MB05F-MB10FMBF贴片塑封玻璃钝化桥式整流

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X·T ELECTRONICS 信展通电子 MB05F-MB10F

MBF贴片塑封玻璃钝化桥式整流

0.5A SURFACE MOUNT GALSS PASSIVATED BRIDGE RECTIFIER

特征Features

z 玻璃钝化晶片Glass Passivated Die Construction

z 正向浪涌承受能力强High Forward surge capability z 低正向压降Low Forward Voltage Drop z 高温焊接保证High temperature soldering guaranteed: 260℃/10秒 z 引线和管体皆符合RoHS标准Lead and body according with Rohs standard 机械数据Mechanical Data MBF z 封装: MBF封装MBF small outline plastic package z 极性: 按极性激光印字与脚位As Marked on Case z 环氧树脂UL易燃等级Epoxy UL: 94V-0 z 安装位置: 任意Mounting Position: Any 极限值和温度特性(TA = 25℃ 除非另有规定) Maximum Ratings & Thermal Characteristics (Ratings at 25℃ ambient temperature unless otherwise specified.) 参数

Parameters 符号

Symbol

MB05F

MB1F

MB2F

MB4F

MB6F MB8F MB10F单

Unit最大可重复峰值反向电压

Maximum repetitive peak reverse

voltage

V

RRM

50 100 200 400 600 800 1000 V 最大均方根电压

Maximum RMS voltage V

RMS 35 70 140 280 420 560 700 V 最大直流阻断电压

Maximum DC blocking voltage V

DC 50 100 200 400 600 800 1000 V 最大正向平均整流电流

Average Rectified Output Current @Ta=40

Average Rectified Output Current @Ta=40

I

o

0.5

0.8 A 正向不重复浪涌电流8.3ms单一正弦半波

Non-repetitive Peak forward surge

current 8.3 ms single half sine-wave

(JEDEC Method)

I

FSM 30 A I2t Rating for Fusing(t<8.3ms) I2t 5.0 A2s典型热阻

Typical thermal resistance

R

θ

JA 60

℃/W工作结温和存储温度Operation junction

and Storage temperature range Tj,T

STG-55-+150 ℃ Note: 1, Mounted on glass epoxy PC board with 1.3mm2 solder pad; 2, Mounted on aluminum substrate PC board with 1.3mm2 solder pad. 电特性(TA = 25℃ 除非另有规定) Electrical Characteristics (Ratings at 25℃ ambient temperature unless otherwise specified.) 参数

Parameters 符号

Symbol

MB05F

MB1F

MB2F

MB4F

MB6F MB8F MB10F单

Unit最大正向电压 @IF=0.5A

Max. forward voltage VF 1.0 V 最大反向电流@VDC TA=25℃

Max.

reverse

current TA=

125

IR 5

500 uA典型结电容 VR=4.0V, f=1MHz

Type junction capacitance Cj 13 pF Note 1

Note 2 信展通电子X·T ELECTRONICS MB05F-MB10F

特性曲线Characteristic Curves

信展通电子X·T ELECTRONICS MB05F-MB10F

MBF PACKAGE OUTLINE Plastic surface mounted package