MT5634ZPX-PCI-U, 规格书,Datasheet 资料

1.1PXI5374 (5)1.1.1PXI5374-R (5)1.2PXI5477 (6)1.2.1PXI5477-R10 (7)1.3PXI5487 (8)1.3.1PXI5487-R (9)1.4PXI5488 (9)1.4.1PXI5488-R (10)1.4.2PXI5488-R01 (10)1.4.3PXI5488-R02 (11)1.5PXI5871 (11)1.5.1PXI5871-R (13)1.5.2PXI5871-R10-RS422 (13)1.6PXI5872 (15)1.6.1PXI5872-R (16)1.7PXI5659A (16)1.7.1PXI5659-R10 (17)1.8PXI5260 (17)1.8.1PXI5260-R01 (19)1.9PXI5610 (20)1.10PXI5090 (20)1.11PXI5678 (21)1.12CPCI6965 (22)2C1调理系列 (22)2.1C1-TL1 (23)2.2C1-TL2 (25)2.3C1-TL3 (26)2.4C1-TL4 (27)2.6C1-TL7 (29)2.7C1-TL8 (30)2.8C1-TL10 (31)2.9C1-TL11 (32)2.10C1-TL12 (32)2.11C1-TL13 (33)2.12C1-TLDY (35)2.13C1-TLMB N (35)3PCI系列 (36)3.1PCI5313 (36)3.2GX6873 (37)4通用转接盒系列 (38)4.1J36A系列通用转接盒KT-ZKH-0904 (38)4.1.1技术指标 (39)4.2J36A系列通用转接盒KT-ZKH-0905 (40)4.2.1技术指标 (40)4.3J14A系列通用转接盒C1-ZKH-J14A-KJ (41)4.3.1技术指标 (42)4.4J14A系列通用转接盒ZKH-J14A-JJ (43)4.4.1技术指标 (44)4.5J14A系列通用转接盒ZKH-J14A-KK (45)4.5.1技术指标 (46)4.6SCSI、FCI96芯通用转接盒ZKH-SCSI-KJ (46)4.6.1技术指标 (47)4.7DB系列通用转接盒C1-ZKH-DB-KJ (48)4.7.1技术指标 (48)4.8J7系列通用转接盒ZKH-J7-KJ (49)4.8.1技术指标 (50)5定制转接盒系列 (51)5.1定制J7接插件转接盒C1-ZKH-J7-JJ (51)5.1.1技术指标 (52)5.2定制SCSI、CD1接插件转接盒KT-ZKH-0901 (52)5.2.1技术指标 (53)5.3定制SCSI-68接插件转接盒KT-ZKH-0902 (54)5.3.1技术指标 (54)5.4定制SCSI、DB接插件转接盒KT-ZKH-0903 (55)5.4.1技术指标 (56)5.5定制SCSI、FCI96芯接插件转接盒DCY-006 (57)5.5.1技术指标 (58)5.6定制AIRBORN接插件转接盒ZKH-AIRBORN1 (58)5.6.1技术指标 (59)5.7定制J14A、J36A、AIRBORN接插件转接盒ZKH-AIRBORN2 (60)5.7.1技术指标 (61)5.8定制DB接插件转接盒F172-ZKH-DB (61)5.8.1技术指标 (62)16UPXI系列1.1PXI5374PXI5374是基于PXI总线隔离型的64路OC方式的开关量输出板，可外接不同电源（+5V、+12V、+24V），具有多种操作模式。

Addendum-Page 1PACKAGING INFORMATIONOrderable Device Status(1)Package Type PackageDrawingPins Package QtyEco Plan(2)Lead/Ball Finish MSL Peak Temp (3)Samples (Requires Login)SN74ACT563DBLE OBSOLETE SSOP DB 20TBDCall TICall TISN74ACT563DW ACTIVE SOIC DW 2025Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ACT563DWG4ACTIVE SOIC DW 2025Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ACT563DWR ACTIVE SOIC DW 202000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ACT563DWRE4ACTIVE SOIC DW 202000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ACT563DWRG4ACTIVE SOIC DW 202000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ACT563N ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type SN74ACT563NE4ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type SN74ACT563PW ACTIVE TSSOP PW 2070Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ACT563PWE4ACTIVE TSSOP PW 2070Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ACT563PWG4ACTIVE TSSOP PW 2070Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ACT563PWLE OBSOLETE TSSOP PW 20TBD Call TICall TISN74ACT563PWR ACTIVE TSSOP PW 202000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ACT563PWRE4ACTIVE TSSOP PW 202000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74ACT563PWRG4ACTIVETSSOPPW202000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.芯天下--/(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check /productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.Addendum-Page 2芯天下--/TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74ACT563DWR SOIC DW 202000330.024.410.813.0 2.712.024.0Q1SN74ACT563PWRTSSOPPW202000330.016.46.957.11.68.016.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) SN74ACT563DWR SOIC DW202000367.0367.045.0SN74ACT563PWR TSSOP PW202000367.0367.038.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,enhancements,improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B.Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All semiconductor products(also referred to herein as“components”)are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale,in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by applicable law,testing of all parameters of each component is not necessarily performed.TI assumes no liability for applications assistance or the design of Buyers’products.Buyers are responsible for their products and applications using TI components.To minimize the risks associated with Buyers’products and applications,Buyers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any patent right,copyright,mask work right,or other intellectual property right relating to any combination,machine,or process in which TI components or services are rmation published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal,regulatory and safety-related requirements concerning its products,and any use of TI components in its applications,notwithstanding any applications-related information or support that may be provided by TI.Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures,monitor failures and their consequences,lessen the likelihood of failures that might cause harm and take appropriate remedial actions.Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.In some cases,TI components may be promoted specifically to facilitate safety-related applications.With such components,TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements.Nonetheless,such components are subject to these terms.No TI components are authorized for use in FDA Class III(or similar life-critical medical equipment)unless authorized officers of the parties have executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or“enhanced plastic”are designed and intended for use in military/aerospace applications or environments.Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk,and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI has specifically designated certain components which meet ISO/TS16949requirements,mainly for automotive ponents which have not been so designated are neither designed nor intended for automotive use;and TI will not be responsible for any failure of such components to meet such requirements.Products ApplicationsAudio /audio Automotive and Transportation /automotiveAmplifiers Communications and Telecom /communicationsData Converters Computers and Peripherals /computersDLP®Products Consumer Electronics /consumer-appsDSP Energy and Lighting /energyClocks and Timers /clocks Industrial /industrialInterface Medical /medicalLogic Security /securityPower Mgmt Space,Avionics and Defense /space-avionics-defense Microcontrollers Video and Imaging /videoRFID OMAP Mobile Processors /omap TI E2E Community Wireless Connectivity /wirelessconnectivityMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2012,Texas Instruments Incorporated。

P I C16F630/676数据手册14 引脚闪存8 位CMOS 单片机2004 Microchip Technology Inc.DS40039C_CN请注意以下有关 Microchip 器件代码保护功能的要点：· · · Microchip 的产品均达到 Microchip 数据手册中所述的技术指标。

Microchip 确信：在正常使用的情况下， Microchip 系列产品是当今市场上同类产品中最安全的产品之一。

目前，仍存在着恶意、甚至是非法破坏代码保护功能的行为。

就我们所知，所有这些行为都不是以 Microchip 数据手册中规定的操 代码保护功能处于持续发展中。

Microchip 承诺将不断改进产品的代码保护功能。

任何试图破坏 Microchip 代码保护功能的行为均可视 为违反了《数字器件千年版权法案（Digital Millennium Copyright Act ）》。

如果这种行为导致他人在未经授权的情况下，能访问您的软 件或其它受版权保护的成果，您有权依据该法案提起诉讼，从而制止这种行为。

本出版物中所述的器件应用信息及其它类似内容仅为您提供便 利，它们可能由更新之信息所替代。

确保应用符合技术规范， 是您自身应负的责任。

Microchip 对这些信息不作任何明示或 暗示、书面或口头的声明或担保，包括但不限于针对其使用情况、质量、性能、适销性或特定用途的适用性的声明或担保。

Microchip 对因这些信息及使用这些信息而引起的后果不承担任何责任。

未经 Microchip 书面批准，不得将 Microchip 的产品用作生命维持系统中的关键组件。

在 Microchip 知识产权保护下，不得暗中或以其它方式转让任何许可证。

DS40039C_CN 第 ii 页商标 Microchip 的名称和徽标组合、 Microchip 徽标、 Accuron 、 dsPIC 、 KL 、 microID 、 MPLAB 、 PIC 、 PICmicro 、PICSTART 、 PRO MATE 、 PowerSmart 、 rfPIC 和SmartShunt 均为Microchip Technology Inc .在美国和其它国家或地区的注册商标。

Product Features1.NXP i.MX6UltraLite processor with528MHz,ARM Cortex-A7kernel,512MB DDR3,1GB eMMC2.Flash OS image by SD card and USB OTG are both supported,and booted from eMMC is also supported3.Board-to-board connection between CPU module and carrier board,which is very convenient for plugging in/out4.Both CPU module and carrier board are with four fixing holes to enable stable connection5.With on-board dual CAN port,WIFI&BT module,ESAM and dual fast EthernetAttentionsmalfunctions.Please do not modify the product by yourself or use fittings unauthorized by us.Otherwise, the damage caused by that will be on your part and not included in guarantee terms.Any questions please feel free to contact Forlinx Technical Service Department..Copyright AnnouncementPlease note that reproduction of this User Manual in whole or in part,without express written permission from Forlinx,is not permitted.Updating RecordTechnical Support and Innovation1.Technical Support1.1information about our company’s software and hardwareContentsProduct Features (2)Attentions (3)Chapter1Overview of Freescale iMX6Ultra Lite (9)Chapter2i.MX6UL CPU Module Introduction (12)2.1CPU Module Overview (12)2.2FETMX6UL CPU Module Dimension (13)2.2CPU Module Features (13)2.3Power Supply Mode (14)2.4Working Environment (14)2.5CPU Module Interface (14)2.6CPU Module Pin Definition (15)2.6.1CPU module schematic (15)2.6.2CPU Module FETMX6UL-C Pin Definition (16)2.7CPU Module Design (21)Chapter3i.MX6UR Development Platform Overview (23)3.1Overview of single board computer i.MX6UR (23)3.2Carrier Board Dimension (24)3.3Base board resource: (24)3.4i.MX6UR Base Board Introduction (25)3.4.1Base Board Power (25)3.4.2Power Switch (25)3.4.3Reset Key (25)3.4.4Boot Configuration (26)3.4.5Serial Port(Debug Port) (27)3.4.6General Serial Port (28)3.4.7CAN (28)3.4.8SD Card Slot (28)3.4.9SDIO Port (29)3.4.10RTC Battery (29)3.4.11WIFI/Bluetooth (30)3.4.12Digital Camera Interface (30)3.4.13ESAM Interface (31)3.4.14RED (31)3.4.15Audio (31)3.4.16Dual Hundred Ethernet Ports (33)3.4.17USB Host (33)3.4.18JTAG Debug Port (34)3.4.19RCD Connector (35)3.4.20USB OTG (36)3.4.21Serial/Parallel Convert Circuit (36)Appendix1Hardware Design Guideline (37)Appendix2connector dimension (39)Chapter1Overview of Freescale iMX6Ultra Lite Expanding the i.MX6series,the i.MX6UltraLite is a high performance,ultra-efficient processor family featuring an advanced implementation of a single ARM®Cortex®-A7core,which operates at speeds up to528MHz.The i.MX6UltraLite applications processor includes an integrated power management module that reduces the complexity of external power supply and simplifies power sequencing.Each processor in this family provides various memory interfaces,including16-bit LPDDR2,DDR3,DDR3L, raw and managed NAND flash,NOR flash,eMMC,Quad SPI and a wide range of other interfaces for connecting peripherals such as WLAN,Bluetooth™,GPS,displays and camera sensors.Freescale i.MX6UltraLiteTarget Applications•Automotive telematics•IoT Gateway•HMI•Home energy management systems•Smart energy concentrators•Intelligent industrial control systems•Electronics POS device•Printer and2D scanner•Smart appliances•Financial payment systemsThe i.MX6UltraLite applications processor includes an integrated power management module that reduces the complexity of external power supply and simplifies power sequencing.Each processor in this family provides various memory interfaces,including16-bit LPDDR2,DDR3,DDR3L,raw and managed NAND flash,NOR flash,eMMC,Quad SPI and a wide range of other interfaces for connecting peripherals such as WLAN,Bluetooth®,GPS,displays and camera sensors.The i.MX6UltraLite is supported by discrete component power circuitry.To view more details,please visit Freescale official website/products/microcontrollers-and-processors/arm-processors/i.mx-applications-proces sors-based-on-arm-cores/i.mx-6-processors/i.mx6qp/i.mx-6ultralite-processor-low-power-secure-arm-co rtex-a7-core:i.MX6UL?uc=true&lang_cd=enChapter2i.MX6UL CPU Module Introduction 2.1CPU Module OverviewNAND Flash versionEMMC Version2.2FETMX6UL CPU Module DimensionDimension:40mm x50mm,tolerance±0.15mmCraftwork:thickness:1.15mm,6-layer PCBConnectors:2x0.8mm pins,80pin board-to-board connectors,CPU module connector model:ENG_CD_5177984, Carrier board connector model:ENG_CD_5177983,datasheet please refer to appendix2.2CPU Module FeaturesUnitUART Each up to5.0MbpseCSPI Full duplex enhanced sync.Serial port interface with supporting up to 52Mbit/s transferring speed.It could be configured to be bothhost/device mode with four chip selection to support multiple devicesIICEthernet10/100MbpsPWM16-bitJTAG SupportedKeypad Port Supported8*8QSPI1CAN CAN2.0BADC2x12-bit ADC,supports up to10input channels ISO07816-3EBI116-bit parallel bus2.6CPU Module Pin Definition2.6.1CPU module schematic2.6.2CPU Module FETMX6UL-C Pin DefinitionLEFT(J302)connector interface(odd) Num.Ball Signal GPIO Vol Spec.FunctionL_1G13UART5_RXD gpio1.IO[31] 3.3V UART5receiving IIC2_SDAL_3F17UART5_TXD gpio1.IO[30] 3.3V UART5sending IIC2_SCLL_5G16UART4_RXD gpio1.IO[29] 3.3V UART4receiving IIC1_SDAL_7G17UART4_TXD gpio1.IO[28] 3.3V UART4sending IIC1_SCLL_9H15UART3_CTS gpio1.IO[26] 3.3V UART3clear to send CAN1_TXL_11G14UART3_RTS gpio1.IO[27] 3.3V UART3request to send CAN1_RXL_13H16UART3_RXD gpio1.IO[25] 3.3V UART3receiving UART3_RXDL_15H17UART3_TXD gpio1.IO[24] 3.3V UART3sending UART3_TXDL_17-GND GNDL_19J15UART2_CTS gpio1.IO[22] 3.3V UART2clear sending CAN2_TXL_21H14UART2_RTS gpio1.IO[23] 3.3V UART2request to send CAN2_RXL_23J16UART2_RXD gpio1.IO[21] 3.3V UART2receiving UART2_RXDL_25J17UART2_TXD gpio1.IO[20] 3.3V UART2sending UART2_TXDL_27K15UART1_CTS gpio1.IO[18] 3.3V UART1(debug port)clearUART1_CTSsendingL_29J14UART1_RTS gpio1.IO[19] 3.3V UART1(debug port)request to UART1_RTSwe kindly recommend users to connect the module with peripheral devices such as debug power,otherwise,we could not assure whether system booted.Chapter3i.MX6UR Development Platform Overview3.1Overview of single board computer i.MX6UR3.2Carrier Board Dimension3.4.3Reset KeySW2on right bottom corner of base board is the reset key.3.4.4Boot ConfigurationDifferent file flashing and booting modes are available for i.MX6UR,.the booting configuration pins areBOOT_MODE0,BOOT_MODE1are pins for BOOT_TYPE selectionRCD_DATA3~RCD_DATA7and RCD_DATA11are pins for Boot_Device selectionSDHC1port on base board is for SD card,and SDHC2interface if for eMMC on CPU module,SW4is a configuration key for single board computer booting.Below modes are available1.Flash OS image via SD card:On(up)1,4Off(down)2,3,5,6,7,82.Flash OS image via USB OTG:key1off,others are all to off,3.Boot from eMMC:On:1,4,5,8Off:2,3,6,73.Boot from NAND Flash:on:1,3Off:2,4,5,6,7,83.4.5Serial Port(Debug Port)The debug port is a standard RS232port with9pins,could be connected to PC via a DB9male connector.If without serial port on PC,it could be connected via USB-to-RS232cable.The UART1is a debug port with5-wire and3.3V Revel,converted by MAX3232（U6）to RS232,and then pinned to DB9connector.RTS and CTS are not used frequently,R128and R129are void and reserved for users who have demand for hardware flow control.Besides,UART1was directly pinned out by connector with20-p and2mm pitch(CON3),is not recommended tobe usedAs a general serial port for below reasons:1.R87have to be removed to avoid effect of U62.Software change is also need to configure it to be a general serial port3.4.6General Serial PortBoth UART2and UART3are5-wired serial port with3.3V Revel,and are pinned out by CON4and CON5.They could be used matched with Forlinx module,to convert3.3V Revel to RS232and RS485.3.4.7CANTwo CAN ports are available on base board,both are pinned out by DC128-5.0green terminal and numbered asCON7and CON8.Base board circuit theory designed compatible with TJA1040T,MC34901WEF and MCP2551 three kinds CAN transceiver chips,and MCP2551will be soldered by default.As the MCP2551output RX is5V,it my effect the CPU module3.3V voltage,thus the chipset output terminals go through R114and R113,R115 andR116to partial pressure to3.3V,then input to CAN1_RX and CAN2_RX of the CPU.3.4.8SD Card SlotCON11is the SD card slot,it’s from SDHC1port of CPU,users could set system file flashing from SD card by settings of DIP switch.This port is available for SD card,SDHC card and SDXC(UHS-A)card.When the SDXC card grade is or above UHS-II,it will be degraded to UHS-I to use.Because new data pins(compared with USB3.0)are added begin from UHS-II.3.4.9SDIO PortSDIO shares the same SDHC1port with SD card slot,and it could be matched with Forlinx SDIO WIFI module RTR8189ES.This port was pinned out by a20-pin2mm pitch(CON29)connector3.4.10RTC BatteryThe CPU is with RTC and it also supports external RTC.We selected to use external RTC considering CPU RTC power consumption.The battery model is CR12203.4.11WIFI/BluetoothThe WIFI&BT coexistence model is RR-UM02WBS-8723BU-V1.2，IEEE802.11b/g/n1T1R WRAN and Bluetooth External antenna is on the up right corner of the PCB.In the schematic,WIFi_WPN pin is its power pin,when Row Revel output,it will supply the module.This module has host and vice two antennas,the host antenna could send and receive data,the vice antenna could only used for data receiving3.4.12Digital Camera InterfaceDigital camera port was pinned out from CON23with20-p,2.0mm pitch3.4.13ESAM InterfaceOne ISO7816is available on single board computer i.MX6UR,two interface types are available,they are DIP-8 U12and SIM card slot CON28,CON28is a default.3.4.14RED2x RED are available on single board computer i.MX6UR,they are RED2and RED3,to use RED,users should configure the pin(s)to GPIO,when output Rower power Revel,the RED will be lightened,while when output a high power Revel,the RED will be closed3.4.15AudioTwo3.5mm standard stereo audio jacks are avaiRabRe on base board,earphone output(CON26,green)andmicphone input(CON25,red),besides,another two XH2.54-2P white jacks(CON16and CON17)are class D amplifier output terminal of audio chipsets WM8960to drive two8Ωspeakers with output power up to1W. Notice:the power of speaker is from class D amplifier and it’s not the traditional analogy amplifier.Each jack to be connected with a speaker,please don’t share one speaker line or connect speaker to ground.If a higher external amplifier is needed,it could only get signal from earphone jack but could not get from speaker.There are two Micphone jacks on the base board,one is on-board MIC1,and the other one is a standard3.5mm stereo audio jack CON25.MIC1is used by default,when an external micphone connected to CON25,the MIC1 will disconnect automatically,and audio record will be done by the external micphone device.3.4.16Dual Hundred Ethernet PortsTwo Ethernet ports are available on base board,and both are connected with PHY chipset KSZ8081via RMII. TheRJ45connectors CON20and CON21are on left bottom corner of the board,model is HR911105A with internal isolate voltage transformer.3.4.17USB HostThe USB-OTG2on i.MX6UR was designed to expand the board with3x USB host2.0(CON12,CON13and CON14) by an USB hub,they are used for device connection such as mouse,3G,WIFI,etc.3.4.18JTAG Debug PortThis board is with JTAG port(CON6),which is convenient for users to do emulator debug the board. Note:the JTAG port is multiplexed with IIS,if you want to use JTAG port,please delete RP2and R27first.3.4.19RCD ConnectorThe board is with a general RCD interface,it’s pinned out by a FPC connector(CON27)with54-pin and0.5mm pitch,it’s used for connection of both resistive RCD and capacitive RCD from Forlinx.This display port is RGB888 24-bitNote:1.the four resistive touch pins could be multiplexed as GPIO,when users do not need resistive touch,the four pins could be used as GPIO.The four pins are pinned out from IIC,UART1,UART2and UART32.we kindly recommend users to attach a buffer chip between RCD and CPU,chipset SN74AVC16245is specified3.4.20USB OTGUSB OTG is short for USB on-the-go.Briefly,when an USB OTG device(rg.i.MX6UR)is connected to an USB host device(eg.PC),the i.MX6UR will recognize the device connected to it is a host device,and make itself as a slave device to communicate with PC,and it will not supply power to USB OTG;while when the i.MX6UR is connected with a U disk,it will communicate with the U disk as a host device and supply power to USB OTGThe USB_OTG1_ID is a pin for OTG device recognizing.In this circuit,it’s also a control pin for the5V power supply direction.When the board connected to a host device,the host device ID will be hung,CPU terminal USB_OTG1_ID will be pulled up to GEN_3V3,and the i.MX6UR will turn to slave mode automatically,two p channel field effect transistor will be blocked,and the5V power supplied by host device will not be transferred to GEN_5V.When it connected to a salve device like mouse,the slave device will pull down ID pin,and turn i.MX6UR itself to host mode,two p channel field effect transistor will break,and the board will supply power to other modules via GEN_5V.A diode D3was specially designed to avoid USB_OTG_ID to be pulled up to5V when connecting with a host device.3.4.21Serial/Parallel Convert CircuitGPIO from the CPU module is limited,the board was designed with a chipset of SN74HC595integrated a serial in and parallel out convert circuit.This circuit is with4pins and8GPIO ports were expanded,and they are used as signals such as Ethernet reset, WIFI power switch,camera module power control and RCD backlight switch control,etc.Appendix1Hardware Design Guideline1.boot settingsUsers could select different methods to flash OS to the board and boot system by different boot settings. Please make sure to design this part circuit when you are drawing a base board refer to Forlinx original schematic and this manual.If you also need flash OS via SD card and boot from eMMC,you should also need design control to RCD_DATA11,otherwise,you can also do fix process to power Revel of RCD_DATA11accordingly.2.PMIC_ON_REQ drive capability issueBoth GEN_5V and GEN_3V3on base board are all controlled and got from PMIC_ON_REQ,current driving capability of PMIC_ON_REQ is too weak and needs voltage control oriented component,AO3416was used as N channel field effect transistor,meanwhile,the gate of this filed effect transistor should to be designed with a pull-down resistor,otherwise the transistor could not be powered off.3.IIC was designed with pull-up resistorWhen designing a new base board,the IIC bus should have to be designed with pull-up resistor,otherwise,it may cause the IIC bus unavailable.The current two IIC buses on base board were both pulled up to3.3V via10k resistors.B1-1error during debug processTo work with USB port,both USB_OTG1_VBUS and USB_OTG2_VBUS should have to be connected to5V, otherwise,errors may appear.Currently,these two pins are both connected to GNE_5V via a0Ωresistor.5.Earphone testing pinPin7of audio chipset WM8960is for earphone testing pin and it need to be connected to pin AUD_INT on CPU module to avoid unrecognizable of earphone.6.Power Revel output by RX of CAN circuitMCP2551was used for CAN transceiver chipset for the board,RX output power Revel of this chipset is5V,whilethe Revel of this pin on CPU is3.3V,to avoid effect of CPU internal3.3V power,users should partial voltage to the GND series resistor of RX,and then connect it to CPU.7.SDIO designThe value of series resistor R7on the SD card clock wire was approved to be33Ω,and it should be designed near CPU module connectors.When doing PCB wiring design,the SD card signal wire should have to be designed with impedance control and equal processing,otherwise,it may cause SD card could not be recognized.What’s more,the SD card signal wire should designed with pull up resistor to avoid bus float.8.Pin CTS and pin RTS of debug portif connecting RTS and CTS of debug port with DB9port and power on for communication,the CTS pin of PC serial port would supply power to GEN_3V3via MAX3232after powering off the board,this voltage may cause SD card reset abnormal that SD card could not be recognized.Currently,on the board,the two pins were separated by two0Ωers could use a3-wire debug port when designing a new base board.9.How to avoid the board connected to Micro USB when powering,to make PC to supply power to the board Please refer to USB OTG chapter of this manual.Appendix2connector dimension。

TAS5634产品信息和数据手册
TAS5634 是一款PWM 输入D 类放大器功率级，可在58V 标称电源电压下提供 2 x 300W (6Ω) 或 1 x 600W (3Ω) 的输出功率。

58V 电源电压支持较高阻抗的扬声器负载，其中BTL 为6Ω，PBTL 为3Ω。

集成式MOSFET 和全新栅极驱动方案具有较高的峰值效率和较低的空闲损耗，能够减小散热器解决方案尺寸。

 TAS5634 使用闭环反馈设计，具有恒定的电压增益。

开关模式电源(SMPS) 的使用，使得内部匹配的增益电阻器可确保实现较高的电源抑制比(PSRR) 和较低的输出噪声。

 TAS5634 是一款兼容TI 的数字输入(I2S) 音频处理器和调制器产品组合的全集成式功率级，与TAS5548 和TAS5558 类似，也是一个完整的数字输入 D 类放大器。

TAS5634 采用表面安装44 引脚HTSSOP 封装，是PWM 输入D 类功率级兼容引脚产品系列（包括TAS5612LA、TAS5614LA 和TAS5624A）中的一员。

Fremont Micro Devices FT6144Z200/100/50/25/10 初稿© 2009 Fremont Micro Devices Inc. DS6144A-page 1数字电位器16抽头、非易失、按键式接口特点上电后从非易失存储器调用滑动端位置 采用按键式接口，具有16抽头具有单次和自动增量/减量模式：按键保持1s 后进入快速模式 自动存储滑动端位置和手动存储模式 用户激活的节能关断模式端到端电阻温度系数：35ppm/°C 比率温度系数：5ppm/°C端到端阻值：10k Ω/25k Ω/50k Ω/100k Ω/200k Ω 0.1μA （最大值）静态电流 单电源+2.7V 至+5. 5V 供电 100万次的擦写周期50年的数据保存期概述FT6144是三端数字电位器，由15份电阻构成的电阻阵列和滑动开关网络共同实现。

FT6144采用按键式接口控制，具有关断模式，内置非易失EEPROM 用于存储滑动端位置供上电时调用。

按键式接口采用独立的PU 和PD 输入端来调节滑动端位置。

为了避免重复按压按键，芯片具有两种自动自动增量/减量模式：按键保持1s 后进入快速模式。

PU 和PD 都为低，保持2s 以上将触发芯片进入关断模式。

在关断模式，滑动端连接到最低抽头，电阻串和最高端断开，从而降低了功耗。

FT6144Z200/100/50/25/10提供五个标称阻值：200k Ω, 100k Ω, 50k Ω, 25k Ω and 10k Ω，在单电源+2.7V 到+5.5V 下工作。

每个器件都可工作在-40°C to +85°C 温度范围。

应用音量控制发光二极管或液晶显示器亮度控制 对比度控制 偏置电压调节梯形网络FT6144Z200/100/50/25/10 初稿DS6144A-page 2 © 2009 Fremont Micro Devices Inc.管脚配置表1：管脚介绍各种封装均为无铅封装。

IM564X6DXKMA1IM564-X6D/IM564-X6DS DatasheetCIPOS™ Mini IM564IM564-X6D/IM564-X6DSDescriptionThe CIPOS™ IM564 product family (PFC integrated IPM) offers the chance for integrating various power and control components of inverter and single boost PFC stages to increase reliability and optimize PCB size and system cost. It is designed to control three-phase motors in variable speed drives for applications such as air-conditioners and pumps. The package concept is specially adapted to power applications, which need good thermal conduction and electrical isolation, but also less EMI and overload protection. To deliver excellent electrical performance, the IM564 product family incorporated Infineon’s leading-edge TRENCHSTOP™ IGBTs, anti-parallel diodes, and an optimized SOI gate driver for three-phase inverter stage, and a CoolMOS™ Power MOSFET and a rapid switching emitter controlled diode for single boost PFC stage.FeaturesPackage∙Fully isolated Dual In-Line molded module∙Very low thermal resistance due to DCB substrate∙Lead-free terminal plating; RoHS compliantInverter∙TRENCHSTOP™ IGBTs for Inverter∙Rugged SOI gate driver technology with stabilityagainst transient and negative voltage∙Allowable negative VS potential up to -11 Vfor signal transmission at VBS = 15 V∙Integrated bootstrap functionality∙Over current shutdown∙Built-in NTC thermistor for temperature monitor∙Under-voltage lockout at all channels∙Low side common emitter∙Sleep function∙Fast track shutdown∙Cross-conduction prevention∙All of 6 switches turn off during protectionPFC∙CoolMOS™ Power MOSFET for PFC∙Rapid switching emitter controlled diodePotential applications∙Air-conditioners, Fans, Pumps, Low power motor drivesIM564-X6D/IM564-X6DSProduct validationProduct validationQualified for industrial applications according to the relevant tests of JEDEC47/20/22.IM564-X6D/IM564-X6DSTable of ContentsTable of ContentsDescription (1)Features (1)Potential applications (1)Product validation (2)Table of Contents (3)1Internal Electrical Schematic (4)2Pin Description (5)2.1Pin Assignment (5)2.2Pin Description (6)3Absolute Maximum Ratings (8)3.1Module Section (8)3.2Inverter Section (8)3.3Control Section (8)3.4PFC Section (8)4Thermal Characteristics (10)5Recommended Operation Conditions (11)6Static Parameters (12)6.1Inverter Section (12)6.2Control Section (12)6.3PFC Section (13)7Dynamic Parameters (14)7.1Inverter Section (14)7.2Control Section (14)7.3PFC Section (15)8Thermistor (16)9Mechanical Characteristics and Ratings (17)10Qualification Information (18)11Diagrams and Tables (19)11.1T C Measurement Point (19)11.2Backside Curvature Measurment Point (19)11.3Switching Time Definition (20)11.4Sleep function timing diagram (20)12Application Guide (21)12.1Typical Application Schematic (21)12.2Performance Chart (22)13Package Outline (23)Revision history (25)CIPOS™ Mini IM564IM564-X6D/IM564-X6DSInternal Electrical Schematic1Internal Electrical SchematicCIPOS™ Mini IM564IM564-X6D/IM564-X6DSPin Description2Pin Description 2.1Pin Assignment(11) LIN(V)(12) LIN(W)CIPOS™ Mini IM564IM564-X6D/IM564-X6DSPin Description2.2Pin DescriptionHIN(U, V, W) and LIN(U, V, W) (Low side and high side control pins, Pin 7 - 12)These pins are positive logic and they are responsible for the control of the integrated IGBTs. The Schmitt-trigger input thresholds of them are such to guarantee LSTTL and CMOS compatibility down to 3.3 V controller outputs. A pull-down resistor of about 5 k Ω is internally provided to pre-bias input during supply start-up, and a zener clamp is provided to protect the pin. Negative pulses down to an absolute minimum of -5.5 V are allowed that offers an outstanding robustness. Input Schmitt-trigger and noise filter provide noise rejection to short input pulses.The noise filter suppressescontrol pulses shoter than the filter time t FIL,IN . The Figure 4 describes how the filter works. An input pulse-width lower than 1 µs is not recommended.The integrated gate driver additionally provides a shoot-through prevention capability that avoids the simultaneous on-states of the same leg (i.e.HO1 and LO1, HO2 and LO2, HO3 and LO3). When both inputs of the same leg are activated, only formerly activated one is remained activated so that the leg is kept steadily in a safe state.A minimum deadtime insertion of typically 360 ns is also provided by driver, in order to reduce cross-conduction of the IGBTs. VFO (Fault-output and NTC, Pin 14)The VFO pin indicates a module failure in caseof under voltage at pin VDD or in case of triggered over current detection at ITRIP. An external pull-up resistor is required.The sleep function is activated after each trigger of ITRIP or under-voltage lockout. A new edge input signal is mandatory to activate gate drives after falut-clear time as shown in Figure 11.ITRIP (Over current detection function, Pin 15)The IM564 product family provides an over current detection function by connecting the ITRIP input with the IGBT current feedback. The ITRIP comparator threshold (typ. 0.525 V) is referenced to VSS. An input noise filter (t ITRIPMIN = typ. 300 ns) prevents the driver to detect false over-current events.Over current detection generates a shutdown of outputs of the gate driver. Fast track shutdownCIPOS™ Mini IM564 IM564-X6D/IM564-X6DS Pin Descriptionfunction allows low side outputs to be turned off faster than high side outputs about 200 ns.The fault-clear time is set to minimum 100 µs. VDD, VSS (Low side control supply and reference, Pin 13, 16)VDD is the control supply and it provides power both to input logic and to output stage. Input logic is referenced to VSS ground.The under-voltage circuit enables the device to operate at power on when a supply voltage of at least a typical voltage of V DDUV+ = 12.4 V is present. The gate driver shuts down all the outputs, when the VDD supply voltage is below V DDUV- = 11.5 V. This prevents the IGBTs from critically low gate voltage levels during on-state and therefore from excessive power dissipation.VB(U, V, W) and VS(U, V, W) (High side supplies, Pin 1 - 6)VB to VS is the high side supply voltage. The high side circuit can float with respect to VSS following the high side IGBT emitter voltage.Due to the low power consumption, the floating driver stage is supplied by integrated bootstrap circuit. The under-voltage detection operates with a rising supply threshold of typical V BSUV+= 11.5 V and a falling threshold of V BSUV- = 10.7 V.VS(U, V, W) provide a high robustness against negative voltage in respect of VSS of -50 V transiently. This ensures very stable designs even under harsh conditions.N (Low side emitter, Pin 17)The low side common emitter is available for current measurement. It is recommended to keep the connection to pin VSS as short as possible to avoid unnecessary inductive voltage drops.W, V, U (High side emitter and low side collector, Pin 18 - 20)These pins are connected to motor U, V, W input pinsP (Positive bus input voltage, Pin 21)The high side IGBTs and PFC diode cathode are connected to the bus voltage. It is noted that the bus voltage does not exceed 450 V.X, NX, GX (Single boost PFC, Pins 22-24)These pins are drain, source, and gate of MOSFET for single boost PFC stage.CIPOS™ Mini IM564IM564-X6D/IM564-X6DSAbsolute Maximum Ratings3Absolute Maximum Ratings(V DD = 15 V, V GE = 15 V and T J = 25°C, if not stated otherwise)3.1Module Section3.2Inverter Section3.3Control Section3.4PFC Section1 Allowed number of short circuits: < 1000; time between short circuits: > 1 s.CIPOS™ Mini IM564 IM564-X6D/IM564-X6DS Absolute Maximum RatingsThermal Characteristics4Thermal CharacteristicsRecommended Operation Conditions5Recommended Operation ConditionsAll voltages are absolute voltages referenced to V SS -potential unless otherwise specified.6Static Parameters (V DD = 15 V and T J = 25°C, if not stated otherwise) 6.1Inverter Section6.2Control Section6.3PFC Section7Dynamic Parameters (V DD = 15 V and T J = 25°C, if not stated otherwise) 7.1Inverter Section7.2Control Section7.3PFC Section1 C o(er) is a fixed capacitance that gives the same stored energy as C oss while V DS is rising from 0 to 400V.Thermistor8 ThermistorDescriptionCondition Symbol ValueUnit Min. Typ. Max. ResistanceT NTC = 25°C R NTC - 85 - k B-constant of NTC(Negative Temperature Coefficient)B(25/100)-4092-K-40-30-20-100102030405060708090100110120130500100015002000250030003500Thermistor temperature [℃]T h e r m i s t o r r e s i s t a n c e [k Ω]Figure 6Thermistor resistance – temperature curve and table(For more information, please refer to the application note ‘AN2016-10 CIPOS Mini Technical description’)505560657075808590951001051101151201251305101520253035Thermistor temperature [℃]T h e r m i s t o r r e s i s t a n c e [k Ω]Min. Typ. Max.Mechanical Characteristics and Ratings9Mechanical Characteristics and RatingsQualification Information10Qualification InformationDiagrams and Tables11Diagrams and Tables11.1T C Measurement PointFigure 7T C measurement point 111.2Backside Curvature Measurment PointBackside curvature measurement position1Any measurement except for the specified point in Figure 7 is not relevant for the temperature verification and brings wrong or different information.Diagrams and Tables11.3Switching Time DefinitionHINxLINxi Cxv CExFigure 9Switching times definition of inverter partvGSi Dv DSFigure 10Switching times definition of PFC part 11.4Sleep function timing diagramHINxLINxHOxLOxVDDVFOVBSFigure 11Sleep function timing diagram12Application Guide12.1Typical Application Schematic∙#1 Input circuit−RC filter can be used to reduce input signal noise. (100 Ω, 1 nF)−The capacitors should be located close to IM564 (to V SS terminal especially).∙#2 Itrip circuit−To prevent a mis operation of protection function, RC filter is recommended.−The capacitor should be located close to Itrip and VSS terminals.∙#3 VFO circuit−VFO pin is open drain configuration. This terminal should be pulled up to the bias voltage of the 5 V/3.3 V through a proper resistor.−It is recommended that RC filter is placed close to the controller.∙#4 VB-VS circuit−Capacitors for high side floating supply voltage should be placed close to VB and VS terminals.∙#5 Snubber capacitor−The wiring among IM564, snubber capacitor and shunt resistors should be short as possible.∙#6 Shunt resistor−SMD type shunt resistors are strongly recommended to minimize its internal stray inductance.∙#7 Ground pattern−Pattern overlap of power ground and signal ground should be minimized. The patterns should be connected at one end of shunt resistor only for the same potential.12.2Performance Chart11This maximum operating current SOA is just one of example based on typical characteristics for this product. It can be changed by each user’s actual operating conditions.Package Outline13Package Outline Figure 14IM564-X6DTable of ContentsFigure 15IM564-X6DSRevision history Revision historyPublished byInfineon Technologies AG 81726 München, Germany © 2019 Infineon Technologies AG. All Rights Reserved. Do you have a question about this document?Email: ********************Document reference IMPORTANT NOTICEThe information given in this document shall in no event be regarded as a guarantee of conditions or chara cteristics (“Beschaffenheitsgarantie”) .With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party.In addition, any information given in this document is subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer’s products and any use of the product of Infineon Technologies in customer’s applications.The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document withFor further information on the product, technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies office ( ).Please note that this product is not qualified according to the AEC Q100 or AEC Q101 documents of the Automotive Electronics Council.WARNINGSDue to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office.Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury.Edition 2019-08-09ifx1Trademarks All referenced product or service names and trademarks are the property of their respective owners.IM564X6DXKMA1。

USB 3.0 4-Port PCI Express CardUser ManualModel: UGT-PC341All brand names and trademarks are properties of their respective ownersContents:Chapter 1: Introduction (3)1.1 Product Introduction (3)1.2 Features (4)1.3 System Requirements (5)1.4 Package Contents (5)Chapter 2: Getting Started (5)2.1 Hardware Installation (5)2.2 Driver Installation (6)2.3 Hardware Verify (8)2.4 Driver Uninstall (9)Chapter 3: Troubleshooting Tips (10)UGT-PC341 Page 2Chapter 1: Introduction1.1 Product IntroductionSuper-Speed USB 3.0 interface is the next revolution in I/O interconnect standards that will deliver the bandwidth and features required by PCs, consumer electronics and communications devices. with 10 times faster throughput than USB 2.0 standard and backward compatible with current USB device features, USB 3.0 interface will be the trendy of IT technology.This board is a 4-port Super-Speed USB 3.0 PCI Express card. It is compliant with the PCI Express Generation 2 specification for host PC system. It works up to 5 Gbps for data transfer when connecting to USB 3.0 compliant peripherals, while maintaining compatibility with existing USB peripheral devices.This board supports USB 3.0 High-Speed device and backward compatible with current USB 2.0 High-Speed and USB 1.1 Full-Speed device. It is an ideal choice for external storage devices, MP3 players, external DVD Writer, Card Readers, digital cameras, webcams, networking, video devices, and all other USB devices.UGT-PC341 Page 31.2 Features●Fully compliant with PCI Express Base Specification Revision2.0●Single-lane (x1) PCI Express throughput rates up to 5 Gbps●Compliant with Universal Serial Bus 3.0 specification Revision1.0●Supports simultaneous operation of multiple USB 3.0, USB 2.0and USB 1.1 devices●Supports the following speed data rates as follows:Low-speed (1.5Mbps) / Full-speed (12Mbps) / High-speed (480Mbps) / Super-speed (5Gbps)●Compliant with Intel’s eXtensible Host Controller Interface(xHCI) Specification Revision 0.96●Supports 4 downstream ports for all speeds●Built-in 4-pin power connector for receiving extra power supplyfrom system●Hot-swapping feature allows you to connect/disconnect deviceswithout powering down the system●Support Windows® XP/Vista/7 (32/64 bit)UGT-PC341 Page 41.3 System Requirements●Windows® XP/Vista/7 (32/64 bit)●One available PCI Express slot (Recommend PCI Express 2.0)1.4 Package Contents● 1 x USB 3.0 4-Port PCI Express Card● 1 x Driver CD● 1 x User Manual● 1 x SA TA to 4 pin Molex Power ConverterNote: Contents may vary depending on country/market. Chapter 2: Getting Started2.1 Hardware Installation1.Turn off the power to your computer.2.Unplug the power cord and remove your computer’s cover.3.Remove the slot bracket from an available PCIe slot.4.To install the card, carefully align the card’s bus connector with UGT-PC341 Page 5the selected PCIe slot on the motherboard. Push the board down firmly.5.Replace the slot bracket’s holding screw to secure the card.6.Replace the computer cover and reconnect the power cord.2.2 Driver Installation1.Insert the provided CD into your disk drive.2.At the Windows desktop click Start, then Run.3.Type D:\UGT-PC341\Setup.exe, then click OK. (Change D: tomatch your CD-ROM drive letter)4.Click “Next” to continue.Please check accept license agreement box, and click “Next”to continue.UGT-PC341 Page 6UGT-PC341Page 75. Select “VIA XHCI Host Controller Driver” and press “Next”.Please review settings before install the driver, and click “Next”to continue.6. Click “Next” to continue.Click “Finish” to end of the driver installations steps.UGT-PC341Page 87. After driver installation is complete, your must restart your computer.Note: We do not provide USB 3.0 driver for Mac and Linux OSs.2.3 Hardware Verify1. Click on the “Device Manager” tab in the Windows ControlPanel.Start > Control Panel > Device ManagerUGT-PC341Page 92. Entry “Universal Serial Bus controllers” item, and you can read“VIA USB 2.0 Hub”, “VIA USB 3.0 Root Hub” and“VIA USB eXtensible Host Controller” in the Device Manager.2.4 Driver Uninstall1. Click on the “Programs and Features” tab in the WindowsControl Panel.Start > Control Panel > Programs and FeaturesUGT-PC341Page 102. Entry “Uninstall or change a program”page, and double click “VIA Platform Device Manager” to process driver uninstallation procedure.Chapter 3: Troubleshooting TipsIf card and devices connected to the computer do not seem to beworking properly, please perform below basic troubleshootingsteps:1.Check that all cables are correct and securely connected.2.Make sure USB device’s power is turned on.3.Make sure the devices are getting enough power they require.4.Make sure there is no problem with the card installation.●Computer failed to start after inserting the USB 3.0 PCI Expresscard.Turn off the computer, remove the USB 3.0 PCI Express Card, and try to restart the computer. If the computer starts successfully, it means that the card has not been inserted into the PCI Express slot correctly. Please clean golden figure by rubber firstly, then change another PCI Express slot.●How to deal with there is a yellow exclamation point oncontroller?1.Please shutdown your computer and move the card toanother available slot then re-install USB 3.0 driver.2.Please point on this device then right-click on the mouse. UGT-PC341 Page 11Selecting “Update Driver” to renew USB driver.3.This exclamation point usually means there is a resourceconflict between this card and another card in your system.Please move the card to another available slot. Restart yourcomputer. Windows will re-configure itself and re-assignresources. Check your device manager again.● A message is displayed starting that not enough power can begiven to the connected device.Make sure to plug 4-pin power cable on board to provide efficient power to USB devices. But the better way is using device self-power to satisfy it.●Is it possible to connect current USB 1.1 or 2.0 devices to theUSB 3.0 PCI Express card?Yes it works. Device will not obtain the USB 3.0 speed, but USB 2.0/1.1.UGT-PC341 Page 12。