LaunchPad User Experience Manifest msp430开发板用户使用经验

TI MSP430FR59xx超低功耗FRAM MCU平台开发方案TI公司的MSP430FR59XX系列产品是混合信号微控制器，是一种超低功耗FRAM平台，集成了FRAM和超低功耗系统架构以及用于各种应用的智能外设.CPU具有16位RISC架构，工作频率髙达16MHZ.I作电压1.8V-3.6V,工作模式的电流大概为100uA/MHz,待机状态为0.4UA,关断时为0.02UA,主要用在测量仪表，传感器管理，能量收集传感器节点擞据资料记录和穿戴电子.本文介绍了MSP430FR59XX系列主要特性，功能框图，以及MSP-EXP430FR5969 LaunchPad开发板主要特性，框图，电路图，材料淸单和PCB设计图.The MSP430™ ultra-low-power (ULP) FRAM platform combines uniquely embedded FRAM and a holistic ultra-low-power system architecture, allowing innovators to increase performance at lowered en ergy budgets. FRAM tech no logy combi nes the speed, flexibility, and en dura nee of SRAM with the stability and reliability of flash at much lower power.The MSP430 ULP FRAM portfolio consists of a diverse set of devices featuring FRAM, the ULP 16-bit MSP430 CPU, and intelligent peripherals targeted for various applications. The ULP architecture showcases seven low・power modes, optimized to achieve extended battery life in energy-challenged applications.The Texas Instruments MSP430FR59xx family of ultra-low-power microcontrollers consists of several devices featuring different sets of peripherals. The architecture, combined with seven low-power modes is optimized to achieve extended battery life for example in portable measurement applications. The devices features a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that con tribute to maximum code efficienc y.The MSP430FR59xx devices are microcontroller configurations with up to five 16-bit timers, Comparator, un iversal serial comm un ication in terfaces (eUSCI) supporti ng UART, SPI, and I2C, hardware multiplier, AES accelerator, DMA, real-time clock module with alarm capabilities, up to 40 I/O pins, and an high performance 12-bit analog-to-digital converter (ADC).The MSP430 CPU has a 16-bit RISC architecture that is highly transparent to the application. All operations, other than program-flow instruct!ons, are performed as register operations in conjunct!on with seven addressing modes for source operand and four addressing modes for destination operand.The CPU is integrated with 16 registers that provide reduced instruction execution time. The register-to register operation execution time is one cycle of the CPU clock.Four of the registers, RO to R3, are dedicated as program counter, stack pointer, status register, and constant generator, respective!y. The remaining registers are general-purpose registers.Peripherals are connected to the CPU using data, address, and control buses, and can be han died with all instructio ns.The instruct!on set consists of the original 51 instructions with three formats and seven address modes and additional instruct!ons for the expanded address range. Each instruction can operate on word and byte data.MSP430FR59xx 系列主要特性:MSP430FR59xx 系列应用:• Embedded Microcontroller-16-Bit RISC Architecture up ta 16-MHz Clock -Wide Supply voltage Range (1.8 V to 3 6 V)山 • Optimized Ultra 丄Modes一 Active Mode. Approximately 100 JJ A/MH Z一 Standby (LPM3 With VLO): 0.4 pA (Typical) -Reai-Titne Clock (LPM3.5). 0.25 pA (Typical)⑵ -Shutdown (LPM4.5): 0.02 pA (Typical) • uitra-Low-Pov^r Ferroetectnc RAM (FRAM )一 Up to 64KB of Nonvolatile Memory 一 Ultra-Low-Pow^r Wntes-Fast Write at 125 ns Per Word (64K6 m 4. ms)一 Unified Memcxy = PFogram + Data + Storage in one Single space-to 15 Wnte Cycle Endurance一 Radiation Resistant and Nonmagnetic •Intelligent Digital Penpherals一 32-Bit Hardware Multiplier (MPY) 一 Three-Chann 刨 Inlemal DMA 一 Real-Tim« Clock (RTC) With Calendar and Alarm FunctKMis-Five 16-Bit Timers Witn u p to Seven Capture/Compare Registers Each一 tG-Bit Cyclic Redundancy Checker (CRC) •High-PerTormance Analog一 tS-Chann 曰 Analog Comparator一 U2・Bit Analog-to-Digital Converter (ADC) Witn internal Reference arxi sample-android and up to 16 Externa I InjxH Channels •Multifunction Input/Output Ports-All Pins Support Capacrtive Touch Capability With No Need for External Components一 Accessible BiE-. Byte-, and Word-Wise (in Pairs) (1)wpp^y wnos-c is gtriUE 好 SVS levels.⑵ RTC » ctockcd t>y a 3.7-pF crystal.一 E<!ge-seiectabie V\Zake From LPM on AH Pons 一 Progrannmabie Puilup and Pulldown on All Ports• Code Security arxJ Encrypt »on一 128-Brt or 25€-Bit AES Secunty Encryption and Deayption Coprocessor- Random Number Seed for Ranrdom Number Generalion Algorithms• Enhanced Serial Communication -eUSCI_A0 and eUSCI_AI Support• UA B T With Automatic Baud-Rate Detection • ifDA Encode and Deccxie • SPl at Rates up to 10 Mbps 一 eUSCIJBQ Supports• l 2C With Multiple Slave Addressing • SPl at Rates up to 8 Mbps-Hardware UART and l 2G Bootstrap Loatfer (BSL) • Flexible Clock System一 Fixed-Frequency DCO With 10 Selectable Fact (x>r -Tflmm«! Frequencies一 Low-Pouer Low-Frequency internal Clock Source (VLO)-32-kHZ Cfystals (LFXT) 一 Hign-Frequency (HFXT) • Development Tools and Software一 Free Professional Development Environments With EnergyTrace+4^ Teciinotogy-Development Kil (MSP TS430RGZ48C) -Family Members一 Section 3 Summarizes the Available Device Variants and Package Types• For Complete Module Descriptions. See the MSP430FR5SXX, MSP430FR^X. 材SP43QFR 盼x M$P43Qf=R 殮"ZEly Users Guide & --- ------------------• Metering• Sensor Management• Energy Harvested Sensor Nodes • Data Logging • Wearable ElectronicsA The low-freq«uency (LF) crystal oscillator and the corresponding LFXIN and LFXOUT pins ore awaHabfe ooly in MSP43OFR5x6xan^MSP43OFR5x4xdevT€«・RTC.B i€ 3*v3il3bie only m conjunction with the LF crystal cxciilator in MSP430FR5i6x and J/SP430Fr^5)xix de ；4oet. B The high-frequency (HF> cry&tai ascillat<x and the ccrreeponding HFXIN arxl HFXOUT pins are a\aKab!e only in MSP430FR5K 6X and MSP43CFR5«5?< dcvww.MSP43OFR5x5xdex^cee with the-HF crystalosalaxoronly dono<ncludethe RTC_B module图1.MSP430FR59XX 系列功能框图MSP-EXP430FR5969 LaunchPad 开发板MSP430™ ultra -low-power (ULP) MCUs with embedded Ferroelectric Random Access Memory (FRAM)technology now join the MCU LaunchPad™ Development Kit ecosystem. The MSP-EXP430FR5969 (orthe TR5969 LaunchPad**) is an easy-to-use evaluation module (EVM) for the MSP430FR5969microcontroller. It contains everything needed to start developing on the MSP430 FRAM platform,including on-board emulation for programming, debugging, and energy measurements. The board featuresbuttons and LEDs for quick in tegration of a simple user in terface as well as a super capacitor (super cap)that enables standalone applications without an external power supply.PJx.P1.P2 3 lOx PA • •••2S 心 P9 ••皿心WPcrt PJ -1/2 4 Ox■-RAW 2r®1KB|q|(n: oi»)TS5gTAiT 存「nT-<r»?r_A7GC 3CC acc气G iS •n - “•；二X"”皆<■1网> SUOLK人乂海上REF AAE3ZK•cacw2F2n-usa 空DMA./TAGCPUXV 2 M.1AEEM (S3••仆J ?• :AK/ypS cvi KoypB(U^RT . 心，LDO图 2.MSP-EXP430FR5969 LaunchPad 开发板外形图MSP-EXP430FR5969 LaunchPad 开发板主要特性：•MSP430 ultra-low-power FRAM technology based MSP430FR5969 16-bit MCU •20-pin LaunchPad standard that leverages the BoosterPack ecosystem•0.1 ・F super capacitor for standalone power•On board eZ-FET emulati on with En ergyTrace++™ Tech no logy•Two buttons and two LEDs for user in teraction•Backchannel UART through USB to PCMSP-EXP430FR5969 LaunchPad 开发板包括：• 1 X MSP-EXP430FR5969• 1 x Micro USB cable• 1 x Quick Start Guide图3.MSP-EXP430FR5969 LaunchPad 开发板元件分布图OO•r: i.JTA CM R7S»l"c1 £rt ・*Ci6Protection<J :©.IFSupe r CapXii Super C<: 店.Pawer/UART/SB?/ to Targetg 5 S ft R£638TPW T«0« TPm・■ ■ ■■CrWdl4 MH?s^icro-B JSBs 6ln £0to s s 185HCR、.l(DR^d/Green八EmulationYCCGMD(Mb I brtRa ・・r LojnchPadO I M I &P &JCpfrdcounlrlOTX K k-v p e ^x.p e d x.u c.3」图 4.MSP-EXP430FR5969 LaunchPad 开发板框图图 5.MSP-EXP430FR5969 LaunchPad 开发板电路图⑴图 6.MSP-EXP430FR5969 LaunchPad 开发板电路图(2) 图7.MSP-EXP430FR5969 LaunchPad 开发板电路图⑶图8.MSP-EXP430FR5969 LaunchPad 开发板电路图⑷图9.MSP-EXP430FR5969 LaunchPad 开发板电路图（5）图10.MSP-EXP430FR5969 LaunchPad 开发板PCB 设汁图⑴图11.MSP-EXP430FR5969 LaunchPad 开发板PCB 设计图(2)TIMSPFRxx超低功耗FRAMMCU平台开发方案图12.MSP-EXP430FR5969 LaunchPad 开发板PCB 设汁图(3)图13.MSP-EXP430FR5969 LaunchPad 开发板PCB 设计图(4)TIMSPFRxx 超低功耗FRAMMCU 平台开发方案11 / 11图 14.MSP-EXP430FR5969 LaunchPad 开发板 PCB 设汁图(5)。

Application ReportZHCA428A–January2011–Revised March2011通过使用MSP430G2452微控制器的LaunchPad ValueLine开发包实现基于心电图的心率监测Abhishek Joshi,Sourabh Ravindran,Austin Miller MSP430System SolutionsABSTRACT这篇应用报告描述了一种低成本，基于MSP430™LaunchPad Value Line 开发工具包(MSP-EXP430G2)的监测心率解决方案，此开发工具包使用MSP430G2xx微控制器(MCU)。

心电图（EKG）信号在被送到微处理器取样和处理之前已经被一块子板放大和过滤。

每分钟心跳数据通过Lanuchpad上的反向通道UART-over-USB传送给电脑。

而且，可以通过一个连接在子板上的六排针的eZ430射频(RF)目标使用SimplicitTI™网络协议来无线传输数据。

此系统电源可来自USB电源，一个CR20323伏纽扣电池，或者两个AA/AAA电池。

在此应用报告中相关的项目和源程序可以在如下的网络地址下载：/msp430/msp430_public_sw/mcu/msp430/EKG-Based-Heart-Rate-Monitor/1_00_00_00/index_FDS.html。

Contents1简介 (2)2硬件描述 (3)3软件 (6)4参考 (7)Appendix A放大器的选择 (9)Appendix B使用反向通道UART的USB有线连接演示 (11)Appendix C通过eZ430射频目标板的无线UART演示 (13)Appendix D硬件原理图 (15)List of Figures1人体心脏解剖图(左）和心电图（右） (2)2手指检测电路原理图 (3)3软件流程图 (6)4心率监测设置（左边）和电脑上的UART输出（右边） (7)5硬件原理图(1/2页) (15)6硬件原理图(2/2页) (16)List of Tables1LaunchPad端口/引脚功能对应表-左排针 (4)2LaunchPad端口/引脚功能对应表-右排针 (4)3电源电流消耗 (5)4仪表放大器的比较 (9)5运放的比较 (10)1 ZHCA428A–January2011–Revised March2011通过使用MSP430G2452微控制器的LaunchPad ValueLine开发包实现基于心电图的心率监测Submit Documentation FeedbackCopyright©2011,Texas Instruments IncorporatedTIMEDifferential Voltage Between Two ElectrodesAortaLeft AtriumAtrioventricular Node LeftVentricle Heart MuscleSinoatrialNode Right AtriumRight Ventricle简介6eZ430射频目标板 (13)1简介人体心脏心跳的来源是由心脏内的称为窦房结（SA ）[1]的一堆细胞产生的电脉冲。

LaunchPad开发板介绍前言大家都拿到了超级便宜的LaunchPad的开发板，这些开发板有的朋友是拿来学习的，有的只是看着便宜先入手一个。

无论大家是出于什么目的都无所谓，现在板子到手了，咱们就要把他利用起来。

咱们EE论坛这次展开LaunchPad的千人大学习，我算是抛砖引玉发出此贴，希望大家一起来编写LaunchPad的中文教材，打造中国最全面的LaunchPad中文教材。

闲话不说了，介绍我挑重点的说，尽量少说废话。

开始了！开发板介绍首先，LaunchPad是一个完整的开发板。

板上包括仿真器和目标芯片，通过仿真器我们可以在线控制CPU的运行以及查看硬件寄存器；目标芯片就是我们编写的代码要下载到的芯片。

在图1所示的开发板照片中，照片中用黄色方框框出来的是仿真器，蓝色方框框出来的是目标板，也就是我们编写的代码最终要运行的地方。

套件内容LaunchPad的开发板包括以下内容：1、LaunchPad开发板2、MinUSB电缆3、两块MSP430G系列芯片– MSP430G2231: 低功耗16位单片机，片上拥有10位8通道的ADC、2K容量的Flash和128bytes 的RAM– MSP430G2211: 低功耗16位单片机，包括一个片上比较器以及2K容量的Flash和128bytes的SRAM4、2排10针的排针和2排10针的插座5、一只32.768-kHz的晶体仿真器介绍大家拿到开发板的时候可以看到在仿真器中最大的那块芯片也是一款1xx系列的MSP430单片机，但我们的代码并不是在这块单片机上运行的，这块单片机其实是充当了仿真器的功能，代码真正还是在目标板上的目标芯片上运行。

在初学阶段的话不需要再仿真器上花时间，仅仅把它当做工具使用即可。

通过图片可以看到，仿真器和目标板之间是通过跳线连接的。

其实这暗示着LaunchPad 上的仿真器不止可以调试下载Gxxx系列的芯片，它还可以调试下载eZ430-RF2500T开发板、eZ430-F2012T/F2013T开发板以及eZ430-Chronos手表。

摘要：本文详细讲述了如何查看MSP430G2231MCLK、SMCLK、ACLK默认时钟频率，最后给出FLASH时序控制发生器频率设置例子。

注：本文是基于开发板MSP-EXP430G2 LaunchPad，其MCU型号是MSP430G2231。

一、MCLK、SMCLK、ACLK默认时钟频率1.1 POR与PUCPOR指Power-On Reset，即上电复位(硬件)，PUC指Power-Up Clear，即上电清除(软件复位)，这是MSP430两种分离的复位信号。

POR总会引起PUC，关于POR与PUC的触发条件见用户指南，如下：图1 POR与PUC触发条件1.2 默认时钟频率有两种方法(甚至更多)可以得知MCLK、SMCLK、ACLK默认的时钟频率。

(1)通过用户指南描述查阅用户指南可得到系统复位后，时钟信号MCLK、SMCLK、ACLK的时钟源分别是DCOCLK(数控震荡器)、DCOCLK、LFXT1CLK(低速晶体震荡器)。

如下：图2 复位后默认时钟频率(2)通过寄存器初始值判定用户指南会给出每个寄存器的初始值，通过分析初始值各位的含义，并对照数据手机，也可得到其默认频率。

定位到用户指南基本时钟模块(Basic Clock Model)，其寄存器描述如下：结合图5分析，可知RSELx为7(BCSCTL1低3位)，DCOx为3，MODx为0，再对照图4可知系统复位后MCLK 和SMCLK的频率在0.8MHz~1.5MHz，即819.2KHz~1536KHz。

再结合图3基本时钟系统控制寄存器2(BCSCTL2)，可知MCLK默认时钟源是DCOCLK，SMCLK默认时钟源也是DCOCLK。

BCSCTL2示意图如下：图3 BCSCTL2示意图1.2.1 MCLK和SMCLK时钟频率在数据手册可以找到DCO频率表(搜索关键词DCOCLK可快速找到)，如下：图4 DCO时钟频率由上图可知，系统复位后MCLK和SMCLK的频率在0.8MHz~1.5MHz，即819.2KHz~1536KHz。

MSP430G2系列Launchpad开发板应用实例作品基于MSP430G2553实现的电子秤设计李弘祖西安邮电大学2015年12月第一章作品概述第一节系统概述本设计以MSP430G2553作为核心，由压力传感器和数码管显示器共同实现对物体质量的测量显示功能，最小分辨率1克，系统框图和各部分简介如图1.1所示。

图1.1 系统组成框图1)压力传感器：在直流激励下，受到压力形变，产生电压信号。

压力信号以差分电压的形式通过绿色（数据）和白色（数据地）连根引线与PCB上的端子相连。

2)信号调理电路：传感器信号由于幅度较小，噪音较大，不能直接由AD采集，经过放大（AD623）滤波电路，得到合适频带幅度的信号送往中央控制器(MSP430G2231) 。

由接线端子上引入的数据+和数据地差分信号分别接仪表运放的正端输入和负端输入，在反馈电阻的作用下，实现高共模抑制的差分放大。

后接RC滤波电路，将低频可用信号取出，输出至MSP430的ADC10模块入口。

3)中央控制器：由G2的AD模块通道0采集前级电压信号，转换为数字量后，保存在CPU内存中，然后通过统计算法和传感器线性参数修正，得到被测压力数值参数，再将这些数据发往LED显示电路。

4)显示电路：由数码管驱动芯片(74LS48)根据CPU发来的显示数据点亮LED，显示出数值。

第二节器件概述1）MSP430G2553MSP430是美国德州仪器公司自1996推出以来一直主打的一个低功耗系列，包含1至5五个系列，每个系列都各自有各自的特点，适用于各种不同场合的不同应用。

其中最近2系列添新面孔——G2超值系列。

本设计采用的MSP430G2553就是MSP430超低功耗系列中G2超值子系列的一款16位处理器。

通过引入MSP430G2xx3 系列，MSP430 超值系列继续扩展了产品系列。

由于具有低成本和超低功耗，G2xx3 系列适用于电容触摸应用，并可集成诸如UART、SPI 和I2C 等通信外设。

单片机编程学习入门LaunchPad板实验报告一、LaunchPad实验板简介1概述名为LaunchPad的MSP-EXP430G2低成本试验板是一款适用于TI最新MSP430G2xx 系列产品的完整开发解决方案。

其基于USB的集成型仿真器可提供为全系列MSP430G2xx 器件开发应用所必需的所有软、硬件。

LaunchPad具有集成的DIP目标插座，可支持多达20个引脚，从而使MSP430ValueLine器件能够简便地插入LaunchPad电路板中。

此外，其还可提供板上Flash仿真工具，以直接连接至PC轻松进行编程、调试和评估。

LaunchPad试验板还能够对eZ430-RF2500T目标板、eZ430-Chronos手表模块或eZ430-F2012T/F2013T 目标板进行编程。

此外，它还提供了从MSP430G2xx器件到主机PC或相连目标板的9600波特UART串行连接。

详细可访以下了解更多/index.php/MSP430_LaunchPad_(MSP-EXP430G2) MSP-EXP430G2LaunchPad特性:•USB调试与编程接口无需驱动即可安装使用，且具备高达9600波特的UART串行通信速度•支持所有采用PDIP14或PDIP20封装的MSP430G2xx和MSP430F20xx器件•分别连接至绿光和红光LED的两个通用数字I/O引脚可提供视觉反馈•两个按钮可实现用户反馈和芯片复位•器件引脚可通过插座引出，既可以方便的用于调试，也可用来添加定制的扩展板•高质量的20引脚DIP插座，可轻松简便地插入目标器件或将其移除2安装安装MSP-EXP430G2LaunchPad时包含三个简单步骤：1.下载所需软件2.安装选定的IDE3.将LaunchPad连接至PC然后可使用LaunchPad开发应用或播放预先编好程的演示应用。

3.开始使用首次使用MSP-EXP430G2LaunchPad试验板时，演示应用将在该板从USB主机获得供电时立即自动启动。

手把手教你使用Grace开发LaunchPad开发环境：Code Composer Studio v4.2操作系统：Windows XP SP3 32bit开发板：TI LaunchPadGrace是TI推出的图形外设配置工具，用于加速用户对MSP430的使用开发，下面简单介绍下如何使用Grace对LaunchPad的开发。

1、安装CCS 和Grace，这两个软件可以到TI的官网里下载到，/。

建议使用页面右上角的检索工具，找资料那些挺方便的：附：CCS下载地址：/tool/cn/ccstudioGrace下载地址：/tool/cn/grace2、安装完成之后，启动Code Composer Studio v4，第一次使用，会提示Select a workspace，这个根据自己需要选择合适目录作为工作路径。

3、由于前面安装了Grace，CCS会提示安装插件Add Discovered Extensions，选中后点击Finish，CCS会提示需要重启动。

4、CCS重启动之后，就看以看到CCS v4的华丽界面了。

至于弹出来的注册界面，注册方法已是公开的秘密，据说那个Crack是对CCS v4.1版及后续版本都支持的。

把CCS的欢迎界面Welcome最大化，我们可以通过这个欢迎界面，来找到需要的资料。

我这里安装的仅仅是对MSP430的支持，所以页面内容都是MSP430相关的。

点击Examples：在弹出来的页面里点击MSP430 Code Examples：点击之后，我们可以看到TI官网上的示例代码页面：再点击我们需要的芯片例程，就可以直接下载到了：是不是方便了很多咧，这个页面也就相当于一个浏览器，在里面我们可以直接链接到TI的官网里，教程、源码等随时可得。

TI给我们提供了极大的便利，用不用，怎么用就因人而异了。

闲着没事的时候，这里点点，那里按按，说不定就有意外的收获。

如果不小心把这个Welcome给关了，我们可以通过以下方式来重新打开：5、回到主题，关于Grace的使用。

MSP430 G2 LaunchPad使用入门v1.0 2013.8.8xie_sx@目录目录 (1)1 G2 LaunchPad功能简介 (1)1.1 快速入门 (1)1.2 硬件电路 (3)1.3 片上资源 (4)1.4 自学资料 (5)1G2 LaunchPad功能简介1.1快速入门收到MSP430 LaunchPad G2板卡，完整包装盒如下所示：打开盒子，MSP-EXP430G2 套件盒包括下列物品：•MSP-EXP430G2板卡•USB线•两个10 脚单排孔（暂时用不上）•1个32.768kHz 时钟晶振（该晶振不焊接，单片机使用的是内部晶振，建议焊接上）•一张快速启动指南+两个LaunchPad 贴签•两个MSP430 单片机–MSP430G2553：具有8 通道10 位模数转换器(ADC)、片上比较器、触控式使能I/O、通用串行通信接口、16kB 闪存、和512 字节RAM 的低功耗16 位MSP430 微控制器（预加载有示例程序）–MSP430G2452：具有8 通道10 位ADC、片上比较器、触控式I/O、通用串行接口、8kB 闪存、和256 字节SRAM 的低功耗16 位MSP430 微控制器拆开包装，拿出G2板卡，电路板如下图所示：作为入门使用的电路板，在设计入门实验时，我们更多的是借助两个LED灯和一个按键，进行单片机功能模块的学习。

在电脑上安装CCS软件，接着用USB线连接电脑和G2板卡，简单两个步骤就可以开始单片机的实验了。

基本的实验环境搭建好之后，如下图所示。

在宿舍/教室/图书馆等地方，仅需外带一台电脑就可以做实验了。

1.2硬件电路在嵌入式的学习过程中，硬件知识是必不可少的。

对于初学者来说，仿真器部分的具体电路可以跳过，把精力放在单片机核心板卡上。

G2板卡硬件电路较为简单，将所有的IO口引出，并且配有两个LED知识灯+1个用户按键输入。

电源供电部分的电路如下所示，通过电脑的USB口获取5V的电源输入，经稳压芯片稳压后输出3.6V电压给单片机供电。

PRE-COMMIT PROCESS POST-COMMIT PROCESS MSP Model and ProcessThere are four participants in the Managed Services Provider (MSP) model –the “Customer” for the services, the Managed Services Provider (“MSP”), the Billing Agent (“Aggregator”) and “VMware”.The MSP works with both an Aggregator and VMware in order to transact and purchase the cloud services. MSP owns the terms of service for their end customers and is responsible for all transactions and support for them, which includes contract, order, support and billing.Discover the Value of the VMware MSP ProgramThe Managed Service Provider route to market gives partners the option to grow their sales through VMware Software-as-a-Service offerings without investment in their own data center infrastructure, delivering managed services on top.To get started:Read these case studies to see how other partners have successfully offered managed services to their end customers.Learn more: VMware MSP Program on our websiteSupport: Contact UsJoin the VMware Partner Connect ProgramThe VMware Partner Connect Program offers partners a simplified, consistent experience in joining the VMware partner ecosystem, designed to provide clearer paths to profitability by offering value-added managed services to their customers.To get started:Go to our VMware Partner Connect page, scroll down to the ‘Getting Started’ section and click on the ‘Enroll Now’ button under ‘I want to become a Partner’. Fill out and submit the VMware Partner Connect application form. Within 10 days, depending on the program selected, you will receive an email with your partner ID and log in credentials to the VMware Partner Connect portal.Learn more: Partner Connect Program GuideSupport:*************************Pick an AggregatorAfter joining Partner Connect, you will work with a third-party company, a VMware Aggregator, to manage the monthly reporting and invoicing. The partner connect portal includes a list of aggregators by country and you can choose who you reach out to.To get started:Decide which aggregator you want to work with.Learn more: Review List of Aggregators on the partner connect portalSupport:*************************Learn more: Access the Partner Connect Program Guide and the Solution Competencies GuideSupport: *************************Sign a Commit Contract for the Desired ServiceYou decide which commit contract level to sign up for and the service you want to offer.To get started:Work with your Aggregator to complete the commit contract process in the VMware Commerce Portal.Learn more: Pricing HandbookSupport: Raise a ticket within the VMware Commerce Portal. Access theVMware Commerce Portal DocumentationNote: VMware Cloud on AWS, Workspace ONE, VMware Horizon Cloud, VMware SD-WAN and VMware Carbon Black Cloud are some of the MSP services that require solution competency training before MSPs can transact. Please refer to the Solution Competencies guide for details.Build an MSP PipelineNow that you have identified a service to offer and signed a commit contract, you are ready to start building your business. As you work through the final steps,you can start initiating go-to-market activities and building your business for the managed service.Learn more:Pricing HandbookDetermine Terms of Service for End CustomersAs a cloud provider, you must offer your own terms of service to your end customers since you will be delivering this service to your customers, not VMware. Additionally, you will be responsible for delivering L1/L2 technical support, implementation services to your end customers, and all functions associated with service configuration, add-ons, renewals, terminations and anything pertaining to customer billing.To get started:Review the Cloud Partner Navigator support documentationLearn more:Cloud Partner Navigator Support DocumentationAccess the on-boarding email. It opens a wizard-based workflow for you to establish your account on and create a new provider organization. You will land on the Cloud Partner Navigator page on the portal, and the service will be available for provisioning.Learn more: Service level MSP Operations HandbooksSupport: For support during the on-boarding process, before getting access to the Cloud Partner Navigator portal, call us or log onto VMware Customer Connect. For support after logging into Cloud Partner Navigator, refer to the support process towards the end of this doc.Resources: Demo Videos»Cloud Partner Navigator PlaylistConfigure Customer Org and Provision ServiceYou can create a customer organization under the provider organization.To get started:Open the service tile on the VMware Cloud Partner Navigator portal. This will activate the service for that customer. Selecting each customer and providing manage customer access will allow you to decide the level of access for the service – fully, partially managed or no access. You can provision the Software-Defined Data Center (SDDC) from within the console for the customer org.Learn more: Service level MSP Operations HandbooksSupport: For support during the on-boarding process, before getting access to the Cloud Partner Navigator portal, call us or log onto VMware Customer Connect.For support after logging into Cloud Partner Navigator, refer to the support process towards the end of this doc.Resources: Demo Videos»Cloud Partner Navigator Playlist。

MSP-EXP430Launchpad 实验指南参考代码附录本附录为MSP-EXP430Launchpad实验指南中各章节涉及示例程序的完整参考代码。

目录第三章 (2)3.5 (2)3.6 (5)第五章 (11)5.1.1 (11)5.1.2 (13)5.1.3 (14)5.1.4 (17)5.1.5 (18)5.1.6 (21)5.2.1 (22)5.2.2 (22)5.2.3 (25)5.2.4 (27)5.3.1 (29)5.3.2 (30)5.4.1 (30)5.4.2 (31)5.4.3 (34)5.5.1 (38)5.5.2 (42)5.5.3 (53)5.5.4 (53)5.5.5 (54)第六章 (58)6.1.3 (58)6.1.4 (59)6.2.3 (62)6.3.3 光照度检测模块程序设计 (65)6.4.3 (67)6.5.3 (73)6.6.3 (75)6.6.4 (77)第三章3.5Flash使用的代码样例#include "msp430g2553.h"/****************************************************g2553有4个数据段,每个数据段有64bytes，共256bytesD:0x1000 -- 0x003FC:0x1040 -- 0x107FB:0x1080 -- 0x10BFA:0x10C0 -- 0x10FF****************************************************/#define uint unsigned int#define uchar unsigned char#define SegA 0x010C0#define SegB 0x01080#define SegC 0x01040#define SegD 0x01000#define SegSize 64/********************Flash初始化********************/void FlashInit(){FCTL2=FWKEY+FSSEL_2+FN1; //选择SMLCK作为时钟源，二分频}/********************Flash检测忙********************/void FlashCheckBusy(){while(BUSY==(FCTL3&BUSY)); //检测是否忙}/********************Flash段擦除*******************/void FlashErase(int SegX){_DINT(); //关闭总中断FlashCheckBusy(); //检测Flash是否处于忙状态FCTL3=FWKEY; //lock=0开锁FCTL1=FWKEY+ERASE; //使能段擦除*((int *)SegX)=0x00; //段擦除--空写FlashCheckBusy(); //检测Flash是否处于忙状态FCTL3=FWKEY|LOCK; //上锁return;}/********************Flash写字节********************/ void FlashWriteChar(uint addr,char wdata){_DINT(); //关闭总中断FlashCheckBusy(); //检测Flash是否处于忙状态FCTL3=FWKEY; //lock=0开锁FCTL1=FWKEY+WRT; //写使能*((uchar *)addr)=wdata; //将wdata存入addr变量地址中 FCTL1=FWKEY; //写关闭FCTL3=FWKEY+LOCK; //上锁return;}/********************Flash读字节********************/ char FlashReadChar(uint addr){char rdata;rdata=*(char*)addr; //读取addr所指地址的值return rdata;}/********************Flash写字********************/void FlashWriteWord(uint addr,uint wdata){_DINT(); //关闭总中断FlashCheckBusy(); //检测忙，若忙，则等待FCTL3=FWKEY; //lock=0开锁FCTL1=FWKEY+WRT; //写使能*((uint *)addr)=wdata; //向地址addr处写入wdataFCTL1=FWKEY; //写关闭FCTL3=FWKEY+LOCK; //上锁return;}/********************Flash读字********************/uint FlashReadWord(uint addr){uint rdata;rdata=*(uint *)addr; //读取变量addr地址的值return rdata;}/********************Flash修改字节********************/void FlashModifyChar(uint SegX,char AddrNum,char wdata){char i,TempArry[SegSize];for(i=0;i<SegSize;i++) //读入内存{TempArry[i]=*(uint *)(SegX+i);}TempArry[AddrNum]= wdata; //在数组中的某一位置AddrNum写入wdata FlashErase(SegX); //段擦除FCTL3=FWKEY; //lock=0开锁FCTL1=FWKEY+WRT; //准备写for(i=0;i<SegSize;i++) //向段中重新写数组{*(uint *)(SegX+i)=TempArry[i];}FCTL1=FWKEY; //写关闭FCTL3=FWKEY+LOCK; //上锁}/********************Flash批量写********************/void FlashBurstWrite(int SegX,int *pStr){int i;FlashErase(SegX); //段擦除FCTL3=FWKEY; //lock=0,开锁FCTL1=FWKEY+WRT; //写使能for(i=0;i<2*sizeof(pStr);i++) //将数组内容写入段中{*(uchar *)(SegX+i)=*(pStr+i);}FCTL1=FWKEY; //写关闭FCTL3=FWKEY+LOCK; //上锁}main(){char ReadChar;uint ReadWord;int p[]={'a','b','c','d'};WDTCTL=WDTPW+WDTHOLD; //关闭看门狗P1DIR=0xff; //P1口设为输出，闲置的I/O不悬空P2DIR=0xff; //P2口设为输出，闲置的I/O不悬空P1OUT=0xff; //P1口输出1P2OUT=0xff; //P2口输出1FlashInit(); //Flash初始化FlashErase(SegD);FlashWriteChar(0x01007,0x12); //向地址01008h写入12hReadChar=FlashReadChar(0x01007); //读取地址01008h的值FlashWriteWord(0x01008,0x3456); //向地址01009h和0100Ah依次写入56h和34hReadWord=FlashReadWord(0x01008); //读取从地址01009h起的一个字FlashWriteChar(0x01017,ReadChar); //向地址01018h写入12hFlashWriteWord(0x01018,ReadWord); //向地址01019h和0101Ah依次写入56h和34hFlashBurstWrite(SegC,p); //向SegD段从地址0110h依次写入a、b、c、dFlashModifyChar(SegB,0x02,0xef); //将地址0112h和0113h内容改为e和f _BIS_SR(CPUOFF); //关闭CPU}3.61. USCI模块串行异步通信例程以MSP430G2553的USCI模块串行异步通信操作为例，介绍串口寄存器配置及收发程序处理过程。

Application ReportSLAA705A–July2016–Revised November2019How to Use the Smart Analog Combo and Transimpedance Amplifier on MSP430FR2311ABSTRACTIn sensing applications,operational amplifiers are often needed to condition(for example,to amplify and filter)the analog sensor output so that it can be properly sampled by the analog-to-digital converter(ADC) on the microcontroller(MCU).This application report provides a guide to set up the integrated operational amplifiers(TIA and SAC_OA)on the MSP430FR2311MCU.Examples are provided for using the integrated operational amplifiers as a transimpedance amplifier for current sensing applications.Considerations for low-power operation are also discussed.Contents1Introduction (2)2Configuration of the Integrated Operational Amplifiers (3)2.1Configuration of SAC_OA (3)2.2Configuration of TIA (4)3Application Examples (5)3.1SAC_OA as a Transimpedance Amplifier (5)3.2TIA Module as a Transimpedance Amplifier (7)3.3A Current Sensing System Demo (8)4References (10)List of Figures1SAC_OA Block Diagram (3)2SAC0OA Register(Address0x0C80) (3)3P1SEL0Register(Address0x020A) (4)4P1SEL1Register(Address0x020C) (4)5TIA Block Diagram (4)6TRICTL Register(Address0x0F00) (5)7Transimpedance Amplifier With SAC_OA (6)8Output Voltage With1-µA Input Current (6)9Output Voltage With50-nA Input Current (7)10Transimpedance Amplifier With TIA (7)11Output Voltage With1-µA Input Current (8)12Block Diagram of the Out-of-Box Demo (8)13Output Voltage When the Op Amp is Dynamically Turned On and Off (9)14Power Consumption of the Out-of-Box Demo (9)TrademarksLaunchPad,Code Composer Studio,EnergyTrace are trademarks of Texas Instruments.All other trademarks are the property of their respective owners.1 SLAA705A–July2016–Revised November2019How to Use the Smart Analog Combo and Transimpedance Amplifier onIntroduction 1IntroductionIn many sensing applications,the raw analog output of a sensor must be amplified,filtered,or converted to a voltage to be properly sampled by the analog-to-digital converter(ADC).The digital stream from the ADC is then processed by an MCU to extract the useful information.One example is a transimpedance amplifier.The transimpedance amplifier converts the output current from a sensor to a voltage that isreadable by an ADC.Stand-alone operational amplifiers(OAs)are normally used to perform the task.To reduce the cost and design complexity,two configurable operational amplifiers are implemented onMSP430FR2311mixed signal microcontroller for single chip designs.This application report describes how to set the MSP430FR2311control registers to use the integrated OAs as general-purpose OAs.The transimpedance amplifier for the current sensing applications is used as examples to demonstrate the operation.One complete current sensing system example is discussed with consideration for low-power applications.The examples are verified with the MSP430FR2311LaunchPad™development kit.The MSP430FR2311includes two integrated OAs:•Transimpedance amplifier(TIA)•General-purpose OA in the Smart Analog Combo module(SAC_OA)There are two major differences between those two OA modules.The first difference is the input biascurrent.On the TSSOP16package,there is a dedicated pin for the negative input of the TIA module,and the input bias current is much lower compared to input pins that are multiplexed with other functions.The second difference is input voltage range.The inputs of the TIA module support only half-rail voltage,while the inputs of the SAC_OA module support rail-to-rail voltage.In applications that require wider bandwidth,a second stage of OA is required.The integrated OAs on the MSP430FR2311make design simple with the internal connections between the two OAs and ADC.The user can choose the TIA module for the first stage and the SAC_OA as the second stage.The TIA output is internally connected to the SAC_OA input.The SAC_OA output is internally connected to the ADCinput.No external connection is needed,which not only reduces cost but also improves signal quality.Although the OA outputs are internally connected to next stage of processing,they must be routed to the external pins because the external feedback network is required.The electrical characteristics of the integrated OAs can be found in the MSP430FR2311data sheet.For more details about how to design with operational amplifiers,refer to the following application reports: An Applications Guide for Op AmpsHandbook of Operational Amplifier ApplicationsFor more details about transimpedance amplifiers,refer to the following application reports:Transimpedance Amplifiers(TIA):Choosing the Best Amplifier for the JobTransimpedance Considerations for High-Speed Operational AmplifiersThe user must verify the sensor specifications and working conditions for application so that the integrated OAs are configured properly.OA0O (P1.3)COMPADCOA0- (P1.2)Reserved ReservedOA0+ (P1.4)TRI0OReserved 3SLAA705A–July 2016–Revised November 2019How to Use the Smart Analog Combo and Transimpedance Amplifier on2Configuration of the Integrated Operational AmplifiersThis section describes how to set up the MSP430FR2311control registers to enable the integrated operational amplifiers as general-purpose operational amplifiers.There are two steps in setting up an integrated OA to work as a general-purpose OA.•Enable and configure the OA module.•Configure the pin multiplexing to enable required OA functions on the external pins.2.1Configuration of SAC_OAFigure 1shows the block diagram of SAC_OA.The black squares are the control bits in the SAC0OA register.In addition to an external pin,the output of the SAC_OA is internally connected to inputs of the compare (eCOMP)and analog-to-digital converter (ADC)modules for further processing.The internal connections save pins so that signal is not routed out and then back into the device,which also can be advantageous in respect to noise.The control registers of the eCOMP and ADC modules must be configured to use this signal as input.Figure 1.SAC_OA Block DiagramTo enable SAC_OA as a general-purpose operational amplifier,the OAEN,PMUXEN,and NMUXEN bits must be set in the SAC0OA register.Configure the OAPM bit to select high-speed or low-speed mode according to the application requirements.The high-speed mode enables faster slew rate at the cost of higher power consumption.The PSEL bits can be configured to connect the positive input to the external pin or TIA output.Figure 2shows the definition of the control register SAC0OA.For example,a value of 0x0588must be written to the SAC0OA register to set up SAC_OA inputs to external pins and set SAC_OA in low-power low-speed mode.15141312111098ReservedSACEN OAPM OAEN r0r0r0r0r0rw-(0)rw-(0)rw-(0)7654321NMUXEN ReservedNSELPMUXEN ReservedPSELrw-(0)r0rw-(0)rw-(0)rw-(0)r0rw-(0)rw-(0)Figure 2.SAC0OA Register (Address 0x0C80)The I/O pins on MSP430FR2311are multiplexed with multiple module functions.The GPIO port control registers P1SEL0and P1SEL1must be configured to enable the SAC_OA function on the external pins.Figure 3and Figure 4show the definition of the P1SEL0and P1SEL1registers,respectively.Bits 2,3,and 4must be set in both the P1SEL0and P1SEL1registers to enable operational amplifier function on the external I/O pins.TRI0- (P1.6)TRI0O (P1.5)OPA0+COMPADCTRI0+ (1.7)Reserved Reserved Reserved76543210P1SEL0rw-0rw-0rw-0rw-0rw-0rw-0rw-0rw-0Figure 3.P1SEL0Register (Address 0x020A)7654321P1SEL1rw-0rw-0rw-0rw-0rw-0rw-0rw-0rw-0Figure 4.P1SEL1Register (Address 0x020C)As an example,use the code sequence in Example 1to enable SAC_OA in low-speed mode with MSPWare driverlib APIs.In this example,all SAC_OA pins are routed to external I/O pins.Example 1.Code Example for Configuring SAC_OA//Enable op amp functions on external pinsGPIO_setAsPeripheralModuleFunctionInputPin (GPIO_PORT_P1,GPIO_PIN2|GPIO_PIN3|GPIO_PIN4,GPIO_TERNARY_MODULE_FUNCTION);//Select external pins for both positive and negative inputs SAC_OA_init(SAC0_BASE,SAC_OA_POSITIVE_INPUT_SOURCE_EXTERNAL,SAC_OA_NEGATIVE_INPUT_SOURCE_EXTERNAL);//Select low speed and low power modeSAC_OA_selectPowerMode(SAC0_BASE,SAC_OA_POWER_MODE_LOW_SPEED_LOW_POWER);//Enable OASAC_OA_enable(SAC0_BASE);//Enable SACSAC_enable(SAC0_BASE);2.2Configuration of TIAFigure 5shows the block diagram of the TIA module.The black squares are the control bits in the TRICTL register.In addition to an external pin,the output of TIA is internally connected to inputs of the eCOMP,ADC,and SAC_OA modules for further processing.The control registers of those modules must be configured to use this signal as input.Figure 5.TIA Block Diagram Application Examples5SLAA705A–July 2016–Revised November 2019How to Use the Smart Analog Combo and Transimpedance Amplifier onTo enable TIA as a general-purpose operational amplifier,the TRIEN bit must be set in the TRICTL register.Configure the TRIPM bit to select high-speed or low-speed mode.A value of 0x01must be written to the TRICTL register to enable TIA as a general-purpose operational amplifier in low-speed mode.To support faster slew rate,the high-speed mode can be set by writing a value of 0x3to theTRICTL register.The high-speed mode consumes more power than the low-speed mode.Figure 6shows the definition of the TRICTL register.15141312111098Reserved r-0r-0r-0r-0r-0r-0r-0r-076543210TRIPSELReservedTRIPM TRIEN rw-(0)rw-(0)r-0r-0r-0r-(0)rw-(0)rw-(0)Figure 6.TRICTL Register (Address 0x0F00)The GPIO port control register P1SEL0and P1SEL1must be configured to enable the TIA function on the external pins.Bits 5,6,and 7must be set in both P1SEL0and P1SEL1registers to enable the TIA function on the external I/O pins.As an example,the code sequence in Example 2can be used to set up TIA in low-speed mode with MSPWare driverlib APIs.Example 2.Code Example for Configuring TIA//Configure Op-Amp functionality for the external pins GPIO_setAsPeripheralModuleFunctionInputPin(GPIO_PORT_P1,GPIO_PIN5|GPIO_PIN6|GPIO_PIN7,GPIO_TERNARY_MODULE_FUNCTION);//Select low power low speed modeTRI_selectPowerMode(TRI0_BASE,TRI_LOW_SPEED_LOW_POWER);//Enable TIATRI_enable(TRI0_BASE);3Application ExamplesWhen an integrated OAs is enabled and signals are routed to external I/O pins,the module can be used as a stand-alone OA.The functionality of the amplifier is determined by the feedback network.The following examples are based on the circuit of the MSP430FR2311LaunchPad development kit.3.1SAC_OA as a Transimpedance AmplifierIn many applications,the sensing element (a photodiode,for example)is a current source.Atransimpedance amplifier is required to convert the sensor output current to voltage so that it can be read by the ADC module.A transimpedance amplifier composed of the SAC_OA module (see Figure 7).Application Examples Figure7.Transimpedance Amplifier With SAC_OAThe gain of the transimpedance amplifier is purely determined by the value of the feedback resistor when the input bias current of the operational amplifier is negligible.For the circuit in Figure8,a voltage of2.5V is observed at the OA0O pin when the photodiode generates an output of1µA.The1-pF bypasscapacitor enables a low-pass filter with a pole at63kHz to eliminate potential oscillation at highfrequencies.Figure8shows the op amp output voltage with1-µA input current.For this example,the photodiode on the MSP430FR2311LaunchPad development kit is replaced by a current source.The current source is constructed by a function generator with a1-MΩresistor in series.Figure9shows the op amp outputvoltage with50-nA input current.The input waveform is on Channel2,and the output is on Channel1. ArrayFigure8.Output Voltage With1-µA Input CurrentTRI0O (P1.5) Application Examples7 SLAA705A–July2016–Revised November2019How to Use the Smart Analog Combo and Transimpedance Amplifier onFigure9.Output Voltage With50-nA Input Current3.2TIA Module as a Transimpedance AmplifierThe transimpedance amplifier in Figure10is the same as in Figure7except that the operational amplifier is replaced by the TIA module.On the TSSOP16package,the TIA module is the preferred choice for a transimpedance amplifier due to the small input bias current on the TRI0-pin.A user can take advantage of the low input bias current when interfacing a sensor with low output current.Figure10.Transimpedance Amplifier With TIAFigure11shows the output voltage with1-µA input current pulses.On the MSP430FR2311LaunchPad, the phot diode is replaced by a current source.Jumpers are removed to disconnect the SAC_OA pinsfrom input.Then two jumper wires are used to connect the feedback resistor and current source to the TIA negative input and output.The TIA positive input is tied to ground via a jumper wire.The noise level is high in the output due to long jumper wires.In a real application,the signal traces to the op amp must be as short as possible to minimize noise.PhotodiodeApplication Examples Figure11.Output Voltage With1-µA Input Current3.3A Current Sensing System DemoThe out-of-box demo provided with the MSP430FR2311LaunchPad development kit implements acomplete current sensing system example.It shows how to use the integrated op-amp(SAC_OA)as a transimpedance amplifier along with the timer,ADC,and external LED to implement a light sensor forultra-low-power applications.Figure12shows the block diagram of the demo.The transimpedance amplifier is made of the SAC_OA module.It converts the current from the photodiode to a voltage.1-µA input current produces a voltage of2.5V.This voltage is then read by the analog-to-digital converter(ADC)and fed to a timer module to drivean external LED with PWM.The duty cycle of the PWM is proportional to the current from the photodiode.As more light reaches the photodiode,the LED becomes brighter.Figure12.Block Diagram of the Out-of-Box DemoTo demonstrate how to reduce power consumption,the device is kept in lower-power mode most of time.A timer is set up to wake up the device every50ms for the measurements.The complete CodeComposer Studio™IDE project for the demo can be downloaded from the TI web site. Application Examples9SLAA705A–July 2016–Revised November 2019How to Use the Smart Analog Combo and Transimpedance Amplifier onFigure 13shows the output voltage of the transimpedance amplifier when it is dynamically enabled and disabled.After the OA is enabled,a small delay is needed before starting the ADC module so that the ADC module does sample the transient pulse when the op amp is enabled.Figure 13.Output Voltage When the Op Amp is Dynamically Turned On and OffFigure 14shows the power consumption of the demo.This data was captured using EnergyTrace™technology.The power profile data indicates a battery life of 380days when a CR2032battery is used.Figure 14.Power Consumption of the Out-of-Box DemoThis demonstration provides functional blocks that can be used for applications such as smoke detectors and gas detectors.References 4References1.MSP430FR231x Mixed-Signal Microcontrollers2.MSP430FR4xx and FR2xx Family User’s Guide3.MSP430FR2311LaunchPad™Development Kit(MSP-EXP430FR2311)User's Guide4.AN-20An Applications Guide for Op Amps5.Handbook of Operational Amplifier Applications6.Transimpedance Amplifier(TIA):Choose the Best Amplifier for the Job7.Transimpedance Considerations for High-Speed Amplifiers Revision History11SLAA705A–July 2016–Revised November 2019Submit Documentation Feedback Copyright ©2016–2019,Texas Instruments IncorporatedRevision History Revision HistoryNOTE:Page numbers for previous revisions may differ from page numbers in the current version.Changes from July 20,2016to November 15,2019Page •Changed the document title;editorial changes in abstract (1)IMPORTANT NOTICE AND DISCLAIMERTI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, regulatory or other requirements.These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources.TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on or provided in conjunction with such TI products. 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LaunchPad实验板触摸感应子卡使用指南ZHCU011 – August 201011. 触摸感应子卡概述1.1 概述LaunchPad Touch的触摸感应子卡是一个基于Texas Instruments MSP430G2xx系列的完整的触摸感应应用开发方案.。

触摸感应子卡可以被插入现有的MSP-EXP430G2 LaunchPad实验板来实现一个触摸感应的应用。

进行简单的硬件配置和使用不同的软件，可以实现按键/滑条/拨号盘的不同应用。

在MSP-EXP430G2 LaunchPad实验板套件中采用了MSP430G2211微控制器；利用MSP430G2211的内置比较器来完成触摸感应, 同时利用计时器来控制LED闪烁频率以及LED的亮度作为反馈.强烈推荐您在使用触摸感应子卡前阅读MSP-EXP430G2 LaunchPad 实验版用户手册(SLAU318)相关代码和更多信息可在/xxx上下载.MSP-EXP430G2可以运用IAR Embedded workbench集成开发环境(IDE) 或Code Composer Studio (CCS) 来进行代码编写, 程序下载和调试。

调试程序非常简单易用，不需要任何额外的硬件资源，允许用户全速运行程序，设定硬件断点以及单步执行等。

触摸感应子卡特性:z实现触摸按键/滑块/拨号盘的功能z通过2个通用数字I/O口来驱动2颗LED用于视觉反馈z支持所有PDIP14封装的具有片内比较器模块的MSP430G2x11和MSP430F20x1型号z能轻松连接到MSP-EXP430G2 LaunchPad实验板用于调试图1. 触摸感应子卡外观图1.2 套件内容触摸感应子卡套件包含了以下一些配件:z触摸感应子卡另外, 套件附送的MSP430G2211芯片可以帮助您马上体验EXP430G2的各项功能。

MSP430G2211是超低功耗16位微控制器MSP430中的一员，拥有片内比较器，2k字节程序空间和128字节的SRAM。

MSP432P401R 用户指南1. 引言本文档旨在为使用MSP432P401R微控制器的开发者提供详细的用户指南。

MSP432P401R是德州仪器（TI）推出的一款低功耗、高性能的ARM Cortex-M4F 内核微控制器。

本指南将帮助用户了解MSP432P401R的基本特性、功能模块和使用方法。

2. 概述MSP432P401R微控制器是基于ARM Cortex-M4F内核的32位单片机。

与其他MSP微控制器相比，MSP432P401R具有更低的功耗和更高的性能。

它采用了TI 的低功耗技术，使得在高性能运算的同时，整个系统的功耗仅为几个微瓦。

MSP432P401R具有丰富的外设功能，包括数字IO、模拟IO、时钟和定时器。

它还支持各种通信接口，如UART、SPI和I2C，以及模拟模块，如ADC和DAC。

此外，MSP432P401R还集成了多个片上内存和闪存，以及一些特殊模块，如低功耗计时器（RTC）和DMA控制器。

3. 特性3.1 处理器MSP432P401R采用ARM Cortex-M4F内核，运行频率高达48MHz。

它具有高性能的浮点单元（FPU），可加速浮点运算，支持单精度和双精度浮点数操作。

此外，MSP432P401R还集成了硬件除法器，可执行快速的整数除法操作。

3.2 存储器MSP432P401R具有256KB的闪存和64KB的RAM。

闪存用于存储用户程序和数据，RAM用于存储运行时数据。

此外，MSP432P401R还具有额外的片上存储器，如EEPROM和FRAM，可供用户进行非易失性数据存储。

3.3 时钟和定时器MSP432P401R支持多个时钟源，包括外部晶体振荡器、内部RC振荡器和低功耗振荡器。

它还具有多个定时器模块，包括通用定时器和低功耗定时器，可用于生成精确的时间延迟和定时事件。

3.4 通信接口MSP432P401R支持多种通信接口，包括UART、SPI和I2C。

通过这些接口，可以实现与其他外部设备的数据交换和通信。

430BOOST-TMP006BoosterPack User's GuideLiterature Number:SLAU440June2012Contents 1430BOOST-TMP006BoosterPack Overview (3)1.1Overview (3)2TMP006Information (4)2.1TMP006EVM (4)3Getting Started (4)3.1Requirements (4)3.2Configuring LaunchPad (4)3.3Connecting Hardware (5)4Obtaining Software Packages (5)4.1Re-Downloading or Modifying Firmware (5)4.2Installing BoosterPack GUI (5)4.3Starting The Demo Application (5)5User Experience Application (6)5.1Data Sampling Mode (6)5.2Data Logging Mode (8)6API Guide (9)6.1Summary of API Functions (9)7References (9)8Schematics (10)2Table of Contents SLAU440–June2012Submit Documentation FeedbackCopyright©2012,Texas Instruments IncorporatedToggles between Data Streaming Mode and Data Logging ModeLED On –Data Streaming Mode LED Off–Data Logging ModeTMP006EVMRecalibrate the temperaturereading to current room temperature Red LED –Indicates warmer than calibrated value Green LED –Indicates colder than calibrated valueUser's GuideSLAU440–June 2012430BOOST-TMP006BoosterPack1430BOOST-TMP006BoosterPack Overview 1.1OverviewThe 430BOOST-TMP006BoosterPack provides a quick and low-cost solution to evaluate and develop with the TMP006contactless temperature sensor.To quickly get started,this BoosterPack comes with a pre-loaded firmware for MSP430G2553device.The software ecosystem also provides fully commented source code for customers to get started with developing their application..A GUI is also available for interaction with the BoosterPack.See Figure 1for an overview of the BoosterPack hardware.Figure 1.430BOOST-TMP006BoosterPack Overview3SLAU440–June 2012430BOOST-TMP006BoosterPackSubmit Documentation FeedbackCopyright ©2012,Texas Instruments IncorporatedTMP006Information 2TMP006InformationThe TMP006is a contactless temperature sensor that uses an infrared thermopile sensor to detect the temperature of a target object.The TMP006data sheet contains all relevant electrical information(both analog and digital)pertaining to the device.The TMP006User’s Guide answers many common questions related to the operation of the TMP006,including critical application criteria,printed circuit board(PCB) layout guidelines,and the equations used to calculate target object temperature.2.1TMP006EVMThis BoosterPack is intended to demonstrate how an MSP430and TMP006can integrate into onesystem.To simplify this integration,the TMP006EVM is included as part of this BoosterPack kit.TheTMP006EVM hardware is well documented in the TMP006EVM User Guide;however,note that thisBoosterPack contains different software.3Getting Started3.1RequirementsTMP006BoosterPack requires LaunchPad rev1.4and above.See /launchpadwiki for more information.TMP006BoosterPack also requires a MSP430G2553device,which is included.This device is pre-programmed with the user experience firmware(see Section5).3.2Configuring LaunchPadunchPad rev1.4and below requires cross jumpering the UART lines.See MSP-EXP430G2LaunchPad Experimenter Board User's Guide(SLAU318)for more information.2.For LaunchPad rev1.5,switch to hardware UART through J3jumpers(see Figure2).Figure2.J3Jumper3.Remove P1.6jumper for I2C operation(see Figure3).Figure3.P1.6Jumper4.Do not touch the TMP006sensor.5.Replace the existing LaunchPad device with the MSP430G2553device inside the TMP006BoosterPack.This device has been pre-loaded with the user experience firmware.6.Insert BoosterPack on top of the LaunchPad.4430BOOST-TMP006BoosterPack SLAU440–June2012Submit Documentation FeedbackCopyright©2012,Texas Instruments Incorporated Obtaining Software Packages 3.3Connecting HardwareInstall the LaunchPad drivers included in the firmware package,if needed(see Section4for details on downloading the latest software).Connect LaunchPad using a USB cable to a PC that is running Windows(see Figure4).If prompted,allow Windows to install the software automatically.Figure4.Connect USB4Obtaining Software PackagesDownload the latest software packages from /tmp006boosterpack.Download the two software packages.One package contains the source code and binaries forMSP430G2553firmware.The other is the GUI application created in LabView for interacting with theBoosterPack.4.1Re-Downloading or Modifying FirmwareThis step is optional to get started if you have used the pre-loaded MSP430G2553device inside theTMP006BoosterPack.This step can be used to reload the firmware with a newer version or to a blank device.The quickest way to re-download firmware image is to run MSP430Flasher.bat inside thebin/firmware folder.To modify the firmware,see Section5regarding supported compilers.4.2Installing BoosterPack GUIExtract the software zip software package with the filename430boost_tmp006_gui_x_xx_xx_xx.zip.Execute the setup.exe inside gui_installer folder and follow the installation instructions.4.3Starting The Demo Application1.Determine LaunchPad COM port through the Windows Device Manager.unch TMP006BoosterPack GUI software.3.Select COM Port and OK(see Figure5).5 SLAU440–June2012430BOOST-TMP006BoosterPack Submit Documentation FeedbackCopyright©2012,Texas Instruments IncorporatedUser Experience Application Figure5.Select COM port and Click OK5User Experience ApplicationThis software package includes the project files to allow customers re-compile the code for userdevelopment.You could download free and unrestricted compilers and debuggers,including:•Code Composer Studio™version5.2(CCS)•IAR Embedded Workbench™v5.40.3These project files are located inside430boost_tmp006_x_xx_xx_xx.zip src folder with their respective compiler names as the folder.This application uses hardware UART using the MSP430G2553USCI module to communicate to the PC via the LaunchPad’s backchannel UART.The software is capable of using timer-based UART,but theuser would need to change the HARDWARE_UART definition inside the uart.h file,re-compile,and re-download the firmware.There are two main user application modes in this user experience code.It operates together with the GUI application.•Data Sampling Mode•Data Logging Mode5.1Data Sampling ModeThis mode samples the object temperature and streams the data back to the PC via the MSP430LaunchPad backchannel UART.The PC then displays the data on the GUI.The Object Temperature is the calculated temperature of the object.The Local Temperature is the temperature with transientcorrection filter applied.When this mode is operating,the LED1(RED)on the LaunchPad is on.The BoosterPack has green(D1)and red(D2)LEDs onboard.These LEDs light up depending on how cold or hot since it was last calibrated.The colder the temperature is from the calibrated value,thebrighter the green LED would be.The hotter the temperature is from the calibrated value,the brighter the red led would be.To calibrate a new value,press the S1button on the Launchpad.6430BOOST-TMP006BoosterPack SLAU440–June2012Submit Documentation FeedbackCopyright©2012,Texas Instruments IncorporatedChange the conversion rate on how often to sample the target temperatureClear the data logger memory from FlashRaw data output from MSP430Triggers a data dump fromLaunchPad's memory buffer to the PC.Available only in Data Logging Mode.Toggle between Data Stream and Data Logger Modes User Experience ApplicationFigure 6.BoosterPack GUI in Data Streaming ModeFigure 7shows the graph plot of the data that were streamed back to the PC over time.To save the data into a CSV file (for example,for data analysis),click Tools >Save Streamed Temperature Data.7SLAU440–June 2012430BOOST-TMP006BoosterPackSubmit Documentation FeedbackCopyright ©2012,Texas Instruments IncorporatedUser Experience Application Figure7.Temperature Values Plotted on Graphs5.2Data Logging ModeIn this mode,temperature can be sampled without connection to a PC.An external power source like a battery pack,not included,must be used.To start data logging mode,press the S2button.This button is required if the BoosterPack is used in an untethered mode from the PC.Ensure that LED1is no longer ON,which indicates that the firmware is no longer in Data Logging Mode.To operate the following user configurations,the BoosterPack must be connected to a PC.Select the data logging mode in the GUI or press the S2button to switch the mode if the BoosterPack is in data sampling mode.Clear the data logging buffer in flash memory by pressing Erase Flash Data on the GUI.To send the data to the PC for data analysis,click Dump Flash Data to PC in the GUI.All of the loggedtemperature from the flash memory is read.This data can then be used for data analysis;for example, using an Excel®spreadsheet.8430BOOST-TMP006BoosterPack SLAU440–June2012Submit Documentation FeedbackCopyright©2012,Texas Instruments Incorporated API GuideFigure8.BoosterPack GUI in Data Logging Mode6API GuideThis source code allows the user to leverage it for their application development when coupled with an MSP430device and TMP006.The TMP006API source code is fully documented in the doc folder.See the Doxygen output under doc folder for detailed information on all available API functions.6.1Summary of API FunctionsThe following API functions are available for code development:void tmp006_init(unsigned char drdyPinEn,unsigned int conversionTime)void tmp006_wakeup(void)void tmp006_disable(void)unsigned char tmp006_ready(void)struct TempReading tmp006_getTemp(void)long double tmp006_calculateTemp(long double*tDie,long double*vObj)int tmp006_read(unsigned char writeByte)void tmp006_write(unsigned char pointer,unsigned int writeByte)7References1.MSP-EXP430G2LaunchPad Experimenter Board User's Guide(SLAU318)9 SLAU440–June2012430BOOST-TMP006BoosterPack Submit Documentation FeedbackCopyright©2012,Texas Instruments IncorporatedVCCP1.1 (TXD)P1.3 (S2)P1.4P1.5P2.0P2.1P2.2P2.3P2.4P2.5P1.6 (LED2)P1.7(S1) RST TEST XOUT XIN GND Schematics 8SchematicsFigure 9.430BOOST-TMP006Schematic10430BOOST-TMP006BoosterPackSLAU440–June 2012Submit Documentation FeedbackCopyright ©2012,Texas Instruments 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建立MSP430 Launchpad 开发环境从MSP430 Launchpad 主页下载Code Composer Studio (CCS)。

在下载页面选择Download latest production CCSv4 MSP430/C28x code size limited image 下面的链接。

有几点要注意：1、下载时需要注_册TI 账户。

2、16KB 限制。

即对于msp430x2xxx 来说不算限制。

3、安装时自动安装驱动及License。

4、使用Vmware 虚拟机连接Launchpad 时会冻住，在一段时间内虚拟机不响应。

USB 设备无法识别。

（Ubuntu11.04 + Vmware 3.1.3 + Windows XP SP3）5、Windows XP 下显示Launchpad 对应的JTAG 仿真器无法启动，但不影响编程及调试。

6、CCS 的IDE 实际上是eclipse。

第4 点比较奇怪，不知道其他人有没有遇到？有没有解决方法？* Linux 篇从MSPGCC 主页下载目前最新的mspgcc-20110716。

解压缩后的文件中除了文档外，还包括README、3 个patch 文件和2 个version 文件。

构筑流程是：1、确保系统中装有以下软件包：patch ncurses-dev build-essential bison flex libgmp3-dev libmpfr-dev libmpc-dev texinfo zlib1g-dev2、阅读README。

3、阅读patch。

4、根据patch 内指示依次补丁、编译及安装binutils、gcc、gdb。

如果patch 内的下载地址失效，用google 搜索同名文件下载并验证md5。

5、根据version 中的版本号下载依次下载、安装msp430mcu 和msp430-libc。

6、下载mspdebug，当前版本mspdebug-0.17。