SN74CBT16211CDL中文资料

© 2000 Fairchild Semiconductor Corporation DS500192February 1999Revised July 200074VCX16722 Low Voltage 22-Bit Register with 3.6V Tolerant Inputs and Outputs74VCX16722Low Voltage 22-Bit Registerwith 3.6V Tolerant Inputs and OutputsGeneral DescriptionThe VCX16722 low voltage 22-bit register contains twenty-two non-inverting D-type flip-flops with 3-STATE outputs and is intended for bus oriented applications. The design has been optimized for use with JEDEC compliant 200 pin DIMM modules.The 74VCX16722 is designed for low voltage (1.65V to 3.6V) V CC applications with I/O capability up to 3.6V.The 74VCX16722 is fabricated with an advanced CMOS technology to achieve high speed operation while maintain-ing low CMOS power dissipation.Featuress 1.65V–3.6V V CC specifications provided s 3.6V tolerant inputs and outputs s t PD (CLK to O n )3.6ns max for 3.0V to 3.6V V CC4.6ns max for 2.3V to 2.7V V CC 9.2ns max for 1.65V to 1.95V V CCs Power-down high impedance inputs and outputs s Supports live insertion/withdrawal (Note 1)s Meets JEDEC registered module specifications s Static Drive (I OH /I OL )±24mA @ 3.0V ±18mA @ 2.3V ±6mA @ 1.65Vs Latchup performance exceeds 300 mA s ESD performance:Human body model > 2000V Machine model >200VNote 1: To ensure the high-impedance state during power up or power down, OE should be tied to V CC through a pull-up resistor; the minimum value of the resistor is determined by the current sourcing capability of the driver.Ordering Code:Devices also available in T ape and Reel. Specify by appending the suffix letter “X ” to the ordering code.Order Number Package NumberPackage Description74VCX16722MTDMTD6464-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide 274V C X 16722Connection Diagram Pin DescriptionsTruth TableH = HIGH Voltage Level L = LOW Level VoltageX = Immaterial (HIGH or LOW, Inputs may not float)Z = High ImpedanceO 0 = Previous O 0 before LOW-to-HIGH transition of Clock = LOW-to-HIGH transitionFunctional DescriptionThe VCX16722 contains twenty-two D-type flip-flops with 3-STATE standard outputs. The twenty-two flip-flops will store the state of their individual D-type inputs that meet the setup and hold time requirements on the LOW-HIGH Clock (CLK) transition, when the Clock-Enable (CE) is LOW. The 3-STATE standard outputs are controlled by the Output-Enable (OE). When OE is HIGH, the standard out-puts are in high impedance mode but this does not inter-fere with entering new data into the flip-flops.Logic DiagramPin Names DescriptionOE Output Enable Input (Active LOW)CE Clock Enable Input (Active Low)CLK Clock Input D 1 - D 21Data Inputs O 1 - O 213-STATE OutputsCLK CE OE D 0-D 21O 0-O 21X X H X Z XH L X O 0 L L L L L L H H L or HLLXO 074VCX16722Absolute Maximum Ratings (Note 2)Recommended Operating Conditions (Note 4)Note 2: The “Absolute Maximum Ratings ” are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the Absolute Maximum Rat-ings. The Recommended Operating Conditions tables will define the condi-tions for actual device operation.Note 3: I O Absolute Maximum Rating must be observed.Note 4: Floating or unused pin (inputs or I/O's) must be held HIGH or LOW.DC Electrical Characteristics (2.7V < V CC ≤ 3.6V)Note 5: Outputs disabled or 3-STATE only.Supply Voltage (V CC )−0.5V to +4.6V DC Input Voltage (V I )−0.5V to +4.6V Output Voltage (V O )Outputs 3-STATE −0.5V to +4.6V Outputs Active (Note 3)−0.5 to V CC + 0.5VDC Input Diode Current (I IK ) V I < 0V −50 mA DC Output Diode Current (I OK )V O < 0V −50 mA V O > V CC+50 mA DC Output Source/Sink Current (I OH /I OL )±50 mA DC V CC or Ground Current per Supply Pin (I CC or Ground)±100 mAStorage Temperature Range (T STG )−65°C to +150°CPower Supply Operating1.65V to 3.6V Data Retention Only 1.2V to 3.6VInput Voltage −0.3V to 3.6VOutput Voltage (V O )Output in Active States 0V to V CC Output in 3-STATE 0.0V to 3.6VOutput Current in I OH /I OL V CC = 3.0V to 3.6V ±24 mA V CC = 2.3V to 2.7V ±18 mA V CC = 1.65V to 2.3V±6 mAFree Air Operating Temperature (T A )−40°C to +85°CMinimum Input Edge Rate (∆t/∆V)V IN = 0.8V to 2.0V, V CC = 3.0V10 ns/VSymbol ParameterConditionsV CC Min Max Units (V)V IH HIGH Level Input Voltage 2.7–3.6 2.0VV IL LOW Level Input Voltage 2.7–3.60.8VV OHHIGH Level Output VoltageI OH = −100 µA 2.7–3.6V CC − 0.2I OH = −12 mA 2.7 2.2VI OH = −18 mA 3.0 2.4I OH = −24 mA3.0 2.2V OLLOW Level Output VoltageI OL = 100 µA 2.7–3.60.2I OL = 12 mA 2.70.4VI OL = 18 mA 3.00.4I OL = 24 mA3.00.55I I Input Leakage Current 0V ≤ V I ≤ 3.6V 2.7–3.6±5.0µA I OZ 3-STATE Output Leakage 0V ≤ V O ≤ 3.6V 2.7–3.6±10µA V I = V IH or V IL I OFF Power Off Leakage Current 0V ≤ (V I , V O ) ≤ 3.6V 010µA I CC Quiescent Supply Current V I = V CC or GND2.7–3.620µA V CC ≤ (V I , V O ) ≤ 3.6V (Note 5) 2.7–3.6±20∆I CCIncrease in I CC per InputV IH = V CC − 0.6V2.7–3.6750µA 474V C X 16722DC Electrical Characteristics (2.3V ≤ V CC ≤ 2.7V)Note 6: Outputs disabled or 3-STATE only.DC Electrical Characteristics (1.65V ≤ V CC < 2.3V)Note 7: Outputs disabled or 3-STATE only.Symbol ParameterConditionsV CC Min Max Units (V)V IH HIGH Level Input Voltage 2.3–2.7 1.6VV IL LOW Level Input Voltage 2.3–2.70.7VV OHHIGH Level Output VoltageI OH = −100 µA 2.3–2.7V CC − 0.2VI OH = −6 mA 2.3 2.0I OH = −12 mA 2.3 1.8I OH = −18 mA2.3 1.7V OLLOW Level Output VoltageI OL = 100 µA 2.3–2.70.2I OL = 12mA 2.30.4V I OL = 18 mA2.30.6I I Input Leakage Current 0 ≤ V I ≤3.6V 2.3–2.7±5.0µA I OZ 3-STATE Output Leakage 0 ≤ V O ≤ 3.6V 2.3–2.7±10µA V I = V IH or V IL I OFF Power Off Leakage Current 0 ≤ (V I , V O ) ≤ 3.6V 010µA I CCQuiescent Supply CurrentV I = V CC or GND2.3–2.720µAV CC ≤ (V I , V O ) ≤ 3.6V (Note 6)2.3–2.7±20Symbol ParameterConditionsV CC Min Max Units (V)V IH HIGH Level Input Voltage 1.65 - 2.30.65 × V CCVV IL LOW Level Input Voltage 1.65 - 2.30.35 × V CCV V OH HIGH Level Output Voltage I OH = −100 µA 1.65 - 2.3V CC − 0.2V I OH = −6 mA 1.65 1.25V OL LOW Level Output Voltage I OL = 100 µA 1.65 - 2.30.2V I OL = 6mA 1.650.3I I Input Leakage Current 0 ≤ V I ≤ 3.6V 1.65 - 2.3±5.0µA I OZ 3-STATE Output Leakage 0 ≤ V O ≤ 3.6V 1.65 - 2.3±10µA V I = V IH or V IL I OFF Power Off Leakage Current 0 ≤ (V I , V O ) ≤ 3.6V 010µA I CCQuiescent Supply CurrentV I = V CC or GND1.65 -2.320µAV CC ≤ (V I , V O ) ≤ 3.6V (Note 7)1.65 -2.3±2074VCX16722AC Electrical Characteristics (Note 8)Note 8: For C L = 50 pF, add approximately 300 ps to the AC maximum specification.Note 9: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH-to-LOW (t OSHL ) or LOW-to-HIGH (t OSLH ).AC Electrical Characteristics Over Load (Note 10)Note 10: This parameter is guaranteed by characterization but not tested.Dynamic Switching CharacteristicsSymbol ParameterT A = −40°C to +85°C, C L = 30 pF, R L = 500ΩUnitsV CC = 3.3V ± 0.3V V CC = 2.5 ± 0.2V V CC = 1.8 ± 0.15V Min MaxMin MaxMin Maxf MAX Maximum Clock Frequency 250200100MHz t PHL , t PLH Propagation Delay Clock to Bus 1.3 3.6 1.5 4.6 2.09.2ns t PZL , t PZH Output Enable Time 0.6 3.50.8 4.5 1.59.0ns t PLZ , t PHZ Output Disable Time 0.6 3.20.8 4.2 1.57.6ns t S Setup Time 2.0 2.0 3.0ns t H Hold Time 0.00.00.5ns t W Pulse Width1.51.54.0ns t OSHL Output to Output Skew 0.50.50.75ns t OSLH(Note 9)Symbol ParameterT A = −0°C to +70°C, R L = 500Ω V CC = 3.3V ± 0.3VUnitsC L = 0 pFC L = 50 pFMinMax Min Max t PHL , t PLH Prop Delay Clock to Bus 1.1 2.5 1.9 3.9ns t PZL , t PZH Output Enable Time 0.7 2.4 1.0 3.8ns t PLZ , t PHZ Output Disable Time 0.7 2.11.0 3.5ns t S Setup Time 2.0 2.0ns t H Hold Time 0.00.0ns t WPulse Width1.51.5ns Symbol ParameterConditionsV CC T A = +25°C Units(V)Typical V OLPQuiet Output Dynamic Peak V OLC L = 30 pF, V IH = V CC , V IL = 0V1.80.252.50.6V3.30.8V OLVQuiet Output Dynamic Valley V OLC L = 30 pF, V IH = V CC , V IL = 0V1.8−0.252.5−0.6V3.3−0.8V OHVQuiet Output Dynamic Valley V OHC L = 30 pF, V IH = V CC , V IL = 0V1.8 1.52.5 1.9V3.32.2 674V C X 16722CapacitanceI OUT - V OUT CharacteristicsI OH versus V OHFIGURE 1. Characteristics for Output - Pull Up DriverI OL versus V OLFIGURE 2. Characteristics for Output - Pull Down DriverSymbol ParameterConditionsT A = +25°C Units Typical C IN Input Capacitance V I = 0V or V CC , V CC = 1.8V, 2.5V, or 3.3V, 3.5pF C I/O Input/Output Capacitance V I = 0V, or V CC , V CC = 1.8V, 2.5V or 3.3V5.5pF C PDPower Dissipation CapacitanceV I = 0V or V CC , f = 10 MHz, V CC = 1.8V, 2.5V or 3.3V13pF74VCX16722AC Loading and WaveformsFIGURE 3. AC Test CircuitFIGURE 4. Waveform for Inverting andNon-inverting Functionst r= t f≤ 2.0ns, 10% to 90%FIGURE 5. 3-STATE Output High Enable andDisable Times for Low Voltage Logict r= t f≤ 2.0ns, 10% to 90%FIGURE 6. 3-STATE Output Low Enable and Disable Times for Low Voltage Logict r= t f ≤ 2.0ns, 10% to 90%TEST SWITCHt PLH, t PHL Opent PZL, t PLZ6V at V CC= 3.3 ± 0.3V;V CC x 2 at V CC= 2.5 ± 0.2V; 1.8V to ± 0.15Vt PZH, t PHZ GNDSymbolV CC3.3V ± 0.3V 2.5V ± 0.2V 1.8 ± 0.15VV mi 1.5V V CC/2V CC/2V mo 1.5V V CC/2V CC/2V x V OL+ 0.3V V OL+ 0.15V V OL+ 0.15VV y V OH− 0.3V V OH− 0.15V V OH − 0.15V874V C X 16722 L o w V o l t a g e 22-B i t R e g i s t e r w i t h 3.6V T o l e r a n t I n p u t s a n d O u t p u t sPhysical Dimensions inches (millimeters) unless otherwise noted64-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm WidePackage Number MTD64Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.LIFE SUPPORT POLICYFAIRCHILD ’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:1.Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be rea-sonably expected to result in a significant injury to the user. 2. A critical component in any component of a life support device or system whose failure to perform can be rea-sonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.。

元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 2000, Texas Instruments Incorporated。

1/11February 2003s 3.6V TOLERANT INPUTS AND OUTPUTS sHIGH SPEED :t PD =2.5ns (MAX.)at V CC =3.0to 3.6V t PD =3.0ns (MAX.)at V CC =2.3to 2.7VsPOWER DOWN PROTECTION ON INPUTS AND OUTPUTSsSYMMETRICAL OUTPUT IMPEDANCE:|I OH |=I OL =24mA (MIN)at V CC =3.0V |I OH |=I OL =18mA (MIN)at V CC =2.3V sOPERATING VOLTAGE RANGE:V CC (OPR)=2.3V to 3.6VsPIN AND FUNCTION COMPATIBLE WITH 74SERIES H16244s BUS HOLD PROVIDED ON DATA INPUTS sLATCH-UP PERFORMANCE EXCEEDS 300mA (JESD 17)sESD PERFORMANCE:HBM >2000V (MIL STD 883method 3015);MM >200VDESCRIPTIONThe 74VCXH16244is a low voltage CMOS 16BIT BUS BUFFER (NON INVERTED)fabricated with sub-micron silicon gate and five-layer metal wiring C 2MOS technology.It is ideal for low power and very high speed 2.3to 3.6V applications;it can be interfaced to 3.6V signal environment for both inputs and outputs.Any nG output control governs four BUS BUFFERS.Output Enable input tied together gives full 16-bit operation.When nG is LOW,the outputs are on.When nG is HIGH,the output are in high impedance state.This device is designed to be used with 3state memory address drivers,etc.Bus hold on data inputs is provided in order to eliminate the need for external pull-up or pull-down resistor.All inputs and outputs are equipped with protection circuits against static discharge,giving them 2KV ESD immunity and transient excess voltage.74VCXH16244LOW VOLTAGE CMOS 16-BIT BUS BUFFER (3-STATE INV.)WITH 3.6V TOLERANT INPUTS ANDOUTPUTSORDER CODESPACKAGE TUBET &RTSSOP74VCXH16244TTRPIN CONNECTION74VCXH162442/11INPUT AND OUTPUT EQUIVALENT CIRCUITPIN DESCRIPTIONTRUTH TABLEX :Don‘t CareZ :High ImpedanceIEC LOGIC SYMBOLSPIN No SYMBOL NAME AND FUNCTION 11G Output Enable Input 2,3,5,61Y1to 1Y4Data Outputs 8,9,11,122Y1to 2Y4Data Outputs 13,14,16,173Y1to 3Y4Data Outputs 19,20,22,234Y1to 4Y4Data Outputs244G Output Enable Input 253G Output Enable Input 30,29,27,264A1to 4A4Data Outputs 36,35,33,323A1to 3A4Data Outputs 41,40,38,372A1to 2A4Data Outputs 47,46,44,431A1to 1A4Data Outputs482G Output Enable Input 4,10,15,21,28,34,39,45GND Ground (0V)7,18,31,42V CCPositive Supply VoltageINPUTS OUTPUTG An Yn L L L L H H HXZ74VCXH162443/11ABSOLUTE MAXIMUM RATINGSAbsolute Maximum Ratings are those values beyond which damage to the device may occur.Functional operation under these conditions isnot implied1)I O absolute maximum rating must be observed 2)V O <GND,V O >V CCRECOMMENDED OPERATING CONDITIONS1)V IN from 0.8V to 2V at V CC =3.0VSymbol ParameterValue Unit V CC Supply Voltage -0.5to +4.6V V I DC Input Voltage-0.5to +4.6V V O DC Output Voltage (OFF State)-0.5to +4.6V V O DC Output Voltage (High or Low State)(note 1)-0.5to V CC +0.5V I IK DC Input Diode Current-50mA I OK DC Output Diode Current (note 2)-50mA I ODC Output Current±50mA I CC or I GND DC V CC or Ground Current per Supply Pin±100mA P DPower Dissipation 400mW T stg Storage Temperature -65to +150°C T LLead Temperature (10sec)300°CSymbol ParameterValue Unit V CC Supply Voltage 2.3to 3.6V V I Input Voltage-0.3to 3.6V V O Output Voltage (OFF State)0to 3.6V V O Output Voltage (High or Low State)0to V CC V I OH ,I OL High or Low Level Output Current (V CC =3.0to 3.6V)±24mA I OH ,I OL High or Low Level Output Current (V CC =2.3to 2.7V)±18mA T op Operating Temperature-55to 125°C dt/dvInput Rise and Fall Time (note 1)0to 10ns/V74VCXH162444/11DC SPECIFICATIONS (2.7V <V CC <3.6V unless otherwise specified)SymbolParameterTest ConditionValueUnitV CC (V)-40to 85°C -55to 125°C Min.Max.Min.Max.V IH High Level Input Voltage2.7to3.62.02.0VV IL Low Level Input Voltage0.80.8V OHHigh Level Output Voltage2.7to3.6I O =-100µA V CC -0.2V CC -0.2V2.7I O =-12mA 2.2 2.23.0I O =-18mA 2.4 2.4I O =-24mA 2.22.2V OLLow Level Output Voltage2.7to3.6I O =100µA 0.20.2V 2.7I O =12mA 0.40.43.0I O =18mA 0.40.4I O =24mA 0.550.55I I Input Leakage Current2.7to3.6V I =V CC or GND±5±5µA I I(HOLD)Input Hold Current3.0V I =0.8V 7575µAV I =2V -75-753.6V I =0to 3.6V ±500±500I off Power Off Leakage Current0V I or V O =0to 3.6V 1010µA I OZ High Impedance Output Leakage Current2.7to3.6V I =V IH or V IL V O =0to 3.6V ±10±10µA I CCQuiescent Supply Current2.7to3.6V I =V CC or GND 2020µA V I or V O =V CC to3.6V±20±20∆I CCI CC incr.per Input2.7to3.6V IH =V CC -0.6V750750µA74VCXH162445/11DC SPECIFICATIONS (2.3V <V CC <2.7V unless otherwise specified)DYNAMIC SWITCHING CHARACTERISTICS (T a =25°C,Input t r =t f =2.0ns,C L =30pF ,R L =500Ω)1)Number of outputs defined as "n".Measured with "n-1"outputs switching from HIGH to LOW or LOW to HIGH.The remaining output is measured in the LOW state.2)Number of outputs defined as "n".Measured with "n-1"outputs switching from HIGH to LOW or LOW to HIGH.The remaining output is measured in the HIGH state.3)Parameters guaranteed by design.SymbolParameterTest ConditionValueUnitV CC (V)-40to 85°C -55to 125°C Min.Max.Min.Max.V IH High Level Input Voltage2.3to 2.71.61.6VV IL Low Level Input Voltage0.70.7V OHHigh Level Output Voltage2.3to 2.7I O =-100µA V CC -0.2V CC -0.2V2.3I O =-6mA 2.0 2.0I O =-12mA 1.8 1.8I O =-18mA 1.71.7V OLLow Level Output Voltage2.3to 2.7I O =100µA 0.20.2V 2.3I O =12mA 0.40.4I O =18mA 0.60.6I I Input Leakage Current2.3to 2.7V I =V CC or GND±5±5µA I I(HOLD)Input Hold Current 2.3V I =0.7V 4545µA V I =1.7V -45-45I off Power Off Leakage Current0V I or V O =0to 3.6V 1010µA I OZ High Impedance Output Leakage Current2.3to 2.7V I =V IH or V IL V O =0to 3.6V ±10±10µA I CCQuiescent Supply Current2.3to 2.7V I =V CC or GND 2020µAV I or V O =V CC to3.6V±20±20SymbolParameterTest ConditionValue UnitV CC (V)T A =25°C Min.Typ.Max.V OLP Dynamic Low Voltage Quiet Output (note 1,3)2.5V IL =0V V IH =V CC 0.6V3.30.8V OLV Dynamic Low Voltage Quiet Output (note 1,3)2.5V IL =0V V IH =V CC -0.6V3.3-0.8V OHVDynamic High Voltage Quiet Output (note 2,3)2.5V IL =0V V IH =V CC1.9V 3.32.274VCXH162446/11AC ELECTRICAL CHARACTERISTICS (C L =30pF,R L =500Ω, Input t r =t f =2.0ns )1)Skew is defined as the absolute value of the difference between the actual propagation delay for any two outputs of the same device switch-ing in the same direction,either HIGH or LOW (t OSLH =|t PLHm -t PLHn |,t OSHL =|t PHLm -t PHLn |)2)Parameter guaranteed by designCAPACITIVE CHARACTERISTICS1)C PD is defined as the value of the IC’s internal equivalent capacitance which is calculated from the operating current consumption without load.(Refer to Test Circuit).Average operating current can be obtained by the following equation.I CC(opr)=C PD x V CC x f IN +I CC /16(per circuit)SymbolParameterTest ConditionValueUnitV CC (V)-40to 85°C -55to 125°C Min.Max.Min.Max.t PLH t PHL Propagation Delay Time2.3to 2.7 1.03.0 1.0 3.6ns 3.0to 3.60.8 2.50.8 3.1t PZL t PZH Output Enable Time 2.3to 2.7 1.04.1 1.0 4.8ns 3.0to 3.60.8 3.50.8 4.1t PLZ t PHZOutput Disable Time2.3to 2.7 1.03.8 1.04.5ns 3.0to 3.60.83.50.84.1t OSLH t OSHL Output To OutputSkew Time (note1,2)2.3to 2.70.50.5ns3.0to 3.60.50.5SymbolParameterTest ConditionValue UnitV CC (V)T A =25°C Min.Typ.Max.C IN Input Capacitance 2.5or 3.3V IN =0or V CC 6pF C OUT Output Capacitance2.5or3.3V IN =0or V CC 7pF C PDPower Dissipation Capacitance (note 1)2.5or3.3f IN =10MHz V IN =0or V CC20pF74VCXH162447/11TEST CIRCUITC L =30pF or equivalent (includes jig and probe capacitance)R L =R1=500Ω or equivalentR T =Z OUT of pulse generator (typically 50Ω)WAVEFORM SYMBOL VALUESTESTSWITCH t PLH ,t PHLOpen t PZL ,t PLZ (V CC =3.0to 3.6V)6V t PZL ,t PLZ (V CC =2.3to 2.7V)2V CC t PZH ,t PHZGNDSymbolV CC3.0to3.6V2.3to 2.7VV IH 2.7V V CC V M 1.5V V CC /2V X V OL +0.3V V OL +0.15V V YV OH -0.3VV OH -0.15V74VCXH162448/11WAVEFORM 1:PROPAGATION DELAYS (f=1MHz;50%duty cycle)WAVEFORM 2:OUTPUT ENABLE AND DISABLE TIME (f=1MHz;50%dutycycle)元器件交易网74VCXH16244 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for theconsequences of use of such information nor for any infringement of patents or other rights of third parties which may result fromits use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specificationsmentioned in this publication are subject to change without notice. This publication supersedes and replaces all informationpreviously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices orsystems without express written approval of STMicroelectronics.© The ST logo is a registered trademark of STMicroelectronics© 2003 STMicroelectronics - Printed in Italy - All Rights ReservedSTMicroelectronics GROUP OF COMPANIESAustralia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - MoroccoSingapore - Spain - Sweden - Switzerland - United Kingdom - United States.© 11/11。

元器件交易网IMPORTANT NOTICETexas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductorproduct or service without notice, and advises its customers to obtain the latest version of relevant informationto verify, before placing orders, that the information being relied on is current.TI warrants performance of its semiconductor products and related software to the specifications applicable atthe time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques areutilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of eachdevice is not necessarily performed, except those mandated by government requirements.Certain applications using semiconductor products may involve potential risks of death, personal injury, orsevere property or environmental damage (“Critical Applications”).TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTEDTO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS.Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TIproducts in such applications requires the written approval of an appropriate TI officer. Questions concerningpotential risk applications should be directed to TI through a local SC sales office.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards should be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance, customer product design, software performance, orinfringement of patents or services described herein. Nor does TI warrant or represent that any license, eitherexpress or implied, is granted under any patent right, copyright, mask work right, or other intellectual propertyright of TI covering or relating to any combination, machine, or process in which such semiconductor productsor services might be or are used.Copyright © 1996, Texas Instruments Incorporated。