空调的温度控制系统的设计
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毕业设计(论文)
题目:空调的温度控制系统的设计
专业名称 机电一体化技术
学生姓名
指导教师
毕业时间 2015年6月
摘 要
空调的温度控制单元应用了单片机技术,用于实现温度自动控制,现场温度经温度传感器采样后,变换为模拟电压信号,经低通滤波滤掉干扰信号后送给放大器,信号放大后送到A/D转换器转换为数字信号送单片机,单片机将给定的温度与测量温度的相比较,得出偏差量,执行器由开关频率较高的固态继电器开关担任,采用模拟的PWM控制方法,改变同一个周期中电子开关的闭合时间,完成温度的控制。实现以单片机为控制中心,以空调机为执行器件,通过单片机程序来完成对室内温度的自动控制。
关键词:单片机,传感器,自动控制
Abstract: Air conditioning's temperature control unit has applied the monolithic integrated
circuit technology, uses in realizes the temperature automatic control, the scene temperature after
the temperature sensor sampling, transforms for the analogue voltage signal, filters out the
unwanted signal after the low-pass filtering gives the amplifier, after the signal enlarges, delivers
A/D switch to transform for the digital signal delivers the monolithic integrated circuit, the
temperature which and the survey temperature the monolithic integrated circuit will assign
compares, obtains the extent of the error, the actuator by the turn-on frequency high solid state
relay switch holds the post, uses the simulation the PWM control method, the change identical
cycle neutron switch's closing time, completes the temperature the control. Realizes take the
monolithic integrated circuit as the control center, as carries out the component take the air
conditioner, completes through the monolithic integrated circuit procedure to the indoor
temperature automatic control.
Keywords:Monolithic integrated circuit, sensor, automatic control
目 录
引言
1 总体方案设计和选择....................................................................................................................................... 1
1.1 方案一 ................................................................................................................................................. 1
1.2 方案二 ................................................................................................................................................. 1
1.3 总体方案设计和选择 .......................................................................................................................... 1
1.4单片机 .................................................................................................................................................... 2
2 DS18B20温度传感器 .................................................................................................................................... 4
2.1 DS18B20的工作原理 ......................................................................................................................... 4
2.2 DS18B20的测温原理 ......................................................................................................................... 5
2.2.1 DS18B20的测温原理 .............................................................................................................. 5
2.2.2 DS18B20的测温流程 .............................................................................................................. 6
3 单片机接口设计 .............................................................................................................................................. 7
3.1 设计原则 ............................................................................................................................................. 7
3.2 引脚连接 ............................................................................................................................................. 7
3.2.1 晶振电路................................................................................................................................... 7
3.2.2 串口引脚................................................................................................................................... 7
3.2.3 其它引脚................................................................................................................................... 7
4 系统整体设计................................................................................................................................... 8
4.1 系统硬件电路设计 .............................................................................................................................. 8
4.1.1 主板电路设计 ........................................................................................................................... 8
4.1.2 各部分电路 ............................................................................................................................... 8
4.2 系统软件设计.................................................................................................................................... 11
4.2.1 系统软件设计整体思路 ......................................................................................................... 11