Measurement-based optimization techniques for bandwidth-demanding peer-to-peer systems

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LARGE-SCALEBIOLOGYARTICLE

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BrassicaceaeCross-SpeciesSeedGerminationCaseStudyWOA

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16 September 2019 Page 1 | | RF Front End and Transceiver Manufacturing Test Solution SOLUTION FLYER RF Front End and Transceiver Manufacturing Test Solution CONTENTS Solution Overview About the NI Semiconductor Test System STS Software Engineering Services Training Options Services and Support 16 September 2019 Page 2 | | RF Front End and Transceiver Manufacturing Test Solution Solution Overview Integrated Solution for RF Front End and Transceiver Manufacturing Test As development schedules constrict under market window pressures and product complexity increases with every iteration of cellular and connectivity wireless communication standards, semiconductor test engineers need a production test solution that can help accelerate time to market and reduce the cost of test. For RF transceivers and RF front ends, including power amplifiers (PAs), low-noise amplifiers (LNAs), RF switches, RF filters, and integrated RF front end modules (FEMs), the NI Semiconductor Test System provides significant test time and throughput advantages over alternative ATE solutions. NI’s heavy involvement in standards bodies and lab applications translates to strong experience and compelling solutions for the latest wireless standards, such as 5G NR and Wi-Fi 6. NI offers significant IP and cutting-edge instrumentation ranging from femtoampere-class DC instrumentation for sensitive I-V measurements to mmWave instrumentation with industry-leading bandwidth to tackle the newest wireless chipset. This document provides an overview of NI’s integrated, multi-site production test ATE solution for RF transceivers and front ends for both handset/user equipment (UE) and base station/small-cell devices. As with traditional semiconductor ATE solutions, STS has modular instrumentation resources that can be configured with the ideal mix of DC, digital, and RF instrumentation resources to perform multi-site test of RF front-end ICs or modules. STS is ready for the production test cell, with support for manipulators, Figure 1. NI Semiconductor Test System Figure 2. Example 5G RFIC Architecture with Multi-user MIMO and Beamforming Capabilities 16 September 2019 Page 3 | | RF Front End and Transceiver Manufacturing Test Solution handlers, and wafer probers (with traditional tower probe and direct dock probe options), and a standard spring pin layout facilitates highly transferable test programs and load boards. STS also features a comprehensive set of software tools for quickly and efficiently developing, debugging, and deploying test programs, including a measurement library for RF measurements such as transmit power, adjacent channel power (ACP), error vector magnitude (EVM), output power servoing, S-parameter measurements, noise floor, noise figure, harmonics, third-order intercept (IP3), and more. For applications that require extended capabilities, NI offers standard add-ons for high-power RF (+40 dBm at the RF blind-mates for transmit and receive), noise figure measurements with Y-factor support, and high frequency harmonics measurements (up to 18 GHz). To complete the solution, NI offers comprehensive engineering services, bring-up services, training, and support. Key Benefits • Integrated production test solution for RF and mmWave cellular and connectivity devices • Industry-leading 1 GHz bandwidth (without stitching) for complex RF measurements • Support for wireless standards, including GSM, TD SCDMA, WCDMA, LTE, LTE-A, 5G NR, and 802.11a/b/g/n/ac/ax • Latest technology emerging from the design lab, including digital predistortion (DPD), envelope tracking, FPGA-based power servoing, support for new RF frequencies, and higher RF, IF, and mmWave port count • Up to 48 bidirectional Sub-6 GHz RF ports or 72 bidirectional mmWave ports (with eight integrated 5-21 GHz IF ports) • Support for SerDes (up to 12.5 or 28.2 Gbps), JESD204B, MIPI RFFE, SPI, and custom digital protocols • Optional high-power RF up to +40 dBm • Optional harmonics measurements - up to 18 GHz • Optional noise figure measurements - with Y-factor and cold source support Standard Features • Drag-and-drop test step templates for common semiconductor test operations • Interactive software for performing manual tests and debugging automated tests • Calibration for RF instrumentation up to the blind-mates, and DC/Digital instrumentation up to the spring probe interface • Test Sequencer: NI TestStand with TestStand Semiconductor Module • Code Development: LabVIEW or C# .NET • STS Maintenance Software Optional Features • High-power RF (+40 dBm transmit and receive) • Harmonics measurement (up to 18 GHz) • Noise figure measurement (with Y-factor and cold source support) Test Head Features • Zero footprint test head • Manipulator interface kits for Reid Ashman, InTest, Esmo, Arktek, Asia Microhandling, and others • Support for packaged device handlers and wafer probers (traditional tower probe and direct dock probe) • 220 V power • Fan cooled • Standard spring pin layout

2021年

3月

March 2021第47卷第3期

Vol.47 No.3

•热点与综述•计算机工程

Computer Engineering

文章编号：

1000-

3428(2021)03-

0043-

10

文献标志码：

A中图分类号:

TN929.5

5G

超密集异构网络带内无线回传资源分配方案

余钊贤

^2,易辉跃心，裴 俊

1

(1.中国科学院上海微系统与信息技术研究所中科院无线传感网与通信重点实验室，上海200050；

2.中国科学院大学，北京100049; 3.上海无线通信研究中心，上海201210)

摘要：为实现5G

超密集异构网络中无线回传链路和接入链路之间的最优资源分配，研究多用户场景下双层异构网

络的联合用户调度和功率分配问题，在队列稳定和无线回传资源有限的情况下，综合考虑用户调度、功率分配和干扰

控制等因素，对带内无线回传的最优资源分配问题进行数学建模并求解，基于李雅普诺夫优化理论提出联合用户调

度和功率分配的优化算法。将优化问题解耦为网络内各个用户的调度以及宏基站和小基站的功率分配过程，采用MOSEK

求解器和二分类方法获得用户调度向量，利用拉格朗日乘子法求解功率分配问题，并通过队列的时刻更新过程实现

最优资源分配。仿真结果表明，在多用户场景下,该方案能够有效提升网络总吞吐量以及网络效用，并且毫米波频段

的通信性能优于传统蜂窝网络频段。

关键词：5G

超密集异构网络;无线回传;用户调度；功率分配；李雅普诺夫优化

开放科学(资源服务)标志码(OSID

)： ||||

中文引用格式:余钊贤，易辉跃，裴俊.

5G

超密集异构网络带内无线回传资源分配方案[J

1.

计算机工程,2021,47(3)：

43-52.

英文弓I

用格式：YU Zhaoxian

, YI Huiyue

, PEI Jun. Resource allocation scheme of in

-band wireless backhaul in

5G

ultra

-dense heterogeneous networkf J