Substrate temperature and strain during sputter deposition of aluminum on cast borosilicate glass in

摘要纳米尺度的金属多层膜在屈服应力、塑性、抗腐蚀性能等方面具有特殊的性能。

目前它已被广泛应用于航空航天、机械制造、电子技术、光学工程及计算机工程等各个领域。

而在薄膜材料的应用过程中,薄膜的使用寿命和可靠性是人们普遍关注的焦点问题。

界面的结合性能是影响多层膜寿命和可靠性的关键指标,而位错和界面的相互作用机理决定着界面的结合性能,即位错和界面的相互作用机理在薄膜的使用寿命和可靠性方面扮演着关键角色。

因此对位错和界面的相互作用机理的研究就显得特别有价值和意义。

随着高性能计算机的发展,原子模拟已成为材料性能预测与设计方面一种有效的方法。

本文用三维分子动力学方法研究了位错和界面的相互作用机理,具体如下:首先,用分子动力学方法研究了侧向拉伸载荷下位错从bcc-Fe/Ni界面的形核和发射过程。

弛豫后,在Fe(0 0 1)/Ni(0 0 1)和Fe(0 0 1)/Ni(1 1 1)界面观察到无序的失配位错网络,Fe(0 0 1)/Ni(1 1 0)界面观察到长方形的失配位错网络。

研究了晶体取向对Fe/Ni 双层膜拉伸性能的影响。

不同取向的对比发现Fe(0 0 1)/Ni(1 1 0)系统的屈服强度最低。

和Fe薄膜进行了对比,发现Fe/Ni双层膜系统的塑性高于Fe薄膜的,而屈服强度低于Fe薄膜的。

模拟结果显示,界面是位错的发射源,滑移位错从界面的失配位错线形核和发射。

同时界面也会阻碍位错运动,随着拉伸的进行,Fe层中越来越多的位错被塞积在界面处,当到达到临界值时,迫使位错穿过Fe/Ni界面,从Fe层到Ni层。

在Fe基体中位错主要在{1 0 1}面滑移,而在Ni中主要在{1 1 1}面滑移。

其次,用分子动力学模拟了单轴拉伸载荷下不同扭转角的Cu(001)/Ni(001)界面的结合性能。

模拟结果显示,当扭转角小于15.124度时,界面形成方格状的失配位错网络,界面失配位错网络的密度随着扭转角的增加而增加。

当扭转角大于15.124度时,在界面形成面缺陷。

1 General1.1 All painting works including surface preparation and painting inspection to be carried out in accordance with the paintspecification and yard’s practice .1.2 Technical supervision to be provided by the paint manufacturer during the preparation and application.1.3 The colors of finish coat to be decided in accordance with owner’s color scheme, color for each coat other than finish co at tobe decided in accordance with paint manufacturer’s recommendation and alternative coat to be of differ ent color for easy identification.1.4 Painting scheme for the parts and spaces which is not specified in this painting scheme to be similar to surrounding orcomparable spaces.2 Surface preparation2.1 Primary surface preparation2.1.1The steel plates of 6mm and above in thickness and profile shall be shot blasted to Sa 2.5 (ISO8501-1：1998), andimmediately painted with one coat of zinc silicate shop primer（HEMPEL’S SHOPPRIMER ZS 15890）according to Builder’s practice to approx. 15 microns of dry film thickness.2.1.2Steel plates below 6mm thickness to be grit or sandblasted to Sa2.5 or pickling, and painted.2.2 Secondary surface preparation2.2.1 The TOPSIDE (INCLUDE BULWARK)、BOTTO M、DECK、HOPPER COAMING、DECK HOUSE、CHAIN LOCKER and MASTetc should be sandblasted to Sa 2.0 according to the ISO 8501-1:1988. The others position should be sandblasted to Sa 1.0 according to the ISO 8501-1:1988.2.2.2Surface shall be dried, cleaned and free of oil /grease before application of paint.3 Painting works3.1 Painting shall be carried out generally by airless spray after second surface preparation to be approved. Brush or roller shall beapplied where airless spray is impractical.3.2 Mixing, Thinning, stirring, induction period, pot time, storage，stripe coat and the recoating intervals should be done according to t he paint manufacturer’s recommendation.3.3 Copper, copper alloy, aluminum alloy, stainless steel, plastic, nameplate and other non-corrosive metal surface shall not bepainted unless otherwise specially specified. All electrical cable not to be painted.3.4 Painting of hull shell under waterline and adjacent areas shall be finished generally before launching.3.5 During application of paint, substrate temperature and temperature of paint should follow the paint manufacture’srecommendation, the relative humidify shall be less than 85% . Paint shouldn’t be applied during periods of rain, snow, or fog in the open air.3.6 The painting scheme not to be involved in this specification shall be same as surrounding.4 Paint film4.1 The dry film thickness specified in painting schedule shall be attained on at least 80% of the measuring points and may not beachieved on the remaining 20% measuring points, but at least 80% thickness of the specified one to be attained on remaining 20% measuring points.4.2 Measurement point shall be selected generally on the smooth surface (1P/10m2). The areas within about 15mm breadth fromfree edge, welding seams and surfaces of outfittings where measurement in difficult or impracticable are reasonably excluded from the scope to measure accurately.4.3 Measurement instrument such as electrometer micrometer shall be approved by measure department.4.4 Appearance of the areas such as superstructure, passage , outside of shell where good appearance in required especially shallbe checked, each layer must be applied homogeneously, surface irregularities such as dry spray, saggings, blooming or embedded dust should be avoided.4.5 The damage areas of paint film shall be touched up in accordance with the paint system as surrounding.5 Inspection5.1 The inspection shall be carried out generally attending Owner’s representation, paint manufacturer’s representation andbuilder’s inspector.5.2 In the event that Owner’s representation are unable to attend, such inspection may be performed under the paintmanufacturer’s representation and builder’s inspector, and the result of inspection to be issued to Owner’s representation fo r reference.5.3 Inspection itemsNote: 1) “O” means inspect items.2) “※” means the items not to be inspected.6 paint。

Marine Paint GuideUpdated: 16/12/141. Definitions and abbreviationsTOLERANCESThe numerical information quoted on marine product datasheets has been derived from laboratory test data obtained under controlled conditions for the products described. Whilst every effort has been made to ensure accuracy, this information will be subject to minor variations obtained in normal manufacturing tolerances, and any fluctuations in ambient conditions during the application and curing periods.GLOSS LEVELTypical gloss values have been determined in accordance with ISO2813:1994/ Corr 1:1997 using a 60° gloss head or, for North America,ASTM-D-523. The categories used in the data sheet are:Finish (sheen)Gloss (60°) headMatt0-15Eggshell16-30Semi-gloss31-60Gloss61-85High gloss>85In practice, the level of sheen and surface finish will be dependent upon a number of factors, including application and the condition of the surface to be overcoated.DRY FILM THICKNESS(DFT)The measured thickness of the final dried film applied to the substrate.WET FILM THICKNESS (WFT)The initial thickness of the wet coating applied to the substrate.VOLUME SOLIDSThe volume solids figure given on the product data sheet is the percentage of the wet film, which remains as the dry film, and is obtained from a given wet film thickness under specified application method and conditions. These figures have been determined under laboratory conditions using a modification of the test method described in ISO 3233:1998/Corr 1:1999 –Determination of Volume Solids by Measurement of Dry Film Density. The modification is technically equivalent involving the use of slightly smaller glass slides. For North America, volume solids are measured by ASTM-D-2697 (1986) which determines the volume solids of a coating using the recommended dry film thickness of the coating quoted on the product data sheet, and a specified drying schedule at ambient temperature, i.e. 7 days at 25°C + 1°C.DRYING TIMEThe drying times quoted in the product data sheet have beendetermined in the laboratory using a typical dry film thickness, the ambient temperature quoted in the relevant product data sheet, and the appropriate testmethod, i.e.Touch Dry (ISO 1517 - 1973) - The surface drying state of a coating when Ballotini (small glass spheres) can be lightly brushed away without damaging the surface of the coating.Hard Dry (ISO 9117-1990) - The condition of the film in which it is dry throughout its thickness, as opposed to that condition in which the surface of the film is dry but the bulk of the coating is still mobile.This through drying state is determined by the use of a “mechanical thumb” device “in situ”at the temperature quoted.In North America the Touch Dry, Hard Dry and Re-coat times are determined in accordance with ASTM-D-1680 (1995) using sections7.5, 7.7 and 7.8 respectively.The drying times achieved in practice may show some slight fluctuation,particularly in climatic conditions where the substrate temperature differs significantly from the ambient air temperature and because of variations in practical dry film thickness.OVERCOATING INTERVALThe product data sheet gives both a “minimum” and a “maximum”overcoating interval and the figures quoted at the various temperatures are intended as guidelines, consistent with good painting practices.Certain terms require elaboration as follows:MinimumThe “minimum overcoating time” quoted is an indication of the time required for the coating to attain the necessary state of dryness and hardness to allow the application of a further coat of paint without the development of any film irregularities such as lifting or loss of adhesion of the first coat (ASTM-D-1640). It assumes:(i)the coating has been applied at the normal recommended thickness.(ii)environmental conditions both during and after application were as recommended forthat particular coating, especially in respect of temperature, relative humidity andventilation.(iii)the paint used for overcoating is suitable for that purpose.(iv)an understanding of the “method of application”. For example, if a coating can be applied by both brush and spray it is expected that overcoating may be carried outmore rapidly if sprayed and it is the “lowest” figure that is quoted.If the above conditions are not met, the quoted minimum overcoating times are liable to variation and will invariably have to be extended.MaximumThe “maximum overcoating time” indicates the allowable time period within which overcoating should take place in order to ensure acceptable intercoat adhesion is achieved.ExtendedWhere an “extended” overcoating time is stated, the anticipated level of intercoat adhesion can only be achieved if:(i) the coating has been applied in accordance with good painting practices and at the specified film thickness.(ii) the aged coating has the “intended” surface characteristics required for long term overcoatability. For example, an over- applied epoxy MIO may not have its usual “textured”surface and will no longer be overcoatable after ageing unless it is abraded.(iii) the coating to be overcoated must be intact, tightly adherent, clean, dry and free from all contaminants. For example, the leached layer on an antifouling coating is usually porous and friable and must be removed to provide the necessary surface for overcoating.(iv) coatings having a glossy surface which could have a detrimental effect on the adhesion of subsequent coats should be treated by light surface abrasion, sweep blasting, or other suitable processes which will not cut through or detract from the performance of the underlying coating.(v) in some situations, and with specific products, it may be necessary to high pressure fresh water wash prior to overcoating.It should be recognised that the level of intercoat adhesion obtained is also dependent upon the chemistry of the “topcoat”. By their nature,primers or undercoats will have inherently better adhesion than finish coats.The measurement of ultimate “adhesion strength” can often be a difficult process, and interpretation of results can be subjective. Excellent adhesion does not necessarily mean good performance, nor does relatively poor adhesion necessarily mean poor performance.Although the adhesion of coatings applied to aged / cured coatings may be deemed satisfactory for the specified end use, actual numerical values obtained for adhesion may be less than with coatings applied within“minimum / short” overcoating intervals.FLASH POINTThe minimum temperature at which a product, when confined in a Setaflash closed cup, must be heated for the vapours emitted to ignite momentarily in the presence of aflame (ISO 3679:1983). In North America Flash Point is determined in accordance with ASTM-D-3278(1996).VOLATILE ORGANIC COMPOUND (VOC)VOC content is the weight of volatile organic compounds which participate in atmospheric photochemical reactions for litre of paint.Legislative requirements differ from country to country, and from region to region, and are constantly being reviewed. Values quoted for VOC on the product data sheet are calculated from the product formulation or have been determined practically in the laboratory using one of the following published test methods:-UK-PG6/23(92), Appendix 3This test method was published in February 1992, by the UK Department of the Environment as part of the Secretary of State’s Guidance Note(PG6/23(92)), issued as a guide to local authorities on the appropriate techniques to control air pollution, in order to achieve the objectives laid down in the Environmental Protection Act 1990. The method described in Appendix 3 includes guidance on the method of meeting VOC of coatings, as applied to demonstrate compliance with Clause 19 of the Guidance Note.USA - EPA Federal Reference Method 24The Environmental Protection Agency (EPA), published procedures for demonstration of compliance with VOC limits under Federal Reference Method 24 “The Determination of Volatile Matter Content, Density,Volume Solids and Weight Solids of Surface Coatings”. This method was originally published in the Federal Register in October 1980, and coded40 CFR, Part 60, Appendix A, and amended in 1992 to incorporate instructions for dealing with multi-component systems, and a procedure for the quantitative determination of VOC exempt solvent.It is recommended that users check with local agencies for details of current VOC regulations, to ensure compliance with any local legislative requirements when proposing the use of any coating.EU Council Directive 1999/13/ECThe purpose of this directive is to prevent or reduce the direct and indirect effects of the emission of volatile organic compounds into the environment, mainly into air, and the potential risks to human health. In essence the directive sets emission limits for coatings users(installations), these differ by application and for old/new installations. For the purpose of the Directive a Volatile Organic Compound (VOC) is defined as:“Any organic compound having at 293.15 K a vapour pressure of 0.01kPa or more, or having a corresponding volatility under the particular conditions of use.”WORKING POT LIFEThe maximum time during which the product supplied as separate components should be used after they have been mixed together at the specified temperature.The values quoted have been obtained from a combination of laboratory tests, and application trials, and refer to the time periods under which satisfactory coating performance will be achieved.Application of any product after the working pot life has been exceeded will lead to inferior product performance, and must NOT be attempted,even if the material in question appears liquid in the can.SHIPPING WEIGHTThe shipping weights quoted are typical values and refer to the total weight of the product supplied plus the weight of the can and are for guidance only. They will vary according to the specific colour. These weights are quoted for individual components and do not take into account any additional packaging weight attributable to cartons, etc. Factory supplied material will show differences to the figures quoted on the product Technical Data Sheet.SHELF LIFEThe shelf life quoted on the product datasheets is generally a conservative value, and it is probable that the coating can be applied without any deterioration in performance after this period has elapsed.Exceeding the shelf life of a product does not necessarily render it unusable. However, if the specified shelf life has been exceeded, it is recommended that the condition of the material is checked before any large scale application is undertaken using materials beyond the quoted shelf life. If this occurs, contact International for advice on how to progress.。

Effect of pH and Temperature on EnzymeActivityEnzymes are biological catalysts that speed up chemical reactions in living organisms. They are essential for many biochemical processes, such as digestion, metabolism, and DNA replication. Enzyme activity is affected by many factors, including pH and temperature. In this article, we will discuss the effect of pH and temperature on enzyme activity.Effect of pH on Enzyme ActivitypH is a measure of the acidity or basicity of a solution. Enzymes have an optimal pH range at which they function most efficiently. This optimal pH range varies for different enzymes. For example, the optimal pH for pepsin, an enzyme found in the stomach that breaks down proteins, is around 2.0, which is very acidic. In contrast, the optimal pH for alkaline phosphatase, an enzyme found in the liver and bones, is around 9.0, which is very basic.When the pH of the environment deviates from the optimal pH range for an enzyme, the enzyme's activity decreases. This is because enzymes are sensitive to changes in pH. At low pH levels, the enzyme may denature or lose its shape, making it unable to bind to its substrate and catalyze the reaction. At high pH levels, the enzyme may become too alkaline, which can also cause denaturation.Effect of Temperature on Enzyme ActivityTemperature is another critical factor that affects enzyme activity. Enzymes have an optimal temperature range at which they function best. For most enzymes, this optimal temperature is around 37°C, which is body temperature. However, there are exceptions to this rule. For example, enzymes in psychrophiles, organisms that thrive in extreme cold, have an optimal temperature range of 0-15°C.When the temperature of the environment deviates from the optimal temperature range for an enzyme, the enzyme's activity decreases. At low temperatures, enzymes have less kinetic energy, which means they move more slowly. This slows down the rate of the reaction and reduces enzyme activity. On the other hand, high temperatures can cause enzymes to denature and lose their shape, rendering them inactive.pH and Temperature InteractionThe effect of pH and temperature on enzyme activity can also interact with each other. Enzymes may have different optimal temperature ranges depending on the pH of the environment. For example, acid phosphatase, an enzyme found in the prostate gland, has an optimal temperature range of 30-40°C at pH 4.5, but an optimal temperature range of 55-60°C at pH 7.0.ConclusionIn conclusion, pH and temperature are critical factors that affect enzyme activity. Enzymes have optimal pH and temperature ranges at which they function most efficiently. Deviations from these optimal ranges can reduce enzyme activity by causing denaturation or slowing down the reaction. The effect of pH and temperature on enzyme activity can also interact with each other, meaning optimal temperature ranges may change depending on the pH of the environment. Understanding the effect of pH and temperature on enzyme activity is essential for researchers and scientists studying biochemistry and biology.。

锂离子电池硅薄膜电极充电膨胀的有限元仿真及其实验验证季家磊;朱孔军;刘鹏程;钱国明;王裕;刘劲松【摘要】硅基负极锂离子电池材料因其具有高的理论容量(4200m Ah/g)而成为最有希望的高容量负极材料之一.但硅负极在充放电过程中的体积效应,将引起电极材料粉化以及循环性能变差.为解决上述问题,将硅与惰性过渡金属材料复合,过渡金属充当体积效应的缓冲层.本文利用有限元软件abaqus对比了三种不同的硅薄膜材料(Si/Si-M n/Si-Zr).通过磁控溅射方法制备了上述三种硅薄膜材料,并对其进行了SEM、XRD、循环性能等测试,实验得出的结论与仿真结果一致,加入的过渡金属材料有利于缓解体积效应,且Mn材料的缓解效应更强.%Si is the most promising anode material for high energy lithium ion battteries because of its high specific capacity(4200mAh·g -1).But its undesirable volume enpansion results in me-chanical degration and capacity reduction.It is a promising way to combine Si and inert metal to relieve the expansion duringLi+insertion/extraction.In this article,use Abaqus to compare three different Si thin films(Si,Si-Mn,Si-Zr).Si thin film was deposited on Cu foil by magne-tron supttering for use as lithium ion battery anode material.The electrochemical performance of Si film was investgated by cyclic voltammetry and constant current charge/discharge test.The results consistent with simulation.The use of metal material is useful for the electronical per-formance and Zr is more useful than M n.【期刊名称】《电池工业》【年(卷),期】2017(021)006【总页数】9页(P19-27)【关键词】锂离子电池;硅薄膜负极;惰性金属;Abaqus;磁控溅射【作者】季家磊;朱孔军;刘鹏程;钱国明;王裕;刘劲松【作者单位】南京航空航天大学航空宇航学院,江苏南京 210016;南京航空航天大学航空宇航学院,江苏南京 210016;广州大学机械与电子工程学院,广东广州510006;南京航空航天大学航空宇航学院,江苏南京 210016;南京航空航天大学材料科学与工程学院,江苏南京 210016;南京航空航天大学材料科学与工程学院,江苏南京 210016【正文语种】中文【中图分类】TM910.21 IntroductionDue to their advantages of high energy density, long life, low toxicity and environmental friendliness, lithium-ion batteries(LIBs) have become the most promising and widely applied rechargeable batteries.[1] LIBs have been widely used in portable electronics such as mobile phone, digital camera, DV, laptop, and (hybrid) electrical vehicles. The theoretical capacity of commercial graphite (used as anode) is only 372mAh/g[2], and can not meet the increasing demands for lithium-ion batteries with high energy density and long cycling life. In recent years, the development of new high capacity anode material has attracted significant interest. It is well known that some elements can electrochemical react with Li with high capacity.Some alloying elements with high theoretical capacities, such as Si, Sn, Ge Al[3-6], and conversion electrodes such as NiO, and Co3O4[7-8],have been studied extensively. Among these material, Si has high theoretical capacity,4100mAh/g, ten times of graphite[9]. However, Si shows a massive volume expansion/contraction during Li+ insertion/extraction, larger than 300% after fullly lithium insertion[10]. This causes the pulverization of Si particle and loose contacts between Si particles and current collector, which will further result in mechanical in mechanical instability and poor cyclability[11-13]. To solve such problems, combine Si and inert metal materials which can relieve the huge volume change of Si thin films during lithiation and delithiation. Researchers have made attempts to improve the electrochemical performance of Si thin films as anode material, among which, the introduction of a secondary material is an effective way[14-16].In this study, choose secondary materials which have good conductivity and ductility and act as buffer to alleviate the particle pulverization. Use Abaqus to compare the stree and strain in three different thin films(Si, Si-Mn, Si-Zr) during Li+ insertion/extraction and analyse the role of the inert metal. Then, fabricate above Si thin films by magnetron supttering. The electrochemical performance of Si film was investgated by cyclic voltammetry and constant current charge/discharge test. The experimental results consist with the simulation. The use of metal material is useful for the cycling performance and Mn is more useful.2 Finite Element ModelLi+ insertion will result in a distorted lattice, volumetric expansion, mechanical stresss occures because of the constraint of Cu substrate. The size and stiffness of the substrate(Cu foil) is much lower than Si thin film, the deformation of Cu foil is then much lower than Si thin film and can be neglected, we assume the substrate to be rigid. Cracking and interface debonding are not considered, body force and inertia effects are neglected. Mechaniacl deformaion is thought to be quasi-static because it is much slower than diffusion process.An axisymetric finite element model under a cylindrical polar coordinate system(r,θ,z) is used in Abaqus. Si thin film is assumed to be homogeneous and isotropic and be firmly bonded to the rigid substate. Because mechanical stress and diffusion process influence each other, fully coupled thermal-mechanical transient analysis procedure is used. First-order elements are used for the highly nonliner problem, finite element size is set to 1% of the height of Si thin film and fine mesh is used due to stress concentration. To improve convergence of the nonliner problem, liner search algorithm and maximum 5 interations are used.There is no diffusion-stress aanalysis in Abaqus,use the method proposed by Prussin[17] as convention. Mechanical response under concetration loading is analogous to that under temperature loading, stress caused by diffusion is analogous to thermal stress.Extending the 1D relation given by Prussin[17] to 3D, the constitutive equation for diffudsion-induced deformation of an elastic solid can be expressed(1)Fig.1 Structure of thin filmwhere εij(i,j=1,2,3) are componts of strain tensor; σij(i,j=1,2,3) are componts of stress tensor; c(mol m3) is concentration of diffusion componts; Ω is partial molar volume representing v olume expansion caused by diffusion of Li+; E is elastic modulus; υ is posson’s ratio. Stress caused by diffusion is analogous to that caused by temperature gradient, Ω/3 plays the same role as thermal expansion coefficient in thermal stress analysis.2.1 Structure and MaterialThe model of anode is based on the 2016-type cell which is used to be tested later. The anode of 2016-type cell is wafer thin film The thickness and radius of the Si thin film is D and R, the thickness of transition metal material is d. According to 2016-type cell, R is set to be 6μm. BourderauS[18] fabricated the Si thin film with 1.2μm which had bad cycling performance, while thin film with 275nm[19] had better cycling performance, thus D is set to be 500nm. Transition metal just works as buffer layer and not participate in LI+ insertion/extraction, d is smaller than Si and set to be 200nm(Fig. 1.).Based on volumes of lithiated silicon at different Li-Si alloy phases[20], and linear relations between Li fraction and elastic constants[21- 22], dependence of elastic constants on concentration c (fmol mm-3) is expressed.E=E0+k1 c，υ=υ0+k2 c.(2)Where E0=130Gpa, V0=0.22[23]. k1= -0.13Gpa.μm3fmol-1，k2=-0.00047μm3fmol-1(minus k1、k2 represents the soften of Si electrode during lithium intercalation.)The choice of transition metal must have good ductility, it acts as the buffer to alleviate the huge expansion, at the same time, it doesn’t act with Li+. Metal choosed here is Mn and Zr.2.2 Boundary ConditionAs metioned previous,the structure of the electrode is wafer type and symmetry, also the electrode is surrounded by invariant Li-ion concentration,the electrod can be treated as a symmetric finite model, and for simplify, we choose a section for analysis.The initial condition iswhen t=0, c=0.(3)In potentiostatic operation,the electrode surfaces are surrounded by an invariant Li-ion concentration, cs, so the concentration of Li-ion on the top surface and edge surface is fixed.when 0<t<t1, r=R, c=cs.(4)when 0<t<t1, z=h, c=cs.(5)Cu foil is rigid substrate and doesn’t take part in Li+ diffusion,(6)Under the cylindrical polar coordinate system, the structure, boundary conditions and loading conditions are all axisymmetric.when t>0,r=0, ur=0.(7)Volume change consistsin stress because of the constraint of substrate. Because the film is firmly adherent to the substrate, there is no lateral displacements occures on the interface.when t>0,z=0,ur=uθ=uz=0.(8)There is no mechanical loading applied on the top surface and side sur face.when t>0,在z=h处,σz=0.(9)when t>0, r=R, z>0, σr=0.(10)3 Simulation Results3.1 Concentratin, Displacement and Stress FieldsThe concentration field before fully insertion is showed in Fig. 2a. Due to the edge diffusion, concention is dependent on radial coordinate. For the central region of the electrode, concentration is dependent on axial displacement.The displacement and stress field after fully insertion is showed in Fig. 2b-e.Fig. 2d-e. shows the expansion caused by lithium-ion insertion includes radial extension and bending.The radial displacement is concentrated at the edge of the top surface and the maximum radial displacement occures at the edge on the top surface, also there is little radial displacement in the central region of the film.The maximum axial displacement occures at the center of the top surface. Axial displacement in the central region can be regarded to be independent of radial coordinate. Due to the fixed constraint of the rigid substrate, negative axial displacement is possible near the edge on the interface. A dome-like morphology is formed due to the axial and lateral expansions.Fig.2 Concentration, displacemt and stress fields (a.concentration field, b.stress field, c, d, e. displacement field in equilibrium state) Fig.2b shows the stress caused by lithium-ion insertion mainly occures at the center of the top surface and the edge of the bottom surface.3.2 ComparasionofDisplacement/StressFieldsinDifferentSi-MThinFilms The displacement after fully insertion is showed in Fig.3. The distribution of displacement in different Si-M electrode is similar. No matter the total displacement or vertional/radial displacement declines while the metal is used.Same conclusion can be achieved in the stress fields (Fig. 4). The maximun of von mises of Si-M thin film is less than Si thin film. Both the results of displacement and stress comparasion fields reveals that use of metal is beneficial to the Si anode to experience less destroy during insertion.Fig.3 Comparasion of displacement fields (a.total, b.radial, c.axial displacement)Fig. 4 Comparasion of stress fields(a.Si, b.Si-Mn,c.Si-Zr)4 Experimental Results4.1 ExperimentalSi thin films were prepared in an PVD 75 multi-target magnetron sputtering system(KJLC, Co.). The samples were deposited on both Si wafer for thickness measurement and Cu foil for electrochemical measurements. The target was N-type monocrystalline Si with 2 inch diameters and 99.999% purity, Mn with 99.9% purity and Zr with 99.5% purity. The target-substrate distance of the sputtering system was set to be 50mm. After the base pressure reached 8.3×10-4 Pa, Ar (99.999%) was introduced into the chamber. The working pressure was kept at 8mtorr. Si thin films were deposited using a constant radio frequency power supply of 100W.Thefilm thickness was controlled by deposition time.The amount of deposited Si was calculated assuming a density of 2.33g·cm-3 for the Si thin film.The morphology and accurate thickness of Si thin films were measured by the field emission scanning electron microscopy (FSEM, SIGMA, Germany). The phase structure of was analyzed by X-ray diffraction (XRD, Bruker D8 Advance, Germany).To evaluate the electrochemical properties of the Si thin film anode, 2025-type half-cells were assembled in an argon-filled glove box with H2O andO2 concentrations of less than 1ppm. A lithium metal foil was used as a counter electrode, and Celgard2400 was used as a separator. Theelectrolyte solution was 1.0 M LiPF6 in EC/DEC (1∶1 vol/vol). Cyclic voltammetry measurements were performed using an electrochemical workstation (Princeton PARSTAT MC) at a scan rate of 0.01 mV in the potential range 0V～1.5V.Galvanostatic charge/discharge measurement was carried out using a Land battery test system (LAND CT2001A) with the cut off potentials being 0V versus Li/Li+ for discharge and 1.5V versusLi/Li+ for charge.4.2 Results and DiscussionFig.5 SEM images(a.cross-ssection, subface of b.Si, c. Si-Mn, d. Si-Zr)The cross-sectional SEM image of Si thin film deposited on a Si wafer is presented in Fig. 5a. The thickness of the dense Si、Mn、Zr can be observed,and the corresponding growth rate can be calculated,finally actual operating time was obtained accoring to the target thickness(Tab 1). Table1SputteringParameterTargetSiMnZrPower(W)100100100Time(min)606030Th ickness(nm)320200170Rate(nm/min)5．33．35．7TargetThickness(nm)500 200200ActualTime(min)946035Fig.6. shows the XRD pattern of Si thin film deposited on Cu foil. All the diffraction peaks are attributed to the Cu foil, and no peak of Si appears, especially the typical peak for crystal Si at 28°. This indicates that the Si thin film is amorphous.Fig.6 XRD patterns of Si thin filmsThe L+ insertion/extraction reactions of Si thin film were studied by cyclic voltammetry. For all of the three thin films, three cyclic voltammetriccurves of the Si thin film are shown in Fig. 7. In the first scanning cycle, there is a cathodic peak at 0.32V, which disappears from the second cycle. This cathodic peak is attributed to the formation of a solid electrolyte interphase (SEI) layer due to decomposition of electrolyte on the film surface. Two cathodic peaks at 0.20V and 0.05V, as well as two anodic peaks at 0.50V and 0.33V, are observed on all three cyclic voltammograms; these are ascribed to the electrochemical reactions of Li+ insertion and extraction in the Si thin film. The slight difference in the intensity and the potential for each peak can be attributed to the kinetic effect involved in the cyclic voltammetry measurement.Fig.7 Cyclic voltammetry plots (scanning rate 0.1Mv/s，potential range0V～1.5V, a. Si; b.Si-Mn; c.Si-Zr)Fig.8.shows the first three times of the discharge/charge curves. The first discharge capacity of the Si, Si-Mn, Si-Zr thin film is 2045.0mAh·g-1, 2203.1mAh·g-1, 2505.0mAh·g-1, and initial coulombic efficiency is 101.76%, 103.98%, 102.89%. The first and second reversible capacity of the Si-Mn thin film is 1900.3mAh·g-1 and 1976.0mAh g-1，for Si-Zr, 1997.0mAh·g-1, 2054.7mAh·g-1,which is much larger than that of a graphiteanod e(1662.9mAh·g-1, 1692.3mAh· g-1,respectively). The irreversible capacity is attributed to the formation of a SEI layer in the first cycle. In evidence, a SEI-formation voltage plateau is observed near 0.32V, which disappears in the second cycle. This observation is also in good agreement with CV results.Fig.8 Discharge/charge curves (a. Si; b.Si-Mn; c.Si-Zr)Cycling performance of the Si thin films are shown in Fig. 9 a-c. The first reversible capacity 100mA/g for Si, Si/Mn, Si/Zr is 1692.3mAh/g,1830.8mAh/g, 1955.6mAh/g respectively, and 71.2%, 83.9%, 88.2% capacity remained after 50 cycles.The introduce of transition metal can enhance both the first reversible capacity and the capacity retention effectively, which proves that the metal can improve the cycling performance of Si thin films. Rate performance of the Si thin films are shown in Fig. 9 d-f.Fig.9 Eletronical performance of Si thin films (Cycling performance of a.Si, b. Si-Mn, c. Si-Zr, rate performance of d. Si, e. Si-Mn, f. Si-Zr)To further evaluate the performance of Si thin films, the rate capability measurements (Fig. 9d-f) at the quickly increased current density from 0.1A/g to 1A/g were carried out. For Si thin films, the discharge capacity of 2045.3mAh/g, 1413.2mAh/g, 1128.8mAh/g, 919.5mAh/g, 732.7mAh/g can be obtained at 0.1A/g, 0.2A/g, 0.3A/g, 0.5A/g, 1.0A/g, 0.1A/g. For Si-Mn, 2203.1mAh/g, 1718.9mAh/g, 1535.7mAh/g, 1329.6mAh/g, 1044.3mAh/g can be obtained, and for Si/Zr, 2505.0mAh/g, 1859.4mAh/g, 1661.2mAh/g, 1500.6mAh/g, 1117.8mAh/g can be delievered. Although suffering from the rapid change of the current density, the cell can still exhibit a stable cycling at each current. Importantly, 80% of the first reversible capacity can be remained for Si thin film when the current density is turned back to1A/g, and for Si-Mn, Si-Zr, 89.0% and 92.9% can be remained.It proved that use of metal is beneficial to the electrocal performance again.5 ConclusionIn this article, Si and inert metal is combined to relieve the expansion during Li+ insertion/ extraction. Use Abaqus to compare three different Si thin films (Si, Si-Mn, Si-Zr).we found that the use of inert metal reduces the displacement and stress induced during the Li+ insertion. Also, Si-M thin film used as anode material.was deposited by magnetron supttering The morphology of the Si-M thin films are similar, and XRD results reveals that the structure of Si thin films is amorphous. The electrochemical performance of Si thin films consistents with the simulation, use of metal can relieve the expansion and result in better cycling and rate performance. Among Mn and Zr, Mn is more useful.References：【相关文献】[1] Goodenough J B, Park K S, The Li-ion Rechargeable Battery: A Perspective[J],American Chemical Society, Journal,2013. 135(4):1167-76.[2] Wachtler M, Besenhard J O, Winter M, Tin and tin-based intermetallics as new anode materials for lithium-ion cells[J], Journal of Power Sources, 2001 , 94 (2) :189-193.[3] Obrovac M N, Krause L J, Reversible Cycling of Crystalline Silicon Powder[J],Journal of the Electrochemical Society, 2007,154 (2) :A103-A108.[4] Graetz J, Ahn C C, Yazami R, and Fultz B, Nanocrystalline and Thin Film Germanium Electrodes with High Lithium Capacity and High Rate Capabilities[J], 2004, 151 (5): A698-A702.[5] Wolfenstine J,Foster D,Read J, Behl W K, and Luecke W, Experimental confirmation of the model for microcracking during lithium charging in single-phase alloys[J], Journal of Power Sources, 2000 , 87 (1-2) :1-3.[6] Liu Y, Hudak N S, Huber D L, Limmer S J, Sullivan J P, and Huang J Y, In situ transmission electron microscopy observation of pulverization of aluminum nanowiresand evolution of the thin surface Al2O3 layers during lithiation-delithiation cycles[J], Nano Letters, 2011, 11 (10) :4188.[7] Wang Y, Qin Q Z, A Nanocrystalline NiO Thin-Film Electrode Prepared by Pulsed Laser Ablation for Li-Ion Batteries[J], Journal of the Electrochemical Society, 2002,149 (7):A873-A878.[8] Fu Z W, Wang Y, Zhang Y, and Qin Q Z, Electrochemical reaction of nanocrystallineCo3O4, thin film with lithium[J], Solid State Ionics, 2004,170:105-109.[9] Huggins R A, Advanced batteries: Materials science aspects[M], SpringerBerlin, 2009.[10] Lee S J, Lee J K, Chung S H, Lee H Y, Lee S M, and Baik H K, Stress effect on cycle properties of the silicon thin-film anode[J],Journal of Power Sources, 2001, 97: 191-193. [11] Winter M, Besenhard J O, ChemInform Abstract: Electrochemical Lithiation of Tin and Tin‐Based Intermetallics and Composites[J], Electrochimica Acta, 1999. 45:31-50.[12] Yoshio M, Tsumura T, Dimov N, Electrochemical behaviors of silicon based anode material[J], Journal of Power Sources, 2006 , 153 (2) :375-379.[13] Wang D Y, Wu X D, Wang Z X, and Chen L Q, Cracking causing cyclic instability of lifepo 4, cathode material[J], Journal of Power Sources, 2005, 140 (1) :125-128.[14] Datta M K, Maranchi J, Chung S J, Epur R, Kadakia K, and Jampani P, Amorphous silicon-carbon based nano-scale thin film anode materials for lithium ion batteries[J], Electrochimica Acta, 2011, 56 :4717-4723.[15] Zhou Y N, Li W J, Chen H J, Liu C, Zhang L, and Fu Z, Nanostructured nisi thin films asa new anode material for lithium ion batteries[J], Electrochemistry Communications, 2011,13 (6) :546-549.[16] Imai Y, Watanabe A, Energetics of compounds related to Mg 2 Si as an anode material for lithium-ion batteries using first principle calculations[J], Journal of Alloys & Compounds, 2011, 509 (30) :7877-7880.[17] Prussin S, Generation and Distribution of Dislocations by Solute Diffusion[J], Journal of Applied Physics, 1961 ,32(10):1876-1881.[18] Bourderau S, Brousse T, Schleich D M, Amorphous silicon as a possible anode material for Li-ion batteries[J], Journal of Power Sources, 1999 ,81-82 (9) :233-236. 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第51卷第1期2020年1月中南大学学报(自然科学版)Journal of Central South University(Science and Technology)V ol.51No.1Jan.2020结霜初期超疏水表面液滴生长的规律赵伟，梁彩华，成赛凤，罗倩妮(东南大学能源与环境学院，江苏南京，210096)摘要：为了研究结霜初期液滴在超疏水表面的生长规律，建立结霜初期超疏水表面液滴生长的分层模型，揭示液滴在生长过程中各层温差的分布特点，并深入研究表面接触角、面积分数、基底温度以及空气相对湿度对液滴生长的影响规律。

研究结果表明：在结霜初期，液滴的Knudsen层以及主流连续区层这2部分的温差占基底过冷度的95%以上；随着表面接触角的增大，传质环节中的主流连续区层的温差减小，导致液滴生长减缓；面积分数S对液滴生长的影响较小，当S=0.04时，与其相关的热阻Rwe仅约占液滴-翅片层总热阻的0.2%；液滴生长速率随着基底温度的降低和空气相对湿度的升高而升高。

关键词：超疏水表面；液滴生长；接触角；面积分数中图分类号：TK124文献标志码：A文章编号：1672-7207（2020）01-0231-08Rule of droplets growth in the early stage of frost formation onsuperhydrophobic surfacesZHAO Wei,LIANG Caihua,CHENG Saifeng,LUO Qianni(School of Energy and Environment,Southeast University,Nanjing210096,China) Abstract:In order to study the droplets growth on the superhydrophobic surfaces in the early stage of frostformation,the model of droplets growth under frosting conditions was established.The proportion of the temperature difference of each layer in the droplets growth process was analyzed.The effects of contact angle, area fraction,substrate temperature and relative humidity on droplets growth were studied.The results show that in the early stage of frost formation,the temperature difference of the Knudsen layer and the continuum region layer account for more than95%of the total temperature difference.With the increase of surface contact angle,the temperature difference of continuum region layer decreases,which leads to the slow growth of droplets.The areafraction S has little effect on the droplets growth.When S=0.04,the related thermal resistance Rweonly accounts for about0.2%of the total thermal resistance of the droplet-fin layer.The rate of droplets growth increases as the substrate temperature decreases and the relative humidity of the air increases.Key words:superhydrophobic surfaces;droplets growth;contact angle;area fractionDOI:10.11817/j.issn.1672-7207.2020.01.026收稿日期：2019−03−12；修回日期：2019−05−23基金项目(Foundation item)：国家自然科学基金资助项目(51676033)；“十三五”国家重点研发计划项目(2016YFC700304) (Project(51676033)supported by the National Natural Science Foundation of China;Project(2016YFC700304)supported by the National Key R&D Programs during the13th Five-Year Plan Period)通信作者：梁彩华，博士，教授，博士生导师，从事制冷空调、建筑节能及可再生能源利用研究；E-mail：caihualiang@163.com第51卷中南大学学报(自然科学版)空气源热泵在冬季制热运行时不可避免地会出现结霜现象。

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Quantitative Analysis定量分析.Quench 淬火,骤冷.Quick Disconnect快速接头.Quill纬纱绕轴.*****R*****Rack 挂架.Radial Lead放射状引脚.Radio Frequency Interference (RFI)射频干扰.Rake Angle抠角,耙角.Rated Temperature, Voltage额定温度,额定电压. Reactance电抗.Real Estate底材面,基板面.Real Time System 实时系统.Reclaiming再生,再制.Rediometer辐射计,光度计.Reel to Reel卷轮(盘)式操作.Reference Dimension参考尺度.Reference Edge参考边缘.Reflection反射.Reflow Soldering重熔焊接,熔焊.Refraction折射.Refractive Index折射率.Register Mark对准用标记.Registration对准度.Reinforcement补强物.Rejection剔退,拒收.Relamination(Re-Lam)多层板压合.Relaxation松弛.缓和.Relay继电器.Release Agent, Release Sheets脱模剂,离模剂. Reliability可靠度,可信度.Relief Angle浮角.Repair修理.Resin Coated Copper Foil背胶铜箔.Resin Content胶含量,树脂含量.Resin Flow胶流量,树脂流量.Resin Recession树脂下陷.Resin Rich Area 多胶区,树脂丰富区.Resin Smear胶(糊)渣.Resin Starve Area缺胶区,树脂缺乏区.Resist阻膜,阻剂.Resistivity电阻系数,电阻率.Resistor电阻器,电阻.Resistor Drift电阻漂移.Resistor Paste电阻印膏.Resolution解像,解像度,分辨率.Resolving Power解析(像)力,分辨力.Reverse Current Cleaning反电流(电解)清洗. 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Rise Time上升时间.Roadmap 线路与零件之布局图.Robber辅助阴极.Roller Coating辊轮涂布.Roller Coating滚动涂布法.Roller Cutter辊切机.Roller Tinning辊锡法,滚锡法.Rosin松香.Rotary Dip Test摆动沾锡试验.Routing切外型.Runout偏转,累绩距差.Rupture迸裂.*****S*****Sacrificial Protection牺牲性保护层.Salt Spray Test盐雾试验.Sand Blast喷砂.Saponification皂化作用.Saponifier皂化剂.Satin Finish缎面处理.Scaled Flow Test比例流量实验.Schemetic Diagram电路概略图.ScoringV型刻槽.Scratch刮痕.Screen Printing纲版印刷.Screenability纲印能力.Scrubber磨刷机,磨刷器.Scum透明残膜.Sealing封孔.Secondary Side第二面 .Seeding下种.Selective Plating选择性电镀.Self-Extinguishing自熄性.Selvage布边.Semi-Additive Process半加成制程.Semi-Conductor半导体.Sensitizing敏化.Separable Component Part可分离式零件.Separator Plate隔板, 钢板.Sequential Lamination接续性压合法.Sequestering Agent螯合剂.Shadowing阴影,回蚀死角.Shank钻针柄部.Shear Strength 抗剪强度.Shelf Life储龄.Shield遮蔽.Shore Hardness萧氏硬度.Short短路.Shoulder Angle肩斜角.Shunt分路.Side Wall侧壁.Siemens电阻值.Sigma (Standard Deviation)标准差.Signal讯号.Silane硅烷.Silica Gel硅胶砂.Silicon硅.Silicone硅铜.Silk Screen纲版印刷,丝纲印刷.Silver Migration银迁移.Silver Paste 银膏.Single-In-Line Package(SIP)单边插脚封装体.Sintering烧结.Sizing上胶,上浆.Sizing上浆处理.Skin Effect集肤效应(高频下,电流在传递时多集中在导体表面,使得道线内部通过电流甚少, 造成内部导体浪费,并也使得表面导体部分电阻升高.Skip Printing, Skip Plating漏印,漏镀.Skip Solder 缺锡, 漏焊.Slashing浆经.Sleeve Jint套接.Sliver边丝,边余.Slot, Slotting槽口.Sludge于泥.Slump塌散.Slurry稠浆,悬浮浆.Small Hole小孔.Smear胶渣.Smudging锡点沾污.Snap-off弹回高度.Socket插座.Soft Contact轻触.Soft Glass 软质玻璃(铅玻璃).Solder焊锡.Solder Ball锡球.Solder Bridging锡桥.Solder Bump 焊锡凸块.Solder Column Package锡柱脚封装法. Solder Connection焊接.Solder Cost焊锡着层.Solder Dam锡堤.Solder Fillet填锡.Solder Levelling喷锡,热风整平.Solder Masking(S/M)防焊膜绿漆.Solder Paste锡膏.Solder Plug锡塞(柱).Solder Preforms预焊料.Solder Projection焊锡突点.Solder Sag 焊锡垂流物.Solder Side焊锡面.Solder Spatter溅锡.Solder Splash贱锡.Solder Spread Test散锡试验.Solder Webbing锡纲.Solder Webbing锡纲.Solder Wicking渗锡,焊锡之灯芯效应. Solderability可焊性.Soldering软焊,焊接.Soldering Fluid, Soldering Oil助焊液,护焊油. Solid Content固体含量,固形分.Solidus Line固相线.Spacing间距.Span跨距.Spark Over闪络.Specific Heat 比热.Specification (Spec)规范,规格.Specimen样品,试样.Spectrophotometry分光光度计检测法. Spindle主轴,钻轴.Spinning Coating自转涂布.Splay斜钻孔.Spray Coating喷着涂装.Spur底片图形边缘突出.Sputtering溅射.Squeege刮刀.Stagger Grid蹒跚格点.Stalagometer滴管式表面张力计.Stand-off Terminals直立型端子.Starvation缺胶.Static Eliminator静电消除器.Steel Rule Die(钢)刀模.Stencil版膜.Step and Repeat逐次重复曝光.Step Plating梯阶式镀层.Step Tablet阶段式曝光表.Stiffener补强条(板).Stop Off防镀膜, 阻剂.Strain变形,应变.Strand绞(指由许多股单丝集束并旋扭而成的丝束).Stray Current迷走电流, 散杂电流(在电镀槽系统中,其直流电由整流器所提供,应在阳极板与被镀件之间的汇电杆与槽体液体中流通,但有时少部分电流也可能会从槽体本身或加热器上迷走,漏失).Stress Corrosion应力腐蚀.Stress Relief消除应力.Strike预镀.Stringing拖尾.Stripline条线.Stripper剥除液(器).Substractive Process减成法.Substrate底材.Supper Solder超级焊锡.Supported Hole(金属)支助通孔.Surface Energy表面能.Surface Insulation Resistance表面绝缘电阻.Surface Mount Device 表面粘装组件.Surface Mounting Technology (SMT)表面粘装技术. Surface Resistivity表面电阻率.Surface Speed钻针表面速度.Surface Tension表面张力.Surfactant表面润湿剂.Surge突流,突压.Swaged Lead压扁式引脚.Swelling Agents, Sweller膨松剂.Swimming 线路滑离.Synthetic Resin合成树脂.*****T*****Tab接点,金手指.Taber Abraser泰伯磨试器.Tackiness粘着性, 粘手性.Tape Automatic Bonding (TAB)卷带自动结合.Tape Casting 带状铸材.Tape Test撕胶带试验.Tape Up Master原始手贴片.Taped Components卷带式连载组件.Taper Pin Gauge锥状孔规.Tarnish污化.Tarnish 污化, 污着.Teflon铁氟龙(聚4氟乙烯).Telegraphing浮印,隐印.Temperature Profile温度曲线.Template模板.Tensile Strength抗拉强度.Tensiomenter张力计.Tenting盖孔法.Terminal端子.Terminal Clearance端子空环.Tetra-Etch氟树脂蚀粗剂.Tetrafunctional Resin四功能树脂.Thermal Coefficient of Expansion (TCE)热膨胀系数. Thermal Conductivity导热率.Thermal Cycling热循环,热震荡.Thermal Mismstch感热失谐.Thermal Relief散热式镂空.Thermal Via导热孔.Thermal Zone感热区.Thermocompression Bonding热压结合. Thermocouple热电偶.Thermode发热体.Thermode Soldering热模焊接法. Thermogravimetric Analysis, (TGA)热重分析法. Thermomechanical Analysis (TMA)热机分析法. Thermoplastic热塑性.Thermosetting热固性.Thermosonic Bonding热超音波结合.Thermount聚醯胺短纤席材.Thermo-Via导热孔.Thick Film Circuit厚膜电路.Thief辅助阳极.Thin Copper Foil薄铜箔.Thin Core薄基板.Thin Film Technology薄膜技术.Thin Small Outline Package(TSOP)薄小型绩体电路器.Thinner调薄剂.Thixotropy抗垂流性,摇变性.Three Point Bending三点压弯试验.Three-Layer Carrier三层式载体.Threshold Limit Value (TLV)极限值.Through Hole Mounting通孔插装.Through Put物流量,物料通过量.Throwing Power分布力.Tie Bar分流条.Tin Drift锡量漂飘失.Tin Immersion浸镀锡.Tin Pest锡疫(常见白色金属锡为"β锡",当温度低于13.2℃时则β锡将逐渐转变成粉末状灰色"α锡"称为"锡疫".Tin Whishers锡须.Tinning热沾焊锡.Tolerance公差.Tombstoning墓碑效应.Tooling Feature工具标示物.Topography表面地形.Torsion Strength抗扭强度.Touch Up触修,简修.Trace 线路,导线.Traceability追溯性,可溯性.Transducer转能器.Transfer Bump移用式突块.Transfer Laminatied Circuit转压式线路.Transfer Soldering移焊法.Transistor晶体管.Translucency半透性.Transmission Line传输线.Transmittance透光率.Treament, Treating含浸处理.Treeing枝状镀物,镀须.Trim修整, 精修.Trim Line裁切线.Trimming修整,修边.True Position真位.Tungsten钨Tungsten Carbide碳化钨.Turnkey System包办式系统.Turret Solder Terminal塔立式焊接端子.Twill Weave斜织法.Twist板扭.Two Layer Carrier两层式载体.UL Symbol(UL.为Under-Writers 保俭业试验所标志. Laboratories,INC)Ultimate Tensile Strength (UTS)极限抗拉强度. Ultra High Frequency (UHF)超高频率.Ultra Violet Curing (UV Curing)紫外线硬化. Ultrasonic Bonding超音波结合.Ultrasonic Cleaning超音波清洗.Ultrasonic Soldering超音波焊接.Unbalanced Transmission Line非平衡式传输线. Undercut, Undercutting侧蚀.Underplate底镀层.Universal Tester汛用型电测机.Unsupported Hole非镀通孔.Urea尿素.Urethane胺基甲酸乙脂.*****V*****Vacuoles焊洞.Vacuum Evaporation(or Deposition)真空蒸镀法. Vacuum Lamination真空压合.Van Der Waals Force凡得华力.Vapor Blasting蒸汽喷砂.Vapor Degreasing蒸汽除油法.Vapor Phase Soldering气相焊接.Varnish凡力水,清漆(树脂之液态单体).V-cutV型切槽.Very Large-Scale Integration(VLSI)极大绩体电路器. Via Hole 导通孔.Vickers Hardness维氏硬度.Viscosity粘滞度,粘度.Vision Systems视觉系统.Visual Examination目视检验.Void 破洞,空洞.Volatile Content挥发份含量.Voltage电压.Voltage Breakdown崩溃电压.Voltage Drop 电压降落.Voltage Efficiency电压效率.Voltage Plane电压层.Voltage Plane Clearance电压层的空环.Volume Resistivity体绩电阻率.Volume Resistivity体绩电阻率.Volumetric Analysis容量分析法.Vulcanization交联,硫化.Wafer晶圆.Waive暂准过关,暂不检查. Warp Size 浆经处理.Warp, Warpage板弯.Washer垫圈.Waste Treatment废弃处理. Water Absorption吸水性. Water Break水膜破散,水破. Water Mark水印.Watt瓦特.Watts Bath瓦兹镀镍液.Wave Guide导波管.Wave Soldering波焊. Waviness 波纹,波度.Wear Resistance耐磨性,耐磨度. Weatherability耐候性.Weave Eposure织纹显露. Weave Texture织纹隐现.Web蹼部.Wedge Bond 楔形结合点. Wedge Void楔形缺口(破口). Weft Yarn纬纱.Welding熔接.Wet Blasting湿喷砂.Wet Lamination湿压膜法.Wet Process湿式制程.Wetting Agent润湿剂.Wetting Balance沾锡天平. Wetting Balance沾锡,沾湿. Whirl Brush旋涡式磨刷法. Whirl Coating旋涡涂布法. Whisker晶须.White Residue白色残渣.White Spot白点.Wicking灯蕊效应.Window操作范围,传动齿孔. Wiping Action 滑动接触(导电). Wire Bonding打线结合.Wire Gauge线规.Wire Lead金属线脚.Wire Pattern布线图形.Wire Wrap绕线互连.Working Master工作母片.Working Time (Life)堪用时间.Workmanship 手艺,工艺水平,制作水准.Woven Cable扁平编线.Wrinkle皱折, 皱纹.Wrought Foil锻碾金属箔.*****X*****X AxisX轴.X-Ray X光.X-Ray FluorescenceX萤光.*****Y*****Yarn纱线.Y-AxisY轴.Yield良品率,良率,产率.Yield Point屈服点.*****Z*****Z-AxisZ轴.Zero Centering中心不变(叠合法).Zig-Zag In-Line Package (ZIP)炼齿状双排脚封装件.。

黑曲霉发酵生产糖化酶的工艺流程英文版The process of producing amylase by black Aspergillus fermentationAmylase is an important enzyme that catalyzes the hydrolysis of starch into sugars. It is widely used in various industries such as food, textile, and pharmaceuticals. One of the most common sources of amylase is black Aspergillus, a fungus known for its high amylase production.The process of producing amylase by black Aspergillus fermentation involves several steps. First, the fungus is cultured in a suitable medium containing starch as the substrate. The culture is then incubated at an optimal temperature and pH for the growth of the fungus and the production of amylase.During the fermentation process, the fungus secretes amylase into the medium, where it hydrolyzes the starch into sugars. The medium is then harvested and the amylase is extracted and purified using techniques such as filtration, chromatography, and precipitation.The purified amylase can be used in various industrial applications, such as in the production of glucose syrup, beer, and biofuels. The process of producing amylase by black Aspergillus fermentation is cost-effective and environmentally friendly, making it a popular choice for industries looking to incorporate enzyme technology into their processes.In conclusion, the process of producing amylase by black Aspergillus fermentation is a well-established and efficient method for obtaining this important enzyme. With the increasing demand for enzymes in various industries, this process is likely to play a key role in meeting the needs of the market.中文翻译黑曲霉发酵生产糖化酶的工艺流程糖化酶是一种重要的酶，可以催化淀粉水解成糖。

be used as an exterior aluminium finish usually within an alkyd system. Can be used as primer, mid coat or finish coat in atmospheric environments. Suitable for properly prepared carbon steel and aluminium substrates.The Application Guide (AG) must be read in conjunction with the relevant specification, Technical Data Sheet reference only one corresponding standard for the substrate being treated.sharp edges, weld spatter and treatment of welds is complete. It is important that all hot work is completedgrades higher than B, but it is practically challenging to ensure specified film thickness on such a rough surface,contamination that can interfere with coating adhesion, and prepare a sound substrate for the subsequent product. Inspect the surface for hydrocarbon and other contamination and if present, remove with an alkaline detergent. Agitate the surface to activate the cleaner and before it dries, wash the treated area using fresh water. Paint solvents (thinners) shall not be used for general degreasing or preparation of the surface forpainting due to the risk of spreading dissolved hydrocarbon contamination. Paint thinners can be used to treat small localized areas of contamination such as marks from marker pens. Use clean, white cotton cloths that are maximum soluble salts (sampled and measured as per ISO 8502-6 and -9) content on a surface are:Areas exposed to (ISO 12944-2):Date of issue: 1 August 2014Page: 1/7Rev.:by Jotun Groupwelds, sharp edges and corners shall conform to minimum grade P2 (ISO 8501-3) Table 1, or as specified. All edges shall have a rounded radius of minimum 2 mm subjected to three pass grinding or equally effectivemethod. Defective welds shall be replaced and treated to an acceptable finish before painting. Temporary weldsactivate the cleaner and before it dries, wash the treated area by Low-Pressure Water Cleaning (LPWC) to Wa 1 (ISO 8501-4) using fresh water. Non-contaminated areas shall be washed down by Low-Pressure Water filler to fill pittings. This should then be done either after the initial surface preparation or after application ofmedium suitable to achieve a sharp and angular surface profile of 30-85 µm, grade Fine to Medium G; Ry5 (ISOproduct and abrasive media and inspected for surface particulate contamination. Maximum contamination level isSuitable methods are disc grinding, hand sanding or hand wire brushing. Ensure the surface is free from mill scale, residual corrosion, failed coating and is suitable for painting. Do not use power wire brushing due to the shall be degreased using an alkaline detergent which is agitated with non-metallic brushes and then fresh water rinsed. The cleaned surface shall be then hand or machine abraded with non-metallic abrasives or bonded fibre machine or hand abrasive pads to remove all surface polish and to impart a scratch pattern to the surface. DoDate of issue: 1 August 2014Page: 2/7Rev.:by Jotun Groupsurface for oil, grease and other contamination and if present, remove with an alkaline detergent. Agitate themortar droppings and loose, chalked and flaking coating. Inspect the surface for oil, grease and othercontamination and if present, remove with an alkaline detergent. Agitate the surface to activate the detergent and before it dries, wash the treated area using plenty of fresh water. When applied on coatings past maximum zinc shop primers must be free of zinc salts (white rust). Corroded and damaged areas must be mechanicallySubstrate temperature560-°C 5-50°C 10-85%• Do not apply the coating if the substrate is wet or likely to become wet• Do not apply the coating if the weather is clearly deteriorating or unfavourable for application or curingDate of issue: 1 August 2014Page: 3/7Rev.:by Jotun GroupThinner/Cleaning solventJotun Thinner No. 2Nozzle tip (inch/1000) :Pressure at nozzle (minimum) :150 bar/2100 psi Pump output (litres/minute) :32:10.9-1.5Several factors influence, and need to be observed to maintain the recommended pressure at nozzle. Among factors causing pressure drop are:- long paint- and whip hoses - low inner diameter hoses - high paint viscosity - large spray nozzle size- inadequate air capacity from compressor15-1970-100Minimum Maximum TypicalDry film thicknessWet film thicknessFilm thickness and spreading rate Theoretical spreading rate204522,5306515255518(μm)(m²/l)application using a painter's wet film comb (ISO 2808 Method 1A). Use a wet-to-dry film calculation table to calculate the required wet film thickness per coat.standard using statistical sampling to verify the actual dry film thickness. Measurement and control of the WFT Date of issue: 1 August 2014Page: 4/7Rev.:by Jotun Groupreducing loss. Application of liquid coatings will result in some material loss. Understanding the ways thatcoating can be lost during the application process, and making appropriate changes, can help reducing material loss.Some of the factors that can influence the loss of coating material are:- type of spray gun/unit used- air pressure used for airless pump or for atomization - orifice size of the spray tip or nozzle - fan width of the spray tip or nozzle - the amount of thinner added- the distance between spray gun and substrate- the profile or surface roughness of the substrate. Higher profiles will lead to a higher "dead volume"- the shape of the substrate targetWalk-on-dry18 h 14 h 10 h 8 h Substrate temperature 5 °C10 °C23 °C40 °C24 h 12 h 8 h6 htackiness. Dry sand sprinkled on the surface can be brushed off without sticking to or causing damage to theextended extended extended extended5 °C10 °C23 °C40 °CDate of issue: 1 August 2014Page: 5/7Rev.:by Jotun GroupPrepare the area through sandpapering or grinding, followed by thorough washing. When the surface is dry the coating may be over coated by itself or by another product, ref. original specification.Always observe the maximum over coating intervals. If the maximum over coating interval is exceeded the surface should be carefully roughened in order to ensure good intercoat adhesion. Damages exposing bare substrate:Remove all rust, loose paint, grease or other contaminants by spot abrasive blasting, mechanical grinding,water and/or solvent washing. Feather edges and roughen the overlap zone of surrounding intact coating. ApplyThe following information is the minimum recommended. The specification may have additional requirements.- Confirm all welding and other metal work, whether internal or external to the tank, has been completed before commencing pre-treatment and surface preparation of the substrate- Confirm installed ventilation is balanced and has the capacity to deliver and maintain the RAQ- Confirm the required surface preparation standard has been achieved and is held prior to coating application - Confirm that the climatic conditions are within recommendation in the AG and held during the application - Confirm the required number of stripe coats have been applied - Confirm each coat meets the DFT requirements of the specification- Confirm the coating has not been adversely affected by rain or any other agency during curing- Observe adequate coverage has been achieved on corners, crevices, edges and surfaces where the spray gun cannot be positioned so that its spray impinges on the surface at 90°- Observe the coating is free from defects, discontinuities, insects, spent abrasive media and other contamination- Observe the coating is free from misses, sags, runs, wrinkles, fat edges, mud blistering, blistering, obvious pinholes, excessive dry spray, heavy brush marks and excessive film build - Observe the uniformity and colour are satisfactoryAll noted defects should be fully repaired to conform to the coating specification.CautionThis product is for professional use only. The applicators and operators shall be trained, experienced and have the capability and equipment to mix/stir and apply the coatings correctly and according to Jotun's technical documentation. Applicators and operators shall use appropriate personal protection equipment when using this product. This guideline is given based on the current knowledge of the product. Any suggested deviation to suit the site conditions shall be forwarded to the responsible Jotun representative for approval before commencing the work.For further advice please contact your local Jotun office.Health and safetyPlease observe the precautionary notices displayed on the container. Use under well ventilated conditions. Do not inhale spray mist. Avoid skin contact. Spillage on the skin should immediately be removed with suitable cleanser, soap and water. Eyes should be well flushed with water and medical attention sought immediately.Colour variationSome coatings used as the final coat may fade and chalk in time when exposed to sunlight and weathering effects. Coatings designed for high temperature service can undergo colour changes without affectingperformance. Some slight colour variation can occur from batch to batch. When long term colour and gloss retention is required, please seek advice from your local Jotun office for assistance in selection of the most suitable top coat for the exposure conditions and durability requirements.Accuracy of informationAlways refer to and use the current (last issued) version of the TDS, SDS and if available, the AG for this product. Always refer to and use the current (last issued) version of all International and Local Authority Standards referred to in the TDS, AG & SDS for this product.Date of issue: 1 August 2014Page: 6/7Rev.:by Jotun GroupReference to related documentsThe Application Guide (AG) must be read in conjunction with the relevant specification, Technical Data Sheet (TDS) and Safety Data Sheet (SDS) for all the products used as part of the coating system.When applicable, refer to the separate application procedure for Jotun products that are approved toAS/NZS = Australian/New Zealand StandardsUV = Ultravioletmin = minutes TDS = Technical Data Sheet AG = Application Guide psi = unit of pressure, pounds/inch²h = hours RH = Relative humidity (% RH)ISO = International Standards OrganisationNACE = National Association of Corrosion Engineersmg/m² = milligrams per square metre d = days° = unit of angleSDS = Safety Data SheetPPE = Personal Protective Equipment DFT = dry film thickness °C = degree Celsius g/kg = grams per kilogram SSPC = The Society for Protective CoatingsEPA = Environmental Protection Agencyg/l = grams per litreµm = microns = micrometresWFT = wet film thicknessMCI = Jotun Multi Colour Industry (tinted colour)UK = United KingdomBar = unit of pressureVOC = Volatile Organic Compoundm²/l = square metres per litreEU = European Union ASTM = American Society of Testing and Materials PSPC = Performance Standard for Protective Coatings RAQ = Required air quantityThe information in this document is given to the best of Jotun's knowledge, based on laboratory testing and practical experience. Jotun's products are considered as semi-finished goods and as such, products are often used under conditions beyond Jotun's control. Jotun cannot guarantee anything but the quality of the product itself. Minor product variations may be implemented in order to comply with local requirements. Jotun reserves the right to change the given data without further notice.Users should always consult Jotun for specific guidance on the general suitability of this product for their needs and specific application practices.If there is any inconsistency between different language issues of this document, the English (United Kingdom)Date of issue: 1 August 2014Page: 7/7Rev.:by Jotun Group。