ContentsDisplay DriverMemoryComputerAnalogVideoMiscellaneousMCU Programming ToolsThe following gives details behind the range of programming equipment available to program the full range of Holtek Microcontroller based devices.HT-IDE3000Development EnvironmentThe HT-IDE3000is a fully integrated development system designed around the Holtek range of microcontrollers.Working in conjunction with the HT-ICE hardware emulator,the HT-IDE3000system provides a user friendly workbench to ease the process of application program development,by integrating all of the software tools,such as editor,cross assembler,linker,library and symbolic debuggers.More detailed information on the HT-IDE3000development system is contained within the HT-IDE3000 User¢s Guide.Installed in conjunction with the HT-IDE3000and to ensure that the development system contains information on new microcontrollers and software updates,Holtek provides regular HT-IDE3000Service Packs.These Service Packs do not replace the HT-IDE3000but are installed after the HT-IDE3000system software has been installed.HT-ICE¾Holtek In-Circuit EmulatorDeveloped alongside the Holtek8-bit microcontroller device range,the Holtek ICE is a fully functional in-circuit emulator for Holtek's8-bit microcontroller devices.Incorporated within the system are a comprehensive set of hardware and software tools for rapid and easy development of user applications.Central to the system is the in-circuit hardware emulator,capable of emulat-ing all of Holtek's8-bit devices in real-time,while also providing a range of powerful debugging and trace facilities.Regarding software functions,the system incorporates a user-friendly windows based workbench which integrates together functions such as program editor,cross assembler,linker and library manager.In addition,the system is capable of running in software simula-tion mode without connection to the HT-ICE hardware.HT-ICE Interface CardThe interface cards supplied with the HT-ICE can be used for most applications,however,it is possible for the user to omit the supplied interface card and design their own interface card.By including the necessary interface circuitry on their own interface card,the user has a means of directly connecting their target boards to the CN1and CN2connectors of the HT-ICE.The following list gives the information to enable the correct flat cable connection between the range of microcontroller packages and the appropriate interface card and socket.Please note that the Interface Card accompanying each HT-ICE model is packed with other accessories in the same HT-ICE ers need not purchase extra Interface Cards.OTP/MTP ProgrammerThe Holtek OTP programmer is supplied to enable efficient programming of OTP devices for engineering or low to medium vol-ume production.In the other hand,the HT-Writer is able to run either by connecting to the PC through its RS-232serial port or to operate stand alone without connecting to PC.More detailed information is contained within the HT-Writer User¢s Guide.Please note if the device to be programmed does not fit the on board Textool,an extra Adapter Card is needed to accommodate the de-vice package form.Related information is listed as follows.There are other kinds of OTP programmers,including partial-lock programmer and two-chips-in-one programmer,which support the MCU with partial lock function and two chips in one package respectively.Also,an MTP programmer provides the MTP de-vice¢s programming functions.The detailed information is contained within HT-MTPWriter User¢s Guide.MTP Starter KitA comprehensive single-pack development kit containing all the required hardware and software development tools to get you up and running with the Holtek series of MTP microcontrollers in as quick a time as possible.HT-ICE USB CableFor product development convenience of users whose computer is equipped with USB port and has no LPT port available, Holtek has released an exclusive HT-ICE USB cable allowing customers to connect from the computer's USB port and the HT-ICE¢s LPT connector.OTP Adapter CardThe Holtek OTP programmers are supplied with a standard Textool chip socket.The OTP Adapter Card is used to connect the Holtek OTP programmers to the various sizes of available OTP chip packages that are unable to use this supplied socket.The following table will enable the user to select the required adapter card for their various applications.MCU Tools Indexing TableBy referring to the applicable Holtek MCU part number this table provides users with a means to quickly locate the relevant de-velopment tools and OTP programming tools required.In instances where tools are not listed for specific devices,this infers that such tools are not required.In the following indexing tables,the part number of the OTP writer is COTPWRITER00A.The HT-ICE,with part number begin-ning with²C²,has an integrated OTP writer on board,it is not required to obtain an extra OTP writer.Other HT-ICE,with part number beginning with²T²,does not have an integrated OTP writer,it requires a separate OTP writer for programming.Holtek Semiconductor assumes no responsibility for errors or omissions in this Selection Guide. THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESSED OR IMPLIED. Holtek further does not warrant the accuracy and indirect, incidental or consequential damages, including without limitation, lost revenues or lost profits, which may result from use of these materials. Holtek's products are not authorized for use as critical components in life support devices or systems. Holtek may make changes to these materials, or to the products described therein, at any time without notice. Holtek makes no commitment to update the information contained Holtek Semiconductor Inc. (Headquarters)No.3, Creation Rd. II, Science Park, Hsinchu, TaiwanTel: 886-3-563-1999Fax: 886-3-563-1189Holtek Semiconductorn Inc. (Taipei Sales Office)4F-2, No. 3-2, YuanQu St., Nankang Software Park, Taipei 115, TaiwanTel: 886-2-2655-7070Fax: 886-2-2655-7373Fax: 886-2-2655-7383 (International sales hot l ine) Holtek Semiconductor Inc. (Shenzhen Sales Office)43F, SEG Plaza, Shen Nan Zhong Road, Shenzhen, China 518031Tel: 0755-8346-5589Fax: 0755-8346-5590Holtek Semiconductor Inc . (Shanghai Sales Office)7th Floor, Building 2, No.889, Yi Shan Road, Shanghai, China 200233Tel: 021-6485-5560Fax: 021-6485-0313 Holtek Semiconductor Inc. (Beijing Sales Office)Suite 1721, Jinyu Tower, A129 West Xuan Wu Men Street, Xicheng District, Beijing, China 100031Tel: 010-6641-0030, 6641-7751, 6641-7752Fax: 010-6641-0125herein. For the most up-to-date information, Please visit our web site at Holmate Semiconductor, Inc. (North America Sales Office)46712 Fremont Blvd., Fremont, CA 94538Tel: 510-252-9880Fax: 510-252-9885。
The mark shows major revised points.©1991, 1996Document No. S11431EJ3V0DS00 (3rd edition)Date Published December 1997 N CP(K)Printed in Japan2BLOCK DIAGRAMSSICSO VSSIHDF HDOHKO SGND HSOF1HSOF2HSOF3AFCF SV CC BGPE NHSO CPO FIO VSO N/P SCOCV CC1TINTCINACCFCKOCKFCOUT APCF CGND SCOF1SCOF2SCOF3CV CC2CV CC3VCOO DIVS ESCIRemark AFC :Automatic Frequency ControlACC :Automatic Color saturation level Control APC :Automatic Phase ControlSelecting divide ratio by DIVS pinSelecting TV transmission by N/P pinDIVS Divide ratioN/P pinTV transmissionH 1/8H PAL Open EXT IN with pin 18LNTSCL1/4In PAL, only correspond 4f SC (DIVS = L).System Block DiagramApplication to Process of Digital Video SignalAnalog34PIN CONFIGURATION (Top View)36-pin plastic shrink SOP (300 mil)SSI CSO VSSI HDF HDO HKO SGND HSOF1HSOF2HSOF3AFCF SV CC BGPE NHSO CPO FIO VSO N/PCV CV CVACCF:Chroma ACC FilterAFCF:Horizontal Sync AFC FilterAPCF:Chroma APC FilterBGPE:Burst Gate Pulse from ExternalCGND:Chroma GNDCIN:Chroma InputCKF:Color Killer FilterCKO:Color Killer OutputCOUT:Chroma OutputCPO:Clamp Pulse OutputCSO:Composite Sync OutputCV CC1-CV CC3:Chroma V CCDIVS:Divider Setting InputESCI:External Subcarrier InputFIO:Field ID OutputHDF:Horizontal Sync Detect FilterHDO:Horizontal Sync Detect OutputHKO:Horizontal Sync Killer OutputHSOF1-HSOF3:32f H VCO FilterNHSO:Negative Horizontal Sync OutputN/P:NTSC/PAL Mode SelectSCO:Subcarrier OutputSCOF1-SCOF3:f SC VCO FilterSGND:Sync GNDSSI:Horizontal Sync Separation InputSV CC:Sync V CCTINT:Tint ControlVCOO:VCO OutputVSO:Vertical Sync OutputVSSI:Vertical Sync Separation Input5PIN FUNCTIONS(1/12)6Note Chroma burst amplitude from pin 4: 150 mV p-p7Note Chroma burst amplitude from pin 4: 150 mV p-p 8Note Chroma burst amplitude from pin 4: 150 mV p-p910Note When only 0.3 V p-p sync signal is input to pin 36Note When only 0.3 V p-p sync signal is input to pin 36ELECTRICAL SPECIFICATIONSABSOLUTE MAXIMUM RATINGS (T A = 25 °C, unless otherwise specified)Parameter Symbol Ratings UnitSupply voltage V CC7VInput signal voltage (Chroma signal)e i43V p-pInput signal voltage (H sync separation)e i363V p-pInput signal voltage (V sync separation)e i343V p-pInput signal voltage (EXT)e i18V CC V p-pTint control signal voltage e c3V CC V Output current I O–7mAPermissible package power dissipation P D570 (T A = 75°C)mW (when mounted on PCB)Operating ambient temperature T A–10 to +75°C Storage temperature T stg–40 to +125°CCaution Expose to Absolute Maximum Rating for extended periods may affect device reliability; exceeding the ratings could cause permanent damage. The parameters apply independently.The device should be operated within the limits specified under DC and AC Characteristics.RECOMMENDED OPERATING CONDITIONSParameter Symbol MIN.TYP.MAX.Unit Supply voltage V CC 4.5 5.0 5.5VInput signal voltage (Chroma signal)e i4150mV p-p Input signal voltage (H sync separation)e i36 1.0V p-pInput signal voltage (V sync separation)e i34 1.0V p-pInput signal voltage (EXT IN HIGH voltage)e iH18 2.0VInput signal voltage (EXT IN LOW voltage)e iL180.8V Divider selector voltage 1 (1/8)V17 (8) 4.8V Divider selector voltage 2 (1/4)V17 (4)0.2VTint control voltage V3 2.5VNTSC/PAL select voltage (PAL)V19P 4.5VNTSC/PAL select voltage (NTSC)V19N0.5VELECTRICAL CHARACTERISTICS (at T A = 25±3 °C, RH ≤ 70 %, V CC = 5 V, unless otherwise specified)Chroma sectionParameter Symbol Condition MIN.TYP.MAX.UnitSupply current I CC (C)V CC (C) = 5 V172125mAof chroma section No current on pin 2, 14 and 15ACC amplitude ACC1Fluctuation of chroma output level at +6 dB–2.00+2.0dB characteristic 1change of chroma input burst signal(0 dB = 150 mV p-p)ACC amplitude ACC2Fluctuation of chroma output level at –20 dB–5.0–1.0+1.0dB characteristic 2change of chroma input burst signal(0 dB = 150 mV p-p)Color killer set point e KS Input level at killer ON with chroma input burst–45–39–33dBsig. (0 dB = 150 mV p-p) being attenuatedColor residual of color killer e KR Residual level of chroma output in Killer ON--15mV p-pstate when chroma input burst signal of150 mV p-p is inputChroma output level E COUT Chroma output level when chroma input burst 1.1 1.3 1.5V p-psignal of 150 mV p-p is inputColor killer output E CKOH (1)High level of color killer output at color killer 2.7 3.5-V High level (1)OFFI OH = –400 µAColor killer output E CKOH (2)High level of color killer output at color killer 3.5 4.0-V High level (2)OFFI OH = –20 µAColor killer output E CKOL Low level of color killer output at color killer ON-0.20.4V Low level I OL = +2 mAAPC lock-in range f P Frequency pulled by APC with chroma input±400±600-Hzburst frequency changed (f SC conversion)VCO control sensitivityβP Rate of variation of frequency when APC filter8.010.012.0Hz/mVpin is changed from –0.025 V to +0.025 V(f SC conversion)Phase variable rangeθCONT Amount of phase shift when voltage of phase±40±55-degcontrol pin is set at 2.5 V + 1 VVCO output level e VCOO VCO output level when chroma input burst 1.0 1.3 1.6V p-psignal of 150 mV p-p is inputf SC output level e SCO f SCO output level when chroma input burst210300390mV p-psignal of 150 mV p-p is inputDivider select voltage VDIVSL1/4 freq. division if V DIVS < V DIVSL--0.5VV DIVSH EXT IN with V DIVS : OPEN4.5--V 1/8 freq. division if V DIVSH < V DIVSNTSC/PAL select voltage V N/PT f V = 60 Hz if V N/P < V N/PT 1.7 2.0 2.3Vf V = 50 Hz if V N/PT < V N/PSync sectionParameter Symbol Condition MIN.TYP.MAX.UnitSupply current I CC (1)V CC (1) = 5 V121518mA of Sync section No current on pin 25DC level of H sync V SSI Voltage of pin 36 when connected to GND via 1.9 2.2 2.5V separation input10 kΩ resistorDC level of V sync V VSSI Voltage of pin 34 when connected to GND via 1.9 2.2 2.5V separation input10 kΩ resistorSync separation output E CSOH1High level of sync separation output when only 2.7 3.8-V High level (1)0.3 V p-p sync signal is input to pin 36I OH = –400 µASync separation output E CSOH2High level of sync separation output when only 3.5 4.3-V High level (2)0.3 V p-p sync signal is input to pin 36I OH = –20 µASync separation output E CSOL Low level of sync separation output when only-0.10.4V Low level0.3 V p-p sync signal is input to pin 36I OL = +2 mAHD output E NHSOH1High level of synchronized HD output when 2.7 3.8-V High level (1)only 0.3 V p-p sync signal is input to pin 36I OH = –400 µAHD output E NHSOH2High level of synchronized HD output when 3.5 4.3-V High level (2)only 0.3 V p-p sync signal is input to pin 36I OH = –20 µAHD output E NHSOL High level of synchronized HD output when-0.10.4V Low level only 0.3 V p-p sync signal is input to pin 36I OL = +2 mAVD output E VSOH1High level of synchronized VD output when 2.7 3.8-V High level (1)only 0.3 V p-p sync signal is input to pin 36I OH = –400 µAVD output E VSOH2High level of synchronized VD output when 3.5 4.3-V High level (2)only 0.3 V p-p sync signal is input to pin 36I OH = –20µAVD output E VSOL High level of synchronized VD output when-0.10.4V Low level only 0.3 V p-p sync signal is input to pin 36I OL = +2 mAClamp output E CPOH1High level of synchronized Clamp output when 2.7 3.8-V High level (1)only 0.3 V p-p sync signal is input to pin 36I OH = –400 µAClamp output E CPOH2High level of synchronized Clamp output when 3.5 4.3-V High level (2)only 0.3 V p-p sync signal is input to pin 36I OH = –20 µAClamp output E CPOL High level of synchronized Clamp output when-0.10.4V Low level only 0.3 V p-p sync signal is input to pin 36I OL= +2 mAParameter Symbol Condition MIN.TYP.MAX.UnitField ident. output E FIOH1High level of synchronized Field ident. output 2.7 3.8-V High level (1)when only 0.3 V p-p sync signal is input to pin 36I OH = –400 µAField ident. output E FIOH2High level of synchronized Field ident. output 3.5 4.3-V High level (2)when only 0.3 V p-p sync signal is input to pin 36I OH = –20 µAField idnet. output E FIOL High level of synchronized Field ident. output-0.10.4V Low level when only 0.3 V p-p sync signal is input to pin 36I OL = +2 mAH detection output E FIOH1High level of asynchronized H detect output 2.7 3.8-V High level (1)without H sync inputI OH = –400 µAH detection output E FIOH2High level of asynchronized H detect output 3.5 4.3-V High level (2)without H sync inputI OH = –20 µAH detection output E FIOL High level of synchronized H detect output-0.10.4V Low level when only 0.3 V p-p sync signal is input to pin 36I OL= +2 mAH sync lock-in range f HP Frequency range that can be pulled when only±400±500-Hz0.3 V p-p sync signal is input to pin 36 and Hsync frequency is varied (f SC conversion)Horizontal VCO controlβH Rate of variation of frequency when APC filter–1.6–1.3–0.9Hz/mV sensitivity pin is changed form 3.0 V to 3.4 V without Hsync input (f SC conversion)Horizontal VCO free-run f HO Frequency difference of HD output from f H–100–25+50Hz frequency when H sync input is not appliedPulse width of HD output P WNHSO Pulse width of synchronized HD output when 3.8 4.0 4.2µsonly 0.3 V p-p sync signal is input to pin 36Pulse width of VD output P WVSO1Pulse width of synchronized VD ODD- 6.0-H NoteP WVSO2output when only 0.3 V p-p syncEVEN- 5.5-H Note signal is input to pin 36Pulse width of Clamp output P WCPO Pulse width of synchronized Clamp output when 3.4 3.6 3.8µsonly 0.3 V p-p sync signal is input to pin 36Oscillation start voltage of V ST Output voltage at HD when V CC is gradually-- 4.2V horizontal VCO increased from 0 V without H sync inputH killer output Low level E HKOL Low level of synchronized H killer output when--0.4Vonly 0.3 V p-p sync signal is input to pin 36Change value of Chroma outputBurst gate input V BGPE1Burst gate pulse input voltage when Clamp 1.6 1.9 2.0V Threshold level 1voltage begins Low level is gradually increasedfrom 0 V without signal inputNote H: Horizontal scanning period21Parameter Symbol Condition MIN.TYP.MAX.UnitBurst gate input V BGPE2Burst gate pulse input voltage when Clamp 3.8 4.0 4.2V Threshold level 2voltage begins High level is graduallyincreased from V BGPE1 without signal inputVertical free-running f V1 (50)Frequency ratio of HD output to VD output-f H/352-Hz frequency 1H sync input: No signalf V1 (60)Pin 33 input: V CC-f H/288-HzV sync input: V CCVertical free-running f V2 (50)Same as f V1 with the following exception-f H/288-Hz frequency 2f V2 (60)V sync input: GND-f H/240-Hz Vertical free-running f V3 (50)Same as f V1 with the following exception-f H/368-Hz frequency 3f V3 (60)Pin 33 input: GND-f H/296-Hz Vertical free-running f V4 (50)Same as f V1 with the following exception-f H/272-Hzfrequency 4f V4 (60)Pin 33 input: GND-f H/232-Hz V sync input: GND22TIMING CHARTS (Horizontal Period)Comp VideoInputComp SyncOutput(CSO)HD Output(NHSO)CLAMPOutput(CPO)23CAUTION AT DESIGNINGResonatorsNEC evaluates µPC1862 using resonators which are shown below in design and development process.If the different product is used as a resonator, electrical specification value described in this document is not assured.And when connecting resonator to external circuit, there is need to consider temperature specification, voltage fluctuation and product variation. In this case, normal operation is not assured in the application circuit including the different product.Use the resonators which are shown below when you design circuit.32 f H VCO resonator X1:in application example circuitX1(PAL):CSB500F2 (MURATA)(NTSC):CSB503F2 (MURATA)nf SC VCO resonator X2X2:HC-49/U (KINSEKI, µPC1860 adoption)Reference data of 4f SC, 8f SC VCO resonator (KINSEKI)Item NTSC for 4f SC NTSC for 8f SC PAL for 4f SCName HC-49/UFrequency14.31818 MHz28.63636 MHz17.34475 MHzOvertone Order Fundamental (AT cut)Fundamental (BT cut)Fundamental (AT cut)Operating Temperature–10 to +70°CFrequency Permitted±30 × 10–6±50 × 10–6±30 × 10–6 Tolerance (25±5°C)Frequency Temperature±30 × 10–6±100 × 10–6±30 × 10–6 Specification (to 25°C)Equivalent Serial Resistance50 Ω or lessParallel Capacitance7.0 pF or less3rd harmonic standard3rd harmonic frequency is over–3rd harmonic frequency is over3f O (42.95454 MHz) + 7.5 kHz3f O (53.203425 MHz) + 7.5 kHz25Recommended patternThe µPC1862 generates system clock for synchronous signal processing and clock generate processing.If the supply voltage, line placement and routing are not set appropriately that the µPC1862 cannot generate correct system clock.Though the recommended pattern is not shows in this document, note points shown below at designing.1.For synchronous section and chroma section, each power supply must be isolated.2.Lines to pin 9 to pin 13 should be as thick and short as possible.3.Connect resonator as near IC as possible. Don’t put GND line between resonator pins for parasitism capacitance. 2628Care Point for Planning of Application Circuit 1.Processing of V CC pinPlease isolate Chroma. V CC from Sync. V CC as follows. If you have external processing block of digital signal, don’t directly supply of the block’s V DD .2.Application of no using Chroma pinIf you don’t use Chroma pin but use Sync pin on µPC1862, you process pin 1 to pin 18 as follows.3.Application of no using Sync pinIf you don’t use Sync pin but use Chroma pin on µPC1862, you process pin 19 to pin 36 as follows. In this case, you need to input a pin 24 with burst gate pulse from external.In this application, you can’t use output of pin 20 to pin 23.F0.01 F µµinput29PACKAGE DRAWING36 PIN PLASTIC SHRINK SOP (300 mil)detail of lead end5°±5P36GM-80-300B-3ITEM MILLIMETERS INCHES A B C D E F G H I J K 15.54 MAX.0.8 (T.P.)1.8 MAX.1.557.7±0.30.97 MAX.0.612 MAX.0.005±0.0030.071 MAX.0.303±0.0120.2200.039 MAX.NOTEL M 0.100.6±0.21.15.60.0040.024+0.008–0.009Each lead centerline is located within 0.10mm (0.004 inch) of its true position (T .P.) at maximum material condition.0.0430.0610.031 (T.P.)0.20+0.10–0.050.008+0.004–0.002N0.100.0040.014+0.004–0.0030.350.125±0.075+0.10–0.05RECOMMENDED SOLDERING CONDITIONSWhen soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering processes are used, or if the soldering is performed under different conditions, please make sure to consult with our sales offices.For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”(C10535E).Surface Mount DeviceµPC1862GS: 36-pin plastic shrink SOP (300 mil)Process Conditions SymbolInfrared ray reflow Peak temperature: 235 °C or below (Package surface temperature),IR35-00-2Reflow time: 30 seconds or less (at 210 °C or higher),Maximum number of reflow processes: 2 times.VPS Peak temperature: 215 °C or below (Package surface temperature),VP15-00-2Reflow time: 40 seconds or less (at 200 °C or higher),Maximum number of reflow processes: 2 times.Wave Soldering Solder temperature: 260 °C or below, Flow time: 10 seconds or less,WS60-00-1Maximum number of flow process: 1 time,Pre-heating temperature: 120 °C or below (Package surface temperature).Partial heating method Pin temperature: 300 °C or below,–Heat time: 3 seconds or less (Per each side of the device).Caution Apply only one kind of soldering condition to a device, except for “Partial heating method”, or the device will be damaged by heat stress.30[MEMO]31[MEMO]The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document.NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from useof such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others.While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features.NEC devices are classified into the following three quality grades:"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications ofa device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application.Standard:Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronicequipment and industrial robotsSpecial:Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designedfor life support)Specific:Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc.The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance.Anti-radioactive design is not implemented in this product.M4 96.5。
