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TRSL-8105BWG中文资料

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Optoway TRSL-8105WG**********************************************************************************************************************************************************************************************************************************************************************************************************************************************OPTOWAY TECHNOLOGY INC. No .38, Kuang Fu S. Road, Hu Kou, Hsin Chu Industrial Park, Hsin Chu, Taiwan 303Tel: 886-3-5979798 Fax: 886-3-59797371TRSL-8105WG / TRSL-8105BWG / TRSL-8105AWG (RoHS Compliant)3.3V / 1310 nm /4.25 Gbps Digital Diagnostic LC SFP SINGLE-MODE TRANSCEIVER ***********************************************************************************************************************************************************************FEATURESl Up to 4.25 Gbps Bi-directional Data Links l Duplex LC Single Mode Transceiverl Fibre Channel FC-PI 400/200/100-SM-LC-L Compliant l IEEE 802.3z 1000BASE-LX Compliantl Small Form-Factor, RJ-45 size, 2×7 pin Package l SFF-8472 Digital Diagnostic Function l 1310 nm LD Transmitterl AC/AC Coupling according to MSAl Up to 10 km at 1.063/2.125 Gbps, 5 km at 4.25 Gb/s l LVTTL Transmitter Disable Input l LVTTL Signal Detect Output l Single +3.3 V Power Supply l RoHS Compliantl 0 to 70o C Operating : TRSL-8105WG l -10 to 85o C Operating : TRSL-8105BWG l -40 to 85o C Operating : TRSL-8105AWGl Class 1 Laser International Safety Standard IEC-60825 CompliantAPPLICATIONSl Tri-rate 1.063/2.125/4.25 Gb/s Fibre Channel l 1.25 Gb/s 1000 BASE-LX EthernetDESCRIPTIONThe TRSL-8105WG series single mode transceiver is small form factor, low power, high performance module for bi-directional serial optical data communications such as 4x/2x/1x Fibre Channel and 1000BASE-LX Ethernet. This 2×7 pin SFF transceiver comply with the 2×5 standard package defined by the SFF MSA with the exception of four extra pins for real-time digital diagnostics and transmitter fault indication. Digital diagnostic functions are available via the 2-wire serial interface defined in the SFF-8472 MSA. This module is designed for single mode fiber and operates at a nominal wavelength of 1310 nm. The transmitter section uses a 1310 nm multiple quantum well laser and is a class 1 laser compliant according to International Safety Standard IEC-60825. The receiver section uses an integrated InGaAs detector preamplifier (IDP) mounted in an optical header and a limiting post-amplifier IC.LASER SAFETYThis single mode transceiver is a Class 1 laser product. It complies with IEC-60825 and FDA 21 CFR 1040.10 and 1040.11. The transceiver must be operated within the specified temperature and voltage limits. The optical ports of the module shall be terminated with an optical connector or with a dust plug.ORDER INFORMATIONP/No. Bit Rate (Gb/s) FC-PI Distance (km) Wavelength (nm) PackageTemp. (o C)TX Power (dBm) RX Sens. (dBm) RoHS Compliant TRSL-8105WG 4 / 2 / 1 400/200/100 5/10* 1310 2×7 LC with DMI 0 to 70 -3 to -8 -18 Yes TRSL-8105BWG 4 / 2 / 1 400/200/100 5/10* 1310 2×7 LC with DMI -10 to 85 -3 to -8 -18 Yes TRSL-8105AWG4 / 2 / 1400/200/1005/10*13102×7 LC with DMI -40 to 85-3 to -8-18Yes*: 10km at 1.063/2.125/1.25 Gb/s and 5 km at 4.25Gb/s.Absolute Maximum RatingsParameterSymbol Min Max Units NotesStorage Temperature Tstg -40 85 o COperating Temperature Topr 0 -10 -40 70 85 85 oCTRSL-8105WG TRSL-8105BWG TRSL-8105AWG Power Supply VoltageVcc-0.53.6VRecommended Operating ConditionsParameterSymbol Min Typ Max Units / NotesPower Supply Voltage Vcc 3.13 3.3 3.47 VOperating Temperature Topr 0 -10 -40 70 85 85 oC / TRSL-8105WG oC / TRSL-8105BWG oC / TRSL-8105BWGPower Supply Current I CC (TX+RX)200 250 mA Data Rate1.06254.25Gb/s**********************************************************************************************************************************************************************OPTOWAY TECHNOLOGY INC. No .38, Kuang Fu S. Road, Hu Kou, Hsin Chu Industrial Park, Hsin Chu, Taiwan 303Transmitter Specifications (0o C < Topr < 70o C, 3.13V < Vcc < 3.47V)ParameterSymbolMinTypMaxUnits Notes OpticalOptical Transmit Power Po -8 --- -3 dBm 1 Optical ModulationAmplitude@4.25Gb/s OMA 290 --- ---µWOutput Center Wavelength λ 1280 1310 1350 nmOutput Spectrum Width ∆λ --- 2 nm RMS (σ)Optical Rise / Fall Time(4.25Gb/s)t r / t f 90ps 20 % to 80%,unfiltered Relative Intensity Noise RIN -118 dB/HzElectricalData Input Current – Low I IL -350 µA Data Input Current – High I IH 350 µADifferential Input Voltage V IH - V IL 0.5 2.4 V Peak-to-PeakTX Disable Input Voltage – Low T DIS, L 0 0.5 V 2 TX Disable Input Voltage – High T DIS, H 2.0 Vcc V 2 TX Disable Assert Time T ASSERT 10 µs TX Disable Deassert Time T DEASSERT 1 ms TX Fault Output Voltage -- Low T FaultL 0 0.5 V 3 TX Fault Output Voltage -- High T FaultH 2.0 Vcc+0.3 V31. Output power is power coupled into a 9/125 µm single mode fiber.2. There is an internal 4.7K to 10K ohm pull-up resistor to VccTX.3. Open collector compatible,4.7K to 10K ohm pull-up to Vcc (Host Supply Voltage).Receiver Specifications (0o C < Topr < 70o C, 3.13V < Vcc < 3.47V)ParameterSymbol Min Typ Max Units NotesOpticalSensitivity @4.25Gb/sSens129 -18 µW dBm 4 5 Maximum Input Power Pin 0 dBmSignal Detect -- Asserted Pa --- -18 dBm Transition: low to high Signal Detect -- Deasserted Pd -30 --- --- dBm Transition: high to low Signal detect -- Hysteresis 1.0 --- dBWavelength of Operation 1260 --- 1600nmElectricalDifferential Output Voltage V OH – V OL 0.6 2.0 V Output LOS Voltage -- Low V OL 0 0.5 V 6 Output LOS Voltage -- High V OH 2.0 Vcc+0.3 V 6 4. Measured at PRBS 27-1 at BER 1E-12.5. Represents sensitivity based on OMA spec, as corrected to incoming Extinction Ratio of 9 dB. For example, an OMA of 29 µW is approximately equal to an average power of -17.3 dBm, average with an Extinction ratio of 9 dB.6. Open collector compatible, 4.7K to 10K ohm pull-up to Vcc (Host Supply Voltage).CONNECTION DIAGRAMPIN Signal Name Description PIN Signal Name DescriptionC N/C Not ConnectedD TX_Fault Transmitter Fault IndicationA SDA Data line of two wire serial interfaceB SCL Clock line of two wire serial interface1 VeeRx Rreceiver ground 10 TD- Transmitter Data In Bar2 VccRx Receiver Power – 3.3V±5% 9 TD+ Transmitter Data In3 SD Signal Detect Output 8 TX_Disable Logic low to enable TXoutput4 RD- Receiver Data Out Bar 7 VeeTx Transmitter ground5 RD+ Receiver Data Out6 VccTx Transmitter Power – 3.3V±5%MS MSMounting Studs. Connect to ChassisGroundModule DefinitionModule DefinitionMOD-DEF2PIN AMOD-DEF1PIN BMOD-DEF0Interpretation by Host4 SDA SCL Serial module definition protocolModule Definition 4 specifies a serial definition protocol. For this definition, upon power up, MOD-DEF(1:2) appear as no connector (NC) and MOD-DEF(0) is TTL LOW. When the host system detects this condition, it activates the serial protocol. The protocol uses the 2-wire serial CMOS E2PROM protocol of the ATMEL AT24C01A/02/04 family of components.PACKAGE DIAGRAM (Units in mm)Note: Specifications subject to change without notice.********************************************************************************************************************************************************************** OPTOWAY TECHNOLOGY INC. No.38, Kuang Fu S. Road, Hu Kou, Hsin Chu Industrial Park, Hsin Chu, Taiwan 303。

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SR05.TCT中文资料

SR05.TCT中文资料


Forward Voltage vs. Forward Current
10 9
% Change in Capacitance 0 -2 -4 -6 -8 -10 -12 -14 -16
Capacitance vs. Reverse Voltage
Forward Voltage - V F (V)
8 7 6 5 4 3 2 1 0 0 5 10 15 20 25 30 35 40 45 50 Forward Current - IF (A) Waveform Parameters: tr = 8µs td = 20µs
SR05

Mechanical Characteristics
JEDEC SOT-143 package UL 497B listed Molding compound flammability rating: UL 94V-0 Marking : R05 Packaging : Tape and Reel per EIA 481
0
25
50
75
100
125
150
Ambient Temperature - TA (oC)
Pulse Waveform
110 100 90 80 Percent of IPP 70 60 50 40 30 20 10 0 0 5 10 15 Time (µs) 20 25 30 td = IPP/2 e
10 Peak Pulse Power - PPk (kW)
Power Derating Curve
1IP 90 80 70 60 50 40 30 20 10 0
1
0.1
SA9105FPA中文资料

SA9105FPA中文资料

39 38 37 36 35 34 33 32 31 30 29
TP26 TP27 V DD VREF N.C. CON3 COP3 IVP3 IVP2 IVP1 GND
40 41 42 43 44 1 2 3 4 5 6
28 27 26 25 24 23 22 21 20 19 18

CINP CIPP CONP COPP N.C. IIP3 IIN3 IIP2 IIN2 IIP1 IIN1
Connections for inner loop capacitors of A/D converters
Connection for current setting resistor Test pin. Connect to VSS Manufacturer's test pins (Leave unconnected)
sames
元器件交易网
#
-25 -25
+25 +25 VSS+1
µA µA V V Hz Hz
VDD-1 0 0 64 180
Recommended crystal: TV colour burst crystal, f = 3.5795 MHz With R = 24 kΩ -IR 45 50 55 µA connected to VSS VR 1.1 1.3 V Referred to VSS
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DESCRIPTION The SAMES SA9105F Three Phase bidirectional Power/Energy metering integrated circuit generates pulse rate outputs for positive and negative energy directions, the frequency of which is proportional to the power consumption. The SA9105F performs the calculation for active power. The method of calculation takes the power factor into account. Energy consumption is determined by the power measurement being integrated over time. This innovative universal three phase power/ energy metering integrated circuit is ideally suited for applications such as residential and industrial energy metering and control. The SA9105F integrated circuit is available in 40 pin dual-in-line plastic (DIP-40), as well as in 44 pin plastic leaded chip carrier (PLCC-44) package types.
G3NA-210B中文资料

G3NA-210B中文资料

Solid-state Relay G3NA A Wide Range of Models with 5- to 40-AOutput Currents and Up to480-VAC/200-VDC Output VoltagesAll models feature the same compact dimensionsto provide a uniform mounting pitch.Built-in varistor effectively absorb external surges.Operation indicator (red LED) enables monitoringoperation.Protective cover for greater safety.Standard models approved by UL/CSA and -UTUmodels by VDE (TÜV).RCE157158Heat SinkThe following heat sinks are thin and can be DIN-track mounted (except Y92B-P250).See Dimensions for details.Low-cost ModelsMounting BracketUsed to mount the G3NA with a mounting dimension of 56 mm.See Dimensionsfor details. (Refer to page 164.)RatingsInput (Ambient Temperature: 25°C)Note:The input impedance is measured at the maximum value of the rated supply voltage (for example, with the model rated at 100 to 120 V AC, the input impedance is measured at 120 V AC).*With constant current input circuit system. The impedance for the G3NA-jjj B-UTU is 15 mA max.**Refer to the Engineering Data for further details.Output*When OMRON’s heat sink (refer to the accessories) or a heat sink of specified size is used.Characteristics159160Load Current vs. Ambient Temperature CharacteristicsG3NA-205BG3NA-210B/410BG3NA-220B/420BAmbient temperature (°C)Ambient temperature (°C)Ambient temperature (°C)L o a d c u r r e n t (A )L o a d c u r r e n t (A )L o a d c u r r e n t (A )201610865420With standard heat sink (Y92B-A100 or Y92B-N50) or aluminum plate measuring 75 mm x 75mm x 13.2 mm (W x H x D)Without heat sinkWith standard heat sink (Y92B-A100 or Y92B-N50)or aluminum plate measur -ing 150 mm x 150 mm x 13.2 mm (W x H x D)With iron plate measuring 100 x 100 x 0.8 (W x H x D)Without heat sinkWith standard heat sink (Y92B-A100 or Y92B-N100) or alumi-num plate measuring 200 mm x 200 mm x 13.2 mm (W x H x D)With iron plate measuring 100 x 100 x 0.8 (W x H x D)Without heat sinkG3NA-240BG3NA-440BG3NA-D210BL o a d c u r r e n t (A )Ambient temperature (°C)L o a d c u r r e n t (A )Ambient temperature (°C)L o a d c u r r e n t (A )Ambient temperature (°C)504540302012106420201065420With standard heat sink (Y92B-A150N or Y92B-N150)With iron plate measuring 100 x 100 x 0.8 (W x H x D)Without heat sinkWith Y92B-A250 or heat sink with a ra -diation ef ficien-cy of 1°C/W.With standard heat sink (Y92B-A150N or Y92B-N150)With iron plate measuring 100 x 100 x 0.8 (W x H x D)Without heat sinkWith standard heat sink (Y92B-A100 or Y92B-N50)or aluminum plate measur -ing 150 mm x 150 mm x 13.2 mm (W x H x D)With iron plate measuring 100 x 100 x 0.8 (W x H x D)Without heat sinkG3NA-450BL o a d c u r r e n t (A )Ambient temperature (°C)With standard heat sink (Y92B-P250)Without heat sink161Inrush Current ResistivityNon-repetitive (Keep the inrush current to half the rated value if it occurs repetitively .)G3NA-205BG3NA-210B/410BG3NA-220B/420BI n r u s h c u r r e n t (A . P e ak)Energizing time (ms)I n r u s h c u r r e n t (A . P e a k )Energizing time (ms)I n r u s h c u r r e n t (A . P e a k)Energizing time (ms)Ambient temperature (°C)G3NA-240B/440B/450BG3NA-D210BTemperature Characteristics (with Must Operate Voltage and Must Release Voltage)G3NA-2jj B AC InputI n r u s h c u r r e n t (A . P e a k )Energizing time (ms)I n r u s h c u r r e n t (A . P e a k )Energizing time (ms)V a r i a t i o n r a t e (%)Heat Sink Size vs. Load CurrentG3NA-220BH e a t s i n k s i z e (c m )2Ambient temperature 80°CAmbient temperature 40°CAluminum plate 3.2 mm thickLoad current (A)Note:The heat sink size refers to the combined area of the sides of the heatsink that radiate heat. For example, when a current of 18 A is allowed to flow through the SSR at 40°C, the graph shows that the heat sink size is about 450 cm 2. Therefore, if the heat sink is square, one side of the heat sink must be 15 cm (152 x 2 = 450) or longer .162In the case of surface mounting, a 30% derating of the load current is required.The orientation indicated by the external dimensions is not the correct mounting orientation. When opening mounting holes, refer to the mount -ing hole dimensions.G3NA-205B, G3NA-210B, G3NA-220B, G3NA-410B, G3NA-420B13.8Mounting HolesT erminal Arrangement/Internal Connections (T op View)Load power supply25 max.27 max.4.5 dia.Four , M4 x 8screws4.52543 max.58 max.47.544Operating indicatorMounting HolesT erminal Arrangement/Internal Connections (T op V iew)Load power supplyG3NA-240B, G3NA-440B, G3NA-450B13.825 max.27 max.58 min.47.5444.5 dia.Two, M5 x 12 screwsTwo,M 4 x 84.52543 max.Operating indicatorG3NA-D210BMounting HolesT erminal Arrangement/Internal Connections (T op View)Load power supply25 max.27 max.4.5 dia.Four,M4 x 8screws4.52543 max.58 max.47.544Operating indicator13.8Note:The load can be connected to either the positive or negative side.Mounting HolesHeat Sink Y92B-N504.6 dia.Two, M3 holesTwo, M4 holes5.647.677 max.90±0.3100 max.3530.5±0.344 max.3054.5647 max.Two, 3.2-dia.holes Two, 4.4-dia.or M4 holesWeight: approx. 200 g51 max.163Y92B-N1004.6 dia.Two, M3 holesTwo, M4holes3530.5±0.347.677 max.90±0.3100 max.5.63071 max.5100 max.4.575 max.Two, 3.2-dia. holesMounting HolesWeight: approx. 400 g2813Y92B-N1504.6 dia.3547.677 max. 5.6100 max.100 max.54.530100 max.90±0.3Two, 3.2-dia. holes104 max.Mounting HolesW eight: approx. 560 g56±0.31328Three,M4holesMounting Holes Y92B-A100Y92B-A150Y92B-A250Y92B-A100Y92B-A150NTwo, M4 holes47.650±0.1100 max.Three, M4 holes47.650±0.156±0.5150 max.R2.2Three, M4 holesR2.247.650±0.156±0.5250 max.100.5 max.80.5 max.1.59.621.5Y92B-A2503045.5 max.90 0.1±90 0.1±90 0.1±70 max.Four , M4Four, R2.5130.5 max.190.5 max.Mounting HolesFour, 4.5 dia. or M4164R99-112112.516844.6556Use Mounting Bracket R99-11 so that theG3NA-240B can be mounted with the same pitch as that of the G3N-240B.Y92B-P25070 max.Four , M4Four, R2.5130.5 max.190.5 max.MountingHolesFour, 4.5 dia. or M4165When attaching a heat sink to the G3NA, apply Silicone Grease or equivalent heat conductive grease on the heat sink. (Toshiba Sili-con, Shinetsu Silicon, etc.)Tighten the mounting screws of the heat sink with a torque of 0.78 to 0.98 N S m.EN55011 Measurement of Mains T erminal Disturbance VoltageThe G3NA-UTU conforms to EN55011 standards when a capacitor is connected to the load power supply as shown in the following cir -cuit diagram.G3NA-UTUOutputLoadInputRecommended Capacitor:Nissei Denki’s MKT-series R40 (1 µF)The output terminal side of the G3NA-D210B is connected to a built-in diode for protecting the SSR from damage that may result from reverse connection. The SSR, however , cannot withstand one min -ute or more if the wires are connected in reverse order . Therefore,pay the utmost attention not to make polarity mistakes on the load side.ALL DIMENSIONS SHOWN ARE IN MILLIMETERS.To convert millimeters into inches, multiply by 0.03937. T o convert grams into ounces, multiply by 0.03527.Cat. No. K067-E1-1D。

T7705A中文资料

T7705A中文资料

PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-88685012A OBSOLETE LCCC FK20TBD Call TI Call TI TL7702ACD ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL7702ACDE4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL7702ACDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL7702ACDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL7702ACDRE4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL7702ACDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL7702ACP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL7702ACPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL7702AID ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL7702AIDE4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL7702AIDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL7702AIDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL7702AIDRE4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL7702AIDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL7702AIP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL7702AIPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL7702AMFKB OBSOLETE LCCC FK20TBD Call TI Call TITL7702AMJG OBSOLETE CDIP JG8TBD Call TI Call TITL7702AMJGB OBSOLETE CDIP JG8TBD Call TI Call TITL7705ACD ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL7705ACDE4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL7705ACDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL7705ACDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL7705ACDRE4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL7705ACDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL7705ACP ACTIVE PDIP P850Pb-Free CU NIPDAU N/A for Pkg Type 31-Oct-2006Orderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)(RoHS)TL7705ACPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL7705ACPSLE OBSOLETE SO PS8TBD Call TI Call TITL7705ACPSR ACTIVE SO PS82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL7705ACPSRE4ACTIVE SO PS82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL7705AID ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL7705AIDE4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL7705AIDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL7705AIDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL7705AIDRE4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL7705AIDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL7705AIP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL7705AIPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL7705AMFKB OBSOLETE LCCC FK20TBD Call TI Call TITL7705AMJG OBSOLETE CDIP JG8TBD Call TI Call TITL7705AMJGB OBSOLETE CDIP JG8TBD Call TI Call TITL7709ACD ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL7709ACDE4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL7709ACDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL7709ACDRE4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL7709ACP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeTL7709ACPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg Type TL7709AID OBSOLETE SOIC D8TBD Call TI Call TITL7709AIP OBSOLETE PDIP P8TBD Call TI Call TITL7712ACD ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL7712ACDE4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL7712ACDR ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMTL7712ACDRE4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL7712ACP ACTIVE PDIP P850Pb-Free CU NIPDAU N/A for Pkg Type 31-Oct-2006Orderable DeviceStatus (1)Package Type Package DrawingPins Package QtyEco Plan (2)Lead/Ball FinishMSL Peak Temp (3)(RoHS)TL7712ACPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL7712AID OBSOLETE SOIC D 8TBD Call TI Call TI TL7712AIP OBSOLETE PDIP P 8TBD Call TI Call TITL7715ACD ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL7715ACDE4ACTIVE SOIC D 875Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM TL7715ACP ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL7715ACPE4ACTIVE PDIP P 850Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type TL7715AID OBSOLETE SOIC D 8TBD Call TI Call TI TL7715AIPOBSOLETEPDIPP8TBDCall TICall TI(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solderbumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and 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