氰酸酯树脂基复合材料的制备及导热、介电性能研究摘要：本研究采用氰酸酯树脂作为基体材料，通过掺杂不同导热填料和介电填料制备氰酸酯树脂基复合材料，并对其导热、介电性能进行测试。
结果表明，导热填料的掺杂可以显著提高复合材料的导热性能，而介电填料的掺杂则可以降低复合材料的介电常数。
进一步的研究发现，当导热填料的掺杂量达到临界值时，复合材料的导热性能不再随着填料添加量的增加而提高，而是呈现出饱和趋势。
同时，介电填料的选择和掺杂量的变化也会影响复合材料的机械性能和热稳定性。
该研究结果可为氰酸酯树脂基复合材料的应用和优化提供基础性数据和理论依据。
关键词：氰酸酯树脂，导热填料，介电填料，导热性能，介电性能Abstract:In this study, cyanate ester resin was used as thebase material to prepare cyanate ester resin-based composite materials through doping with different thermal conductive fillers and dielectric fillers, and the thermal conductivity and dielectric propertieswere tested. The results showed that the doping ofthermal conductive fillers can significantly improve the thermal conductivity of the composite material, while the doping of dielectric fillers can reduce the dielectric constant of the composite material. Further research found that when the doping amount of thermal conductive fillers reaches a critical value, the thermal conductivity of the composite material no longer increases with the increase of the filler content, but shows a saturation trend. At the same time, the selection of dielectric fillers and the variation of doping amount also affect the mechanical properties and thermal stability of the composite material. The results of this study can provide basic data and theoretical basis for the application and optimization of cyanate ester resin-based composite materials.Keywords: Cyanate ester resin; Thermal conductive filler; Dielectric filler; Thermal conductivity; Dielectric propertiesIn addition, the effect of the properties of the thermal conductive and dielectric fillers on the thermal conductivity and dielectric properties of the cyanate ester resin-based composite material was investigated. It was found that the addition of thermal conductive fillers increased the thermalconductivity of the composite material, while the addition of dielectric fillers improved the dielectric properties of the composite material.Furthermore, the amount of doping had an impact on the mechanical and thermal properties of the composite material. When the amount of doping was too high, it led to a decrease in the mechanical and thermal properties of the composite material. Therefore, the optimal amount of doping needs to be determined through experiments to ensure that the composite material meets the requirements of the application.Overall, the study demonstrated that the thermal conductivity and dielectric properties of the cyanate ester resin-based composite materials can be improved through the introduction of appropriate thermal conductive and dielectric fillers. The optimal amount of doping also needs to be carefully considered to achieve the best performance. These findings can serve as a guide for the application and optimization of the cyanate ester resin-based composite materials in various fieldsIn addition to the improvements in thermalconductivity and dielectric properties, the use of cyanate ester resin-based composite materials alsooffers other advantages. The materials exhibit high chemical and thermal stability, as well as good mechanical properties, making them suitable for use in high-temperature applications such as aerospace, automotive, and electronics industries.Moreover, the cyanate ester resin-based composites can be easily processed using conventional techniques such as compression molding, autoclave molding, and resin infusion. This makes them highly versatile andsuitable for use in a variety of manufacturing processes.Despite the many advantages offered by cyanate ester resin-based composites, there are still challengesthat must be addressed. For example, the materials can be brittle, which limits their use in certain applications. Additionally, the use of certain fillers can result in a reduction in the mechanical properties of the composites, which must be carefully balanced with the desired improvements in thermal conductivity and dielectric properties.Further research is needed to explore ways to optimize the use of cyanate ester resin-based composites and to address these challenges. This can include exploring alternative filler materials, developing newprocessing techniques, and investigating the use of hybrid composites that combine the advantages of different types of fillers.In conclusion, the study highlighted the potential of cyanate ester resin-based composites as high-performance materials for various applications. By carefully selecting appropriate filler materials and optimizing the doping amount, these materials can exhibit improved thermal conductivity and dielectric properties, making them ideal for use in industries that require high-temperature and high-performance materials. These findings can provide important insights for material scientists and engineers who are working on developing new composite materials for various applicationsThe development of high-performance materials has been a major focus in the materials science and engineering field for many years. With advancements in technology and new discoveries in materials engineering, researchers have been able to create new and innovative materials with enhanced properties, such as improved thermal conductivity and dielectric properties.One key area of interest is the development ofcomposite materials. These materials are created by combining two or more different types of materials, often a polymer matrix and filler material. The properties of the resultant material can be tailoredto suit specific applications by selecting appropriate filler materials and optimizing the doping amount.In recent years, there has been a growing interest in the development of high-performance compositematerials with improved thermal conductivity. These materials are ideal for use in industries such as electronics, aerospace, and energy, where high temperatures are often present and heat dissipation is critical to the performance of the system.To achieve high thermal conductivity in composite materials, researchers have focused on optimizing the properties of the filler materials. One common approach is to use graphene, a material known for its excellent thermal conductivity, as the filler material. Graphene can be incorporated into a polymer matrix to create a composite material with improved thermal conductivity.Another approach is to use ceramic fillers, such as aluminum nitride or boron nitride, which have high thermal conductivity and are stable at hightemperatures. These fillers can be incorporated into a polymer matrix to create a composite material with excellent thermal stability and high thermal conductivity.In addition to improving thermal conductivity, composite materials can also be optimized for improved dielectric properties. Dielectric materials are commonly used in electronic systems to insulate electrical components and prevent electrical discharge.One approach to improving the dielectric properties of composite materials is to use fillers with high dielectric constants, such as barium titanate or zinc oxide. These fillers can be incorporated into a polymer matrix to create a composite material with enhanced dielectric properties.Overall, the development of high-performance composite materials with improved thermal conductivity and dielectric properties is an exciting area of research. By carefully selecting appropriate filler materialsand optimizing the doping amount, researchers can create materials with enhanced properties that areideal for use in a wide range of applications. These findings have the potential to significantly impact various industries and provide important insights formaterial scientists and engineers working on developing new composite materialsIn conclusion, the development of new materials with improved thermal conductivity and dielectricproperties is an important area of research. Through the careful selection of appropriate filler materials and optimization of the doping amount, scientists can create composite materials with enhanced properties suitable for various industrial applications. These findings are of significant importance for material scientists and engineers working on the development of new composite materials。
