不良缺点中英对照表

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band switch int (receiving)rx int (transmission)tx int no rx on tx weak set rx weak tx weak speaker distortion rx distortion volume oscillation int oscillation vol noise speaker noise rx noise tx noise tuner noise sens weak/weak sens high sens antenna loose battery clip int battery clip dead screw rust battery plate rust gift box display box button difficulty to press cold solder over current short circuit open circuit 難按制 假錫 電流大 短路 開路 開關接觸不良 接收接觸不良 發射接觸不良 沒接收 沒發射 低機 接收低 發射低 喇叭失真 收接失真 電位器叫 接觸不良叫 電位器雜聲 喇叭雜聲 接收雜聲 發射雜聲 調諧器雜聲 靈敏度太高 靈敏度太低 天線松 電池夾接觸不良 電池夾死 螺絲生銹 電池片生銹 彩盒 air bubble blind hole color mismatch damaged deformed ejector pin mark dirty flash gate flow mark mould stain oil mark over size scratch material contamination moisture mark shrinkage stress mark under shot under size weld line wrong color wrong material mismatch

常用英语词汇与缩写：Accuracy：精度Additive Process：加成工艺Adhesion：附着力Aerosol：气溶剂Angle of attack：迎角Anisotropic adhesive：各异向性胶Annular ring：环状圈Application specific integrated circuit ：ASIC特殊应用集成电路Array：列阵Artwork：布线图Automated test equipment：ATE自动测试设备Bond lift-off：焊接升离Bonding agent：粘合剂CAD/CAM system：计算机辅助设计与制造系统Capillary action：毛细管作用Chip on board ：COB板面芯片Circuit tester：电路测试机Cladding：覆盖层Cold cleaning：冷清洗Cold solder joint：冷焊锡点Conductive epoxy：导电性环氧树脂Conductive ink：导电墨水Conformal coating：共形涂层Copper foil：铜箔Copper mirror test：铜镜测试Cure：烘焙固化AOI（Automatic optical inspection）：自动光学检查Assembly：组件ATE（Automated test equipment）：自动测试设备Bare Chip：裸芯片BGA（Ball grid array）球栅列阵Blind via：盲孔Blowholes：吹孔Bridge：锡桥Bridging：搭锡bulk feeder：散装式供料器Buried via：埋孔Chamber System：炉膛系统Chip：片状元件Circuit tester：电路测试机cleaning after soldering：焊后清洗Cold solder joint：冷焊锡点Component Check：元件检查Component density：元件密度Component Pick-Up：元件拾取Component Transport：元件传送Component：元件convection reflow soldering：热对流再流焊Copper Clad Laminates：覆铜箔层压板Copper foil：铜箔Copper mirror test：铜镜测试CSP（Chip Scale Package）：芯片规模的封装CTE（Coefficient of the thermal expansion）：温度膨胀系数Cure：烘焙固化Cursting：发生皮层Cycle rate：循环速率Data recorder：数据记录器Defect：缺陷Delamination：分层Desoldering：卸焊Dewetting：去湿DFM：为制造着想的设计Dispersant：分散剂Documentation：文件编制Downtime：停机时间Durometer：硬度计Desoldering：卸焊Device：器件Dewetting：缩锡DIP：双列直插Downtime：停机时间Dpm（defects per million）：百万缺陷率dual wave soldering：双波峰焊Dull Joint：焊点灰暗Environmental test：环境测试Eutectic solders：共晶焊锡Excessive Paste：膏量太多FCT（Functional test）：功能测试feeder holder：供料器架feeders：供料器Fiducial：基准点Fillet：焊角Fine-pitch technology ：FPT密脚距技术Fixture：夹具Flexibility：柔性flexible stencil：柔性金属漏版Flip chip：倒装芯片flux bubbles：焊剂气泡flying：飞片FPT（Fine-pitch technology）：密脚距技术Full liquidus temperature：完全液化温度Golden boy：金样Fundamentals of Solders and Soldering焊料及焊接基础知识Soldering Theory焊接理论Microstructure and Soldering显微结构及焊接Effect of Elemental Constituents on Wetting焊料成分对润湿的影响Effect of Impurities on Soldering杂质对焊接的影响Solder Paste Technology焊膏工艺Solder Powder 锡粉Solder Paste Rheology锡膏流变学Solder Paste Composition & Manufacturing锡膏成分和制造SMT Problems Occurred Prior to Reflow回流前SMT问题Flux Separation助焊剂分离Paste Hardening焊膏硬化Poor Stencil Life网板寿命问题Poor Print Thickness印刷厚度不理想Poor Paste Release From Squeegee锡膏脱离刮刀问题Smear印锡模糊Insufficiency锡不足Needle Clogging针孔堵塞Slump塌落Low Tack低粘性Short Tack Time 粘性时间短SMT Problems Occurred During Reflow回流过程中的SMT问题Cold Joints冷焊Nonwetting不润湿Dewetting反润湿Leaching浸析Intermetallics金属互化物Tombstoning立碑Skewing歪斜Wicking焊料上吸Bridging桥连Voiding空洞Opening开路Solder Balling锡球Solder Beading锡珠Spattering飞溅SMT Problems Occurred at Post Reflow Stage回流后问题White Residue白色残留物Charred Residue炭化残留物Poor Probing Contact探针测接问题Surface Insulation Resistance or Electrochemical Migration Failure表面绝缘阻抗或电化迁移缺陷Delamination/Voiding/Non-curing Of Conformal Coating/Encapsulants分层/空洞/敷形涂覆或包封的固化问题Challenges at BGA and CSP Assembly and Rework Stage BGA、CSP组装和翻修的挑战Starved Solder Joint少锡焊点Poor Self-Alignment自对位问题Poor Wetting润湿不良Voiding空洞Bridging桥连Uneven Joint Height焊点高度不均Open开路Popcorn and Delamination爆米花和分层Solder Webbing锡网Solder Balling锡球Problems Occurred at Flip Chip Reflow Attachment倒装晶片回流期间发生的问题Misalignment位置不准Poor Wetting润湿不良Solder Voiding空洞Underfill Voiding底部填充空洞Bridging桥连Open开路Underfill Crack底部填充裂缝Delamination分层）Filler Segregation填充分离Insufficient Underfilling底部填充不充分Optimizing Reflow Profile via Defect Mechanisms Analysis回流曲线优化与缺陷机理分析Flux Reaction助焊剂反应Peak Temperature峰值温度Cooling Stage冷却阶段Heating Stage加热阶段Timing Considerations时间研究Optimization of Profile曲线优化Comparison with Conventional Profiles与传统曲线的比较Discussion讨论Implementing Linear Ramp Up Profile斜坡式曲线general placement equipment：中速贴装机Golden boy：金样Halides：卤化物Hard water：硬水Hardener：硬化剂high speed placement equipment：高速贴装机hot air reflow soldering：热风再流焊ICT（In-circuit test）：在线测试In-circuit test：在线测试Insufficient Paste：膏量不足JIT（Just-in-time）：刚好准时laser reflow soldering：激光再流焊LCCC（Leadless Ceramic Chip Carrier）：无引脚陶瓷芯片载体Lead configuration：引脚外形Line certification：生产线确认located soldering：局部软钎焊low speed placement equipment：低速贴装机low temperature paste：低温焊膏Machine vision：机器视觉Mean time between failure ：MTBF平均故障间隔时间Manhattan effect：曼哈顿现象melf：圆柱形元件metal stencil：金属漏版Misalignment：偏斜Modularity：模块化Movement：移位no-clean solder paste：免清洗焊膏Non-Dewetting：不沾锡Nonwetting：不熔湿的optic correction system ：光学校准系统Organic activated ：OA有机活性的Packaging density：装配密度Photoploter：相片绘图仪Placement equipment：贴装设备past mask：焊膏膜(漏板）paste shelf life：焊膏贮存寿命PCB（Printed circuit board）：印刷电路板Pick-and-place：拾取-贴装设备placement accuracy：贴装精度placement direction：贴装方位Placement equipment：贴装设备placement pressure：贴装压力Placement Procedure：元件放置placement speed：贴装速度PLCC（Plastic Leaded Chip Carrier）：塑型有引脚芯片载体Poor Tack Retention：粘着力不足precise placement equipment：精密贴装机PTH （Pin Through the Hole）：通孔安装QFP（Quad Flat Package）：多引脚方形扁平封装Reflow soldering：回流焊接Repair：修理Repeatability：可重复性Rheology：流变学repeatability：重复性resolution：分辨率Rework：返工rotating deviation：旋转偏差Schematic：原理图Semi-aqueous cleaning：不完全水清洗Shadowing：阴影Silver chromate test：铬酸银测试Slump：坍落Solder bump：焊锡球Solderability：可焊性Soldermask：阻焊Solids：固体。

焊接缺陷1.裂缝：crack （焊缝/弧坑/热影响区裂纹:weld metal/crater/heat-affected Zone (HAZ) crack）2.焊瘤:overlap3.冷隔：cold lap4.未焊满: under fill / incompletely filled groove5.咬边: undercut6.道间没有圆滑过渡/焊缝凹陷：bum effect / Excessive concave7.未溶合: lack of fusion / incomplete fusion8.气孔:gas pore / blowhole (针尖状气孔:pinhole; 密集气孔:porosity; 条虫状气孔:wormhole)9.夹渣: slag inclusion (夹钨:tungsten inclusion; 夹杂物:inclusion)10.未焊透:incomplete penetration / lack of penetration11.过度焊缝加强高：excessive reinforce / Excessive weld metal12.电弧烧伤：Arc strike / Arc burn13.焊接变形: welding deformation14.烧穿:burn through15.塌陷: excessive penetration16.凹坑:pit / dent17.过度打磨：excessive grinding18.焊疤：scar19.飞溅：spatter20.焊缝成行不好：poor profile21.焊角不足：lack of weld leg附录attachment焊接工艺方法1.熔焊:fusion welding 压焊:pressure welding 钎焊:brazing welding2.焊缝倾角:weld slope, inclination of weld axis.3.焊缝转角:weld rotation, angle of rotation4.平焊:flat position of welding, downhand welding 横焊:Horizontal position welding.5.立焊:vertical position welding 仰焊:overhead position welding.6.向下立焊:vertical down welding, downward welding in the vertical position.7.向上立焊:vertical up welding, upward welding in the vertical position.8.倾斜焊;inclined position welding9.上坡焊: upward welding in the inclined position10.下坡焊: downward welding in the inclined position11.对接焊:butt welding 角焊:fillet welding 搭接焊:lap welding12.船形焊: fillet welding in the downhand / flat position13.坡口焊:groove welding14.I 形坡口对接焊:square groove welding15.Y形坡口对接焊:flare groove welding16.纵缝焊接:welding of longitudinal seam. 横缝焊接:welding of transverse seam.17.环缝焊接:girth welding, circumferential welding18.螺旋缝焊接:welding of spiral seam, welding of helical seam.19.环缝对接焊:Butt welding of circumferential seam.20.单面焊:welding by one side 双面焊:welding by both sides21.单道焊:single-pass welding, single-run welding 多道焊: multi-pass welding..22.单层焊:single layer welding 多层焊:multi-layer welding23.分段多层焊:block sequence, block welding24.连续焊:continuous welding 打底焊:backing welding 封底焊:back sealing weld25.自动焊:automatic welding 半自动焊:semi-automatic welding26.手工焊:manual welding, hand welding27.车间焊接:shop welding 工地焊接:site welding, field welding28.堆焊:surfacing welding, building up welding, overlaying welding.29.衬垫焊:welding with backing.30.焊剂垫焊:welding with flux backing31.电弧点焊:arc spot welding.32.套环:ferrule 试板test piece 随机检查random check33.单面/双面串联点焊:direct/indirect serial spots welding.34.机械性能试验mechanical properties test35.简历curriculum vitae36.分类category37.风险评估risk assessment38.第三方notified body39.基准modules坡口, 焊缝1.焊接工艺参数:welding parameter2.坡口: groove 钝边:root face3.坡口面角度: angle of bevel, bevel angle.4.坡口角度: Included angle, groove angle.5.坡口高度:groove depth6.开坡口:beveling of the edge, chamfering.7.single-V/U groove (with root face)8.焊缝区:weld metal zone 热影响区:heat-affected Zone (HAZ)9.工艺/使用/热/焊接性:fabrication/service/thermal weldability.10.碳弧气刨:carbon arc air gouging. 火焰气刨:flame gouging11.等离子切割:plasma arc cutting(PAC) 激光切割: laser cutting (LC)12.喷沙: sand blast 清渣:slag removal 清根: back chipping13.碳/铬/镍当量:carbon/chromium/nickel equivalent.电弧焊1.手工电弧焊:manual metal arc welding2.直流电弧焊:direct current arc welding3.交流电弧焊:alternating current arc welding4.三相电弧焊:three phases current arc welding5.熔化极电弧焊: arc welding with consumable electrode6.金属极电弧焊:metal arc welding 电弧堆焊:arc surfacing7.碳弧焊:carbon arc welding 自动堆焊:automatic surfacing8.埋弧焊:submerged-arc welding (SAW)9.自动埋弧焊:automatic submerged-arc welding (SAW)10.半自动埋弧焊:semi-automatic submerged-arc welding (SAW)11.气体保护焊:gas shielded arc welding12.惰性气体保护焊:inert-gas arc welding13.氩弧焊:argon arc welding14.钨极惰性气体保护焊:tungsten inert-gas arc welding15.活性气体保护焊:metal active gas arc welding16.Co2气体保护焊:carbon-dioxide arc welding.17.电渣焊:electro-slag welding (ESW) 电阻焊:resistance welding (RW)18.点焊:spot welding 摩擦焊:friction welding (FW) 爆炸焊: explosive welding (EW)19.热切割: thermal cutting (TC) 气割: gas cutting20.塑性/脆性:plastic/brittle21.焊缝\环焊缝\打磨:welding seam\circumference seam\grind22.发证:certification issue焊接检验1.试件/试样: test piece/specimen2.直射/斜射/水浸超声探伤:straight/angle beam/immersed ultrasonic inspection3.射线探伤:radiographic inspection 超声探伤:ultrasonic inspection4.磁粉探伤:magnetic particle examination 渗透探伤: penetration inspection5.荧光检验:fluorescent penetration inspection6.着色检验:dye penetration inspection7.电磁法探伤:electromagnetic test8.密封性检验:leak test 气密性检验: airtight test10. 破坏检验:destructive test9.耐压检验:pressure test 水压试验:hydraulic test 气压试验:pneumatic test10.声发射:acoustic emersion11.淬火：quenching 回火：tempering退火：annealing 熔炼：smelting12.强制检验:mandatory inspection13.拉伸试验\弯曲试验\冲击试验:tension test\bend test\impact test14.金相检查:metallographic exam15.面弯\背弯\侧弯\断口\弯曲条件:face bend\root bend\side bend\break\condition of bend16.合格级别\评定级别\底片编号acceptable grade\interpretation level\radiograph no17.铱同位素:iridium isotope∙welding inspection clearance groove, assembly space whether it meets the requirements, positioning it firmly welding, weld around is not oil, rust;清理焊口：焊前检查坡口、组装间隙是否符合要求，定位焊是否牢固，焊缝周围不得有油污、锈物；∙开孔前要按照图纸给定的方位、标高，结合排版图进行放样、测量、号孔、划线。

注塑、模具专业英语Surface Appearance 外观Glossiness/gloss finish 光洁度、粗糙度Matt finish/matt surface 毛面Glass fiber rich surface/glass emergence on the surface 玻纤外露、浮纤Blooming/surface blooming 表面析出White patches on surface 表面白斑Silver marks/silver streak 银纹Splay mark 水纹、料花Flow mark 流纹Brittle/brittleness 脆、脆性Bubbles/trapped gas 气泡/困气V oid 孔、气泡Burn marks 烧伤FR failed 阻燃不合格Flame rating V-2 阻燃等级V—2Poor dispersion 分散不好FR/PTFE …agglomerates etc 阻燃剂/PTFE…结块Pellet porous 颗粒料孔隙、Low impact/tensile strength etc 低冲击强度/拉伸强度等High flow/filler content etc 高流动性/过度填充Longs/fines/doubles 长粒/碎屑/连粒Poor cut 粒形不好Bristle/voids 表面有小气泡/孔Glass bundles 纤维结团Product was rejected due to 产品不能接受因为…High moisture level 高水分、高湿度Warpage/warped 翘曲/变形Shrinkage/shrink 收缩/收缩率Sink marks 凹陷、缩水Short shot/short molding 打不满、欠注Distortion 变形Over dimension 尺寸过大Under dimension 尺寸过小Flashing 飞边、披锋、溢边Discoloration 变色Off color 颜色差异Flow rate 流动速率Viscous/viscosity 粘性的、粘的/黏度High flow 高流动Low flow 低流动Sticky 粘的，粘性的Sticking core 粘后模,粘模芯Sticking sprue 粘水口Sticking cavity 粘前模Mold release（agent) 脱模(剂)Antioxidant 抗氧剂Flame retardant agent 阻燃剂Heat stabilizer 热稳定剂Chopped glass fiber 短切玻纤Roving glass fiber 粗纱/长玻纤Glass beads 玻璃微珠Milled fiber 碾磨纤Molybdenum disulfide/moly/MoS2 二硫化钼Colorant 着色剂Pigment 颜料Dye 染料Accepted product specification 接受产品规格Approved our product 认可我们的产品Re-set spec 重新定标准Add in extra …添加多一点…Reduced …content 减少…含量Dropped/reduced …by x％减少…含量…% Confirmed color standard 确认颜色标准Approved color standard 认可颜色标准Re-confirmed color standard 重新确认颜色标准Qualified our product 认可我们的产品Undergoing heat aging test 在做热老化实验Product is under testing 产品在测试当中Received first order 接了第一个定单Expected to finish by …预计在…完成Expected order is xMT 预计定单量…吨Estimated annual/monthly consumption 预计年/月用量模具方面：Ejection system 顶出系统、脱模系统pin 顶针、推杆spring 弹簧Gate type 浇口类型sprue 主流道runner 分流道cavity 模腔Sprue gate 直浇口Pin point gate 点浇口Tab gate 护耳浇口Fan gate 扇形浇口Tunnel or submarine gate 潜伏式浇口Jump gate 跳跃式浇口Diaphragm gate 片状浇口Ring gate 环形浇口The cavity of the mould 模腔Heated cylinder 加热料筒Surface finish 表面光洁度Sink mark 缩水Air trap 困气Gas trapped 气体困着,困气void 空隙,孔galling 烧焦Weld line 熔接痕，熔合线Drag mark 划伤、脱模痕Scratch mark 模具刮花Deformed/ warp 变形Ejector not returned 顶针不回位slide 滑块、行位streak 波纹、条纹、色痕delamination 分层Jetting mark 喷射痕Gate mark 浇口痕rib 筋、加强筋、骨位boss 凸台、凸起、凸痕Melt flow length 熔体流线长度Ejector plate 顶针板Stop pin 限位销Push rod 推杆、顶针Push back pin 复位杆Ejector guide pin 顶针导柱Cold—slug—well 冷料井、冷料穴plate 模板Ejected mark 顶痕，顶白nozzle 喷嘴Surface defect 表面缺陷Air vent 排气口Filling uneven 走胶不平衡、进胶不平衡。