）PAPC――生产和流程控制（Production and Process Control）DHR――器械历史文件（Device History Record）NCR――不合格（Non-conformance）CAPA――纠正和预防措施（Corrective And Preventive Activity）NPV――净现值（Net Present Value）IRR――内部收益率（Internal Rate of Return）PP――回收期（Payback Period）SPC――统计过程控制（Statistic process control）B OM――物料清单（Bill of Material）OBOM――订单BOMMBOM――生产制造物料清单EBOM――工程设计BOMPBOM――工艺规划BOMSBOM――销售BOMPLM――产品生命周期管理（Product Lifecycle Management）PDM――产品数据管理（Product Data Management）CAD――计算机辅助设计（Computer Added Design）CAPP――计算机辅助工艺设计（Computer Aided Process Planning）KPI――关键绩效指标（Key Performance Index）SOA――面向服务架构（Service Oriented Architecture）WAN――广域网（Wide Area Network）LAN――局域网（Local Area Network）MAN――城域网（Metropolitan Area Network）TCP――传输控制协议（Transfer Control Protocol）IP――网际协议（Internet Protocol）ASN――预先发货通知（Advanced Shipment Notice）MHE――物料处理设备（Material Handling Equipment）EMEA――欧洲、中东和非洲CRM――客户关系管理（Customer Relationship Management）SCM――供应链管理（Supply Chain Management）BI――商业智能（Business Intelligence）LDAP――轻量级目录访问协议（Lightweight Directory Access Protocol）MRP――生产资源规划（Manufacturing Resource Planning）SFA――自动销售（Sales Force Automation）SCV――供应链可见性（Supply Chain Visibility）MDM――制造数据管理（Manafacturing Data Management）APS――高级计划系统（Advanced Planning System）CMMS――电脑化维修管理系统（computerized maintenance management system）HMI――人机界面（Human Machine Interface）OEM――原始设备制造商（Original Equipment Manafacturer）MES――制造执行系统（Manufacturing Execution System）CPG――消费包装产品（Customer Packaged Goods）Time to Market――即时上市/及时切入生产Time to Volume――即时量产/及时大量生产Time to Money――即时变现/及时大量交货AIT――自动验证技术（Automated IDentification Technologies）TAV――全部资产可视化（Total Assets Visualization）SCADA――数据采集和监视控制（Supervisory Control and Data Acquisition）OPC――用于过程控制的对象链接和嵌入（OLE for Process Control）ASRS――自动存贮与检索系统（Automatic Storage and Retrieval System ）BTO――订单生产（Build-to-Order）CTO――（Configuration-to-Order）VMI――供货商免费存放（Vendor Managed Inventory）MCT――制造周期时间（Manufacturing Cycle Time）ABC――作业制成本制度(Activity-Based Costing)ABB――实施作业制预算制度(Activity-Based Budgeting)ABM――作业制成本管理(Activity-Base Management)APS――先进规画与排程系统(Advanced Planning and Scheduling)ASP――应用程序服务供货商（Application Service Provider）ATP――可承诺量(Available To Promise)AVL――认可的供货商清单(Approved Vendor List)BPR――企业流程再造(Business Process Reengineering) BSC――平衡记分卡(Balanced ScoreCard)BTF――计划生产(Build To Forecast)CPM――要径法(Critical Path Method)CPM――每一百万个使用者会有几次抱怨(Complaint per Million) CRM――客户关系管理(Customer Relationship Management) CRP――产能需求规划(Capacity Requirements Planning) CTO――客制化生产(Configuration To Order)DBR――限制驱导式排程法(Drum-Buffer-Rope)DMT――成熟度验证(Design Maturing Testing)DVT――设计验证(Design Verification Testing)DRP――运销资源计划(Distribution Resource Planning) DSS――决策支持系统(Decision Support System)EC――设计变更／工程变更(Engineer Change)EC――电子商务(Electronic Commerce)ECRN――原件规格更改通知(Engineer Change Request Notice) EDI――电子数据交换(Electronic Data Interchange)EIS――主管决策系统(Executive Information System) EMC――电磁相容(Electric Magnetic Capability)EOQ ――基本经济订购量(Economic Order Quantity) ERP――企业资源规划(Enterprise Resource Planning) FAE――应用工程师(Field Application Engineer)FCST――预估(Forecast)FMS――弹性制造系统(Flexible Manufacture System)FQC――成品质量管理(Finish or Final Quality Control)IPQC――制程质量管理(In-Process Quality Control)IQC――进料质量管理(Incoming Quality Control)ISO――国际标准组织(International Organization for Standardization) ISAR――首批样品认可(Initial Sample Approval Request)JIT――实时管理(Just In Time)KM ――知识管理(Knowledge Management)L4L――逐批订购法(Lot-for-Lot)LTC――最小总成本法(Least Total Cost)LUC――最小单位成本(Least Unit Cost)MES――制造执行系统(Manufacturing Execution System)MO――制令(Manufacture Order)MPS――主生产排程(Master Production Schedule)MRO――请修(购)单(Maintenance Repair Operation)MRP――物料需求规划(Material Requirement Planning)MRPII――制造资源计划(Manufacturing Resource Planning) NFCF――更改预估量的通知Notice for Changing ForecastOEM――委托代工(Original Equipment Manufacture)ODM――委托设计与制造(Original Design & Manufacture) OLAP――在线分析处理(On-Line Analytical Processing)OLTP――在线交易处理(On-Line Transaction Processing) OPT――最佳生产技术(Optimized Production Technology) OQC――出货质量管理(Out-going Quality Control)PDCA――PDCA管理循环(Plan-Do-Check-Action)PDM――产品数据管理系统(Product Data Management) PERT――计划评核术(Program Evaluation and Review Technique) PO――订单(Purchase Order)POH――预估在手量(Product on Hand)PR――采购申请Purchase RequestQA――品质保证(Quality Assurance)QC――质量管理(Quality Control)QCC――品管圈(Quality Control Circle)QE――品质工程(Quality Engineering)RCCP――粗略产能规划(Rough Cut Capacity Planning) RMA――退货验收Returned Material ApprovalROP――再订购点(Re-Order Point)SCM――供应链管理(Supply Chain Management)SFC――现场控制(Shop Floor Control)SIS――策略信息系统(Strategic Information System)SO――订单(Sales Order)SOR――特殊订单需求(Special Order Request)SPC――统计制程管制(Statistic Process Control)TOC――限制理论(Theory of Constraints)TPM――全面生产管理Total Production ManagementTQC――全面质量管理(Total Quality Control)TQM――全面品质管理(Total Quality Management)WIP――在制品(Work In Process)企业管理常用缩写术语之中英文对照表（含解释)5S:5S管理ABC:作业制成本制度(Activity-BasedCosting)ABB:实施作业制预算制度(Activity-BasedBudgeting)ABM:作业制成本管理(Activity-BaseManagement)APS:先进规画与排程系统(AdvancedPlanningandScheduling) ASP:应用程序服务供货商（ApplicationServiceProvider）ATP:可承诺量(AvailableToPromise)AVL:认可的供货商清单(ApprovedVendorList)BOM:物料清单(BillOfMaterial)BPR:企业流程再造(BusinessProcessReengineering) BSC:平衡记分卡(BalancedScoreCard)BTF:计划生产(BuildToForecast)BTO:订单生产(BuildToOrder)CPM:要径法(CriticalPathMethod)CPM:每一百万个使用者会有几次抱怨(ComplaintperMillion) CRM:客户关系管理(CustomerRelationshipManagement) CRP:产能需求规划(CapacityRequirementsPlanning)CTO:客制化生产(ConfigurationToOrder)DBR:限制驱导式排程法(Drum-Buffer-Rope)DMT:成熟度验证(DesignMaturingTesting)DVT:设计验证(DesignVerificationTesting)DRP:运销资源计划(DistributionResourcePlanning) DSS:决策支持系统(DecisionSupportSystem)EC:设计变更／工程变更(EngineerChange)EC:电子商务(ElectronicCommerce)ECRN:原件规格更改通知(EngineerChangeRequestNotice) EDI:电子数据交换(ElectronicDataInterchange)EIS:主管决策系统(ExecutiveInformationSystem)EMC:电磁相容(ElectricMagneticCapability)EOQ:基本经济订购量(EconomicOrderQuantity)ERP:企业资源规划(EnterpriseResourcePlanning)FAE:应用工程师(FieldApplicationEngineer)FCST:预估(Forecast)FMS:弹性制造系统(FlexibleManufactureSystem)FQC:成品质量管理(FinishorFinalQualityControl)IPQC:制程质量管理(In-ProcessQualityControl)IQC:进料质量管理(IncomingQualityControl)ISO:国际标准组织(InternationalOrganizationforStandardization) ISAR:首批样品认可(InitialSampleApprovalRequest)JIT:实时管理(JustInTime)KM:知识管理(KnowledgeManagement)L4L:逐批订购法(Lot-for-Lot)LTC:最小总成本法(LeastTotalCost)LUC:最小单位成本(LeastUnitCost)MES:制造执行系统(ManufacturingExecutionSystem) MO:制令(ManufactureOrder)MPS:主生产排程(MasterProductionSchedule) MRO:请修(购)单(MaintenanceRepairOperation) MRP:物料需求规划(MaterialRequirementPlanning) MRPII:制造资源计划(ManufacturingResourcePlanning)NFCF:更改预估量的通知NoticeforChangingForecast OEM:委托代工(OriginalEquipmentManufacture)ODM:委托设计与制造(OriginalDesign&Manufacture) OLAP:在线分析处理(On-LineAnalyticalProcessing) OLTP:在线交易处理(On-LineTransactionProcessing) OPT:最佳生产技术(OptimizedProductionTechnology) OQC:出货质量管理(Out-goingQualityControl)PDCA:PDCA管理循环(Plan-Do-Check-Action)PDM:产品数据管理系统(ProductDataManagement) PERT:计划评核术(ProgramEvaluationandReviewTechnique) PO:订单(PurchaseOrder)POH:预估在手量(ProductonHand)PR:采购申请PurchaseRequestQA:质量保证(QualityAssurance)QC:质量管理(QualityControl)QCC:品管圈(QualityControlCircle)QE:质量工程(QualityEngineering)RCCP:粗略产能规划(RoughCutCapacityPlanning) RMA:退货验收ReturnedMaterialApproval ROP:再订购点(Re-OrderPoint)SCM:供应链管理(SupplyChainManagement) SFC:现场控制(ShopFloorControl)SIS:策略信息系统(StrategicInformationSystem) SO:订单(SalesOrder)SOR:特殊订单需求(SpecialOrderRequest) SPC:统计制程管制(StatisticProcessControl) TOC:限制理论(TheoryofConstraints)TPM:全面生产管理TotalProductionManagement TQC:全面质量管理(TotalQualityControl) TQM:全面质量管理(TotalQualityManagement) WIP:在制品(WorkInProcess)------5S管理------5S是由日本企业研究出来的一种环境塑造方案，其目的在藉由整理(SEIRI)、整顿(SEITON)、清扫(SEISO)、清洁(SEIKETSU)及身美(SHITSUKE) 五种行为来创造清洁、明朗、活泼化之环境，以提高效率、质量及顾客满意度。

企业常见英文缩写RM(raw material):原材料PP(purchased parts):外购件FP(finished products):完工产品QTY(quantity):数量品质人员名称类QC quality control 品质管理人员FQC final quality control 终点质量管理人员IPQC in process quality control 制程中的质量管理人员OQC output quality control 最终出货质量管理人员IQC incoming quality control 进料质量管理人员TQC total quality control 全面质量管理POC passage quality control 段检人员QA quality assurance 质量保证人员OQA output quality assurance 出货质量保证人员QE quality engineering 品质工程人员品质保证类FAI first article inspection 新品首件检查FAA first article assurance 首件确认CP capability index 能力指数媵CPK capability process index 模具制程能力参数SSQA standardized supplier quality audit 合格供货商品质评估FMEA failure model effectiveness analysis 失效模式分析FQC运作类AQL Acceptable Quality Level 运作类允收品质水准S/S Sample size 抽样检验样本大小ACC Accept 允收REE Reject 拒收CR Critical 极严重的MAJ Major 主要的MIN Minor 轻微的Q/R/S Quality/Reliability/Service 品质/可靠度/服务P/N Part Number 料号藊L/N Lot Number 批号AOD Accept On Deviation 特采UAI Use As It 特采FPIR First Piece Inspection Report 首件检查报告PPM Percent Per Million 百万分之一制程统计品管专类SPC Statistical Process Control 统计制程管制SQC Statistical Quality Control 统计质量管理GRR Gauge Reproductiveness & Repeatability 量具之再制性及重测性判断量可靠与否DIM Dimension 尺寸DIA Diameter 直径N Number 样品数其它品质术语类QIT Quality Improvement Team 品质改善小组ZD Zero Defect 零缺点QI Quality Improvement 品质改善QP Quality Policy 目标方针TQM Total Quality Management 全面品质管理RMA Return Material Audit 退料认可7QCTools 7 Quality Control Tools 品管七大手法通用之件类ECN Engineering Change Notice 工程变更通知(供货商)ECO Engineering Change Order 工程改动要求(客户)PCN Process Change Notice 工序改动通知PMP Product Management Plan 生产管制计划SIP Standard Inspection Procedure 制程检验标准程序SOP Standard Operation Procedure 制造作业规范 IS Inspection Specification 成品检验规范BOM Bill Of Material 物料清单PS Package Specification 包装规范SPEC Specification 规格DWG Drawing 图面系统文件类ES Engineering Standard 工程标准IWS International Workman Standard 工艺标准ISO International Standard Organization 国际标准化组织GS General Specification 一般规格部类PMC Production & Material Control 生产和物料控制PCC Product control center 生产管制中心PPC Production Plan Control 生产计划控制MC Material Control 物料控制DC Document Center 资料中心QE Quality Engineering 品质工程(部)QA Quality Assurance 品质保证(处)QC Quality Control 质量管理(课)PD Product Department 生产部LAB Laboratory 实验室IE Industrial Engineering 工业工程R&D Research & Design 设计开发部生产类PCs Pieces 个(根,块等)PRS Pairs 双(对等)CTN Carton 卡通箱PAL Pallet/skid 栈板PO Purchasing Order 采购订单MO Manufacture Order 生产单D/C Date Code 生产日期码ID/C Identification Code (供货商)识别码]SWR Special Work Request 特殊工作需求L/N Lot Number 批号P/N Part Number 料号OEM Original Equipment Manufacture 原设备制造PC Personal Computer 个人计算机CPU Central Processing Unit 中央处理器A.S.A.P As Soon As Possible 尽可能快的E-MAIL Electrical-Mail 电子邮件N/A Not Applicable 不适用QTY Quantity 数量I/O input/output 输入/输出NG Not Good 不行,不合格C=0 Critical=0 极严重不允许APP Approve 核准,认可,承认CHK Check 确认ASS''Y Assembly 装配,组装T/P True Position 真位度5WIH When, Where, Who, What, Why, How to6M Man, Machine, Material, Method, Measurement, Message4MTH Man, Material, Money, Method, Time, How 人力,物力,财务,技术,时间(资源)SQA Strategy Quality Assurance 策略品质保证DQA Design Quality Assurance 设计品质保证MQA Manufacture Quality Assurance 制造品质保证SSQA Sales and service Quality Assurance 销售及服务品质保证LRR Lot Reject Rate 批退率DVD Digital Video DiskVCD Video Compact DiskLCD Liquid Crystal DisplayCAD Computer Aided DesignCAM Computer Aided ManufacturingCAE Computer Aided EngineeringPCB Printed Circuit Board 印刷电路板CAR Correction Action Report 改善报告NG Not Good 不良WDR Weekly Delivery Requirement 周出货要求PPM Percent Per Million 百万分之一TPM Total Production Maintenance 全面生产保养MRP Material Requirement Planning 物料需计划OS Operation System 操作系统TBA To Be Assured 待定,定缺D/C Drawing ChangeP/P Plans & ProcedureEMI Electrical-Music Industry 电子音乐工业Electrical Magnetic Interference 电子干扰RFI Read Frequency Input 读频输入MMC Maximum Material ConditionMMS Maximum Material Size XsLMC Least Material ConditionLMS Least Material Size UmLED lighting-emitting diode 发光二极管QBR Quarter Business RecordCIP Continuous improvement processFGI Forecasted Goal InventoryCNC Computerized numeral controllerB2C Business to customerB2B Business to businessAVL Approved vendor listPOP Procedure of packagingEOL End of lifeVDCS Vender defect correcting sheetPDCS Process defect correcting sheetGRN Goods receiving noteA/R Accounting receivableA/P Accounting payable。