ICSLV810 Buffer/Clock DriverDescriptionThe ICSLV810 is a low skew 1.5 V to 2.5 V, 1:10 fanout buffer. This device is specifically designed for data communications clock management. The large fanout from a single input line reduces loading on the input clock. The TTL level outputs reduce noise levels on the part. Typical applications are clock and signal distribution. Features•Packaged in 20-pin QSOP/SSOP•Split 1:10 fanout Buffer•Maximum skew between outputs of different packages 0.75 ns•Max propagation delay of 3.8 ns•Operating voltage of 1.5 V to 2.5 V on Bank A •Operating voltage of 1.5 V to 2.5 V on Banks B and C •Advanced, low power, CMOS process •Industrial temperature range -40° C to +85° C• 3.3 V tolerant input when VDDA=2.5 V •Available in Pb (lead) free packagingBlock DiagramBuffer/Clock Driver Pin AssignmentPin DescriptionsPin NumberPinNamePinTypePin Description1CLKIN Input Clock input.2GND Power Connect to ground.3CLK1Output Clock output.4VDDA Power Connect to +1.5 - +2.5 V. 5CLK2Output Clock output.6GND Power Connect to ground.7CLK3Output Clock output.8VDDA Power Connect to +1.5 - +2.5 V. 9CLK4Output Clock output.10GND Power Connect to ground.11CLK5Output Clock output.12CLK6Output Clock output.13GND Power Connect to ground.14CLK7Output Clock output.15VDDC Power Connect to +1.5 - 2.5 V. 16CLK8Output Clock output.17GND Power Connect to ground.18CLK9Output Clock output.19CLK10Output Clock output.20VDDB Power Connect to +1.5 - 2.5 V.Buffer/Clock DriverExternal ComponentsThe ICSLV810 requires a minimum number of external components for proper operation.Decoupling CapacitorsDecoupling capacitors of 0.01µF must be connected between VDD and GND, as close to these pins as possible. For optimum device performance, the decoupling capacitors should be mounted on thecomponent side of the PCB. Avoid the use of vias in the decoupling circuit.Series Termination ResistorWhen the PCB trace between the clock outputs and the loads are over 1 inch, series termination should be used. T o series terminate a 50Ω trace (a commonly used trace impedance) place a 33Ω resistor in serieswith the clock line, as close to the clock output pin as possible. The nominal impedance of the clock output is 20Ω.PCB Layout RecommendationsFor optimum device performance and lowest output phase noise, the following guidelines should be observed.1) The 0.01µF decoupling capacitors should bemounted on the component side of the board as close to the VDD pins as possible. No vias should be used between the decoupling capacitors and VDD pins. The PCB trace to VDD pin should be kept as short as possible, as should the PCB trace to the ground via. 2) T o minimize EMI the 33Ω series termination resistor, if needed, should be placed close to the clock output.Absolute Maximum RatingsStresses above the ratings listed below can cause permanent damage to the ICSLV810. These ratings, which are standard values for ICS commercially rated parts, are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of thespecifications is not implied. Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating temperature range.Recommended Operation ConditionsItemRatingSupply Voltage, VDD MAX 7 VAll Inputs and Outputs-0.5 V to VDDA + 1.2 V Ambient Operating Temperature -40 to +85°C Storage Temperature -65 to +150°C Junction Temperature 125°C Soldering Temperature260°CParameterMin.Typ.Max.UnitsAmbient Operating Temperature-40+85°C Power Supply Voltage (measured with respect to GND), VDDA 1.425 2.625V Power Supply Voltage (measured with respect to GND), VDDB 1.425 2.625V Power Supply Voltage (measured with respect to GND), VDDC1.4252.625VBuffer/Clock DriverDC Electrical Characteristics—CLKIN and Bank AVDDA = 2.5 V , Ambient Temperature -40° C to +85° CNote1: This parameter is not tested, guaranteed by design.DC Electrical Characteristics—Bank BVDDB = 2.5 V , Ambient Temperature -40° C to +85° C, unless otherwise notedParameterSymbolConditionsMin.Typ.Max.UnitsOperating Voltage VDDA 1.4252.625V Quiescent Power Supply CurrentIDDA No Load F = 40 MHz 15mA Short Circuit Current I OS CLK 1 - 5±80mA Input High Voltage, CLKINV IH Guaranteed Logic Level High1.6VInput Low Voltage, CLKINV IL Guaranteed Logic Level Low 0.8V Output High Voltage V OH VIN = VIH or VILI OH = -7 mA 1.8V Output Low Voltage V OL VIN = VIH or VIL I OL =12 mA 0.4V Input High Current I IH VDD = max VIN = 2.4 V 1µA Input Low Current I IL VDD = max VIN = 0.5 V -1µA Input High Current I I VDD = max VIN = VDD (max)20µA Input Capacitance C IN VIN = 0V , Note15 6.0pF Output CapacitanceC OUTV OUT = 0V, Note15.58.0pFParameterSymbolConditionsMin.Typ.Max.UnitsOperating Voltage VDDB 1.4252.625V Quiescent Power Supply CurrentIDDBVDDB = 2.5 V No Load F = 40 MHz 7mAVDDB = 1.5 V No Load F = 40 MHz3mA Short Circuit CurrentI OS VDDB = 1.5 V CLK8-10±35mA VDDB = 2.5 VCLK8-10±80mABuffer/Clock DriverNote1: This parameter is not tested, guaranteed by design.DC Electrical Characteristics—Bank CVDDC = 2.5 V , Ambient Temperature -40° C to +85° C, unless otherwise notedOutput High VoltageV OHVDDB = 1.5 V VIN = VIH or VIL I OH = -7 mA 1.1V VDDB = 2.5 V VIN = VIH or VILI OH = -7 mA 1.8VOutput Low VoltageV OLVDDB = 1.5 V VIN = VIH or VIL I OL =12 mA 0.42V VDDB = 2.5 V VIN = VIH or VILI OL =12 mA0.4V Input High Current I IH VDDB = max 1µA Input Low Current I IL VDDB = max -1µA Input High Current I I VDDB = max, VIN = VDD (max)20µA Input Capacitance C IN VIN = 0V , Note15 6.0pF Output CapacitanceC OUTV OUT = 0V, Note 15.58.0pFParameterSymbolConditionsMin.Typ.Max.UnitsOperating Voltage VDDC 1.4252.625V Quiescent Power Supply CurrentIDDCVDDC = 2.5 V No Load F = 40 MHz 3mAVDDC = 1.5 V No Load F = 40 MHz2mA Short Circuit Current I OS VDDC = 1.5 V CLK6-7±35mA VDDC = 2.5 V CLK6-7±80mA Output High VoltageV OHVDDC = 1.5 V VIN = VIH or VIL I OH = -7 mA 1.1V VDDC = 2.5 V VIN = VIH or VILI OH = -7 mA 1.8V Output Low VoltageV OLVDDC = 1.5 V VIN = VIH or VIL I OL =12 mA 0.42V VDDC = 2.5 V VIN = VIH or VILI OL =12 mA0.4V Input High Current I IH VDDC = max 1µA Input Low CurrentI ILVDDC = max-1µAParameterSymbolConditionsMin.Typ.Max.UnitsBuffer/Clock DriverNote1: This parameter is not tested, guaranteed by design.AC Electrical Characteristics—Bank AVDDA = 2.5 V , Ambient Temperature -40° C to +85° CInput High Current I I VDDC = max, VIN = VDD (max)20µA Input Capacitance C IN VIN = 0V, Note15 6.0pF Output CapacitanceC OUTV OUT = 0V , Note 15.58.0pFParameterSymbolConditionsMin.Typ.Max.UnitsOutput Skew: skew between outputs of same package t SK(0)CL = 3 pF , RL = 500ΩFigure 3-200200psPulse Skew: skew between opposite transitions of same output (t PLH -t PHL )t SK(P)CL = 3 pF ,RL = 500ΩFigure 4-200200psPropagation Delayt pLH / t pHL CL = 3 pF ,RL = 500ΩFigure 2 1.5 2.6 3.5nsPart to Part Skew t SK(t)CL = 3 pF , RL = 500ΩFigure 5-650650psOutput Rise Time 20% to 80%t r(o)CL = 3 pF ,RL = 500Ω0.8ns Output Fall Time 80% to 20%t f(o)CL = 3 pF , RL = 500Ω0.8ns Additive Jitter t J All Outputs 50ps Duty CycleMeasured at VDD/2DC CL = 3 pF , RL = 500Ω4555%Duty Cycle, VDDA=1.8V DC405060%Output Frequency Range1133MHzParameterSymbolConditionsMin.Typ.Max.UnitsBuffer/Clock DriverAC Electrical Characteristics—Bank BVDDB = 2.5 V, Ambient Temperature -40° C to +85° C, unless otherwise notedParameter Symbol Conditions Min.Typ.Max.UnitsOutput Skew: skew between outputs of same package t SK(0)C L = 3 pF, R L = 500ΩFigure 3-200200psPulse Skew: skew between opposite transitions of same output (t PLH-t PHL)t SK(P)C L = 3 pF, R L = 500ΩFigure 4-200200psPropagation Delay t pLH / t pHL C L = 3 pF, R L = 500Ω,VDDB = 1.5 VFigure 25.5nsC L = 3 pF, R L = 500Ω,VDDB = 2.5 VFigure 21.52.63.5nsPart to Part Skew C L = 3 pF, R L = 500ΩVDDB = 1.5 VFigure 5-11nsC L = 3 pF, R L = 500ΩVDDB = 2.5 VFigure 5-650650psOutput Rise Time 20% to 80%t r(o)C L = 3 pF, R L = 500ΩVDDB = 1.5 V1.0nsC L = 3 pF, R L = 500ΩVDDB = 2.5 V0.8nsOutput Fall Time 80% to 20%t f(o)C L = 3 pF, R L = 500ΩVDDB = 1.5 V1.0nsC L = 3 pF, R L = 500ΩVDDB = 2.5 V0.8nsAdditive Jitter t J All Outputs,VDDB = 1.5 V34psAll Outputs,VDDB = 2.5 V50psDuty Cycle Measured at VDD/2DC CL = 3 pF,RL = 500Ω4555%Duty Cycle, VDDB = 1.8V DC405060% Output Frequency Range1133MHzBuffer/Clock DriverAC Electrical Characteristics—Bank CVDDC = 2.5 V, Ambient Temperature -40° C to +85° C, unless otherwise notedParameter Symbol Conditions Min.Typ.Max.UnitsOutput Skew: skew between outputs of same package t SK(0)C L = 3 pF, R L = 500ΩFigure 3-200200psPulse Skew: skew between opposite transitions of same output (t PLH-t PHL)t SK(P)C L = 3 pF, R L = 500ΩFigure 4-200200psPropagation Delay t pLH / t pHL C L = 3 pF, R L = 500Ω,VDDC = 1.5 VFigure 25.5nsC L = 3 pF, R L = 500Ω,VDDC = 2.5 VFigure 21.52.63.5nsPart to Part Skew C L = 3 pF, R L = 500ΩVDDC = 1.5 VFigure 5-11nsC L = 3 pF, R L = 500ΩVDDC = 2.5 VFigure 5-650650psOutput Rise Time 20% to 80%t r(o)C L = 3 pF, R L = 500ΩVDDC = 1.5 V1.0nsC L = 3 pF, R L = 500ΩVDDC = 2.5 V0.8nsOutput Fall Time 80% to 20%t f(o)C L = 3 pF, R L = 500ΩVDDC = 1.5 V1.0nsC L = 3 pF, R L = 500ΩVDDC = 2.5 V0.8nsAdditive Jitter t J All Outputs,VDDC = 1.5 V34psAll Outputs,VDDC = 2.5 V50psDuty Cycle Measured at VDD/2DC CL = 3 pF,RL = 500Ω4555%Duty Cycle, VDDC=1.8V DC405060% Output Frequency Range1133MHzBuffer/Clock DriverThermal Characteristics for 20QSOPThermal Characteristics for 20SOICParameterSymbolConditionsMin.Typ.Max.UnitsThermal Resistance Junction to AmbientθJA Still air 135°C/W θJA 1 m/s air flow 93°C/W θJA 3 m/s air flow78°C/W Thermal Resistance Junction to CaseθJC60°C/WParameterSymbolConditionsMin.Typ.Max.UnitsThermal Resistance Junction to AmbientθJA Still air 83°C/W θJA 1 m/s air flow 71°C/W θJA 3 m/s air flow58°C/W Thermal Resistance Junction to CaseθJC46°C/WPackage dimensions are kept current with JEDEC Publication No. 95Buffer/Clock DriverPackage Outline and Package Dimensions (20-pin SSOP, 209 Mil. Body)Package dimensions are kept current with JEDEC Publication No. 95Ordering InformationParts that are ordered with a "LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant.While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems (ICS) assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without additional processing by ICS. ICS reserves the right to change any circuitry or specifications without notice. ICS does not authorize or warrant any ICS product for use in life support devices or critical medical instruments.Part / Order NumberMarkingShipping PackagingPackageTemperatureICSLV810RI ICSLV810RI Tubes 20-pin QSOP -40 to +85° C ICSLV810RIT ICSLV810RI T ape and Reel20-pin QSOP -40 to +85° C ICSLV810FI ICSLV810FI Tubes 20-pin SSOP -40 to +85° C ICSLV810FIT ICSLV810FI T ape and Reel20-pin SSOP -40 to +85° C ICSLV810RILF LV810RILF Tubes 20-pin QSOP -40 to +85° C ICSLV810RILFT LV810RILF T ape and Reel20-pin QSOP -40 to +85° C ICSLV810FILF LV810FILF Tubes 20-pin SSOP -40 to +85° C ICSLV810FILFTLV810FILFT ape and Reel20-pin SSOP-40 to +85° CRevision HistoryRev.Originator Date Description of ChangeA P.Griffith03/25/05New device/datasheet.B P.Griffith05/02/05Released from Preliminary to final; changed Short Circuit Current parameter in 2.5 V DCChar table to ±80 mA; changed Short Circuit Current parameter in 1.5 V DC Char table to±35 mAC P.Griffith05/12/05Added bullet in “Features” for operating voltage of 2.5 V on Bank A and specified thatoperating voltages of 1.5 and 2.5 V are on Banks B and C; changed block diagram inputand pin 1 from IN to CLKIN; removed +1.5 V spec from pin 4 and pin 8 descriptions; added“VDDA + 1.2 V” to “All Inputs and Outputs” section of Absolute Maximum Ratings; addedmin and max values for Banks A, B, and C “Power Supply Voltage” in RecommendedOperating Conditions; expanded DC Electrical Char tables in to include a separate tablefor Banks A, B, and C; expanded AC Electrical Char tables in to include a separate tablefor Banks A, B, and C;D P.Griffith06/21/05Added 209 mil 20-pin SSOP package and ordering info.E K. Beckmeyer07/27/05Specified operating voltage on Bank A from 1.5V to 2.5V; Added figures 4 and 5 on page10 to explain Pulse Skew and Part-to-Part Skew; Changed Output Frequency MaxSpecification to 133MHz in AC Electrical Char tables for Banks A, B, and C; Added DutyCycle Spec for VDD = 1.5V in AC Electrical Char tables for Banks A, B, C; Changed CLKconditions in DC Electrical Char tables on Banks B and C; removed SOIC package.F K. Beckmeyer10/13/05Added “LF” packaging and ordering info to both “R” and”F” packages.。
咨询通告易折易碎杆塔通⽤技术要求及检测规范-中国民⽤航空局中国民⽤航空局机场司编⼀⼀号：ＡＣ－１３７－ＣＡ－２０１４－０１下发⽇期：２０１４年９⽉９⽇易折易碎杆塔通⽤技术要求及检测规范⽬⼀录１⽬的（１）２适⽤范围（１）３定义（１）４参考资料（２）５通⽤要求（３）⼀５．１产品（３）⼀５．２环境条件（４）⼀⼀５．２．１风（４）⼀⼀５．２．２温度（５）⼀⼀５．２．３湿度（５）⼀⼀５．２．４⽇照（５）⼀⼀５．２．５盐雾（５）⼀⼀５．２．６振动（５）⼀⼀５．２．７摆动（５）⼀５．３材料（６）⼀⼀５．３．１杆塔材料（６）⼀⼀５．３．２其它部件材料（６）⼀５．４⼯艺要求（６）⼀⼀５．４．１钢铁制件和钢制紧固件（７）⼀⼀５．４．２铝制件（７）⼀⼀５．４．３颜⾊（７）⼀⼀５．４．４涂装（７）⼀５．５⾼度（７）⼀５．６重量（７）⼀５．７易折性要求（８）⼀５．８组装要求（９）⼀５．９偏移要求（９）⼀５．１０可维护性（９）１⼀⼀５．１０．１⼀般要求（９）⼀⼀５．１０．２特殊要求（１０）⼀５．１１基础（１０）⼀５．１２防雷接地（１０）⼀５．１３电线电缆（１１）⼀５．１４清洁（１１）⼀５．１５说明书（１１）６试验规程和合格判断条件（１１）⼀６．１可视测试（１１）⼀６．２盐雾试验（１１）⼀⼀６．２．１试验程序（１１）⼀⼀６．２．２合格判断条件（１１）⼀６．３太阳辐射试验（１１）⼀⼀６．３．１试验程序（１２）⼀⼀６．３．２合格判断条件（１２）⼀６．４偏移试验（１２）⼀⼀６．４．１试验程序（１２）⼀⼀６．４．２合格判断条件（１２）⼀６．５易折性试验（１２）⼀⼀６．５．１试验⼯具和程序（１３）⼀⼀６．５．２合格判断条件（１４）⼀６．６风压试验（１４）⼀⼀６．６．１试验程序（１４）⼀⼀６．６．２合格判断条件（１５）⼀６．７维护性能试验（１５）７出⼚检验（１５）⼀７．１检验（１５）⼀７．２检验记录（１５）８包装（１５）编写说明（１７）２易折易碎杆塔通⽤技术要求及检测规范１⽬的为明确民⽤机场飞⾏区内易折易碎杆塔的技术要求，规范有关检测⼯作，根据国际民航组织第９１５７号⽂件‘机场设计⼿册第６部分－易折性“，参考美国联邦航空局第１５０／５３４５－４５Ｃ号咨询通告‘Ｌｏｗ－ｉｍｐａｃｔＲｅｓｉｓｔａｎｔＳｔｒｕｃｔｕｒｅｓ“，制定本咨询通告三２适⽤范围本咨询通告适⽤于民⽤机场飞⾏区障碍物限制⾯中的⽤于⽀撑助航设施设备的易折易碎杆塔，包括进近灯光杆塔⼆仪表着陆设备杆塔⼆风向标杆塔等类似结构，不适⽤于跑道⼆停⽌道和滑⾏道边上的⽴式灯具三３定义ａ．易折易碎物体三在规定的冲击⼒下会折断（破碎）⼆弯曲或屈服，从⽽对航空器的危害达到最⼩的轻质量物体三ｂ．易折性三机场各种⽬视和⾮⽬视助航设施（例如进近灯光杆塔⼆⽓象设备⼆⽆线电导航设备等）⼀般设在跑道⼆滑⾏道和机坪附近，若起飞⼆着陆或地⾯运⾏的航空器与其意外碰撞会造成危险三所有此类设备及其⽀柱必须易折且应当安装得尽可能低，以保证碰撞不会导致航空器失控三易折性可通过多种设计理念来实１现，例如可采⽤轻质易折易碎材料⼆脆性或低韧性的构件和连接件等⽅式，以确保易折物体受到碰撞时破碎⼆弯曲或屈服三注：易折性包含易折性和易碎性三ｃ．易折易碎杆塔三易折易碎杆塔（以下简称易折杆）是指采⽤轻质易碎材料或易折结构制成的单杆式⼆塔架式等构型的⽀撑结构物三注：易折杆通常⽤作进近灯光系统⼆仪表着陆系统航向仪天线⼆下滑仪天线⼆风向标⼆⼤⽓投射仪⼆前向散射仪等机场设备的⽀柱三４参考资料ａ．ＧＢ５０００９－２０１２‘建筑结构荷载规范“ｂ．ＧＢ５０１３５－２００６‘⾼耸结构设计规范“ｃ．ＧＢ／Ｔ３１９０－２００８‘变形铝及铝合⾦化学成分“ｄ．ＧＢ／Ｔ６８９２－２００６‘⼀般⼯业⽤铝及铝合⾦挤压型材“ｅ．ＧＢ／Ｔ８７３３－２００７‘铸造铝合⾦锭“ｆ．ＧＢ／Ｔ１１２０６－２００９‘橡胶⽼化试验表⾯龟裂法“ｇ．ＧＢ／Ｔ１３９１２－２００２‘⾦属覆盖层钢铁制件热浸镀锌层技术要求及试验⽅法“ｈ．ＧＢ／Ｔ５２６７．３－２００８‘紧固件热浸镀锌层“ｉ．ＧＢ／Ｔ２０８７８－２００７‘不锈钢和耐热钢－牌号及化学成分“ｊ．ＧＢ／Ｔ１０６１０－２００９‘产品⼏何技术规范（ＧＰＳ）表⾯结构轮廓法评定表⾯结构的规则和⽅法“２ｋ．ＧＢ／Ｔ１３３８４－２００８‘机电产品包装通⽤技术条件“ｌ．ＧＢ／Ｔ３０９８．１－２０００‘紧固件机械性能螺栓⼆螺钉和螺柱“ｍ．ＧＪＢ１５０．１Ａ－２００９‘军⽤装备实验室环境试验⽅法第１部分：通⽤要求“ｎ．ＧＪＢ１５０．７Ａ－２００９‘军⽤装备实验室环境试验⽅法第７部分：太阳辐射试验“ｏ．ＧＪＢ１５０．１１Ａ－２００９‘军⽤装备实验室环境试验⽅法第１１部分：盐雾试验“ｐ．ＧＪＢ１５０．２１Ａ－２００９‘军⽤装备实验室环境试验⽅法第２１部分：风压试验“ｑ．ＭＨ５００１－２０１３‘民⽤机场飞⾏区技术标准“ｒ．ＩＣＡＯＤｏｃ９１５７‘机场设计⼿册第６部分易折性“ｓ．ＩＣＡＯ附件１４‘机场－卷Ｉ机场设计和运⾏“ｔ．ＦＡＡＡＣ１５０／５３４５－４５ＣＬｏｗ－ｉｍｐａｃｔＲｅｓｉｓｔａｎｔＳｔｒｕｃｔｕｒｅｓｕ．ＦＡＡ－Ｅ－２７０２Ｌｏｗ－ｉｍｐａｃｔＲｅｓｉｓｔａｎｔＳｔｒｕｃｔｕｒｅｓｖ．ＭＩＬ－ＳＴＤ－８１０ＦＥｎｖｉｒｏｎｍｅｎｔａｌＥｎｇｉｎｅｅｒｉｎｇＣｏｎｓｉｄｅｒａｔｉｏｎｓａｎｄＬａｂｏｒａｔｏｒｙＴｅｓｔｓｗ．ＡＳＴＭＡ３２５Ｍ‘最⼩抗拉强度８３０ＭＰａ的热处理⽶制钢结构螺栓“５通⽤要求５．１产品产品应当结构完整⼆配件齐全⼆外观完好，整体满⾜本规程的３技术要求，还应当提供出⼚试验报告和产品型式试验报告⼆产品出⼚合格证和使⽤说明书三注：产品应当包括易折杆的所有零部件（安装底座⼆调整和连接组件等），还应当提供安装和维护所必需的装置（如升降或折倒装置等）三５．２环境条件易折杆及其零部件和所有必需设备置于以下环境中，其结构或任意易折易碎部分必须能正常⼯作⽽不会失效三５．２．１风ａ．确定⾃然风速三易折杆应当⾜够结实牢固以满⾜在国家规定的典型⾃然风荷载（例如覆冰１２．５ｍｍ和风速１４０ｋｍ／ｈ）中正常⼯作的运⾏要求；还应当能经受２１０ｋｍ／ｈ的风速，或采⽤当地５０年⼀遇最⼤风压来确定风荷载，具体可参考ＧＢ５０００９‘建筑结构荷载规范“，取两者最⼤值三ｂ．确定喷⽓⽓流风速三航空器的喷⽓⽓流不应当对正常⼯作的易折杆产⽣破坏和永久性变形三设计时，应当使⽤航空器排⽓轮廓线图，结合易折杆相对于航空器的距离和⽅向，确定易折杆所能承受的喷⽓⽓流风速三ｃ．综合确定设计风速三易折杆应当综合考虑当地的⾃然风和航空器的喷⽓⽓流来确定所能承受的风速，取⼆者中最⼤值三ｄ．计算设计风压三设计风速确定后，应当依据‘建筑结构荷载规范“（ＧＢ５０００９－２０１２）附录Ｅ的风压风速变换公式，计算易折４杆所能承受的设计风压三ｅ．计算风荷载三设计风压确定后，应当依据‘建筑结构荷载规范“（ＧＢ５０００９－２０１２）８．１的计算公式，综合考虑风振系数⼆体型系数⼆⾼度变化系数等计算易折杆所能承受的风荷载三５．２．２温度易折杆及其零部件和所有必需设备，应当能在－５５? ５５?的环境中正常⼯作三５．２．３湿度易折杆及其零部件和所有必需设备，应当能在相对湿度为５％１００％（包括冷凝）的环境中正常⼯作三５．２．４⽇照此要求适⽤于使⽤塑料或⾮⾦属材料的易折杆及其零部件和所有必需设备，其应当能经受长时间太阳辐射三５．２．５盐雾易折杆及其零部件和所有必需设备，应当能经受盐雾腐蚀环境三５．２．６振动易折杆的零部件⼆其零部件组合乃⾄整个结构，在⾃然风⼆喷⽓⽓流和地震等影响下不应当产⽣谐波振动三５．２．７摆动对于安装在⾼塔上的易折杆，设计时应当考虑摆动因素，满⾜⾼耸结构的位移要求和助航设施设备的偏移要求三５５．３材料５．３．１杆塔材料杆塔应当选⽤质量轻⼆质地硬⼆韧性模量低的材料，可⽤哑光处理的阳极氧化铝合⾦⼆玻璃纤维增强塑料（以下简称玻璃钢）等三５．３．２其它部件材料５．３．２．１不锈钢所有不锈钢制成的五⾦零部件应当使⽤１８－８以上的不锈钢三５．３．２．２钢制五⾦件所有⾼强度碳素钢制成的螺栓和螺母应当进⾏热处理，最⼩抗拉强度不低于８３０ＭＰａ，适合实际应⽤三５．３．２．３⾮⾦属连接器玻璃钢的钻孔和切割边应当镀与原树脂同样的材料三５．３．２．４橡胶所有⽤于易折杆结构的橡胶或类似橡胶的材料应当符合ＧＢ／Ｔ１１２０６‘橡胶⽼化试验表⾯龟裂法“Ｂ法－－矩形试样弯曲试验法的全部要求三５．４⼯艺要求易折杆结构及其零部件不应当有锐利边缘，以防操作中造成危险；其表⾯应当平整，防⽌影响组合和安装三所有接合⾯，⽆论是⾦属的还是⾮⾦属的，结构接合前均应当喷砂处理并⽤溶剂清洗三６５．４．１钢铁制件和钢制紧固件所有钢铁制件和钢制紧固件（不锈钢除外）表⾯应当做防锈⼆防腐蚀处理，并满⾜５．２．５的要求三对于钢铁制件，宜按照ＧＢ／Ｔ１３９１２‘⾦属覆盖层钢铁制件热浸镀锌层技术要求及试验⽅法“进⾏热浸镀锌，且钢铁制件表⾯在镀锌前应当喷砂到基体⾦属三对于钢制紧固件（螺母⼆螺栓⼆垫圈和其它微⼩部件），宜按照ＧＢ／Ｔ５２６７．３‘紧固件热浸镀锌层“进⾏热浸镀锌三５．４．２铝制件所有铝制件都应当在硫酸电解液中进⾏阳极氧化，阳极氧化膜不染⾊，但应当做哑光处理三５．４．３颜⾊易折杆颜⾊应当符合ＭＨ５００１‘民⽤机场飞⾏区技术标准“有关要求三５．４．４涂装所有玻璃钢或同等性能材料制成的零部件应当喷涂３８５１微⽶厚的聚氨酯涂料三除有具体说明外，对于所有玻璃钢零部件，⾊素和紫外线吸收剂应当溶⼊涂料中三喷涂料前，应当⽤砂纸或通过机械加⼯磨平所有突起（表⾯粗糙度参数Ｒａ达到６．３）并⽤适合的溶剂清洁表⾯三５．５⾼度易折杆⽀撑的设备⾄少应当在?２０ｃｍ⾼度范围内可调整三５．６重量７易折杆结构应当设计得尽可能地轻，并符合５．２⼆５．３⼆５．７⼆５．９⼆５．１０中的相关要求三５．７易折性要求ａ．设计⽬的三在５．２所述的所有环境条件下，能⽤质量尽可能轻的易折杆⽀撑起尽可能重的助航设施设备三但遭受任意⽅向意外撞击时，易折杆应当易折易碎，以最⼤限度减轻对航空器的结构损伤三碰撞时，易折杆必须破碎⼆弯曲或屈服，且不缠绕航空器，以防限制航空器的安全机动性三ｂ．对于可能与起飞或降落的航空器发⽣碰撞的易折杆，在遭受重３０００ｋｇ⼆速度１４０ｋｍ／ｈ的航空器撞击时必须易折易碎三对于可能与地⾯滑⾏的航空器发⽣碰撞的易折杆，在遭受重３０００ｋｇ⼆速度５０ｋｍ／ｈ的航空器撞击时必须易折易碎三ｃ．碰撞时，易折杆施加到航空器上的⼒应当不⼤于４５ｋＮ；航空器与易折杆碰撞接触瞬间（约１００ｍｓ），易折杆施加给航空器的最⼤能量应当不⼤于５５ｋＪ三ｄ．电缆应当是易断开的，以避免缠绕航空器和降低易折杆的易折性能，同时应当确保供电可靠性三电缆可设置⼀些断开点，可通过采⽤⽐拉断电缆⼩的拉⼒就能断开的接线器来实现，接线器应当符合相关标准；同时应当使⽤可脱开的保护罩，以减⼩电缆断开时电弧引起的⽕灾危险，保护罩的⼤⼩应当与电压相匹配三ｅ．安装在易折杆上的电⽓设备或组件宜设计成易折杆结构的⼀部分，并保证运⾏性能不降低三８ｆ．如果易折杆位于跑道端安全区内，易折杆底座的所有机械固定点必须与易折固定装置相匹配，且易折固定装置的易折点应当不⾼于周围地⾯７６ｍｍ三易折杆进⾏测试时，必须将其底座的固定点连接到易折固定装置上三ｇ．按照ＭＨ５００１‘民⽤机场飞⾏区技术标准“，⽴式进近灯及其⽀柱均应当易折三但在距跑道⼊⼝３００ｍ以外的部分：（１）若⽀柱⾼度超过１２ｍ，则其顶端１２ｍ的部分应当易折；（２）若⽀柱四周存在⾮易折物体，则⾼出⾮易折物体的部分应当易折三５．８组装要求易折杆应当制成多个部件的组合体，以便于运输和操作，但不得影响设计的整体性三各部件应当不需使⽤特殊⼯具就能在现场快速组装，不应当在现场焊接结构部件三５．９偏移要求易折杆必须⾜够牢固，其结构偏移应当限定在偏移容差范围内，以防影响其所⽀撑的助航设施设备的信号质量三设计时，应当考虑不同设施设备的运⾏性能⼆测量精度等要求，合理确定偏移容差三例如，进近灯光杆塔在全部表⾯覆冰１２．５ｍｍ⼆经受１００ｋｍ／ｈ的风速时，光束垂直偏移应当不⼤于?２度，光束⽔平偏移应当不⼤于?５度三５．１０可维护性５．１０．１⼀般要求９易折杆应当便于维护，不应当作为攀登架或⽤来固定梯⼦，以防⽌其性能降低三可以采⽤容易移动和升降的设备对易折杆及所⽀撑的设备进⾏维护，也可以将易折杆降⾄地⾯或仅降低设备进⾏维护三对于可降⾄地⾯或仅降低设备的易折杆，当降⾄地⾯时，设备应当处于易于维护的⾼度三所有可降低装置应当作为易折杆的必要部件由制造商提供，且应当与易折杆作为整体来考虑其重量和易折性三维护作业完成后，设备应当重新安装就位，且不需重新调校三例如，进近灯光杆塔的灯具降⾄地⾯维护时，灯具应当保持⽔平；杆塔应当适于安装且不会限制灯座的调整范围；维护作业完成后，灯具应当在⽔平和垂直⽅向上对齐三５．１０．２特殊要求对于某些有特殊要求的易折杆，例如仪表着陆系统下滑仪天线杆塔，若确实需要设置⽤于维护的固定爬梯，爬梯应当作为易折性设计的⼀部分予以考虑三５．１１基础为确保易折杆及所⽀撑设施设备的稳定性，易折杆底座应当牢固安装在基础上（⼀般为⽔泥混凝⼟基础），且经简单调整即可调⾄⽔平三易折杆基础应当符合ＭＨ５００１‘民⽤机场飞⾏区技术标准“及相关规定三５．１２防雷接地易折杆必须设置防雷接地装置三０１５．１３电线电缆电线电缆不得裸露，其外部保护构件应当作为易折性设计的⼀部分予以考虑，且不降低整体的易折性能三５．１４清洁易折杆材料表⾯应当保持清洁，所有在⽣产过程中所残留的油脂⼆油⼆灰尘⼆污垢⼆助焊剂和化学品等应当予以清除三５．１５说明书说明书中必须提供所有重要程序，包括：分拆⼆组合⼆安装⼆操作⼆建议维护措施说明和⼀份完整的零部件清单三６试验规程和合格判断条件６．１可视测试必须对易折杆所有零部件的⼯艺品质⼆表⾯光洁度和预期⽬标的符合情况等⽅⾯进⾏⽬视检查三６．２盐雾试验６．２．１试验程序必须对易折杆的⼀部分和所有必需五⾦件进⾏盐雾试验三试验条件为４８⼩时喷盐雾⼆４８⼩时⼲燥三具体可参照ＧＪＢ１５０．１１Ａ‘军⽤装备实验室环境试验⽅法第１１部分：盐雾试验“三６．２．２合格判断条件若没有出现损坏⼆锈蚀⼆点蚀⼆腐蚀（保护性涂层损坏除外）以及玻璃钢分层等现象，则认定通过盐雾试验三６．３太阳辐射试验１１６．３．１试验程序对于所有带有塑料或⾮⾦属外层材料的易折杆，必须进⾏太阳辐射试验三试验以２４⼩时为⼀个循环，照射２０⼩时，停照４⼩时，试验应当持续⾄少５６个循环三具体可参照ＧＪＢ１５０．７Ａ‘军⽤装备实验室环境试验⽅法第７部分：太阳辐射试验“中的程序ＩＩ－－稳态试验（光化学效应）三６．３．２合格判断条件若没有出现品质降低或玻璃钢分层等现象，则认定通过太阳辐射试验三６．４偏移试验６．４．１试验程序将根据１００ｋｍ／ｈ风速和覆冰１２．５ｍｍ计算出的静态荷载，垂直施加到按实际⼯作组态组合和安装的易折杆（最⼤⾼度）的纵轴上三６．４．２合格判断条件若偏移不超过５．９中的数值，且易折杆没有永久性变形，则认定通过偏移试验三６．５易折性试验必须对装有所有零部件和最⼤设施设备负荷的（包括电线电缆）⼆最⼤规格的易折杆进⾏易折性试验，易折杆底座的易折五⾦件也应当包含在内三易折性试验应当能够模拟易折杆被航空器碰撞的情形三２１６．５．１试验⼯具和程序ａ．撞击物三撞击物应当为刚性半圆形轻质钢管三钢管长度为１ｍ或为易折杆（塔）最⼤横截⾯尺⼨的５倍（取两者最⼤值），钢管壁厚不⼩于２５ｍｍ，钢管外径不超过２５０ｍｍ三钢管表⾯应当尽量平滑⼆不需要涂层或抛光三撞击物应当固定在试验车上，从⽽使撞击物与易折杆结构的碰撞过程尽量体现出刚体碰撞的特性，以便于在试验中获取最⼤碰撞⼒⼆碰撞时间及碰撞时间内的能量变化等数据三ｂ．测⼒传感器三测⼒传感器应当安装在尽量靠近撞击物的位置上，并且应当安装⾜够数量的测⼒传感器，以确保当撞击物偏离中⼼线或与易折杆（或其底座）反作⽤产⽣意外冲量时，数据仍能有效测量三测⼒传感器量程不低于４５ｋＮ，采样频率不低于１０ｋＨｚ三ｃ．⾼速摄像机三应当使⽤⾼速摄像机来记录撞击物与易折杆的碰撞过程，帧速率应当⾜以观察并记录碰撞瞬间（⼤约１００ｍｓ）易折杆的损坏模式三⽬视观察碰撞过程和结构变形是不可⾏的三ｄ．撞击速度三装载撞击物的试验车辆最⼤⾏驶速度应当⼤于１４０ｋｍ／ｈ三应当维持撞击速度不变，并记录碰撞瞬间的撞击速度三ｅ．撞击位置三撞击物或易折杆结构应当处于合适的相对位置，使碰撞发⽣在⾼出地⾯以上４ｍ或易折杆顶端以下１ｍ的位置３１（选两者较⾼的位置）三６．５．２合格判断条件ａ．根据测⼒传感器的记录，易折杆施加到撞击物上的⼒应当不⼤于４５ｋＮ；撞击物与易折杆碰撞接触瞬间（约１００ｍｓ），易折杆施加给撞击物的最⼤能量应当不⼤于５５ｋＪ三ｂ．观察⾼速摄像机的视频或影像记录，易折杆不应当继续锚定在基础上，且不会有缠绕机翼的潜在可能性，以防⽌航空器飞⾏⽅向受到不利影响三ｃ．易折杆被撞击后的损坏模式应当为：被撞击位置破碎⼆开出⼀个豁⼝或弯曲三ｄ．若易折杆碰撞后形成的节段（碎⽚）或与基础分离的易折杆下部被撞击物带⾛，可认为不会对航空器造成危险，不算作试验失败三ｅ．电线电缆应当分离，不应当妨碍易折杆破碎⼆开出⼀个豁⼝或弯曲三如果撞击物与电线电缆⼆或与被电线电缆捆住的易折杆节段缠绕在⼀起，应当判断是否会阻碍重约３０００ｋｇ的航空器继续飞⾏和安全操作三ｆ．易折杆被撞击后形成的节段或碎⽚，其质量应当尽可能⼩且其断开⽅式不会对航空器造成严重损害（例如击穿挡风玻璃⼆机⾝或机尾操纵⾯）三６．６风压试验６．６．１试验程序４１⾄少应当对最⼤规格的⼆以实际⼯作组态组合和安装的易折杆按照５．２．１中的风速要求，通过施加静态荷载或者按照ＧＪＢ１５０．２１Ａ‘军⽤装备实验室环境试验⽅法第２１部分：风压试验“的要求进⾏风压试验三６．６．２合格判断条件当荷载消除时，易折杆结构恢复⾄初始位置，且未发⽣永久变形，则认定通过风压试验三６．７维护性能试验制造商应当按照说明组装⼀个最⼤规格的易折杆结构，以演⽰组装⼆所有零部件及升降功能的适⽤性三结构升降前，制造商应当在易折杆上安装与适⽤设备等重的配重块三演⽰必须证明维护⼈员能够安全执⾏所有维护作业三７出⼚检验７．１检验制造商应当检验易折杆的所有零部件，以保证其物理尺⼨⼆材料和⼯艺品质合格三７．２检验记录制造商应当保留７．１中的检验记录３年三所有零部件应当可通过序列号或检验记录追踪查询三８包装易折杆应当妥善包装，以保护其零部件，防⽌运输过程中受损或被腐蚀三所有集装箱应当标明易折杆的装箱内容⼆型号⼆⾼度５１等三若使⽤⼀个以上的集装箱运输，易折杆的零部件应当在包装上贴有识别标签三所有包装标签和易折杆零部件应当符合ＧＢ／Ｔ１３３８４‘机电产品包装通⽤技术条件“的要求三６１。
