LMK04100SQNOPB;LMK04100SQXNOPB;LMK04101SQNOPB;LMK04101SQXNOPB;中文规格书,Datasheet资料

LMD18245LMD18245 3A, 55V DMOS Full-Bridge Motor DriverLiterature Number: SNVS110DLMD182453A,55V DMOS Full-Bridge Motor DriverGeneral DescriptionThe LMD18245full-bridge power amplifier incorporates all the circuit blocks required to drive and control current in a brushed type DC motor or one phase of a bipolar stepper motor.The multi-technology process used to build the device combines bipolar and CMOS control and protection circuitry with DMOS power switches on the same monolithic struc-ture.The LMD18245controls the motor current via a fixed off-time chopper technique.An all DMOS H-bridge power stage delivers continuous out-put currents up to 3A (6A peak)at supply voltages up to 55V.The DMOS power switches feature low R DS(ON)for high efficiency,and a diode intrinsic to the DMOS body structure eliminates the discrete diodes typically required to clamp bipolar power stages.An innovative current sensing method eliminates the power loss associated with a sense resistor in series with the motor.A four-bit digital-to-analog converter (DAC)provides a digital path for controlling the motor current,and,by extension,simplifies implementation of full,half and microstep stepper motor drives.For higher resolution applications,an external DAC can be used.Featuresn DMOS power stage rated at 55V and 3A continuous n Low R DS(ON)of typically 0.3Ωper power switch n Internal clamp diodesn Low-loss current sensing methodn Digital or analog control of motor current n TTL and CMOS compatible inputsn Thermal shutdown (outputs off)at T J =155˚C n Overcurrent protection n No shoot-through currentsn15-lead TO-220molded power packageApplicationsn Full,half and microstep stepper motor drivesn Stepper motor and brushed DC motor servo drives n Automated factory,medical and office equipmentFunctional Block and Connection Diagram(15-Lead TO-220Molded Power Package (T))01187801Order Number LMD18245T See NS Package Number TA15A©2006National Semiconductor Corporation 01187802Top View15-Lead TO-220Molded Power PackageOrder Number LMD18245TSee NS Package Number TA15APinout Descriptions(See Functional Block and Connection Diagrams)Pin1,OUT1:Output node of the first half H-bridge.Pin2,COMP OUT:Output of the comparator.If the voltage at CS OUT exceeds that provided by the DAC,the compara-tor triggers the monostable.Pin3,RC:Monostable timing node.A parallel resistorca-pacitor network connected between this node and ground sets the monostable timing pulse at about1.1RC seconds. Pin5,PGND:Ground return node of the power bridge.Bond wires(internaI)connect PGND to the tab of the TO-220 package.Pins4and6through8,M4through M1:Digital inputs of the DAC.These inputs make up a four-bit binary number with M4as the most significant bit or MSB.The DAC pro-vides an analog voltage directly proportional to the binary number applied at M4through M1.Pin9,V CC:Power supply node.Pin10,BRAKE:Brake logic input.Pulling the BRAKE input logic-high activates both sourcing switches of the power bridge—effectively shorting the load.See Table1.Shorting the load in this manner forces the load current to recirculate and decay to zero.Pin11,DIRECTION:Direction logic input.The logic level at this input dictates the direction of current flow in the load. See Table1.Pin12,SGND:Ground return node of all signal level c Pin13,CS OUT:Output of the current sense amplifie current sense amplifier sources250µA(typical)per a of total forward current conducted by the upper two sw of the power bridge.Pin14,DAC REF:Voltage reference input of the DA DAC provides an analog voltage equal to V DAC REF x where D is the decimal equivalent(0–15)of the number applied at M4through M1.Pin15,OUT2:Output node of the second half H-brTABLE1.Switch Control Logic Truth Table BRAKE DIRECTION MONO Active SwitchH X X Source1,SourceL H L Source2L H H Source2,Sink1L L L Source1L L H Source1,Sink2 X=don’t careMONO is the output of the monostable.L2please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.DC Voltage at:OUT1,V CC,and OUT2+60V COMP OUT,RC,M4,M3,M2,M1,BRAKE,+12VDIRECTION,CS OUT,and DAC REFDC Voltage PGND to SGND±400mV Continuous Load Current3A Peak Load Current(Note2)6A Junction Temperature(T J(max))+150˚C Power Dissipation(Note3):ESD Susceptibility(Note4)1500V Storage Temperature Range(T S)−40˚C to+150˚C Lead Temperature(Soldering,10seconds)300˚COperating Conditions(Note1) Temperature Range(T J)(Note3)−40˚C to+125˚C Supply Voltage Range(V CC)+12V to+55V CS OUT Voltage Range0V to+5V DAC REF Voltage Range0V to+5V MONOSTABLE Pulse Range10µs to100msElectrical Characteristics(Note2)The following specifications apply for V CC=+42V,unless otherwise stated.Boldface limits apply over the operating tem-perature range,−40˚C≤T J≤+125˚C.All other limits apply for T A=T J=25˚C.Symbol Parameter Conditions Typical Limit Units(Note5)(Note5)(Limits)I CC Quiescent Supply Current DAC REF=0V,V CC=+20V8mA15mA(max) POWER OUTPUT STAGER DS(ON)Switch ON Resistance I LOAD=3A0.30.4Ω(max)0.6Ω(max)I LOAD=6A0.30.4Ω(max)0.6Ω(max)V DIODE Body Diode Forward Voltage I DIODE=3A 1.0V1.5V(max)T rr Diode Reverse Recovery Time I DIODE=1A80nsQ rr Diode Reverse Recovery Charge I DIODE=1A40nCt D(ON)Output Turn ON Delay TimeSourcing Outputs I LOAD=3A5µsSinking Outputs I LOAD=3A900nst D(OFF)Output Turn OFF Delay TimeSourcing Outputs I LOAD=3A600nsSinking Outputs I LOAD=3A400nst ON Output Turn ON Switching TimeSourcing Outputs I LOAD=3A40µsSinking Outputs I LOAD=3A1µst OFF Output Turn OFF Switching TimeSourcing Outputs I LOAD=3A200nsSinking Outputs I LOAD=3A80nst pw Minimum Input Pulse Width Pins10and112µst DB Minimum Dead Band(Note6)40ns CURRENT SENSE AMPLIFIERCurrent Sense Output I LOAD=1A(Note7)200µA(min)250175µA(min)300µA(max)325µA(max) Current Sense Linearity Error0.5A≤I LOAD≤3A(Note7)±6%±9%(max)3perature range,−40˚C≤T J≤+125˚C.All other limits apply for T A=T J=25˚C.LSymbol Parameter Conditions Typical Limit U(Note5)(Note5)(L CURRENT SENSE AMPLIFIERCurrent Sense Offset I LOAD=0A520µA DIGITAL-TO-ANALOG CONVERTER(DAC)Resolution4BitMonotonicity4BitTotal Unadjusted Error0.1250.25LSB0.5LSBPropagation Delay50I REF DAC REF Input Current DAC REF=+5V−0.5±10µA COMPARATOR AND MONOSTABLEComparator High Output Level 6.27Comparator Low Output Level88Comparator Output CurrentSource0.2Sink 3.2t DELAY Monostable Turn OFF Delay(Note8) 1.22.0µsPROTECTION AND PACKAGE THERMAL RESISTANCESUndervoltage Lockout,V CC5V8V T JSD Shutdown Temperature,T J155Package Thermal ResistancesθJC Junction-to-Case,TO-220 1.5˚θJA Junction-to-Ambient,TO-22035˚LOGIC INPUTSV IL Low Level Input Voltage−0.1V0.8VV IH High Level Input Voltage2V12VI IN Input Current V IN=0V or12V±10µANote1:Absolute Maximum Ratings indicate limits beyond which damage to the device may occur.Electrical specifications do not apply when operating th outside the rated Operating Conditions.Note2:Unless otherwise stated,load currents are pulses with widths less than2ms and duty cycles less than5%.Note3:The maximum allowable power dissipation at any ambient temperature is P Max=(125−T A)/θJA,where125˚C is the maximum junction temper operation,T A is the ambient temperature in˚C,andθJA is the junction-to-ambient thermal resistance in˚C/W.Exceeding P max voids the Electrical Specifica forcing T J above125˚C.If the junction temperature exceeds155˚C,internal circuitry disables the power bridge.When a heatsink is used,θJA is the su junction-to-case thermal resistance of the package,θJC,and the case-to-ambient thermal resistance of the heatsink.Note4:ESD rating is based on the human body model of100pF discharged through a1.5kΩresistor.M1,M2,M3and M4,pins8,7,6and4are pro 800V.Note5:All limits are100%production tested at25˚C.Temperature extreme limits are guaranteed via correlation using accepted SQC(Statistical Quality methods.All limits are used to calculate AOQL(Average Outgoing Quality Level).Typicals are at T J=25˚C and represent the most likely parametric nor Note6:Asymmetric turn OFF and ON delay times and switching times ensure a switch turns OFF before the other switch in the same half H-bridge begin ON(preventing momentary short circuits between the power supply and ground).The transitional period during which both switches are OFF is commonly to as the dead band.Note7:(I LOAD,I SENSE)data points are taken for load currents of0.5A,1A,2A and3A.The current sense gain is specified as I SENSE/I LOAD for the1A da The current sense linearity is specified as the slope of the line between the0.5A and1A data points minus the slope of the line between the2A and3A da all divided by the slope of the line between the0.5A and1A data points.Note8:Turn OFF delay,t DELAY,is defined as the time from the voltage at the output of the current sense amplifier reaching the DAC output voltage to t DMOS switch beginning to turn OFF.With V CC=32V,DIRECTION high,and200Ωconnected between OUT1and V CC,the voltage at RC is increased fro 5V at1.2V/µs,and t DELAY is measured as the time from the voltage at RC reaching2V to the time the voltage at OUT1reaches3V.4RDS(ON)vs Temperature RDS(ON)vs Load Current0118782901187830RDS(ON)vs Supply Voltage Current Sense Output vs Load Current0118783101187832Supply Current vs Supply Voltage Supply Current vs Temperature01187833011878345TYPICAL OPERATION OF A CHOPPER AMPLIFIER Chopper amplifiers employ feedback driven switching of a power bridge to control and limit current in the winding of a motor(Figure1).The bridge consists of four solid state power switches and four diodes connected in an H configu-ration.Control circuitry(not shown)monitors the winding current and compares it to a threshold.While the winding current remains less than the threshold,a source switch and a sink switch in opposite halves of the bridge force the supply voltage across the winding,and the winding current increases rapidly towards V CC/R(Figure1a and Figure1d). As the winding current surpasses the threshold,the control circuitry turns OFF the sink switch for a fixed period or rent recirculates and decays slowly towards zero(Fig and Figure1e).At the end of the off-time,the cont cuitry turns back ON the sink switch,and the winding c again increases rapidly towards V CC/R(Figure1a an ure1d again).The above sequence repeats to pro current chopping action that limits the winding curren threshold(Figure1g).Chopping only occurs if the w current reaches the threshold.During a change in the tion of the winding current,the diodes provide a deca for the initial winding current(Figure1c and Figur Since the bridge shorts the winding for a fixed perio type of chopper amplifier is commonly referred to as off-time chopper.L6(a)01187803(b)01187804(c)01187805(d)01187806(e)01187807(f)01187808(g)01187809FIGURE 1.Chopper Amplifier Chopping States:Full V CC Applied Across the Winding (a)and (d),Shorted Winding (b)and (e),Winding Current Decays During a Change in the Direction of the Winding Current (c)and (f),and theChopped Winding Current (g)7The LMD18245incorporates all the circuit blocks needed to implement a fixed off-time chopper amplifier.These blocks include:an all DMOS,full H-bridge with clamp diodes,an amplifier for sensing the load current,a comparator,a monostable,and a DAC for digital control of the chopping threshold.Also incorporated are logic,level shifting and drive blocks for digital control of the direction of the load current and braking.THE H-BRIDGEThe power stage consists of four DMOS power switches and associated body diodes connected in an H-bridge configura-tion(Figure2).The time constant to charge or discharge any inductor,in this case the motor windings,is defined as:τ=L/Rwhere L is the winding inductance,and R is the sum of the series resistance in the current path including the winding resistance.Turning ON a source switch and a sink switch in opposite halves of the bridge forces the full supply voltage less the creases exponentially towards a limit dictated by the voltage,the switch drops(I x R DS(ON)),and the w resistance.However,the winding current exponential increase will end when the current chopping circui comes active.Subsequently turning OFF the sink switch causes a v transient that forward biases the body diode of the source switch.The diode clamps the transient at one drop above the supply voltage and provides an alte current path.While the bridge remains in this state,it tially shorts the winding,the winding current recirculat decays exponentially towards zero at a rate that is d by the L/R time constant.During a change in the direction of the winding curren the switches and the body diodes provide a decay p the initial winding current(Figure3).During actual motor operation there are many variabl can effect the motor winding magnetic behavior and mance.Resonance,eddy currents,friction,motor lo damping,temperature coefficients of the windings,are few.These are all issues that are beyond the scope this data sheet.L80118781001187811FIGURE2.The DMOS H-Bridge9分销商库存信息: NATIONAL-SEMICONDUCTOR LMD18245T/NOPB。

Package
Name
PBSS4350Z
SC-73
Description
plastic surface-mounted package with increased heatsink; 4 leads
Version SOT223
7. Marking
Table 4. Marking codes Type number PBSS4350Z
2 / 12
Nexperia
PBSS4350Z
50 V low VCEsat NPN transistor
12. Soldering
1.3 1.2 (4×) (4×)
7 3.85 3.6 3.5
0.3
4
3.9 6.1 7.65
1
2
3
2.3
2.3
1.2 (3×)
1.3 (3×)
6.15
Fig. 9. Reflow soldering footprint for SC-73 (SOT223)
8.9
6.7
1.9 4
6.2
8.7
1
2
3
1.9 (3×)
2.7
2.7
1.1
1.9 (2×)
Fig. 10. Wave soldering footprint for SC-73 (SOT223)
solder lands solder resist solder paste occupied area Dimensions in mm
4. Quick reference data
Table 1. Quick reference data
Symbol
Parameter

6˚
0.5+−00..42
6˚
0.5+−00..42
7.0+−00..27
7.0+−00..27
Product mass : approx. 0.1g
Sheet No.: D2-A04801EN
2
元器件交易网
Date code (2 digit)
A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001
Sheet No.: D2-A04801EN
1
Date Nov. 28. 2003
© SHARP Corporation
元器件交易网
■ Internal Connection Diagram
1
6
5
Amp.
3
4
1 Anode 3 Cathode 4 GND 5 VO (Open collector) 6 VCC
Factory identification mark
Epoxy resin
5.3±0.3 45˚
(Unit : mm)
2. Mini-flat Package (VDE0884 option) [ex. PC410L0YIP]
1.27±0.25
3.6±0.3
1.27±0.25
SHARP mark "S"
3. Package resin : UL flammability grade (94V-0)
■ Applications
1. Programmable controllers 2. Inverter
∗ "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing circuit integrated onto a single chip.

LMC6009LMC6009 9 Channel Buffer Amplifier for TFT-LCDLiterature Number: SNOS786ALMC60099Channel Buffer Amplifier for TFT-LCDGeneral DescriptionThe LMC6009is a CMOS integrated circuit that buffers 9reference voltages for gamma correction in a Thin Film Transistor Liquid Crystal Display (TFT-LCD).Guaranteed to operate at both 3.3V and 5V supplies,this integrated circuit contains nine,independent unity gain buffers that can source 130mA into a capacitive load without oscillation.The LMC6009is useful for buffering gamma voltages into column drivers that employ the resistor-divider architecture.High output current capability and fast settling characteristics of this device improve display quality by minimizing rise time errors at the outputs of the column driver.The integration of nine buffers and a multiplexer eliminates the need for dis-crete buffers and a separate multiplexer (MUX)chip on the panel.The LMC6009is available in 48-pin surface mount TSSOP .Featuresn Number of inputs18n 3.3V and 5V operation n Supply current 3.5mA n Settling time3µsn A/B channel inputs for asymmetrical Gamma n Number of outputs9n Number of control inputs1nBuilt-in thermal shutdown protectionApplicationsn VGA/SVGA TFT-LCD drive circuits n Electronic Notebooks n Electronic Gamesn Personal Communication Devices nPersonal Digital Assistants (PDA)Application in VGA/SVGA TFT-LCDOrdering InformationPackage Temperature Range Transport MediaNSC Drawing48-pin TSSOP−20˚C–+75˚C MTD48LMC6009MT LMC6009MTXTape and Reel DS012533-1©2001National Semiconductor Corporation please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.ESD Tolerance 1.0kV Input Voltage GND–0.3V≤V+≤V DD+0.3V DC Supply Voltage(V DD)−0.3to+6.5V DC Operating Temperature−20˚C to+75˚C Storage Temperature Range−55˚C to+150˚C Operating Ratings(Note1)Supply Voltage 2.7V≤V DD Frequency DC Thermal Resistance(θJA)Derating8.703V DC Electrical CharacteristicsUnless otherwise specified,all limits are guaranteed for T J=25˚C,and V DD=3.0V DC.Symbol Parameter Conditions Min Typ Max V DD Supply Voltage 2.7 3.0 3.3 V OS Offset Voltage R S=10k20 I B Input Bias Current1500V OL Output Voltage,Low Amp A8and A9I SINK=13mA GND+ 0.2Amp A1–A7 I SINK=13mA GND+ 0.6V OH Output Voltage,High Amp A1and A2I SOURCE=13mAV DD–0.2Amp A3–A9I SOURCE=13mAV DD–0.6I SC Output Short Circuit Current V OUT-1.65V(Note1)80150I DD Supply Current No Load 3.55∆V L Load Regulation V IN=0.3–3V DCI SOURCE=13mA−10I SINK=13mA+10 V IH A/B Switch Logic Voltage,High Select A2V IL A/B Switch Logic Voltage,Low Select B0.8 I IH A/B Switch Logic Current,High 1.5 I IL A/B Switch Logic Current,Low1 A V Voltage Gain0.985Note1:See Test Circuit(Figure2)5V DC Electrical CharacteristicsUnless otherwise specified,all limits are guaranteed for T J=25˚C,and V DD=5V DC.Symbol Parameter Conditions Min Typ Max V DD Supply Voltage 4.55 5.5 V OS Offset Voltage R S=10k20 I B Input Bias Current1500V OL Output Voltage,Low Amp A8and A9I SINK=20mA GND+ 0.2Amp A1–A7 I SINK=20mA GND+ 1.0V OH Output Voltage,High Amp A1and A2I SOURCE=20mAV DD–0.2Amp A3–A9I SOURCE=20mAV DD–1.0I SC Output Short Circuit Current V OUT-1.65V(Note1)120200I DD Supply Current No Load 4.56 L2J DD DCSymbol Parameter Conditions Min Typ Max Units ∆V L Load Regulation V IN=0.5–4.5V DC−10mVI SOURCE=20mAI SINK=20mA+10mVV IH A/B Switch Logic Voltage,High Select A2VV IL A/B Switch Logic Voltage,Low Select B0.8VI IH A/B Switch Logic Current,High 1.5µAI IL A/B Switch Logic Current,Low1µAA V Voltage Gain0.985V/V AC Electrical CharacteristicsUnless otherwise specified,all limits are guaranteed for T J=25˚C,and V DD=3V DC.Symbol Parameter Conditions Min Typ Max Units T S1Settling Time1(Note2)I DC=13mA(Sink/Source)36µsT S2Settling Time2(Note2)I DC=13mA(Sink/Source)36µs Note2:See test circuits(Figure3,Figure4and Figure5)DS012533-2FIGURE1.Rise and Fall Times at Outputs3Description of Pins;LMC6009Pin 1NC Pin 25NC Pin 2NC Pin 26NC Pin 3NC Pin 27NC Pin 4A1in (A)Pin 28NC Pin 5A1in (B)Pin 29A/B Switch Pin 6A2in (A)Pin 30V DD (C)Pin 7A2in (B)Pin 31GND (C)Pin 8A3in (A)Pin 32A9out Pin 9A3in (B)Pin 33A8out Pin 10A4in (A)Pin 34A7out Pin 11A4in (B)Pin 35A6out Pin 12A5in (A)Pin 36A5out Pin 13A5in (B)Pin 37GND (B)Pin 14A6in (A)Pin 38V DD (B)Pin 15A6in (B)Pin 39A4out Pin 16A7in (A)Pin 40A3out Pin 17A7in (B)Pin 41A2out Pin 18A8in (A)Pin 42A1out Pin 19A8in (B)Pin 43GND (A)Pin 20A9in (A)Pin 44V DD (A)Pin 21A9in (B)Pin 45NC Pin 22NC Pin 46NC Pin 23NC Pin 47NC Pin 24NCPin 48NCDS012533-3FIGURE 2.DS012533-4FIGURE 3.A1:13mA Source onlyA2–A4:13mA Sink/SourceDS012FIGURE 4.13mA Sink/SourceDS012FIGURE 5.A6–A8:13mA Sink/SourceA9:13mA Sink OnlyL 4ApplicationsThe LMC6009is useful for buffering the nine reference voltages for gamma correction in a TFT-LCD as shown in Figure7.The A/B channel inputs allow the user to alternate two sets of gamma references to compensate for asymmetri-cal Gamma characteristic during Row Inversion.The LMC6009eliminates the need for nine external switches or an18-to-9multiplexer.Since the buffers in the LMC6009draw extremely low bias current(1.5µA max),large resistance values can be used in the reference voltage string.This allows the power dissipa-tion in the gamma reference circuit to be minimized.The nine buffers are guaranteed to deliver80mA to the load, allowing the pixel voltages of the TFT-LCD to settle very quickly.DS012533-8FIGURE6.Block Diagram of LMC6009 5Example:Below is a calculation of pixel charge time(for a black to black transition)in a VGA display operating at a vertical refresh rate of60Hz,with a panel capacitance of 50pF per sub-pixel:A full black to black transition represents the maximum charging time for the panel,since it requires that the panel capacitance be driven by a4V swing from node V REF1 (Figure7).Total capacitive load presented to the LMC6009isC L=50pF x3x640=96nFOutput current of the LMC6009is:I SC=80mAHence,slew time t SLEW=(96nF x4V)/80mA=3.07µs The total line time for a VGA system is approximately34µs. Therefore,the LMC6009easily meets the drive require-ments for the application.The input resistance seen between the V REFn and V REF(n+1)inputs,(where n=0thru8)of the Column Driver(Figure7)also draw current fro LMC6009.Thus,the actual current available for charg panel capacitance is:Ipx=80mA-(V VREF1–V VREF2)/R CDwhereV V REFn=Voltage at node V REFn,V VREF(n+1)=Voltage at node V REF(n+1),andR CD=Column driver input resistance between VREFn and VREF(n+1)Since the LMC6009is capable of sourcing80mA,th charging time is primarily limited only by the length R CD.C L time constant.To implement a high quality d column drivers that allow the shortest possible time co (lower values of R CD)are desirable.However,lower of R CD result in increased system quiescent power d tion.It is therefore important to optimize system perfor by carefully considering speed vs power tradeoffs.DS012533-7FIGURE7. L6LIFE SUPPORT POLICYNATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION.As used herein:1.Life support devices or systems are devices or systems which,(a)are intended for surgical implant into the body,or (b)support or sustain life,and whose failure to perform when properly used in accordance with instructions for use provided in the labeling,can be reasonably expected to result in a significant injury to the user.2.A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system,or to affect its safety or effectiveness.National Semiconductor Corporation AmericasTel:1-800-272-9959Fax:1-800-737-7018Email:support@National Semiconductor EuropeFax:+49(0)180-5308586Email:europe.support@Deutsch Tel:+49(0)6995086208English Tel:+44(0)8702402171Français Tel:+33(0)141918790National Semiconductor Asia Pacific Customer Response Group Tel:65-2544466Fax:65-2504466Email:ap.support@National Semiconductor Japan Ltd.Tel:81-3-5639-7560Fax:81-3-5639-7507All dimensions are in millimeters48-Lead Molded Thin Shrink Small Outline Package,JEDECNS Package Number MTD48National does not assume any responsibility for use of any circuitry described,no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improveme and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products a sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work rig or other TI intellectual property right relating to any combination,machine,or process in 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associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasona be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their product and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may b provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products such safety-critical applications.TI 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