MCU选型指南

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超低功耗mcu的选型技巧与设计思路

超低功耗mcu的选型技巧与设计思路循序渐进式的功耗优化已经不再是超低功耗mcu的游戏规则，而是突飞猛进模式，与功耗相关的很多指标都不断刷新记录。

我们在选择合适的超低功耗mcu时要掌握必要的技巧，在应用时还需要一些设计方向与思路才能够更好的应用。

一：超低功耗mcu-低功耗mcu的选择方法嵌入式微控制器（mcu）的功耗在当今电池供电应用中正变得越来越举足轻重。

大多mcu 芯片厂商都提供低功耗低功耗产品，但是选择一款最适合您自己应用的产品并非易事，并不像对比数据表前面的数据那么简单。

我们必须详细对比mcu 功能，以便找到功耗最低的产品，这些功能包括：断电模式定时系统事件驱动功能片上外设掉电检测与保护漏电流处理效率。

----在低功耗设计中，平均电流消耗往往决定电池寿命。

例如，如果某个应用采用额定电流为400mAh 的Eveready 高电量9V 1222 型电池的话，要提供一年的电池寿命其平均电流消耗必须低于400mAh/8760h，即45.7uA。

----在使mcu 能够达到电流预算的所有功能中，断电模式最重要。

低功耗mcu 具有可提供不同级别功能的断电模式。

例如，TI 超低功耗mcu MSP430 系列产品可以提供5 种断电模式。

低功耗模式0 （LPM0）会关闭CPU，但是保持其他功能正常运转。

LPM1 与LPM2 模式在禁用功能列表中增加了各种时钟功能。

LPM3 是最常用的低功耗模式，只保持低频率时钟振荡器以及采用该时钟的外设运行。

LPM3 通常称为实时时钟模式，因为它允许定时器采用低功耗32768Hz 时钟源运行，电流消耗低于1uA，同时还可定期激活系统。

最后，LPM4 完全关闭器件上的包括RAM 存储在内的所有功能，电流消耗仅100 毫微安。

----时钟系统是mcu功耗的关键。

应用可以每秒多次或几百次进入与退出各种低功耗模式。

进入或退出低功耗模式以及快速处理数据的功能极为重要，因为CPU会在等待时钟稳定下来期间浪费电流。

mcu选型的注意事项

mcu选型的注意事项MCU（Microcontroller Unit）是一种集成了处理器核心、内存、输入输出接口和定时器等功能的微型计算机系统。

在选择MCU时，有一些注意事项需要考虑，以确保选型的准确性和合适性。

本文将介绍一些选择MCU的注意事项。

考虑应用需求。

在选择MCU之前，需要明确应用的需求和目标。

例如，需要确定所需的计算处理能力、存储容量、通信接口、功耗要求等。

这些需求将直接影响MCU的选型。

考虑处理器核心类型。

MCU的处理器核心类型有多种选择，如ARM、MIPS、AVR等。

不同的处理器核心具有不同的特性和优势，例如ARM处理器核心在处理性能和能耗方面具有优势，而AVR处理器核心则在低功耗和成本方面较为突出。

因此，在选择MCU时，需要根据应用需求和处理器核心的特性进行权衡和选择。

第三，考虑存储容量和存储类型。

MCU的存储容量通常包括程序存储器（Flash）和数据存储器（RAM）。

程序存储器用于存储代码和程序，而数据存储器用于存储变量和数据。

在选择MCU时，需要根据应用的代码和数据大小确定所需的存储容量，并考虑存储器类型（如闪存、EEPROM等）对应用的影响。

第四，考虑通信接口和外设功能。

MCU通常具有多种通信接口，如UART、SPI、I2C等，用于与外部设备进行数据交互。

此外，MCU还可集成多种外设功能，如模数转换器（ADC）、定时器、PWM等。

在选择MCU时，需要根据应用需求确定所需的通信接口和外设功能，并确保MCU具备相应的硬件支持。

第五，考虑功耗要求。

不同的应用对功耗的要求不同，有些应用对低功耗要求较高，而有些应用对功耗要求则相对较低。

在选择MCU 时，需要根据应用的功耗要求选择合适的MCU，并考虑MCU的功耗管理功能是否满足应用需求。

第六，考虑开发工具和生态系统支持。

选择一款MCU后，需要考虑其相关的开发工具和生态系统支持。

开发工具包括编译器、调试器、仿真器等，而生态系统支持则包括开发文档、代码示例、社区支持等。

华大低功耗 mcu选型手册

华大低功耗 mcu选型手册
华大低功耗MCU选型手册是针对用户对低功耗、高效率的MCU的需求而编写的，为用户提供了多种型号的MCU选择。

在选择MCU时，需要考虑以下几个关键因素：
1. 功耗：低功耗MCU在电池供电的应用中尤为重要，可以延长电池寿命。

2. 性能：MCU的性能应满足应用需求，包括运算速度、内存大小等。

3. 外设接口：根据具体应用，可能需要不同的外设接口，如UART、SPI、I2C等。

4. 开发工具：应选择与MCU配套的开发工具，以便于开发调试。

基于以上考虑因素，华大低功耗MCU选型手册提供了多种型号的MCU供用户选择，包括HC32F003系列、HC32F4A0系列等。

这些MCU具有低功耗、高性能、丰富的外设接口等特点，适用于各种应用场景。

此外，华大还提供了完善的开发工具，如Keil、IAR等，以帮助用户快速开发MCU应用程序。

总之，华大低功耗MCU选型手册为用户提供了多种选择，用户可以根据实际需求选择最适合的MCU型号。

同时，华大还提供了完善的开发工具和服务，帮助用户快速开发出高效、可靠的MCU应用程序。

MSP430系列MCU选型手册

MSP430系列MCU选型手册msp430芯片选型中文手册指南F1XX系列Vcc1.8V-3.6V型号MSP430F1101A参数说明1KBflash,128BRam；slopeA/D；14个I/O口；16位WDT；1个16位Timer_A(3个捕获/比较寄存器）,比较器_A；20DW、PW封装型号MSP430F1111A参数说明2KBflash,128BRam；slopeA/D；14个I/O口；16位WDT；1个16位Timer_A(3个捕获/比较寄存器）,比较器_A；20DW、PW封装型号MSP430F1121A参数说明4KBflash,256BRam；slopeA/D；14个I/O口；16位WDT；1个16位Timer_A(3个捕获/比较寄存器）,比较器_A；20DW、PW封装型号MSP430F1122参数说明4KBflash,256BRam；5通道10bitA/D；14个I/O口；16位WDT；1个16位Timer_A(3个捕获/比较寄存器）,温度传感器；20DW、PW封型号MSP430F1132参数说明8KBflash,256BRam；5通道10bitAD；14个I/O口；16位WDT；1个16位Timer_A(3个捕获/比较寄存器）；温度传感器；20DW、PW封型号MSP430F122参数说明4KBflash,256BRam；slopeA/D；22个I/O口；16位WDT；1个16位Timer_A(3个捕获/比较寄存器）；1个USART接口，比较器A；28DW、PW封装型号MSP430F123参数说明8KBflash,256BRam；slopeA/D；22个I/O口；16位WDT；1个16位Timer_A(3个捕获/比较寄存器）；1个USART接口，比较器A；28DW、PW封装型号MSP430F1222参数说明4KBflash,256BRam；8通道10bitA/D；22个I/O口；16位WDT；1个16位Timer_A(3个捕获/比较寄存器）；1个USART接口；温度传感器；28DW、PW封装型号MSP430F1232参数说明8KBflash,256BRam；8通道10bitA/D；22个I/O口；16位WDT；1个16位Timer_A(3个捕获/比较寄存器）；1个USART接口；温度传感器；28DW、PW封装型号MSP430F133参数说明8KBflash,256BRam；8通道12bitA/D；48个I/O口；16位WDT；1个16位Timer_A(3个捕获/比较寄存器）_A；1个16位Timer_B(3个捕获/比较寄存器）；1个USART接口；比较器_A；温度传感器；64PM封装型号MSP430F135参数说明16KBflash,512BRam；8通道12bitA/D；48个I/O口；16位WDT；1个16位Timer_A(3个捕获/比较寄存器）_A；1个16位Timer_B(3个捕获/比较寄存器）；1个USART接口；比较器_A；温度传感器；64PM封装型号MSP430F147参数说明32KBflash,1024BRam；8通道12bitA/D；48个I/O口；16位WDT；1个16位Timer_A(3个捕获/比较寄存器）；1个16位Timer_B（7个捕获/比较寄存器）；2个USART接口；MPY；比较器_A；温度传感器；64PM封装型号MSP430F1471参数说明32KBflash,1024BRam；slopeA/D；48个I/O口；16位WDT；1个16位Timer_A(3个捕获/比较寄存器）_A；1个16位Timer_B（7个捕获/比较寄存器）；2个USART接口；MPY；比较器_A；64PM封装型号MSP430F148参数说明48KBflash,2048BRam；8通道12bitA/D；48个I/O口；16位WDT；1个16位Timer_A(3个捕获/比较寄存器）_A；1个16位Timer_B（7个捕获/比较寄存器）；2个USART接口；MPY；比较器_A；温度传感器；64PM封装型号MSP430F1481参数说明48KBflash,2048BRam；slopeA/D；48个I/O口；16位WDT；1个16位Timer_A(3个捕获/比较寄存器）_A；1个16位Timer_B（7个捕获/比较寄存器）；2个USART接口；MPY；比较器_A；64PM封装型号MSP430F149参数说明60KBflash,2048BRam；8通道12bitA/D；48个I/O口；16位WDT；1个16位Timer_A(3个捕获/比较寄存器）_A；1个16位Timer_B（7个捕获/比较寄存器）；2个USART接口；MPY；比较器_A；温度传感器；64PM封装型号MSP430F1491参数说明60kflash,2048BRam；slopeA/D；48个I/O口；16位WDT；1个16位Timer_A(3个捕获/比较寄存器）_A；1个16位Timer_B（7个捕获/比较寄存器）；2个USART接口；MPY；比较器_A；64PM封装型号MSP430F155参数说明16KBflash,512BRam；8通道12bitA/D；双12bitD/A；DMA；48个I/O口；16位WDT；1个16位Timer_A(3个捕获/比较寄存器）_A；1个16位Timer_B(3个捕获/比较寄存器）；1个USART接口；I2C；比较器_A；温度传感器；64PM封装型号MSP430F156参数说明24KBflash,512BRam；8通道12bitA/D；双12bitD/A；DMA；48个I/O口；16位WDT；1个16位Timer_A(3个捕获/比较寄存器）_A；1个16位Timer_B(3个捕获/比较寄存器）；1个USART接口；I2C；比较器_A；温度传感器；64PM封装型号MSP430F157参数说明32KBflash,1024BRam；8通道12bitA/D；双12bitD/A；DMA；48个I/O口；16位WDT；1个16位Timer_A(3个捕获/比较寄存器）；1个16位Timer_B(3个捕获/比较寄存器）；1个USART接口；I2C；比较器_A；温度传感器；64PM 封装型号MSP430F167参数说明32KBflash,1024BRam；8通道12bitA/D；双12bitD/A；DMA；48个I/O口；16位WDT；1个16位Timer_A(3个捕获/比较寄存器）；1个16位Timer_B（7个捕获/比较寄存器）；2个USART接口；I2C；MPY；比较器_A；温度传感器；64PM封装型号MSP430F168参数说明48KBflash,2048BRam；8通道12bitA/D；双12bitD/A；DMA；48个I/O口；16位WDT；1个16位Timer_A(3个捕获/比较寄存器）；1个16位Timer_B（7个捕获/比较寄存器）；2个USART接口；I2C；MPY；比较器_A；温度传感器；64PM封装型号MSP430F169参数说明60KBflash,2048BRam；8通道12bitA/D；双12bitD/A；DMA；48个I/O口；16位WDT；1个16位Timer_A(3个捕获/比较寄存器）；1个16位Timer_B（7个捕获/比较寄存器）；2个USART接口；I2C；MPY；比较器_A；温度传感器；64PM封装型号MSP430F1610参数说明32KBflash,5120BRam；8通道12bitA/D；双12bitD/A；DMA；48个I/O口；16位WDT；1个16位Timer_A(3个捕获/比较寄存器）；1个16位Timer_B（7个捕获/比较寄存器）；2个USART接口；I2C；MPY；比较器_A；温度传感器；64PM封装型号MSP430F1611参数说明48KBflash,10240BRam；8通道12bitA/D；双12bitD/A；DMA；48个I/O口；16位WDT；1个16位Timer_A(3个捕获/比较寄存器）；1个16位Timer_B （7个捕获/比较寄存器）；2个USART接口；I2C；MPY；比较器_A；温度传感器；64PM封装型号MSP430F1612参数说明55kBflash,5120BRam；8通道12bitA/D；双12bitD/A；DMA；48个I/O口；16位WDT；1个16位Timer_A(3个捕获/比较寄存器）；1个16位Timer_B（7个捕获/比较寄存器）；2个USART接口；I2C；MPY；比较器_A；温度传感器；64PM封装F21X1系列Vcc1.8V-3.6V型号MSP430F2101参数说明1KBflash,128BRam；slopeA/D；16个I/O口；15/16位WDT；1个16位Timer_A(3个捕获/比较寄存器）；比较器_A；BrownoutProtection；20DW、PW、DGV封装型号MSP430F2111参数说明2KBflash,128BRam；slopeA/D；16个I/O口；15/16位WDT；1个16位Timer_A(3个捕获/比较寄存器）；比较器_A；BrownoutProtection；20DW、PW、DGV封装型号MSP430F2121参数说明4KBflash,256BRam；slopeA/D；16个I/O口；15/16位WDT；1个16位Timer_A(3个捕获/比较寄存器）；比较器_A；BrownoutProtection；20DW、PW、DGV封装型号MSP430F2131参数说明8KBflash,256BRam；slopeA/D；16个I/O口；15/16位WDT；1个16位Timer_A(3个捕获/比较寄存器）；比较器_A；BrownoutProtection；20DW、PW、DGV封装F4XX系列Vcc1.8V-3.6VWithLCD驱动型号MSP430F412参数说明4KBflash,256BRam；slopeA/D；48个I/O口；96段LCD；16位WDT；8bit基本定时器；1个16位Timer_A(3个捕获/比较寄存器）；比较器_A；64PM封装型号MSP430F413参数说明8KBflash,256BRam；slopeA/D；48个I/O口；96段LCD；16位WDT；8bit基本定时器；1个16位Timer_A(3个捕获/比较寄存器）；比较器_A；64PM封装型号MSP430F415参数说明16kBflash,512BRam；slopeA/D；48个I/O 口；96段LCD；16位WDT；8bit基本定时器；1个16位Timer_A （3或5个捕获/比较寄存器）；比较器_A；64PM 封装型号MSP430F417参数说明32kBflash,1024BRam；slopeA/D；48个I/O口；96段LCD；16位WDT；8bit基本定时器；1个16位Timer_A（3或5个捕获/比较寄存器）；比较器_A；64PM 封装型号MSP430FE423参数说明8KBflash,256BRam；SD16A/D；Emeter计量模块；14个I/O口；128段LCD；16位WDT；8bit基本定时器；1个16位Timer_A（3个捕获/比较寄存器）；1个USART 接口；温度传感器；64PM封装型号MSP430FE425参数说明16KBflash,512BRam；SD16A/D；Emeter计量模块；14个I/O口；128段LCD；16位WDT；8bit基本定时器；1个16位Timer_A（3个捕获/比较寄存器）；1个USART 接口；温度传感器；64PM封装型号MSP430FE427参数说明32KBflash,1KBRam；SD16A/D；Emeter计量模块；14个I/O口；128段LCD；16位WDT；8bit基本定时器；1个16位Timer_A(3个捕获/比较寄存器）；1个USART 接口；比较器_A；温度传感器；64PM封装型号MSP430F4250参数说明16KBflash,256BRam；32个I/O 口；56段LCD；SD16位ADC （具有内部参考电压）；12位DAC，1个16位Timer_A(3个捕获/比较寄存器）；温度传感器模块；电源检测功能；48DL封装型号MSP430F4260参数说明24KBflash,256BRam；32个I/O 口；56段LCD；SD16位ADC （具有内部参考电压）；12位DAC，1个16位Timer_A(3个捕获/比较寄存器）；温度传感器模块；电源检测功能；48DL封装型号MSP430F4270参数说明32KBflash,256BRam；32个I/O 口；56段LCD；SD16位ADC （具有内部参考电压）；12位DAC，1个16位Timer_A(3个捕获/比较寄存器）；温度传感器模块；电源检测功能；48DL封装型号MSP430FG437参数说明32KBflash,1024BRam；12通道12bitA/D；双12bitD/A；48个I/O口；DMA；128段LCD；16位WDT；8bit基本定时器；1个16位Timer_A(3个捕获/比较寄存器)；1个16位Timer_B(3个捕获/比较寄存器)；1个USART接口；温度传感器；80PN 封装型号MSP430FG438参数说明48KBflash,2048BRam；12通道12bitA/D；双12bitD/A；48个I/O口；DMA；128段LCD；16位WDT；8bit基本定时器；1个16位Timer_A(3个捕获/比较寄存器)；1个16位Timer_B(3个捕获/比较寄存器)；1个USART接口；温度传感器；80PN 封装型号MSP430FG439参数说明60KBflash,2048BRam；12通道12bitA/D；双12bitD/A；48个I/O口；DMA；128段LCD；16位WDT；8bit基本定时器；1个16位Timer_A(3个捕获/比较寄存器)；1个16位Timer_B(3个捕获/比较寄存器)；1个USART接口；温度传感器；80PN 封装型号MSP430FW423参数说明8KBflash,256BRam；slopeA/D；流量测量ScanIF模块；48个I/O口；96段LCD；16位WDT；8bit 基本定时器；1个16位Timer_A(3或5个捕获/比较寄存器)；比较器_A；64PM封装型号MSP430FW425参数说明16KBflash,512BRam；slopeA/D；流量测量ScanIF模块；48个I/O口；96段LCD；16位WDT；8bit 基本定时器；1个16位Timer_A(3或5个捕获/比较寄存器)；比较器_A；64PM封装型号MSP430FW427参数说明32KBflash,1024BRam；slopeA/D；流量测量ScanIF模块；48个I/O口；96段LCD；16位WDT；8bit基本定时器；1个16位Timer_A(3或5个捕获/比较寄存器)；比较器_A；64PM封装型号MSP430F435参数说明16KBFlash,512BRam；8通道12bitA/D；48个I/O口；128/160段LCD；16位WDT；8bit基本定时器；16位Timer_A(3个捕获/比较寄存器）_A；16位Timer_B(3个捕获/比较寄存器）_B；1个USART接口；比较器_A；温度传感器；80PN/100PZ封装型号MSP430F436参数说明24KBFlash,1024KRam；8通道12bitA/D；48个I/O口；128/160段LCD；16位WDT；8bit基本定时器；1个16位Timer_A(3个捕获/比较寄存器）_A；1个16位Timer_B(3个捕获/比较寄存器）_B；1个USART接口；比较器_A；温度传感器；80PN/100PZ封装型号MSP430F437参数说明32KBFlash,1024KRam；8通道12bitA/D；48个I/O口；128/160段LCD；16位WDT；8bit基本定时器；1个16位Timer_A(3个捕获/比较寄存器）_A；1个16位Timer_B(3个捕获/比较寄存器）_B；1个USART接口；比较器_A；温度传感器；80PN/100PZ封装型号MSP430F447参数说明32KBFlash,1024KRam；8通道12bitA/D；48个I/O口；160段LCD；16位WDT；8bit基本定时器；1个16位Timer_A(3个捕获/比较寄存器）；1个16位Timer_B （7个捕获/比较寄存器）；2个USART接口；MPY；比较器_A；温度传感器；100PZ 封装型号MSP430F448参数说明48KBflash,2048BRam；8通道12bitA/D；48个I/O口；160段LCD；16位WDT；8bit基本定时器；1个16位Timer_A(3个捕获/比较寄存器）；1个16位Timer_B （7个捕获/比较寄存器）；2个USART接口；MPY；比较器_A；温度传感器；100PZ 封装型号MSP430F449参数说明60KBflash,2048BRam；8通道12bitA/D；48个I/O口；160段LCD；16位WDT；8bit基本定时器；1个16位Timer_A(3个捕获/比较寄存器）；1个16位Timer_B （7个捕获/比较寄存器）；2个USART接口；MPY；比较器_A；温度传感器；100PZ 封装型号TSS721AD参数说明M-BUS总线型号TRF6901PT参数说明无线射频率收发芯片。

NEC 78K 8-16位MCU选型手册

16-位定时器 8-位定时器其它定时器钟表定时器实时计数器看门狗定时器 PWM 输出
UART UART（支持LIN总线）
UART/CSI UART（支持LIN总线）/CSI
CSI CSI/I2C CSI 具有自动发送/接收功能
I2C IEBus CAN 片上调试 LCD [segment x common] 16-位 A/D 转换器 10-位 A/D 转换器 8-位 A/D 转换器 8-位 D/A 转换器乘法器/除法器 [位 x 位，位÷位] 其它功能电源电压
8-位 x 4
√
−
8
√ −
16 x 16 32 ÷ 16
√
−
1 − 1 16-位 x 1, − 1 1 − − − − 1 − − − − − 8 − − − POC, LVI
8-位 x 4
16 x 16 32 ÷ 16
√
−
1 − 1 16-位 x 1, − 1 1 − − − − 1 − − − − − 8 − − − POC, LVI
78K0S/KA1+ µ PD78F9221 µ PD78F9222
78K0S/KB1+ µ PD78F9232 µ PD78F9234
POC: 上电清零电路 LVI: 低电压检测电路
1 Flash √ 128 10 8 M, − 8 −/− 1 1
−
− − 1 16-位 x 1, − − − − − − − − − − − − − 4 − − − POC (2.1 V ± 0.1 V), 2.0 ～ 5.5 10-SSOP
8-位单片微控制器
设备
存储器时钟 I/O Fra bibliotek线定时器
78K0, 78K0S 微控制器

STMCU全部选型手册

October 200832-bit microcontroller familiesFor a list of abbreviations and notes, refer to the page following the mature products16-bit microcontroller familiesAbbreviations ADC : Analog-to-digital converter ART : Auto-reload timerATAPI : AT attachment packet interface AWU : Auto wake-up from halt BLPD : Byte level protocol decoder BOD : Brown-out detector CAN : Controller area network CAPCOM : Capture compare CSS : Clock security systemDALI : Digital addressable lighting interface DDC : Data display channelDiSEqC : Digital satellite equipment control DMA : Direct memory access DSC : Dual supply control DTC : Data transfer coprocessor ETM : Embedded trace macrocell EMI : External memory interface HDLC : High-level data link control IAP : In-application programmingIC/OC : Input capture/output compare ICP programming IR : Infrared IrDA : Infrared data association ISP : In-situ programming I ²C : Inter-integrated circuit I²S : Inter-IC sound LCD : Liquid crystal display LIN : Local interconnect network LVD : Low voltage detection MAC : Multiply accumulator MC : Motor controlMFT: Multifunction timer MMC : MultiMediaCardNMI : Non-maskable interrupt OSG : Oscillator safeguardPCA : Programmable counter array PDR : Power-down resetPHW : Programmable halt wake-up PEC : Peripheral event controller PLD : Programmable logic device PLL : Phase locked loop POR : Power-on resetPVD : Programmable voltage detector PVR : Programmable voltage regulator PWM : Pulse width modulation ROP : Readout protection RTC : Real-time clock timer SC : SmartcardSCI : Serial communication interface SCR : Smartcard readerSDIO : Secure digital input output SMI : Serial memory interface SPI : Serial peripheral interface SSC : Single-cycle switching support SSP : Synchronous serial port TBU : Time base unit LI : Top level interruptUART : Universal asynchronous receiver transmitter USART : Universal sync/async receiver transmitter USB : Universal Serial Bus WDG : Watchdog timerWWDG: Window watchdog timerPackages DIP : Dual in-line package LCC : Leaded chip carrierSDIP : Shrink dual in-line package PQFP : Plastic quad flat package SO : Small outlineLQFP : Low-profile quad flat package PBGA : Plastic ball grid array DFN : Dual flat no-lead QFN : Quad flat no-leadAbbreviations and notesNotes8-, 16- and 32-bit microcontroller development toolsThis reference guide lists ST and third-party development tools that are promoted as part of the ST tool offer for 8-, 16- and 32-bit microcontrollers. For the latest news about this tool offer, please refer to /mcuEvaluation boards from STn Implement full range of device featuresn Come with complete schematics, documentation and code samples Starter kitsn Everything you need to start developing quickly and easilyn Immediate device evaluation with ready-to-run demonstration applications n In-circuit debugging to troubleshoot code using actual input/output of target systemEvaluationLow-cost evaluation boards are also available from third-party vendorsIn-circuit debugger/programmersn Real-time debugging using debug resources on the standard chip, no bondouts, 100% electrical characteristics guaranteedn R equires separate evaluation or application boardn RLink – debug and program a full range of ST MCUs from 8- to 32-bit Softwaren Free software toolsets with development environment, programming interface, integrated compiler support and moren C compilers with free versions that output code up to a specified sizen Free ST firmware libraries for all standard peripherals plus special package for USB, motor control and moren Large selection of development solutions (IDE + compiler) from leading tool suppliers for ARMn Large selection of royalty-free RTOS, solution stacks (TCP/IP, USB, …) and middlewareDevelopmentAdvanced emulation systems for 8-bit devices n Real-time emulationn Advanced breakpointsn Trace capability with complex triggeringn Code performance analysisIn-circuit programmersProgram the device on an application board via JTAG, in-circuit communication or in-situ programming interface (depends on target device)Pre-programmingST FASTROM service for ST7 and ST6 also provides rapid delivery ofready-to-mount MCUs pre-programmed with the customer’s application Automated programmersThird-party solutions for programming in a production environment.For a list of vendors, refer to /mcu Single position programmersThird-party solutions for programming one device at a time. Allows operation from a host PC, or in standalone mode.For a list of vendors, refer to /mcuGang programmersThird-party solutions for programming several devices at once. For a list of vendors, refer to /mcuProgrammingSTM32, STR9 and STR7 familiesTools for ST ARM® core based STM32, STR9 and STR7 families include a full range of third-party solutions that come complete with C/C++ compiler, integrated development environment and in-circuit debugger/programmer with industry standard JTAG interface. Explore and start applications easily with any of a range of affordable, easy-to-use starter kits. Take advantage of a range of firmware to speedapplication development, including free ST libraries and royalty-free RTOS, solution stacks (USB, TCP/IP, ...) and middleware.1 All part numbers shown are for STMicroelectronics and third-party tools (Hitex, IAR, Keil and Raisonance) which are available from ST.Additional tools that are not available through ST can be ordered from the third-parties listed.Development and programming toolsSTM32, STR9 and STR7 familiesST10 development and programming toolsST10 familySTM8 development and programming toolsDevelopment and programming toolsST7 family1 Add suffix /EU, /US or /UK for the power supply for your region2 Add suffix /EU or /US for the power supply for your region3 Available from ST or from Raisonance, 4 Requires optional connection kit. See ‘How to order ST7-EMU or DVP’ for connection kit ordering information5 Includes connection kit for SDIP32/SDIP42 only. See ‘How to order ST7-EMU or DVP’ for connection kit ordering information6 Includes connection kit for DIP16/SO16 only. See ‘How to order ST7-EMU or DVP’ for connection kit ordering information7 Order socket board ST7SB40-QP48 for LQFP48 package and ST7SB20J for all other packages 8 USB connection to PCHow to order ST7-EMU or DVP (accessories)9 Parallel port connection to PC10 Available accessories: ST7MC-MOT/IND (induction motor) and ST7-ICC/OPTOISOL (optoisolation board included with motor control starter kit (ST7MC-KIT/BLDC), is also available as separate product)11 Socket boards complement any tool with ICC capabilities (ST7-STICK, InDART, RLINK, DVP3, EMU3, etc.)12 For in-circuit debugging of ST7FLITEUx, users must also order the AD-ICD/DS8Z adapter. For ICD of ST7FLITEUx in DFN8 package, users must order AD-ICD/DS8Z and ST7MDT10-8/DVP13 Order code for daughter board featuring the selected MCU, which can be used with any REva starter kit (STxxxxx-SK/RAIS)How to order ST7-EMU or DVP (accessories)1 TEB: target emulation board to emulate a specific ST7 sub-family. Users can upgrade their emulator to emulate another ST7 family by ordering the appropriate TEB2 Connection kit: complete kit to connect the emulator to a target board. Includes cables, adapters and sockets for specific packages3 DVP3: entry-level emulator that offers a low-cost, flexible, modular debugging and programming solution4 EMU3: high-end emulator that offers a complete, flexible, modular debugging and programming solutionReplacement power supplies:1 For EMU series emulators: APS5V/8A2 For DVP series emulators: APS5V/2A51 Includes all connection kits2 Must be ordered separately3 Connection kit not included, must be ordered separately4 The following connection kit is provided without specifying a connection kit part number:ST7MDT10-16/DVP for DIP16/SO16, when ordering ST7MDT10-DVP3 and ST7MDT10-TEB/DVP SDIP32/SDIP42 connection kit, when ordering ST7MDT20-DVP3 and ST7MDT20-TEB/DVP 5 Add suffix /EU, /US or /UK for the power supply of your region6 These parts are included with the emulator. Ordering references are provided for upgrade or replacement7 These parts are included with connection kits and EMU series emulators. References are provided for ordering spare or replacement parts8 Connection kit Includes application board sockets and connectors for DIP8, SO8 and DFN8 packages 9 ICD adapter for ST7FLITEUx includes application board connectors for DIP8 and SO8 packagesUPSD familyUPSD development and programming toolsNotes1 Code development is easily managed without an external hardware in-circuit emulator by using the on-chip JTAG in-circuit emulator. ST has partnered with Keil Software and Raisonance to include support for UPSD3300 and UPSD3400 JTAG ICE in their 8051 Development ToolsST6 familyNotes1 Add suffix /110, /220 or /UK for the power supply for your region2 Emulator interface with Raisonance’s IDE (RIDE)MCU - Typical designations and part number suffixes© STMicroelectronics - October 2008 - Printed in Italy - All rights reserved The STMicroelectronics corporate logo is a registered trademark of the STMicroelectronics group of companies.All other names are the property of their respective owners.For more information on ST products and solutions,visit Order code: SGMICRO1008。

微芯MCU选型手册

2V to 5.5V
PIC12F519
P
$0.49
FLASH
8
1.5
0.04
64
8
8
2
LS, FW
POR WDT
1 x 8-bit
2V to 5.5V
PIC12F609
P
$0.52
FLASH
8
1.75
0.06
8
20
5
1
LS, FW
BOR POR WDT BOR POR WDT BOR POR WDT
F
FLASH
8
28
1
28
20
5
LS, FW, APM
2 x 8-bit 1 x 16-bit
1 - A/E/USART 1 - MSSP
mTouch Ch.: 17
2 - CCP
1 A/D 17 x 10 - bit @100ksps Bandgap: INTERNAL
1.8V to 5.5V
PIC16F1519
F
FLASH
8
14
0.5
28
20
5
LS, FW, APM
2 x 8-bit 1 x 16-bit
1 - A/E/USART 1 - MSSP
mTouch Ch.: 17
2 - CCP
1 A/D 17 x 10 - bit @100ksps Bandgap: INTERNAL
1.8V to 5.5V
PIC16F1517
PIC16F1823
P
$0.78
FLASH
8
3.5
0.12
256
14

便携医疗设备MCU选型必备宝典

便携医疗设备MCU选型必备宝典引言电子技术的快速发展与个人健康意识的逐步提高，使得人类对便携式医疗电子仪器的需求日益增长，生物测量与医疗仪器正成为21世纪全球经济的支柱型产业之一。

反之，随着各类便携式生物医学仪器的进步和普及，测量精度、功耗、运算能力、成本和集成度等指标的提高，对电子器件尤其是微控制器（MCU）提出了更高要求。

在家用医疗市场的逐步开放、偏远地域居民和军队野外作战训练时的医护需求、医院内部临床诊断和长期监测的需求等因素的共同驱动下，部分传统专业级医疗设备已逐步走向便携化。

便携式医疗电子仪器的快速发展，使得移动医疗、远程医疗、个人日常健康监测和治疗成为可能。

便携化的趋向给医疗电子仪器的设计提出了低功耗、高集成度和简单易用的要求，此外，仪器设计智能化和算法复杂化使得核心处理器必须具备更高的计算能力。

作为仪器仪表的核心控制器与处理中心，MCU的合理选型是仪器设计的首要步骤。

以TI、Freescale、ST、Silicon Labs、Microchip和Renesas为代表的半导体芯片公司，纷纷针对便携式医疗电子仪器市场推出了自己低功耗、高集成度的混合信号处理器。

当各类MCU 厂商皆宣称自己产品功耗最低、外设丰富和性能优越时，设计者需要结合自身科研和产品的现有需求与未来几年的升级规划来合理分析，从而选择较合适的MCU进行仪器设计。

1 便携式医疗电子仪器简介1.1 家用与临床便携式医疗仪器以电子温度计、血糖仪、数字血压计、低频理疗仪为代表的家用医疗电子产品的竞争日益激烈，市场需求的可提升空间巨大。

此类仪器设计对成本十分敏感，片上集成相应外设的MCU能有效降低系统成本，同时还有利于缩小尺寸和提高稳定性；对MCU运算性能则要求不高，传统8 bit或16 bit内核基本满足设计需求。

此外，以动态心电记录仪和动态血压监测仪为代表的临床便携式医用设备，具有测量精度高、可连续运行时间长、运算相对复杂和通讯功能多样等特点。

TI MCU选型指南

IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right, or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use any non-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAudio /audio Automotive and Transportation /automotiveAmplifiers Communications and Telecom /communicationsData Converters Computers and Peripherals /computersDLP®Products Consumer Electronics /consumer-appsDSP Energy and Lighting /energyClocks and Timers /clocks Industrial /industrialInterface Medical /medicalLogic Security /securityPower Mgmt Space,Avionics and Defense /space-avionics-defense Microcontrollers Video and Imaging /videoRFID OMAP Mobile Processors /omapWireless Connectivity /wirelessconnectivityTI E2E Community Home Page Mailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2012,Texas Instruments Incorporated。

教你挑选MCU

时控制,仪器仪表,通讯设备,家用电器,宇航设备等各个领域.
Motorola单片机: Motorola是世界上最大的单片机厂商.从M6800开始,开发了广
泛的品种,4位,8位,16位32位的单片机都能生产,其中典型的代表有:8位
机 M6805,M68HC05系列,8位增强型M68HC11,M68HC12 , 16位机M68HC16, 32位
图像处理等市场.
8051单片机: 8051单片机最早由Intel公司推出,其后,多家公司购买了8051的
内核,使得以8051为内核的MCU系列单片机在世界上产量最大,应用也最广泛,有
人推测8051可能最终形成事实上的标准MCU芯片.
LG公司生产的GMS90系列单片机,与Intel MCS-51系列,Atmel 89C51/52,89C2051
列,SMC63系列,SMC60系列和八位单片机SMC88系列.
东芝单片机: 东芝单片机门类齐全,4位机在家电领域有很大市场,8位机主要有
870系列,90系列,该类单片机允许使用慢模式,采用32K时钟时功耗降至10UA数
量级.东芝的32位单片机采用MIPS 3000A RISC的CPU结构,面向VCD,数字相机,
频率较Intel类单片机低很多，因而使得高频噪声低，抗干扰能力强,更适合用
于工控领域及恶劣的环境。Motorola 8位单片机过去的策略是以掩膜为主的，最
近推出OTP计划以适应单片机发展新趋势，在32位机上，M.CORE在性能和功耗方
面都胜过ARM7。
Microchip单片机
专用串行电缆即可对目标系统进行在线实时仿真.
EPSON单片机: EPSON单片机以低电压,低功耗和内置LCD驱动器特点著名于世,尤

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SG1006–2 SG1006Q12008
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: DSP56852VFE, DSP56F807VF80, DSP56F807VF80E, MC56F8357VVFE, MC56F8367VVFE
FREESCALE’S 8-BIT PRODUCTS SUMMARY
For complete part number information and temperature definitions, refer to Product Numbering System on page SG1006-9.
FREESCALE’S 8-BIT PRODUCTS SUMMARY (continued)
For complete part number information and temperature definitions, refer to Product Numbering System on page SG1006-9.
General Purpose Products (continued)
Product Flash RAM USB ADC 10-Bit MC9S08QE4 MC9S08QD4 MC9S08QD2 MC9S08QA4 MC9S08QA2 MC9S08LC60 MC9S08LC36 MC9S08SH8 MC9S08SH4 4 KB 4 KB 2 KB 4 KB 2 KB 60 KB 36 KB 8 KB 4 KB 256B 256B 128B 256B 128B 4 KB 2.5 KB 512 B 256 B — — — — — — — — — 10 4 4 4 4 8 (12-bit) 8 (12-bit) 12 12 8-Bit SCI (UART) √ — — — — √ √ √ √ √ — — — — 2 2 √ √ √ — — — — √ √ √ √ — — — √ √ √ √ √ √ 1 + 6-CH 2 + 3-CH 2 + 3-CH 2 + 3-CH MTIM MTIM 2 + 2-CH 2 + 2-CH 2+ 2-CH 2+ 2-CH ICS ICS ICS ICS ICS ICG w/FLL ICG w/FLL ICS ICS ESCI SPI I2 C ACMP Timer Clock Type DFN/QFN — — — 8 8 — — — 24 Package QFP/LQFP 32 — — — — 80, 64 80, 64 — — TSSOP 16 — — — — — — — 20, 16 SOIC 20, 28 8 8 8 8 — — — 8 DIP 16 8 8 8 8 — — — 20 Dev Tools DEMO √ √ √ √ √ √ √ √ √ EVB √ — — — — — — — — FSICE Applications/Additional Features *All RS08, S08, and HC08 products include COP, LVI, POR and KBI Ultra-low power S08 device with 1.8 V to 3.6 V op range0 Low-end, flash programmable to 5 V Low-end, flash programmable to 5 V Entry-level S08 with 1.8 V to 3.3 V op range Entry-level S08 with 1.8 V to 3.3 V op range Integrated Liquid Crystal Display (LCD) driver with high segment count Integrated Liquid Crystal Display (LCD) driver with high segment count Low-end S08 device with 2.7 V to 5.5 V op range Low-end S08 device with 2.7 V to 5.5 V op range
General Purpose Products
Product Flash RAM USB ADC 10-Bit 8-Bit SCI (UART) ESCI SPI I2 C ACMP Timer Clock Type DFN/QFN Package QFP/LQFP TSSOP SOIC DIP Dev Tools DEMO EVB FSICE Applications/Additional Features *All RS08, S08, and HC08 products include COP, LVI, POR and KBI High integration, flash programmable to 5V High integration, flash programmable to 5V High integration, flash programmable to 5V High integration, flash programmable to 5V High integration, flash programmable to 5V High performance, flash programmable down to 1.8 V High performance, flash programmable down to 1.8 V High performance, flash programmable down to 1.8 V High performance, flash programmable down to 1.8 V USB S08 device with high performance and integration USB S08 device with high performance and integration High performance, low voltage, small package High performance, low voltage, small package Ultra-low end, new RS08 core for small MCUs Ultra-low end, new RS08 core for small MCUs Ultra-low end, new RS08 core for small MCUs Ultra-low end, new RS08 core for small MCUs High performance, flash programming down to 1.8 V Flash programming down to 1.8 V, small package Ultra-low power S08 device with 1.8 V to 3.6 V op range Ultra-low power S08 device with 1.8 V to 3.6 V op range Ultra-low power S08 device with 1.8 V to 3.6 V op range
HCS08 & RS08 Families
MC9S08AW60 MC9S08AW32 MC9S08AW16 MC9S08AC16 MC9S08AC8 MC9S08GB60A MC9S08GT60A MC9S08GB32A MC9S08GT32A MC9S08JM60 MC9S08JM32 MC9S08QG8 MC9S08QG4 MC9RS08KA8 MC9RS08KA4 MC9RS08KA2 MC9RS08KA1 MC9S08GT16A MC9S08GT8A MC9S08QE128 MC9S08QE64 MC9S08QE8 60 KB 32 KB 16 KB 16KB 8KB 60 KB 60 KB 32 KB 32 KB 60KB 32KB 8 KB 4 KB 8 KB 4 KB 2 KB 1 KB 16 KB 8 KB 128 KB 64 KB 8 KB 2 KB 2 KB 1 KB 1 KB 1 KB 4 KB 4 KB 2 KB 2 KB 4K 2K 512B 256B 254B 126B 62B 62B 2 KB 1 KB 8 KB 4 KB 512B — — — — — — — — — 2.0 2.0 — — — — — — — — — — — 16 16 16 8 8 8 8 8 8 12 (12-bit) 12 (12-bit) 8 8 12 12 — — 8 8 24 (12-bit) 24 (12-bit) 10 2 2 2 2 2 √ √ √ √ 2 2 √ √ — — — — √ √ 2 2 √ √ √ √ √ √ √ √ √ √ 2 2 √ √ — — — — √ √ 2 2 √ √ √ √ √ √ √ √ √ √ √ √ √ √ √ √ — — √ √ 2 2 √ — — — — — — — — — √ √ √ √ √ √ √ √ — — 2 2 — 6 + 2-CH 6 + 2-CH 4 + 2-CH 6 + 2-CH 6 + 2-CH 3 + 5-CH 2 + 2-CH 3 + 5-CH 2 + 2-CH 1 x 2-CH 1 x 6-CH 1 x 2-CH 1 x 6-CH 2-CH MTIM 2-CH MTIM MTIM MTIM MTIM MTIM 3 + 2-CH 3 + 2-CH 1 + 6-CH 2 + 3-CH 1 + 6-CH 2 + 3-CH 1 + 6-CH 2 + 3-CH ICG w/FLL ICG w/FLL ICG w/FLL ICG w/FLL ICG w/FLL ICG ICG ICG ICG MCG with PLL and FLL MCG with PLL and FLL ICS ICS ICS ICS ICS ICS ICG ICG ICS ICS ICS 48 48 48 48 48 — 48 — 48 48 48 8, 16, 24 8, 16, 24 — — 6 6 48, 32 48, 32 48 48 — 64, 44 64, 44 64, 44 44, 32 44, 32 64 44 64 44 64, 44 64, 44 — — — — — — 44 44 80, 64, 44 80, 64, 44, 32 32 — — — — — — — — — — — 16 16 — — — — — — — — 16 — — — — — — — — — — — 8 8 16, 20 16, 20 8 8 — — — — 20, 28 — — — 42 42 — 42 — 42 — — 16 16, 8 16, 20 16, 20 8 8 42 42 — — 16 √ √ √ √ √ √ √ √ √ √ √ √ √ √ √ √ √ √ √ √ √ √ — — — — — √ √ √ √ — — — — — — — — √ — √ √ √