EUA2380 Ver1.0(1)

UM11817Introduction to 18-cell slider battery pack emulatorRev. 1 — 17 February 2023User manualIntroduction to 18-cell slider battery pack emulatorIntroduction to 18-cell slider battery pack emulator 1 IntroductionThe BATT-18EMULATOR board can emulate a multi-cell battery pack that can be easily hooked-up to the evaluation boards for MC33774 18-cell battery cell controllers (BCCs):•RD33774ADSTEVB - distributed board with single MC33774•RD33774CNT3EVB - centralized board with three MC33774The user can connect the BATT-18EMULATOR board for a quick evaluation of NXP BCC ICs, or to help the users in their software development. These boards basically provide a very intuitive way:•To change the voltage across any of the 18 cells of an emulated battery pack•To change the voltage across some analog inputs of the BCC IC that are typically used as temperature sensorsFigure 1. BATT-18EMULATOR2 Getting started2.1 Kit contents/packing listThe kit contents include:•BATT-18EMULATOR, 18-cell slider battery pack emulator•25 W AC-DC adapter with +5 VDC/5 A single output - DC plug type P1J (2.1 × 5.5 × 11 mm), tuning fork type, center positive•Adapter cable DC plug 2.1 × 5.5 × 11 mm to 2.5 × 5.5 × 9.5 mmIntroduction to 18-cell slider battery pack emulator 3 Getting to know the hardware3.1 Board features•18 slider potentiometers to adjust the cells voltage between 1.2 V and 3.3 V. The maximum total voltage has been limited to 60 V.•Three cells voltage can be inverted to apply voltages from −1.2 V to −3.3 V•Maximum current capability per channel: 200 mA•Three connectors for MC33774 evaluation boards connections•Temperature sensor output voltage can vary from 0 V to +4.95 V to simulate negative temperature coefficient (NTC) sensor3.2 Board functionsThe board has been designed and optimized for the operating conditions described in Table 1 and Table 2. Usage of the board beyond these conditions can lead to malfunction and damage.Table 1. Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).[1]The maximum input supply current depends on the setup: number of boards connected, cells voltage, activated cell balancing channels; seeSection 3.3.3.[1]With jumpers setting, it is possible to get negative voltages from −3.3 V to −1.2 V for cells 13, 8 and 4; see Section 3.3.4.Introduction to 18-cell slider battery pack emulator 3.3 Board functional descriptionFigure 2. BATT-18EMULATOR board elements3.3.1 DescriptionEach cell emulation is made of a 5 V to 5 V unregulated isolated DC-DC converter and an adjustable regulator. The regulator output voltage is set thanks to a voltage slider. Minimum voltage is 1.2 V and maximum is set to 3.3 V.3.3.2 Connection and configurationThe emulator board requires a 5 V DC power supply with 5 A current capability. The power supply is connected to the board via J3 a Ø2.5 mm jack connector or using the 2 mm bananas J2(+) and J1(−). The center pinis connected to the positive voltage and the ring terminal to the ground. The input of the board is 5 A fuse protected. An LED allows the user to check that the board is powered up. If the voltage is present on the jack connector but the LED is off, then check the fuse F1.Up to three evaluation boards RD33774ADSTEVB or one RD33774CNT3EVB can be connected using connectors J4, J5, and J6 with no specific order.3.3.3 Current consumptionThe slider pack should be supplied with a +5 V AC-DC adapter or with a lab supply. The required supply current depends on several parameters described below.With no board connected, the default supply current on the 5 V primary is around 500 mA [19 × 28 mA (DC-DC typ supply current)].One RD33774ADSTEVB board, communicating, no balancing activated, consumes around 10.5 mA. Then the total supply current required on the 5 V primary is around 700 mA [500 mA + (19 × 10.5 mA)].If three boards are connected, then the supply current is 500 mA + (3 × 19 × 10.5 mA) = 1 A.If cell balancing is activated, the primary current depends on the cell voltage, the balancing resistance, and the number of balancing metal-oxide-semiconductor field-effect transistor (MOSFET) activated.Introduction to 18-cell slider battery pack emulator On RD33774ADSTEVB, the balancing resistance is 22 Ω per cell balancing channel. With V cell = 3.3 V, the peak balancing current is 150 mA peak, 75 mA average assuming a 50 % duty cycle. If N cell balancing MOSFETs are activated, then N × 75 mA are added to the primary current needed. If one board is connected and all18 cell balancing MOSFETs are activated, then the total current is 700 mA + 18 × 75 mA = 2 A. Each individual channel (200 mA of current capability) has to provide 10.5 mA + 75 mA averaged or 10.5 mA + 150 mA peak. Note: The current is limited to 180 mA per channel. If several boards are connected, it is recommended toavoid to activate same cell balancing channels at the same time on all the boards.3.3.4 Cell polarity selectionThree pairs of jumpers allow the polarity to be reversed for cell polarities for cell4 (C5M − C4M), cell8(C9M − C8M) and cell13 (C14M − C13M) therefore providing voltages between −1.2 V and −3.3 V; see Table 3.Note: Jumper selections should be done prior to supplying the BATT-18EMULATOR. Adjacent cell voltages are impacted when changing the polarities.3.3.5 External voltage injectionThe three jumpers can also be used as injection points to inject voltages above slider ranges: −1.2 V < V inj <+1.2 V or 3.3 V < V inj, typically to evaluate MC33774 cell terminal measurements at very low voltage (busbars) or a high-voltage cell.As example, to inject a voltage between C5M and C4M, remove jumper J8, keep jumper J7 1-2, and connect a floating supply between J8-2 and J7-1 or 2. Do not exceed maximum ratings and keep cell voltage in the range −5 V to +5 V.3.3.6 Temperature sensor simulationA separate slider allows the variation of the voltage across the temperature sensors.The temperature sensor output voltage can vary from 0 V to +4.95 V. It can mimic the temperaturevariation from −48 °C to +200 °C of a 10 kΩ NTC sensor. This output voltage is connected to four different general‑purpose input/output (GPIO) on the MC33774 (GPIO 1, 2, 7, 8) configured as ratiometric inputs with10 kΩ pull‑up resistors to VAUX (3.3 V typ.).3.4 MC33774 board connectionsThree 32 pins connectors (JAE Electronics MX34032NF2) J4, J5, J6 are connected in parallel as perthe following schematic Figure 3. Up to three boards (for example, RD33774ADSTEVB) or one boardRD33774CNT3EVB can be connected on any of these connectors.Introduction to 18-cell slider battery pack emulator Slider cell 0 is setting the voltage between C0M (cell0M) and C1M (cell0P), slider cell 1 is setting the voltage between C1M (cell1M) and C2M (cell1P), and so on, slider cell 17 is setting the voltage between C17M(cell17M) and C17P (cell17P).C17P-PWR and GND (pin 21) are used to supply the RD33774ADSTEVB and are separated from C17P andC0M respectively to avoid any voltage drop due to the current consumption of the evaluation boards.The slide temperature sensor is connected on pin 17 to pin 20 (NTC1, 2, 7 and 8 for RD33774DSTEVB).Figure 4. BATT-18EMULATOR connected to three RD33774DSTEVBIntroduction to 18-cell slider battery pack emulator 4 SchematicFigure 5. SchemaIntroduction to 18-cell slider battery pack emulator 5 Legal information5.1 DefinitionsDraft — A draft status on a document indicates that the content is still under internal review and subject to formal approval, which may resultin modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included in a draft version of a document and shall have no liability for the consequences of use of such information.5.2 DisclaimersLimited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors.In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation -lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory.Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products.NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or defaultin the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applicationsand the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect.Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at /profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer.Suitability for use in automotive applications — This NXP product has been qualified for use in automotive applications. If this product is usedby customer in the development of, or for incorporation into, products or services (a) used in safety critical applications or (b) in which failure could lead to death, personal injury, or severe physical or environmental damage (such products and services hereinafter referred to as “Critical Applications”), then customer makes the ultimate design decisions regarding its products and is solely responsible for compliance with all legal, regulatory, safety, and security related requirements concerning its products, regardless ofany information or support that may be provided by NXP. As such, customer assumes all risk related to use of any products in Critical Applications and NXP and its suppliers shall not be liable for any such use by customer. Accordingly, customer will indemnify and hold NXP harmless from any claims, liabilities, damages and associated costs and expenses (including attorneys’ fees) that NXP may incur related to customer’s incorporation of any product in a Critical Application.Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities.Evaluation products — This product is provided on an “as is” and “with all faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates and their suppliers expressly disclaim all warranties, whether express, implied or statutory, including but not limited to the implied warranties of non-infringement, merchantability and fitness for a particular purpose. The entire risk as to the quality, or arising out of the use or performance, of this product remains with customer.In no event shall NXP Semiconductors, its affiliates or their suppliersbe liable to customer for any special, indirect, consequential, punitiveor incidental damages (including without limitation damages for loss of business, business interruption, loss of use, loss of data or information, and the like) arising out the use of or inability to use the product, whether or not based on tort (including negligence), strict liability, breach of contract, breach of warranty or any other theory, even if advised of the possibility of such damages.Notwithstanding any damages that customer might incur for any reason whatsoever (including without limitation, all damages referenced above and all direct or general damages), the entire liability of NXP Semiconductors,its affiliates and their suppliers and customer’s exclusive remedy for all of the foregoing shall be limited to actual damages incurred by customer based on reasonable reliance up to the greater of the amount actually paid by customer for the product or five dollars (US$5.00). The foregoing limitations, exclusions and disclaimers shall apply to the maximum extent permitted by applicable law, even if any remedy fails of its essential purpose.Translations — A non-English (translated) version of a document, including the legal information in that document, is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions.Security — Customer understands that all NXP products may be subject to unidentified vulnerabilities or may support established security standards or specifications with known limitations. Customer is responsible for the design and operation of its applications and products throughout their lifecyclesto reduce the effect of these vulnerabilities on customer’s applicationsand products. Customer’s responsibility also extends to other open and/or proprietary technologies supported by NXP products for use in customer’s applications. NXP accepts no liability for any vulnerability. Customer should regularly check security updates from NXP and follow up appropriately. Customer shall select products with security features that best meet rules, regulations, and standards of the intended application and make the ultimate design decisions regarding its products and is solely responsiblefor compliance with all legal, regulatory, and security related requirements concerning its products, regardless of any information or support that may be provided by NXP.NXP has a Product Security Incident Response Team (PSIRT) (reachableat *************) that manages the investigation, reporting, and solution release to security vulnerabilities of NXP products.Introduction to 18-cell slider battery pack emulatorNXP — wordmark and logo are trademarks of NXP B.V.5.3 TrademarksNotice: All referenced brands, product names, service names, andtrademarks are the property of their respective owners.Introduction to 18-cell slider battery pack emulatorTablesTab. 1.Limiting values (4)Tab. 2.Electrical characteristics (4)Tab. 3.Cell voltage polarity selection (6)FiguresFig. 1.BATT-18EMULATOR (3)Fig. 2.BATT-18EMULATOR board elements (5)Fig. 3.Cell connector schematic ..................................7Fig. 4.BATT-18EMULATOR connected to threeRD33774DSTEVB (7)Fig. 5.Schema (8)UM11817All information provided in this document is subject to legal disclaimers.© 2023 NXP B.V. All rights reserved. User manual Rev. 1 — 17 February 202311 / 12Introduction to 18-cell slider battery pack emulatorContents1Introduction (3)2Getting started (3)2.1Kit contents/packing list (3)3Getting to know the hardware (4)3.1Board features (4)3.2Board functions (4)3.3Board functional description (5)3.3.1Description (5)3.3.2Connection and configuration (5)3.3.3Current consumption (5)3.3.4Cell polarity selection (6)3.3.5External voltage injection (6)3.3.6Temperature sensor simulation (6)3.4MC33774 board connections (6)4Schematic (8)5Legal information (9)Please be aware that important notices concerning this document and the product(s)described herein, have been included in section 'Legal information'.© 2023 NXP B.V.All rights reserved.For more information, please visit: Date of release: 17 February 2023。

V2400A SeriesComponent Compatibility GuideA list of peripheral components suitable for use with the V2400A series of computers2016/12/07 Version 2.1© 2016 Moxa Inc. All rights reserved.Copyright Notice©2016 Moxa Inc.All rights reserved.TrademarksThe MOXA logo is a registered trademark of Moxa Inc.All other trademarks or registered marks in this manual belong to their respective manufacturers.DisclaimerInformation in this document is subject to change without notice and does not represent a commitment on the part of Moxa.Moxa provides this document as is, without warranty of any kind, either expressed or implied, including, but not limited to, its particular purpose. Moxa reserves the right to make improvements and/or changes to this manual, or to the products and/or the programs described in this manual, at any time.Information provided in this manual is intended to be accurate and reliable. However, Moxa assumes no responsibility for its use, or for any infringements on the rights of third parties that may result from its use.This document might contain unintentional technical or typographical errors. Changes are periodically made to the information herein to correct such errors, and these changes are incorporated into new editions of the publication.Technical Support Contact Information/supportMoxa AmericasToll-free: 1-888-669-2872 Tel: +1-714-528-6777 Fax: +1-714-528-6778 Moxa China (Shanghai office) Toll-free: 800-820-5036Tel: +86-21-5258-9955Fax: +86-21-5258-5505Moxa EuropeTel: +49-89-3 70 03 99-0 Fax: +49-89-3 70 03 99-99 Moxa Asia-Pacific Tel: +886-2-8919-1230 Fax: +886-2-8919-1231Moxa IndiaTel: +91-80-4172-9088 Fax: +91-80-4132-10451. IntroductionThis document lists hardware components that are proven to provide the performance listed in the specification when used with the Moxa V2400A series of embedded computers, or computers that share basic design features with the V2400A series. Moxa computers come with multiple peripheral options and are engineered to work with components having different hardware specifications. This flexibility could sometimes lead to compatibility issues. When used with the V2400A series of embedded computers, peripherals from one manufacturer may not work as well as the ones made by another manufacturer. Moxa provides this list of V2400A series-compatible components, so that users can be certain of a reliable performance from the V2400A series, when used with the components listed in this document.2. Testing MethodsTo validate that a component meets the Moxa standards for quality and performance, the following five key compatibility tests are run:•Ambient temperature burn-in•Low temperature hard start•Heat/humidity burn-in•Cyclic high-low temperature burn-in•Vibration testAmbient Temperature Burn-InThe component is mounted on to a V2400A computer and put through a series of stress tests at an ambient temperature of around 25˚C, for a specified period of time. The duration of the test is determined based on the class of peripherals being tested.Low Temperature Hard StartThe component is mounted on to an unpowered V2400A computer and then the system is booted up at an extremely low temperature. The designated low temperature value depends on the computer model being tested.Heat/Humidity Burn-InThe component is mounted on to a V2400A computer, placed in a temperature- andhumidity-controlled enclosure, and then put through the burn-in test for a specified period of time. The temperature, humidity, and time targets vary depending on the specification of the computer model used in the test.Cyclic High-Low Temperature Burn-InThe component is mounted on to a V2400A computer, placed in a temperature controlled enclosure, and then put through the burn-in wherein the temperature is cyclically varied from very high to very low and back again, over a specified period of time. The target temperature range and the duration of the test can vary depending on the specification of the computer model used in the test.Vibration TestThe component is mounted on to a V2400A computer that is bound inside an electromagnetic vibrator, and then put through random vibration tests along three orthogonal axes: longitudinal, transverse, and vertical. The vibration tests are compliant with the EN50155/IEC61373 vibration standards.3. Storage EnduranceStorage media, such as SSDs, CF cards, SD cards, Disk on Module, and CFast, are composed of different electrical components. The main electrical components in these storage media, the NAND-flash memory and NAND-flash controller, impact the storage endurance and lifespan of the storage media.NAND-Flash Memory EnduranceNAND-flash memories have a limit on the number of times they can be programmed and erased (P/E). The P/E cycle as well as the erase count of a NAND-flash memory can be used to determine this limit. For example, an SLC (single-level cell) flash memory has a 60,000 P/E cycle, an MLC (multi-level cell) flash memory has a 3,000 P/E cycle, and TLC NAND flash memories have a P/E cycle value of up to 1,000. Each flash memory type has a different endurance level, which is why the storage lifespan is based on the flash memory type. Storage that uses SLC type flash memory could have the best endurance level compared with the MLC type storage. SLC storage usually comes with a 5-year OEM warranty (the actual warranty period depends on the original manufacturer). MLC storage only comes with a 1- to 3-year warranty. The major differences between SLC and MLC are: (a) The SLC NAND flash has a lifespan that is around 20 times that of an MLC, and (b) The price can differ by a factor of 4 to 5. The SLC type of storage is recommended for systems that are expected to have high reliability, and for applications that need to frequently write data to a storage medium.Terabytes Written (TBW)TBW is the unit used to evaluate SSD endurance. In actual applications, storage is used for routine operations and data access. Therefore the physical P/E cycle is not appropriate for describing the total rewritable data capacity. The management efficiency of the storage controller also affects the total rewritable data capacity result. For these reasons, Joint Electron Device Engineering Council (JEDEC) has defined a standard for SSD endurance evaluation called JESD218, which uses TBW to measure the endurance of the storage memory. By referring to this TBW value, users can easily estimate the storage specification and select a suitable storage for real-life use cases. For example, when routine operations need a maximum of 20 GB and the expected storage lifespan is 3 years, the total rewritable data demand would be 21.9 TBW (20 GB x 365 x 3). In this case, a storage that has more than 21.9 TBW will meet the requirement. We recommend selecting a storage media with a TBW that is greater than the calculated value.4. Declaration for Liability ExclusionThe specifications, warranty terms, and liability of items listed in this guide are the sole responsibility of the original manufacturers. Moxa does not take any responsibility in this regard. Please visit the manufacturers’ official websites for up-to-date product information before purchasing the components.5. Compatible ComponentsPeripheral components that have been tested and found suitable for use with the V2400A series of computers are listed in this section. The following table lists the Test Codes and their descriptions:Test Code DescriptionA The component has passed the ambient temperature verification testB The component has passed the low temperature verification testC The component has passed the heat/humidity verification testD The component has passed the cyclic high-low temperature verification testE The component has not been tested, but is similar to another component that has been tested in terms of its material and design.F The component has passed the vibration verification testDRAMVendor MemorySize Moxa’s PN Vendor’s PN Interface Chip Brand Speed Test Codes ADATA 4 GB N/A ADDS1600W4G11-B DDR3L N/A 1600 MHz A Apacer 2 GB N/A 78.A2GD9.4010C DDR3 Samsung 1600 MHz A Apacer 2 GB N/A 75.A83E4.G010C DDR3 Micron 1600 MHz A DSL 2 GB 135********B0 D3SP56081X12BAI DDR3L ProMOS 1600 MHz B, C DSL 4 GB 1352110042081 D3SP12081XL12BAI DDR3L ProMOS 1600 MHz B, C DSL 8 GB 1352110082022 D3SP12082XL12BAI DDR3L ProMOS 1600 MHz B, C DSL 8 GB 1352110082020 D3SH12082XL12AA DDR3L Hynix 1600 MHz B, C DSL 8 GB 1352110082026 D3SH12082XH15AB DDR3 Hynix 1333 MHz B, C, D InnoDisk 2 GB 135********B4 M3S0-2GMJCDPC DDR3L Micron 1600 MHz B, C, D InnoDisk 4 GB N/A M3SW-4GSJDL0C-Q DDR3L N/A 1600 MHz B, C, D Transcend 4 GB 1352110042091 TS512MSK64W6H-I DDR3L Samsung 1600 MHz B, C Transcend 8 GB 1352110082031 TS1GSK64W6H-I DDR3L Samsung 1600 MHz B, CCFastVendor StorageSize Moxa’s PN Vendor’s PNFlashMemoryBrandFlashMemorySpecController Firmware Warranty WarrantyExclusionTestCodesApacer 8 GB N/A APCFA008GACAN-ATM N/A MLC N/A N/A 2 years Endurance >3,000 EApacer 16 GB N/A APCFA016GACAN-ATM N/A MLC N/A N/A 2 years Endurance >3,000 EApacer 32 GB N/A APCFA032GACAN-ATM N/A MLC N/A N/A 2 years Endurance >3,000 AApacer 32 GB 1352010322314 APCFA032GBAN-WFTM1 Toshiba MLC N/A N/A 2 years Endurance >3,000 B, C, DInnoDisk 4 GB 1352010042311 DECFA-04GD06SWBDB Toshiba SLC N/A N/A 2 years Endurance >3,000 B, CInnoDisk 8 GB 1352010082311 DC1T-08GJ30AW2QB-A31 Toshiba SLC N/A N/A 5 years Endurance >60,000 B, C, DInnoDisk 8 GB N/A DECFA-08GD07SW2SC-A31 Toshiba MLC N/A N/A 2 years Endurance >3,000 B, CInnoDisk 8 GB 1352010082314 DECFA-08GD06SWBQB Toshiba SLC N/A N/A 2 years Endurance >3,000 B, CInnoDisk 8 GB N/A DECFA-08GD09SW1SC Toshiba MLC N/A N/A 2 years Endurance >3,000 B, CInnoDisk 8 GB 1352010082317 DECFA-08GD09BW1SC Toshiba MLC ID109 N/A 2 years Endurance >3,000 B, C, DInnoDisk 16 GB N/A DECFA-16GD09SW1DC Toshiba MLC N/A N/A 2 years Endurance >3,000 B, CInnoDisk 16 GB 1352010162316 DECFA-16GD09BW1DC Toshiba MLC N/A N/A 2 years Endurance >3,000 B, C, DInnoDisk 16 GB N/A DECFA-16GD07SW2DC-A31 N/A MLC N/A N/A 2 years Endurance >3,000 B, CInnoDisk 32 GB N/A DECFA-32GD09SW1DC Toshiba MLC N/A N/A 2 years Endurance >3,000 B, CInnoDisk 64 GB N/A DECFA-64GD09SW1DC Toshiba MLC N/A N/A 2 years Endurance >3,000 B, CInnoDisk 64 GB 1352010642312 DECFA-64GD07SW2DC N/A MLC N/A N/A 2 years Endurance >3,000 B, C Memoright 8 GB N/A MRCAJ5A008GN1CAI48 Micron SLC N/A N/A 5 years N/A B, C, D Silicon Power 1 GB N/A SP001GBCFS000V30-4T Toshiba SLC Jmicron N/A 3 years N/A E Silicon Power 2 GB N/A SP002GBCFS000V30-4T Toshiba SLC Jmicron N/A 3 years N/A E Silicon Power 4 GB N/A SP004GBCFS000V30-4T Toshiba SLC Jmicron N/A 3 years N/A E Silicon Power 8 GB N/A SP008GBCFS000V30-4T Toshiba SLC Jmicron N/A 3 years N/A AmSATA (V2403 only)Vendor StorageSize Moxa’s PN Vendor’s PNFlashMemoryBrandFlashMemorySpecController Firmware Warranty WarrantyExclusionTestCodesInnoDisk 8 GB N/A DEMSR-08GD09SW2SC Toshiba MLC N/A N/A 2 years Endurance >3,000 B, C, DInnoDisk 16 GB N/A DEMSR-16GD09SW2DC Toshiba MLC N/A N/A 2 years Endurance >3,000 B, C, DInnoDisk 32 GB N/A DEMSR-32GD09SW2DC Toshiba MLC N/A N/A 2 years Endurance >3,000 B, C, DInnoDisk 512 GB 1352035122210 DEMSR-C12D08BCBQC Toshiba MLC ID108 N/A 2 years Endurance >3,000 B, C, D Intel 120 GB N/A SSDMCEAW120A401 N/A MLC N/A N/A 3 years N/A ATranscend 16 GB N/A TS16GMSA370I Micron MLC N/A N/A 2 years Endurance >3,000 B, C, DSSDVendor StorageSize Moxa’s PN Vendor’s PNFlashMemoryBrandFlashMemorySpecController Firmware Warranty WarrantyExclusionTestCodesApacer 64 GB N/A AP64GAS510SB N/A MLC N/A N/A 2 years Endurance >3,000 AInnoDisk 64 GB N/A DES25-64GD06SW1QC Toshiba MLC N/A N/A 2 years Endurance >3,000 B, CInnoDisk 64 GB 1352030642170 DGS25-64GD81SWAQN Micron MLC N/A N/A 2 years Endurance >3,000 B, CInnoDisk 128 GB 1352031282116 DGS25-A28D81BW1QC Toshiba MLC N/A N/A 2 years Endurance >3,000 B, C, DInnoDisk 128 GB N/A DGS25-A28D81SW1QC-A31 Toshiba MLC N/A N/A 2 years Endurance >3,000 B, CInnoDisk 256 GB 1352032562112 DGS25-B56D81BW3QC Toshiba MLC N/A N/A 2 years Endurance >3,000 B, C, D Kingston 120 GB N/A SH103S3/120G N/A MLC N/A N/A 2 years N/A AMemoright 64 GB N/A MRSAJAA064GDA25I00 N/A MLC N/A N/A 3 years Endurance >3,000 B, CHDDVendor StorageSize Moxa’s PN Vendor’s PN Controller Firmware Test Codes HGST 500 GB N/A HTS725050A7E630 / 0J38075 N/A N/A A HGST 1 TB N/A HTS721010A9E630 / 0J22423 N/A N/A A, F HGST 1 TB N/A HTS541010A9E680 N/A N/A A, F Samsung 2 TB N/A ST2000LM003 N/A N/A A WD 1 TB N/A WD10JUCT-63CYNY0 N/A N/A A。

V2426A SeriesIntel®3rd Gen Core™CPU,EN50155railway computer with2mini PCIe expansion slotsFeatures and Benefits•Intel Celeron/Core i7processor•2peripheral expansion slots for various I/O,WLAN,mini-PCIe expansionmodule cards•Dual independent DVI-I displays•2Gigabit Ethernet ports with M12X-coded connectors•1SATA connector and1CFast socket for storage expansion•M12A-coded power connector•Compliant with EN50121-4•Complies with all EN50155mandatory test items1•Ready-to-run Debian7,Windows Embedded Standard7,and Windows10Embedded IoT Enterprise2016LTSB platforms•-40to70°C wide-temperature models available•Supports SNMP-based system configuration,control,and monitoring(Windows only)CertificationsIntroductionThe V2426A Series embedded computers are based on the Intel3rd Gen processor,and feature4RS-232/422/485serial ports,dual LAN ports,3 USB2.0hosts,and dual DVI-I outputs.In addition,the V2426A Series computers comply with the mandatory test items of the EN50155standard, making them suitable for a variety of industrial applications.The dual megabit/Gigabit Ethernet ports with M12X-coded connectors offer a reliable solution for network redundancy,promising continuous operation for data communication and management.As an added convenience,the V2426A computers have6DIs and2DOs for connecting digital input/output devices.In addition,the CFast socket,SATA connector,and USB sockets provide the V2426A computers with the reliability needed for industrial applications that require data buffering and storage expansion.Moreover,the V2426A computers come with2peripheral expansion slots for inserting different communication modules(2-port CAN module,or HSDPA,GPS,or WLAN module),an8+8-port digital input/output module,and a2-port serial module,giving greater flexibility for setting up different industrial applications at field sites.Preinstalled with Linux Debian7or Windows Embedded Standard7,the V2426A Series provides programmers with a friendly environment for developing sophisticated,bug-free application software at a low cost.Wide-temperature models of the V2426A Series that operate reliably in a-40 to70°C operating temperature range are also available,offering an optimal solution for applications subjected to harsh environments.1.This product is suitable for rolling stock railway applications,as defined by the EN50155standard.For a more detailed statement,click here:/doc/specs/EN_50155_Compliance.pdfAppearanceFront View Rear ViewSpecificationsComputerCPU V2426A-C2Series:Intel®Celeron®Processor1047UE(2M cache,1.40GHz)V2426A-C7Series:Intel®Core™i7-3517UE Processor(4M cache,up to2.80GHz) System Chipset Mobile Intel®HM65Express ChipsetGraphics Controller Intel®HD Graphics4000(integrated)System Memory Pre-installed4GB DDR3System Memory Slot SODIMM DDR3/DDR3L slot x1Supported OS Linux Debian7Windows Embedded Standard7(WS7E)32-bitWindows Embedded Standard7(WS7E)64-bitStorage Slot 2.5-inch HDD/SSD slots x1CFast slot x2Computer InterfaceEthernet Ports Auto-sensing10/100/1000Mbps ports(M12X-coded)x2Serial Ports RS-232/422/485ports x4,software selectable(DB9male)USB2.0USB2.0hosts x1,M12D-coded connectorUSB2.0hosts x2,type-A connectorsAudio Input/Output Line in x1,Line out x1,M12D-codedDigital Input DIs x6Digital Output DOs x2Video Output DVI-I x2,29-pin DVI-I connectors(female)Expansion Slots2peripheral expansion slotsDigital InputsIsolation3k VDCConnector Screw-fastened Euroblock terminalDry Contact On:short to GNDOff:openI/O Mode DISensor Type Dry contactWet Contact(NPN or PNP)Wet Contact(DI to COM)On:10to30VDCOff:0to3VDCDigital OutputsConnector Screw-fastened Euroblock terminalCurrent Rating200mA per channelI/O Type SinkVoltage24to30VDCLED IndicatorsSystem Power x1Storage x1LAN2per port(10/100/1000Mbps)Serial2per port(Tx,Rx)Serial InterfaceBaudrate50bps to921.6kbpsFlow Control RTS/CTS,XON/XOFF,ADDC®(automatic data direction control)for RS-485,RTSToggle(RS-232only)Isolation N/AParity None,Even,Odd,Space,MarkData Bits5,6,7,8Stop Bits1,1.5,2Serial SignalsRS-232TxD,RxD,RTS,CTS,DTR,DSR,DCD,GNDRS-422Tx+,Tx-,Rx+,Rx-,GNDRS-485-2w Data+,Data-,GNDRS-485-4w Tx+,Tx-,Rx+,Rx-,GNDPower ParametersInput Voltage12to48VDCPower Connector M12A-coded male connectorPower Consumption 3.78A@12VDC0.96A@48VDCPower Consumption(Max.)47W(max.)Physical CharacteristicsHousing AluminumIP Rating IP30Dimensions(with ears)275x92x154mm(10.83x3.62x6.06in)Dimensions(without ears)250x86x154mm(9.84x3.38x6.06in)Weight3,000g(6.67lb)Installation DIN-rail mounting(optional),Wall mounting(standard) Protection-CT models:PCB conformal coating Environmental LimitsOperating Temperature Standard Models:-25to55°C(-13to131°F)Wide Temp.Models:-40to70°C(-40to158°F) Storage Temperature(package included)-40to85°C(-40to185°F)Ambient Relative Humidity5to95%(non-condensing)Standards and CertificationsEMC EN55032/24EMI CISPR32,FCC Part15B Class AEMS IEC61000-4-2ESD:Contact:6kV;Air:8kVIEC61000-4-3RS:80MHz to1GHz:20V/mIEC61000-4-4EFT:Power:2kV;Signal:2kVIEC61000-4-5Surge:Power:2kVIEC61000-4-6CS:10VIEC61000-4-8PFMFRailway EN50121-4,IEC60571Railway Fire Protection EN45545-2Safety EN60950-1,UL60950-1Shock IEC60068-2-27,IEC61373,EN50155Vibration IEC60068-2-64,IEC61373,EN50155DeclarationGreen Product RoHS,CRoHS,WEEEMTBFTime304,998hrsStandards Telcordia(Bellcore),GBWarrantyWarranty Period3yearsDetails See /warrantyPackage ContentsDevice1x V2426A Series computerInstallation Kit1x wall-mounting kitDocumentation1x document and software CD1x quick installation guide1x warranty cardDimensionsOrdering InformationModel Name CPU Memory(Default)OS CFast(CTO)Backup CFast(CTO)SSD/HDD Tray(CTO)PeripheralExpansionSlotsOperatingTemp.ConformalCoatingV2426A-C2Celeron1047UE4GB1(Optional)1(Optional)1(Optional)2-25to55°C–V2426A-C2-T Celeron1047UE4GB1(Optional)1(Optional)1(Optional)2-40to70°C–V2426A-C2-CT-T Celeron1047UE4GB1(Optional)1(Optional)1(Optional)2-40to70°C✓V2426A-C7Core i7-3517UE4GB1(Optional)1(Optional)1(Optional)2-25to55°C–V2426A-C7-T Core i7-3517UE4GB1(Optional)1(Optional)1(Optional)2-40to70°C–V2426A-C7-CT-T i7-3517UE4GB1(Optional)1(Optional)1(Optional)2-40to70°C✓V2426A-C2-W7E Celeron1047UE4GB8GB1(Optional)1(Optional)2-25to55°C–V2426A-C2-T-W7E Celeron1047UE4GB8GB1(Optional)1(Optional)2-40to70°C–V2426A-C7-T-W7E i7-3517UE4GB8GB1(Optional)1(Optional)2-40to70°C–Accessories(sold separately)Battery KitsRTC Battery Kit Lithium battery with built-in connectorCablesCBL-M12XMM8PRJ45-BK-100-IP67M12-to-RJ45Cat-5E UTP gigabit Ethernet cable,8-pin X-coded male connector,IP67,1mCBL-M12(FF5P)/Open-100IP67A-coded M12-to-5-pin power cable,IP67-rated5-pin female M12connector,1mA-CRF-RFQMAM-R2-50Wi-Fi Extension Cable QMA(male)to SMA(male)adapter with50cm cable x1A-CRF-QMAMSF-R2-50Cellular Extension Cable QMA(male)to SMA(female)adapter with50cm cable x1A-CRF-CTPSF-R2-50GPS Extension Cable TNC to SMA(female)adapter with50cm cable x1ConnectorsM12A-5PMM-IP685-pin male circular threaded D-coded M12USB connector,IP68M12X-8PMM-IP678-pin male X-coded circular threaded gigabit Ethernet connector,IP67M12A-5P-IP68A-coded screw-in sensor connector,female,IP68,4.05cmM12A-8PMM-IP678-pin male circular threaded A-codes M12connector,IP67-rated(for field-installation)Power AdaptersPWR-24270-DT-S1Power adapter,input voltage90to264VAC,output voltage24V with2.5A DC loadPower CordsPWC-C7AU-2B-183Power cord with Australian(AU)plug,2.5A/250V,1.83mPWC-C7CN-2B-183Power cord with two-prong China(CN)plug,1.83mPWC-C7EU-2B-183Power cord with Continental Europe(EU)plug,2.5A/250V,1.83mPWC-C7UK-2B-183Power cord with United Kingdom(UK)plug,2.5A/250V,1.83mPWC-C7US-2B-183Power cord with United States(US)plug,10A/125V,1.83mWall-Mounting KitsV2400Isolated Wall Mount Kit Wall-mounting kit with isolation protection,2wall-mounting brackets,4screwsStorage KitsFK-75125-02Storage bracket,4large silver screws,4soft washers,4small sliver bronze screws,1SATA powercable,4golden spacers(only for the V2406and V2426)Expansion ModulesEPM-DK022mini PCIe slots for wireless modules,-25to55°C operating temperatureEPM-DK03GPS receiver with2mini PCIe slots for wireless modules,-25to55°C operating temperatureEPM-30322isolated RS-232/422/485ports with DB9connectors,-40to70°C operating temperatureEPM-31122isolated CAN ports with DB9connectors,-25to55°C operating temperatureEPM-34388DIs and8DOs,with3kV digital isolation protection,2kHz counter,-40to70°C operating AntennasANT-GPS-OSM-05-3M BK Active GPS antenna,26dBi,1572MHz,L1band antenna for GPSANT-LTEUS-ASM-01GSM/GPRS/EDGE/UMTS/HSPA/LTE,omni-directional rubber duck antenna,1dBiANT-WDB-ARM-02 2.4/5GHz,omni-directional rubber duck antenna,2dBi,RP-SMA(male)ANT-LTE-ASM-02GPRS/EDGE/UMTS/HSPA/LTE,omni-directional rubber duck antenna,2dBiANT-WCDMA-AHSM-04-2.5m GSM/GPRS/EDGE/UMTS/HSPA,omni-directional magnetic base antenna,4dBiWireless Antenna CablesA-CRF-MHFQMAF-D1.13-14.2Digital Interface Mini card internal antenna with QMA connector x1,locking washer x1,O-ring x1,nutx1DIN-Rail Mounting KitsDK-DC50131DIN-rail mounting kit,6screwsWireless PackagesEPM-DK3G Package Gemalto PHS8-P3G mini card with digital interface,internal antenna,installation bracket,screws,locking washers,O-rings,nuts,and thermal padEPM-DK Wi-Fi Package SprakLAN WPEA-121N Wi-Fi mini card with digital interface,internal antenna,installation bracket,screws,locking washers,O-rings,nuts,and thermal padEPM-DK LTE-EU Package Gemalto PLS8-E LTE mini card with digital interface,internal antenna,installation bracket,screws,locking washers,O-rings,nuts,and thermal padEPM-DK LTE-US Package Gemalto PLS8-X LTE mini card with digital interface,internal antenna,installation bracket,screws,locking washers,O-rings,nuts,and thermal padWireless Antenna Packages3G Antenna Package3G external antenna with QMA(male)to SMA(female)adapter and50-cm cables x2,3G externalantenna with SMA connectors x2,cellular extension cableLTE-US Antenna Package LTE-US external antenna with QMA(male)to SMA(female)adapter and50-cm cables x2,LTE-USexternal antenna with SMA connector x2,cellular extension cableLTE-EU Antenna Package LTE-EU external antenna with QMA(male)to SMA(female)adapter with50-cm cables x2,LTE-EUexternal antenna with SMA connectors x2,cellular extension cableWi-Fi Antenna Package External antenna with QMA internal cable,Wi-Fi extension cableGPS Antenna Package External antenna with TNC to SMA(female)adapter and a50-cm cable,SMA antenna(26dBi,1572MHz,L1band),GPS extension cable©Moxa Inc.All rights reserved.Updated Jan22,2020.This document and any portion thereof may not be reproduced or used in any manner whatsoever without the express written permission of Moxa Inc.Product specifications subject to change without notice.Visit our website for the most up-to-date product information.。

Alphacool Eisbaer Pro Aurora 280 CPUAlphacool article number: 11773The Alphacool Eisbaer Pro Aurora offers a much higher cooling surface than the normal Eisbaer Aurora. It was developed spe-cifically for extremely large CPU DIEs and covers processors such as the AMD Threadripper but also the AMD Ryzen CPUs com-pletely. The Eisbaer Pro is also designed for the Intel Sockets 3647 and 4189 to ensure the best possible cooling performance of the entire CPU.• Full copper radiator, Nickel-plated copper cooler• Virtually silent DC-LT2 pump• Hose length 40 cm• Digital RGB illuminated cooler and 140 mm fanCompatibility list1 x Mounting set for AMD TR4 / sTRX4 / SP31 x Mounting set for AMD AM41 x Mounting set for Intel 2011 / 2011-3 / 20661 x Mounting set for Intel 3647 Narrow & Square1 x Mounting set for Intel LGA 41891 x Mounting set for Intel LGA 17008 x M3x5 case mounting screws8 x M3x30 fan screws2 x 140 mm Aurora Rise fans 1 x Y -Adaptor 4-Pin PWM 1 x Digital RGB Controller 1 x 3-Pin JST to 3-Pin 5V adaptor 1 x Thermal compound 1 x Screw plug Tool 1 x Allen keyData Quick fastenersThe Alphacool Eisbaer Pro Aurora CPU AIO water cooler is a special development for processors with particularly large CPU dies. These include the AMD Threadripper and Epyc processors and the Intel CPUs for the LGA 3647 and LGA 4189 socket. With the optional XPX Pro AM4 mounting bracket, the Alphacool Eisbaer Pro CPU cooler can also be used on AMD Ryzen processors. Large cooling surfaceThe cold plate bottom covers the entire surface of the respective processors. The area of the cooling fins exceeds all known processor cores with an area of around 55 x 42 mm. This ensures that all hotspots of a CPU are directly covered and thus opti-mally cooled. With the additionally available AM4 bracket, cooling an AMD Ryzen processor is also child's play. The cooling fins are 0.4 mm thick and also have an optimal distance of 0.4 mm between them. In total there are 58 cooling fins on the bottom of the cooler. The bottom of the cooler is only 3 mm thick, which allows the heat to reach the water and be dissipated as quick-ly as possible.Copper radiatorAs per usual with Alphacool, the radiators are made of copper. Alphacool is the first manufacturer worldwide to use copper for all water bearing components such as the antechambers, the cooling fins and the cooling channels to which the fins are sol-dered. The connection threads are made of brass for strength reasons. In addition, the cooling fins are only lightly painted. On closer inspection the copper shimmers through a little. A thick lacquer coating would result in a reduction of the cooling capaci-ty. The fin density is at optimal 15FPI. Therefore the radiator works perfectly even at low airflow. A too high fin density would require fans with higher speed to achieve the same cooling capacity. A lower fin density would no longer benefit from fast ro-tating fans. So the golden mean was chosen.Real water coolingThe Eisbaer Pro Aurora consists almost entirely of actual water cooling components. The extremely robust and durable TPV hoses are used in the enterprise products for servers and workstations. The hose connections also come from the Enterprise series from Alphacool and use the standard G1/4". This makes the Eisbaer Pro Aurora fully compatible with all common water cooling products. The quick-release fastener allows easy expansion of the AIO with additional components. The most im-portant of these are the prefilled radiators and the Eiswolf GPU AIO water cooling system.Fan and lightingThe entire Eisbaer Aurora Pro cooler is equipped with addressable digital RGB LEDs. This gives a real eye-catcher in the Case. The fan used is the Aurora Rise with 140mm. Due to the special blade design, the fan is extremely quiet and the addressable RGB LEDs provide brilliant illumination. The Alphacool Aurora Rise fan convinces with a max. statistical pressure of 2.20 mm/ H2O and offers a max. air flow of 154.1 m3/h. The PWM control allows the fan to be controlled over a wide speed range. In ad-dition, it offers a zero control. It can therefore be regulated down to 0 rpm and then starts with approx. 350 rpm. Of course all Digital RGB LEDs can be controlled at will. Depending on the controller almost all effects are possible.How to connect everythingThe fans are normally controlled via a 4-pin PWM connector. An included Y-adapter for the fans makes it easy to connect them to the mainboard. This allows all fans to be controlled and regulated via one connector. Each fan has a 3-pin JST connector in-cluding Y-adapter for the LED illumination. This allows the fans to be connected directly together and can also be controlled simultaneously via a controller. For the connection to a typical 3-pin 5V connector a corresponding adapter is included. Alter-natively, the included Digital RGB controller can be used. The pump of the Eisbaer Aurora uses a 3-pin Molex connector. This can also be connected to the mainboard.The Eisbaer Pro Aurora is a true multi-talent. Expandable, fully compatible with DIY water cooling components and it is the optimal solution for the most powerful processors on the market.。