具有纳米凹坑氧化铟锡的LED光提取效率的提高
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Vol.33,No.5JournalofSemiconductorsMay2012Lightextractionefficiencyenhancementinlight-emittingdiodeswithindiumtinoxidenano-craters
ZhengHuaiwen(郑怀文),ZhangYiyun(张逸韵),YangHua(杨华),XueBin(薛斌),WuKui(吴奎),LiJing(李璟),andWangGuohong(王国宏)
SolidStateLightingResearchandDevelopmentCentre,InstituteofSemiconductors,ChineseAcademicsofSciences,Beijing100083,China
Abstract:Asimpleandlowcostmethodisdescribedwhichimprovesextractionefficiency.Theindiumtinoxide(ITO)texturedfilmwasfabricatedbyusingtheself-assemblymethodanddry-etching.Thesurfacemorphologiesandsurfaceroughnesswereobservedbyusinganatomicforcemicroscope.TheI–Vcharacteristics,outputpowerandpolarradiationpatternoftheLEDswithandwithouttexturedITOweremeasuredforcomparison.CylindersandcraterswereformedontheITOsurfaceaftertheetching,theheightofwhichincreasedwithetchingtime.Theoutputpowerofthedevicesisproportionaltotheetchingtime.TotalinternalreflectionoflightontheITO-GaNinterfaceisreducedduetotheappearanceofcylindersandcraters,andtheirincreasingheight.Thus,theoutputpowerisimproved.
Keywords:indiumtinoxide;self-assembly;light-emittingdiodes;texturedsurfaceDOI:10.1088/1674-4926/33/5/054009EEACC:2560
1.IntroductionGaN-basedlight-emittingdiodes(LEDs)haveattractedconsiderableinterestinrecentyearsduetotheirhugedemandandpotentialforvariousapplicationsŒ1.However,themajorityofapplicationsarecurrentlyhinderedbythelowlightextrac-tionefficiencyandLambertian-likeradiationprofilecausedbythelargedifferenceintherefractiveindexbetweentheLEDdieandtheexternalmediumŒ2;3.Mostphotonsaretrappedin-sidetheLEDdevicebytotalinternalreflection(TIR)andcon-vertedtoheat,whichlimitstheexternalquantumefficiencyofconventionalLEDstoonlyafewpercentŒ2.Severalmeth-odshasbeenstudiedtoenhanceexternalquantumefficiencyandtoreducethetotalinternalreflection.Usingatexturedsur-facehasbeendemonstratedtobeaneffectivetechniqueŒ4.It
wasstudiedthathighlightoutputpowervaluesinLEDswasachievedbyusingatexturedsurfaceŒ512.Surfaceroughnesswasdefinedbyprocessessuchasindiumtinoxide(ITO)withatexturedsurfaceŒ1323,etchingthinfilmŒ24;25andside-wallroughnessŒ26.However,suchmethodsarecomplexandexpen-sive.Inthisstudy,anewapproachisdevelopedtofabricatetexturedindiumtinoxide(ITO)filmbyusingaself-assemblymethodanddryetching.Theadvantageofthemethodisitssimplicityandlowcost.Meanwhile,thep-GaNlayerispro-tectedduringtheprocess.
2.ExperimentalmethodsAconventionalGaNLEDstructurewasgrownona2-inchpatternedsapphiresubstratebyusingmetal-organicchem-icalvapordeposition(MOCVD).TheepitaxialLEDstructureconsistsofa1-m-thicklow-temperaturegrownGaNbufferlayer,a2-m-thickundopedGaNlayer,a2-m-thickheav-ilydopedn-typeGaNlayer,10pairsofInGaN(3nm)/GaN(12nm)multiplequantumwells(MQWs)withatotalthick-nessof0.15m,anda0.2-m-thickp-typeGaNlayer.Af-tera300-nm-thickITOtransparentconductivelayerwasde-positedonthewaferbyanelectronbeamsystem,monodis-persepolystyrene(PS)nanoparticleswithadiameterof1mwereassembledintoacloselypackedmonolayerontheITOlayerbyusingtheself-assemblymethod.TheGaNLEDwasdividedintofourparts:samplesA,B,C,D.Inductivelycou-pledplasma(ICP)etchingwasappliedonsamplesB,C,Dfor175,250,300s,respectively.Allthesampleswerethenputintodeionizedwaterbeforepolystyreneparticlesweremovedbyusinganultrasonicconcussionbath.SampleAwasnotetchedandusedforcomparison.Next,theLEDmesa(11mm2/wasobtainedbystandardlithographypatterningfollowedbyGaNetchinginICPtoexposethen-typeGaNlayer.Finally,ametallizationprocesswasappliedonthesamplestoformthep-andn-electrodeswhereCr/Pt/Au(50/50/1500nm)wasde-positedontotheITOtransparentconductivelayerandthen-typeGaNlayerrespectivelybyusinganelectron-beamevap-orator.SchematicsofthefabricatingprocessareillustratedinFigs.1(a)–1(d).3.ResultsanddiscussionFigure2showstheAFMimagesofITOsurfacemorpholo-gies.TheITOandnanoparticlesareetchedwith0,175,250,300s,respectively.ThesurfaceroughnessofsamplesA,B,C,Dis8.129,37.629,52.170,58.778nm,respectively.CylinderswereformedontheITOsurfaceduringICPetching,asshowninFig.2(d).Whenetchingtimewasabove250s,craterswere
*ProjectsupportedbytheNationalHighTechnologyResearchandDevelopmentProgramofChina(No.2011AA03A107).Correspondingauthor.Email:zhenghw@semi.ac.cnReceived29October2011,revisedmanuscriptreceived19December2011c2012ChineseInstituteofElectronics
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