PCB专业英语

一、综合词汇1、印制电路：prｉnｔed ｃirｃuiｔ2、印制线路:printed wiｒing3、印制板:ｐrinｔed ｂｏaｒd4、印制板电路:ｐｒinteｄcircｕiｔｂoard （ｐcb)5、印制线路板:pｒｉnted ｗiriｎｇboard(ｐｗb)６、印制元件:pｒinted compoｎｅｎt7、印制接点：ｐrinｔed contact8、印制板装配:printeｄbｏarｄassｅmbly9、板:ｂoard10、单面印制板:ｓinｇle-sidｅd pｒinted board(ssb)１1、双面印制板:douｂlｅ-siｄed ｐrinted ｂoａrd(dsb)12、多层印制板:mulitlayｅr printed bｏaｒd(ｍｌｂ）13、多层印制电路板:mulｉtlａyer printed circuit boａrｄ14、多层印制线路板:mulitlayer pritedｗｉrｉnｇｂoard１５、刚性印制板:ｒigid pｒｉnted boarｄ16、刚性单面印制板:riｇiｄsingｌｅ-sｉｄed printed boｒad17、刚性双面印制板：ｒｉgｉd ｄｏuｂle-sideｄprinｔed boｒaｄ1８、刚性多层印制板：riｇｉd ｍulｔilaｙer prｉnｔed boarｄ１9、挠性多层印制板:flexiblｅmultiｌayer prｉｎted board２０、挠性印制板：fｌｅｘible ｐrinｔｅd bｏａrｄ２1、挠性单面印制板:fｌexibｌｅsinglｅ-sideｄpｒinted board22、挠性双面印制板：fleｘｉble ｄouble-sｉded printed board23、挠性印制电路:flexiblｅｐｒinted cｉrcuit(fpc）24、挠性印制线路:flｅxｉｂlｅprinｔed ｗirinｇ25、刚性印制板：ｆｌex－rｉgidｐrｉnｔed bｏaｒd，ｒigid－flex ｐriｎtｅd board２６、刚性双面印制板：flex-rigid douｂｌe-sided prinｔeｄboａrd, rｉｇiｄ－ｆlex ｄｏubｌe-siｄed priｎted27、刚性多层印制板：flex-rigｉd multｉｌayer printed boarｄ, rigid-flｅx ｍｕltilay ｅr ｐrinted ｂoaｒd28、齐平印制板：ｆlush ｐriｎtｅｄboaｒd２９、金属芯印制板：mｅtal core printｅd bｏａｒｄ30、金属基印制板:mｅtａl bａsｅprinted bｏaｒd3１、多重布线印制板：mulit－wiring priｎted ｂoard３2、陶瓷印制板：ｃeｒaｍic suｂstraｔｅpｒiｎtｅｄboard33、导电胶印制板:elecｔｒｏconductive ｐaste printｅd boａrd３4、模塑电路板:ｍｏlｄed ciｒｃuiｔboaｒd３5、模压印制板：staｍpｅd prinｔeｄwiｒiｎg boarｄ36、顺序层压多层印制板:ｓequenｔially-laminated mｕｌitlayer37、散线印制板:discreｔeｗiriｎg ｂoａrd３8、微线印制板：miｃｒo ｗire ｂｏarｄ39、积层印制板：bｕile-ｕpｐｒintｅd bｏard40、积层多层印制板:ｂuiｌd-uｐmulｉtlａｙer priｎｔed bｏａrd (buｍ) 4１、积层挠印制板：ｂｕild-uｐflexiblｅprｉnted ｂoard42、表面层合电路板:sｕrface laｍinａr ciｒcuit （slｃ)4３、埋入凸块连印制板：b2iｔprinｔed boａｒｄ４4、多层膜基板：multi-laｙｅｒed fiｌm subｓtrate(mfs)45、层间全内导通多层印制板：alivh multilaｙer prｉntｅｄboaｒd46、载芯片板:cｈiｐｏｎboard （cob)4７、埋电阻板：burｉed ｒesistaｎce board4８、母板：mother board４9、子板：ｄaｕgｈter boaｒd50、背板:ｂackplane51、裸板：baｒe board52、键盘板夹心板：ｃoppeｒ-iｎvaｒ-cｏppｅｒboａrｄ5３、动态挠性板:dynamic fｌex boaｒd54、静态挠性板:stａtic flex board5５、可断拼板：ｂｒeaｋ-away planｅl56、电缆:cable5７、挠性扁平电缆：fleｘiblｅｆlａt cａbｌe（ffc）５8、薄膜开关:ｍemｂrane ｓwitch5９、混合电路:hybrid circｕit60、厚膜：thick fiｌm６１、厚膜电路：thick film circuｉt62、薄膜：thiｎfiｌm63、薄膜混合电路:thin fｉｌm hybrid cirｃuit６4、互连：intｅrcoｎｎｅｃtion65、导线:cｏnｄuctoｒtraｃｅline66、齐平导线：flusｈconductoｒ67、传输线:ｔransmｉｓｓioｎline68、跨交：crｏssoveｒ69、板边插头:edge－bｏaｒd contacｔ７0、增强板：stｉｆfｅｎer71、基底:ｓuｂｓtrate72、基板面:rｅal ｅstａte73、导线面：cｏnｄucｔor ｓide７4、元件面：comｐｏｎenｔsｉde75、焊接面：sｏｌdeｒｓiｄｅ76、印制:priｎtinｇ77、网格：grｉd78、图形：pattern79、导电图形：conductive paｔtern80、非导电图形：noｎ－conductive paｔteｒn81、字符:legeｎd８2、标志：marｋ二、基材:1、基材：baｓe ｍaｔerial2、层压板:lamｉnatｅ３、覆金属箔基材：mｅｔal－clad bａde mａｔerial4、覆铜箔层压板:copｐer-clad lａmiｎaｔｅ(cｃl)５、单面覆铜箔层压板:single-ｓided ｃoppｅr-claｄlａminａte６、双面覆铜箔层压板：doublｅ-ｓided copｐeｒ-claｄlaminａte7、复合层压板：coｍｐｏsitｅlａmｉnate8、薄层压板：thiｎlaminａte9、金属芯覆铜箔层压板:mｅｔal corｅcopper－cｌａｄlａmiｎate１０、金属基覆铜层压板：metａl base ｃoppeｒ-ｃｌad lａminａtｅ1１、挠性覆铜箔绝缘薄膜:fｌexibｌe copｐeｒ-clad diｅlectricｆilｍ12、基体材料：bａsｉs ｍａterial1３、预浸材料：prepreｇ1４、粘结片:bonding ｓｈｅet15、预浸粘结片:preimｐrｅgｎatedｂonding sheｅr16、环氧玻璃基板：epoxy glass ｓｕｂsｔｒate17、加成法用层压板：ｌaminate for aｄdiｔｉve procｅss18、预制内层覆箔板：mass laminａtion panel１9、内层芯板:corｅmateｒiaｌ20、催化板材：cataｌｙzeｄboard ,ｃoaｔｅd ｃatａlyzeｄlamｉnate21、涂胶催化层压板:aｄhesiｖe－cｏated catalｙzed laminate22、涂胶无催层压板:adｈeｓive-cｏａted unｃatａlyzed ｌａmiｎａtｅ２３、粘结层：bondｉng layｅr24、粘结膜:fｉlm aｄｈｅsive25、涂胶粘剂绝缘薄膜:ａdhesive coatｅd dielectriｃfｉｌm2６、无支撑胶粘剂膜:ｕｎsｕpported adhｅsｉｖe fｉｌｍ２７、覆盖层:coveｒlayｅr(coｖeｒlaｙ)2８、增强板材：sｔｉffener maｔeｒiaｌ29、铜箔面：copper-claｄsurfaｃe30、去铜箔面:ｆoil remｏｖａｌsurfacｅ３1、层压板面：unclaｄｌamｉnate surｆacｅ３2、基膜面:base fｉlmｓurfaｃe３３、胶粘剂面：adhesive faec34、原始光洁面：pｌate finｉsh35、粗面：matｔfiniｓh3６、纵向:lenｇth wiｓe dirｅction37、模向：crosｓwise directｉoｎ38、剪切板：cut tｏsｉｚe pａｎｅl3９、酚醛纸质覆铜箔板:pheｎolｉｃｃelｌuｌose pａｐeｒcｏpper-clad lamｉnatｅｓ(pｈenoliｃ/pａｐｅr cｃl）4０、环氧纸质覆铜箔板:epoｘide celｌulｏse pａｐer copｐer－clａd laｍinaｔes (epoxy/ｐaｐer ccｌ)41、环氧玻璃布基覆铜箔板:ｅpoxidｅwoven glａss fabric cｏpｐer－ｃｌａd laminａteｓ42、环氧玻璃布纸复合覆铜箔板:epoxiｄe cｅｌlulose ｐapｅr core,ｇlａss clotｈsurfaｃes copper－cｌad lａminａteｓ4３、环氧玻璃布玻璃纤维复合覆铜箔板:ｅpoｘidｅｎｏnｗoven/ｗｏveｎｇlass reｉｎforced coｐpeｒ－clad ｌaｍinａtes44、聚酯玻璃布覆铜箔板：ployester woｖｅn glａss ｆaｂric ｃopper-cｌａd lamin ａｔes45、聚酰亚胺玻璃布覆铜箔板:polyimide wovｅn gｌａss fabrｉc copper-ｃｌad laminateｓ46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：ｂiｓmaｌeimide/triazinｅ/epoxide woven glａsｓｆａbric cｏppeｒ－ｃｌad lamimaｔes47、环氧合成纤维布覆铜箔板:epoxｉde syntｈeｔic ｆibｅr fabric copper-ｃｌａｄlamｉnaｔeｓ48、聚四乙烯玻璃纤维覆铜箔板：teｆlon/fiber glass cｏppｅr－cｌａｄｌamｉna ｔes49、超薄型层压板:ｕltrａthin laminａte50、陶瓷基覆铜箔板：ｃeramics baｓeｃopｐeｒ-ｃlaｄｌａminaｔes51、紫外线阻挡型覆铜箔板：uv bloｃkiｎg cｏppｅr-clａｄlａmｉnａｔeｓ三、基材的材料1、a阶树脂：a－staｇｅreｓｉn2、b阶树脂：b-ｓtage resin3、c阶树脂:c-stａｇｅrｅsin4、环氧树脂:ｅpoxy resｉｎ５、酚醛树脂：pｈenoｌic resin6、聚酯树脂：pｏlｙesteｒreｓin7、聚酰亚胺树脂:ｐoｌyimｉde resin8、双马来酰亚胺三嗪树脂:bisｍａleimidｅ-triazinｅresin9、丙烯酸树脂：ａcｒyｌic resin10、三聚氰胺甲醛树脂:meｌaｍine formaldehydｅreｓin11、多官能环氧树脂：polyfuncｔiｏnal epｏｘy reｓｉn12、溴化环氧树脂：bｒominａted epoxy resiｎ１３、环氧酚醛:epoｘy ｎovoｌaｃ１４、氟树脂:fｌｕroresiｎ１５、硅树脂:silｉconｅresin１6、硅烷:silane17、聚合物：polymer１８、无定形聚合物：ａmoｒphｏus poｌymｅr1９、结晶现象：ｃｒyｓｔalline pｏlamer２0、双晶现象:dｉｍoｒｐhiｓｍ２1、共聚物：coｐｏlｙmer22、合成树脂:sｙnthetｉc23、热固性树脂：tｈeｒmｏｓetting resin２４、热塑性树脂：tｈermoplastic resin２5、感光性树脂：photosensitivｅｒｅｓin２6、环氧当量：wｅight peｒepoxy eｑｕivalenｔ(wｐe)２7、环氧值：epoｘｙvalue2８、双氰胺：ｄicyandiamiｄe29、粘结剂：ｂindeｒ30、胶粘剂：aｄesive3１、固化剂：ｃuｒing aｇeｎt32、阻燃剂：ｆｌaｍe retardaｎt3３、遮光剂：opａｑuer34、增塑剂：pｌastｉcｉzｅrs３5、不饱和聚酯:ｕnsａtｕiａted polyeｓteｒ36、聚酯薄膜:poｌyｅster37、聚酰亚胺薄膜：pｏlyiｍidｅfilm (pi)38、聚四氟乙烯：polｙtetｒaflｕoｅtyｌenｅ（ｐtfｅ）３9、聚全氟乙烯丙烯薄膜:peｒｆｌuorｉnaｔed ethylene-propylｅnｅcｏpolymer film （ｆeｐ）40、增强材料:reinｆｏrｃing material41、玻璃纤维:ｇｌass ｆiber42、e玻璃纤维：e－glass ｆibre４３、d玻璃纤维：d-ｇlasｓfｉbre4４、s玻璃纤维：s-glaｓｓfibre45、玻璃布：glaｓs fabｒiｃ46、非织布:nｏn－woven faｂric47、玻璃纤维垫:gｌaｓs matｓ4８、纱线:ｙaｒn 49、单丝:ｆilａment５0、绞股:sｔranｄ51、纬纱:ｗｅｆt yarn52、经纱：warp yａｒｎ53、但尼尔:deｎier５4、经向：wａrp-ｗｉｓｅ55、纬向:weｆt-wise,fillｉｎg-wise5６、织物经纬密度:tｈrｅaｄｃouｎt５７、织物组织：weaveｓtruｃture5８、平纹组织：pｌain structurｅ5９、坏布：ｇrｅy faｂric６0、稀松织物:woveｎscrim61、弓纬:bｏｗｏf weave62、断经:ｅｎd mｉssｉnｇ63、缺纬:miｓ-picｋs64、纬斜:biaｓ6５、折痕:crease６6、云织：waviness67、鱼眼:ｆisｈｅye68、毛圈长:ｆｅatｈer lengｔh６9、厚薄段：ｍark70、裂缝:spliｔ71、捻度：twｉst ｏf yａｒn72、浸润剂含量：siｚe conｔeｎｔ7３、浸润剂残留量：size ｒesiｄｕe74、处理剂含量：finisｈlｅveｌ75、浸润剂:sｉze７6、偶联剂:cｏuplint ａｇent７7、处理织物：ｆiｎiｓheｄfabｒic7８、聚酰胺纤维:polｙａrｍidｅfibｅｒ79、聚酯纤维非织布:ｎｏn-woｖｅnｐolyestｅｒfaｂriｃ８0、浸渍绝缘纵纸：ｉmpregnaｔing insｕlaｔion pａｐer８1、聚芳酰胺纤维纸：aroｍatic polｙamide pａper82、断裂长：ｂｒｅaking leｎgth83、吸水高度：heiｇht oｆｃaｐilｌary rise84、湿强度保留率：wet ｓtｒeｎgｔhｒetenｔion8５、白度:wｈitennｅss８6、陶瓷：ceramics87、导电箔：condｕｃｔive foｉl８８、铜箔:coｐper ｆｏil89、电解铜箔:eｌｅctrｏdｅpｏsited coｐpeｒｆoiｌ(ed cｏpｐｅr fｏil) 9０、压延铜箔:ｒolｌed coｐper ｆｏil９1、退火铜箔:aｎneａleｄcｏppｅｒfoil９2、压延退火铜箔:roｌled annｅalｅd copｐer foil (rａcｏｐpeｒｆoil)93、薄铜箔：thiｎcopper foiｌ94、涂胶铜箔:adhesiｖe coated fｏｉl９5、涂胶脂铜箔：resｉn cｏateｄcｏpper foil (rcc）9６、复合金属箔：ｃomｐoｓｉte meｔallｉc material９7、载体箔:caｒrier fｏil9８、殷瓦：inｖar9９、箔(剖面）轮廓：foil pｒofile１00、光面:shiny sidｅ１０1、粗糙面：matte siｄe１０2、处理面:trｅatｅｄｓｉdｅ1０３、防锈处理:staｉn proofｉng１0４、双面处理铜箔：double trｅateｄfoｉl四、设计1、原理图:shｅｍａtiｃｄｉaｇｒaｍ２、逻辑图：loｇｉc diagrａｍ３、印制线路布设：prinｔed wire ｌayｏut4、布设总图:ｍastｅｒｄrawing5、可制造性设计:ｄesign-ｆｏr-ｍanufacturａｂiｌity6、计算机辅助设计:computｅr-ａｉded desiｇn．（cad)7、计算机辅助制造:computer-aiｄed mａnufacｔuｒing.(cａm)８、计算机集成制造:computer ｉntegrａt manuｆactuｒinｇ．(cim）9、计算机辅助工程：coｍpuｔeｒ-aided engｉneｅｒing．(cae)10、计算机辅助测试：cｏmputｅr-aｉded test.（cat)11、电子设计自动化：eleｃtric ｄesign automatioｎ.(edａ)12、工程设计自动化:ｅｎginｅｅｒｉｎｇdeｓign aｕtｏｍaton .(eda２)13、组装设计自动化:ａssembｌy aidｅd arcｈitectural ｄesign.(aaaｄ)14、计算机辅助制图:coｍｐuter aｉdｅd drawing１５、计算机控制显示：compｕtｅｒcｏntｒolleｄｄisｐｌay .(ｃcd) １6、布局:placemenｔ１7、布线:ｒoｕｔing18、布图设计:layout１9、重布：reroｕting20、模拟:simulation21、逻辑模拟:logic ｓiｍuｌatiｏn22、电路模拟：cｉrciｔsｉmulation2３、时序模拟：timing simulatｉon２4、模块化:moduｌarｉzatｉon25、布线完成率:ｌａｙout ｅfｆeciｅncy26、机器描述格式:mａchｉne deｓcripｔionm fｏrmat .(ｍdｆ)27、机器描述格式数据库：mdf ｄａtabse２8、设计数据库:dｅｓign daｔabａｓe２9、设计原点：deｓｉgn origin30、优化（设计):optimization(ｄesｉgn)3１、供设计优化坐标轴：ｐredominaｎt aｘis32、表格原点:ｔaｂle origｉn33、镜像:mirｒｏrｉng３4、驱动文件:drｉve ｆiｌe35、中间文件:inｔｅrmedｉaｔeｆile36、制造文件:manｕfacｔurinｇdocumentatiｏn37、队列支撑数据库：queueｓuｐpｏrt ｄaｔaｂasｅ38、元件安置：coｍponenｔｐositioning39、图形显示:graｐhiｃs diｓpalｙ40、比例因子：ｓｃaling factoｒ４１、扫描填充:scａｎfilｌｉng４2、矩形填充:ｒecｔａnglｅfilling４３、填充域:region ｆilliｎｇ4４、实体设计：ｐhysiｃaｌdesign４5、逻辑设计:logｉc dｅｓｉgn4６、逻辑电路：ｌogic circuit4７、层次设计:hieｒarｃhｉcal ｄｅsign4８、自顶向下设计：top－dｏwn dｅsiｇn49、自底向上设计：bottom-ｕp desiｇn5０、线网：neｔ51、数字化:ｄiｇiｔｚiｎg52、设计规则检查：design rule checｋing５3、走（布)线器:rouｔeｒ(cａd)54、网络表:netｌist５５、计算机辅助电路分析:cｏmputer-aideｄｃircuiｔanａlyｓiｓ５6、子线网：suｂｎet57、目标函数:objectｉvｅfunctiｏｎ58、设计后处理:pｏsｔdeｓign procｅsｓiｎg （pdｐ)59、交互式制图设计:ｉnｔerａｃtivｅdrａwing desｉgn6０、费用矩阵:cｏsｔmetrix61、工程图：enginｅering dｒａwing62、方块框图：blocｋdiagram６3、迷宫:ｍozｅ６4、元件密度：compｏｎentｄｅnｓitｙ６5、巡回售货员问题：tｒaveliｎｇsalesｍan ｐｒobｌem６6、自由度:degrees fｒeｅdｏm67、入度:out goiｎｇdeｇree68、出度：incomｉng degree69、曼哈顿距离:ｍａｎhatton distanｃe70、欧几里德距离:ｅucliｄｅan ｄistance71、网络：network72、阵列:arｒaｙ73、段:segmｅnt74、逻辑:lｏgic７5、逻辑设计自动化：lｏｇic desigｎautomａtion76、分线:sepaｒaｔｅｄtｉme77、分层:ｓeparａｔed layｅr78、定顺序:dｅｆinite seｑｕｅnce五、形状与尺寸:１、导线(通道):ｃondｕctｉon（ｔraｃk)2、导线(体)宽度:cｏndｕｃtｏr widtｈ3、导线距离:cｏnｄuｃtor ｓpacing4、导线层:conductｏrｌayer5、导线宽度／间距：cｏnduｃtor linｅ/space6、第一导线层:coｎdｕctor ｌaｙｅr nｏ.1７、圆形盘：roｕnd paｄ８、方形盘:squarｅpad9、菱形盘：dｉamｏnd pad10、长方形焊盘：ｏbｌonｇｐａd１1、子弹形盘：buｌleｔpａｄ12、泪滴盘:tearｄrop pａd１3、雪人盘:snoｗmａｎpａｄ１４、v形盘：v-shaｐｅd pad１5、环形盘：anｎｕｌａr paｄ1６、非圆形盘：noｎ-ｃｉrcuｌａr pad17、隔离盘：ｉsolaｔion ｐaｄ18、非功能连接盘：ｍｏnｆunctｉoｎａｌpad１9、偏置连接盘：ofｆｓｅt ｌａnd20、腹（背)裸盘:back－baｒd land21、盘址:aｎｃｈoring spauｒ２２、连接盘图形：lanｄpatｔern23、连接盘网格阵列:land grid array24、孔环:ａnnulaｒrｉnｇ2５、元件孔:component hｏｌe26、安装孔：ｍounting hole2７、支撑孔:sｕppｏｒted ｈoｌe2８、非支撑孔:unsupporteｄhｏle29、导通孔:ｖia３0、镀通孔：platｅｄｔｈrough ｈole （pｔh)31、余隙孔：ａｃcess hole３2、盲孔：blindｖiａ(ｈoｌｅ）3３、埋孔:bｕriｅｄvia hole3４、埋／盲孔:buried /blind via3５、任意层内部导通孔:ａny laｙer innｅｒviａhole（aliｖh）3６、全部钻孔:all driｌled hoｌｅ３7、定位孔:toalｉnｇhoｌｅ3８、无连接盘孔：lanｄleｓs hｏle３９、中间孔:intersｔitｉal hoｌe4０、无连接盘导通孔:lａndlｅss viａhｏｌe41、引导孔：pilot ｈｏｌe4２、端接全隙孔:teｒminａl cleaｒｏmee holｅ43、准表面间镀覆孔:ｑuａｓi-ｉｎterfacｉng pｌated-tｈroｕgｈｈolｅ44、准尺寸孔：dimeｎｓioｎeｄhole45、在连接盘中导通孔：via-in-pad46、孔位：holeｌoｃatｉon47、孔密度：hoｌeｄensｉty48、孔图:hole pattern49、钻孔图：driｌl draｗing50、装配图:ａssemｂly drawinｇ5１、印制板组装图：ｐrinｔed board assembly drａｗｉng５2、参考基准:datum referaｎce电路板术语总整理＊**＊*A*****Ａｂiｅtic Acｉd松脂酸.Abrasiｏn Resistａnce耐磨性.Ａbrａｓives磨料，刷材.ＡBS树脂.Aｂsｏrｐtiｏn吸收(入）.Ac Ｉmｐeｄaｎce交流阻抗.Accelerated Teｓｔ(Ａging)加速老化(试验).Accelerａtioｎ速化反应.Acceｌｅｒator 加速剂,速化剂.Aｃceｐtabilitｙ,Acceptanｃe 允收性，允收.Ａccess Hｏlｅ露出孔，穿露孔．Accuracｙ准确度.Acid Ｎumber(AciｄVａlue)酸值.Ａcｏusｔic Micrｏscoｐｅ(AM)感音成像显微镜．Acrｙｌic压克力（聚丙烯酸树脂).Actinic Lｉght (oｒIｎtensｉｔy，oｒRaｄiation)有效光. Acｔivation活化.Actｉｖator活化剂．AcｔｉvｅCarbon活性炭.ＡctivｅParts(Dｅvices)主动零件.Acuｔance解像锐利度.Adｄitiｏn Ａgeｎｔ添加剂.Addｉｔive Prｏcｅｓｓ加成法.Adhesion附着力．Ａdhｅsion Pｒomｏｔｏr附着力促进剂.Aｄhesiｖｅ胶类或接着剂．Admｉttａncｅ导纳(阻抗的倒数).Aerosol喷雾剂,气熔胶,气悬体.Ａgiｎg老化.Air Inｃｌuｓｉon气泡夹杂.Ａir Ｋnifｅ风刀．Aｌｇｏriｔhm算法.Alipｈatic Soｌvent脂肪族溶剂．AluｍiniuｍNitridｅ(AlN)氮化铝.Ａmbient Ｔａmp环境温度.Amorphｏus无定形,非晶形.Aｍp-Hｏｕr安培小时.Aｎalｏg Cirｃuit／Anａlｏg Sｉｇnal模拟电路/模拟讯号．Anchoring Spｕrs着力爪.Angle of Contack接触角.Ａngle of Attack攻角.Aｎiｏn阴离子.Anisotrｏpiｃ异向性,单向的．Ａnnｅal韧化(退火）．AnｎulaｒRiｎg孔环．Ａｎodｅ阳极．Anode Ｓludgｅ阳极泥.Anｏdizing阳极化．ANSI美国标准协会.Anｔi-Ｆｏaming Agent消泡剂.Anｔi-ｐｉt Agｅnt抗凹剂．AOＩ自动光学检验．Apｅrtuｒes开口，钢版开口．AQL品质允收水准.AQL(Accｅpｔable QualitｙLeｖel）允收品质水准.Ａramid Fｉber聚醯胺纤维．Ａrc Ｒeｓistance耐电弧性.Array排列．Aｒtworｋ底片.AＳIC特定用途绩体电路器．AspｅcｔRatiｏ纵横比.Assembly组装装配.A－stage A阶段.ATE自动电测设备．Aｔｔenuatioｎ讯号衰减.Autocｌaｖe压力锅.Axｉal-lead轴心引脚.Azeｏｔrｏpe共沸混合液．*****Ｂ*＊＊*＊BacｋLighｔ(Ｂack Ｌighting)背光法.BacｋＴａper反锥斜角.Bacｋpaneｌｓ，Backplａｎes支撑板.Bacｋ-up 垫板.Baｌａncｅd Trａnsｍisｓion Ｌｉｎes平衡式传输线.Ball GriｄAｒray球脚数组(封装).Bandabｉliｔy弯曲性.Bａnｋiｎg Agｅnｔ护岸剂.Bａｒe Ｃhip Assemblｙ裸体芯片组装.Ｂaｒrel孔壁,滚镀.Ｂase Maｔerｉaｌ基材．ＢasｉｃGriｄ基本方格．Baｔch批.Bａｕme波美度(凡液体比重比水重则Ｂe＝145-(145÷Ｓp.Ｇr）凡液体比重比水轻则Be=1４0÷(Ｓp.Ｇr-１３０)*Ｓp.Gｒ为比重即同体绩物质对"纯水"1g／ｃm的比值).Beam lead光芒式的平行密集引脚.Bｅｄ-oｆ－Nail Ｔesｔｉng针床测试.Bｅｌlｏws Conact弹片式接触.Bｅｔa Rａy Backscａtter贝他射线反弹散射.Bｅｖｅllｉnｇ切斜边．Biaｓ斜张纲布,斜纤法.Bｉ－LeveｌSｔeｎcil]双阶式钢板.Ｂindｅr粘结剂.Bits头(Ｄｒｉll Biｔｓ).Black Oxide黑氧化层．Blanｋiｎｇ冲空断开．Blｅack 漂洗.Bleeding溢流.ＢｌinｄＶｉa Ｈoｌe肓通孔.Bｌister局部性分层或起泡.Ｂｌock Diａgrａｍ电路系统块图.Blｏckout封纲．Ｂｌｏｔting干印.Bｌotting Papeｒ吸水纸.Bｌｏw Hole吹孔.Blue Ｐlaque蓝纹(锡面钝化层)．Blur Ｅｄge (Circle)模糊边带(圈)．ＢomｂＳiｇht弹标.BoｎｄＳtrｅｎgｔh结合强度.Ｂondabilitｙ结合性．Bｏnｄing Laｙｅr结合层接着层．Bｏnｄｉｎg Ｓhｅｅt(Layer)接合片.Bｏｎding Wirｅ结合线.Bow, Bｏｗinｇ板弯.Bｒaｉd编线.Bｒazing硬焊（用含银的铜锌合金焊条). 在425℃~８70℃下进行熔接的方式).BｒeaｋＰoint显像点.Break-away Panel可断开板．Bｒeakdｏwn V oltagｅ崩溃电压．Brｅak-ｏut破出．Ｂriｄginｇ搭桥.Bright Dｉp光泽浸渍处理.Bｒightenｅr光泽剂.Brｏwn Oxiｄｅ棕氧化.ＢrusｈPlaｔinｇ刷镀.Ｂ-ｓtagｅB阶段.BuiｌｄＵp Procｅｓs增层法制程．Ｂuilｄ-up堆积.Ｂulgｅ鼓起.Bｕｍｐ突块.Bumping Ｐroｃess凸块制程.Buｏｙancｙ浮力.Ｂuｒiｅd Via Hｏle埋导孔.Burｎ－in高温加速老化试验.Ｂurｎiｎg烧焦.Bｕrr毛头.Bus Ｂar汇电杆.Buｔｔer Coａｔ外表树脂层．**＊*＊C***＊*C4 Ｃhip JｏintC4芯片焊接.Cabｌe电缆.CＡD计算机辅助设计.ＣａlendｅｒeｄＦabrｉc轧平式纲布．CaｐLaminａｔioｎ帽式压合法．Caｐaｃiｔance电容.Capacｉtiｖe Couplｉｎg电容耦合.Caｐillary Aｃtion毛细作用.Carbｉde碳化物.CarｂoｎArc Ｌamp碳弧灯.CarboｎＴreａｔmeｎt, Active活化炭处理．Cａrd卡板.Card Cａｇes/Cａrd Racｋs电路板构装箱.Caｒｌson Pｉｎ卡氏定位稍.Carrier载体.Carｔｒｉdgｅ滤心.Castａllatiｏn堡型绩体电路器.Catalｙzed Ｂoarｄ, Ｃａｔalyzed Sｕbsｔｒatｅ催化板材. Ｃatalyｚing催化.Cathode阴极.Catｉon阴向离子, 阳离子.Caul Plａte隔板.Caｖitatｉｏn空泡化半真空.Cｅnter-tｏ-Center Ｓpacｉng中心间距.Ｃeramicｓ陶瓷.Ｃerｍeｔ陶金粉．Ｃertiｆｉcaｔｅ证明书．CFC氟氢碳化物.Ｃhaｍfer倒角．Cｈaracteｒisｔic Impedanｃｅ特性阻抗.Chase纲框.Cheｃk List检查清单．Chelatｅ螯合.Chemicａl Millｉnｇ化学研磨.Chemical Ｒｅｓｉsｔance抗化性．Chemisｏrption化学吸附.Chip芯片(粒).Chip Ｉntｅrconnecｔioｎ芯片互连.Chiｐon Bｏaｒd芯片粘着板．Chip On Glass晶玻接装(COG).Chｉsel钻针的尖部.Ｃhｌoriｎated Solveｎｔ含氯溶剂,氯化溶剂．CircumfeｒentｉaｌSepaｒation环状断孔.Clad／Ｃlaｄdiｎｇ披覆.Cｌeａn Ｒoom无尘室.Ｃleanliｎeｓs清洁度．Cｌearance余地,余环．CliｎcheｄLｅad Terminal紧箝式引脚.Cliｎched-wiｒe Ｔhｒough Conneｃtion通孔弯线连接法. Clip Terｍｉnaｌ绕线端接.Coaｔ, Ｃｏating皮膜表层.Cｏaxial Cable同轴缆线.Coeｆficieｎt of Tｈermａl Expaｎsion热膨胀系数．Ｃｏ－Firing共绕.Coｌd Flｏw冷流.ＣolｄＳoldeｒJoiｎt冷焊点.CｏｌｌｉｍaｔｅｄLiｇht平行光.Collｏid胶体.ColumnaｒStructurｅ柱状组织．Comb Ｐatteｒn梳型电路．Cｏｍｐlex Ioｎ错离子.Componｅnt Hoｌｅ零件孔.Ｃomponｅnt Orｉeｎｔation零件方向.Ｃomponeｎt Side组件面.Compoｓiｔｅs,(CEM－1,CEM－3)复合板材．ＣｏndensaｔioｎSolｄerｉng凝热焊接,液化放热焊接．Ｃonｄｉtioning整孔.Conducｔance导电.Ｃonｄuctive Salt导电盐．Cｏnｄｕcｔｉvｉty导电度.ConducｔoｒSpaciｎg导体间距.Coｎfｏｒmal Coaｔing贴护层.Cｏnfｏrmｉtｙ吻合性, 服贴性.Connector连接器．Contact Ａngle接触角.Conｔａｃt Arｅa接触区.Ｃontaｃt Ｒｅsistancｅ接触电阻．Continｕity连通性.Contrａｃt Service协力厂,分包厂.Ｃontｒoｌled Depth Drilliｎg定深钻孔.Cｏnveｒsion Coating 转化皮膜.Coplanａｒｉty共面性．Cｏpolyｍｅｒ共聚物.Cｏpper Foｉｌ铜皮.Coｐpｅr Mirｒor Tｅst铜镜试验.Copper Paste铜膏.Coｐper-Iｎvａr-Cｏppｅr (ＣIC）综合夹心板. Core Maｔeｒial内层板材,核材.Ｃorｎer Cｒacｋ通孔断角．Cｏrｎer Ｍaｒｋ板角标记.Ｃｏuｎterboｒing方型扩孔.Coｕntersiｎking锥型扩孔.CoupliｎｇＡｇeｎt 偶合剂.Coｕpoｎ, Ｔest Cｏupｏｎ板边试样.Coverｌaｙ／Coveｒｃｏat表护层.Cｒack裂痕.Ｃｒａzinｇ白斑.Crease皱折.Ｃreｅp潜变.ＣrossｅcｔioｎＡrea截面积.Croｓshａtch Ｔestiｎg十字割痕试验.Crossｈaｔｃhｉnｇ十字交叉区.Crosｓlｉnkｉng，Croｓｓliｎkage交联，架桥.Ｃrossover越交，搭交.Crosstａlｋ噪声, 串讯．Crｙstaｌline Meltｉng Poiｎｔ晶体熔点.C-Stage C阶段．Cure硬化，熟化．Currｅnt Deｎsiｔy电流密度.Current-Carryｉｎg Caｐabilｉty载流能力．ＣurtaｉnＣoating濂涂法.＊***＊D＊＊*＊*Daisy Ｃhaiｎed Desｉgｎ菊瓣设计.Dａtum Ｒefeｒｅnce基准参考．Dａｕghtｅr Ｂoard子板.Debriｓ碎屑,残材.Ｄeｂuｒring去毛头.Dｅｃｌｉｎatｉｏn Ａｎgｌｅ斜射角.Definiｔｉon边缘逼真度.Deｇrａdaｔion 劣化.Deｇrasiｎｇ脱脂.Deionｉzed Wａｔer去离子水.Dｅｌａｍinａｔｉｏn分离.DenｄritiｃGrｏwth 枝状生长.Ｄenier丹尼尔（是编织纺织所用各种纱类直径单位, 定义９000米纱束所具有的重量(以克米计))．Dｅnsiｔomer透光度计．Ｄent凹陷.Ｄepｏｓition 皮膜处理.Deｓｉccatoｒ干燥器.Deｓmｅaｒinｇ去胶渣.Deｓｏlderinｇ解焊.Ｄeｖeloper显像液,显像机．Deveｌopiｎg显像.Deviatiｏn偏差.Dｅｖice电子组件.Dewetｔing缩锡．Ｄ－glassD玻璃．Ｄiaze Fｉｌm偶氮棕片.Ｄｉｃhromａｔe重铬酸盐.Ｄｉcing芯片分割．Dicｙandiaｍｉde（Dicy)双氰胺．Die 冲模．Die Aｔtaｃｈ晶粒安装．Ｄie Bｏｎdiｎｇ晶粒接着．Die Staｍping冲压．Dielectrｉc 介质.Ｄielecｔric Ｂreakｄown Volｔage介质崩溃电压.Dieleｃtｒic Cｏｎstanｔ介质常数.Ｄieleｃtｒic Sｔｒengｔh介质强度.DifｆerｅntｉaｌScanniｎg Calorimetｒｙ(ＤSC)微差扫瞄热卡分析法. Difｆusion Laｙer扩散层.Digiｔizing数字化．Ｄihedｒａl Anｇle双反斜角.DiｍｅnsionaｌStability尺度安定性.Diodｅ二极管.DiｐCoａｔｉnｇ浸涂法.Ｄip Ｓｏlderiｎｇ浸焊法.DIP(Duａl Inline Package)双排脚封装体.Dipｏle偶极,双极.Ｄiｒｅct / IndirecｔＳtencil直接/间接版膜.DireｃｔEmulｓｉon直接乳胶．Dｉrｅct Pｌatｉng直接电镀.Diｓｃｒｅｔe Compenent散装零件.DiscretｅＷiｒing Boａrd散线电路板,复线板.DiｓｈDowｎ碟型下陷.Diｓｐersａnt分散剂.Disｓｉpaｔion Facｔor散失因素.Dｉssｐatｉｏn Ｆａｃtor散逸因子.Dｉsturbed Ｊｏiｎt受扰焊点.DocｔoｒＢlaｄe修平刀,刮平刀.Dog Ｅａr狗耳.Ｄopinｇ掺杂.DoｕbｌｅＬayer双电层.Doubｌe TrｅateｄFoｉl双面处理铜箔.Ｄrag In ／Dｒag Out带[进/带出.Dｒag Sｏｌderｉnｇ拖焊.Ｄｒawbridgiｎg吊桥效应．Drｉft漂移.Ｄrｉll Ｆaｃet钻尖切削面.DrilｌPoｉnter钻针重磨机.DrilｌeｄBlanｋ已钻孔的裸板.Drｏｓs浮渣.Ｄrｕm Side铜箔光面.ＤrｙFilｍ干膜.Ｄｕａl ＷａvｅＳoldｅriｎg 双波焊接.Ductilｉty展性．Dumｍy Land假焊垫.Ｄuｍｍｙ, Ｄumｍyｉng假镀(片)．Durometeｒ橡胶硬度计．DYCOsｔｒatｅ电浆蚀孔增层法.Dynamic Ｆleｘ(ＦＰC)动态软板.＊*＊**E＊***＊E-Beａm (EleｃtronＢeam)电子束.Eｄdy Curreｎt涡电流.Edge Ｓpacing板边空地．Ｅdge-Boａrd Conneｃtｏr板边(金手指)承接器.Ｅdge-Board Cｏｎtact板边金手指.Edge-Dip Solｄeraｂｉlity Tesｔ板边焊锡性测试.EDTA乙二胺四乙酸.Ｅｆflｕｅnt排放物．E-gｌass电子级玻璃.Eｌastomｅr弹性体.ＥlectｒicＳtrｅngth(耐)电性强度.Ｅlectrｏdeposiｔｉon电镀.Electro-deposition Pｈoｔｏｒesｉst电着光阻，电泳光阻. Electｒoｆorｍｉｎg电铸.Elｅcｔrｏlｅss－Deｐoｓｉtion无电镀.Eｌｅｃtrolytic TougｈＰiｔｃｈ电解铜..Eleｃtｒｏlyｔic－Cleａning电解清洗.Elｅctro-migrａtiｏｎ电迁移.Eleｃｔro-ｐhorｅsiｓ电泳动, 电渗．Electro-tiｎninｇ镀锡.Eleｃｔｒｏ-Winninｇ电解冶炼.Eloｎgaｔioｎ延伸性, 延伸率．Embossｉng凸出性压花.EMF(ＥlecｔromｏｔivｅForce）电动势.ＥＭI(Electｒｏmaｇnetic Inｔeｒfeｒeｎce)电磁干扰. Ｅmulｓｉｏn乳化.EｍｕｌsioｎSide药膜面.Ｅncapｓuｌaｔing胶囊.Ｅncrｏａｃhmｅnt沾污,侵犯.EnｄTａｐ封头.Eｎtek有机护铜处理.Entｒaｐmenｔ夹杂物.Entry Materiａl盖板.Epoｘy Ｒｅsin环氧树脂.Etch Fａcｔor蚀刻因子.Eｔｃhant蚀刻剂(液).Etchbａｃk回蚀.Etching Inｄicａtor蚀刻指针．Etchｉｎg Ｒesisｔ蚀刻阻剂．Eutetic Ｃomposition共融组成.Eｘotｈerm放热（曲线).Eｘposure曝光.Eyeleｔ铆眼.***＊＊F*＊*＊*Ｆａbｒic纲布.FaｃｅBonｄinｇ反面朝下结合.Failuｒe故障.Fan Out Wirinｇ/Ｆan In Wiriｎｇ扇出布线／扇入布线. Farad 法拉.Farａdy法拉第.FａｔigｕｅStrｅngth抗疲劳强度．Faｕｌt缺陷.Fａult Plane断层面.Ｆｅed ThroｕgｈＨolｅ导通孔.Feｅｄeｒ进料器.FibｅｒExｐｏｓure玻纤显露．Fiducial Mark基准记号.Fｉlamenｔ纤丝.Fｉll纬向.Fｉlｌer填充料.Fｉllet内圆填角．Ｆilm底片.Film Adｈesive接着膜，粘合膜.Ｆiｌter过滤器.Fiｎe Line细线.Ｆiｎe Pitch密脚距,密线距,密垫距.Finｅｎess粒度,纯度.Finger手指．Ｆinishing终修(饰).ＦiniteＥlｅmenｔMeｔhｏｄ有限要素分析法．Fiｒst Arｔicle首产品.First Pass-Yield初检良品率.Ｆixtuｒe夹具.Ｆlaｉｒ刃角变形．Flaｍe Pｏint自燃点.Flame Rｅｓｉstant耐燃性.FlａmｍａｂilｉtｙRate燃性等级.Flａｒe扇形崩口.FｌaｓｈＰｌating闪镀.Ｆlaｓhovｅr闪络．Flat Cablｅ扁平排线.Flat Pack扁平封装（之零件)．Flatneｓs平坦度.Ｆｌexible Printed Circｕit (FPC）软板.Flexｕral Faｉｌｕｒe挠曲损坏．Flｅxｕral Mｏduｌe弯曲模数, 抗挠性模数.Fｌeｘural Stｒengｔh抗挠强度．FlｉpＣhｉp覆晶，扣晶.Fｌｏｃcｕlatｉon絮凝．Flood Sｔroke Print覆墨冲程印刷.Flow Soｌdｅｒiｎg (WavｅSolｄering)流焊.Fluｏｒｅscencｅ荧光．FluｒocarｂoｎＲesｉn碳氟树脂.Ｆlush Conｄuctoｒ嵌入式线路, 贴平式导体. Flush Poｉnt闪火点.Ｆｌutｅ退屑槽.Fｌux助焊剂.Foｉl Burr铜箔毛边.Ｆoil Laｍination铜箔压板法.Foot残足(干膜残余物）.ＦooｔPrint(Ｌaｎd Ｐattｅrn)脚垫.Foreｉgn Matｅｒｉaｌ外来物,异物.Foｒm－ｔo-Ｌist布线说明清单.Foｕr PoｉnｔTwisting四点扭曲法.Free Radicaｌ自由基.Freｅboard干舷.Frequｅnｃy频率.Frit玻璃熔料．Fully－ＡddｉtivｅPｒocesｓ全加成法.ＦunｇuｓResｉstance抗霉性．Fused Coａting熔锡层.Ｆusing熔合.Fusing Fｌuid助熔液．*****G**＊**Ｇ-1０由连续玻纤所织成的玻纤布与环氧树脂粘结剂所复合成的材料．Gaｇe, Gauｇe量规.Ｇａllｉum Arsenide (GａAs)砷化镓.Ｇaｌｖａｎic Cｏrrosｉｏn贾凡尼式腐蚀(电解式腐蚀).ＧａlvaniｃＳerｉｅs贾凡尼次序(电动次序)．Ｇalｖaｎizinｇ镀锌.GAP第一面分离，长刃断开.Gａte Ａrraｙ闸列,闸极数组.Ｇel Tｉme胶化时间.Gelａtｉon Pａrｔiｃlｅ胶凝点.Gerｂer Datａ,Geｒbｅr File格博档案（是美商Gerber公司专为PＣB面线路图形与孔位,所发展一系列完整的软件档案).Ghoｓt Image阴影.Giｌding镀金(现为：GｌoｄPlating）.Ｇlａss Ｆibeｒ玻纤.Glass Fｉber Ｐrotrusion/Goｕging,Ｇroｏｖe玻纤突出／挖破.Gｌass Transｉtion Tempeｒature，Tg玻璃态转化温度.Ｇlaze釉面,釉料.Glob Top圆顶封装体.GloublｅＴeｓt球状测试法.Glyｃoｌ（Ethylｅｎe Ｇlycol)乙二醇.Goldｅn Board测试用标准板.GraiｎＳｉze结晶粒度.GraｓｓＬeak 大漏.Grid标准格．Grｏｕｎd Plane /Eａrｔh Plａne接地层.Ｇｒouｎd Plａne Ｃｌeaｒａnce接地空环．GuidｅＰin导针．Gｕll/Ｗing Leaｄ鸥翼引脚．****＊H**＊**Ｈalaｔiｏn环晕.Half Anglｅ半角.Halide卤化物.Halｏｉng白圈,白边.Haｌon海龙,是ＣFC"氟碳化物＂的一种商品名.Ｈard Aｎodｉzｉng硬阳极化．ＨarｄChrome Plａtinｇ镀硬铬．HaｒｄSｏlｄerｉｎg硬焊.Hardｅneｒ(CuringＡgeｎt）硬化剂(或Cuｒｉng Agent).Ｈardｎeｓs硬度．Hａｒing-BｌｕｍCeｌｌ海固槽.Ｈarness电缆组合.Hay Ｗire跳线．Heａt Cｌｅａniｎｇ烧洁.ＨeatＤisｓipation散热.Hｅat Disｔｏrtion Ｐｏｉnt (Temp)热变形点（温度)．HeaｔＳealing热封.HeatＳink Plane散热层.Heat Trａnｓfer Pａste导热膏．Heaｔsiｎk Ｔool散热工具.Ｈertｚ(Hz)赫.Hｉgh Efｆｉciency Pａrｔiｃuｌａte Air Fiｌter （HEPＡ)高效空气尘粒过泸机．Ｈｉpot Tesｔ高压电测.Ｈi-Rｅl高度靠度.Hｉt击（钻孔时钻针每一次"刺下"的动作).Holding Ｔime停置时间.Hoｌe Bｒｅakout孔位破出．Hoｌe Ｃｏunｔｅr数孔机．Hoｌe Density孔数密度.Hｏｌe Preｐaratｉoｎ通孔准备.Hole Puｌl Sｔrength孔壁强度.Hole Ｖoiｄ破洞.Hｏｏk切削刀缘外凸.Hｏt Air Lｅｖeｌling喷锡.Hot Ｂar Solｄerｉｎｇ热把焊接.Hot Gas Sｏldｅｒing热风手焊.HTE（HigｈTｅmperａｔureＥloｎｇation)高温延伸性.Hull Ｃell哈氏槽．HybrｉｄIｎtegｒated Ｃiｒcuｉｔ混成电路.HydrauliｃBulｇｅTｅｓｔ液压鼓起试验.HydrogeｎＥｍbrittｌｅmｅnt氢脆．HｙｄrogｅｎＯvervoltage氢过(超）电压.Hｙdｒolysis水解.Ｈydrophiｌiｃ亲水性.Hｙgroｓｃopｉｃ吸湿性.Hypersorption超吸咐.*＊＊**Ｉ＊＊*＊*I.C．Ｓoｃket绩体电路器插座.Iｃicｌe锡尖.Illｕｍinaｎce照度.Ｉmage Trａnsfeｒ影像转移.Immｅrsion Pｌａting浸镀．Ｉmpｅdancｅ阻抗.Imｐedance Matcｈ阻抗匹配.Impｒeｇnaｔe含浸.In-Cｉrcuit Tｅstｉnｇ组装板电测．Iｎcｌusｉoｎ异物,夹杂物．IｎdeｘｉnｇHole基准孔．Inｄｕcｔance(Ｌ）电感.Infrａred(IR)红外线.Inｐut／Outpuｔ输入/输出.Insｅｒｔ, Inseｒｔioｎ插接.InspectiｏｎOverlay套检底片.InsulａtionＲeｓistａnce绝缘电阻.Integrated Cｉrｃuit(ＩC)绩体电路器.Ｉnter Fａce接口.Iｎterconneｃｔion互连.ＩntｅrmetaｌｌiｃCompｏｕnd（IMC)接口共化物.Internａl Strｅｓs内应力.Iｎtｅｒｐoseｒ互边导电物．Interstitial Vｉa-Hｏｌe(IVＨ)局部层间导通孔.Ｉnvar殷钢(63.8%Ｆｅ,36％Ni，0．２%Ｃ).Ion Ｃleaｎlineｓs离子清洁度.IoｎＥxchａngｅＲesiｎs离子交换树脂.Iｏn Migｒatiｏn离子迁移.Ｉｏnｉzaｂlｅ（Ｉonｉｃ) Cｏnｔaiminａｔioｎ离子性污染.Ionｉｚation游离,电离.IoｎizatｉoｎV oltage (Coｒoｎa Leveｌ）电离化电压（电缆内部狭缝空气中,引起其电离所施加之最小电压).IPＣ美国印刷电路板协会.Iｓolａtion隔离性,隔绝性.＊*＊**J＊****JEDEC(Ｊoｉnt EｌｅｃtｒｏｎicＤevice 联合电子组件工程委员会.ＥngｉnｅerｉnｇCoｕnｃiｌ）J-ＬｅadＪ型接脚.Jｏb Sｈop专业工厂.Joｕｌe焦耳.ＪumｐｅrＷire跳线.Juｎctｉon接(合)面，接头.Just-In-Ｔiｍe（ＪＩT)适时供应,及时出现.*****K**＊**Kａpｔｏn聚亚醯胺软板.Kａrat克拉（1克拉(钻石）=0.２g 纯金则２４ｋ金为10０%的钝金.Kauｒi-Butanol Ｖalue考立丁醇值(简称K.B.值).Keｒf．切形，裁剪.Keｖｌar聚醯胺纤维.Key电键Ｋey Boaｒd键盘.Ｋiss Ｐresｓure吻压,低压.Knoｏp Ｈardｎｅｓs努普硬度.Kｎown Ｇood Dｉe(KGD)已知之良好芯片.Koｖar科伐合金（Fe53％，Nｉ29％，Cｏ17%).Ｋｒａft Paper牛皮纸．*＊*＊＊L＊****Lamda Wave延伸平波.Lamiｎａr Flow平流.Lａminar Sｔｒucture片状结构.Ｌaminate Vｏid板材空洞.Ｌａｍiｎate(s)基板.Ｌaminaｔion V oiｄ压合空洞.Laminator压膜机.Ｌanｄ孔环焊垫,表面焊垫.Lanｄless Hｏｌe无环通孔．Lasｅr Diｒeｃt Imａｇing (LDI)雷射直接成像.LａseｒＭacｈinｇ雷射加工法．ＬaserＰhotoｇeneｒａtｏr（LPG）, Ｌａsｅr Pｈｏtｏｐlotｔer雷射曝光机. LaｓｅｒSoｌdｅｒing雷射焊接法.LaｙBack 刃角磨损.Lay Ｏｕｔ布线,布局.LaｙＵp叠合．Layｅr to LayerＳpacing层间距离Leａchiｎｇ焊散漂出,熔出．Lｅａd 引脚.Lead Ｆｒame脚架．LeaｄPitch脚距.Leakage Currｅnt漏电电流.Legｅnd文字标记.Lｅvelinｇ整平.Lifted Land孔环(焊垫）浮起.Ligand错离子附属体.Light Emiｔtｉng Diodes（LED)发光二极管.ＬiｇhｔIｎteｇraｔor光能累积器.LighｔＩnteｎsitｙ光强度.LimitinｇCurrｅnt Dｅｎsitｙ极限电流密度．Liquid Crysｔａl Disｐｌａy(ＬCD）液晶显示器.LiquiｄDｉelectrｉcs液态介质．Liquid PｈｏtoｉmagｉｂlｅSoldｅr Mask,（LPSM)液态感光防焊绿漆. Local Area Ｎｅtworｋ区域性网络．Logic 逻辑.Logic Ｃｉｒcuit 逻辑电路．Lｏss Ｆacｔor损失因素．ＬosｓTanｇent (TａｎδDK)损失正切.Ｌot Siｚe批量.Lumiｎaｎce发光强度.Lyopｈiliｃ亲水性胶体.*＊***M＊*＊**Macrｏ-ＴｈrowinｇPower巨观分布力.Mａｊor Deｆeｃt主要(严重）缺点.Major Weave Direction主要织向．Margin刃带(钻头尖部）.Ｍaｒkinｇ标记.Ｍask阻剂.Maｓs Ｆiｎｉsｈｉng大量整面(拋光).Ｍass Laｍinａtioｎ大型压板．Mass Tｒansport质量输送.ＭａsteｒDｒawing主图.Maｔ席(用于CEM-3(Composite Epｏｘy Mａterial)的复合材料.)Mａtte Side毛面(电镀铜皮(ＥD Fｏil）之粗糙面).Mｅaling泡点.MeaｎTimｅTｏFailｕre(MTTF)故障前可用之平均时数. Measliｎg白点.Mechａnｉcal Sｔｒetｃher机械式张网机.Mecｈaｎｉcal Warp机械式缠绕.Mｅchanｉsm机理.Membｒane Swiｔch薄膜开关.Mｅｎiscｏｇraph Test弧面状沾锡试验．Meｎiｓｃｕs弯月面.Mercｕry Vａpｅr Ｌamp汞气灯.Mesh Coｕnt纲目数.MetaｌHaliｄｅLamp 金属卤素灯.Metａllizatｉon金属化．MetallizeｄFａbrｉc金属化纲布．Miｃｅｌｌe微胞.ＭiｃｒoＷire Board微封线板．Miｃrｏ-ｅlｅctronios微电子.Microeｔｃhiｎg微蚀.Mｉcｒosecｔionｉng微切片法.Ｍｉcrostrip 微条.MiｃｒostripＬinｅ微条线,微带线.Microthrｏwiｎg Poｗｅr微分布力.Ｍｉcrｏwavｅ微波.Ｍiｇｒａtiｏn迁移．Ｍigｒatｉon Ratｅ迁移率.Mｉl英丝.Minimｕm Annular Riｎg孔环下限.Mｉnimum Electｒｉcal Sｐａcing电性间距下限.Minｏr WeａvｅDirｅction次要织向．Mｉsreｇistｒation 对不准度．Ｍixed Componｍt MoｕｎtiｎｇＴｅｃｈnoｌogｙ混合零件之组装技术．Moｄｅm调变及解调器.Mｏdｉｆicaｔion修改．Moduｌｅ模块.Moｄulus of Elａｓtｉcitｙ弹性系数．Moisture anｄＩnsulａtｉon Resisｔance Teｓｔ湿气与绝缘电阻试验. Mold Relｅａse脱模剂，离型剂．Mｏｌｅ摩尔.Monｏfilameｎｔ单丝.MoｔｈerＢoard主机板,母板．MouｌdeｄＣircuit模造立体电路机.Mounting Ｈole安装孔.Mounｔing Ｈole组装孔,机装孔.Mouse Bite鼠齿(蚀刻后线路边缘出现不规则缺口）.Mｕlti-Chip-Moｄuｌe（MCＭ)多芯片芯片模块．ＭｕltiｗirinｇＢoard (orＤiｓcｒete Wiring Board)复线板.*****N＊***＊N．Ｃ．数值控制.Naｉl Hｅad钉头.NeａrＩR近红外线.Negatｉve负片,钻尖的第一面外缘变窄.Ｎegatｉｖe Eｔcｈ-back反回蚀．Nｅｇａtiｖe Sｔｅncil负性感光膜.Negaｔivｅ－Aｃting Resist负性作用之阻剂.Nｅtｗork纲状元件．Newtoｎ牛顿.ＮewｔｏｎRｉng牛顿环.Newtｏnian Lｉquid牛顿流体．Nick缺口.N-MeｔhylＰyｒｒｏlidine(NMP）N-甲基四氢哔咯.NoblｅMetal Pａsｔe贵金属印膏.Node节点.Nｏｄｕle节瘤．Nomｅnclｅａｔurｅ标示文字符号．Nominal Cured Thickneｓｓ标示厚度.Noｎ-Ciｒｃular Laｎd非圆形孔环焊垫.Ｎon-ｆlａｍmablｅ非燃性.Non-ｗettｉｎg不沾锡.NoｒｍａlＣoｎｃentratiｏn （Stｒenｇth)标准浓度,当量浓度．Ｎｏrmａl Distribuｔioｎ常态分布.Ｎovｏlaｃ酯醛树脂.Nucleatioｎ，Nｕcleating核化.Ｎumerｉcal Ｃonｔｒol数值控制.Nyloｎ尼龙.***＊*Ｏ***＊＊Oｃｃlusioｎ吸藏.Off-Ｃontact架空.Ｏｆfseｔ第一面大小不均.OFHC(OxyｅｎFrｅe HｉghＣonｄuctｉvity）无氧高导电铜．Ohm欧姆.Oｉｌcａｎnｉng盖板弹动．ＯLB（Ｏuｔｅr LｅaｄBond)外引脚结合.Olｉgomｅr寡聚物.OmegaＭetｅr离子污染检测仪.OmeｇａWａｖe振荡波.Oｎ-ConｔacｔＰrintiｎｇ密贴式印刷．Ｏpａｑuer不透明剂,遮光剂．OpｅnＣｉrcuits断线．Oｐｔical Coｍpａrater光学对比器(光学放大器．)Optical Dｅnsiｔy光密度.Opｔｉcal Ｉnｓpeｃtiｏn光学检验.Opｔical Instrument光学仪器．ＯｒganiｃSolｄeraｂiliｔy Preservaｔivｅs (OＳP)有机保焊剂. Osmｏsiｓ渗透.Ｏｕtgaｓｓing出气,吹气.Ouｔgｒowｔｈ悬出,横出,侧出.Outpｕｔ产出,输出.Overflow溢流.Overhaｎg总悬空.Ｏveｒlａp钻尖点分离.Ovｅrpotantial（Over voｌtage）过电位，过电压.Oｘiｄatioｎ氧化.Oxｙgen Iｎhibiｔor氧化抑制剂．OzonｅDepletion臭氧层耗损．*****P*****Ｐaｃkagiｎg封装,构装.Pad焊垫,圆垫．ＰaｄMaster圆垫底片.PaｄsＯnly Bｏaｒｄ唯垫板.Ｐallａｄium钯.Paｎeｌ制程板．PanelＰｌａｔinｇ全板镀铜.Pａnel Ｐroceｓs全板电镀法.。

PCB专业用语-英汉对照：一、综合词汇:1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board 10、单面印制板：single-sided printed board(ssb) 11、双面印制板：double-sided printed board(dsb) 12、多层印制板：mulitlayer printed board(mlb) 13、多层印制电路板：mulitlayer printed circuit board 14、多层印制线路板：mulitlayer prited wiring board 15、刚性印制板：rigid printed board 16、刚性单面印制板：rigid single-sided printed borad 17、刚性双面印制板：rigid double-sided printed borad 18、刚性多层印制板：rigid multilayer printed board 19、挠性多层印制板：flexible multilayer printed board 20、挠性印制板：flexible printed board 21、挠性单面印制板：flexible single-sided printed board 22、挠性双面印制板：flexible double-sided printed board 23、挠性印制电路：flexible printed circuit (fpc) 24、挠性印制线路：flexible printed wiring 25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed 27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board 28、齐平印制板：flush printed board 29、金属芯印制板：metal core printed board 30、金属基印制板：metal base printed board 31、多重布线印制板：mulit-wiring printed board 32、陶瓷印制板：ceramic substrate printed board 33、导电胶印制板：electroconductive paste printed board 34、模塑电路板：molded circuit board 35、模压印制板：stamped printed wiring board 36、顺序层压多层印制板：sequentially-laminated mulitlayer 37、散线印制板：discrete wiring board 38、微线印制板：micro wire board 39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (bum)41、积层挠印制板：build-up flexible printed board 42、表面层合电路板：surface laminar circuit (slc) 43、埋入凸块连印制板：b2it printed board 44、多层膜基板：multi-layered film substrate(mfs) 45、层间全内导通多层印制板：alivh multilayer printed board 46、载芯片板：chip on board (cob) 47、埋电阻板：buried resistance board 48、母板：mother board 49、子板：daughter board 50、背板：backplane 51、裸板：bare board 52、键盘板夹心板：copper-invar-copper board 53、动态挠性板：dynamic flex board 54、静态挠性板：static flex board 55、可断拼板：break-away planel 56、电缆：cable 57、挠性扁平电缆：flexible flat cable (ffc) 58、薄膜开关：membrane switch 59、混合电路：hybrid circuit 60、厚膜：thick film 61、厚膜电路：thick film circuit 62、薄膜：thin film 63、薄膜混合电路：thin film hybrid circuit 64、互连：interconnection 65、导线：conductor trace line 66、齐平导线：flush conductor 67、传输线：transmission line 68、跨交：crossover 69、板边插头：edge-board contact 70、增强板：stiffener 71、基底：substrate 72、基板面：real estate 73、导线面：conductor side 74、元件面：component side 75、焊接面：solder side 76、印制：printing 77、网格：grid 78、图形：pattern 79、导电图形：conductive pattern 80、非导电图形：non-conductive pattern 81、字符：legend 82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-cladlaminate 7、复合层压板：composite laminate 8、薄层压板：thin laminate 9、金属芯覆铜箔层压板：metal core copper-clad laminate 10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material 13、预浸材料：prepreg 14、粘结片：bonding sheet 15、预浸粘结片：preimpregnated bonding sheer 16、环氧玻璃基板：epoxy glass substrate 17、加成法用层压板：laminate for additive process 18、预制内层覆箔板：mass lamination panel 19、内层芯板：core material 20、催化板材：catalyzed board ,coated catalyzed laminate 21、涂胶催化层压板：adhesive-coated catalyzed laminate 22、涂胶无催层压板：adhesive-coated uncatalyzed laminate 23、粘结层：bonding layer 24、粘结膜：film adhesive 25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film 26、无支撑胶粘剂膜：unsupported adhesive film 27、覆盖层：cover layer (cover lay) 28、增强板材：stiffener material 29、铜箔面：copper-clad surface 30、去铜箔面：foil removal surface 31、层压板面：unclad laminate surface 32、基膜面：base film surface 33、胶粘剂面：adhesive faec 34、原始光洁面：plate finish 35、粗面：matt finish 36、纵向：length wise direction 37、模向：cross wise direction 38、剪切板：cut to size panel 39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl) 40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl) 41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates 42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates 43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates 44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates 45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates 46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates 47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates 48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates 49、超薄型层压板：ultra thin laminate 50、陶瓷基覆铜箔板：ceramics base copper-clad laminates 51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材的材料:1、 a阶树脂：a-stage resin2、 b阶树脂：b-stage resin3、 c阶树脂：c-stage resin 4、环氧树脂：epoxy resin 5、酚醛树脂：phenolic resin 6、聚酯树脂：polyester resin 7、聚酰亚胺树脂：polyimide resin 8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin 9、丙烯酸树脂：acrylic resin 10、三聚氰胺甲醛树脂：melamine formaldehyde resin 11、多官能环氧树脂：polyfunctional epoxy resin 12、溴化环氧树脂：brominated epoxy resin 13、环氧酚醛：epoxy novolac 14、氟树脂：fluroresin 15、硅树脂：silicone resin 16、硅烷：silane 17、聚合物：polymer 18、无定形聚合物：amorphous polymer 19、结晶现象：crystalline polamer 20、双晶现象：dimorphism 21、共聚物：copolymer 22、合成树脂：synthetic 23、热固性树脂：thermosetting resin 24、热塑性树脂：thermoplastic resin 25、感光性树脂：photosensitive resin 26、环氧当量：weight per epoxy equivalent (wpe) 27、环氧值：epoxy value 28、双氰胺：dicyandiamide 29、粘结剂：binder 30、胶粘剂：adesive 31、固化剂：curing agent 32、阻燃剂：flame retardant 33、遮光剂：opaquer 34、增塑剂：plasticizers 35、不饱和聚酯：unsatuiated polyester 36、聚酯薄膜：polyester 37、聚酰亚胺薄膜：polyimide film (pi) 38、聚四氟乙烯：polytetrafluoetylene (ptfe) 39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep) 40、增强材料：reinforcing material 41、玻璃纤维：glass fiber 42、 e玻璃纤维：e-glass fibre 43、 d玻璃纤维：d-glass fibre 44、 s玻璃纤维：s-glass fibre 45、玻璃布：glass fabric 46、非织布：non-woven fabric 47、玻璃纤维垫：glass mats 48、纱线：yarn 49、单丝：filament 50、绞股：strand 51、纬纱：weft yarn 52、经纱：warp yarn 53、但尼尔：denier 54、经向：warp-wise 55、纬向：weft-wise, filling-wise 56、织物经纬密度：thread count 57、织物组织：weave structure 58、平纹组织：plain structure 59、坏布：grey fabric 60、稀松织物：woven scrim 61、弓纬：bow of weave 62、断经：end missing 63、缺纬：mis-picks 64、纬斜：bias 65、折痕：crease 66、云织：waviness 67、鱼眼：fish eye 68、毛圈长：feather length 69、厚薄段：mark 70、裂缝：split 71、捻度：twist of yarn 72、浸润剂含量：size content 73、浸润剂残留量：size residue 74、处理剂含量：finish level 75、浸润剂：size 76、偶联剂：couplint agent 77、处理织物：finished fabric 78、聚酰胺纤维：polyarmide fiber 79、聚酯纤维非织布：non-woven polyester fabric 80、浸渍绝缘纵纸：impregnating insulation paper 81、聚芳酰胺纤维纸：aromatic polyamide paper 82、断裂长：breaking length 83、吸水高度：height of capillary rise 84、湿强度保留率：wet strength retention 85、白度：whitenness 86、陶瓷：ceramics 87、导电箔：conductive foil 88、铜箔：copper foil 89、电解铜箔：electrodeposited copper foil (ed copper foil) 90、压延铜箔：rolled copper foil 91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil)93、薄铜箔：thin copper foil 94、涂胶铜箔：adhesive coated foil 95、涂胶脂铜箔：resin coated copper foil (rcc) 96、复合金属箔：composite metallic material 97、载体箔：carrier foil 98、殷瓦：invar 99、箔（剖面）轮廓：foil profile 100、光面：shiny side 101、粗糙面：matte side 102、处理面：treated side 103、防锈处理：stain proofing 104、双面处理铜箔：double treated foil四、设计:1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae) 10、计算机辅助测试：computer-aided test.(cat) 11、电子设计自动化：electric design automation .(eda) 12、工程设计自动化：engineering designautomaton .(eda2) 13、组装设计自动化：assembly aided architectural design. (aaad) 14、计算机辅助制图：computer aided drawing 15、计算机控制显示：computer controlled display .(ccd) 16、布局：placement 17、布线：routing 18、布图设计：layout 19、重布：rerouting 20、模拟：simulation 21、逻辑模拟：logic simulation 22、电路模拟：circit simulation 23、时序模拟：timing simulation 24、模块化：modularization 25、布线完成率：layout effeciency 26、机器描述格式：machine descriptionm format .(mdf) 27、机器描述格式数据库：mdf databse 28、设计数据库：design database 29、设计原点：design origin 30、优化（设计）：optimization (design) 31、供设计优化坐标轴：predominant axis 32、表格原点：table origin 33、镜像：mirroring 34、驱动文件：drive file 35、中间文件：intermediate file 36、制造文件：manufacturing documentation 37、队列支撑数据库：queue support database 38、元件安置：component positioning 39、图形显示：graphics dispaly 40、比例因子：scaling factor 41、扫描填充：scan filling 42、矩形填充：rectangle filling 43、填充域：region filling 44、实体设计：physical design 45、逻辑设计：logic design 46、逻辑电路：logic circuit 47、层次设计：hierarchical design 48、自顶向下设计：top-down design 49、自底向上设计：bottom-up design 50、线网：net 51、数字化：digitzing 52、设计规则检查：design rulechecking 53、走（布）线器：router (cad) 54、网络表：net list 55、计算机辅助电路分析：computer-aided circuit analysis 56、子线网：subnet 57、目标函数：objective function 58、设计后处理：post design processing (pdp) 59、交互式制图设计：interactive drawing design 60、费用矩阵：cost metrix 61、工程图：engineering drawing 62、方块框图：block diagram 63、迷宫：moze 64、元件密度：component density 65、巡回售货员问题：traveling salesman problem 66、自由度：degrees freedom 67、入度：out going degree 68、出度：incoming degree 69、曼哈顿距离：manhatton distance 70、欧几里德距离：euclidean distance 71、网络：network 72、阵列：array 73、段：segment 74、逻辑：logic 75、逻辑设计自动化：logic design automation 76、分线：separated time 77、分层：separated layer 78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no.1 7、圆形盘：round pad 8、方形盘：square pad 9、菱形盘：diamond pad 10、长方形焊盘：oblong pad 11、子弹形盘：bullet pad 12、泪滴盘：teardrop pad 13、雪人盘：snowman pad 14、 v形盘：v-shaped pad 15、环形盘：annular pad 16、非圆形盘：non-circular pad 17、隔离盘：isolation pad 18、非功能连接盘：monfunctional pad 19、偏置连接盘：offset land 20、腹（背）裸盘：back-bard land 21、盘址：anchoring spaur 22、连接盘图形：land pattern 23、连接盘网格阵列：land grid array 24、孔环：annular ring 25、元件孔：component hole 26、安装孔：mounting hole 27、支撑孔：supported hole 28、非支撑孔：unsupported hole 29、导通孔：via 30、镀通孔：plated through hole (pth) 31、余隙孔：access hole 32、盲孔：blind via (hole) 33、埋孔：buried via hole 34、埋/盲孔：buried /blind via 35、任意层内部导通孔：any layer inner via hole (alivh) 36、全部钻孔：all drilled hole 37、定位孔：toaling hole 38、无连接盘孔：landless hole 39、中间孔：interstitial hole 40、无连接盘导通孔：landless via hole 41、引导孔：pilot hole 42、端接全隙孔：terminal clearomee hole 43、准表面间镀覆孔：quasi-interfacing plated-through hole 44、准尺寸孔：dimensioned hole 45、在连接盘中导通孔：via-in-pad 46、孔位：hole location 47、孔密度：hole density 48、孔图：hole pattern 49、钻孔图：drill drawing 50、装配图：assembly drawing 51、印制板组装图：printed board assembly drawing 52、参考基准：datum referance。

PCB行业专业词汇大全—马建整理* Process Module 说明:A. 下料( Cut Lamination)a-1 裁板( Sheets Cutting)a-2 原物料发料(Panel)(Shear material to Size)B. 钻孔(Drilling)b-1 内钻(Inner Layer Drilling )b-2 一次孔(Outer Layer Drilling )b-3 二次孔(2nd Drilling)b-4 雷射钻孔(Laser Drilling )(Laser Ablation )b-5 盲(埋)孔钻孔(Blind & Buried Hole Drilling)C. 乾膜制程( Photo Process(D/F))c-1 前处理(Pretreatment)c-2 压膜(Dry Film Lamination)c-3 曝光(Exposure)c-4 显影(Developing)c-5 蚀铜(Etching)c-6 去膜(Stripping)c-7 初检( Touch-up)c-8 化学前处理,化学研磨( Chemical Milling )c-9 选择性浸金压膜(Selective Gold Dry Film Lamination)c-10 显影(Developing )c-11 去膜(Stripping )D. 压合Laminationd-1 黑化(Black Oxide Treatment)d-2 微蚀(Microetching) d-3 铆钉组合(eyelet )d-4 叠板(Lay up)d-5 压合(Lamination)d-6 後处理(Post Treatment)d-7 黑氧化( Black Oxide Removal )d-8 铣靶(spot face)d-9 去溢胶(resin flush removal)E. 减铜(Copper Reduction)e-1 薄化铜(Copper Reduction)F. 电镀(Horizontal Electrolytic Plating)f-1 水平电镀(Horizontal Electro-Plating) (Panel Plating) f-2 锡铅电镀( Tin-Lead Plating ) (Pattern Plating)f-3 低於1 mil ( Less than 1 mil Thickness )f-4 高於1 mil ( More than 1 mil Thickness)f-5 砂带研磨(Belt Sanding)f-6 剥锡铅( Tin-Lead Stripping)f-7 微切片( Microsection)G. 塞孔(Plug Hole)g-1 印刷( Ink Print )g-2 预烤(Precure)g-3 表面刷磨(Scrub)g-4 後烘烤(Postcure)H. 防焊(绿漆): (Solder Mask)h-1 C面印刷(Printing Top Side)h-2 S面印刷(Printing Bottom Side)h-3 静电喷涂(Spray Coating)h-4 前处理(Pretreatment)h-5 预烤(Precure)h-6 曝光(Exposure)h-7 显影(Develop)h-8 後烘烤(Postcure)h-9 UV烘烤(UV Cure)h-10 文字印刷( Printing of Legend )h-11 喷砂( Pumice)(Wet Blasting)h-12 印可剥离防焊(Peelable Solder Mask)I . 镀金Gold platingi-1 金手指镀镍金( Gold Finger )i-2 电镀软金(Soft Ni/Au Plating)i-3 浸镍金( Immersion Ni/Au) (Electroless Ni/Au)J. 喷锡(Hot Air Solder Leveling)j-1 水平喷锡(Horizontal Hot Air Solder Leveling)j-2 垂直喷锡( Vertical Hot Air Solder Leveling)j-3 超级焊锡(Super Solder )j-4. 印焊锡突点(Solder Bump)K. 成型(Profile)(Form)k-1 捞型(N/C Routing ) (Milling)k-2 模具冲(Punch)k-3 板面清洗烘烤(Cleaning & Backing)k-4 V型槽( V-Cut)(V-Scoring)k-5 金手指斜边( Beveling of G/F)L. 短断路测试(Electrical Testing) (Continuity & Insulation Testing)l-1 AOI 光学检查( AOI Inspection)l-2 VRS 目检(Verified & Repaired)l-3 泛用型治具测试(Universal Tester)l-4 专用治具测试(Dedicated Tester)l-5 飞针测试(Flying Probe)M. 终检( Final Visual Inspection)m-1 压板翘( Warpage Remove)m-2 X-OUT 印刷(X-Out Marking)m-3 包装及出货(Packing & shipping)m-4 目检( Visual Inspection)m-5 清洗及烘烤( Final Clean & Baking)m-6 护铜剂(ENTEK Cu-106A)(OSP)m-7 离子残余量测试(Ionic Contamination Test )(Cleanliness Test)m-8 冷热冲击试验(Thermal cycling Testing)m-9 焊锡性试验( Solderability Testing )N. 雷射钻孔(Laser Ablation)N-1 雷射钻Tooling孔(Laser ablation Tooling Hole)N-2 雷射曝光对位孔(Laser Ablation Registration Hole)N-3 雷射Mask制作(Laser Mask)N-4 雷射钻孔(Laser Ablation)N-5 AOI 检查及VRS ( AOI Inspection & Verified & Repaired)N-6 Blaser AOI (after Desmear and Microetching)N-7 除胶渣(Desmear)N-8 微蚀(Microetching )A/W (artwork) 底片Ablation 烧溶(laser),切除abrade 粗化abrasion resistance 耐磨性absorption 吸收ACC ( accept ) 允收accelerated corrosion test 加速腐蚀accelerated test 加速试验acceleration 速化反应accelerator 加速剂acceptable 允收activator 活化液active work in process 实际在制品adhesion 附着力adhesive method 黏着法air inclusion 气泡air knife 风刀amorphous change 不定形的改变amount 总量amylnitrite 硝基戊烷analyzer 分析仪anneal 回火annular ring 环状垫圈;孔环anode slime (sludge) 阳极泥anodizing 阳极处理AOI ( automatic optical inspection ) 自动光学检测applicable documents 引用之文件AQL sampling 允收水准抽样aqueous photoresist 液态光阻aspect ratio 纵横比(厚宽比) As received 到货时back lighting 背光back-up 垫板banked work in process 预留在制品base material 基材baseline performance 基准绩效batch 批beta backscattering 贝他射线照射法beveling 切斜边;斜边biaxial deformation 二方向之变形black-oxide 黑化blank controller 空白对照组blank panel 空板blanking 挖空blip 弹开blister 气泡;起泡blistering 气泡blow hole 吹孔board-thickness error 板厚错误bonding plies 黏结层bow ; bowing 板弯break out 从平环内破出bridging 搭桥;桥接BTO (Build To Order) 接单生产burning 烧焦burr 毛边(毛头) camcorder 一体型摄录放机carbide 碳化物carlson pin 定位梢carrier 载运剂catalyzing 催化catholic sputtering 阴极溅射法caul plate 隔板;钢板calibration system requirements 校验系统之各种要求center beam method 中心光束法central projection 集中式投射线certification 认证chamfer 倒角(金手指) chamfering 切斜边;倒角characteristic impedance 特性阻抗charge transfer overpotential 电量传递过电压chase 网框checkboard 棋盘chelator 蟹和剂chemical bond 化学键chemical vapor deposition 化学蒸着镀circumferential void 圆周性之孔破clad metal 包夹金属clean room 无尘室clearance 间隙coat 镀外表coating error 防焊覆盖错误coefficient of thermal expansion (CTE) 热澎胀系数cold solder joint 冷焊点cold-weld 金属粉末冷焊color 颜色color error 颜色错误compensation 补偿competitive performance 竞争力绩效complex salt 错化物complexor 错化物component hole 零件孔component side 零件面concentric 同心conformance 密贴性consumer products 消费性产品contact resistance 接触电阻continuous performance 连续发挥效能contract service 协力厂controlled split 均裂式conventional flow 乱流方式conventional tensile test 传统张力测试法conversion coating 转化层convex 突出coordinate list 资料清单copper claded laminates (CCL) 铜箔基板copper exposure 线路露铜copper mirror 镜铜copper pad 铜箔圆配copper residue (copper splash) 铜渣corrosion rate numbering 腐蚀速率计数系统corrosion resistance 抗蚀性coulombs law 库伦定律countersink 喇叭孔coupon 试样coupon location 试样点covering power 遮盖力CPU 中央处理器crack 破裂;裂痕crazing 裂痕;白斑cross linking 交联聚合cross talk 呼应作用crosslinking 交联crystal collection 结晶收集curing 聚合体current efficiency 电流效率cut-outs 挖空cutting 裁板cyanide 氰化物cycles of learning 学习循环cycle-time reduction 交期缩短date code 周期deburring 去毛头dedicated 专用型degradation 退变delamination 分层dent / pin hole 凹陷/ 针孔department of defense 国防部designation 字码简示法de-smear 除胶渣developing 显影dewetting 缩锡dewetting time 缩锡时间dimension error 外形尺寸错误dielectric constant 介质常数difficulty 困难度difunctional 双功能dimension 尺寸dimension stability 尺寸安定性dimensional stability 尺度安定性dimension and tolerance 尺寸与公差dirty hole 孔内异物discolor hole 孔黑;孔灰;氧化discoloration 变色disposable eyelet method 消耗性铆钉法distortion factor 尺寸变形函数double side 双面板downtime 停机时间drill 钻孔drill bit 钻头drill facet 钻尖切萷面drill pointer 钻尖重(研)磨机drilled blank board 已钻孔之裸板drilling 钻孔dry film 乾膜ductility 延展性economy of scale 经济规模edge spacing 板边空地edge-board contact ( gold finger ) 金手指efficiency 能量效率electric test 电测electrical testing 电测;测试electrochemical machine ECM 电化学加工法electrochemical reactor 电化学反应器electroforming 电铸electroless plate 化学铜electroless-deposition 无电镀electropolishing 电解抛光electrorefining 电解精链electrowinning 电解萃取elliptical set 椭圆形embrittlement 脆性entitlement performance 可达成绩效entrapment 电镀夹杂物epoxy 环氧树酯equipotential 电位线error data file 异常情形etch rate 蚀铜速率etchants 蚀刻液etchback 回蚀evaluation program 评估用程式exposure 曝光external pin method 外部插梢法eyelet hole 铆钉孔Eyeletting 铆眼fabric 网布failure 故障fast response 快速回应fault 瑕庛;缺陷fiber exposure 纤维显露fiber protrusion 纤维突出fiducial mark 光学点,基准记号filler 填充料film 底片filtration 过滤finished board 成品fixing 固着fixture 电测夹具(治具) flaking off 粹离flammability rating 燃性等级flare 喇叭形孔flat cable 并排电缆feedback loop 回馈循环first-in-first-out (FIFO) 先进先出flexible manufacturing system (FMS) 弹性制造系统flux 助焊剂foil distortion 铜层变形fold 空泡foreign include 异物foreign material 基材内异物free radical chain polymerization 自由基连锁聚合fully additive 加成法fully annealed type 彻底回火轫化之类形function 函数fundamental and basic 基本fungus resistance 抗霉性funnel flange 喇叭形摺翼galvanized 加法尼化制程gap 钻尖分开gauge length 有效长度gel time 胶化时间general resist ink 一般阻剂油墨general 通论general industrial 一般性(电子)工业级geometrical levelling 几何平整glass transition temperature (Tg) 玻璃态转换温度Gold 金gold finger 金手指gold plating 镀金golden board 标准板gouges 刷磨凹沟gouging 挖破grain boundary 金属晶体之四边green 绿色grip 夹头ground plane 接地层ground plane clearance 接地空环hackers 骇客HAL ( hot air leveling ) 喷锡haloing 白边;白圈hardener 硬化剂hardness 硬度hepa filter 空气滤清器high performance industrial 高性能(电子)工业级high reliability 高可靠度high resolution 高解析度high temperature elongation (HTE) 高温延展性铜箔high temperature epoxy (HTE) 高温树酯hit 击hole counter 数孔机hole diameter 孔径hole diameter error 孔径错误hole location 孔位hole number 孔数hole wall quality 孔壁品质hook 外弧hot dip 热浸法hull cell 哈氏槽hybrid 混成积体电路hydrogen bonding 氢键hydrolysis 水解hydrometallurgy 湿法冶金法image analysis system 影像分析系统image transfer 影像转移immersion gold 浸金(化镍金) immersion plating 浸镀法impedance 阻抗infrared reflow 红外线重熔inhibitor 热聚合抑制剂injection mold 射模ink 油墨innerlayer & outlayer 内外层insulation resistance 绝缘电阻intended position 应该在的位置intensifier 增强器intensity 强度inter molecular exchange 交互改变interconnection 互相连通ionic contaminants 离子性污染物ionic contamination testing 离子污染试验IPA 异丙醇inspiration (启蒙) identification 确认计划目标implementation 改善方案information 数据internalization 制度化invisible inventory 无形的库存knife edges 刀缘Knoop 努普(硬度单位) kraft paper 牛皮纸laminar flow 层流laminate 基层板laminating 压合lamination 压合laminator 压膜机land 焊垫lay back 刃角磨损lay up 组合叠板layout 布线;布局lead screw 牵引螺丝leakage 漏电learning curve 学习曲线legend 文字标记leveling 平整levelling additive 平整剂levelling power 平整力life support 维系生命limiting current 极限电流line space 线距line width 线宽linear variable differential transformer(LVDL) 线性可变差动转换器liquid 液状(态) liquid crystal resins 液晶树脂liquid photoimageable solder resist ink 液态感光防焊油墨liquid photoresist ink 液态光阻剂油墨lot size 批量lower carrier 底部承载板mechanical plating 机祴镀法machine scrub 刷磨清洁法macrothrowing power 巨分布力margin 钻头刃带market share 市场占有率marking error 文字错误masked leveling 儰装平整mass lamination 大型压板mass transfer 质量传送效应mass transfer overpotential 质量传递过电压mass transportation 质传master drawing 主图;蓝图material use factor 材料使用率mealing 泡点;白点memory 记忆装置meniscograph solderability measurement 新月型焊锡效果microetch 微蚀microetching 微蚀microfocus 微焦距microfocus system 微焦距系统microprofile 微表面microsectioning 微切片法microthrowing power 微分布力migration 迁移mini-tensile tester 迷你拉力测试仪mis hole location 孔位错误misregistration 焊锡面与零件面对位偏差misregsitration 对不准moisture and insulation resistance test 湿气与绝缘电阻试验molded circuit board (MCB) 模制电路板monoethanal amine 单乙醇氨monohydrate state 水化物monomer 单分子膜;单体mouse bite 锯齿;蚀刻缺口msec 毫秒muffle furnace 高温焚火炉multichip 超大IC型(多晶片模组) mylar 保护膜nail head 钉头NC drill 数位钻孔机negative etchback 反回蚀negative film 负片negative rake angle 负抠耙角network 回路;网路neutralization 中和nick 缺口nickel 镍nodule 铜瘤;瘤粒no flow resin 不流树脂noise 杂讯nominal 标示nominal dimension 标定长度nominal gel time 标示胶性时间nominal resin content 标示胶含量nominal resin flow 标示胶流量nominal scaled flow thickness 标示比例流量厚度OA equip 办公室自动化设备obsolescence factor 报废因素OEM 原设备制造商offset-list 补偿数据清单ohmmeter 欧姆计open 断路open circuits 断路open short testing 断短路测试opening 开口original art work (A/W) 原稿底片Others 其它outgrowth 增出over design 牛刀杀鸡overlap 钻尖重叠overlay entry 盖板overpotential 过电压oxidation 氧化oxide treatment 黑化处理oxided cytochrome 氧化性之细包色素oxygen evolution 氧气发生反应packed bed 充填床式pad 锡垫;圆配pad copper exposure pad 露铜panel 小型板面;母板panel plating 一次铜电镀parasitic 寄生的part no. 料号pattern plating 二次铜电镀PCB ( print circuit board ) 印刷电路板pcs 片peel strength 抗撕强度peeling off 剥离(剥落) performance specification 性能规范permittivity 透电率perspectives on experience 经验透视PET 聚酯photodiode detector 发光二极体侦测器photo initiator 感光启始剂photoresist 光阻phototool 光具(指工作底片) piece 子板面pinceton applied research 腐蚀测定仪pink ring 粉红圈pit 凹点pitch 脚距planar 平面plating 电镀plating exposure 下镀层露出plug gauge 插规plug hole 孔塞PNL (panel) 排板polar-polar interaction 极性之间的吸力polyester 聚酯类polyglycols 聚乙二醇polyimide 聚亚醯氨poor bevelling 磨边加工引起突起,剥离poor drill 孔形不良poor HAL 喷锡不良poor marking 字体不良poor pad 锡垫不良poor printed 印刷偏差poor solderability 焊锡性不良poor touch-up 补线不良position control system 位置控制系统positive rake angle 正抠耙角power curve model 幕次曲线模式practice 工艺惯例preferred 良好premature tearing 提前撕裂prepolymer 预聚合物prepreg 胶片pre-process ( front-end) 制前press 压床press cycle 压合周期primary current distribution 一次电流分布primary 主要product lifetimes 生命周期product process 制程promoter 促进剂protocal 初步资料prussic acid 普鲁士酸PTF-based process 厚膜糊法PTH (plating though hole) 导通孔pull away 拉开pumice 浮石粉pumice scrub 喷砂清洁法pyrometallurgy 火烧法冶链QC ( quality control) 品管QFP (quad flat pack ) 扁方型封装体qualification inspection 资格审查检验qualification testing 资格检定quality classification 品质等级quantitative 计量式测试rack 挂架radiometer 能量剂rake angle 抠耙角RAM [Random Access Memory 随机存取记忆体real time 关键时刻recessed trace process 凹槽线路法recovery tank 回收槽reduction 还原re-eninforcement 强化refraction 折光率reinforcement style 补强材料的型式register mark 对位用标记registration hole 对位孔registration pattern 长方形铜地REJ ( reject ) 退货;拒收rejectable 拒收release agent 脱模剂relief angle 浮离角remark 备注repair 修理resin content 树脂含量(胶含量) resin flow 胶流量resin flow percentage 树脂流量之百分率resin recession 树脂下陷resin smear 胶渣resist strippers 剥乾膜剂resistor network 排列电阻resolution 解像度return on assets 资产报酬率reversibility 可逆性rework 重工rosin 天然松香rotating cylinder 旋转圆柱形roughtness 孔壁粗糙;粗慥routing 切外形,成型routing bit 铣刀runout 偏转S/L on hole 孔内沾文字S/M ( solder mask ), S/L 防焊文字S/M (solder mask) 防焊S/M error 防焊种类错误S/M on hole 孔内绿漆salt spray test 盐水喷雾试验sampling size 抽样数scope 范围scored 刻痕scoring 枢槽;刮线scrap 废框scratches 刮伤screen printing 网版印刷scum 透明残膜sealing 封孔处理secondary 次要semi-additive 半加成法sensitize 敏化sensitizer 敏化液separator 钢隔板sequential lamination 渐成式压法serrated edges 毛边shatter 破碎short 短路shunt 分路silane treatment 矽烷处理silicone coupling agent 矽烷偶合剂silk screen 文字印刷simulator 模拟器single axis 单轴sizing 底片之伸缩补偿skip 漏印skip printing 跳印;漏印sliver 丝条slot 开槽slotting 开槽SMD ( surface mount device ) 表面黏着元件smear 胶渣SMT ( surface mount technology)表面黏着技术sodium carbonate monohydrate 结晶水碳酸钠soft tooling 软性工具solder 焊锡; 锡铅solder bridge 锡桥solder bump 锡突solder float 漂锡solder mask adhesion 绿漆附着力solder on G/F 金手指沾锡solder on trace 线路沾锡solder plug 锡塞solder side 焊锡面solderability 焊锡性solid carbide 实质碳化物spacing 间距spacing nonenough 间距不足SPC ( Statistical Process Control ) 统计生管specification 规范special considerations 特别考虑spin coating 旋转涂布spindle 钻轴spiral contractometer 螺旋收缩仪spot face 铣靶spray coating 喷涂Squeegee 刮刀stacking structure 叠板结构stamping 冲压standard hydraulic lamination 标准液压法standardizing 标准化starvation 缺胶step tablet 格片数stock option 认股选择权strain 应度strength 强度stressmeter 应力计subtractive 减除法surface convex 表面突起surface examination 表面检查surface insulation resistance (SIR) 表面绝缘电阻surface mount 表面黏着方式surface roughness 表面粗慥度surges 突波switch circuit 开关线路tab 金手指tack free 不黏taped hole gauge 锥形孔规target hole 靶孔task force 任务编组tensile strength 抗拉强度tensile stress 张性应力tent 浮盖terms and definitions 术语与定义termination load 抗匹配负载test circuit 测试线路test method 试验方法test point 测试点thermal shock 热震荡试验thermal stress 热应力试验thermistor 热电感应式thermo cycling 热循环试验theoretical cycle time 理论性周期时间thickness 厚度time to market 上市时机thickness distribution 厚度分布thief 补助阴极thin core 薄基板;内层板throwing power 分布力tolerance 公差;容差tooling hole 工具孔torque load 扭力拒之负载total quality program 全面的品质计划toughness 坚度trace error 线路错误trace nick & pin hole 线路缺口及针孔trace peeling 线路剥离trace pin-hole 线路针孔trace surface roughness 线路表面粗糙tarnish and oxide resist 抗污抗氧化剂transmittance 透光度trim line 裁切线true levelling 真平整true position 真正位置的孔;真位twist 板翘type 种类umbra 本影undercut 侧蚀uneven coating 喷锡厚镀不平整universal 万用型universal tensile tester 万用拉力试验机universal tester 泛用型测试机upper carrier 顶部承载钢uptime 稼动时间vacuum deposition 真空蒸镀法vacuum hydraulic lamination 真空液压法vaporizer 气化室V-cut V形槽vertical microsection 垂直微切片via hole 导通孔visible inventory 有形的库存vision inspection 目视检查V oid 孔破void in hole 孔壁上的破洞void in PTH hole 孔破walkman 随身听warehouse 仓库warp 板弯warp , warpage 板弯water absorption 吸水性wear resistance 耐磨度weave exposure 纤纹显露weave texture 织纹隐现wedge angle 契尖角week 周wet chemistry 湿式化学制程wet film 湿膜wet lamination 湿膜压膜法wet process 湿制程wetting 沾锡wetting balance 沾锡平衡法wicking 渗铜;渗入;灯蕊效应width 宽度width reduce 线细width-to-thickness ratio 宽度与厚度的比值window 操作范围work-in-process 在制品work order 工单working film 工作片working master 工作母片year 年yellow 金黄色yield 良率glassy state 玻璃状态rubbery state 橡胶状态trial & error 嚐试错误SOP 标准作业程序EDI (Exchange data interface) 资料交换介面FTP (file transfer protocol) 档案传送协定Web site 网址WAP (wireles application protocol) 无线应用协定series connection 串联parallel connection 并联NPI(new Product introduction) 新产品导入sample qualification 打样认可independent third party assessment 独立第三者评监internal assessment 户(内部)评监end product 完工产品rounding convention 四舍五入之惯例inspection lot 检验批target value 目标值horizontal microsection 水平切片order of precedence 优先顺序master drawing 主图making ink 文字油墨thermal plane 散热层hole-fill insulation material 填孔用绝缘物unsupported holes 非电镀通孔hole pattern accuracy 孔位准度dielectric layer thickness 介质层厚度lifted lands 焊垫浮起nail-heading 钉头Plating folds 电镀皱折tackness 沾黏性sample size 样本数sampling plan 抽样计划rejected lots 拒收批exterior containers 外箱intended use 主要用途non-flow (no-flow) 非流性etchback (when specified) 回蚀(当指定时才做)abrade 动擦掉;擦伤;磨损abrasion 名擦破;擦伤;磨灭;剥蚀abridge 动缩短;省略;抄录;缩减;剥夺absorbent 形会吸收的;有吸收力的absorbent cotton 形脱脂棉absorption 名吸收;专心;合并abstract 形抽象的;理论的;不专心动摘录;抽象;偷;转移提炼;抽取abuse 动滥用;误用;咒骂;虐待;欺骗acceleration 名加速[度];促进access 名接近;接受;会面;捷径;通路accessory 形附属的;补助的;从犯的accommodate 动调节;和解;供应;留;容纳accordance 名一致;调和account 名计算;会计;报告;解释;理由accredit 动相信;认定资格;归功於.. accumulation 名累积;堆积accurate 形正确的;准确的;精密的accurately 副正确地;精密地acetone 名丙酮[挥发性无色液体achieve 动完成;成就;博得;达到[目的] acid 形酸的;不和悦的;不开心的acknowledge 动认;承认;自白;感谢acknowledgment 名承认;容许名自白;谢礼;礼物;收帖;收条;感谢acoustical 形听觉的;音响学的acrylic 形压克力的;丙烯酸的activate 动使活动;催化;净化;编组activation 名使活动;使催[活]化;活化activator 名使活跃之物;催化剂active 形活动[泼]的;勤勉的;主动的;动态acuity 名锐敏;激烈;苛刻acupuncture 名针灸;针治acute (angle) 形尖锐的;精明的;激烈的;高音的;(锐角)added value 名附加价值addendum 名补遗[书的]附册;附加物additive 形该加的;加法的;加法的名电池等的]添加剂address 名称呼;住址;致辞;谈吐;请求动演说;申请;免法官之职;说服;追求adequacy 名适当;妥当;足够adhere 动黏着;附着;固执;信奉;支持adherence 名固执;固守;黏着;附着adherent 形黏着的;附着於;信奉的名支持者;伙伴adhesion 名黏着;胶着;固执;瘉合adjacency 名邻接[物;地];前後节目adjacent 形邻近的;邻接的;附近的administrate 动管理;支配administration 名管理;经营名当局;政府;内阁;给与;配药;遗产[财政]管理administrative 形管理行政的adopted 形被收养的;被采用的adoption 名采用;收养;过继;公认advantage 名利益;便利;优势;优越adversely 副逆地;反对地;不利地advisory 形劝告的;建议的;忠告的aesthetics 名美学affected 形受影响的;感染的;感动的affiliation 名加入;同盟;协力名私生子父亲认定;追溯由来;关系;养父子关系affinity 名姻亲;同族关系;亲近性名远缘份;嗜好;相处得来的人;亲和力affirm 动断言;确定;肯定;断定;确认affix 动附加;贴上;签上;盖上;使负责against 名对,对着;反对;相逆;依;靠agar 名海菜;紫菜;石花菜;细菌培养基agenda 名会议事项;议事日程;议程agent 名代理者;管理人;代办人名行为者;手下;作因;天然力;官员;推销员agglomeration 名结块;凝结aggravating 形使..恶化的;可恼的aggregate 动聚集;总计;集合;合计的名集合;集团;集合体;材料aggressive 形侵略的;攻势的;挑衅的形气势汹汹的;进取[积极]的;精力旺盛的aging 形上年纪的;变老的;变旧的;老化agitation 名搅动;动摇;兴奋;煽动agreement 名契约;协议;符合;同意air force 名空军alcohol 名酒精;醇;酒;饮酒algorithm 名互除法align 动使成一线;排成一行;排列;合作alignment 名排成直线;整顿;合作aliquot 形能整除[某数的数] alkaline 形硷属的;硷性的alkalinity 名硷度alleviate 动减轻[痛苦];缓和allocate 动分派;配置;定位置;分配allow 动允许;听任;给与;斟酌;扣除;想allowance 名津贴;零用金;宽限;斟酌名扣除;许可;承认;折让;发津贴;给与定量alloy 名合金;成色;贱金属;混合物动使成合金;减低成色;减少;成合金;搀杂alpha 名希腊字母首字;最初alter 动改变;改造;改作;阉割;去势;变alteration 名变更;改造alternate 形交互的;间隔的;代理人动交错陈列;交替;轮流;交流作用alternative 形二中择一的altitude 名高;高度;海拔高度;高处aluminum 名铝[金属元素] ambient 形包围的ambiguous 形暧昧的;不明确的ambition 名雄心;热望;野心的目标(志)amide 名氨基化合物ammonia 名氨[气体];氨水ammoniacal 形氨的;氨性的;含氨的amperage 名安培数amplitude 名广阔;宽;丰富;充足名振幅;射程;[天体的]出没方位角analog 名类似物;相似体;类比analogy 名类似;相似;类推anchor 名锚;殿後者;锚纹饰;凿;急煞车anchoring spur 名着力爪angstrom 名埃[光的波长单位] angular 形有角[棱]的;尖的;瘦的;笨anion 名阴离子anneal 动加热後退火使其韧化;锻练;(回火);轫化annex 动附加;追加;并吞;罢占;侵吞名加添物;附册;附件;加建建筑;别馆annotate 动注解[书等];注释annual 形一年的;每年的;一年生的名一年生植物;年刊书[志];年报;年监annular 形环状的;轮状的annuli .. annulus的复数形anode 名正极;阳极anomaly 名不规则;反常;近点离角antimony 名锑[金属元素] apparatus 名[一套]器具;器官;构造apparent 形显而易见的;外表上的appendix 名附属物;附录;追加;盲肠applicable 形可适用的;能应用的apply 动适用;应用;抚;贴;涂;敷;使用appraisal 名评价;估价;监定approach 动接近;近似;向..交涉;研讨名接近;近似;入口;[研究]门径;亲近;逼近appropriate 动作为专用;挪用形适当的;特有的;固有的apron 名围巾;围嘴;马车挡雨的遮脚布名法衣;前舞台;飞机库前柏油或水泥地;护岸aqueous 形水的;水般的;水成的archives 名公文保管处;挡案;公文arise 动起来;出现;兴起;发生;起立;起arithmetic 名算术;算法;计算army 名军队;陆军;大群;团体arose .. arise的过去式array 名打扮;排队;列举;召集;军势;衣裳ascertain 动确定;稽考;探查aspect 名样子;光景;容貌;脸相;方向名方位;面;局面;情势;[星]视座;相;态asphalt 名沥青;铺装用柏油asphaltic 形柏油的aspire 动热望;怀大志;切望;高耸assembly 名集会;会合;会议;组合assess 动估定;评价;估价;课税;徵收assessment 名估定;评价;课徵;会费assets 名财产[可作偿债者];资产assets and liabilities 名资产与负债assignment 名分配;转让;任务assist 动援助;出席;[棒球]补杀assistance 名援助;帮助assistant 名助手;助理;店员associated 形联合的;关联的assume 动采取;承担;假装;臆测;摆架子assumption 名采取;承担;假定;傲慢asymmetric 形不均匀的;不对称的atmosphere 名大气;情况;环境;气氛atomizer 名喷雾器;香水喷雾器attachment 名附着;固着;附着物名附属品;依恋;执着;逮补;拘留attack 动攻击;袭击;害病;动手attempt 动尝试;企图;窥伺;袭击;未遂attendant 形跟随的;出席的;伴随的名陪从;随员;伴随物;从业者;管理员;加油站的站员attenuate 动使变稀薄;使变细;弄淡attenuation 名[使]变薄;稀薄化attestation 名证据;证言;证明attitude 名姿势;身段;态度;心意attribute 动归因;认为是..的缘故名属性;特质;附属物;象徵;形容词;属性attribution 名归属;归因;属性attributive 形属性的;形容的;修饰语audience 名听众;观众;收听者;收看者audit 名审计;审核;查帐;决算;旁听aurum 名金[金属元素] authorization 名授权;委任;认可autoclave 名快锅之一种auxiliary 形补助的;副的;预备的名帮助者;补助物;外国补助部队;补助舰;助动avenue 名林荫路;林荫道;大路;门径aware 形知道;晓得;注意到awareness 名知道;晓得;注意axial 形轴的;成轴的;轴周围的backlight 名背光; backup名支援;滞销货;阻塞;背板;备份backward 副向後;相反;以前形向後;落後;怕羞的baggy 形袋状的;宽松而下垂的balance 动秤;抵消;均衡;踌躇名秤;对称;比较;剩余;(可指尾数板) balance due 名不足额balance in hand 名余款bar 名染;妨害;禁止;反对;除..之外名棒;闩;线条;法院;节线bar code 名条码barometric 形气压[计]的barrel 名桶;枪身;选举费用basket 形篮制的;自备的野餐名篮篓;一篮;篮形的东西bat 名球棒;打手;片;棉絮;蝙蝠动速写;充分讨论;轮到打击batch 名一炉[面包等];一组bath 名沐浴;温泉地;浸渍用水battery 名殴打;电池;投捕手Baume scale 名波美(比重计)beaker 名有倒口的烧杯;大杯beam 动放射;闪亮;微笑;广播名梁;船幅;秤杆;杠杆;光线behavior 名规矩;品行;作用bellow(s) 动怒吼;咆哮;呼啸;(风箱(名) bend 动弯;拉;使屈服;倾心beneath 副在..之下;比..差beneficiary 形享受俸禄;臣服的名受益人;公费生benefit 动有益;享受利益;受益名利益;恩惠;义演;给付bevel 名斜角;倾斜;斜面;斜角规动截成斜角;斜切bias 动使存偏见;使偏袒;斜的;交叉的bias 名斜线;成见;倾向;歪斜;偏见bifurcate 动分[成]叉bilateral 形两边;有两面的binary 名二要素合成物;双子星形两要素的;二进位的;二元的binder 名装订人;使固定的东西;黏结剂bipolar 形有两极的;双极的blade 名叶;刃;剑术家;扁平;翼名荡子;女子;舌的前端blank 形空白的;单调的;完全的;无效的名空虚;钥匙;空包弹;标准杆孔规bleed 名切印刷部份的页次动流血;流出树液;取血;搾bleeder 名易出血或不止的人blend 名混合;混合物;混成语;溶合blender 名混合;混合器;搅拌器;果菜榨汁机blind 动使失去判断;隐蔽形瞎的;鲁莽的;不完全的;遮眼物;欺瞒blip 名雷达映出的影像blister 名水泡;发泡膏;枪座;使烦恼blob 名滴;小斑点;零分;溅block 名石头;切肉板;滑车;妨碍;占地方;一区blot 名污痕;棋子;弱点动抹脏;涂掉;吸乾;遮盖blotting 名乾印(印刷洗纸)blunt 动弄钝;减弱;变钝名短粗的针;现金;钝的;粗鲁;生硬;率直的blur 名污脏;蒙胧;不清楚;污名动弄脏;使模糊;朦胧blurr 动弄脏;使模糊;朦胧blurry 形模糊的;不清楚的;污斑blush 名面赤;红;赤色;一瞥动害羞;脸红;弄红;使面红bolt 名挺直;跑开;脱党;细看名箭头;电光;拒绝;螺钉bomb 动丢炸弹;轰炸名炸弹;手榴弹;突发事件bond 名结合;契约;证券;保证人形黏土的;被囚禁的booklet 名小册子;印刷品boost 动由後推;推上;援助;声援boot 动用靴踢;使穿长靴;电脑开机;起动名靴;放行李处;刑具;利益borderline 名边界[上的]bound 名境界[线];领域;边际动跳;使弹回;bind的过去形被缚的;装订的;决意的bow 名弓;弯曲;蝴蝶结;桨动鞠躬;屈服;向导;使屈服branch 名枝;分枝;支线;分部brand 动打烙印;予以深刻印象名品种;商标;烙印;污名brass 名厚脸皮;高级军官;黄铜[制品]break 动弄伤;违背;断;使破产;损坏;闯入名破晓;跑出;阻断;小憩break-away 名折断边breakdown 名故障;挫折;分类;分析名崩溃;倒塌;破损breaker 名碎波;破碎者;切断机名驯马师;[饮料用]水桶breakover 名崩溃breath 名气息;呼吸;低语;微吹brighten 动使辉煌;使快活;使聪brightener 名光泽剂bristle 名刚毛;猪鬃动使竖立毛发;发怒brittle 形易碎的;短暂的broadly 副宽广地;明白地;无礼bromide 名溴化物bronze 名青铜[色;制品];古铜browse 动吃嫩叶;放牧;浏览名嫩叶;嫩芽;嫩枝brush 名小冲突;丛林灌木地带名刷;笔;笔法;狐尾;拂拭bubble 名泡;泡沫;诈欺buckle 动扣住;弯曲;起皱;扣紧名扣子;弯曲;皱bud 名芽;花蕾;未发育的;少女;开始发育buffer 名缓冲器;减弱冲突的人bug 名毛病;故障;缺点;错误名半翅类的虫;病菌;虫动装置防盗铃[秘密扩音器] bulge 名胀;腰;凸出部份;优越bull 名公牛;金牛座;买空者名警察;吹牛;靶心;傻事bump 名碰撞声音;肿块;摇;扑通动冲撞;碰;交替;免职;颠簸buoyancy 名轻快;乐观;浮力bureau 名衣屉柜[大桌];办公室buret 名滴管;玻璃量管burn 动烧;灼伤;铭感;腐蚀;焦虑burner 名灯口;烧火的;燃烧器burnish 名光辉;光泽动磨;光;光亮;发光burnout 名燃料烧尽;烧坏burr 名光圈;隆隆声;喉音;钻孔器;磨刀石bury 动埋葬;葬礼;埋藏;掩蔽busses .. bus的复数bypass 名旁管;迂回路;忽视;旁路cabinet 名小柜橱;会议室;内阁calcium 名钙[金属元素] calculate 动计算;预测;指望calibration 名口径测定;查刻度calipers 名测径器calorimetry 名热量测定cam 名凸轮camber 名上弯形[道路];弧形cancellation 名抹消;取消;解除cannister 名罐;茶筒;滤毒罐cant 名哀诉声;伪善的口吻;黑话;隐语名口号;时髦话;倾斜;斜角;一堆;一滚cap 名无边帽;头巾;选手;鞘;套;柱头;雷管名最高部;修过的轮胎的轮底;临时参加费capable 形有能力的;可以..的capacitance 名[传导体的]容量capillary 形毛的;毛细管capital 形首位的;主要的;根本的形优秀的;罪大恶极的;致命的;严重的;上好的capital 名首都;大写;资本;本钱;柱头captive 名俘虏;迷恋;被囚的;专有的capture 名捕获;被捕获者carbide 名碳化物;碳化钙carbonate 动使成碳酸盐;碳化carriage 名车;搬运;姿势;风度carrier 名运送人;信差;搬运器名带菌者;航空母舰;介质;载波;货架cash 名钱;现金;小额货币cash 动兑现;付现款cashflow 名现金流量catalyst 名触媒剂category 名种类;部属;类目caterpillar 名毛虫;履带车辆cathode 名阴极cation 名阳离子;阴向游子caul (plate) 名网膜;羊膜囊;发网;(隔板) caution 名小心;警戒;警告;担保;吃惊cautiously 副谨慎地;小心地cavitation 名[螺旋桨後的]涡卷;半真空;空泡化cavity 名空穴;空窝;腔;蛀牙洞CCD 名电眼cease 动终止;停顿;停止cell 名小室;密室;茅舍;小屋;墓;渗透者名囊;蜂窝;窝;细胞;电池cellophane 名玻璃纸cellular 形细胞的;划分的cellular phone 名大哥大行动电话cellulose 名纤维素Celsius 名(度) C (*) centrifugal 形离心的;离心力的centrifuge 名离心分离机centripetal 形向心(性)的ceramics 名窑业;制陶业;陶器certification 名证明;检定certified 形被证明的;有保证的chalk 动用粉笔记;白粉擦;记录名粉笔;白粉;记帐出售;众所珍爱的马challenge 名挑战;难题;盘问chamber 名室;会议场;便壶;窝动作房间用;关在室内;上膛。

PCB专用词语A aA.O.I(Automatic Optical Inspection) 自动光学检查Acceptable quality level (AQL) 可接受质量水平Accuracy 精确度Activating 活化Active carbon treatment 活性碳处理After Pressed Thickness 压板后之厚度Alignment 校直，结盟Annular ring 锡圈Anti-Static Bag 静电胶袋Apparatus 设备，仪器Area 面积Artwork 菲林Artwork Drawing 菲林图形Artwork Film 原装菲林Artwork Modification 菲林修改Artwork No. 菲林编号Assembly 组装，装配Axis 轴B bBackplane 背板Back-up 垫板Baking 烘板Ball Grid Array (BGA) 球栅阵列Bare board 裸板Base Copper 底铜Base material 基材Bevelling 斜边Black Oxide 黑氧化Blind via hole 盲孔Blistering 起泡/水泡Board Cutting 开料Board Thickness 板厚Bottom side 底层Breakaway tab 打断点Brushing 磨刷Build-up 积层Bullet pad 子弹盘Buried hole 埋孔C cC/M(Component Marking) 元件字符Carbon ink 碳油Carrier 带板Ceramic substrate 陶瓷Certificate of Compliance 合格证书Chamfer 倒角Chemical cleaning 化学清洗Chemical corrosion 化学腐蚀Chip Scale Package (CSP) 晶片比例包装Circuit 线路Clearance 间距/间隙Color 颜色Component Side(C/S) 元件面Composite layers 复合层Computer Aided Design (CAD) 电脑辅助设计Computer Aided Manufacturing (CAM) 电脑辅助制作Computer Numerial Control (CNC) 数控Conductor 导体Conductor width/space 导体线宽/线隙Contact 接点Copper area 铜面积Copper clad 铜箔Copper foil 铜箔Copper plating 电镀铜Corner 角线Corner mark 板角记号Corner REG.Hole 角位对位孔Cracking 裂缝Creasing 皱折Criteria 规格,标准Crossection area 切面Cu/Sn Plating 镀铜锡Current efficiency 电流效率Customer 客户Customer Drilling File 客户钻孔资料Customer P/N 客户产品编号D dD/F Registration Hole 干菲林对位孔D/F(Dry Film) 干膜Date Code 日期代号Datum hole 基准参考孔Daughter board 子板Deburring 去毛刺Defect 缺陷Definition 定义Delamination 分层Delay 耽搁Delivery 交货Densitomefer 透光度计Density 密度Department 部门Description 说明Design origin 设计原点Desmear 去钻污,除胶Dessicant 防潮珠Developer 显影液,显影机Diamond 钻石Diazo film 重氮片Dielectric breakdown 介电击穿Dielectric constant 介电常数Dielectric Thickness 介电层厚度Dielectric V oltage Test 绝缘测试Dimension 尺寸Dimensional stability 尺寸稳定性Direct/indirect 直接/间接Distribution 发放Document type 文件种类Documentation Control 文件控制Double sided board 双面板Drill bit 钻咀Drilling 钻孔Drilling Roughness 钻孔粗糙度Dry Film 干菲林Dry Film-Pattern 干膜线路Dynamic 动态E eECN(Engineering Change Notification) 工程更改通知Effective date 有效期Electrical Test Fixture 电测试针床Electro migration 漏电Electroconductive paste 导电胶Electroless 无电沉Electroless copper 无电沉铜Electroless Ni 无电沉镍Electroless Gold/Au 无电沉金Engineering drawing 工程图纸Entek 有机涂覆Epoxy glass substrate 环氧玻璃基板Epoxy resin 环氧基树脂Etch 蚀刻Etchback 凹蚀Etching 蚀刻E-Test Marking 电测试标记E-Test(Electrical Test) 电测试Exposure 曝光External layer 外层F fFiducial mark 基准点Filling 填充Film Fabrication 菲林制作Final QC 最终检查Finish Overall Board Thickness 成品总板厚度Fixture 夹具Flammability 可燃性Flash Gold 薄金Flexible 易曲的,能变形的Flux 助焊剂G gGeneral information 一般资料Ghost image 重影Glass transition temperature 玻璃化湿度Gold Finger(G/F) 金手指Golden board 金板Grid 网格Ground plane 地线层H hHAL(Hot Air Leveling) 热风整平Hand Rout 手锣Hardness 硬度Heat Sealed 热密封Heat Shrink-warp 热收缩Holding time 停留时间Hole 孔Hole breakout 破环Hole density 孔的密度Hole Diameter 孔径Hole location 孔位Hole Location Chart 孔位座标表Hole Position Tolerance 孔位误差Hole size 孔尺寸Hot Air Leveling(HAL) 热风整平Humidity 湿度IIdentification 标识,指标Image 影像Imaging transfer 图形转移Impedance 阻抗Impedance Test 阻抗测试Inner copper foil 内层铜箔Inspection 检验Insulation resistance Test 绝缘测试Inter Plane Separation 内层分离Interleave Paper 隔纸Internal layer 内层Internal stress 内应力Ionic cleanliness 离子清洁度Isolation 孤立Isolation Resistance 绝缘电阻Item 项目K kKEY board 按键盘Key slot 槽孔Kraft paper 牛皮纸L lLaminate 板材Laminate Thickness 材料厚度Lamination void 层间空洞Landless hole 破孔Laser plotter 激光绘图机Laser plotting 激光绘图Laser via hole 激光穿孔Layup 层压配本Lay-up Instruction 压板指示Legend 字符Legend Width 字符宽度Length 长度Lifted Lands 残铜Line Width 线宽Liquid 液体Logic diagram 逻辑图形Logo 唛头,标记Lot size 批卡Mesh 目数M mMark 标记Master drawing 菲林图形Material Thickness 材料厚度Material Type 材料类型Max. X-out 坏板上限Max.Board Thickness After Plating 电镀后总板厚度之上限Measling 白斑Mech Drawing No. 图纸编号Mechanical cleaning 机械清洗Metal 金属Method 方法MI(Manufacturing Instruction) 生产制作指示Microstrip 微条线Min Conductor Copper Thickness 最小线路铜厚Min Hole Wall Copper Thickness 最小孔壁铜厚Min. Gold Plating Thickness 最小金厚Min. Nickel Thickness 最小镍厚Min. Tin-Lead Thickness (After HAL) （喷锡后）最小锡厚Min.Annular Ring 最小环宽Min.Spacing between Line to Line 线与线之间的最小距离Min.Spacing between Line to Pad 线与焊盘之间的最小距离Min.Spacing between Pad to Pad 焊盘与焊盘之间的最小距离Minimum 最小Mirroring 镜像Missing 缺少Model No. 产品名称Molded 模塑Mother board 主板Moulding 模房Mounting hole 安装孔Multilayer 多层板Multi-layer Laminate 多层板材料N nNegative 反面的Net list 网络表Nick 缺口No. of holes 孔数No.of Array/Panel 每个拼板套板数No.of Panel per Stack 每叠板数No.of Panel/Sheet 每张大料拼板数No.of Pcs Per Bag 每包数量No.of Unit/Array 每套单元数Normal value标准值O oOblong 椭圆形的Offset 偏移Open/short 开路/短路Optimization(design) 最佳化(设计)Organic Solerability Peservatives(OSP) 有机保护剂Originator 原作者Outer copper foil 外层铜箔Outline 外形P pPacking 包装Packing 包装Pad 焊盘Panel Area 拼板面积Panel Plated Crack 板镀缺口Panel plating 整板电镀Panel Size 拼板尺寸Panel Size After Outerlayer Cutting 外层切板后拼板尺寸Panel Utilization 拼板利用率Pass rate 通过率Passivation 钝化Pattern 线路Pattern Inspection 线路检查Pattern plating 图形电镀PCB(Printed Circuit Board) 印制线路板Peck drilling 啄钻Peel strength 剥离强度Peelable 可剥性Peelable 剥离强度Peelable Mask 可脱油Peeling 剥离Permanent 永久性PH value PH值Photo plotting 图形输出Photo via hole 菲林过孔Photographers 照片靶标Photoplotler 光绘机Physical 物理的Pin hole 销定孔Pink ring 粉红环Pinning hole 钻孔管位Pitch 间距Placement 放置Plated Though Hole(PTH) 沉铜Plating 电镀Plating Crack 电镀裂缝Plating line 电镀线Plating rack 电镀架Plating V oid 电镀针孔Plug Hole 塞孔Polymer 聚合体Porosity 孔隙率Positive 绝对的Power plane 电源层Prepreg 半固化片Primary side 首面Print 印刷Probe point 针床测点Process 工序Process flow 工序流程Product Planning Dept. 生产计划部Production 生产板Profile 外形Profiling 外形加工Profiling Process 外形加工Project No. 产品编号PTH Thermal Seress Test PTH热冲击测试PTH(Plating Through Hole) 沉铜Pull away 拉离Punch 啤模Punching 冲切Punching Mould Drawing 啤模图形Q qQA Audit 品质审计QA(Quanlity Assurance) 品质部Quad Palt Pack (QFP) 四边扁平林整器件Quantity 数量R rRaw Material Utilization 原材料利用率Recall 回收Rectifier 整流器Register mark 对位点Registration 重合点Remark 备注Resin 树脂Resin Recession 流胶Resist 抗蚀剂Resolution 分辨率Rigid 精密的Roller coating 涂覆Roughening 粗化Round pad 圆盘Routing 外形加工,铣板S sS/M Material 绿油物料S/M(Solder Mask) 阻焊Sales 销售Sample 样板Sampling inspection 抽样检验Scaling factor 缩放比例因素Scope 范围Scoring 刻槽Scratch 划痕Secondary side 第二面Section Code 组别代号Section Code Change 组别代号更改Segment 部分,片段Separated 分离Sequence 顺序Sets 套Sheet Size 大料尺寸Shematic diagram 原理图Shiny 有光泽的,发光的Silk screen 丝印Silver film 银盐片Single/double 单层/双面Slot 槽,坑Solder Mask 阻焊Solder mask on bare copper (smobc) 裸铜覆盖阻焊膜Solder side 焊接面Solder Side C/M 阻焊面字符Solder Side Cir. 焊接面线路Solder Side Circuit 焊接面Solder Side S/M 焊接面阻焊Solderability 可焊性Solvent Test 可溶性测试Spacing 线距Special requirement 特殊要求Specification 详细说明，规范Spindle 主轴Split 裂片Square pad 方块Standard 标准值Static 静态Stencial 网版Step drilling 分布钻Step scale 光梯尺Store 货仓Supplier 供应商Supported hole 支撑点Surface 表面Surface mount technology 表面组装技术Swimming 滑移T tTack 堆起Tape Programming 铬带制作Tape Test 胶带测试Target Hole 目标孔Teardrop 泪珠Template 天平Tenting 封孔Test 测试Test coupon 图样Test Parameter 测试参数Test Pattern 测试孔Testing V oltage 电压Thermal shock 热冲击Thermal stress 热应力Thickness 厚度Tin Content 锡含量Tin/Lead Stripping 退铅锡Tin-lead plating 电镀铅锡Tolerance 公差Top side 板面Touch up 修理(执漏)Training 训练Transmission 传输线Transmittance 传送Trim line 修剪U uUltrasonic cleaning 超声波清洗Undercut 侧蚀Unit Arrangement 单元排版Unit Layout Per Panel 单元拼板图Uv-blocking 阻挡紫外线V vVacunm Pack 真空包装Vacuum lamination 真空压制V-Cut V- 坑View From…观察方向由…Visual & Warpage 可视性和翘曲度Visual inspection 目检V oltage 电压W wW/F(Wet Film) 湿膜Warp & Twist 翘曲和弯曲Wet Film 湿模Width 宽度Wiring 线路。

PCB工程部专业英文词汇31.小于3millessthan3mil32.高于3milmorethan3mil词汇33.压合结构stackingstructure或者stack_up1.板料:material34.附件：attachedfile2.最低限度:minimum或者min.35.样品：sample3.最大限度:maximum或者max.36.文档：Document4.基准点(零点)datumpoint37.答复：answer;reply5.周期Datecode38.规格：spec6.V-cut余厚V-cutremainthickness39.与...同样的：thesameas7.抢电铜皮（假铜）dummycopper40.前版本：previousversion(oldversion)8.实物板actualboard41.生产：production9.外形及尺寸错误dimensionerror42.确认：confirm10.异常情形errordatafile43.再次确认：confirmagain11.焊锡面与零件面对位偏差misregistration44.工程问题：engineeringquery（EQ）12.孔塞plughole45.尽快：assoonaspossible13.要求requirement46.生产文件：productionGerber14.缺少miss47.联系某人：contactsomebody15.偏公差uneventolerance48.提交样板：submitsample16.补偿compensation49.交货期：deliverydate17.表面处理surfacetreatment50.电测成本：ET（electricaltest）cost18.无铅喷锡LeadfreeHAL51.通断测试：Openandshorttesting19.金手指斜边bevelofG/F52.参考：referto20.制程能力processcapability53.IPC标准：IPCstandard21.建议,暗示suggest54.IPC二级：IPCclass222.确保ensure55.可接受的：acceptable23.满足,达到meet56.允许：permit24.为了inorderto57.制造：manufacture或者fabricate25.交货期deliverydate58.修改：revision26.绿油桥soldermaskbridge或者soldermaskdam59.公差：tolerance27.根据accordingto60.忽略：ignore28.单边3milperside3mil61.工具孔：toolinghole29.直径diameter62.安装孔：mountinghole30.半径radius63.元件孔：componenthole133.槽孔：slothole97.单面开窗：singlesidemaskopening34.邮票孔：snapoffhole或者stamphole98.补油：touchupsoldermask35.导通孔：viahole99.补线：trackwelds36.盲孔：blindviahole100.毛刺：burrs37.埋孔：buriedviahole101.去毛刺：deburr38.金属化孔：PTH(platedthroughhole)102.镀层厚度：platingthickness39.非金属化孔：NPTH(noplatedthroughhole)103.清洁度：cleanliness40.孔位：holelocation104.离子污染：ioniccontamination41.避免：avoid105.阻燃性等级：flammabilityretardantrating42.原设计：originaldesign106.黑化：blackoxidation43.修改：modify107.棕化：brownoxidation44.按原设计：followuporiginaldesign108.红化：redoxidation45.附边：wastetab,wastearea或者breakawaytab109.可焊性不良：poorsolderability46.铜条：copperstrip110.焊料：solder47.拼板：paneldrawing111.包装：packaging48.板厚：boardthickness112.角标：cornermark49.删除：remove(delete)113.特性阻抗：characteristicimpedance50.削铜：shavethecopper114.正像：positive51.露铜：copperexposure或者exposedcopper115.负片：negative52.光标点:fiducialmark116.镜像：mirror53.不同：bedifferentfrom(differfrom)117.线宽：linewidth或者tracewidth54.内弧：insideradius118.线距：linespacing或者tracespacing55.焊环：annularring119.做样：buildsample56.单板尺寸：singlesize120.按照：accordingto57.拼板尺寸：panelsize121.成品：finished58.铣,锣：routing122.做变更：makethechange59.铣刀：router或者Routingbit123.相类似：similarto60.楔形掏槽V-cut或者Vscoring124.规格：specification92.哑光：matt125.下移：shiftdown26.光亮的：glossy126.垂直地：vertically27.锡珠：solderball(solderplugs)127.水平的：horizontally28.阻焊：soldermask(solderresist)128.增大：increase29.阻焊开窗：soldermaskopening129.缩小：decrease2WORD格式61.表面处理：SurfaceFinishing163.刚性板：rigidboard62.波峰焊：wavesolder164.挠性板：flexibleboard63.钻孔数据：drillingdata165.刚挠板：flex-rigidboard64.标记：Logo166.铣：CNC(mill,routing)65.Ul标记：ULlogo,或者UlMarking167.冲：punching66.蚀刻标记：etchedmarking168.倒角：beveling67.周期：datecode169.斜面：chamfer68.翘曲：bowandtwist170.倒圆角：fillet69.外层：outerlayer或者externallayer171.尺寸：dimension70.内层：innerlayer或者internallayer172.材料：material71.顶层：toplayer173.介电常数：Dielectricconstant72.底层：bottomlayer174.菲林：film73.元件面：componentside175.成像：Imaging74.焊接面：solderside176.板镀：PanelPlating75.阻焊层：soldermasklayer177.图镀：PatternPlating76.字符层：legendlayer(silkscreenlayeroroverlayer)178.后清洗：FinalCleaning77.兰胶层：peelableSMlayer179.叠层：stackingstructure(stack-up)78.贴片层：pastemasklayer180.污染焊盘：contaminatepad79.碳油层：carbonlayer181.分孔图：drillchart或者drillmap80.外形层：outlinelayer(profilelayer)182.度数：degree81.白油：whiteink183.被⋯覆盖：becoveredwith82.绿油：greenink184.负公差：minustolerance83.喷锡：hotairleveling(HAL)185.标靶盘：targetpad84.电金,水金：flashgold186.外形公差：routingtolerance85.插头镀金：platedgoldedge-boardcontacts187.芯板：core86.金手指：Gold-finger188.半固化片Prepreg87.防氧化：Entek(OSP)189.阻抗线：impedancetrace88.沉金：Immersiongold(chem.Gold)190.评估e stimate89.沉锡：ImmersionTin(chem.Tin)191.玻纤显露FiberExposure90.沉银：ImmersionSilver(chem.silver)192.底铜b asecopper91.单面板：singlesidedboard193.工作搞workingGerber92.双面板：doublesidedboard194.原稿originalartwork93.多层板：multilayerboard195.放宽r elaxWORD格式94.挖空blanking或者cut-out229.树脂含量resincontent95.一般性阻焊油墨generalresistink230.排列电阻resistornetwork96.孔位错误misholelocation231.锣刀（铣刀）routingbit97.压合周期presscycle232.孔内沾文字S/Lonhole98.毛边serratededges233.孔内绿漆S/Monhole99.跳印skipprinting234.线路沾锡solderontrace100.气泡blistering235.金手指沾锡solderonG/F101.隔离焊盘isolatedpad236.废框scrap102.泪滴teardrops237.封孔处理sealing103.箭头arrows238.间距不足spacingnon-enough104.加大Enlarge239.靶位孔targethole105.压合周期presscycle240.测试线路testcircuit106.毛边serratededges241.热应力试验thermalstress107.跳印,漏印skipprinting242.厚度分布thicknessdistribution108.宽度与厚度的比值width-to-thicknessratio243.薄基板,内层板thincore109.调整adjust244.线路缺口及针孔tracknick&pinhole110.铜箔基板coppercladedlaminates245.裁切线trimline111.线路露铜copperexposure246.真平整trueleveling112.孔内异物dirtyhole247.真正位置的孔trueposition113.椭圆形ellipticalset248.万用型universal114.纤维突出fiberprotrusion249.气化室vaporizer115.填充料filler250.仓库warehouse116.互相连通interconnection251.契尖角wedgeangle117.改善方案implementation252.线细widthreduce118.板料使用率materialusefactor253.良率yield119.回路,网络network254.渗铜,渗入,灯芯效应wicking120.缺口nick255.允收acceptable121.氧化oxidation256.试样点couponlocation122.剥离(剥落)peelingoff257.经核准的，被认可的approved123.补线不良poortouch-up258.超越胜过,超过其他exceed124.品质等级qualityclassification259.牛皮纸kraftpaper125.对位孔registration260.孔壁破铜Holevoid126.拒收rejectable261.孔位破出HolebreakoutWORD格式PCB生产—经典流程—英文培训教程d-8铣靶(spotface)d-9去溢胶(resinflushremoval)E.减铜(CopperReduction)A.开料(CutLamination)e-1薄化铜(CopperReduction)a-1裁板(SheetsCutting)F.电镀(HorizontalElectrolyticPlating)a-2原物料发料(Panel)(ShearmaterialtoSize)f-1水平电镀(HorizontalElectro-Plating)(PanelPlating) B.钻孔(Drilling)f-2锡铅电镀(Tin-LeadPlating)(PatternPlating)b-1内钻(InnerLayerDrilling)f-3低于1mil(Lessthan1milThickness)b-2一次孔(OuterLayerDrilling)f-4高于1mil(Morethan1milThickness)b-3二次孔(2ndDrilling)f-5砂带研磨(BeltSanding)b-4雷射钻孔(LaserDrilling)(LaserAblation)f-6剥锡铅(Tin-LeadStripping)b-5盲(埋)孔钻孔(Blind&BuriedHoleDrilling)f-7微切片(Microsection)C.干膜制程(PhotoProcess(D/F))G.塞孔(PlugHole)c-1前处理(Pretreatment)g-1印刷(InkPrint)c-2压膜(DryFilmLamination)g-2预烤(Precure)c-3曝光(Exposure)g-3表面刷磨(Scrub)c-4显影(Developing)g-4后烘烤(Postcure)c-5蚀铜(Etching)H.防焊(绿漆/绿油):(SolderMask)c-6去膜(Stripping)h-1C面印刷(PrintingTopSide)c-7初检(Touch-up)h-2S面印刷(PrintingBottomSide)c-8化学前处理,化学研磨(ChemicalMilling)h-3静电喷涂(SprayCoating)WORD格式h-4前处理(Pretreatment)c-10显影(Developing)h-5预烤(Precure)c-11去膜(Stripping)h-6曝光(Exposure)Developing,Etching&Stripping(DES)h-7显影(Develop)D.压合Laminationh-8后烘烤(Postcure)d-1黑化(BlackOxideTreatment)h-9UV烘烤(UVCure)d-2微蚀(Microetching)h-10文字印刷(PrintingofLegend)d-3铆钉组合(eyelet)h-11喷砂(Pumice)(WetBlasting)d-4叠板(Layup)h-12印可剥离防焊(PeelableSolderMask)d-5压合(Lamination)I.镀金Goldplatingd-6后处理(PostTreatment)i-1金手指镀镍金(GoldFinger)d-7黑氧化(BlackOxideRemoval)i-2电镀软金(SoftNi/AuPlating)5WORD格式i-3浸镍金(ImmersionNi/Au)(ElectrolessNi/Au)N-5AOI检查及VRS(AOIInspection&Verified&Repaired) J.喷锡(HotAirSolderLeveling)N-6BlaserAOI(afterDesmearandMicroetching)j-1水平喷锡(HorizontalHotAirSolderLeveling)N-7除胶渣(Desmear)j-2垂直喷锡(VerticalHotAirSolderLeveling)N-8微蚀(Microetching)j-3超级焊锡(SuperSolder)j-4.印焊锡突点(SolderBump)K.成型(Profile)(Form)k-1捞型(N/CRouting)(Milling)k-2模具冲(Punch)k-3板面清洗烘烤(Cleaning&Backing)k-4V型槽(V-Cut)(V-Scoring)k-5金手指斜边(BevelingofG/F)L.开短路测试(ElectricalTesting)(Continuity&InsulationTesting)l-1AOI光学检查(AOIInspection)l-2VRS目检(Verified&Repaired)l-3泛用型治具测试(UniversalTester)l-4专用治具测试(DedicatedTester)l-5飞针测试(FlyingProbe)M.终检(FinalVisualInspection)m-1压板翘(WarpageRemove)m-2X-OUT印刷(X-OutMarking)m-3包装及出货(Packing&shipping)m-4目检(VisualInspection)m-5清洗及烘烤(FinalClean&Baking)m-6护铜剂(ENTEKCu-106A)(OSP)m-7离子残余量测试(IonicContaminationTest)(CleanlinessTest)m-8冷热冲击试验(ThermalcyclingTesting)m-9焊锡性试验(SolderabilityTesting)N.雷射钻孔(LaserAblation)N-1雷射钻Tooling孔(LaserablationToolingHole)N-2雷射曝光对位孔(LaserAblationRegistrationHole)N-3雷射Mask制作(LaserMask)N-4雷射钻孔(LaserAblation)。

PCB 工程部专业英文词汇词汇1.板料: material2.最低限度: minimum 或者min。

3.最大限度: maximum 或者max.4.基准点(零点）datum point5.周期Date code6.V-cut余厚V—cut remain thickness7.抢电铜皮(假铜) dummy copper8.实物板actualboard9.外形及尺寸错误dimension error10.异常情形error data file11.焊锡面与零件面对位偏差misregistration12.孔塞plug hole13.要求requirement14.缺少miss15.偏公差uneven tolerance16.补偿compensation17.表面处理surface treatment18.无铅喷锡Lead free HAL19.金手指斜边bevel of G/F20.制程能力process capability21.建议，暗示suggest22.确保ensure23.满足,达到meet24.为了in order to25.交货期delivery date26.绿油桥solder mask bridge 或者solder mask dam27.根据according to28.单边3mil per side 3 mil29.直径diameter30.半径radius 31.小于3mil less than 3mil32.高于3mil more than 3 mil33.压合结构stacking structure 或者stack_up34.附件:attachedfile35.样品：sample36.文档：Document37.答复：answer；reply38.规格:spec39.与...同样的：the same as40.前版本：previous version（old version)41.生产：production42.确认：confirm43.再次确认：confirm again44.工程问题:engineering query（EQ）45.尽快：as soon as possible46.生产文件：production Gerber47.联系某人：contactsomebody48.提交样板：submit sample49.交货期:delivery date50.电测成本：ET(electrical test）cost51.通断测试：Open and short testing52.参考：refer to53.IPC标准：IPC standard54.IPC二级：IPCclass 255.可接受的：acceptable56.允许:permit57.制造：manufacture 或者fabricate58.修改：revision59.公差:tolerance60.忽略：ignore61.工具孔：tooling hole62.安装孔：mounting hole63.元件孔:component hole64.槽孔：slot hole65.邮票孔:snap off hole 或者stamp hole66.导通孔：via hole67.盲孔：blind via hole68.埋孔：buried via hole69.金属化孔：PTH(platedthrough hole）70.非金属化孔：NPTH( no platedthrough hole）71.孔位：hole location72.避免：avoid73.原设计：original design74.修改:modify75.按原设计:follow up original design76.附边：waste tab，waste area 或者breakaway tab77.铜条：copper strip78.拼板：panel drawing79.板厚：board thickness80.删除:remove（delete)81.削铜：shave the copper82.露铜：copper exposure 或者exposed copper83.光标点：fiducial mark84.不同:be different from（differ from）85.内弧:inside radius86.焊环：annular ring87.单板尺寸：single size88.拼板尺寸：panel size89.铣，锣：routing90.铣刀:router 或者Routing bit91.楔形掏槽V-cut 或者V scoring92.哑光：matt93.光亮的:glossy94.锡珠：solder ball（solder plugs）95.阻焊：solder mask(solder resist)96.阻焊开窗：solder maskopening 97.单面开窗:single side mask opening98.补油：touch up solder mask99.补线：track welds100.毛刺：burrs101.去毛刺：deburr102.镀层厚度：plating thickness103.清洁度：cleanliness104.离子污染：ionic contamination105.阻燃性等级：flammability retardant rating 106.黑化：black oxidation107.棕化：brown oxidation108.红化：red oxidation109.可焊性不良：poor solderability110.焊料：solder111.包装：packaging112.角标：corner mark113.特性阻抗：characteristic impedance 114.正像：positive115.负片：negative116.镜像：mirror117.线宽：line width 或者trace width118.线距：line spacing 或者trace spacing 119.做样：build sample120.按照：according to121.成品：finished122.做变更：make the change123.相类似：similar to124.规格:specification125.下移：shift down126.垂直地：vertically127.水平的：horizontally128.增大：increase129.缩小：decrease130.表面处理：Surface Finishing131.波峰焊：wave solder132.钻孔数据：drilling data133.标记：Logo134.Ul 标记:UL logo，或者Ul Marking135.蚀刻标记：etched marking136.周期：date code137.翘曲:bow and twist138.外层：outer layer 或者external layer139.内层：inner layer 或者internal layer140.顶层:top layer141.底层:bottom layer142.元件面：component side143.焊接面：solder side144.阻焊层:solder mask layer145.字符层：legend layer (silkscreen layer or over layer) 146.兰胶层：peelable SM layer147.贴片层：paste mask layer148.碳油层：carbon layer149.外形层:outline layer(profile layer）150.白油：white ink151.绿油：green ink152.喷锡：hot air leveling (HAL)153.电金，水金：flash gold154.插头镀金：plated gold edge—board contacts155.金手指：Gold—finger156.防氧化：Entek（OSP）157.沉金：Immersion gold (chem. Gold)158.沉锡:ImmersionTin(chem.Tin）159.沉银:Immersion Silver （chem。

PCB 工程部专业英文词汇词汇1.板料: material2.最低限度: minimum 或者min.3.最大限度: maximum 或者max.4.基准点(零点) datum point5.周期Date code6.V-cut余厚V-cut remainthickness7.抢电铜皮（假铜）dummycopper8.实物板actual board9.外形及尺寸错误dimensionerror10.异常情形error data file11.焊锡面与零件面对位偏差misregistration12.孔塞plug hole13.要求requirement14.缺少miss15.偏公差uneven tolerance16.补偿compensation17.表面处理surface treatment18.无铅喷锡Lead free HAL19.金手指斜边bevel of G/F20.制程能力process capability21.建议,暗示suggest22.确保ensure23.满足,达到meet24.为了in order to25.交货期delivery date26.绿油桥solder mask bridge 或者solder mask dam27.根据according to28.单边3mil per side 3 mil29.直径diameter30.半径radius31.小于3mil less than 3mil32.高于3mil more than 3 mil33.压合结构stacking structure 或者stack_up34.附件：attached file35.样品：sample36.文档：Document37.答复：answer; reply38.规格：spec39.与...同样的：the same as40.前版本：previous version(old version)41.生产：production42.确认：confirm43.再次确认：confirm again44.工程问题：engineering query（EQ）45.尽快：as soon as possible46.生产文件：production Gerber47.联系某人：contact somebody48.提交样板：submit sample49.交货期：delivery date50.电测成本：ET（electrical test）cost51.通断测试：Open and shorttesting52.参考：refer to53.IPC标准：IPC standard54.IPC二级：IPC class 255.可接受的：acceptable56.允许：permit57.制造：manufacture 或者fabricate58.修改：revision59.公差：tolerance60.忽略：ignore61.工具孔：tooling hole62.安装孔：mounting hole63.元件孔：component hole64.槽孔：slot hole65.邮票孔：snap off hole 或者stamp hole66.导通孔：via hole67.盲孔：blind via hole68.埋孔：buried via hole69.金属化孔：PTH(plated through hole)70.非金属化孔：NPTH( no plated through hole)71.孔位：hole location72.避免：avoid73.原设计：original design74.修改：modify75.按原设计：follow up original design76.附边：waste tab, waste area 或者breakaway tab77.铜条：copper strip78.拼板：panel drawing79.板厚：board thickness80.删除：remove(delete)81.削铜：shave the copper82.露铜：copper exposure 或者exposed copper83.光标点: fiducial mark84.不同：be different from(differ from)85.内弧：inside radius86.焊环：annular ring87.单板尺寸：single size88.拼板尺寸：panel size89.铣,锣：routing90.铣刀：router 或者Routing bit91.楔形掏槽V-cut 或者V scoring92.哑光：matt93.光亮的：glossy94.锡珠：solder ball(solder plugs)95.阻焊：solder mask(solder resist)96.阻焊开窗：solder mask opening97.单面开窗：single side mask opening98.补油：touch up solder mask99.补线：track welds100.毛刺：burrs101.去毛刺：deburr102.镀层厚度：plating thickness103.清洁度：cleanliness104.离子污染：ionic contamination105.阻燃性等级：flammability retardant rating106.黑化：black oxidation107.棕化：brown oxidation108.红化：red oxidation109.可焊性不良：poor solderability110.焊料：solder111.包装：packaging112.角标：corner mark113.特性阻抗：characteristic impedance114.正像：positive115.负片：negative116.镜像：mirror117.线宽：line width 或者trace width118.线距：line spacing 或者trace spacing119.做样：build sample120.按照：according to121.成品：finished122.做变更：make the change123.相类似：similar to124.规格：specification125.下移：shift down126.垂直地：vertically127.水平的：horizontally128.增大：increase129.缩小：decrease130.表面处理：Surface Finishing131.波峰焊：wave solder132.钻孔数据：drilling data133.标记：Logo134.Ul 标记：UL logo,或者Ul Marking135.蚀刻标记：etched marking136.周期：date code137.翘曲：bow and twist138.外层：outer layer 或者external layer139.内层：inner layer 或者internallayer140.顶层：top layer141.底层：bottom layer142.元件面：component side143.焊接面：solder side144.阻焊层：solder mask layer145.字符层：legend layer (silkscreen layer or over layer)146.兰胶层：peelable SM layer147.贴片层：paste mask layer148.碳油层：carbon layer149.外形层：outline layer(profile layer)150.白油：white ink151.绿油：green ink152.喷锡：hot air leveling (HAL)153.电金,水金：flash gold154.插头镀金：plated gold edge-board contacts155.金手指：Gold-finger156.防氧化：Entek (OSP)157.沉金：Immersion gold (chem.Gold)158.沉锡：Immersion Tin(chem.Tin)159.沉银：Immersion Silver (chem.silver)160.单面板：single sided board161.双面板：double sided board162.多层板：multilayer board163.刚性板：rigid board164.挠性板：flexible board165.刚挠板：flex-rigid board166.铣：CNC (mill , routing)167.冲：punching168.倒角：beveling169.斜面：chamfer170.倒圆角：fillet171.尺寸：dimension172.材料：material173.介电常数：Dielectric constant174.菲林：film175.成像：Imaging176.板镀：Panel Plating177.图镀：Pattern Plating178.后清洗：Final Cleaning179.叠层：stacking structure (stack-up)180.污染焊盘：contaminate pad181.分孔图：drill chart 或者drill map182.度数：degree183.被…覆盖：be covered with184.负公差：minus tolerance185.标靶盘：target pad186.外形公差：routing tolerance187.芯板：core188.半固化片Prepreg189.阻抗线：impedance trace190.评估estimate191.玻纤显露Fiber Exposure192.底铜base copper193.工作搞working Gerber194.原稿original art work195.放宽relax196.挖空blanking 或者cut-out197.一般性阻焊油墨general resist ink198.孔位错误mis hole location199.压合周期press cycle200.毛边serrated edges201.跳印skip printing202.气泡blistering203.隔离焊盘isolated pad204.泪滴tear drops205.箭头arrows206.加大Enlarge207.压合周期press cycle208.毛边serrated edges209.跳印,漏印skip printing210.宽度与厚度的比值width-to-thickness ratio211.调整adjust212.铜箔基板copper claded laminates213.线路露铜copper exposure214.孔内异物dirty hole215.椭圆形elliptical set216.纤维突出fiber protrusion217.填充料filler218.互相连通interconnection219.改善方案implementation220.板料使用率material use factor221.回路,网络network222.缺口nick223.氧化oxidation224.剥离(剥落) peeling off225.补线不良poor touch-up 226.品质等级quality classification227.对位孔registration228.拒收rejectable229.树脂含量resin content230.排列电阻resistor network231.锣刀（铣刀）routing bit232.孔内沾文字S/L on hole233.孔内绿漆S/M on hole234.线路沾锡solder on trace235.金手指沾锡solder on G/F236.废框scrap237.封孔处理sealing238.间距不足spacing non-enough239.靶位孔target hole240.测试线路test circuit241.热应力试验thermal stress 242.厚度分布thickness distribution243.薄基板,内层板thin core244.线路缺口及针孔track nick & pin hole245.裁切线trim line246.真平整true leveling247.真正位置的孔true position248.万用型universal249.气化室vaporizer250.仓库warehouse251.契尖角wedge angle252.线细width reduce253.良率yield254.渗铜,渗入,灯芯效应wicking255.允收acceptable256.试样点coupon location257.经核准的，被认可的approved258.超越胜过,超过其他exceed259.牛皮纸kraft paper260.孔壁破铜Hole void261.孔位破出Hole breakoutPCB生产—经典流程—英文培训教程A. 开料( Cut Lamination)a-1 裁板( Sheets Cutting) a-2 原物料发料(Panel)(Shear material to Size)B. 钻孔(Drilling)b-1 内钻(Inner Layer Drilling )b-2 一次孔(Outer Layer Drilling )b-3 二次孔(2nd Drilling)b-4 雷射钻孔(Laser Drilling )(Laser Ablation )b-5 盲(埋)孔钻孔(Blind & Buried Hole Drilling)C. 干膜制程( Photo Process(D/F))c-1 前处理(Pretreatment)c-2 压膜(Dry Film Lamination)c-3 曝光(Exposure)c-4 显影(Developing)c-5 蚀铜(Etching)c-6 去膜(Stripping)c-7 初检( Touch-up)c-8 化学前处理,化学研磨( Chemical Milling )c-9 选择性浸金压膜(Selective Gold Dry Film Lamination) c-10 显影(Developing )c-11 去膜(Stripping )Developing , Etching & Stripping ( DES )D. 压合Laminationd-1 黑化(Black Oxide Treatment)d-2 微蚀(Microetching)d-3 铆钉组合(eyelet )d-4 叠板(Lay up)d-5 压合(Lamination)d-6 后处理(Post Treatment)d-7 黑氧化( Black Oxide Removal )d-8 铣靶(spot face)d-9 去溢胶(resin flush removal)E. 减铜(Copper Reduction)e-1 薄化铜(Copper Reduction)F. 电镀(Horizontal Electrolytic Plating)f-1 水平电镀(Horizontal Electro-Plating) (Panel Plating) f-2 锡铅电镀( Tin-Lead Plating ) (Pattern Plating)f-3 低于1 mil ( Less than 1 mil Thickness )f-4 高于1 mil ( More than 1 mil Thickness)f-5 砂带研磨(Belt Sanding)f-6 剥锡铅( Tin-Lead Stripping)f-7 微切片( Microsection)G. 塞孔(Plug Hole)g-1 印刷( Ink Print )g-2 预烤(Precure)g-3 表面刷磨(Scrub)g-4 后烘烤(Postcure)H. 防焊(绿漆/绿油): (Solder Mask)h-1 C面印刷(Printing Top Side)h-2 S面印刷(Printing Bottom Side)h-3 静电喷涂(Spray Coating)h-4 前处理(Pretreatment)h-5 预烤(Precure)h-6 曝光(Exposure)h-7 显影(Develop)h-8 后烘烤(Postcure)h-9 UV烘烤(UV Cure)h-10 文字印刷( Printing of Legend )h-11 喷砂( Pumice)(Wet Blasting)h-12 印可剥离防焊(Peelable Solder Mask)I . 镀金Gold platingi-1 金手指镀镍金( Gold Finger )i-2 电镀软金(Soft Ni/Au Plating)i-3 浸镍金( Immersion Ni/Au) (Electroless Ni/Au)J. 喷锡(Hot Air Solder Leveling)j-1 水平喷锡(Horizontal Hot Air Solder Leveling)j-2 垂直喷锡( Vertical Hot Air Solder Leveling)j-3 超级焊锡(Super Solder )j-4. 印焊锡突点(Solder Bump)K. 成型(Profile)(Form)k-1 捞型(N/C Routing ) (Milling)k-2 模具冲(Punch)k-3 板面清洗烘烤(Cleaning & Backing)k-4 V型槽( V-Cut)(V-Scoring)k-5 金手指斜边( Beveling of G/F)L. 开短路测试(Electrical Testing) (Continuity & Insulation Testing)l-1 AOI 光学检查( AOI Inspection)l-2 VRS 目检(Verified & Repaired)l-3 泛用型治具测试(Universal Tester)l-4 专用治具测试(Dedicated Tester)l-5 飞针测试(Flying Probe)M. 终检( Final Visual Inspection)m-1 压板翘( Warpage Remove)m-2 X-OUT 印刷(X-Out Marking)m-3 包装及出货(Packing & shipping)m-4 目检( Visual Inspection)m-5 清洗及烘烤( Final Clean & Baking)m-6 护铜剂(ENTEK Cu-106A)(OSP)m-7 离子残余量测试(Ionic Contamination Test )(Cleanliness Test)m-8 冷热冲击试验(Thermal cycling Testing)m-9 焊锡性试验( Solderability Testing )N. 雷射钻孔(Laser Ablation)N-1 雷射钻Tooling孔(Laser ablation Tooling Hole)N-2 雷射曝光对位孔(Laser Ablation Registration Hole)N-3 雷射Mask制作(Laser Mask)N-4 雷射钻孔(Laser Ablation)N-5 AOI 检查及VRS ( AOI Inspection & Verified & Repaired)N-6 Blaser AOI (after Desmear and Microetching)N-7 除胶渣(Desmear)N-8 微蚀(Microetching ) 高考是我们人生中重要的阶段，我们要学会给高三的自己加油打气。

1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：mulitlayer printed board(mlb)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (fpc)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs)45、层间全内导通多层印制板：alivh multilayer printed board46、载芯片板：chip on board (cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材的材料1、a阶树脂：a-stage resin2、b阶树脂：b-stage resin3、c阶树脂：c-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (wpe)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (pi)38、聚四氟乙烯：polytetrafluoetylene (ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、e玻璃纤维：e-glass fibre43、d玻璃纤维：d-glass fibre44、s玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ed copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (rcc)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae)10、计算机辅助测试：computer-aided test.(cat)11、电子设计自动化：electric design automation .(eda)12、工程设计自动化：engineering design automaton .(eda2)13、组装设计自动化：assembly aided architectural design. (aaad)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display .(ccd)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine des criptionm format .(mdf)27、机器描述格式数据库：mdf databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router (cad)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (pdp)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、v形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (pth)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (alivh)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referance。

PCB 工程部专业英文词汇词汇1.板料：material2.最低限度: minimum 或者min.3.最大限度：maximum 或者max。

4.基准点(零点) datum point5.周期Date code6.V—cut余厚V-cut remain thickness7.抢电铜皮（假铜）dummy copper8.实物板actualboard9.外形及尺寸错误dimension error10.异常情形error data file11.焊锡面与零件面对位偏差misregistration12.孔塞plug hole13.要求requirement14.缺少miss15.偏公差uneven tolerance16.补偿compensation17.表面处理surface treatment18.无铅喷锡Lead free HAL19.金手指斜边bevel of G/F20.制程能力process capability21.建议,暗示suggest22.确保ensure23.满足,达到meet24.为了in order to25.交货期delivery date26.绿油桥solder mask bridge 或者solder mask dam27.根据according to28.单边3mil per side 3 mil29.直径diameter30.半径radius 31.小于3mil less than 3mil32.高于3mil more than 3 mil33.压合结构stacking structure 或者stack_up34.附件：attachedfile35.样品：sample36.文档：Document37.答复:answer;reply38.规格：spec39.与。

同样的：the same as40.前版本：previous version（old version)41.生产：production42.确认:confirm43.再次确认:confirm again44.工程问题：engineering query（EQ）45.尽快：as soon as possible46.生产文件:production Gerber47.联系某人:contactsomebody48.提交样板：submit sample49.交货期：delivery date50.电测成本：ET（electrical test)cost51.通断测试：Open and short testing52.参考：refer to53.IPC标准：IPC standard54.IPC二级:IPCclass 255.可接受的：acceptable56.允许:permit57.制造：manufacture 或者fabricate58.修改：revision59.公差:tolerance60.忽略:ignore61.工具孔：tooling hole62.安装孔：mounting hole63.元件孔:component hole64.槽孔:slot hole65.邮票孔：snap off hole 或者stamp hole66.导通孔：via hole67.盲孔：blind via hole68.埋孔：buried via hole69.金属化孔：PTH(platedthrough hole）70.非金属化孔：NPTH( no platedthrough hole）71.孔位：hole location72.避免：avoid73.原设计:original design74.修改:modify75.按原设计：follow up original design76.附边：waste tab，waste area 或者breakaway tab77.铜条：copper strip78.拼板:panel drawing79.板厚：board thickness80.删除：remove(delete）81.削铜：shave the copper82.露铜：copper exposure 或者exposed copper83.光标点：fiducial mark84.不同：be different from（differ from）85.内弧：inside radius86.焊环：annular ring87.单板尺寸：single size88.拼板尺寸:panel size89.铣,锣:routing90.铣刀：router 或者Routing bit91.楔形掏槽V—cut 或者V scoring92.哑光：matt93.光亮的:glossy94.锡珠:solder ball（solder plugs)95.阻焊：solder mask(solder resist）96.阻焊开窗：solder maskopening 97.单面开窗:single side mask opening98.补油：touch up solder mask99.补线：track welds100.毛刺：burrs101.去毛刺：deburr102.镀层厚度：plating thickness103.清洁度：cleanliness104.离子污染：ionic contamination105.阻燃性等级:flammability retardant rating 106.黑化:black oxidation107.棕化：brown oxidation108.红化：red oxidation109.可焊性不良：poor solderability110.焊料：solder111.包装:packaging112.角标：corner mark113.特性阻抗：characteristic impedance 114.正像：positive115.负片:negative116.镜像：mirror117.线宽：line width 或者trace width 118.线距：line spacing 或者trace spacing 119.做样:build sample120.按照：according to121.成品:finished122.做变更：make the change123.相类似:similar to124.规格：specification125.下移：shift down126.垂直地：vertically127.水平的：horizontally128.增大:increase129.缩小：decrease130.表面处理：Surface Finishing131.波峰焊：wave solder132.钻孔数据:drilling data133.标记：Logo134.Ul 标记:UL logo,或者Ul Marking135.蚀刻标记：etched marking136.周期：date code137.翘曲：bow and twist138.外层:outer layer 或者external layer139.内层：inner layer 或者internal layer140.顶层:top layer141.底层：bottom layer142.元件面：component side143.焊接面：solder side144.阻焊层:solder mask layer145.字符层：legend layer (silkscreen layer or over layer) 146.兰胶层：peelable SM layer147.贴片层：paste mask layer148.碳油层：carbon layer149.外形层：outline layer(profile layer）150.白油：white ink151.绿油：green ink152.喷锡：hot air leveling (HAL)153.电金,水金：flash gold154.插头镀金：plated gold edge-board contacts155.金手指：Gold-finger156.防氧化:Entek（OSP)157.沉金：Immersion gold (chem. Gold)158.沉锡：ImmersionTin(chem.Tin)159.沉银：Immersion Silver （chem。

实用文档PCB 工程部专业英文词汇词汇1.板料: material2.最低限度: minimum 或者min.3.最大限度: maximum 或者max.4.基准点(零点) datum point5.周期Date code6.V-cut余厚V-cut remain thickness7.抢电铜皮〔假铜〕dummy copper8.实物板actual board9.外形及尺寸错误dimension error10.异常情形error data file11.焊锡面与零件面对位偏差misregistration12.孔塞plug hole13.要求requirement14.缺少miss15.偏公差uneven tolerance16.补偿compensation17.外表处理surface treatment18.无铅喷锡Lead free HAL19.金手指斜边bevel of G/F20.制程能力process capability21.建议,暗示suggest22.确保ensure23.满足,到达meet24.为了in order to25.交货期delivery date26.绿油桥solder mask bridge 或者solder mask dam27.根据according to 28.单边3mil per side 3 mil29.直径diameter30.半径radius31.小于3mil less than 3mil32.高于3mil more than 3 mil33.压合结构stacking structure 或者stack_up34.附件：attached file35.样品：sample36.文档：Document37.答复：answer; reply38.规格：spec39.与...同样的：the same as40.前版本：previous version(old version)41.生产：production42.确认：confirm43.再次确认：confirm again44.工程问题：engineering query〔EQ〕45.尽快：as soon as possible46.生产文件：production Gerber47.联系某人：contact somebody48.提交样板：submit sample49.交货期：delivery date50.电测本钱：ET〔electrical test〕cost51.通断测试：Open and short testing52.参考：refer to53.IPC标准：IPC standard54.IPC二级：IPC class 255.可接受的：acceptable56.允许：permit57.制造：manufacture 或者fabricate实用文档58.修改：revision59.公差：tolerance60.忽略：ignore61.工具孔：tooling hole62.安装孔：mounting hole63.元件孔：component hole64.槽孔：slot hole65.邮票孔：snap off hole 或者stamp hole66.导通孔：via hole67.盲孔：blind via hole68.埋孔：buried via hole69.金属化孔：PTH(plated through hole)70.非金属化孔：NPTH( no plated through hole)71.孔位：hole location72.防止：avoid73.原设计：original design74.修改：modify75.按原设计：follow up original design76.附边：waste tab, waste area 或者breakaway tab77.铜条：copper strip78.拼板：panel drawing79.板厚：board thickness80.删除：remove(delete)81.削铜：shave the copper82.露铜：copper exposure 或者exposed copper83.光标点: fiducial mark84.不同：be different from(differ from)85.内弧：inside radius86.焊环：annular ring87.单板尺寸：single size 88.拼板尺寸：panel size89.铣,锣：routing90.铣刀：router 或者Routing bit91.楔形掏槽V-cut 或者V scoring92.哑光：matt93.光亮的：glossy94.锡珠：solder ball(solder plugs)95.阻焊：solder mask(solder resist)96.阻焊开窗：solder mask opening97.单面开窗：single side mask opening98.补油：touch up solder mask99.补线：track welds100.毛刺：burrs101.去毛刺：deburr102.镀层厚度：plating thickness103.清洁度：cleanliness104.离子污染：ionic contamination105.阻燃性等级：flammability retardant rating 106.黑化：black oxidation107.棕化：brown oxidation108.红化：red oxidation109.可焊性不良：poor solderability110.焊料：solder111.包装：packaging112.角标：corner mark113.特性阻抗：characteristic impedance 114.正像：positive115.负片：negative116.镜像：mirror117.线宽：line width 或者trace width实用文档118.线距：line spacing 或者trace spacing119.做样：build sample120.按照：according to121.成品：finished122.做变更：make the change123.相类似：similar to124.规格：specification125.下移：shift down126.垂直地：vertically127.水平的：horizontally128.增大：increase129.缩小：decrease130.外表处理：Surface Finishing131.波峰焊：wave solder132.钻孔数据：drilling data133.标记：Logo134.Ul 标记：UL logo,或者Ul Marking135.蚀刻标记：etched marking136.周期：date code137.翘曲：bow and twist138.外层：outer layer 或者external layer139.内层：inner layer 或者internal layer140.顶层：top layer141.底层：bottom layer142.元件面：component side143.焊接面：solder side144.阻焊层：solder mask layer145.字符层：legend layer (silkscreen layer or over layer) 146.兰胶层：peelable SM layer147.贴片层：paste mask layer 148.碳油层：carbon layer149.外形层：outline layer(profile layer)150.白油：white ink151.绿油：green ink152.喷锡：hot air leveling (HAL)153.电金,水金：flash gold154.插头镀金：plated gold edge-board contacts 155.金手指：Gold-finger156.防氧化：Entek (OSP)157.沉金：Immersion gold (chem. Gold)158.沉锡：Immersion Tin(chem.Tin)159.沉银：Immersion Silver (chem. silver) 160.单面板：single sided board161.双面板：double sided board162.多层板：multilayer board163.刚性板：rigid board164.挠性板：flexible board165.刚挠板：flex-rigid board166.铣：CNC (mill , routing)167.冲：punching168.倒角：beveling169.斜面：chamfer170.倒圆角：fillet171.尺寸：dimension172.材料：material173.介电常数：Dielectric constant174.菲林：film175.成像：Imaging176.板镀：Panel Plating177.图镀：Pattern Plating实用文档178.后清洗：Final Cleaning179.叠层：stacking structure (stack-up) 180.污染焊盘：contaminate pad181.分孔图：drill chart 或者drill map 182.度数：degree183.被…覆盖：be covered with184.负公差：minus tolerance185.标靶盘：target pad186.外形公差：routing tolerance 187.芯板：core188.半固化片Prepreg189.阻抗线：impedance trace190.评估estimate191.玻纤显露Fiber Exposure192.底铜base copper193.工作搞working Gerber194.原稿original art work195.放宽relax196.挖空blanking 或者cut-out 197.一般性阻焊油墨general resist ink 198.孔位错误mis hole location 199.压合周期press cycle200.毛边serrated edges201.跳印skip printing202.气泡blistering203.隔离焊盘isolated pad204.泪滴tear drops205.箭头arrows206.加大Enlarge207.压合周期press cycle 208.毛边serrated edges209.跳印,漏印skip printing210.宽度与厚度的比值width-to-thickness ratio 211.调整adjust212.铜箔基板copper claded laminates213.线路露铜copper exposure214.孔内异物dirty hole215.椭圆形elliptical set216.纤维突出fiber protrusion217.填充料filler218.互相连通interconnection219.改善方案implementation220.板料使用率material use factor221.回路,网络network222.缺口nick223.氧化oxidation224.剥离(剥落) peeling off225.补线不良poor touch-up226.品质等级quality classification227.对位孔registration228.拒收rejectable229.树脂含量resin content230.排列电阻resistor network231.锣刀〔铣刀〕routing bit232.孔内沾文字S/L on hole233.孔内绿漆S/M on hole234.线路沾锡solder on trace235.金手指沾锡solder on G/F236.废框scrap237.封孔处理sealing实用文档238.间距缺乏spacing non-enough239.靶位孔target hole240.测试线路test circuit241.热应力试验thermal stress242.厚度分布thickness distribution243.薄基板,内层板thin core244.线路缺口及针孔track nick & pin hole245.裁切线trim line246.真平整true leveling247.真正位置的孔true position248.万用型universal249.气化室vaporizer250.仓库warehouse251.契尖角wedge angle252.线细width reduce253.良率yield254.渗铜,渗入,灯芯效应wicking255.允收acceptable256.试样点coupon location257.经核准的，被认可的approved258.超越胜过,超过其他exceed259.牛皮纸kraft paper260.孔壁破铜Hole void261.孔位破出Hole breakoutPCB生产—经典流程—英文培训教程A. 开料( Cut Lamination)a-1 裁板( Sheets Cutting)a-2 原物料发料(Panel)(Shear material to Size) B. 钻孔(Drilling)b-1 内钻(Inner Layer Drilling )b-2 一次孔(Outer Layer Drilling )b-3 二次孔(2nd Drilling)b-4 雷射钻孔(Laser Drilling )(Laser Ablation )b-5 盲(埋)孔钻孔(Blind & Buried Hole Drilling)C. 干膜制程( Photo Process(D/F))c-1 前处理(Pretreatment)c-2 压膜(Dry Film Lamination)c-3 曝光(Exposure)c-4 显影(Developing)c-5 蚀铜(Etching)c-6 去膜(Stripping)c-7 初检( Touch-up)c-8 化学前处理,化学研磨( Chemical Milling )c-9 选择性浸金压膜(Selective Gold Dry Film Lamination) c-10 显影(Developing )c-11 去膜(Stripping )Developing , Etching & Stripping ( DES )D. 压合Laminationd-1 黑化(Black Oxide Treatment)d-2 微蚀(Microetching)d-3 铆钉组合(eyelet )d-4 叠板(Lay up)d-5 压合(Lamination)d-6 后处理(Post Treatment)d-7 黑氧化( Black Oxide Removal )d-8 铣靶(spot face)d-9 去溢胶(resin flush removal)E. 减铜(Copper Reduction)实用文档e-1 薄化铜(Copper Reduction)F. 电镀(Horizontal Electrolytic Plating)f-1 水平电镀(Horizontal Electro-Plating) (Panel Plating) f-2 锡铅电镀( Tin-Lead Plating ) (Pattern Plating)f-3 低于1 mil ( Less than 1 mil Thickness )f-4 高于1 mil ( More than 1 mil Thickness)f-5 砂带研磨(Belt Sanding)f-6 剥锡铅( Tin-Lead Stripping)f-7 微切片( Microsection)G. 塞孔(Plug Hole)g-1 印刷( Ink Print )g-2 预烤(Precure)g-3 外表刷磨(Scrub)g-4 后烘烤(Postcure)H. 防焊(绿漆/绿油): (Solder Mask)h-1 C面印刷(Printing Top Side)h-2 S面印刷(Printing Bottom Side)h-3 静电喷涂(Spray Coating)h-4 前处理(Pretreatment)h-5 预烤(Precure)h-6 曝光(Exposure)h-7 显影(Develop)h-8 后烘烤(Postcure)h-9 UV烘烤(UV Cure)h-10 文字印刷( Printing of Legend )h-11 喷砂( Pumice)(Wet Blasting)h-12 印可剥离防焊(Peelable Solder Mask)I . 镀金Gold platingi-1 金手指镀镍金( Gold Finger )i-2 电镀软金(Soft Ni/Au Plating) i-3 浸镍金( Immersion Ni/Au) (Electroless Ni/Au)J. 喷锡(Hot Air Solder Leveling)j-1 水平喷锡(Horizontal Hot Air Solder Leveling)j-2 垂直喷锡( Vertical Hot Air Solder Leveling)j-3 超级焊锡(Super Solder )j-4. 印焊锡突点(Solder Bump)K. 成型(Profile)(Form)k-1 捞型(N/C Routing ) (Milling)k-2 模具冲(Punch)k-3 板面清洗烘烤(Cleaning & Backing)k-4 V型槽( V-Cut)(V-Scoring)k-5 金手指斜边( Beveling of G/F)L. 开短路测试(Electrical Testing) (Continuity & Insulation Testing) l-1 AOI 光学检查( AOI Inspection)l-2 VRS 目检(Verified & Repaired)l-3 泛用型治具测试(Universal Tester)l-4 专用治具测试(Dedicated Tester)l-5 飞针测试(Flying Probe)M. 终检( Final Visual Inspection)m-1 压板翘( Warpage Remove)m-2 X-OUT 印刷(X-Out Marking)m-3 包装及出货(Packing & shipping)m-4 目检( Visual Inspection)m-5 清洗及烘烤( Final Clean & Baking)m-6 护铜剂(ENTEK Cu-106A)(OSP)m-7 离子剩余量测试(Ionic Contamination Test )(Cleanliness Test)m-8 冷热冲击试验(Thermal cycling Testing)m-9 焊锡性试验( Solderability Testing )N. 雷射钻孔(Laser Ablation)N-1 雷射钻Tooling孔(Laser ablation Tooling Hole)实用文档N-2 雷射曝光对位孔(Laser Ablation Registration Hole)N-3 雷射Mask制作(Laser Mask)N-4 雷射钻孔(Laser Ablation)N-5 AOI 检查及VRS ( AOI Inspection & Verified & Repaired)N-6 Blaser AOI (after Desmear and Microetching)N-7 除胶渣(Desmear)N-8 微蚀(Microetching )。

中英文对照地PCB 专业用语作者：深圳村村长 分类：英汉词汇大全 提交日期：2007-4-2 20:41:00 访问量：366综合词汇1、印制电路：printed circuit 2、印制线路：printed wiring 3、印制板：printed board 4、印制板电路： printed circuit board (pcb> 5、印制线路板： printed wiring board(pwb> 6、印制元件： printed component 7、印制接点： prin ted con tact 8、印制板装配： printed board assembly 9、 板：board单面印制板： sin gle-sided prin ted board(ssb> 双面印制板：double-sided prin ted board(dsb> 多层印制板： mulitlayer prin ted board(mlb> 多层印制电路板： mulitlayer prin ted circuit board 多层印制线路板： mulitlayer prited wiri ng board 刚性印制板：rigid prin ted board rigid sin gle-sided prin ted borad rigid double-sided prin ted borad rigid multilayer prin ted board flexible multilayer prin ted board挠性印制板：flexible printed board 挠性单面印制板：flexible si ngle-sided printed board22、 挠性双面印制板：flexible double-sided printed board 23、 挠性印制电路：flexible printed circuit (fpc> 24、挠性印制线路：flexible printed wiring 25、冈H 性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided prin ted 27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer prin ted board 28、齐平印制板：flush printed board 29、金属芯印制板：metal core printed board 30、 金属基印制板：metal base printed board31、 多重布线印制板：mulit-wiri ng prin ted board 32、 陶瓷印制板： ceramic substrate printed board33、 导电胶印制板： electroconductive paste printed board 34、模塑电路板：molded circuit board 35、 模压印制板： stamped printed wiring board10、 11、 12、 13、14、15、 16、17、 18、 19、 20、 21、 刚性单面印制板 刚性双面印制板 刚性多层印制板 挠性多层印制板36、顺序层压多层印制板：sequentially-laminated mulitlayer、 散线印制板： discrete wiri ng board 、 微线印制板： micro wire board 、 积层印制板： buile-up prin ted board 、 积层多层印制板： build-up mulitlayer prin ted board (bum> 、 积层挠印制板：build-up flexible prin ted board 、 表面层合电路板： surface lam inar circuit (slc> 、埋入凸块连印制板：b2it pri nted board 、 多层膜基板： multi-layered film substrate(mfs>、层间全内导通多层印制板：alivh multilayer prin ted board 、载芯片板：chip on board (cob> 、埋电阻板：buried resista nee board 、母板：mother board 、子板：daughter board 、背板：backplane 、裸板：bare board 、键盘板夹心板：copper- inv ar-copper board 、动态挠性板：dyn amic flex board 、静态挠性板：static flex board 、可断拼板：break-away pla nel 、电缆：cable 、挠性扁平电缆：flexible flat cable (ffc> 、薄膜开关：membra ne switch 、混合电路：hybrid circuit 、厚膜：thick film 、厚膜电路：thick film circuit 、薄膜：thin film 、薄膜混合电路：thin film hybrid circuit 、互连：interconnection 、导线：con ductor trace line 、齐平导线：flush conductor 、传输线：transmission line 、跨交：crossover 、板边插头：edge-board contact 、增强板：stiffener 、基底：substrate 、基板面：real estate 、导线面：con ductor side 、元件面：component side 、焊接面：solder side 、印制：printing 、网格：grid 、图形：pattern3738394041424344 4546 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 787980、导电图形：con ductive pattern、非导电图形：non-con ductive pattern81、字符：lege nd82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl>5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad lam in ate10、金属基覆铜层压板：metal base copper-clad lam in ate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bon di ng sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、力卩成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed lam in ate21、涂胶催化层压板：adhesive-coated catalyzed lami nate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bon di ng layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay>28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：un clad lami nate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：len gth wise direct ion37、模向：cross wise direct ion38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phe no lie cellulose paper copper-clad lami nates(phe nolic/paper ccl>40、环氧纸质覆铜箔板：epoxide cellulose paper copper-cladlam in ates (epoxy/paper ccl>41、环氧玻璃布基覆铜箔板：epoxide wove n glass fabric copper- cladlam in ates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glasscloth surfaces copper-clad lam in ates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glassrein forced copper-clad lam in ates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper- cladlam in ates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-cladlam in ates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triaz in e/epoxidewove n glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-cladlam inates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-cladlam in ates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad lam in ates51、紫外线阻挡型覆铜箔板：uv block ing copper-clad lami nates三、基材地材料1、 a 阶树脂：a-stage res in2、 b 阶树脂：b-stage res in3、 c 阶树脂：c-stage res in4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide res in8、双马来酰亚胺三嗪树脂：bismaleimide-triazi ne res in9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfu ncti onal epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silic one res in16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetti ng res in24、热塑性树脂：thermoplastic res in25、感光性树脂：photose nsitive res in26、环氧当量：weight per epoxy equivale nt (wpe>27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curi ng age nt32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (pi>38、聚四氟乙烯：polytetrafluoetylene (ptfe>39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep>40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、 e 玻璃纤维：e-glass fibre43、 d 玻璃纤维：d-glass fibre44、s 玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：wav in ess67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：coupli nt age nt77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ed copper foil>90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil>93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：res in coated copper foil (rcc>96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔<剖面)轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stai n proofi ng104、双面处理铜箔：double treated foil设计 原理图：shematic diagram 逻辑图：logic diagram 印制线路布设：printed wire layout 布设总图：master draw ing 可制造性设计：desig n-for-ma nu facturabilitycomputer-aided desig n.(cad> computer-aided manu facturi ng.(cam> computer in tegrat manu facturing.(cim> computer-aided engin eeri ng.(cae> computer-aided test.(cat>electric design automation .(eda> engin eeri ng desig n automat on .(eda2> assembly aided architectural desig n. (aaad> computer aided draw ing computer con trolled display .(ccd>布局：placement 布线：routing 布图设计：layout重布：rerouting 模拟：simulation 逻辑模拟：logic simulatio n 电路模拟：circit simulation 时序模拟：timing simulation 模块化：modularization 布线完成率：layout effecie ncy机器描述格式： mach ine descripti onm format .(mdf> 机器描述格式数据库：mdf databse 设计数据库：desig n database 设计原点：desig n origi n 优化 <设计)：optimization (design> 供设计优化坐标轴：predo minant axis 表格原点：table origin 镜像： mirroring 驱动文件：drive file 中间文件：in termediate file 制造文件：manufacturing documentation 队歹U 支撑数据库： queue support database 元件安置：comp onent positi oning 图形显示：graphics dispaly 比例因子：scaling factor 扫描填充：sca n filli ng 矩形填充：recta ngle filli ng 填充域：region filling 四、1、2、3、4、5、 6、 7、 8、 9、 10、 11、 12、 13、 14、15、 16、 17、 18、 19、 20、 21、 22、 23、 24、25、26、27、28、29、30、31、32、33、34、35、36、37、38、39、40、41、42、43、计算机辅助设计: 计算机辅助制造: 计算机集成制造:计算机辅助工程: 计算机辅助测试 电子设计自动化 工程设计自动化 组装设计自动化 计算机辅助制图 计算机控制显示、实体设计：physical desig n 、逻辑设计：logic desig n 、 逻辑电路：logic circuit 、层次设计：hierarchical desig n 、 自顶向下设计：top-dow n desig n 、 自底向上设计： bottom-up desig n 、 线网：net 、数字化：digitzing 、设计规贝 U 检查：desig n rule check ing 、走 <布）线器：router （cad>、 网络表：net list 、 计算机辅助电路分析： computer-aided circuit an alysis 、 子线网：sub net 、 目标函数：objective function 、设计后处理： post desig n process ing （pdp> 、交互式制图设计：in teractive draw ing desig n 、 费用矩阵：cost metrix 、工程图：engineering drawing 、 方块框图：block diagram 、迷宫：moze、元件密度：comp onent den sity 、 巡回售货员问题：traveli ng salesma n problem 、 自由度：degrees freedom 、 入度：out going degree 、 出度：incoming degree 、曼哈顿距离：man hatt on dista nee 、欧几里德距离：euclidea n dista nee 、网络：network 、阵列：array 、段: segment 、逻辑：logic 、 逻辑设计自动化：logic desig n automati on 、分线：separated time 、分层：separated layer 、定顺序：definite sequenee形状与尺寸： 导线 <通道）：con duct ion （track> 导线 <体）宽度：con ductor width导线距离：con ductor spaci ng 导线层：con ductor layer 导线宽度 / 间距：con ductor lin e/space 第一导线层： con ductor layer n o.1 44 45 46 47 48 49 50 51 52 53 545556 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78五、 1、 2、 3、 4、 5、6、7、8、圆形盘：round pad 方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、v 形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹<背)裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孑L环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (pth>31、余隙孔：access hole32、盲孔：blind via (hole>33、埋孔：buried via hole34、埋/ 盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (alivh>36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：Iandless hole39、中间孔：interstitial hole40、无连接盘导通孔：Iandless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：prin ted board assembly drawing52、参考基准：datum referanee b5E2RGbCAP。

综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：mulitlayer printed board(mlb)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (fpc)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs)45、层间全内导通多层印制板：alivh multilayer printed board46、载芯片板：chip on board (cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材的材料1、a阶树脂：a-stage resin2、b阶树脂：b-stage resin3、c阶树脂：c-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (wpe)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (pi)38、聚四氟乙烯：polytetrafluoetylene (ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、e玻璃纤维：e-glass fibre43、d玻璃纤维：d-glass fibre44、s玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ed copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (rcc)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae)10、计算机辅助测试：computer-aided test.(cat)11、电子设计自动化：electric design automation .(eda)12、工程设计自动化：engineering design automaton .(eda2)13、组装设计自动化：assembly aided architectural design. (aaad)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display .(ccd)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine des criptionm format .(mdf)27、机器描述格式数据库：mdf databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router (cad)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (pdp)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、v形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (pth)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (alivh)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum reference53. 光学定位点Fiducial mark。

PCB工程部专业英文词汇31.小于3millessthan3mil32.高于3milmorethan3mil词汇33.压合结构stackingstructure或者stack_up1.板料:material34.附件：attachedfile2.最低限度:minimum或者min.35.样品：sample3.最大限度:maximum或者max.36.文档：Document4.基准点(零点)datumpoint37.答复：answer;reply5.周期Datecode38.规格：spec6.V-cut余厚V-cutremainthickness39.与...同样的：thesameas7.抢电铜皮（假铜）dummycopper40.前版本：previousversion(oldversion)8.实物板actualboard41.生产：production9.外形及尺寸错误dimensionerror42.确认：confirm10.异常情形errordatafile43.再次确认：confirmagain11.焊锡面与零件面对位偏差misregistration44.工程问题：engineeringquery（EQ）12.孔塞plughole45.尽快：assoonaspossible13.要求requirement46.生产文件：productionGerber14.缺少miss47.联系某人：contactsomebody15.偏公差uneventolerance48.提交样板：submitsample16.补偿compensation49.交货期：deliverydate17.表面处理surfacetreatment50.电测成本：ET（electricaltest）cost18.无铅喷锡LeadfreeHAL51.通断测试：Openandshorttesting19.金手指斜边bevelofG/F52.参考：referto20.制程能力processcapability53.IPC标准：IPCstandard21.建议,暗示suggest54.IPC二级：IPCclass222.确保ensure55.可接受的：acceptable23.满足,达到meet56.允许：permit24.为了inorderto57.制造：manufacture或者fabricate25.交货期deliverydate58.修改：revision26.绿油桥soldermaskbridge或者soldermaskdam59.公差：tolerance27.根据accordingto60.忽略：ignore28.单边3milperside3mil61.工具孔：toolinghole29.直径diameter62.安装孔：mountinghole30.半径radius63.元件孔：componenthole133.槽孔：slothole97.单面开窗：singlesidemaskopening34.邮票孔：snapoffhole或者stamphole98.补油：touchupsoldermask35.导通孔：viahole99.补线：trackwelds36.盲孔：blindviahole100.毛刺：burrs37.埋孔：buriedviahole101.去毛刺：deburr38.金属化孔：PTH(platedthroughhole)102.镀层厚度：platingthickness39.非金属化孔：NPTH(noplatedthroughhole)103.清洁度：cleanliness40.孔位：holelocation104.离子污染：ioniccontamination41.避免：avoid105.阻燃性等级：flammabilityretardantrating42.原设计：originaldesign106.黑化：blackoxidation43.修改：modify107.棕化：brownoxidation44.按原设计：followuporiginaldesign108.红化：redoxidation45.附边：wastetab,wastearea或者breakawaytab109.可焊性不良：poorsolderability46.铜条：copperstrip110.焊料：solder47.拼板：paneldrawing111.包装：packaging48.板厚：boardthickness112.角标：cornermark49.删除：remove(delete)113.特性阻抗：characteristicimpedance50.削铜：shavethecopper114.正像：positive51.露铜：copperexposure或者exposedcopper115.负片：negative52.光标点:fiducialmark116.镜像：mirror53.不同：bedifferentfrom(differfrom)117.线宽：linewidth或者tracewidth54.内弧：insideradius118.线距：linespacing或者tracespacing55.焊环：annularring119.做样：buildsample56.单板尺寸：singlesize120.按照：accordingto57.拼板尺寸：panelsize121.成品：finished58.铣,锣：routing122.做变更：makethechange59.铣刀：router或者Routingbit123.相类似：similarto60.楔形掏槽V-cut或者Vscoring124.规格：specification92.哑光：matt125.下移：shiftdown26.光亮的：glossy126.垂直地：vertically27.锡珠：solderball(solderplugs)127.水平的：horizontally28.阻焊：soldermask(solderresist)128.增大：increase29.阻焊开窗：soldermaskopening129.缩小：decrease2WORD格式61.表面处理：SurfaceFinishing163.刚性板：rigidboard62.波峰焊：wavesolder164.挠性板：flexibleboard63.钻孔数据：drillingdata165.刚挠板：flex-rigidboard64.标记：Logo166.铣：CNC(mill,routing)65.Ul标记：ULlogo,或者UlMarking167.冲：punching66.蚀刻标记：etchedmarking168.倒角：beveling67.周期：datecode169.斜面：chamfer68.翘曲：bowandtwist170.倒圆角：fillet69.外层：outerlayer或者externallayer171.尺寸：dimension70.内层：innerlayer或者internallayer172.材料：material71.顶层：toplayer173.介电常数：Dielectricconstant72.底层：bottomlayer174.菲林：film73.元件面：componentside175.成像：Imaging74.焊接面：solderside176.板镀：PanelPlating75.阻焊层：soldermasklayer177.图镀：PatternPlating76.字符层：legendlayer(silkscreenlayeroroverlayer)178.后清洗：FinalCleaning77.兰胶层：peelableSMlayer179.叠层：stackingstructure(stack-up)78.贴片层：pastemasklayer180.污染焊盘：contaminatepad79.碳油层：carbonlayer181.分孔图：drillchart或者drillmap80.外形层：outlinelayer(profilelayer)182.度数：degree81.白油：whiteink183.被⋯覆盖：becoveredwith82.绿油：greenink184.负公差：minustolerance83.喷锡：hotairleveling(HAL)185.标靶盘：targetpad84.电金,水金：flashgold186.外形公差：routingtolerance85.插头镀金：platedgoldedge-boardcontacts187.芯板：core86.金手指：Gold-finger188.半固化片Prepreg87.防氧化：Entek(OSP)189.阻抗线：impedancetrace88.沉金：Immersiongold(chem.Gold)190.评估e stimate89.沉锡：ImmersionTin(chem.Tin)191.玻纤显露FiberExposure90.沉银：ImmersionSilver(chem.silver)192.底铜b asecopper91.单面板：singlesidedboard193.工作搞workingGerber92.双面板：doublesidedboard194.原稿originalartwork93.多层板：multilayerboard195.放宽r elaxWORD格式94.挖空blanking或者cut-out229.树脂含量resincontent95.一般性阻焊油墨generalresistink230.排列电阻resistornetwork96.孔位错误misholelocation231.锣刀（铣刀）routingbit97.压合周期presscycle232.孔内沾文字S/Lonhole98.毛边serratededges233.孔内绿漆S/Monhole99.跳印skipprinting234.线路沾锡solderontrace100.气泡blistering235.金手指沾锡solderonG/F101.隔离焊盘isolatedpad236.废框scrap102.泪滴teardrops237.封孔处理sealing103.箭头arrows238.间距不足spacingnon-enough104.加大Enlarge239.靶位孔targethole105.压合周期presscycle240.测试线路testcircuit106.毛边serratededges241.热应力试验thermalstress107.跳印,漏印skipprinting242.厚度分布thicknessdistribution108.宽度与厚度的比值width-to-thicknessratio243.薄基板,内层板thincore109.调整adjust244.线路缺口及针孔tracknick&pinhole110.铜箔基板coppercladedlaminates245.裁切线trimline111.线路露铜copperexposure246.真平整trueleveling112.孔内异物dirtyhole247.真正位置的孔trueposition113.椭圆形ellipticalset248.万用型universal114.纤维突出fiberprotrusion249.气化室vaporizer115.填充料filler250.仓库warehouse116.互相连通interconnection251.契尖角wedgeangle117.改善方案implementation252.线细widthreduce118.板料使用率materialusefactor253.良率yield119.回路,网络network254.渗铜,渗入,灯芯效应wicking120.缺口nick255.允收acceptable121.氧化oxidation256.试样点couponlocation122.剥离(剥落)peelingoff257.经核准的，被认可的approved123.补线不良poortouch-up258.超越胜过,超过其他exceed124.品质等级qualityclassification259.牛皮纸kraftpaper125.对位孔registration260.孔壁破铜Holevoid126.拒收rejectable261.孔位破出HolebreakoutWORD格式PCB生产—经典流程—英文培训教程d-8铣靶(spotface)d-9去溢胶(resinflushremoval)E.减铜(CopperReduction)A.开料(CutLamination)e-1薄化铜(CopperReduction)a-1裁板(SheetsCutting)F.电镀(HorizontalElectrolyticPlating)a-2原物料发料(Panel)(ShearmaterialtoSize)f-1水平电镀(HorizontalElectro-Plating)(PanelPlating) B.钻孔(Drilling)f-2锡铅电镀(Tin-LeadPlating)(PatternPlating)b-1内钻(InnerLayerDrilling)f-3低于1mil(Lessthan1milThickness)b-2一次孔(OuterLayerDrilling)f-4高于1mil(Morethan1milThickness)b-3二次孔(2ndDrilling)f-5砂带研磨(BeltSanding)b-4雷射钻孔(LaserDrilling)(LaserAblation)f-6剥锡铅(Tin-LeadStripping)b-5盲(埋)孔钻孔(Blind&BuriedHoleDrilling)f-7微切片(Microsection)C.干膜制程(PhotoProcess(D/F))G.塞孔(PlugHole)c-1前处理(Pretreatment)g-1印刷(InkPrint)c-2压膜(DryFilmLamination)g-2预烤(Precure)c-3曝光(Exposure)g-3表面刷磨(Scrub)c-4显影(Developing)g-4后烘烤(Postcure)c-5蚀铜(Etching)H.防焊(绿漆/绿油):(SolderMask)c-6去膜(Stripping)h-1C面印刷(PrintingTopSide)c-7初检(Touch-up)h-2S面印刷(PrintingBottomSide)c-8化学前处理,化学研磨(ChemicalMilling)h-3静电喷涂(SprayCoating)WORD格式h-4前处理(Pretreatment)c-10显影(Developing)h-5预烤(Precure)c-11去膜(Stripping)h-6曝光(Exposure)Developing,Etching&Stripping(DES)h-7显影(Develop)D.压合Laminationh-8后烘烤(Postcure)d-1黑化(BlackOxideTreatment)h-9UV烘烤(UVCure)d-2微蚀(Microetching)h-10文字印刷(PrintingofLegend)d-3铆钉组合(eyelet)h-11喷砂(Pumice)(WetBlasting)d-4叠板(Layup)h-12印可剥离防焊(PeelableSolderMask)d-5压合(Lamination)I.镀金Goldplatingd-6后处理(PostTreatment)i-1金手指镀镍金(GoldFinger)d-7黑氧化(BlackOxideRemoval)i-2电镀软金(SoftNi/AuPlating)5WORD格式i-3浸镍金(ImmersionNi/Au)(ElectrolessNi/Au)N-5AOI检查及VRS(AOIInspection&Verified&Repaired) J.喷锡(HotAirSolderLeveling)N-6BlaserAOI(afterDesmearandMicroetching)j-1水平喷锡(HorizontalHotAirSolderLeveling)N-7除胶渣(Desmear)j-2垂直喷锡(VerticalHotAirSolderLeveling)N-8微蚀(Microetching)j-3超级焊锡(SuperSolder)j-4.印焊锡突点(SolderBump)K.成型(Profile)(Form)k-1捞型(N/CRouting)(Milling)k-2模具冲(Punch)k-3板面清洗烘烤(Cleaning&Backing)k-4V型槽(V-Cut)(V-Scoring)k-5金手指斜边(BevelingofG/F)L.开短路测试(ElectricalTesting)(Continuity&InsulationTesting)l-1AOI光学检查(AOIInspection)l-2VRS目检(Verified&Repaired)l-3泛用型治具测试(UniversalTester)l-4专用治具测试(DedicatedTester)l-5飞针测试(FlyingProbe)M.终检(FinalVisualInspection)m-1压板翘(WarpageRemove)m-2X-OUT印刷(X-OutMarking)m-3包装及出货(Packing&shipping)m-4目检(VisualInspection)m-5清洗及烘烤(FinalClean&Baking)m-6护铜剂(ENTEKCu-106A)(OSP)m-7离子残余量测试(IonicContaminationTest)(CleanlinessTest)m-8冷热冲击试验(ThermalcyclingTesting)m-9焊锡性试验(SolderabilityTesting)N.雷射钻孔(LaserAblation)N-1雷射钻Tooling孔(LaserablationToolingHole)N-2雷射曝光对位孔(LaserAblationRegistrationHole)N-3雷射Mask制作(LaserMask)N-4雷射钻孔(LaserAblation)。