2021年LQFP,TQFP,QFP封装尺寸图解及区别之令狐采学创编

D u m m y C o m p o n e n t sLQFPLow Profile Quad Flat PackLow Profile Quad Flat Pack (LQFP) packages provide the same benefit of the metric QFP packages, but are thinner (body thickness of 1.4mm) and have a standard lead-frame footprint (2.0mm lead footprint).LQFPs help to solve issues such as increasing board density, die shrink programs, thin end-product profile and portability. Lead counts range from 32 to 256. Body sizes range from 5 x 5mm to 28 x 28mm. Copper lead-frames are used for the LQFP package. Lead pitches available for LQFP package are 0.65mm, 0.5mm, 0.4mm.Notes* = Available as an ExposedPad™ L/TQFP Package by Amkor. TheExposedPad™ L/TQFP can increase heat dissipation by as much as 110% over a standard L/TQFP. The E xposedPad™ L/TQFP is a cost effective, high frequency leadframe solution to thermal management when the die attach pad is soldered to the PCB. All LQFPs are standard in trays.LQFPs have a body thickness of 1.4mm. Tray quantity may vary. Tape type is plastic.Moisture sensitivity is JEDEC level 3.Lead-free parts are available with SnCu, SnBi or 100% Sn finish.For recommended kits see pages58, 68, 71, 81, 73 and 70.Part Number System▪ Add “TR” to end of part number for Tape and Reel.▪ Add specific finish to end of part number for Lead-Free, i.e Sn or SnCu or SnBi.LQFP48–7mm–.5mm–2.0Low Profile Quad Flat PackNumber of Pins Lead PitchBody SizeLead FootprintLQFP Low Profile Quad Flat Pack 1.4mm ThickPart NumberNumber of Pins Body Size Lead Pitch Quantity Per Tray Tape Width Tape Pitch Quantity Per Reel AvailableLead-Free Finishes .4mm PitchLQFP64-7mm-.4mm-2.0647mm sq .4mm 25016mm 12mm 1,000Sn, SnCu or SnBi LQFP80-10mm-.4mm-2.08010mm sq .4mm 16024mm 24mm 1,000Sn, SnCu or SnBi LQFP120-14mm-.4mm-2.012014mm sq .4mm 9032mm 24mm 750Sn, SnCu or SnBi LQFP128-14mm-.4mm-2.012814mm sq .4mm 9032mm 24mm 750Sn, SnCu or SnBi LQFP176-20mm-.4mm-2.017620mm sq .4mm 6044mm 24mm 500Sn, SnCu or SnBi LQFP216-24mm-.4mm-2.021624mm sq .4mm 4044mm 32mm 500Sn, SnCu or SnBi LQFP256-28mm-.4mm-2.025628mm sq .4mm 2444mm 40mm 500Sn, SnCu or SnBi .5mm PitchLQFP48-7mm-.5mm-2.0487mm sq .5mm 25016mm 12mm 1,000Sn, SnCu or SnBi LQFP64-10mm-.5mm-2.06410mm sq .5mm 16024mm 24mm 1,000Sn, SnCu or SnBi LQFP80-12mm-.5mm-2.08012mm sq .5mm 9024mm 20/24mm 1,000Sn, SnCu or SnBi LQFP100-14mm-.5mm-2.010014mm sq .5mm 9032mm 24mm 750Sn, SnCu or SnBi LQFP128-14x20mm-.5mm-2.012814 x 20mm .5mm 7244mm 32mm 500Sn, SnCu or SnBi LQFP128-20mm-.5mm-2.012820mm sq .5mm 6044mm 24mm 500Sn, SnCu or SnBi LQFP144-20mm-.5mm-2.0*14420mm sq .5mm 6044mm 24mm 750Sn, SnCu or SnBi LQFP160-24mm-.5mm-2.016024mm sq .5mm 4044mm 32mm 500Sn, SnCu or SnBi LQFP176-24mm-.5mm-2.0*17624mm sq .5mm 4044mm 32mm 500Sn, SnCu or SnBi LQFP208-28mm-.5mm-2.0*20828mm sq .5mm 3644mm 40mm 500Sn, SnCu or SnBi .65mm PitchLQFP52-10mm-.65mm-2.05210mm sq .65mm 16024mm 24mm 1,000Sn, SnCu or SnBi LQFP80-14mm-.65mm-2.08014mm sq .65mm 9032mm 24mm 750Sn, SnCu or SnBi LQFP100-14x20mm-.65mm-2.010014x20mm .65mm 7244mm 32mm 500Sn, SnCu or SnBi .8mm PitchLQFP32-7mm-.8mm-2.0327mm sq .8mm 25016mm 12mm 1,000Sn, SnCu or SnBi LQFP44-10mm-.8mm-2.04410mm sq .8mm 16024mm 24mm 1,000Sn, SnCu or SnBi LQFP64-14mm-.8mm-2.06414mm sq.8mm9032mm24mm750Sn, SnCu or SnBiDaisy-Chain And Lead-Free Parts Available!For drawings, please visit our web site at .Dummy ComponentsTQFPThin Quad Flat PackThin Quad Flat Pack (TQFP) packages provide the same benefit of the metric QFP package, but are thinner (body thickness of 1.0mm) and have a standard lead-frame footprint (2.0mm lead footprint). TQFPs are help-ing to solve issues such as increasing board density, die shrink programs, thin end-product profile and portability. Lead counts range from 32 to 176. Body sizes range from 5 x 5mm to 20 x 20mm. Copper lead-frames are used for the TQFP package. Lead pitches available for TQFP package are 0.4mm, 0.5mm, 0.65mm 0.8mm and 1.0mm.Exposed Pad L/TQFP PackageTQFP PackageMold Die Up (Standard)Die AttachDie Down (Inverted)Notes* = Available as an Exposed Pad L/TQFP Package by Amkor. TheExposedPad™ L/TQFP can increase heat dissipation by as much as 110% over a standard L/TQFP. The E xposedPad™ L/TQFP is a cost effective, high frequency leadframe solution to thermal management when the die attach pad is soldered to the PCB.TQFP is available in die up configurations in 1.0mm thickness only. 5 x 5mm to 20 x 20mm body size (JEDEC Standard). 32 to 176 lead counts. Copper leadframes.1.0mm body thickness for TQFP. Moisture sensitivity is JEDEC level 3.Lead-free parts are available with SnCu, SnBi or 100% Sn finish.Part Number System▪ Add “ePad” to beginning of part number when orderingExposedPad™ package.▪ Add “TR” to end of part number for Tape and Reel.▪ Add “LF” to end of part number for Lead-Free.Mold Die Up (Standard)TQFP Thin Quad Flat Pack 1.0mm ThickPart NumberNumber of Pins Body SizeLead Pitch Footprint Quantity Per Tray Tape Width Tape Pitch Quantity Per Reel A-TQFP32-5mm-.5mm-2.0*325mm sq .5mm 2.0mm 36016mm 12mm 1,000A-TQFP32-7mm-.8mm-2.0*327mm sq .8mm 2.0mm 25016mm 12mm 1,000A-TQFP40-5mm-.4mm-2.0*405mm sq .4mm 2.0mm 36016mm 12mm 1,000A-TQFP44-10mm-.8mm-2.0*4410mm sq .8mm 2.0mm 16024mm 16mm 1,000A-TQFP48-7mm-.5mm-2.0 *487mm sq .5mm 2.0mm 25016mm 12mm 1,000A-TQFP52-10mm-.65mm-2.0 *5210mm sq .65mm 2.0mm 16024mm 16mm 1,000A-TQFP64-7mm-.4mm-2.0*647mm sq .4mm 2.0mm 25016mm 12mm 1,000A-TQFP64-10mm-.5mm-2.0*6410mm sq .5mm 2.0mm 16024mm 16mm 1,000A-TQFP64-14mm-.8mm-2.0 *6414mm sq .8mm 2.0mm 9032mm 24mm 750A-TQFP80-12mm-.5mm-2.0 *8012mm sq .5mm 2.0mm 11924mm 24mm 1,000A-TQFP80-14mm-.65mm-2.0*8014mm sq .65mm 2.0mm 9032mm 24mm 750A-TQFP100-14mm-.5mm-2.0*10014mm sq .5mm 2.0mm 9032mm 24mm 750A-TQFP120-14mm-.4mm-2.0 *12014mm sq .4mm 2.0mm 9032mm 24mm 750A-TQFP128-14mm-.4mm-2.0*12814mm sq .4mm 2.0mm 9032mm 24mm 750A-TQFP128-20mm-.5mm-2.0 *12820mm sq .5mm 2.0mm 6044mm 24mm 500A-TQFP144-20mm-.5mm-2.0 *14420mm sq .5mm 2.0mm 6044mm 24mm 500A-TQFP176-20mm-.4mm-2.0 *17620mm sq.4mm2.0mm6044mm24mm500A-TQFP32-5mm-.5mm-2.0Thin Quad Flat PackBody SizeLead FootprintNumber of PinsLead PitchAmkorD u m m y C o m p o n e n t sNotesAll QFPs are standard in JEDEC trays. Tray quantities may vary. Carrier tape is plastic.SnCu, SnBi or 100% Sn finish.QFPQuad Flat PackQuad Flat Pack (QFP) components have four sides with leads extend-ing from the component body on all four sides. QFP componentscome packaged in trays or on tape and reel to protect the component leads that can be easily damaged. An important measurement for QFPs is coplanarity. When the first lead from the component is placedPart Number System▪ Add “TR” to end of part number for Tape and Reel.▪ Add specific finish to end of part number for Lead-Free, i.e Sn, SnCu or SnBi.QFP44–10mm–.8mm–3.9mmQuadFlat PackNumber of Pins Lead Pitch Body SizeLead FootprintDaisy-Chain And Lead-Free Parts Available!QFP Plastic Quad Flat PackPart NumberNumber of Pins Body Size Body Thickness Lead Pitch Footprint Quantity Per Tray Tape Width Tape Pitch Quantity 13" Reel AvailableLead-Free Finishes .40mm PitchQFP256-28mm-.4mm-2.625628mm sq 3.37mm .40mm 2.6mm 244440200Sn, SnCu or SnBi .50mm PitchQFP64-10mm-.50mm-3.26410mm sq 2.0mm .50mm 3.2mm 962424500Sn, SnCu or SnBi QFP64-10mm-.50mm-3.96410mm sq 2.0mm.50mm 3.9mm 962424500Sn, SnCu or SnBi QFP100-14mm-.5mm-3.210014mm sq 2.0/2.67mm .50mm 3.2mm 843224350Sn, SnCu or SnBi QFP100-14mm-.5mm-3.910014mm sq 2.67mm .50mm 3.9mm 843224350Sn, SnCu or SnBi QFP128-14x20mm-.5mm-3.212814 x 20mm 2.71mm .50mm 3.2mm 664432200Sn, SnCu or SnBi QFP128-14x20mm-.5mm-3.912814 x 20mm 2.71mm .50mm 3.9mm 664432200Sn, SnCu or SnBi QFP208-28mm-.5mm-2.620828mm sq 3.37mm .50mm 2.6mm 244440200Sn, SnCu or SnBi QFP208-28mm-.5mm-3.220828mm sq 3.37mm .50mm 3.2mm 244440200Sn, SnCu or SnBi QFP240-32mm-.5mm-2.624032mm sq 3.4mm .50mm 2.6mm 245644250Sn, SnCu or SnBi QFP304-40mm-.5mm-2.630440mm sq 3.8mm .50mm 2.6mm 12n/a n/a —Sn, SnCu or SnBi .65mm PitchQFP52-10mm-.65mm-3.25210mm sq 2.0mm .65mm 3.2mm 962424500Sn, SnCu or SnBi QFP52-10mm-.65mm-3.95210mm sq 2.0mm.65mm 3.9mm 962424500Sn, SnCu or SnBi QFP80-14mm-.65mm-3.28014mm sq 2.0/2.67mm .65mm 3.2mm 843224350Sn, SnCu or SnBi QFP80-14mm-.65mm-3.98014mm sq 2.67mm .65mm 3.9mm 843224350Sn, SnCu or SnBi QFP100-14x20mm-.65mm-3.210014 x 20mm 2.71mm .65mm 3.2mm 664432200Sn, SnCu or SnBi QFP100-14x20mm-.65mm-3.910014 x 20mm 2.71mm .65mm 3.9mm 664432200Sn, SnCu or SnBi QFP144-28mm-.65mm-2.614428mm sq 3.37mm .65mm 2.6mm 244440200Sn, SnCu or SnBi QFP144-28mm-.65mm-3.214428mm sq 3.37mm .65mm 3.2mm 244440200Sn, SnCu or SnBi QFP160-28mm-.65mm-2.616028mm sq 3.37mm .65mm 2.6mm 244440200Sn, SnCu or SnBi QFP160-28mm-.65mm-3.216028mm sq 3.37mm .65mm 3.2mm 244440200Sn, SnCu or SnBi QFP160-28mm-.65mm-3.916028mm sq 3.37mm .65mm 3.9mm 244440200Sn, SnCu or SnBi .80mm PitchQFP44-10mm-.8mm-3.24410mm sq 2.0mm .80mm 3.2mm 962424500Sn, SnCu or SnBi QFP44-10mm-.8mm-3.94410mm sq 2.0mm.80mm 3.9mm 962424500Sn, SnCu or SnBi QFP64-14mm-.8mm-3.26414mm sq 2.0/2.67mm .80mm 3.2mm 843224350Sn, SnCu or SnBi QFP64-14mm-.8mm-3.96414mm sq 2.67mm .80mm 3.9mm 843224350Sn, SnCu or SnBi QFP80-14x20mm-.8mm-3.28014 x 20mm 2.71mm .80mm 3.2mm 664432200Sn, SnCu or SnBi QFP80-14x20mm-.8mm-3.98014 x 20mm 2.71mm .80mm 3.9mm 664432200Sn, SnCu or SnBi QFP120-28mm-.8mm-2.612028mm sq 3.37mm .80mm 2.6mm 244440200Sn, SnCu or SnBi QFP120-28mm-.8mm-3.212028mm sq 3.37mm .80mm 3.2mm 244440200Sn, SnCu or SnBi QFP128-28mm-.8mm-2.612828mm sq 3.37mm .80mm 2.6mm 244440200Sn, SnCu or SnBi QFP128-28mm-.8mm-3.212828mm sq 3.37mm .80mm 3.2mm 244440200Sn, SnCu or SnBi 1.00mm PitchQFP52-14mm-1.0mm-3.25214mm sq 2.0/2.67mm 1.00mm 3.2mm 843224350Sn, SnCu or SnBi QFP52-14mm-1.0mm-3.95214mm sq 2.67mm 1.00mm 3.9mm 843224350Sn, SnCu or SnBi QFP64-14x20mm-1.0mm-3.26414 x 20mm 2.71mm 1.00mm 3.2mm 664432200Sn, SnCu or SnBi QFP64-14x20mm-1.0mm-3.96414 x 20mm2.71mm1.00mm3.9mm664432200Sn, SnCu or SnBion the PCB coplanarity is established. Coplanarity ensures the last lead can be placed on the board. The standard for QFP coplanarity is ±4 mils. Lead-free versions of QFPs are now available. Please call for additional information.Dummy ComponentsCQFPCeramic Quad Flat PackCQFPs are hermetic packages consisting of true pieces of dry pressed ceramic surrounding a uniformed leadframe with tie bar attached. Lead counts for this package range from 14 to 304, with lead pitch rangingPart Number Systemeither metal or ceramic. Lids are attached after die attach. This allows for a hermetically sealed environment for the die.from 15.7mil to 50mils. Package leads are gold or Kovar finish and can be solder-coated by special request. Lids are optional for CQFPs, which are sealed over the package cavity at temperatures from 400° to 460° C.NotesCQFPs are available with or without combo lid. Pins are flat (sandwiched) with tie bar. Parts are packaged in non-JEDEC trays.Due to the custom nature of the package, body size and dimensions can change without notice.Parts available with a daisy-chain configuration upon request. Other ceramic packages available upon request. Glass or epoxy seal.Footprint compatible with plastic QFP packages. EIAJ and JEDEC standards.Lead-frames are embedded into the glass to create both internal die connection and external PCB connection.This surface mount package consists of a ceramic base that has metal-ized castellations/pads on the sides and bottom of the package. LCC packages have pads on all four sides of the package. Lids for LCCs can beCQFP Ceramic Quad Flat PackPart NumberNumber of Pins Body Size Pitch (Inch)(mm)52CQFP-19.0mm-1.27mm 52.750" sq 19.0mm sq 1.27mm 68CQFP-24.1mm-1.27mm 68.950" sq 24.1mm sq 1.27mm 84CQFP-16.5mm-.65mm 84.650" sq 16.5mm sq .65mm 100CQFP-19.0mm-.65mm 100.750" sq 19.0mm sq .65mm 132CQFP-24.1mm-.65mm 132.950" sq 24.1mm sq .65mm 144CQFP-26.6mm-.65mm 144 1.050" sq 26.6mm sq .65mm 172CQFP-29.2mm-.65mm 172 1.150" sq 29.2mm sq .65mm 196CQFP-32.0mm-.50mm1961.260" sq32.0mm sq.50mmNotesLCCs are available with or without combo lid.Gold castellations are standard, but can be solder-coated with 100% Sn or Sn/Cu alloy.Parts are packaged in non-JEDEC trays.upon request.LCC Leadless Ceramic CarrierPart NumberNumber of Castellations Body Size Pitch (Inch)(mm)16LCC-1.27mm-7.36x8.96mm 16.350" x .285"7.36 x 8.96mm 1.27mm 20LCC-1.27mm-8.90mm 20.350" sq 8.90mm sq 1.27mm 28LCC-1.27mm-11.5mm28.450" sq 11.50mm sq 1.27mm 32LCC-1.27mm-11.4x14.0mm 32.550" x .450"11.40 x 14.00mm 1.27mm 40LCC-1.00mm-10.1mm 40.400" sq 10.10mm sq 1.00mm 44LCC-1.27mm-16.5mm 44.650" sq 16.50mm sq 1.27mm 48LCC-1.00mm-14.2mm 48.560" sq 14.20mm sq 1.00mm 52LCC-1.27mm-19.0mm 52.750" sq 19.00mm sq 1.27mm 68LCC-1.27mm-24.11mm 68.950" sq 24.11mm sq 1.27mm 84LCC-1.27mm-29.2mm841.150" sq29.20mm sq1.27mmLCCLeadless Ceramic Carrier52CQFP–19.0mm–1.27mmI/O CountBody SizeLead PitchCeramic Quad Flat Pack20LCC–1.27mm–8.90mm Number of CastellationsPitch Body SizeLeadless Ceramic CarrierFor recommended kits see pages 71 and 55.。

D u m m y C o m p o n e n t sLQFPLow Profile Quad Flat PackLow Profile Quad Flat Pack (LQFP) packages provide the same benefit of the metric QFP packages, but are thinner (body thickness of 1.4mm) and have a standard lead-frame footprint (2.0mm lead footprint).LQFPs help to solve issues such as increasing board density, die shrink programs, thin end-product profile and portability. Lead counts range from 32 to 256. Body sizes range from 5 x 5mm to 28 x 28mm. Copper lead-frames are used for the LQFP package. Lead pitches available for LQFP package are 0.65mm, 0.5mm, 0.4mm.Notes* = Available as an ExposedPad™ L/TQFP Package by Amkor. TheExposedPad™ L/TQFP can increase heat dissipation by as much as 110% over a standard L/TQFP. The E xposedPad™ L/TQFP is a cost effective, high frequency leadframe solution to thermal management when the die attach pad is soldered to the PCB. All LQFPs are standard in trays.LQFPs have a body thickness of 1.4mm. Tray quantity may vary. Tape type is plastic.Moisture sensitivity is JEDEC level 3.Lead-free parts are available with SnCu, SnBi or 100% Sn finish.For recommended kits see pages58, 68, 71, 81, 73 and 70.Part Number System▪ Add “TR” to end of part number for Tape and Reel.▪ Add specific finish to end of part number for Lead-Free, i.e Sn or SnCu or SnBi.LQFP48–7mm–.5mm–2.0Low Profile Quad Flat PackNumber of Pins Lead PitchBody SizeLead FootprintLQFP Low Profile Quad Flat Pack 1.4mm ThickPart NumberNumber of Pins Body Size Lead Pitch Quantity Per Tray Tape Width Tape Pitch Quantity Per Reel AvailableLead-Free Finishes .4mm PitchLQFP64-7mm-.4mm-2.0647mm sq .4mm 25016mm 12mm 1,000Sn, SnCu or SnBi LQFP80-10mm-.4mm-2.08010mm sq .4mm 16024mm 24mm 1,000Sn, SnCu or SnBi LQFP120-14mm-.4mm-2.012014mm sq .4mm 9032mm 24mm 750Sn, SnCu or SnBi LQFP128-14mm-.4mm-2.012814mm sq .4mm 9032mm 24mm 750Sn, SnCu or SnBi LQFP176-20mm-.4mm-2.017620mm sq .4mm 6044mm 24mm 500Sn, SnCu or SnBi LQFP216-24mm-.4mm-2.021624mm sq .4mm 4044mm 32mm 500Sn, SnCu or SnBi LQFP256-28mm-.4mm-2.025628mm sq .4mm 2444mm 40mm 500Sn, SnCu or SnBi .5mm PitchLQFP48-7mm-.5mm-2.0487mm sq .5mm 25016mm 12mm 1,000Sn, SnCu or SnBi LQFP64-10mm-.5mm-2.06410mm sq .5mm 16024mm 24mm 1,000Sn, SnCu or SnBi LQFP80-12mm-.5mm-2.08012mm sq .5mm 9024mm 20/24mm 1,000Sn, SnCu or SnBi LQFP100-14mm-.5mm-2.010014mm sq .5mm 9032mm 24mm 750Sn, SnCu or SnBi LQFP128-14x20mm-.5mm-2.012814 x 20mm .5mm 7244mm 32mm 500Sn, SnCu or SnBi LQFP128-20mm-.5mm-2.012820mm sq .5mm 6044mm 24mm 500Sn, SnCu or SnBi LQFP144-20mm-.5mm-2.0*14420mm sq .5mm 6044mm 24mm 750Sn, SnCu or SnBi LQFP160-24mm-.5mm-2.016024mm sq .5mm 4044mm 32mm 500Sn, SnCu or SnBi LQFP176-24mm-.5mm-2.0*17624mm sq .5mm 4044mm 32mm 500Sn, SnCu or SnBi LQFP208-28mm-.5mm-2.0*20828mm sq .5mm 3644mm 40mm 500Sn, SnCu or SnBi .65mm PitchLQFP52-10mm-.65mm-2.05210mm sq .65mm 16024mm 24mm 1,000Sn, SnCu or SnBi LQFP80-14mm-.65mm-2.08014mm sq .65mm 9032mm 24mm 750Sn, SnCu or SnBi LQFP100-14x20mm-.65mm-2.010014x20mm .65mm 7244mm 32mm 500Sn, SnCu or SnBi .8mm PitchLQFP32-7mm-.8mm-2.0327mm sq .8mm 25016mm 12mm 1,000Sn, SnCu or SnBi LQFP44-10mm-.8mm-2.04410mm sq .8mm 16024mm 24mm 1,000Sn, SnCu or SnBi LQFP64-14mm-.8mm-2.06414mm sq.8mm9032mm24mm750Sn, SnCu or SnBiDaisy-Chain And Lead-Free Parts Available!For drawings, please visit our web site at .Dummy ComponentsTQFPThin Quad Flat PackThin Quad Flat Pack (TQFP) packages provide the same benefit of the metric QFP package, but are thinner (body thickness of 1.0mm) and have a standard lead-frame footprint (2.0mm lead footprint). TQFPs are help-ing to solve issues such as increasing board density, die shrink programs, thin end-product profile and portability. Lead counts range from 32 to 176. Body sizes range from 5 x 5mm to 20 x 20mm. Copper lead-frames are used for the TQFP package. Lead pitches available for TQFP package are 0.4mm, 0.5mm, 0.65mm 0.8mm and 1.0mm.Exposed Pad L/TQFP PackageTQFP PackageMold Die Up (Standard)Die AttachDie Down (Inverted)Notes* = Available as an Exposed Pad L/TQFP Package by Amkor. TheExposedPad™ L/TQFP can increase heat dissipation by as much as 110% over a standard L/TQFP. The E xposedPad™ L/TQFP is a cost effective, high frequency leadframe solution to thermal management when the die attach pad is soldered to the PCB.TQFP is available in die up configurations in 1.0mm thickness only. 5 x 5mm to 20 x 20mm body size (JEDEC Standard). 32 to 176 lead counts. Copper leadframes.1.0mm body thickness for TQFP. Moisture sensitivity is JEDEC level 3.Lead-free parts are available with SnCu, SnBi or 100% Sn finish.Part Number System▪ Add “ePad” to beginning of part number when orderingExposedPad™ package.▪ Add “TR” to end of part number for Tape and Reel.▪ Add “LF” to end of part number for Lead-Free.Mold Die Up (Standard)TQFP Thin Quad Flat Pack 1.0mm ThickPart NumberNumber of Pins Body SizeLead Pitch Footprint Quantity Per Tray Tape Width Tape Pitch Quantity Per Reel A-TQFP32-5mm-.5mm-2.0*325mm sq .5mm 2.0mm 36016mm 12mm 1,000A-TQFP32-7mm-.8mm-2.0*327mm sq .8mm 2.0mm 25016mm 12mm 1,000A-TQFP40-5mm-.4mm-2.0*405mm sq .4mm 2.0mm 36016mm 12mm 1,000A-TQFP44-10mm-.8mm-2.0*4410mm sq .8mm 2.0mm 16024mm 16mm 1,000A-TQFP48-7mm-.5mm-2.0 *487mm sq .5mm 2.0mm 25016mm 12mm 1,000A-TQFP52-10mm-.65mm-2.0 *5210mm sq .65mm 2.0mm 16024mm 16mm 1,000A-TQFP64-7mm-.4mm-2.0*647mm sq .4mm 2.0mm 25016mm 12mm 1,000A-TQFP64-10mm-.5mm-2.0*6410mm sq .5mm 2.0mm 16024mm 16mm 1,000A-TQFP64-14mm-.8mm-2.0 *6414mm sq .8mm 2.0mm 9032mm 24mm 750A-TQFP80-12mm-.5mm-2.0 *8012mm sq .5mm 2.0mm 11924mm 24mm 1,000A-TQFP80-14mm-.65mm-2.0*8014mm sq .65mm 2.0mm 9032mm 24mm 750A-TQFP100-14mm-.5mm-2.0*10014mm sq .5mm 2.0mm 9032mm 24mm 750A-TQFP120-14mm-.4mm-2.0 *12014mm sq .4mm 2.0mm 9032mm 24mm 750A-TQFP128-14mm-.4mm-2.0*12814mm sq .4mm 2.0mm 9032mm 24mm 750A-TQFP128-20mm-.5mm-2.0 *12820mm sq .5mm 2.0mm 6044mm 24mm 500A-TQFP144-20mm-.5mm-2.0 *14420mm sq .5mm 2.0mm 6044mm 24mm 500A-TQFP176-20mm-.4mm-2.0 *17620mm sq.4mm2.0mm6044mm24mm500A-TQFP32-5mm-.5mm-2.0Thin Quad Flat PackBody SizeLead FootprintNumber of PinsLead PitchAmkorD u m m y C o m p o n e n t sNotesAll QFPs are standard in JEDEC trays. Tray quantities may vary. Carrier tape is plastic.SnCu, SnBi or 100% Sn finish.QFPQuad Flat PackQuad Flat Pack (QFP) components have four sides with leads extend-ing from the component body on all four sides. QFP componentscome packaged in trays or on tape and reel to protect the component leads that can be easily damaged. An important measurement for QFPs is coplanarity. When the first lead from the component is placedPart Number System▪ Add “TR” to end of part number for Tape and Reel.▪ Add specific finish to end of part number for Lead-Free, i.e Sn, SnCu or SnBi.QFP44–10mm–.8mm–3.9mmQuadFlat PackNumber of Pins Lead Pitch Body SizeLead FootprintDaisy-Chain And Lead-Free Parts Available!QFP Plastic Quad Flat PackPart NumberNumber of Pins Body Size Body Thickness Lead Pitch Footprint Quantity Per Tray Tape Width Tape Pitch Quantity 13" Reel AvailableLead-Free Finishes .40mm PitchQFP256-28mm-.4mm-2.625628mm sq 3.37mm .40mm 2.6mm 244440200Sn, SnCu or SnBi .50mm PitchQFP64-10mm-.50mm-3.26410mm sq 2.0mm .50mm 3.2mm 962424500Sn, SnCu or SnBi QFP64-10mm-.50mm-3.96410mm sq 2.0mm.50mm 3.9mm 962424500Sn, SnCu or SnBi QFP100-14mm-.5mm-3.210014mm sq 2.0/2.67mm .50mm 3.2mm 843224350Sn, SnCu or SnBi QFP100-14mm-.5mm-3.910014mm sq 2.67mm .50mm 3.9mm 843224350Sn, SnCu or SnBi QFP128-14x20mm-.5mm-3.212814 x 20mm 2.71mm .50mm 3.2mm 664432200Sn, SnCu or SnBi QFP128-14x20mm-.5mm-3.912814 x 20mm 2.71mm .50mm 3.9mm 664432200Sn, SnCu or SnBi QFP208-28mm-.5mm-2.620828mm sq 3.37mm .50mm 2.6mm 244440200Sn, SnCu or SnBi QFP208-28mm-.5mm-3.220828mm sq 3.37mm .50mm 3.2mm 244440200Sn, SnCu or SnBi QFP240-32mm-.5mm-2.624032mm sq 3.4mm .50mm 2.6mm 245644250Sn, SnCu or SnBi QFP304-40mm-.5mm-2.630440mm sq 3.8mm .50mm 2.6mm 12n/a n/a —Sn, SnCu or SnBi .65mm PitchQFP52-10mm-.65mm-3.25210mm sq 2.0mm .65mm 3.2mm 962424500Sn, SnCu or SnBi QFP52-10mm-.65mm-3.95210mm sq 2.0mm.65mm 3.9mm 962424500Sn, SnCu or SnBi QFP80-14mm-.65mm-3.28014mm sq 2.0/2.67mm .65mm 3.2mm 843224350Sn, SnCu or SnBi QFP80-14mm-.65mm-3.98014mm sq 2.67mm .65mm 3.9mm 843224350Sn, SnCu or SnBi QFP100-14x20mm-.65mm-3.210014 x 20mm 2.71mm .65mm 3.2mm 664432200Sn, SnCu or SnBi QFP100-14x20mm-.65mm-3.910014 x 20mm 2.71mm .65mm 3.9mm 664432200Sn, SnCu or SnBi QFP144-28mm-.65mm-2.614428mm sq 3.37mm .65mm 2.6mm 244440200Sn, SnCu or SnBi QFP144-28mm-.65mm-3.214428mm sq 3.37mm .65mm 3.2mm 244440200Sn, SnCu or SnBi QFP160-28mm-.65mm-2.616028mm sq 3.37mm .65mm 2.6mm 244440200Sn, SnCu or SnBi QFP160-28mm-.65mm-3.216028mm sq 3.37mm .65mm 3.2mm 244440200Sn, SnCu or SnBi QFP160-28mm-.65mm-3.916028mm sq 3.37mm .65mm 3.9mm 244440200Sn, SnCu or SnBi .80mm PitchQFP44-10mm-.8mm-3.24410mm sq 2.0mm .80mm 3.2mm 962424500Sn, SnCu or SnBi QFP44-10mm-.8mm-3.94410mm sq 2.0mm.80mm 3.9mm 962424500Sn, SnCu or SnBi QFP64-14mm-.8mm-3.26414mm sq 2.0/2.67mm .80mm 3.2mm 843224350Sn, SnCu or SnBi QFP64-14mm-.8mm-3.96414mm sq 2.67mm .80mm 3.9mm 843224350Sn, SnCu or SnBi QFP80-14x20mm-.8mm-3.28014 x 20mm 2.71mm .80mm 3.2mm 664432200Sn, SnCu or SnBi QFP80-14x20mm-.8mm-3.98014 x 20mm 2.71mm .80mm 3.9mm 664432200Sn, SnCu or SnBi QFP120-28mm-.8mm-2.612028mm sq 3.37mm .80mm 2.6mm 244440200Sn, SnCu or SnBi QFP120-28mm-.8mm-3.212028mm sq 3.37mm .80mm 3.2mm 244440200Sn, SnCu or SnBi QFP128-28mm-.8mm-2.612828mm sq 3.37mm .80mm 2.6mm 244440200Sn, SnCu or SnBi QFP128-28mm-.8mm-3.212828mm sq 3.37mm .80mm 3.2mm 244440200Sn, SnCu or SnBi 1.00mm PitchQFP52-14mm-1.0mm-3.25214mm sq 2.0/2.67mm 1.00mm 3.2mm 843224350Sn, SnCu or SnBi QFP52-14mm-1.0mm-3.95214mm sq 2.67mm 1.00mm 3.9mm 843224350Sn, SnCu or SnBi QFP64-14x20mm-1.0mm-3.26414 x 20mm 2.71mm 1.00mm 3.2mm 664432200Sn, SnCu or SnBi QFP64-14x20mm-1.0mm-3.96414 x 20mm2.71mm1.00mm3.9mm664432200Sn, SnCu or SnBion the PCB coplanarity is established. Coplanarity ensures the last lead can be placed on the board. The standard for QFP coplanarity is ±4 mils. Lead-free versions of QFPs are now available. Please call for additional information.Dummy ComponentsCQFPCeramic Quad Flat PackCQFPs are hermetic packages consisting of true pieces of dry pressed ceramic surrounding a uniformed leadframe with tie bar attached. Lead counts for this package range from 14 to 304, with lead pitch rangingPart Number Systemeither metal or ceramic. Lids are attached after die attach. This allows for a hermetically sealed environment for the die.from 15.7mil to 50mils. Package leads are gold or Kovar finish and can be solder-coated by special request. Lids are optional for CQFPs, which are sealed over the package cavity at temperatures from 400° to 460° C.NotesCQFPs are available with or without combo lid. Pins are flat (sandwiched) with tie bar. Parts are packaged in non-JEDEC trays.Due to the custom nature of the package, body size and dimensions can change without notice.Parts available with a daisy-chain configuration upon request. Other ceramic packages available upon request. Glass or epoxy seal.Footprint compatible with plastic QFP packages. EIAJ and JEDEC standards.Lead-frames are embedded into the glass to create both internal die connection and external PCB connection.This surface mount package consists of a ceramic base that has metal-ized castellations/pads on the sides and bottom of the package. LCC packages have pads on all four sides of the package. Lids for LCCs can beCQFP Ceramic Quad Flat PackPart NumberNumber of Pins Body Size Pitch (Inch)(mm)52CQFP-19.0mm-1.27mm 52.750" sq 19.0mm sq 1.27mm 68CQFP-24.1mm-1.27mm 68.950" sq 24.1mm sq 1.27mm 84CQFP-16.5mm-.65mm 84.650" sq 16.5mm sq .65mm 100CQFP-19.0mm-.65mm 100.750" sq 19.0mm sq .65mm 132CQFP-24.1mm-.65mm 132.950" sq 24.1mm sq .65mm 144CQFP-26.6mm-.65mm 144 1.050" sq 26.6mm sq .65mm 172CQFP-29.2mm-.65mm 172 1.150" sq 29.2mm sq .65mm 196CQFP-32.0mm-.50mm1961.260" sq32.0mm sq.50mmNotesLCCs are available with or without combo lid.Gold castellations are standard, but can be solder-coated with 100% Sn or Sn/Cu alloy.Parts are packaged in non-JEDEC trays.upon request.LCC Leadless Ceramic CarrierPart NumberNumber of Castellations Body Size Pitch (Inch)(mm)16LCC-1.27mm-7.36x8.96mm 16.350" x .285"7.36 x 8.96mm 1.27mm 20LCC-1.27mm-8.90mm 20.350" sq 8.90mm sq 1.27mm 28LCC-1.27mm-11.5mm28.450" sq 11.50mm sq 1.27mm 32LCC-1.27mm-11.4x14.0mm 32.550" x .450"11.40 x 14.00mm 1.27mm 40LCC-1.00mm-10.1mm 40.400" sq 10.10mm sq 1.00mm 44LCC-1.27mm-16.5mm 44.650" sq 16.50mm sq 1.27mm 48LCC-1.00mm-14.2mm 48.560" sq 14.20mm sq 1.00mm 52LCC-1.27mm-19.0mm 52.750" sq 19.00mm sq 1.27mm 68LCC-1.27mm-24.11mm 68.950" sq 24.11mm sq 1.27mm 84LCC-1.27mm-29.2mm841.150" sq29.20mm sq1.27mmLCCLeadless Ceramic Carrier52CQFP–19.0mm–1.27mmI/O CountBody SizeLead PitchCeramic Quad Flat Pack20LCC–1.27mm–8.90mm Number of CastellationsPitch Body SizeLeadless Ceramic CarrierFor recommended kits see pages 71 and 55.。

LQFP,TQFP,QFP封装尺寸图解及区别这个型号只有两种封装一种是TQFP32 一种是BGA48QFP(quad flat package)四侧引脚扁平封装。

表面贴装型封装之一，引脚从四个侧面引出呈海鸥翼(L)型。

基材有陶瓷、金属和塑料三种。

从数量上看，塑料封装占绝大部分。

当没有特别表示出材料时，多数情况为塑料QFP。

塑料QFP 是最普及的多引脚LSI 封装。

不仅用于微处理器，门陈列等数字逻辑LSI 电路，而且也用于VTR 信号处理、音响信号处理等模拟LSI 电路。

引脚中心距有1.0mm、0.8mm、 0.65mm、0.5mm、0.4mm、0.3mm 等多种规格。

0.65mm 中心距规格中最多引脚数为304。

日本电子机械工业会对QFP 的外形规格进行了重新评价。

在引脚中心距上不加区别，而是根据封装本体厚度分为 QFP(2.0mm～3.6mm 厚)、LQFP(1.4mm 厚)和TQFP(1.0mm 厚)三种。

LQFP指封装本体厚度为1.4mm的QFP。

TQFP指封装本体厚度为1.0mm的QFPBQFP(quad flat package with bumper)带缓冲垫的四侧引脚扁平封装。

QFP封装之一，在封装本体的四个角设置突起(缓冲垫)以防止在运送过程中引脚发生弯曲变形。

美国半导体厂家主要在微处理器和ASIC等电路中采用.此封装。

引脚中心距0.635mm，引脚数从84到196左右FQFP(finepitchquadflatpackage)小引脚中心距QFP。

通常指引脚中心距小于0.65mm的QFP(见QFP)。

部分导导体厂家采用此名称。

集成电路封装形式介绍(图解）BGA BGFP132CLCCCPGA DIP EBGA 680LFBGA FDIP FQFP 100LJLCC BGA160L LCCLDCC LGA LQFPLQFP100L Metal Qual100L PBGA217LPCDIP PLCC PPGAPQFP QFP SBA 192LTQFP100L TSBGA217L TSOPCSPSIP:单列直插式封装.该类型的引脚在芯片单侧排列,引脚节距等特征与DIP基本相同.ZIP:Z型引脚直插式封装.该类型的引脚也在芯片单侧排列,只是引脚比SIP粗短些,节距等特征也与DIP基本相同.S-DIP:收缩双列直插式封装.该类型的引脚在芯片两侧排列,引脚节距为1.778mm,芯片集成度高于DIP.SK-DIP:窄型双列直插式封装.除了芯片的宽度是DIP的1/2以外,其它特征与DIP相同.PGA:针栅阵列插入式封装.封装底面垂直阵列布置引脚插脚,如同针栅.插脚节距为2.54mm或1.27mm,插脚数可多达数百脚.用于高速的且大规模和超大规模集成电路.SOP:小外型封装.表面贴装型封装的一种,引脚端子从封装的两个侧面引出,字母L状.引脚节距为1.27mm.MSP:微方型封装.表面贴装型封装的一种,又叫QFI等,引脚端子从封装的四个侧面引出,呈I字形向下方延伸,没有向外突出的部分,实装占用面积小,引脚节距为1.27mm.QFP:四方扁平封装.表面贴装型封装的一种,引脚端子从封装的两个侧面引出,呈L字形,引脚节距为1.0mm,0.8mm,0.65mm,0.5mm,0.4mm,0.3mm,引脚可达300脚以上.SVP:表面安装型垂直封装.表面贴装型封装的一种,引脚端子从封装的一个侧面引出,引脚在中间部位弯成直角,弯曲引脚的端部与PCB键合,为垂直安装的封装.实装占有面积很小.引脚节距为0.65mm,0.5mm.LCCC:无引线陶瓷封装载体.在陶瓷基板的四个侧面都设有电极焊盘而无引脚的表面贴装型封装.用于高速,高频集成电路封装.PLCC:无引线塑料封装载体.一种塑料封装的LCC.也用于高速,高频集成电路封装.SOJ:小外形J引脚封装.表面贴装型封装的一种,引脚端子从封装的两个侧面引出,呈J字形,引脚节距为1.27mm.BGA:球栅阵列封装.表面贴装型封装的一种,在PCB的背面布置二维阵列的球形端子,而不采用针脚引脚.焊球的节距通常为1.5mm,1.0mm,0.8mm,与PGA相比,不会出现针脚变形问题.CSP:芯片级封装.一种超小型表面贴装型封装,其引脚也是球形端子,节距为0.8mm,0.65mm,0.5mm等.TCP:带载封装.在形成布线的绝缘带上搭载裸芯片,并与布线相连接的封装.与其他表面贴装型封装相比,芯片更薄,引脚节距更小,达0.25mm,而引脚数可达500针以上.介绍：1 基本元件类型Basic Component Type盒形片状元件 (电阻和电容)Box Type Solder ComponentResistor and Capacitor小型晶体管三极管及二极管SOTSmall Outline TransistorTransistor and Diodeelf类元件Melf type Component [Cylinder]Sop元件Small outline package小外形封装TSop元件Thin Sop薄形封装SOJ元件Small Outline J-lead Package 具有丁形引线的小外形封装QFP元件Quad Flat Package方形扁平封装PLCC元件Plastic Leaded Chip Carrier 塑料有引线芯片载体BGABall Grid Array 球脚陈列封装球栅陈列封装CSPChip Size Package芯片尺寸封装2特殊元件类型Special Component Type钽电容 ( Tantalium Capacitor)铝电解电容 (Aalminum Electrolytic Capacitor )可变电阻 ( Variable Resistor )针栅陈列封装BGABin Grid Array连接器 ConnectorIC卡连接器 IC Card Connector附BGA 封装的种类APBGAPlastic BGA塑料BGABCBGACeramic BGA陶瓷BGACCCGACeramic Column Grid Array陶瓷柱栅陈列DTBGATape Automated BGA载带自动键合BGAEMBGA微小BGA注芯片的封装技术已经历了好几代的变迁从DIPQFPPGABGA到CSP再到MCM技术指标一代比一代先进包括芯片面积与封装面积之比越来越接近于1适用频率越来越高耐温性能越来越好引脚数增多引脚间距减少重量减少可靠性提高使用更加方便等(MCMMulti Chip Model 多芯片组件)英汉缩语对照SMTSurface Mount Technology 表面贴装技术SMDSurface Mounting Devices 表面安装器件SMBSurface Mounting Printed Circuit Board 表面安装印刷板DIP Dual-In-Line Package 双列直插式组件THTThough Hole Mounting Technology插装技术PCB Printed Circuit Board 印刷电路板SMC Surface Mounting Components表面安装零件PQFP Plastic Quad Flat Package 塑料方形扁平封装SOIC Small Scale Integrated Circuit小外形集成电路LSI Large Scale Integration 大规模集成注意芯片封装图鉴封装大致经过了如下发展进程：结构方面：DIP封装(70年代)->SMT工艺(80年代 LCCC/PLCC/SOP/QFP)->BGA封装(90年代)->面向未来的工艺(CSP/MCM)材料方面：金属、陶瓷－>陶瓷、塑料－>塑料；引脚形状：长引线直插－>短引线或无引线贴装－>球状凸点；装配方式：通孔插装－>表面组装－>直接安装一．TO 晶体管外形封装TO（Transistor Out-line）的中文意思是“晶体管外形”。

芯片封装类型图解本文介绍了常见的集成电路封装形式，包括BGA、CPGA、FBGA、JLCC、LDCC、LQFP100L、PCDIP、PLCC、PPGA、PQFP、TQFP100L、TSBGA217L、TSOP、CSP、SIP、ZIP、S-DIP、SK-DIP、PGA、SOP、MSP和QFP等。

SIP是单列直插式封装，引脚在芯片单侧排列，与DIP基本相同。

ZIP是Z型引脚直插式封装，引脚比SIP粗短些，节距等特征也与DIP基本相同。

S-DIP是收缩双列直插式封装，引脚在芯片两侧排列，引脚节距为1.778mm，芯片集成度高于DIP。

SK-DIP是窄型双列直插式封装，除了芯片的宽度是DIP的1/2以外，其它特征与DIP相同。

PGA是针栅阵列插入式封装，封装底面垂直阵列布置引脚插脚，插脚节距为2.54mm或1.27mm，插脚数可多达数百脚，用于高速的且大规模和超大规模集成电路。

SOP是小外型封装，表面贴装型封装的一种，引脚端子从封装的两个侧面引出，字母L状，引脚节距为1.27mm。

MSP是微方型封装，表面贴装型封装的一种，又叫QFI等，引脚端子从封装的四个侧面引出，呈I字形向下方延伸，没有向外突出的部分，实装占用面积小，引脚节距为1.27mm。

QFP是四方扁平封装，表面贴装型封装的一种，引脚端子从封装的两个侧面引出，呈L字形，引脚节距为1.0mm、0.8mm、0.65mm、0.5mm、0.4mm、0.3mm，引脚可达300脚以上。

SVP是一种表面安装型垂直封装，其引脚端子从封装的一个侧面引出，中间部位弯成直角并与PCB键合，适用于垂直安装，实装占有面积很小。

其引脚节距为0.65mm和0.5mm。

LCCC是一种无引线陶瓷封装载体，其四个侧面都设有电极焊盘而无引脚，适用于高速、高频集成电路封装。

PLCC是一种无引线塑料封装载体，适用于高速、高频集成电路封装，是一种塑料封装的LCC。

SOJ是一种小外形J引脚封装，其引脚端子从封装的两个侧面引出，呈J字形，引脚节距为1.27mm。

集成电路封装形式介绍(图解）BGA BGFP132CLCCCPGA DIP EBGA 680L FBGA FDIP FQFP 100L JLCC BGA160L LCCLDCC LGA LQFP LQFP100L Metal Qual100L PBGA217L PCDIP PLCC PPGAPQFP QFP SBA 192L TQFP100L TSBGA217L TSOPCSPSIP: 单列直插式封装.该类型的引脚在芯片单侧排列 ,引脚节距等特征与 DIP 基本相同封装 .该类型的引脚也在芯片单侧排列 ,只是引脚比 SIP 粗短些 , 节距等特征也与.ZIP:Z 型引脚直插式DIP 基本相同 .S-DIP: 收缩双列直插式封装.该类型的引脚在芯片两侧排列,引脚节距为 1.778mm, 芯片集成度高于DIP.SK-DIP: 窄型双列直插式封装.除了芯片的宽度是DIP 的 1/2 以外 ,其它特征与DIP 相同 .PGA: 针栅阵列插入式封装 .封装底面垂直阵列布置引脚插脚, 如同针栅 . 插脚节距为 2.54mm 或 1.27mm, 插脚数可多达数百脚用于高速的且大规模和超大规模集成电路..SOP: 小外型封装 . 表面贴装型封装的一种,引脚端子从封装的两个侧面引出, 字母 L 状.引脚节距为1.27mm.MSP:微方型封装. 表面贴装型封装的一种,又叫 QFI 等,引脚端子从封装的四个侧面引出伸,没有向外突出的部分,实装占用面积小,引脚节距为 1.27mm.,呈 I 字形向下方延QFP: 四方扁平封装 .表面贴装型封装的一种,引脚端子从封装的两个侧面引出,呈 L 字形 ,引脚节距为1.0mm,0.8mm,0.65mm,0.5mm,0.4mm,0.3mm,引脚可达300 脚以上 .SVP: 表面安装型垂直封装. 表面贴装型封装的一种,引脚端子从封装的一个侧面引出,引脚在中间部位弯成直角,弯曲引脚的端部与PCB 键合 ,为垂直安装的封装. 实装占有面积很小.引脚节距为0.65mm,0.5mm.LCCC: 无引线陶瓷封装载体. 在陶瓷基板的四个侧面都设有电极焊盘而无引脚的表面贴装型封装.用于高速, 高频集成电路封装.PLCC: 无引线塑料封装载体.一种塑料封装的LCC. 也用于高速 ,高频集成电路封装.SOJ: 小外形 J 引脚封装 .表面贴装型封装的一种,引脚端子从封装的两个侧面引出,呈 J 字形 ,引脚节距为1.27mm.BGA:球栅阵列封装 .表面贴装型封装的一种,在 PCB 焊球的节距通常为 1.5mm,1.0mm,0.8mm,的背面布置二维阵列的球形端子,而不采用针脚引脚与 PGA 相比 ,不会出现针脚变形问题..CSP: 芯片级封装 .一种超小型表面贴装型封装,其引脚也是球形端子,节距为 0.8mm,0.65mm,0.5mm等.TCP: 带载封装.在形成布线的绝缘带上搭载裸芯片,并与布线相连接的封装.与其他表面贴装型封装相比芯片更薄 ,引脚节距更小 ,达 0.25mm, 而引脚数可达500 针以上 .,介绍：1 基本元件类型Basic Component Type盒形片状元件(电阻和电容 )Box Type Solder ComponentResistor and Capacitor小型晶体管三极管及二极管SOTSmall Outline TransistorTransistor and Diodeelf 类元件Melf type Component [Cylinder]Sop 元件Small outline package 小外形封装TSop 元件Thin Sop 薄形封装SOJ 元件Small Outline J-lead Package具有丁形引线的小外形封装QFP 元件Quad Flat Package 方形扁平封装PLCC 元件Plastic Leaded Chip Carrier塑料有引线芯片载体BGABall Grid Array球脚陈列封装球栅陈列封装CSPChip Size Package 芯片尺寸封装2 特殊元件类型Special Component Type钽电容( Tantalium Capacitor)铝电解电容(Aalminum Electrolytic Capacitor )可变电阻( Variable Resistor )针栅陈列封装BGABin Grid Array连接器ConnectorIC 卡连接器IC Card Connector附 BGA封装的种类APBGAPlastic BGA塑料BGABCBGACeramic BGA陶瓷BGACCCGACeramic Column Grid Array陶瓷柱栅陈列DTBGATape Automated BGA载带自动键合BGAEMBGA 微小 BGA注芯片的封装技术已经历了好几代的变迁从DIPQFPPGABGA到CSP再到MCM技术指标一代比一代先进包括芯片面积与封装面积之比越来越接近于 1 适用频率越来越高耐温性能越来越好引脚数增多引脚间距减少重量减少可靠性提高使用更加方便等(MCMMulti Chip Model多芯片组件)英汉缩语对照SMTSurface Mount Technology表面贴装技术SMDSurface Mounting Devices表面安装器件SMBSurface Mounting Printed Circuit Board表面安装印刷板DIP Dual-In-Line Package双列直插式组件THTThough Hole Mounting Technology插装技术PCB Printed Circuit Board印刷电路板SMC Surface Mounting Components表面安装零件PQFP Plastic Quad Flat Package 塑料方形扁平封装SOIC Small Scale Integrated Circuit小外形集成电路LSI Large Scale Integration大规模集成注意芯片封装图鉴封装大致经过了如下发展进程：结构方面： DIP 封装 (70 年代 )->SMT 工艺 (80 年代 LCCC/PLCC/SOP/QFP)->BGA封装(90 年代 )-> 面向未来的工艺 (CSP/MCM)材料方面：金属、陶瓷－>陶瓷、塑料－ >塑料；引脚形状：长引线直插－>短引线或无引线贴装－>球状凸点；装配方式：通孔插装－ >表面组装－ >直接安装一． TO 晶体管外形封装TO（Transistor Out-line ）的中文意思是“晶体管外形”。

TQFP封装薄四方扁平封装低成本，低高度引线框封装方案薄四方扁平封装对中等性能、低引线数量要求的应用场合而言是最有效利用成本的封装方案，且可以得到一个轻质量的不引人注意的封装。

TQFP系列支持宽泛范围的印模尺寸和引脚数量，尺寸范围从7mm到28mm，引线数量从32到256 产品体尺寸(mm) 引线间距(mm)TQFP 100 14 0.50TQFP 120 14 0.40TQFP 128 14*20 0.50TQFP 144 20 0.50TQFP 176 24 0.50TQFP 208 28 0.50TQFP 256 28 0.40TQFP 32 7 0.80TQFP 44 10 0.80TQFP 48 7 0.50TQFP 52 10 0.65TQFP 64 14 0.80TQFP 64 10 0.50TQFP 80 12 0.50TQFP 80 14 0.65TQFP44封装PLCCPLCC为特殊引脚芯片封装，它是贴片封装的一种，这种封装的引脚在芯片底部向内弯曲，因此在芯片的俯视图中是看不见芯片引脚的。

这种芯片的焊接采用回流焊工艺，需要专用的焊接设备，在调试时要取下芯片也很麻烦，现在已经很少用了。

PLCC(Plastic Leaded Chip Carrier),带引线的塑料芯片载体.表面贴装型封装之一,外形呈正方形,32脚封装,引脚从封装的四个侧面引出,呈丁字形,是塑料制品,外形尺寸比DIP封装小得多.PLCC封装适合用SMT表面安装技术在PCB上安装布线,具有外形尺寸小、可靠性高的优点.美国德克萨斯仪器公司首先在64k 位DRAM 和256kDRAM 中采用,现在已经普及用于逻辑LSI、DLD(或程逻辑器件)等电路.引脚中心距1.27mm,引脚数从18 到84 .J 形引脚不易变形,比QFP 容易操作,但焊接后的外观检查较为困难. PLCC 与LCC(也称QFN)相似.以前,两者的区别仅在于前者用塑料,后者用陶瓷.但现在已经出现用陶瓷制作的J 形引脚封装和用塑料制作的无引脚封装(标记为塑料LCC、PC LP、P -LCC 等),已经无法分辨.为此,日本电子机械工业会于1988 年决定,把从四侧引出J 形引脚的封装称为QFJ,把在四侧带有电极凸点的封装称为QFN.。

集成电路封装形式介绍(图解）BGA BGFP132 CLCCCPGA DIP EBGA 680LFBGA FDIP FQFP 100LJLCC BGA160L LCCLDCC LGA LQFPLQFP100L Metal Qual100L PBGA217LPCDIP PLCC PPGAPQFP QFP SBA 192LTQFP100L TSBGA217L TSOPCSPSIP:单列直插式封装.该类型的引脚在芯片单侧排列,引脚节距等特征和DIP基本相同.ZIP:Z型引脚直插式封装.该类型的引脚也在芯片单侧排列,只是引脚比SIP粗短些,节距等特征也和DIP基本相同.S-DIP:收缩双列直插式封装.该类型的引脚在芯片两侧排列,引脚节距为1.778mm,芯片集成度高于DIP.SK-DIP:窄型双列直插式封装.除了芯片的宽度是DIP的1/2以外,其它特征和DIP相同.PGA:针栅阵列插入式封装.封装底面垂直阵列布置引脚插脚,如同针栅.插脚节距为2.54mm或1.27mm,插脚数可多达数百脚.用于高速的且大规模和超大规模集成电路.SOP:小外型封装.表面贴装型封装的一种,引脚端子从封装的两个侧面引出,字母L状.引脚节距为1.27mm.MSP:微方型封装.表面贴装型封装的一种,又叫QFI等,引脚端子从封装的四个侧面引出,呈I字形向下方延伸,没有向外突出的部分,实装占用面积小,引脚节距为1.27mm.QFP:四方扁平封装.表面贴装型封装的一种,引脚端子从封装的两个侧面引出,呈L字形,引脚节距为1.0mm,0.8mm,0.65mm,0.5mm,0.4mm,0.3mm,引脚可达300脚以上.SVP:表面安装型垂直封装.表面贴装型封装的一种,引脚端子从封装的一个侧面引出,引脚在中间部位弯成直角,弯曲引脚的端部和PCB键合,为垂直安装的封装.实装占有面积很小.引脚节距为0.65mm,0.5mm.LCCC:无引线陶瓷封装载体.在陶瓷基板的四个侧面都设有电极焊盘而无引脚的表面贴装型封装.用于高速,高频集成电路封装.PLCC:无引线塑料封装载体.一种塑料封装的LCC.也用于高速,高频集成电路封装.SOJ:小外形J引脚封装.表面贴装型封装的一种,引脚端子从封装的两个侧面引出,呈J字形,引脚节距为1.27mm.BGA:球栅阵列封装.表面贴装型封装的一种,在PCB的背面布置二维阵列的球形端子,而不采用针脚引脚.焊球的节距通常为1.5mm,1.0mm,0.8mm,和PGA相比,不会出现针脚变形问题.CSP:芯片级封装.一种超小型表面贴装型封装,其引脚也是球形端子,节距为0.8mm,0.65mm,0.5mm等.TCP:带载封装.在形成布线的绝缘带上搭载裸芯片,并和布线相连接的封装.和其他表面贴装型封装相比,芯片更薄,引脚节距更小,达0.25mm,而引脚数可达500针以上.介绍：1 基本元件类型Basic Component Type盒形片状元件(电阻和电容)Box Type Solder ComponentResistor and Capacitor小型晶体管三极管及二极管SOTSmall Outline TransistorTransistor and Diodeelf类元件Melf type Component [Cylinder]Sop元件Small outline package小外形封装TSop元件Thin Sop薄形封装SOJ元件Small Outline J-lead Package 具有丁形引线的小外形封装QFP元件Quad Flat Package方形扁平封装PLCC元件Plastic Leaded Chip Carrier 塑料有引线芯片载体BGABall Grid Array 球脚陈列封装球栅陈列封装CSPChip Size Package芯片尺寸封装2特殊元件类型Special Component Type钽电容( Tantalium Capacitor)铝电解电容(Aalminum Electrolytic Capacitor )可变电阻( Variable Resistor )针栅陈列封装BGABin Grid Array连接器ConnectorIC卡连接器IC Card Connector附BGA 封装的种类APBGAPlastic BGA塑料BGABCBGACeramic BGA陶瓷BGACCCGACeramic Column Grid Array陶瓷柱栅陈列DTBGATape Automated BGA载带自动键合BGAEMBGA微小BGA注芯片的封装技术已经历了好几代的变迁从DIPQFPPGABGA到CSP再到MCM技术指标一代比一代先进包括芯片面积和封装面积之比越来越接近于1适用频率越来越高耐温性能越来越好引脚数增多引脚间距减少重量减少可靠性提高使用更加方便等(MCMMulti Chip Model 多芯片组件)英汉缩语对照SMTSurface Mount Technology 表面贴装技术SMDSurface Mounting Devices 表面安装器件SMBSurface Mounting Printed Circuit Board 表面安装印刷板DIP Dual-In-Line Package 双列直插式组件THTThough Hole Mounting Technology插装技术PCB Printed Circuit Board 印刷电路板SMC Surface Mounting Components表面安装零件PQFP Plastic Quad Flat Package 塑料方形扁平封装SOIC Small Scale Integrated Circuit小外形集成电路LSI Large Scale Integration 大规模集成注意芯片封装图鉴封装大致经过了如下发展进程：结构方面：DIP封装(70年代)->SMT工艺(80年代 LCCC/PLCC/SOP/QFP)->BGA封装(90年代)->面向未来的工艺(CSP/MCM)材料方面：金属、陶瓷－>陶瓷、塑料－>塑料；引脚形状：长引线直插－>短引线或无引线贴装－>球状凸点；装配方式：通孔插装－>表面组装－>直接安装一．TO 晶体管外形封装TO（Transistor Out-line）的中文意思是“晶体管外形”。

常见元器件封装(实物图)qqqDIPPLCCSOPPQFPSOJTQFPTSSOPBGA芯片封装技术知多少前言我们经常听说某某芯片采用什么什么的封装方式，在我们的电脑中，存在着各种各样不同处理芯片，那么，它们又是是采用何种封装形式呢？并且这些封装形式又有什么样的技术特点以及优越性呢？那么就请看看下面的这篇文章，将为你介绍个中芯片封装形式的特点和优点。

一、DIP双列直插式封装DIP(DualIn－line Package)是指采用双列直插形式封装的集成电路芯片，绝大多数中小规模集成电路(IC)均采用这种封装形式，其引脚数一般不超过100个。

采用DIP封装的CPU芯片有两排引脚，需要插入到具有DIP结构的芯片插座上。

当然，也可以直接插在有相同焊孔数和几何排列的电路板上进行焊接。

DIP封装的芯片在从芯片插座上插拔时应特别小心，以免损坏引脚。

DIP封装具有以下特点：1.适合在PCB(印刷电路板)上穿孔焊接，操作方便。

2.芯片面积与封装面积之间的比值较大，故体积也较大。

Intel系列CPU中8088就采用这种封装形式，缓存(Cache)和早期的内存芯片也是这种封装形式。

二、PQFP塑料方型扁平式封装和PFP塑料扁平组件式封装PQFP（Plastic Quad Flat Package）封装的芯片引脚之间距离很小，管脚很细，一般大规模或超大型集成电路都采用这种封装形式，其引脚数一般在100个以上。

用这种形式封装的芯片必须采用SMD（表面安装设备技术）将芯片与主板焊接起来。

采用SMD安装的芯片不必在主板上打孔，一般在主板表面上有设计好的相应管脚的焊点。

将芯片各脚对准相应的焊点，即可实现与主板的焊接。

用这种方法焊上去的芯片，如果不用专用工具是很难拆卸下来的。

PFP（Plastic Flat Package）方式封装的芯片与QFP方式基本相同。

唯一的区别是QFP一般为正方形，而PFP既可以是正方形，也可以是长方形。

常用的各类封装含义————————————————————————————————作者：————————————————————————————————日期：1.BGA：球栅阵列封装Ball Grid Array球形栅格阵列说明：为什么说是球栅，下图是横截面图，很直观的看出引脚轮廓是球形；栅格阵列封装，引脚大致分布如下图：就上图来说，四行四列引脚不是非要排满，如下图（引脚五行五列）左右的区别：实物图：实物图：（a）（b）2.CBGA：陶瓷球栅阵列封装（基板是陶瓷）Ceramic Ball Grid Array陶瓷的球形栅格阵列说明：引脚分布图和实物图都可参考上一说明。

GA：陶瓷圆柱栅格阵列封装（基板是陶瓷）Ceramic Column Grid Array陶瓷的圆柱栅格阵列说明：都是栅格阵列封装，不同就在于引脚形状，横截面如图：引脚是圆柱状。

4.PBGA：塑料球栅阵列封装（塑料焊球阵列封装）Plastic Ball Grid Array塑料的球形栅格阵列说明：引脚分布图和实物图都可参考BGA封装的说明。

CBGA和PBGA不同之处就在于它们的基板材质不同，一个是陶瓷，一个是塑料。

5.TBGA：载带球栅阵列封装Tape Ball Grid Array带子球形栅格阵列说明：引脚分布图和实物图都可参考BGA封装的说明。

不同之处在于它的基板为带状软质的1或2层的PCB电路板。

6.MicroBGA：缩微型球状引脚栅格阵列封装Micro Ball Grid Array微小的球形栅格阵列说明：M i croBGA封装的显存采用晶元嵌入式底部引线封装技术，具有体积小，连线短，耗电低，速度快，散热好的特点。

7.CSP：芯片尺寸封装Chip Scale Package芯片比例,尺寸包裹,封装说明：CSP封装，是芯片级封装的意思。

CSP封装最新一代的内存芯片封装技术，其技术性又有了新的提升。

CSP封装可以让芯片面积与封装面积之比超过1:1.14，已经相当接近1:1的理想情况，绝对尺寸也仅有32平方毫米，约为普通的BGA 的1/3，仅仅相当于TSOP内存芯片面积的1/6。

集成电路封装形式介绍(图解）BGA BGFP132 CLCCCPGA DIP EBGA 680L FBGA FDIP FQFP 100L JLCC BGA160L LCCLDCC LGA LQFPLQFP100L Metal Qual100L PBGA217L PCDIP PLCC PPGAPQFP QFP SBA 192L TQFP100L TSBGA217L TSOPCSPSIP:单列直插式封装.该类型的引脚在芯片单侧排列,引脚节距等特征与DIP基本相同.ZIP:Z型引脚直插式封装.该类型的引脚也在芯片单侧排列,只是引脚比SIP粗短些,节距等特征也与DIP基本相同.S-DIP:收缩双列直插式封装.该类型的引脚在芯片两侧排列,引脚节距为1.778mm,芯片集成度高于DIP.SK-DIP:窄型双列直插式封装.除了芯片的宽度是DIP的1/2以外,其它特征与DIP相同.PGA:针栅阵列插入式封装.封装底面垂直阵列布置引脚插脚,如同针栅.插脚节距为2.54mm或1.27mm,插脚数可多达数百脚.用于高速的且大规模和超大规模集成电路.SOP:小外型封装.表面贴装型封装的一种,引脚端子从封装的两个侧面引出,字母L状.引脚节距为1.27mm.MSP:微方型封装.表面贴装型封装的一种,又叫QFI等,引脚端子从封装的四个侧面引出,呈I字形向下方延伸,没有向外突出的部分,实装占用面积小,引脚节距为1.27mm.QFP:四方扁平封装.表面贴装型封装的一种,引脚端子从封装的两个侧面引出,呈L字形,引脚节距为1.0mm,0.8mm,0.65mm,0.5mm,0.4mm,0.3mm,引脚可达300脚以上.SVP:表面安装型垂直封装.表面贴装型封装的一种,引脚端子从封装的一个侧面引出,引脚在中间部位弯成直角,弯曲引脚的端部与PCB键合,为垂直安装的封装.实装占有面积很小.引脚节距为0.65mm,0.5mm.LCCC:无引线陶瓷封装载体.在陶瓷基板的四个侧面都设有电极焊盘而无引脚的表面贴装型封装.用于高速,高频集成电路封装.PLCC:无引线塑料封装载体.一种塑料封装的LCC.也用于高速,高频集成电路封装.SOJ:小外形J引脚封装.表面贴装型封装的一种,引脚端子从封装的两个侧面引出,呈J字形,引脚节距为1.27mm.BGA:球栅阵列封装.表面贴装型封装的一种,在PCB的背面布置二维阵列的球形端子,而不采用针脚引脚.焊球的节距通常为1.5mm,1.0mm,0.8mm,与PGA相比,不会出现针脚变形问题.CSP:芯片级封装.一种超小型表面贴装型封装,其引脚也是球形端子,节距为0.8mm,0.65mm,0.5mm等.TCP:带载封装.在形成布线的绝缘带上搭载裸芯片,并与布线相连接的封装.与其他表面贴装型封装相比,芯片更薄,引脚节距更小,达0.25mm,而引脚数可达500针以上.介绍：1 基本元件类型Basic Component Type盒形片状元件(电阻和电容)Box Type Solder ComponentResistor and Capacitor小型晶体管三极管及二极管SOTSmall Outline TransistorTransistor and Diodeelf类元件Melf type Component [Cylinder]Sop元件Small outline package小外形封装TSop元件Thin Sop薄形封装SOJ元件Small Outline J-lead Package 具有丁形引线的小外形封装QFP元件Quad Flat Package方形扁平封装PLCC元件Plastic Leaded Chip Carrier 塑料有引线芯片载体BGABall Grid Array 球脚陈列封装球栅陈列封装CSPChip Size Package芯片尺寸封装2特殊元件类型Special Component Type钽电容( Tantalium Capacitor)铝电解电容(Aalminum Electrolytic Capacitor )可变电阻( Variable Resistor )针栅陈列封装BGABin Grid Array连接器ConnectorIC卡连接器IC Card Connector附BGA 封装的种类APBGAPlastic BGA塑料BGABCBGACeramic BGA陶瓷BGACCCGACeramic Column Grid Array陶瓷柱栅陈列DTBGATape Automated BGA载带自动键合BGAEMBGA微小BGA注芯片的封装技术已经历了好几代的变迁从DIPQFPPGABGA到CSP再到MCM技术指标一代比一代先进包括芯片面积与封装面积之比越来越接近于1适用频率越来越高耐温性能越来越好引脚数增多引脚间距减少重量减少可靠性提高使用更加方便等(MCMMulti Chip Model 多芯片组件)英汉缩语对照SMTSurface Mount Technology 表面贴装技术SMDSurface Mounting Devices 表面安装器件SMBSurface Mounting Printed Circuit Board 表面安装印刷板DIP Dual-In-Line Package 双列直插式组件THTThough Hole Mounting Technology插装技术PCB Printed Circuit Board 印刷电路板SMC Surface Mounting Components表面安装零件PQFP Plastic Quad Flat Package 塑料方形扁平封装SOIC Small Scale Integrated Circuit小外形集成电路LSI Large Scale Integration 大规模集成注意芯片封装图鉴封装大致经过了如下发展进程：结构方面：DIP封装(70年代)->SMT工艺(80年代 LCCC/PLCC/SOP/QFP)->BGA封装(90年代)->面向未来的工艺(CSP/MCM)材料方面：金属、陶瓷－>陶瓷、塑料－>塑料；引脚形状：长引线直插－>短引线或无引线贴装－>球状凸点；装配方式：通孔插装－>表面组装－>直接安装一．TO 晶体管外形封装TO（Transistor Out-line）的中文意思是“晶体管外形”。

芯片封装方式大全各种IC封装形式图片精品文档精品文档精品文档精品文档精品文档精品文档精品文档精品文档精品文档精品文档精品文档精品文档精品文档精品文档各种封装缩写说明BGA精品文档BQFP132BGA精品文档BGA精品文档BGABGA精品文档BGACLCCCNR精品文档PGADIPDIP-tabBGA精品文档DIPTOFlat Pack精品文档HSOP28TO精品文档精品文档TOJLCCLCCCLCC(ceramic leaded chip carrier) 带引脚的陶瓷芯片载体，表面贴装型封装之一，引脚从封装的四个侧面引出，呈丁字形 。

带有窗口的用于封装紫外线擦除型EPROM 以及带有EPROM 的微机电路等。

此封装也称为 QFJ 、QFJ －G(见QFJ)。

BGALQFPDIP精品文档PGAPLCCPQFP精品文档DIPLQFP精品文档LQFP精品文档PQFPQFP精品文档QFPTQFPBGA精品文档SC-70 5LDIP精品文档SIPSOSOH精品文档SOJSOJ精品文档SOPTO精品文档SOPSOP精品文档CANTOTO精品文档TOTO3CAN精品文档CANCANCANCAN精品文档TO8TO92CAN精品文档CANTSOPTSSOP or TSOP精品文档BGABGAZIP精品文档PCDIP以下封装形式未找到相关图片，仅作简易描述，供参考：DIM单列直插式，塑料例如：MH88500QUIP蜘蛛脚状四排直插式，塑料例如：NEC7810DBGA BGA系列中陶瓷芯片例如：EP20K400FC672-3CBGA BGA系列中金属封装芯片例如： EP20K300EBC652-3MODULE方形状金属壳双列直插式例如：LH0084RQFP QFP封装系列中，表面带金属散装体例如：EPF10KRC系列DIMM电路正面或背面镶有LCC封装小芯片，陶瓷，双列直插式例如：X28C010DIP-BATTERY电池与微型芯片内封SRAM芯片，塑料双列直插式例如：达拉斯SRAM系列（五）按用途分类集成电路按用途可分为电视机用集成电路。

PSDIP PLCC DIP DIP-TAB LCC LDCC LQFP LQFP FTO220HSOP28ITO220ITO3PPDIPBQFP PQFP PQFPQFP SC-70SDIP SIP SO SOD323SOJ SOJ SOT143 SOT223SOT223SOT23SOT343SOT SOT SOT523SOT89SSOP SSOP STO-220 TO18TO220TO247TO252 TO264TO3TO52TO71 TO78TO8TO92TO93PCDIP JLCC TO72STO-220TO99AX14TO263SOT89SOT23SOP SNAPTK FGIPTQFP TSOP TSSOP ZIP常见集成电路（IC）芯片的封装金属圆形封装 TO99最初的芯片封装形式。

引脚数8--12。

散热好，价格高，屏蔽性能良好，主要用于高档产品。

PZIP(Plastic Zigzag In-line Package)塑料ZIP型封装引脚数3 --16。

散热性能好，多用于大功率器件。

SIP(Single In-line Package)单列直插式封装引脚中心距通常为2.54mm，引脚数2 --23，多数为定制产品。

造价低且安装便宜，广泛用于民品。

DIP(DualIn－line Package)双列直插式封装绝大多数中小规模 IC均采用这种封装形式，其引脚数一般不超过100个。

适合在PCB板上插孔焊接，操作方便。

塑封DIP应用最广泛。

SOP(Small Out-Line Package) 双列表面安装式封装引脚有J形和L形两种形式，中心距一般分1.27mm和0.8mm两种，引脚数8--32。

体积小，是最普及的表面贴片封装。

BGA(Ball Grid Array Package)球栅阵列封装表面贴装型封装之一，其底面按阵列方式制作出球形凸点用以代替引脚。

适应频率超过100MHz ，I/O 引脚数大于208 Pin 。

PSDIP PLCC DIP DIP-TAB LCC LDCC LQFP LQFP FTO220HSOP28ITO220ITO3P PDIP BQFP PQFP PQFPQFP SC-70SDIP SIP SO SOD323SOJ SOJ SOT143 SOT223SOT223SOT23 SOT343SOT SOT SOT523SOT89SSOP SSOP STO-220 TO18TO220TO247TO252 TO264TO3TO52TO71 TO78TO8TO92TO93PCDIP JLCC TO72STO-220 TO99AX14TO263SOT89 SOT23SOP SNAPTK FGIP TQFP TSOP TSSOP ZIP常见集成电路（IC）芯片的封装金属圆形封装 TO99最初的芯片封装形式。

引脚数8--12。

散热好，价格高，屏蔽性能良好，主要用于高档产品。

PZIP(Plastic Zigzag In-line Package)塑料ZIP型封装引脚数3 --16。

散热性能好，多用于大功率器件。

SIP(Single In-line Package)单列直插式封装引脚中心距通常为2.54mm，引脚数2 --23，多数为定制产品。

造价低且安装便宜，广泛用于民品。

DIP(DualIn－line Package)双列直插式封装绝大多数中小规模 IC均采用这种封装形式，其引脚数一般不超过100个。

适合在PCB板上插孔焊接，操作方便。

塑封DIP应用最广泛。

SOP(Small Out-Line Package) 双列表面安装式封装引脚有J形和L形两种形式，中心距一般分1.27mm和0.8mm两种，引脚数8--32。

体积小，是最普及的表面贴片封装。

BGA(Ball Grid Array Package)球栅阵列封装表面贴装型封装之一，其底面按阵列方式制作出球形凸点用以代替引脚。

适应频率超过100MHz ，I/O 引脚数大于208 Pin 。

常见元器件封装实物图qqq芯片封装技术知多少前言我们经常听说某某芯片采用什么什么的封装方式，在我们的电脑中，存在着各种各样不同处理芯片，那么，它们又是是采用何种封装形式呢？并且这些封装形式又有什么样的技术特点以及优越性呢？那么就请看看下面的这篇文章，将为你介绍个中芯片封装形式的特点和优点。

一、DIP双列直插式封装DIP(DualIn－line Package)是指采用双列直插形式封装的集成电路芯片，绝大多数中小规模集成电路(IC)均采用这种封装形式，其引脚数一般不超过100个。

采用DIP封装的CPU芯片有两排引脚，需要插入到具有DIP结构的芯片插座上。

当然，也可以直接插在有相同焊孔数和几何排列的电路板上进行焊接。

DIP 封装的芯片在从芯片插座上插拔时应特别小心，以免损坏引脚。

DIP封装具有以下特点：1.适合在PCB(印刷电路板)上穿孔焊接，操作方便。

2.芯片面积与封装面积之间的比值较大，故体积也较大。

Intel系列CPU中8088就采用这种封装形式，缓存(Cache)和早期的内存芯片也是这种封装形式。

二、PQFP塑料方型扁平式封装和PFP塑料扁平组件式封装PQFP（Plastic Quad Flat Package）封装的芯片引脚之间距离很小，管脚很细，一般大规模或超大型集成电路都采用这种封装形式，其引脚数一般在100个以上。

用这种形式封装的芯片必须采用SMD（表面安装设备技术）将芯片与主板焊接起来。

采用SMD安装的芯片不必在主板上打孔，一般在主板表面上有设计好的相应管脚的焊点。

将芯片各脚对准相应的焊点，即可实现与主板的焊接。

用这种方法焊上去的芯片，如果不用专用工具是很难拆卸下来的。

PFP（Plastic Flat Package）方式封装的芯片与QFP方式基本相同。

唯一的区别是QFP一般为正方形，而PFP既可以是正方形，也可以是长方形。

QFP/PFP封装具有以下特点：1.适用于SMD表面安装技术在PCB电路板上安装布线。

DIMENSIONDIP-8 DIMENSION (FIG. NO. DIM-DIP8-0103-B) UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONDIP-14 DIMENSION (FIG. NO. DIM-DIP14-0103-B) UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONDIP-16 DIMENSION (FIG. NO. DIM-DIP16-0103-B) UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONDIP-28 DIMENSION (FIG. NO. DIM-DIP28-0103-B) UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONDIP-12H DIMENSION (FIG. NO. DIM-DIP12H-0103-B) UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONSDIP-24 DIMENSION (FIG. NO. DIM-SDIP24-0103-A) UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONFSIP-12H DIMENSION (FIG. NO. DIM-FSIP12-0103-B) UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONSOP-8 DIMENSION (FIG. NO. DIM-SOP8-0103-B)UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONSOP-14 DIMENSION (FIG. NO. DIM-SOP14-0103-B) UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONSOP-16 DIMENSION (FIG. NO. DIM-SOP16-0103-B) UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONSOP-20 DIMENSION (FIG. NO. DIM-SOP20-0103-A) UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONSOP-24 DIMENSION (FIG. NO. DIM-SOP24-0103-A) UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONSOP-28 DIMENSION (FIG. NO. DIM-SOP28-0103-B) UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONTO-92 DIMENSION (FIG. NO. DIM-TO92-0104-B)UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONTO-92L DIMENSION (FIG. NO. DIM-TO92L-0002-A) UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONTO-92M DIMENSION (FIG. NO. DIM-TO92M-0002-A) UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONTO-92SP DIMENSION (FIG. NO. DIM-TO92SP-0011-B) UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONTO-92NL DIMENSION (FIG. NO. DIM-TO92NL-0103-B) UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONTO-126 DIMENSION (FIG. NO. DIM-TO126-0002-A) UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONTO-220 DIMENSION (FIG. NO. DIM-TO220-0104-B) UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONTO-220B DIMENSION (FIG. NO. DIM-TO220B-0002-A) UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONTO-220FP-4 DIMENSION (FIG. NO. DIM-TO220FP-0100-A) UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONTO-3 DIMENSION (FIG. NO. DIM-TO3-0002-A)UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONTO-251 DIMENSION (FIG. NO. DIM-TO251-0002-A) UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONTO-252 DIMENSION (FIG. NO. DIM-TO252-0009-B) UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONTO-263 DIMENSION (FIG. NO. DIM-TO263-0002-A) UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONSOT-113 DIMENSION (FIG. NO. DIM-SOT113-0103-B) UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONSOT-223 DIMENSION (FIG. NO. DIM-SOT223-0103-B) UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONSOT-23 DIMENSION (FIG. NO. DIM-SOT23-0103-B) UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONSOT-23 VERTICAL DIMENSION (FIG. NO. DIM-SOT23V-0103-B) UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONSOT-25 DIMENSION (FIG. NO. DIM-SOT25-0103-B) UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONSOT-89 DIMENSION (FIG. NO. DIM-SOT89-0103-B) UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONTSSOP-8 DIMENSION (FIG. NO. DIM-TSSOP8-0103-B) UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONTAPING TO-92 DIMENSION (FIG. NO. DIM-TAPING-TO92-0105-C 1/2)UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONTAPING TO-92 DIMENSION (FIG. NO. DIM-TAPING-TO92-0105-C 2/2)UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONTAPING SOP-8 DIMENSION (FIG. NO. DIM-TAPING-SOP8-0104-B) UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONTAPING SOP-14 DIMENSION (FIG. NO. DIM-TAPING-SOP16-0104-B)UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONTAPING SOP-16 DIMENSION (FIG. NO. DIM-TAPING-SOP16-0104-B)UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONTAPING SOP-28 DIMENSION (FIG. NO. DIM-TAPING-SOP28-0104-B)UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONTAPING SOT-23 DIMENSION (FIG. NO. DIM-TAPING- SOT23-0104-B)UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONTAPING SOT-223 DIMENSION (FIG. NO. DIM-TAPING-SOT223-0105-A)UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONTAPING SOT-25 DIMENSION (FIG. NO. DIM-TAPING-SOT25/26-0105-A)UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONTAPING SOT-26 DIMENSION (FIG. NO. DIM-TAPING-SOT25/26-0105-A)UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONTAPING SOT-89 DIMENSION (FIG. NO. DIM-TAPING-SOT89-0104-B)UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONTAPING TO-252 DIMENSION (FIG. NO. DIM-TAPING-TO252-0104-B)UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONTAPING TO-263 DIMENSION (FIG. NO. DIM-TAPING-TO263-0105-A)UTC UNISONIC TECHNOLOGIES CO., LTD.DIMENSIONTAPING TSSOP-8 DIMENSION (FIG. NO. DIM-TAPING-TSSOP8-0105-A)UTC UNISONIC TECHNOLOGIES CO., LTD.。

集成电路封装形式介绍(图解）BGA BGFP132CLCCCPGA DIP EBGA 680L FBGA FDIP FQFP 100L JLCC BGA160L LCCLDCC LGA LQFP LQFP100L Metal Qual100L PBGA217L PCDIP PLCC PPGAPQFP QFP SBA 192L TQFP100L TSBGA217L TSOPCSPSIP: 单列直插式封装.该类型的引脚在芯片单侧排列 ,引脚节距等特征与 DIP 基本相同封装 .该类型的引脚也在芯片单侧排列 ,只是引脚比 SIP 粗短些 , 节距等特征也与.ZIP:Z 型引脚直插式DIP 基本相同 .S-DIP: 收缩双列直插式封装.该类型的引脚在芯片两侧排列,引脚节距为 1.778mm, 芯片集成度高于DIP.SK-DIP: 窄型双列直插式封装.除了芯片的宽度是DIP 的 1/2 以外 ,其它特征与DIP 相同 .PGA: 针栅阵列插入式封装 .封装底面垂直阵列布置引脚插脚, 如同针栅 . 插脚节距为 2.54mm 或 1.27mm, 插脚数可多达数百脚用于高速的且大规模和超大规模集成电路..SOP: 小外型封装 . 表面贴装型封装的一种,引脚端子从封装的两个侧面引出, 字母 L 状.引脚节距为1.27mm.MSP:微方型封装. 表面贴装型封装的一种,又叫 QFI 等,引脚端子从封装的四个侧面引出伸,没有向外突出的部分,实装占用面积小,引脚节距为 1.27mm.,呈 I 字形向下方延QFP: 四方扁平封装 .表面贴装型封装的一种,引脚端子从封装的两个侧面引出,呈 L 字形 ,引脚节距为1.0mm,0.8mm,0.65mm,0.5mm,0.4mm,0.3mm,引脚可达300 脚以上 .SVP: 表面安装型垂直封装. 表面贴装型封装的一种,引脚端子从封装的一个侧面引出,引脚在中间部位弯成直角,弯曲引脚的端部与PCB 键合 ,为垂直安装的封装. 实装占有面积很小.引脚节距为0.65mm,0.5mm.LCCC: 无引线陶瓷封装载体. 在陶瓷基板的四个侧面都设有电极焊盘而无引脚的表面贴装型封装.用于高速, 高频集成电路封装.PLCC: 无引线塑料封装载体.一种塑料封装的LCC. 也用于高速 ,高频集成电路封装.SOJ: 小外形 J 引脚封装 .表面贴装型封装的一种,引脚端子从封装的两个侧面引出,呈 J 字形 ,引脚节距为1.27mm.BGA:球栅阵列封装 .表面贴装型封装的一种,在 PCB 焊球的节距通常为 1.5mm,1.0mm,0.8mm,的背面布置二维阵列的球形端子,而不采用针脚引脚与 PGA 相比 ,不会出现针脚变形问题..CSP: 芯片级封装 .一种超小型表面贴装型封装,其引脚也是球形端子,节距为 0.8mm,0.65mm,0.5mm等.TCP: 带载封装.在形成布线的绝缘带上搭载裸芯片,并与布线相连接的封装.与其他表面贴装型封装相比芯片更薄 ,引脚节距更小 ,达 0.25mm, 而引脚数可达500 针以上 .,介绍：1 基本元件类型Basic Component Type盒形片状元件(电阻和电容 )Box Type Solder ComponentResistor and Capacitor小型晶体管三极管及二极管SOTSmall Outline TransistorTransistor and Diodeelf 类元件Melf type Component [Cylinder]Sop 元件Small outline package 小外形封装TSop 元件Thin Sop 薄形封装SOJ 元件Small Outline J-lead Package具有丁形引线的小外形封装QFP 元件Quad Flat Package 方形扁平封装PLCC 元件Plastic Leaded Chip Carrier塑料有引线芯片载体BGABall Grid Array球脚陈列封装球栅陈列封装CSPChip Size Package 芯片尺寸封装2 特殊元件类型Special Component Type钽电容( Tantalium Capacitor)铝电解电容(Aalminum Electrolytic Capacitor )可变电阻( Variable Resistor )针栅陈列封装BGABin Grid Array连接器ConnectorIC 卡连接器IC Card Connector附 BGA封装的种类APBGAPlastic BGA塑料BGABCBGACeramic BGA陶瓷BGACCCGACeramic Column Grid Array陶瓷柱栅陈列DTBGATape Automated BGA载带自动键合BGAEMBGA 微小 BGA注芯片的封装技术已经历了好几代的变迁从DIPQFPPGABGA到CSP再到MCM技术指标一代比一代先进包括芯片面积与封装面积之比越来越接近于 1 适用频率越来越高耐温性能越来越好引脚数增多引脚间距减少重量减少可靠性提高使用更加方便等(MCMMulti Chip Model多芯片组件)英汉缩语对照SMTSurface Mount Technology表面贴装技术SMDSurface Mounting Devices表面安装器件SMBSurface Mounting Printed Circuit Board表面安装印刷板DIP Dual-In-Line Package双列直插式组件THTThough Hole Mounting Technology插装技术PCB Printed Circuit Board印刷电路板SMC Surface Mounting Components表面安装零件PQFP Plastic Quad Flat Package 塑料方形扁平封装SOIC Small Scale Integrated Circuit小外形集成电路LSI Large Scale Integration大规模集成注意芯片封装图鉴封装大致经过了如下发展进程：结构方面： DIP 封装 (70 年代 )->SMT 工艺 (80 年代 LCCC/PLCC/SOP/QFP)->BGA封装(90 年代 )-> 面向未来的工艺 (CSP/MCM)材料方面：金属、陶瓷－>陶瓷、塑料－ >塑料；引脚形状：长引线直插－>短引线或无引线贴装－>球状凸点；装配方式：通孔插装－ >表面组装－ >直接安装一． TO 晶体管外形封装TO（Transistor Out-line ）的中文意思是“晶体管外形”。