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1.1目的规范本公司FPC( 柔性线路板) 设计标准, 提高设计员的设计水平, 及工作效率。
1.2 范围适用于本公司FPC( 柔性线路板) 设计1.3 职责研发部: 学习和应用FPC( 柔性线路板) 设计规范于开发新产品中。
1.4 定义无FPC设计规范与注意事项1 FPC机构设计规范1.1 LCD与FPC压合处要求如上图所示A: 表示FPC成型边到LCD PIN顶端要差0.10mm.B: 表示FPC PIN要比LCD压合PIN长0.10-0.20mm.C: 此处只给正负0.10mm的公差.D: 对位PIN到FPC两侧边不小于0.5mm.E: FPC PIN反面的PI覆盖膜距FPC PIN不小于0.3mm.F: 此处只给正负0.20mm的公差.G: 如果是FPC 需要从玻璃处弯折或是弯折距离<0.8mm , FPC的CVL需上玻璃0.10-0.20如上图所示: A: 双面胶要耐高温,长度最好能和FPC相等.T= 0.05mm.最好是3M厂商生产的,可靠性较好.B: 宽度用2.50正负0.30mm的即可.C: FPC出PIN要用月牙边,便于焊接.D: FPC出PIN要有漏锡过孔,孔单边焊盘不小于0.15mm,便于焊接.E: FPC PIN正反面不能相等,要正反面相差0.20-0.30mm,正反面不能出阻焊层.注:此连接方式最终要符合客户要求.1.3 FPC与主板插拔处要求(以HIROSE为例)如上图所示: A: 此处公差一定要控制在正负0.07mm以内, 重点尺寸.B: 此处公差一定控制在正负0.20mm以内.C: 此处只给正负0.10mm的公差.D: 此处公差一定控制在正负0.20mm以内.E: 倒角非常重要,一定要有,否则可能接触不良.F: 补强材料要硬,一般用宇部厂商生产的.较软的补强装配时金指会断裂.G: 此处厚度在0.19-0.21较好,重点尺寸.注: 以上是以HIROSE的连接器为例,具体项目要参考客户连接器规格书.1.4 FPC与主板以公母座连接器连接如上图所示: A: 焊盘设计以连接器规格说明为准, 辅助焊盘不能少。
FPC 05 20 01 n L T1.SCOPEThis specification covers the FPC CONNECTOR.2.ORDERING INFORMA TION3.CONNECTOR DIMENSIONSSee attached drawings.4.MA TERIALHousing :LCPColor :WhiteFlammability Rating (UL94V-0)Actuator :LCPColor :BrownFlammability Rating (UL94V-0)Terminal :Phosphor Bronze Peg :BrassPlating :See Ordering Information5.ACCOMMODA TED P YOUTSee attached drawings.2.0mm04-60PIN0.5 mmL:Low Contact SMT Type / U:Upper Contact SMT Type1 FPC Connector234567 PART NO.： 1 2 3 4 5 6 7Number of terminals High Pitch Series name Assembly style PlatingModeG:Gold flash over Nickel / T:Tin OVER NickelD:Double-Face Contact SMT Type03:Clamshell FFC T=0.2mm / 04:Drawer FFC T=0.2mm 01:Clamshell FFC T=0.3mm / 02:Drawer FFC T=0.3mm6.RA TINGITEMSTANDARDOperating Voltage (Max.)50V AC/DC Current Rating (Max.)0.4A AC/DC Operating T emperature7.PERFORMANCEITEMTEST CONDITIONREQUIRMENTELECTRICAL PERFORMANCEContact ResistanceMate applicable FPC/FFC and measure by drycircuit,20mV Max,10mA.(JIS C54025.4)20mMax.Insulation ResistanceMate applicable FPC/FFC and apply 500V DCbetween adjacent terminal or ground.(JIS C54025.2/MIL-STD-202Method 302)500MMin.Dielectric Strength Mate applicable FPC/FFC;apply 200V AC (rms)for 1minute between adjacent terminal and ground.(JIS C54025.1/MIL-STD-202Method 301)No BreakdownMECHANICAL PERFORMANCEFPC/FFC Retention ForcePull out force at a speed rate of 253mm per minute.Pos.X0.04kgf (0.4N)Min.Contact RetentionForceApply axial pull out force at the rate of 253mm/minute on the terminal assembled in the housing.Pos.X0.08kgf (0.8N)Min.ENVIRONMENTAL PERFORMANCE AND OTHERSTemperature RiseMateapplicableFPC/FFCandmeasurethetemperature rise of contact when the maximum AC rated current is passed.(UL498)Temperature rise 30C Max.-25~+85(Including terminal temperature rise)ITEMTEST CONDITIONREQUIRMENTAppearance Contact Resistance 40m Max.VibrationMate connectors and subject to the following vibration conditions,for period of 2hours in each of 3mutually perpendicular axes,passing DC 1mA during the test.Amplitude :1.5mm P-PFrequency:10~55~10Hz in 1minute.Duration:2hours in each of X,Y ,Z axes.(MIL-STD-202Method 201)Discontinuity1sec Max.Appearance Contact Resistance ShockMate applicable FPC/FFC and subject to the following shock conditions.3times of shocks shall be applied for each 6directions along 3mutuallyperpendicular axes,passing DC 1mA current during the test.(Total of 18shocks)Peak value :490m/s{50G}(JIS C0041/MIL-STD-202Method 213)Discontinuity1sec Max.2Appearance Heat ResistanceMate applicable FPC/FFC and expose to 85for 96hours.Upon completion of the exposure period,the test specimens shall be conditioned atambient room conditions for 1to 2hours,after which the specified measurements shall be performed.(JIS C0021/MIL-STD-202Method 108)Contact ResistanceAppearance Cold ResistanceMate applicable FPC/FFC and expose to -402for 2hours.Upon completion of the exposure period,the test specimens shall be conditioned at ambient room conditions for 1to 2hours,after which the specified measurements shall be performed.(JIS C0020)Contact Resistance Contact Resistance Dielectric Strength No BreakdownInsulation Resistance 250M Min.HumidityMate applicable FPC/FFC and expose to 402relative humidity 90to 95%for 96hours.Upon completion of the exposure period,the test specimens shall be conditioned at ambient room conditions for 1to 2hours,after which the specified measurements shall be performed.(JIS C0022/MIL-STD-202Method 103)AppearanceNo DamageNo DamageNo DamageNo Damage40m Max.40m Max.40m Max.40m Max.No Damageb)+8530minutesITEMTEST CONDITIONREQUIRMENTContact ResistanceTemperature CyclingMate applicable FPC/FFC and subject to thefollowing conditions for 5cycles.Upon completion of the exposure period,the test specimens shall be conditioned at ambient room conditions for 1to 2hours,after which the specified measurements shall be performed.1cycle a)-5530minutes(Transit time shall be with in 3minutes)(JIS C0025)AppearanceContact ResistanceSalt SprayMate applicable FPC/FFC and expose to thefollowing salt mist conditions.Upon completion of the exposure period,salt deposits shall beremoved by a gentle wash or dip in running water ,after which the specified measurements shall be performed.NaCl solutionConcentration :51%Spray time :484hours Ambient temperature :352(JIS C0023/MIL-STD-202Method 101)AppearanceNo DamageResistance to Soldering HeatWhen reflowingRefer to paragraph 8.Soldering iron methodSoldering time:30.5seconds Max.Solder temperature :3805AppearanceSolder abilitySolder Temperature:245Immersion Period:50.5secThe test area shall be covered more than 95%of immersed area with fresh solder .40m Max.No DamageNo Damage40m Max.Export CartonLayer 3Layers Carton Size 350x350x350mm04~18 24.48.INFRARED REFLOW CONDITIONTimesecondsTEMPERATURE CONDITION GRAPH (TEMPERA TURE ON BOARD PA TTERN SIDE)9.T APE AND REEL PACKAGE SPECIFICA TION9-1.T ape and Reel Dimensions:See attached drawings.9-2.SpecificationNo of Contacts.Width19~252426~483249~6044?PcsReelReels Carton2K12K 12K 12K1121917151。
FPC连接器,0.5间距,1.5mm⾼。
4-60PIN,下接触1 of 6Document No:LZR-RD062 Product Name:FPC CONN.04-68PINFPC 05 15 01 XX L X1.5mm2 of 61. SCOPE1.1. ContentsThis specification covers the performance, tests and quality requirements for the (With Cover), R/A,SMT, 0.5 mm Pitch, 1.50 mm H, Connector. 1.2. QualificationWhen tests are performed on the subject product line, the procedures specified in FPC 0.5mm Pitch series specifications shall be used. All inspections shall be performed using the applicable inspection plan and product drawing.2. ORDERING INFORMATION3. CONNECTOR DIMENSIONSSee attached drawings.4. MATERIALHousing :Hight-Temp plastic Color : WhiteFlammability Rating (UL94V-0) Actuator Hight-Temp plastic Color : Black. Flammability Rating (UL94V-0) Contact : Copper alloy Peg : Copper alloy Contact Plating See Ordering Information Peg Plating: Tin over Nickel5. ACCOMMODATED P .C.B. LAYOUT See attached drawings.Document No:LZR-RD062 Product Name:FPC CONN.0.5 mmL:Low Contact SMT Type / U:Upper Contact SMT Type1 FPC Connector234567 PART NO.： 1 2 3 4 5 6 7Number of terminals High Pitch Series name Assembly style Plating ModeG:Gold flash over Nickel / T:Tin OVER NickelD:Double-Face Contact SMT Type03:Clamshell FFC T=0.2mm / 04:Drawer FFC T=0.2mm 01:Clamshell FFC T=0.3mm / 02:Drawer FFC T=0.3mm3 of 66. RATING.ITEMSTANDARDOperating Voltage (Max.) 25 V AC/DC Current Rating (Max.) 0.3 A AC/DCOperating Temperature-25°C ~ +85°C (Including terminal temperature rise)7. PERFORMANCETEST ITEM REQUIREMENT PROCEDURE1 Examination of Product Meets requirements of productdrawing. No physical damage.Visual inspection.ELECTRICAL REQUIREMENT2Contact Resistance [ 30 ] m Ohm Max(Initial)Subject mated contacts assembled in housing to 20mV Max open circuit at 10mA Max. Refer to Fig.33Dielectric withstanding Voltage No creeping discharge or flashover shall occur. Current leakage: 0.5 mA MAX [ 500 ]VAC for 1minuteTest between adjacent circuits of unmated connector. 4 Insulation Resistance [ 500 ] M Ohm Min.(Initial) Impressed voltage 500 VDC. Test between adjacent circuits of unmated connector.5 Temperature Rising30℃ Max. Under loaded ratingcurrentContact series-wired, apply test currentof loaded rating current to the circuit, and measure the temperature rising byprobing on soldered areas of contacts, aftethe temperature becomes stabilized deduc ambient temperature from the measured value.MECHANICAL REQUIREMENT6 Contact / Peg Retention Force0.100 kgf Min. Apply axial pull out force at the rate of[ 25.4±3 ] mm/min on the terminal assembled in the housing.7 FPC/FFC Retention Force 0.030 kgf/Pin Min.(PIN>=17) 0.500 kgf/ Min. (PIN<17)Operation Speed ：[ 25.4±3 ] mm/minMeasure the force required to unmate connector.8 DurabilityContact Resistance: [ 50 ] m Ohm Max(Final) Operation Speed ：[ 10 ] cycle-max./min Durability Cycles ：50 Cycles9 VibrationNo electrical discontinuitygreater than 0.1 or 1µsec shall occur. See Note.Subject mated connectors to 10-55-10Hz traversed in 1minutes at 1.52mm amplitude 2 Hours each of 3 mutually perpendicular planes. 100mA Max. Applied.10 Mechanical ShockNo electrical discontinuitygreater than 0.1 or 1µsec shall occur. See Note.Accelerate Velocity ：490m/s2 （50G ） Waveform ：Half-sine shock plus Duration ：11msecNo. of Drops ：3 drops each to normal and reversed directions of X, Y and Z axes, totally 18 drops, passing DC 100mA max. Current during the test.Document No:LZR-RD062 Product Name:FPC CONN.4 of 6Figure 1（End ）NOTE ：Shall meet visual requirements, show no physical damage, and meet requirement of additional tests asspecified in the test sequence in Figures 2TEST ITEM REQUIREMENTPROCEDUREMECHANICAL REQUIREMENT11 Solder abilityThe inspected area of each lead must have 95% solder coverage minimum.Steam Aging Preconditioning ：Intended for no-tin lead and no-tin lead -alloy finished for 93+3/-5℃、8hrs.Solder pot temperature: 245 ±5℃ ,3~5secENVIRONMENTAL REQUIREMENTS12Resistance to Reflow Soldering HeatNo physical damage shall occur.（Lead-Free ） Pre Heat ：150~180℃, 90±30sec. Heat ：230℃ Min., 30±10sec.Peak Temp.：260+0/-5℃, 10sec. or less Duration ：3 cycles Refer to Fig.413 Thermal ShockContact Resistance: [ 50 ] m Ohm Max(Final)Mated Connector-55+/-3℃(30 min.), +85+/-2℃(30 min) Perform this a cycle, repeat 5 cycles 14Humidity-Temperature Cycle Contact Resistance: [ 50 ] m Ohm Max(Final)Mated Connector25~65℃, 90~95% RH, 10 Cycles 15 Temperature Life (Heat Aging)Contact Resistance: [ 50 ] m Ohm Max(Final)Mated Connector 85℃, 250 hours,16 Salt SprayNo detrimental corrosionallowed in contact area and base metal exposed. Contact Resistance: [ 40 ] m Ohm Max(Final) Subject mated connectors to 35+/-2℃ and 5+/-1% salt condition for 48hours. After test, rinse the sample with water and recondition the room temperature for 1 hour. EIA-364-26B, Condition BDocument No:LZR-RD062 Product Name:FPC CONN.5 of 67.1. PRODUCT QUALIFICATION AND REQUALIFICATION TESTTest Group A B C D E F G H I JTest or ExaminationTest Sequence （a ）Examination of Product 1, 71, 91, 61, 51, 51, 51, 5 1, 3 1, 3 1, 3Contact Resistance2, 82, 52, 42, 42, 42, 4Dielectric withstanding Voltage 3, 6 Insulation Resistance 2, 5Temperature Rising2Contact/ Peg Retention Force 3, 7 FPC/FFC Retention Force 4, 6 Durability 5 Vibration 3 Mechanical Shock 4Solder ability2 Resistance to Soldering Heat2Thermal Shock3Humidity Temperature Cycling 43Temperature Life 3Salt Spray3Figure 2NOTE ：（a ）Numbers indicate sequence in which tests are performed.（b ）Discontinuities shall not take place in this test group, during tests. Figure 3. Contact ResistanceDocument No:LZR-RD062 Product Name:FPC CONN.6 of 68. INFRARED REFLOW CONDITIONNOTE: Please check the re-flow soldering condition by your own devices beforehand . Because the condition changes by the soldering devices, p.c. boards, and so on.9. TAPE AND REEL PACKAGE SPECIFICATION9-1.Tape and Reel Dimensions ：See attached drawings. 9-2.SpecificationNo. of Contacts Width ? Pcs ／Reel ? Reels ／Carton04～08 16 4 K ／1 14／1 09～24 24 4 K ／110／1 25～3632 4 K ／18／1 37～40444 K ／16／1Export Carton Layer ：3 LayersCarton Size ：350x350x300mm0 50 100 150 200 230 °C 60 Sec.6090 Sec.30 Sec.Time(sec.)Document No:LZR-RD062 Product Name:FPC CONN.。
特征阻抗是指柔性印刷电路板（FPC）座子上导线传输电信号时的阻抗特性。
0.5mm 间距的FPC座子是一种常见的连接器，它具有一定的特征阻抗要求。
下面将从多个角度来探讨0.5mm 间距的FPC座子特征阻抗的相关知识。
一、0.5mm 间距的FPC座子的概述0.5mm 间距的FPC座子是一种用于连接FPC的组件，它通常用于手机、平板电脑、数码相机等电子产品中，用于连接主板与显示屏、摄像头模组等组件。
它具有小巧轻便、插拔方便的特点，因此在电子产品中得到了广泛的应用。
二、0.5mm 间距的FPC座子的特征阻抗要求在实际的电子产品设计中，由于0.5mm 间距的FPC座子所连接的线路长度较短，因此对于其特征阻抗的要求相较于大尺寸的PCB来说更为严格。
一般来说，0.5mm 间距的FPC座子的特征阻抗要求在50欧姆左右。
这是为了保证信号在传输过程中的稳定性和可靠性，避免信号的反射和损耗。
因此在设计和生产过程中，需要特别关注0.5mm 间距的FPC座子的特征阻抗。
三、影响0.5mm 间距的FPC座子特征阻抗的因素1. FPC板材料FPC座子所连接的柔性印刷电路板的材料对于特征阻抗有着重要的影响。
FPC板材料的介电常数、介电损耗、厚度等参数会直接影响到FPC座子的特征阻抗。
因此在选择FPC板材料时需要特别注意这些参数。
2. FPC线路形状FPC线路的宽度、厚度、层间距等参数都会对其特征阻抗产生影响。
设计人员在设计FPC线路时需要根据特征阻抗的要求来合理确定这些参数。
3. FPC座子结构FPC座子本身的结构也会对特征阻抗产生影响。
插针的设计、接触面积等都需要在设计和制造过程中进行充分考虑。
四、提高0.5mm 间距的FPC座子特征阻抗的方法1. 优化FPC板材料的选择选择具有稳定特性的FPC板材料是提高特征阻抗的关键。
通常来说，聚酰亚胺（PI）材料是一种常见的FPC板材料，具有较好的介电性能和稳定性。
2. 精确的线路设计和制造精确的线路设计和制造是保证特征阻抗的关键。
fpc设计规范FPC分类FPC类产品共同设计要点滑盖FPC 翻盖FPC 按键FPC 摄像头FPC 1.材质：基材为聚酰亚氨或聚酯，铜线为压延铜或沉积铜；2.线径线距：目前技术一般为3.5或4mil，即0.08或0.1mm；3.板边间距：一般为0.5mm以上；4.与壳体间隙：至少0.3～0.5mm；5.最小倒圆角：0.5mm；6.宽度大致计算方式：（线径＋线距）×PIN数＋2～3mm；7.厚度设计：单层板单层走线为0.07mm，以此类推；局部补强位置除外，需在2D上标明厚度要求；8.补强板设计：connector和金手指背面一定要补强，金手指补强后总厚度请参考FPC connector的详细SPEC，需在2D上标明总厚度和补强板尺寸，另外需注意补强区域X方向上最好不要有无需补强的接地片存在；9.补强板材质:一般为PI，特殊情况可用不锈钢或其它补强材料；10.接地：fpc连接的地方要保证接地区域，接地点要避开折弯处，接地焊盘最小为2*3mm，一般要求正反两面露铜；11.折弯要求：如需折弯，则在折弯处印刷白线或标明折弯区域；注意：3D如有折弯，则出2D必须展平；12.尺寸标注：2D图需标注详细的外形、连接器中心定位位置、焊盘、定位孔、补强板和印刷位置尺寸；13.公差设定：金手指处公差为＋/-0.03mm，外形尺寸为＋/-0.1mm,其它非重点尺寸为＋/-0.3mm；14.注释要求：2D图上需注明层数、top和bottom面、金手指位置、补强板位置、印刷位置及折弯线或区域；15.屏蔽要求：需要屏蔽，则印刷银浆，银浆外面印刷绝缘漆，同时需要指出具体的印刷区域；16.长度设计：FPC长度需在3D上模拟出来，以免过长或过短；17.PIN脚定义：需要在2D上注明。
F侧键FPC 其它FPCFPC设计规范各类FPC不同设计要点1.目前技术下只能用单层板单层走线，而且只能用FPC连接器；2.滑盖机的FPC必须要有足够宽的地,至少左右各1mm；3.滑盖机上的上板和主板的连接器旁边要有接地区域，在fpc的两端增加一个漏铜的小尾巴(至少2mm*3mm)以便将上板和主板导通；4.需在2D上注明滑盖测试寿命要求，一般为10万次；1.翻盖机主fpc连接的主板和lcm上的连接器旁边要有接地区域, 至少2mm*3mm，fpc加强板上面留有漏铜区域以便加导电泡棉来和壳体的地相连；2.FPC在转轴孔内部分做成5度斜线(非水平)，FLIP与BASE交点为FPC斜线起点(目的：减小FPC与hinge孔摩擦的可能性)；3.FPC在hinge孔内的扭曲部分宽度要求≥8,越大越好；4.FPC两个连接器的X方向距离等同于FLIP PCB与MAIN PCB两连接器的X方向距离；5.FPC flip部分Y方向长度计算办法：连接器边距hinge中心孔的直线距离+0.2(具体加多少视实际情况而定，0.2是个参考值)；6.FPC过渡尽量圆滑，内侧圆角设计成R1到R1.5；7.壳体上FPC过孔位置不要利角分模线（如壳体上无法避免，FPC对应位置加贴泡棉）；8.在有壳体的情况下，FPC在发数据前要剪1比1手工样品装配试验，CHECK没问题后发出；9.flip穿FPC槽原始设计宽度开通到中心线，方便FPC加宽；10.2D图必须就厚度有每层的尺寸要求(单层FPC可做到0.05厚），并实物测量。
0.5mm FPC/FFC 连接器FPCPCB FPC/连接器 FPCPCB PCB 连接器连接器端子连接器塑胶体连接器焊接片连接器卡锁 FPC/FFC 连接器简介概 述当前，随着SMT 技术的推广普及，表面贴装连接器的应用也越来越广泛，各种类型的PCB 都随之有相应的表面贴装连接器出现。
从穿孔式（T/H ）焊接工艺到表面贴片（SMT ）焊接工艺，使得连接器的端子排列间距（Pitch ）可以从1.27mm 减小到1.0mm ，并逐渐减小到0.8mm 和0.5mm ，而且应用SMT 工艺允许在PCB 的双面都焊接电子元器件，大大增加了PCB 上的元器件密度。
现在各类消费类电子产品都已经集小型化、薄型化和高性能化于一身，利用柔性印制电路板（FPC ）及与之相配的FPC 连接器来减少空间，减轻重量，降低装配成本已经被众多的客户所接受。
FPC 及FPC 连接器广泛应用于电脑行业，家用电器，自控设备，尤其是用于体积小、重量轻的消费类电子产品，如：数码相机，PDA,手机等产品。
本文将着重介绍这种FPC/FFC 连接器。
一．FPC 连接器结构及使用FPC 连接器用于连接印制电路板（PCB ）和柔性印制电路板（FPC ）,使之实现机械上和电气上的连接。
其特点是一端与PCB 焊接相连接（多采用SMT 焊接），另一端与FPC 对插，且FPC 连接器上设计有卡锁装置使FPC 和FPC 连接器锁紧，保持一定的接触可靠性。
故连接器的塑胶体和端子以及卡锁零件之间有严格的配合要求。
如下图所示，是FPC 连接器的产品示意图：为了满足在SMT 制程的要求，整个产品的端子焊接区都严格要求有良好的平整度和共面度，通常业界的规范为共面度0.10max.,否则会导致与PCB 焊接不良而影响产品的使用。
片状隔栏结构底面平直无翘曲端子焊接区FPC 连接器端子 FPC 连接器塑胶体FPCPCBFPC 连接器卡锁 1－1、塑胶体塑胶体内部是等间距的片状隔栏结构，使端子装配后保持小间距的排列和提供一定的保持力。
设计手册新的PoE控制器如何通过以太网电缆提供高达90W的功率第5页技术观点芯片制造商用于机器学习的最新设计工具第12页应用聚焦连接第8页实现高于24N的总拔出力。
其坚固的执行器提供了对插接触点的更强的TE的FPC连接器：零插入力设计流行的连接器产品系列推出可提供13A电流额定值的新产品这些VAL-U-LOK连接器还提供新型垂直接头样式，可提供2至24个位置，并可选择UL 94 V-0或灼热丝测试/UL94 V-2或V-0材料。
钉、以及带或不带排泄孔的产品。
和灼热丝测试外壳配合使用。
从而实现向后兼容。
大电流引脚和插座触点也适用于线对线应用的外壳。
TE Connectivity (TE) 扩展了其VAL-U-LOK连接器产品系列，新产品，可在4.2mm的中心线间距上提供13A的最大电流能力。
的VAL-U-LOK连接器的额定电流为9A。
VAL-U-LOK：4.3mm中心线间距新款低成本封装的高性能跨界MCU系列新款i.MX RT1010是市场上包括高性能Arm® Cortex®-M7内核的成本最低的产品。
在i.MX该内核提供了高性能的实时处理：主频高达500MHz，它利用128kB的紧密耦合SRAM存储器实现了仅20ns的低延迟响应时间。
新器件采用低成本的80引脚LQFP封装，支持真正的两层PCB设计，并简化了PCB布局。
它的尺寸为12mm x 12mm，间距为0.5mm。
其丰富的集成功能包括：一个四通道和八通道串行NOR闪存接口、一个高速USB 2.0控制器和收发器、一个音频接口、支持无线标准，以及通过片上32通道FlexIO模块实现灵活连接。
恩智浦的MCUXpresso软件和工具完全支持i.MX RT1010。
恩智浦半导体的i.MX RT1010为想要利用恩智浦跨界微控制器的功能的设计人员提供了一种新的低成本选择：它包含了应用处理器的高处理能力和集成功能以及微控制器的易用性和实时性能。
10.5mm Pitch Low-Profile Board-to-Board/Board-to-FPC ConnectorsDF23 Series2004.9- 0.11.5+0.2PlugReceptaclePlugReceptacleBoardBoardFPCBoard- 0.11.5+0.20.30.3s Features1. Low profileThe 1.5 mm board-to-board distance makes theseconnectors ideal for limited space applications.2. Large variety of number of contactsAvailable with 10, 12, 14, 16, 18, 20, 30, 40, 50, and 60contacts.Connectors with 10 to 20 contacts are ideal for use in small LCD connections in cellular phones, PDA’s, video equipment, photo cameras and miniature of other devices requiring reliable connections in a small spaces.3. Click sensationPositive click sensation when completely mated confirms correct insertion and connection of all contacts.4. High contact reliabilityAlthough connectors are low profile, the female contacts maintain reliable spring force assuring secure electrical contact.5. Large self-alignmentThe large range of alignment of 0.3 mm allows for smooth insertion.6. Board placement with automatic equipmentFlat surfaces allows placement of embossed tape packaged connectors with vacuum nozzles.s ApplicationsMobile phones, PDA’s, notebook PC’s, digital cameras and other miniature devices.Large Self-alignmentq Board-to-Board Applicationq Board-to-FPC ApplicationFemale contactMale contactHigh Contact ReliabilityLow profile - 1.5 mm board-to-board distance2s Product SpecificationsNote 1: Includes temperature rise caused by the current flow.Note 2: The term “storage” refers to products stored for long period of time prior to mounting and use. Operating Temperature Range and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during transportation.s Materialss Ordering information-( )q Receptacles/Plugs3Note 1: Available in code (51) only.Note 2: Available in code (53) only.Note 3: Contact Hirose for availability.Note 4: Please order embossed tape packaging items by the reel.s ReceptaclesB Recommended PCB Footprints0.25±0.050.5±0.10.15±0.05P=0.5±0.1B±0.15A±0.35±0.26±0.21.45±0.14Note 1: Available in code (91) only.Note 2: Available in code (92) only.Note 3: Contact Hirose for availability.Note 4: Please order embossed tape packaged items by the reel.s PlugsB Recommended PCB Footprints.15±.50.45±0.10.19±0.05P=0.5±0.1B±0.15A±0.153.1±.154.3±.21.2±.15B Embossed Career Tape Dimensions Note 1: This side feed hole is added to embossed tape where the D dimension is 32.0min. wide.Note 2: (53) packaging code embossed tape is without the bottom surface protrusion.sReel DimensionsØ21Ø13±0.2Product name labelDepth of 1.5 diameter2±0.5±0.80(Ø80)Ø330±2H MAXG +2Unit: mms6s PlugssReel DimensionsG+2(Ø8)Ø33±2Ø21±.8Ø13±0.2Product name label Depth of 1.5diameter2±0.5H MAXUnit: mm Note : Code number (91) embossed tape is without the bottom surface protrusion.7B Usage PrecautionsNote 1: Up to 2 cycles are possible under the same conditions provided that there is a return to normaltemperature between the first and second cycle.Note 2: This temperature profile indicates the temperature of the connector terminal lead at the point of contactwith the PCB.1.Recommended Temperature Profile Temperature2.Recommended Manual Soldering Conditions 4.Board Warping Maximum of 0.03 mm at the connector center section, with both ends of the connector as reference points. Refer to the "Nylon Connector Use Handbook."s When manually handling the connectors avoid touching any portion of exposed terminal leads. This may cause deformation and lead to difficulties with placement and soldering on the PCB.When mating/un-mating do not use excessive force or lifting of one side only.5.Cleaning Conditionse and handling precautions.3.Recommended Screen Thickness and Open Area Ratio (Pattern Area Ratio) Temperature: 290ç±10ç, Soldering time: within 2 sec.Thickness : 0.12 mm Open Area ratio: 80%0ç50ç100ç150ç150ç 30 sec. to 90 sec.235±5ç 10 sec. max.220çmin.10 sec. to 20 sec.200ç250çTemperature50 sPreheatingIR ReflowPreheating : Soldering : Soldering0 s90 s150 s TimeMaximum. 240ç220ç。
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1•适用范围:
本规格书适用于FFC/FPC0.5MM/1.0MM/1.25MM/2.0MM 连接器
2.产品名称及型号：
名称：0.5MM/1.0MM/1.25MM/2.0MM 间距卧式连接器型号：
有无锁扣标记0表示
无锁扣1表示带锁扣
接触方向
WS:表示卧式上接触
WX:表示卧式下接触
XG:表示掀盖式
LT::表示立贴
DS:表示单排双面接触
表示引脚数量
DD :表示单排单面接触
SD:双排单面接触
SS:双排双面接触
表示相邻两引脚间的
H:表示产品厚度
中心距,分别有：
0.5、
1.0,1.25/
2.0MM
焊接时安装方式
SMT:表示表面贴片安
装
例如：1.0SMT-H2.5DD-WS-1 1.0mm间距贴片H2.5单排单面接触Pin上接带锁连接器
3.技术参数：
额定电流：0.5A
额定电压：50VAC，DC
温度范围：-40 C ~+85C 耐压：200V/min
接触电阻：w 0.06Q
绝缘电阻：》500M Q
适用FPC/FFC尺寸：
导体间距：0.5mm
导体宽度：0.3mm
配合部分厚度：0.3mm
配合部分长度：3.0mm
4.外观形状、寸法（参照产品图）、材质：
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◎焊接曲线图Reflowconditionp f bture。
