Application Note for Derating setup

DATA SHEETIntroduction Performance Characteristics Mechanical Dimensions Characteristic Curves ReliabilityPacking Specification PrecautionP 2P 3P 5P 6P 9P 10P 11 CITILED COB SeriesStandard Type.Ra70 Min., Ra80 Min. Model CLU04Q-1212E11. Introduction1-1. Product Description1-2. Features・Mechanical Dimensions :28 × 28 × 1.4 (mm)・Package Structure :Aluminum Base Chip on Board ・Reference Assembly :M3 screw, Connector ・CRI (Ra):70 Min., 80 Min.・Nominal CCT :3,000K, 4,000K, 5,000K ( CRI(Ra) 70Min. )2,700K, 3,000K, 3,500K, 4,000K, 5,000K, 5,700K, 6,500K ( CRI(Ra) 80Min. )・Chromaticity Range:3-step Ellipse, the center refers to ANSI C78.377:2017. ( CRI(Ra) 70Min. )2-step Ellipse, the center refers to ANSI C78.377:2017. ( CRI(Ra) 80Min. )・Thermal Resistance :0.32C/W ・Maximum drive current :2760mA ・UL recognized component (E358566)・RoHS compliant・Better die arrangement for optics・Wide range of luminous flux and high efficacy・Improved lumen density compared with previous version CLU04Q -1212E1-303L7X4[1][2][3][4][5][1]:[2]:[3]:[4]:[5]:Nominal CCT CRI (Ra)Product NomenclatureCLU04Q 12123000K 70 Min.Product shape Die count in series Die count in parallel CITIZEN ELECTRONICS is the first COB manufacturer.With many years of knowledge, experience, and advanced packaging technology, we continue to produced high quality and highly reliable products.The new COB series, Version9, while keeping the conventional product lineup and package sizes, achieves both high color quality (2 Step ellipse) and higher driving capability.In addition, efficacy and reliability are improved by selecting superior materials and optimizing production processes.Our highly reliable and efficient COB light source contributes to the realization of a circular economy through energy saving and reduction of carbon emissions.2. Performance Characteristics2-1. Electro Optical Characteristics2-2. Absolute Maximum RatingsSymbol RatingPi 116.5*1If 2760*1Ir 1Top -40 ~ +100Tst -40 ~ +100Tc 120*2Tj140*3*2. Refer to 3. Outline drawing for Tc measurement point.*3. Junction temperature calculation formula : Tj = Tc + Rj-c × PiParameterInput Power (W)Forward Current (mA)Reverse Current (mA)Storage Temperature (C)Case Temperature (C)Junction Temperature (C)Operating Temperature (C)*1. Input power and forward current are the values when the LED is used within the range of the derating curve in this data sheet.( Tj=85C )Ra R9Tc25C*Min.Min.Min.Typ.Typ.Typ.Min.Typ.Max.CLU04Q-1212E1-303L7X43000K 70-5,6566,4286,9251761,08031.433.836.20.32CLU04Q-1212E1-403L7X44000K 70-5,6896,4656,9651771,08031.433.836.20.32CLU04Q-1212E1-503L7X45000K 70-5,7106,4896,9911781,08031.433.836.20.32CLU04Q-1212E1-272M2X22700K 8004,9915,6736,1111551,08031.433.836.20.32CLU04Q-1212E1-302M2X23000K 8005,1845,8926,3471611,08031.433.836.20.32CLU04Q-1212E1-352M2X23500K 8005,3036,0276,4931651,08031.433.836.20.32CLU04Q-1212E1-402M2X24000K 8005,4256,1666,6421691,08031.433.836.20.32CLU04Q-1212E1-502M2X25000K 8005,4096,1476,6231681,08031.433.836.20.32CLU04Q-1212E1-572M2X25700K 8005,3546,0856,5561671,08031.433.836.20.32CLU04Q-1212E1-652M2X26500K805,3046,0276,4941651,08031.433.836.20.32Notes :1. Citizen Electronics maintains a tolerance of ± 10% on luminous flux measurements.2. Citizen Electronics maintains a tolerance of ± 3% on forward voltage measurements.3. Citizen Electronics maintains a tolerance of ± 2 on Ra measurements. * : Values of Luminous flux at Tc=25C are provided as reference only.Product codeForward Current( mA )Thermal Resistance Rj-c ( C/W )CRI Nominal CCTLuminous flux( lm )Efficacy ( lm/W )Forward Voltage( V )Tj85C2,700K ( 0.4578, 0.4101)3,000K( 0.4339, 0.4033)3,500K ( 0.4078, 0.3930)4,000K ( 0.3818, 0.3797)5,000K ( 0.3446, 0.3551)5,700K ( 0.3287, 0.3425)6,500K( 0.3123, 0.3283)3-step Ellipse.2-step Ellipse.Color RegionNominal CCT Center Point ( x, y )---0.003540.00236-0.00507-0.001983-step 2-step 0.0083452.970.00634-0.00278 ( Rated current, Tj=85C )53.170.005560.004080.002720.00516-0.0027457.28Oval parameterMajor Axisa Minor Axisb E llipse Rotation Angleθ3-step 2-step * Color region stay within 3-step / 2-step ellipse from the chromaticity center.* The chromaticity center refers to ANSI C78.377:2017.* θ is the angle between the major axis of the ellipse and the x-axis, and a and b are the major and minor semi-axes of an ellipse.54.0059.6258.3859.460.009390.006260.004020.002680.00446-0.001900.008220.005482-3. Chromaticity CharacteristicsNote : Citizen Electronics maintains chromaticity ( x, y ) +/-0.0050.300.350.400.450.300.350.400.450.50yxx-y chart CIE19314,000K3,000KBlack Body Locus2,700K3,500K5,000K5,700K6,500K2-step 3-step3. Mechanical DimensionsUnit : mmTolerances unless otherwise specified : +/-0.3・Internal Circuit12 S 12 P Protection deviceLED deviceCathodeAnodeMarking 1 : Serial No.Marking 2 : Code No.CRI CCTDie count in parallel Die count in seriesCLU0xQ seriesMarking 3 : Data MatrixAN 12 12 ** ** *4. Characteristic Curves4-1. Forward Current Characteristics / Temperature CharacteristicsForward Current vs. Forward VoltageForward Current vs. Relative Luminous FluxTc=25CTc=25CCase Temperature vs. Forward VoltageCase Temperature vs. Relative Luminous FluxIf=1080mAIf=1080mA30.032.034.036.038.040.00100020003000V f [V ]If [mA]0%50%100%150%200%250%100020003000R e l a t i v e L u m i n o u s F l u x [a .u .]If [mA]32.033.034.035.036.0255075100125V f [V ]Tc [C]0%20%40%60%80%100%120%0255075100125R e l a t i v e L u m i n o u s F l u x [a .u .]Tc [C]4-2. Optical CharacteristicsTj=85CIf=1080mASpectrum : CRI(Ra) 80 Min.0%10%20%30%40%50%60%70%80%90%100%380430480530580630680730780R a d i a t i v e I n t e n s i t yWave length [nm]6,500K5,700K 5,000K 4,000K 3,500K 3,000K2,700KTj=85CIf=1080mASpectrum : CRI(Ra) 70 Min.0%10%20%30%40%50%60%70%80%90%100%380430480530580630680730780R a d i a t i v e I n t e n s i t yWave length [nm]5,000K4,000K3,000K4-2. Optical Characteristics (continued)4-3. Derating CharacteristicsRadiation Characteristic0%20%40%60%80%100%X Y80°70°60°50°40°30°20°10°-80°-70°-60°-50°-20°-30°-40°-10°90°-90°Case Temperaturevs. Allowable Forward Current1000200030000255075100125I f [m A ]Tc [C]5. Reliability5-1. Reliability Test5-2. Failure Criteria-40 C × 30 minutes – 100 C × 30 minutes, 100 cycle85 C, 85 %RH for 500 hoursThermal Shock TestContinuous Operation Test High Temperature Storage TestLow Temperature Storage Test Moisture-proof Test If=1080mA , Tj=140C (with Al-fin) ×1000hoursTest Item100 C × 1000 hours -40 C × 1000 hours Test ConditionIf=1080mA , Ta= 25C (with Al-fin) ×1000hours ( Tc=25C )U defines the upper limit of the specified characteristics. S defines the initial value.Note : Measurement shall be taken between 2 hours and 24 hours, and the test pieces should be return to the normal ambient conditions after the completion of each test.Total Luminous FluxΦvIf=1080mA<S × 0.85Measuring Item Symbol Measuring ConditionFailure CriteriaForward Voltage Vf If=1080mA >U × 1.1Unit : mmProduct : 30 pcs/tray1. TYPEe.g. CLU04Q-1212E12. P.No. ( Customer's P/N )3. Lot No.2175015(b)(a) Last two digit of the year 21 : Year 2021(b) Production month 7 : JulyNote: October, November and December are designated X,Y and Z.(c) CE's control number 4. Quantity(a)(c)Example of indication labele.g. 6. Packing Specification6-1. PackingAn empty tray is placed on top of a 6-tier tray which contain 30 pieces each.( Smallest packing unit : 180 pieces )A label with product name, quantity and lot number is placed on the upper empty tray.Tray ( Dimensions: 310 x 210 x 12 mm / Materials: Electrically conductive PS ) CUSTOMERTYPE P.NO Lot No Q'ty: CLU***-******-******* : ****** : ******* : ***--- ( 1 ) --- ( 2 ) --- ( 3 ) --- ( 4 )7. Precaution7-1. Handling with care for this product-Both the light emitting area and white rim around the light emitting area is composed of resin materials.Please avoid the resin area from being pressed, stressed, rubbed, come into contact with sharp metal nail(e.g. edge of reflector part) because the function, performance and reliability of this product are negatively impacted.-Please be aware that this product should not come into contact with any other parts while incorporating in your lightingapparatus or your other products.-Please be aware that careful handling is required after the attachment of lead wires to prevent the application of any loadto the connections.-For more information, please refer to application note "Instruction Manual(COB LED Package)".7-2. Countermeasure against static electricity-Handling of this product needs countermeasures against static electricity because this is a semiconductor product.-Please take adequate measures to prevent any static electricity being produced such as the wearing of a wristband oranti-static gloves when handling this product.-Every manufacturing facility in regard to the product (plant, equipment, machine, carrier machine and conveyance unit)should be connected to ground and please avoid the product to be electric-charged.-ESD sensitivity of this product is over 1000V (HBM, based on JEITA ED-4701/304).-After assembling the LEDs into your final product(s), it is recommended to check whether the assembled LEDs aredamaged by static electricity (electrical leak phenomenon) or not.-It is easy to find static damaged LED dies by a light-on test with the minimum current value.7-3. Caution of product assembly-Regarding this product assembling on the heat sink, it is recommended to use M3 screw.It might be good for screw tightening on the heat sink to do temporary tightening and final tightening.In addition, please don’t press with excess stress on the product.-The condition of the product assembling on the heat sink and the control of screw tightening torque needs to be optimized according to the specification of the heat sink.-Roughness, unevenness and burr of surface negatively impact thermal bonding between the product and heat sink andincrease heat thermal resistance between them.Confidence of thermally and mechanical coupling between the product and heat sink are confirmed by checkingthe mounting surface and measuring the case temperature of the product.-In order to reduce the thermal resistance at assembly, it might be good to use TIM (Thermal Interface Material) on whole contact surface of the product.In case of using thermal grease for the TIM, it might be good to apply uniformly on the contact surface of the product.In case of using thermal sheet for the TIM, it might be good to make sure that the product is NOT strained by stress when the screws are tightened for assembly.-For more information, please refer to application note "Instruction Manual(COB LED Package)".7-4. Thermal Design-The thermal design to draw heat away from the LED junction is most critical parameter for an LED illumination system. High operating temperatures at the LED junction adversely affect the performance of LED’s light output and lifetime. Therefore the LED junction temperature should not exceed the absolute maximum rating in LED illumination system. -The LED junction temperature while operation of LED illumination system depends upon thermal resistance of internal LED package (Rj-c), outer thermal resistances of LED package, power loss and ambient temperature. Please take both of the thermal design specifications and ambient temperature conditions into consideration for the setting of driving conditions.-For more information, please refer to application note "Thermal Management", "Instruction Manual(COB LED Package)".7-5. Driving Current-A constant current is recommended as an applying driving current to this product.In the case of constant voltage driving, please connect current-limiting resistor to each products in series and control the driving current to keep under the absolute maximum rating forward current value.-Electrical transient might apply excess voltage, excess current and reverse voltage to the product(s).They also affect negative impact on the product(s) therefore please make sure that no excess voltage, no excess current and no reverse voltage is applied to the product(s) when the LED driver is turn-on and/or turn-off.-For more information, please refer to application note "Driving", "Instruction Manual(COB LED Package)".7-6. Lighting at a minimum current value-A minimum current value of lighting of all dice is 15mA.When a minimum current is applied, LED dice may look different in their brightness due to the individual difference of the LED element, and it is not a failed product.7-7. Electrical Safety-This product is designed and produced according to IEC 62031:2008(IEC 62031:2008 LED modules for general lighting. Safety specification)-Dielectric voltage withstand test has been conducted on this product to see any failure after applyingvoltage between active pads and aluminum section of the product, and to pass at least 500V.-Considering conformity assessment for IEC62031:2008, almost all items of the specification depend uponyour final product of LED illumination system.Therefore, please confirm with your final product for electrical safety of your product.As well, the products comply with the criteria of IEC62031:2008 as single LED package.- A minimum current value of lighting of all dice is 60 mA. When a minimum current is applied, LED dice may look different in their brightness due tothe individual difference of the LED element, and it is not a failed product.7-8. Recommended soldering Condition (This product is not adaptable to reflow process.) -For manual solderingPlease use lead-free soldering.Soldering shall be implemented using a soldering bit at a temperature lower than 350C, and shall befinished within 3.5 seconds for one land.No external force shall be applied to resin part while soldering is implemented.Next process of soldering should be carried out after the product has return to ambient temperature.Contacts number of soldering bit should be within twice for each terminal.* Citizen Electronics cannot guarantee if usage exceeds these recommended conditions.Please use it after sufficient verification is carried out on your own risk if absolutely necessary.-For more information, please refer to application note "Instruction Manual(COB LED Package)".7-9. Eye Safety-The International Electrical Commission (IEC) published in 2006 IEC 62471”2006 Photobiological safety of lamps and lamp systems ” which includes LEDs within its scope.When sorting single LEDs according to IEC 62471, almost all white LEDs can be classifiedas belonging to either Exempt Group (no hazard) or Risk Group 1 (low risk).-However, Optical characteristics of LEDs such as radiant flux, spectrum and light distribution are factorsthat affect the risk group determination of the LED, and especially a high-power LED, that emits lightcontaining blue wavelengths,might have properties equivalent to those of Risk Group 2 (moderate risk).-Great care should be taken when directly viewing an LED that is driven at high current, has multipleuses as a module or when focusing the light with optical instruments, as these actions might greatlyincrease the hazard to your eyes.-It is recommended to regard the evaluation of stand-alone LED packages as a referenceand to evaluate your final product.7-10. This product is not designed for usage under the following conditions.If the product might be used under the following conditions, you shall evaluate its effect and appropriate them. In places where the product might:-directly and indirectly get wet due to rain and/or at place with the fear.-be damage by seawater and/or at place with the fear-be exposed to corrosive gas (such as Cl2, H2S, NH3, SOx, NOx and so on) and/or at place with the fear.-be exposed to dust, fluid or oil and/or at place with the fear.Precautions with regard to product use(1) This document is provided for reference purposes only so that CITIZEN ELECTRONICS' products are used as intended. CITIZEN ELECTRONICS neither makes warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property rights or any other rights of CITIZEN ELECTRONICS or any third party with respect to the information in this document. Before purchasing or using any CITIZEN ELECTRONICS' products listed in this document, please confirm the latest product information with a CITIZEN ELECTRONICS‘s sales office, and formal specifications must be exchanged and signed by both parties prior to mass production.(2) All information included in this document such as product data, diagrams, charts, is current as of the date this document is issued.Such information, however, is subject to change without any prior notice.(3) CITIZEN ELECTRONICS has used reasonable care in compiling the information included in this document, but CITIZEN ELECTRONICS assumes no liability whatsoever for any damages incurred as a result of errors or omissions in the information included in this document.(4) Absent a written signed agreement, except as provided in the relevant terms and conditions of sale for product, and to the maximum extent allowable by law, CITIZEN ELECTRONICS assumes no liability whatsoever, including without limitation, indirect, consequential, special, or incidental damages or loss, including without limitation, loss of profits, loss of opportunities, business interruption and loss of data, and disclaims any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or no infringement.(5) Though CITIZEN ELECTRONICS works continually to improve products' quality and reliability, products can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards to minimize risk and avoid situations in which a malfunction or failure of a product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. In addition, customers are also responsible for determining the appropriateness of use of any information contained in this document such as application cases not only with evaluating by their own but also by the entire system. CITIZEN ELECTRONICS assumes no liability for customers' product design or applications.(6) The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances). Consult Citizen Electronics’s sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health ( such as for airplane, aerospace, submersible repeaters, nuclear reactor control system, automobiles, traffic control equipment, life support system and safety devices ) . This LED does not comply with ISO/TS 16949 (IATF16949) and is not intended for automotive applications.(7) The customer shall not reserve engineer by disassembling or analysis of the LEDs without having prior written consent from Citizen Electronics. When defective LEDs are found, the customer shall inform Citizen Electronics before disassembling or analysis.(8) When exporting our products, please ensure conformance with applicable laws and regulations and take appropriate actions such as obtaining an export license.(9) Please do not use or supply our products for any weapons of mass destruction (WMD) or for any other military purposes.(10) Please contact CITIZEN ELECTRONICS' sales office if you have any questions regarding the information contained in this document, or if you have any other inquiries.is a trademark or a registered trademark of CITIZEN ELECTRONICS CO., LTD. JAPAN. **********************.co.jp。

Manuals+— User Manuals Simplified.MEAN WELL XLG-25 25W Constant Power Mode LED Driver User ManualHome » MEAN WELL » MEAN WELL XLG-25 25W Constant Power Mode LED Driver User ManualContents1 XLG-25 25W Constant Power Mode LEDDriver2 Features3 Applications4 GTIN CODE5 Description6 Model Encoding7 SPECIFICATION8 Block Diagram9 DIMMING OPERATION10 OUTPUT LOAD vs TEMPERATURE11 STATIC CHARACTERISTIC12 POWER FACTOR (PF) CHARACTERISTIC13 TOTAL HARMONIC DISTORTION (THD)14 EFFICIENCY vs LOAD15 LIFE TIME16 Mechanical Specification17 Documents / ResourcesXLG-25 25W Constant Power Mode LED Driver25W Constant Power Mode LED Driver/Upload/PDF/LED_EN.pdf Constant Power mode outputType Ip Level Function Note A IP67lo adjustable through built in potentiometer.In StockAB IP67lo adjustable through built in potentiometer3 in 1 dimming function (0-10Vdc, 10V PWM signal and resistance)In StockOPEN CIRCUITVOLTAGE (max.)57VCURRENT ADJ. RANGE0.25 ~ 1.05ASETUP, RISE TIME Note.3500ms, 100ms/115VAC, 230VACINPU T VOLTAGE RANGE Note.490 ~ 305VAC127 ~ 431VDC(Please refer to “STATIC CHARACTERISTIC” section)FREQUENCYRANGE47 ~ 63HzPOWER FACTORPF≧0.97/115VAC, PF≧0.95/230VAC, PF≧0.92/277VAC@full load(Please refer to “POWER FACTOR (PF) CHARACTERISTIC” section)TOTAL HARMONIC DISTORTIONTHD< 10%(@load¾50%/115VC,230VAC; @load¾75%/277VAC)(Please refer to “TOTAL HARMONIC DISTORTION(THD)” section)EFFICIENCY (Typ.) Note.1088%AC CURRENT0.29A / 115VAC 0.15A / 230VAC 0.13A/277VACINRUSH CURRENT(Typ.)COLD START 50A(twidth=350μs measured at 50% Ipeak) at 230VAC; Per NEMA 41MAX. No. of PSUs on 16A CIRCUIT BREAKER5 units (circuit breaker of type B) / 8 units (circuit breaker of type C) at 230VACLEAKAGE CURRENT<0.75mA / 277VACNO LOAD / STANDBY POWERCONSUMPTIONNo load power consumption <0.5W for A,<0.75W for I series Standby power consumption <0.5W for AB-Type(Dimming OFF)PRO TEC TION OVER POWER110-150% Over Power Protection, recovers automatically after fault condition is removedOVER CURRENTConstant current limiting, recovers automatically after fault condition is removedSHORT CIRCUITConstant current limiting, recovers automatically after fault condition is removedOVER TEMPERATUREHiccup mode, recovers automatically after fault condition is removedINPUT OVER VOLTAGE Note.8320 ~ 370VAC (Shut down output voltage when the input voltage exceeds protectionvoltage,recovers automatically after fault condition is removed)Can survive input voltage stress of 440Vac for 48 hours @ tc 75℃ maxENVI RON MEN T WORKING TEMP.Tcase=-40 ~ +85℃ (Please refer to “ OUTPUT LOAD vs TEMPERATURE” section)MAX. CASE TEMP.Tcase=+85℃WORKING HUMIDITY20 ~ 95% RH non-condensingSTORAGE TEMP.-40 ~ +80℃TEMP. COEFFICIENT±0.03%/℃ (0 ~ 60℃)VIBRATION10 ~ 500Hz, 5G 12min./1cycle, period for 72min. each along X, Y, Z axesSAF ETY & EM C SAFETY STANDARDS Note.8UL8750(type”HL”), CSA C22.2 No. 250.13-12; ENEC AS/NZS IEC BS EN/EN61347-1, AS/NZS BS EN/EN61347-2-13 independent, BS EN/EN62384; IP67; GB19510.1,GB19510.14, EAC TP TC 004,J61347-1(H29), J61347-2-13(H29),KC61347-1,KC61347-2-13,IS15885(Part2/Sec13)( for XLG-25I type only); NOM-058-SCFI-2017 approvedWITHSTAND VOLTAGEI/P-O/P:3.75KVAC I/P-FG:2.0KVAC O/P-FG:1.5KVACISOLATION RESISTANCEI/P-O/P, I/P-FG, O/P-FG:100M Ohms / 500VDC / 25℃/ 70% RHEMC EMISSIONParameter Standard Test Level/NoteConductedBSEN/EN55015(CISPR15) ,GB/T17743—–RadiatedBSEN/EN55015(CISPR15) ,GB/T17743—–Harmonic CurrentBS EN/EN61000-3-2 ,GB/T17625.1Class C @load≥50% Voltage Flicker BS EN/EN61000-3-3—–EMC IMMUNITYBS EN/EN61547Parameter Standard Test Level/NoteESD BS EN/EN61000-4-2Level 3, 8KV air ; Level 2,4KV contactRadiated BS EN/EN61000-4-3Level 3EFT/Burst BS EN/EN61000-4-4Level 3Surge BS EN/EN61000-4-54KV/Line-Line 6KV/Line-EarthConducted BS EN/EN61000-4-6Level 3Magnetic Field BS EN/EN61000-4-8Level 4Voltage Dips and Interrupti ons BS EN/EN61000-4-11>95% dip 0.5 periods, 30%dip 25 periods,>95% interruptions 250 periodsOTH ERS MTBF3931.6 K hrs min. Telcordia SR-332 (Bellcore) 399.9Khrs min. MIL-HDBK-217F (25℃)DIMENSION105*63*30mm (L*W*H)PACKING0.41Kg;24pcs/ 10.5Kg/0.68CUFT for A-type 0.42Kg;24pcs/ 11Kg/0.68CUFT for AB-typeNOTE1. All parameters NOT specially mentioned are measured at 230VAC input, rated current and 25℃ of ambienttemperature.2. Please refer to “DRIVING METHODS OF LED MODULE”.3. Length of set up time is measured at first cold Turning ON/OFF the driver may lead to increase of the set uptime.4. De-rating may be needed under low input Please refer to “STATIC CHARACTERISTIC” sections for details.5. The driver is considered as a component that will be operated in combination with final Since EMCperformance will be affected by the complete installation, the final equipment manufacturers must re-qualify EMC Directive on the complete installation again.6. This series meets the typical life expectancy of >50,000 hours of operation when Tcase, particularly tc point (orTMP, per DLC), is about 80℃ or less.7. Please refer to the warranty statement on MEAN WELL’s website at 8. Input over voltage only for XLG-25 I series ,and I series without UL/CSA certificate.9. The ambient temperature derating of 5℃/1000m with fanless models and of 5℃/1000m with fan models foroperating altitude higher than 2000m(6500ft).10. Only for XLG-25-A11. Products sourced from the Americas regions may not have the CCC/PSE/BIS/KC Please contact your MEANWELL sales for more information.12. For any application note and IP water proof function installation caution, please refer our user manual beforehttps:///Upload/PDF/LED_EN.pdf13. Ripple & noise are measured at 20MHz of bandwidth by using a 12″ twisted pair-wire terminated with a 1uf &47uf parallel capacitor.14. To fulfill requirements of the latest ErP regulation for lighting fixture, this LED driver can only be used behind aswitch without permanently connected to the mains.15. If you need the NOM (Mexico) certificate, Please contact MEAN WELL sales representative for details.Block DiagramDRIVING METHODS OF LED MODULEDIMMING OPERATION※ 3 in 1 dimming function (for AB-Type)Output constant current level can be adjusted by applying one of the three methodologies between DIM+ and DIM-:0 ~ 10VDC, or 10V PWM signal or resistance.Direct connecting to LEDs is suggested. It is not suitable to be used with additional drivers.◎Applying additive 0 ~ 10VDC◎ Applying additive 10V PWM signal (frequency range 100Hz ~ 3KHz):◎ Applying additive resistance:Note :1. Min. dimming level is about 8% and the output current is not defined when 0%< Iout<8%.2. The output current could drop down to 0% when dimming input is about 0kΩ or 0Vdc, or 10V PWM signal with0% duty cycle.OUTPUT LOAD vs TEMPERATURESTATIC CHARACTERISTICPOWER FACTOR (PF) CHARACTERISTICTOTAL HARMONIC DISTORTION (THD)XLG-25 series possess superior working efficiency that up to 88% can be reached in field applications.※ 50V Model, Tcase at 75℃LIFE TIMEMechanical SpecificationInstallation ManualPlease refer to : /manual.html。

AN010699 XC61C Series Voltage DetectorsApplication Notes=============== Index ===============Introduction P-2Standard Circuits P-2Notes on Use P-3Application Circuits1. Power ON Reset P-72. High V oltage Detection P-93. Hysteresis Range Enlargement P-11Appendix P-12Time ChartFunctional Explanation1.The products and product specifications contained herein are subject to changewithout notice to improve performance characteristics. Consult us, or ourrepresentatives before use, to confirm that the information in these notes is up todate.2.We assume no responsibility for any infringement of patents, patent rights, or otherrights arising from the use of any information and circuitry in these notes.3.Please ensure suitable shipping controls (including fail-safe designs and agingprotection) are in force for equipment employing products listed in these notes.4.The products in these notes are not developed, designed, or approved for use withsuch equipment whose failure of malfunction can be reasonably expected to directlyendanger the life of, or cause significant injury to, the user.(e.g. Atomic energy; aerospace; transport; combustion and associated safetyequipment thereof.)5.Please use the products listed in these notes within the specified ranges. Shouldyou wish to use the products under conditions exceeding the specifications, pleaseconsult us or our representatives.6.We assume no responsibility for damage or loss due to abnormal use.7.All rights reserved. No part of this document may be copied or reproduced withoutthe prior permission of Torex Semiconductor Ltd.WARNINGAs the voltage detector depends on not only the IC’s characteristics but also on those of the surrounding circuitry, please fully ensure that the ‘notes on use’ provided are followed.In actual operation we suggest that you allow ample margins above the recommended specifications and take the IC’s and the peripheral’s absolute maximum ratings into consideration.r IntroductionThe XC61C series are highly accurate, low power consumption voltage detectors manufactured using laser trimming and CMOS process technologies. The series consists of an output driver circuit, a hysteresis circuit, a comparator and a highly accurate standard voltage supply.Detect voltage has minimal temperature drift. Both CMOS and N-channel open drain output configurations are available.All the above functions are provided in a super mini-mold package that supports high density mounting.r Standard CircuitsCMOS Configuration Nch Open Drain Configurationr Notes on Use1.Oscillation as a result of output current with CMOS output configurationsAs oscillation may occur due to load current (I OUT) with CMOS output configurations if anything which acts like a resistor is present between the V IN pin and the power supply, we recommend that you use Nch open drain output configurations where R IN is used.N.B.When the voltage applied at IN rises, release operations commence and the detector’s output voltage increases. Load current (I OUT) will flow through R L. Because a voltage drop (R IN x I OUT) is produced at the R IN resistor, located between the input (IN) and the V IN pin, the load current will flow via the IC’s V IN pin. The voltage drop will also lead to a fall in the voltage level at the V IN pin.When the V IN pin voltage level falls below the detect voltage level, detect operations will commence. Following detect operations, load current flow will cease and since voltage drop at R IN will disappear, the voltage level at the V IN pin will rise and release operations will begin over again.Oscillation may occur with this “ release – detect – release” repetition.Further, this condition will also appear via means of a similar mechanism during detect operations.Note : Do not use R IN with CMOS outputconfigurations as oscillation may occur.Diagram 1. Oscillation resulting from output current2.Oscillation as a result of through currentPlease note that if a resistor is connected between the V IN pin and the power supply with CMOS output configurations (irrespective of N-channel output configurations), oscillation may occur as a result of through current at the time of voltage release. (Please refer to Diagram 2)Through current is the current that flows excessively when the IC’s internal circuit voltage level changes (during release and detect operations).N.B.When the voltage applied at IN rises, release operations commence, the detector’s output voltage increases and through current flows. Because a voltage drop (R IN x I SS) is produced at the R IN resistor, located between the input (IN) and the V IN pin, this through current will flow via the IC’s V IN pin. The voltage drop will also lead to a fall in the voltage level at the V IN pin.When the V IN pin voltage level falls below the detect voltage level, detect operations will commence. Following detect operations, through current flow will cease and since voltage drop at R IN will disappear, the voltage level at the V IN pin will rise and release operations will begin over again.Oscillation may occur with this “ release – detect – release” repetition.However, since hysteresis exists during detect operations, oscillation is unlikely to occur. In comparison to N-channel output configurations, through current in the final stages is larger with CMOS output configurations, which tends to result in oscillation occurring somewhat more easily.Note : Do not use R IN with CMOS outputDiagram 2. Oscillation resulting from through currentAlways use the N-channel open drain output configuration if an input resistor (R IN) is to be used and/or the input voltage is to be divided. (Please refer to Diagram 3 )With an input resistor (R IN) present, release voltage will rise if a pull up resistor (Rpull) is connected between the V IN – V OUT pins and input voltage is divided between R IN and Rpull. It is therefore recommended that the pull up resistor be connected to the power supply side. (Please refer to Application Circuits 3, page 11)Rpull* Pull up resistor connected to separate power supply * Pull up resistor connected to input Diagram 3. Example circuit with Input Resistor connectedN.B. Please ensure that R IN = less than 10kΩ, C = more than 0.1µFPlease be aware that both detect and release voltages will rise due to voltage drops at R IN brought about by the IC’s supply current.3.Operational errors resulting from steep frequency inputsShould steep start up voltages be input at the V IN pin, frequencies output from V OUT may become distorted so please regulate input frequency start up time (MIN) to a standard of more than several µ seconds/V.4.Power Dissipation PdPlease observe the following points :CMOS(V IN – V OUT) x I OUT< Pd : Release time (PchFET : ON)V OUT x I OUT< Pd : Detect time (NchFET : ON)Should output (V OUT) short to ground during release operations, the resulting heat from the loss at V IN x I OUT may cause damage to the IC so please take all necessary precautions.N-channel open drainV OUT x I OUT< Pd : Detect time5.Pull up resistor with N-channel open drain configurationsIf the pull up resistance value is extremely large, output voltage may drop during release operations as a result of the N-channel transistor leak current within the IC.It is therefore recommended that a pull up resistance of less than 470kΩ be used.(a pull up resistor is not necessary with CMOS output configurations)r Application Circuits1. Power ON reset circuitDiagram. Power ON reset circuitXC61CN seriesPeripherals :R IN: 10kΩC : 3.3µFEx.) When input voltage rises from 0V to 4V,delay time tDLY = 46msec (V DR = 3.0V)(Please refer to the notes on tDL Y below)D : 1S1588Rpull : 100kΩNotes on Use :It is recommended that R IN = less than 10kΩ and that C = more than0.1µF in order to avoid oscillation.Note that the above does not apply to CMOS output (XC61CC series) configurations. (Please refer to ‘Notes on Use 1’, page 3)If pull up is connected to the input, please ensure that the settings forV OUT are not exceeded.Notes :1.The value for delay time tDLY can be calculated as follows :tDL Y = −R IN• C •In (1-V DR/V T) (sec)where V T = Input voltage peak value, V DR = Release voltage2.Output waveforms when power is switched on :Explanation :A power ON reset circuit can be realized by using the N-channel open drain configuration. Delay time during start up is regulated via theexternal input resistor (R IN) and capacitor (C).When power is switched off the electric charge that had charged C is discharged by the diode (D).r Application Circuits2. High voltage detection circuitDiagram. High voltage detection circuitXC61CN seriesPeripherals :R1 : 10kΩR2 : 5kΩEx.) Detect voltage V DF = 3.0VSet-up detect voltage V DH = 9.0VHysteresis range increases from 0.15V(typ) to 0.45V(Please refer to the notes on detect voltage V DH andhysteresis range V HYSH provided below)C : 0.1µFRpull : 100kΩNotes on Use :It is recommended that R1 = less than 10kΩ and that C = more than0.1µF in order to avoid oscillation.Note that the above does not apply to CMOS output (XC61CC series) configurations.Notes :The value for detect voltage V DH and hysteresis range V HYSH can becalculated as follows :V DH = V DF• (R1 + R2) ÷ R2(V)V HYSH = V HYS• (R1 + R2) ÷ R2(V)where V DF = the IC’s detect voltage valueV DH = the actual circuit’s detect voltage valueV HYS = the IC’s hysteresis rangeV HYSH = the actual circuit’s hysteresis rangePlease note that due to the IC’s supply current I SS, V DH will behigher than, and V HYSH will be larger than, the calculated values.Explanation :Should the required voltage detector be unavailable, it is possible to achieve a detect voltage higher than the IC’s established value by usingdivided resistors, but only with N- channel open drain outputconfigurations.r Application Circuits3. Hysteresis range enlargement circuitDiagram. Hysteresis range enlargementXC61CN seriesPeripherals :R1 : 3kΩR2 : 33kΩC IN: 0.1µFEx.) Release voltage V DR = 3.15V, R1=3kΩ, R2=33kΩSet-up release voltage V DR1 = 3.44VRelease voltage therefore increases by 0.29V(Please refer to the notes on release voltage provided below) Notes :The value for release voltage V DR1 can be calculated as follows :V DR1 = V DR• (R1 + R2) ÷ R2where V DR = the IC’s release voltage valueV DR1 = the actual circuit’s release voltage valuePlease note that due to the IC’s supply current I SS, V DR1 will be higher than the calculated values.Explanation :With N- channel open drain output configurations it is possible toenlarge the hysteresis range without having to change detect voltage.N.B. Please use with a value for R1 below 10kΩr AppendixTime ChartFunctional Explanation (CMOS output)1.When input voltage (V IN) rises above detect voltage (V DF), output voltage(V OUT) will be equal to V IN.Note that as a condition of high impedance exists at the V OUT pin with N-channel open drain configurations, pull up voltage can be obtained via pull up resistance.2. When V IN falls below V DF, V OUT will equal ground voltage (V SS).3. When V IN falls to a level below that of the minimum operating voltage(V MIN), output becomes unstable.Note that as the output pin is generally pulled up with N-channel open drain output configurations, output will be equal to pull up voltage.4. When V IN rises above the V SS level, output will be unstable at levels belowV MIN. Between the V MIN and detect release voltage (V DR) levels, the V SS level will be maintained.5. When V IN rises above V DR, V OUT will be equal to V IN.Note that a condition of high impedance exists with N-channel open drainConfigurations (refer to explanation 1).6. The difference between V DR and V DF represents the hysteresis range(V HYS).。

1234567891011121310010080604020100kHz1MHz10MHz100MHz200300400500No.Types1.RO, RM, RE, ROM, RB, RBM, RK, RH, RP , RU, RI, RD, REZ, RKZ, RUZ, RY,RxxTR, R-78xx2.RS, RSO,3.RL, RN, RF, RA, RC, RX4.RSS, RSD, RQS, RQD, RZ5.RTD, RTS, RSZ, R-78Axx SMD6.RV, RW, RxxPxx, RxxP2xx7.R5, R6, R7, REC1.5-, REC1.8-, REC3-, REC5-, REC7.5-8.RAA9.RP08, RP1210.RP08-SMD, REC2.2-SMD, REC3-SMD, REC5-SMD, REC7.5-SMD 11.REC10, REC15, REC20, REC30, REC4012.RP10, RP15, RP20, RP30, RP4013.RP40-E15.5 ± 0.54.9 ± 0.50.5 ± 0.29.0 ± 0.512.0 ± 0.5TUBE LENGTH = 520mm ± 1.017.0 ± 0.256.5 ± 0.250.6 ± 0.1510.0 ± 0.2512.0 ± 0.25TUBE LENGTH = 520mm ± 1.51.2.11.3 ± 0.357.85 ± 0.350.55 ± 0.222.7 ± 0.3518.3 ± 0.35TUBE LENGTH = 520mm ± 2.011.00±0.250.95±0.127.40±0.226.50±0.25TUBE LENGTH = 520mm ± 2.08.00±0.2524.35±0.258.50±0.531.40±0.2526.50±0.2516.30±0.213.8 ± 0.358.85 ± 0.350.8 ± 0.222.7 ± 0.3518.3 ± 0.35TUBE LENGTH = 252mm ± 2.015.45 ± 0.50.55 ± 0.222.0 ± 0.53.5 ± 0.5TUBE LENGTH = 538mm ± 2.013.5 ± 0.531.50 ± 0.57.8.10.9.10.5 ± 0.53.3 ± 0.50.5 ± 0.214.5 ± 0.515.5 ± 0.5TUBE LENGTH = 520mm ± 1.07.7 ± 0.44.3 ± 0.417.0 ± 0.40.55 ± 0.212.0 ± 0.48.3 ± 0.413.5 ± 0.4TUBE LENGTH = 530mm ± 2.09.4 ± 0.45.3 ± 0.417.0 ± 0.40.6 ± 0.1511.0 ± 0.49.12 ± 0.412.6 ± 0.4TUBE LENGTH = 530mm ± 2.012.35 ± 0.357.1 ± 0.3521.0 ± 0.350.55 ± 0.216.15 ± 0.3511.6 ± 0.3519.2 ± 0.35TUBE LENGTH = 520mm ± 2.03.4.6.5.21.0 ± 0.59.0 ± 0.5TUBE LENGTH = 256mm ± 5.080.0 ± 0.522.0 ± 0.51.2 ± 0.20.5 ± 0.520.0 ± 0.56.0 ± 0.515.0 ± 0.51.2 ± 0.250.0 ± 0.57.0 ± 0.5TUBE LENGTH = 292mm ± 2.010.0 ± 0.554.0 ± 0.522.0 ± 0.520.0 ± 0.56.0 ± 0.515.0 ± 0.51.2 ± 0.250.0 ± 0.57.0 ± 0.5TUBE LENGTH = 254mm ± 2.010.0 ± 0.554.0 ± 0.522.0 ± 0.513.12.11.RSS-xxxx & RQS-xxxx tape outline dimensions13.2Spocket hole Ø1.50+0.1/-0Spocket hole tolerance over any 10 pitches ±0.211.51.7524.0 ±0.22.004.00All dimensions in mm xx.xx ±0.11. 10 sprocket hole pitch cumulative tolerance ±0.202. All dimensions meet EIA-481-2 requirements3. Component load per 13" reel : 500 pcs4. The diameter of disc center hole is 13.0mmRECOM RSS-0505xxxxRECOM RSS-0505xxxxRECOM RSS-0505xxxx11.416.007.60.40 ±0.05RSD-xxxx, RQD-xxxx & RZ-xxxx tape outline dimensions17.75Spocket hole Ø1.50+0.1/-0Spocket hole tolerance over any 10 pitches ±0.211.51.7524.0 ±0.22.004.00All dimensions in mm xx.xx ±0.11. 10 sprocket hole pitch cumulative tolerance ±0.202. All dimensions meet EIA-481-2 requirements3. Component load per 13" reel : 500 pcs4. The diameter of disc center hole is 13.0mmRECOM RSD-0505xxxxRECOM RSD-0505xxxxRECOM RSD-0505xxxx11.416.007.60.35 ±0.05RSZ-xxxx, RTS-xxxx, RTD-xxxx & R-78Axx-xxSMD tape outline dimensions15.5Spocket hole Ø1.50+0.1/-0Spocket hole tolerance over any 10 pitches ±0.211.51.7524.0 ±0.32.004.00All dimensions in mm xx.xx ±0.11. 10 sprocket hole pitch cumulative tolerance ±0.202. All dimensions meet EIA-481-2 requirements3. Component load per 13" reel : 500 pcs4. The diameter of disc center hole is 13.0mmRECOM RSZ-0505xxxxRECOM RSZ-0505xxxxRECOM RSZ-0505xxxx12.520.009.90.5 ±0.05Notes.................................................................................................................................................................................................................................................................................................... ................................................................................................................................................................................................................................................................................................... .................................................................................................................................................................................................................................................................................................... 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可靠性光盘的目录CD1//Application Notes for Solid Tantalum Capacitors//Capacitor Lifetime Calculation 200302//LIFETME CALCULA TION FORMULA OF ALUMINUM ELECTROLYTIC CAPACITORS //Guide to Use Aluminum Electrolytic Capacitors//Aluminium Electrolytic Capacitors//ELECTRICAL CHARACTERISTICS AND EXPLANA TION OF TERMS//电解电容的应用//电容寿命计算方法：//電容衝擊試驗報告//電容衝擊試驗報告//壽命計算公式-max//A11空调系统失效模式分析//FMEA(sumida)//FMEA//FMEA手册//PFMEA案例//系统FMEA//Accelerated Thermal Cycling and Failure Mechanisms//Accelerated_Standards_Transition_Plan_Approved_by_Board_06_04//Accelerated stress testing//the enviromental stress screen handbook//Pre halt analysis//谈加速寿命试验//2003 CARTS Derating differences Ta-KO-AO//sony ss-00259 handbook//ADI Reliability Handbook//stress test qualification for discrete semiconductors//An Overview of Weibull Analysis//balloons reliability analysis//An Improved SPICE Capacitor Model//CONSEQUENCES AND CA TEGORIES OF SRAM FPGA//COST ANALYSIS//EEE PARTS DERA TING//Stochastic Aging and Dependence for Reliability//Fault tree construction//final drive and axle fluid requirements//Fish Embryo Analysis//FLOTHERM V4.1 Introductory//Generalized Step Stress Accelerated Life Model//HALT & HASS//IBM ASIC Products Application Note//IEC 60950//Improving the Performance of Y our Root Cause Analysis (RCA) Program//The Application of Accelerated Testing Methods and Theory Accelerated Testing Methods and Theory HALT-HASS//Life Testing and Reliability Predictions for Electromechanical Relays//MAXIM reliability report//TESTING FOR RELIABILITY IN SPACE SYSTEMS//MTBF Instruction Guide//MTBF 計算方法概論//MODELING AND SIMULA TION OF RELIABILITY& MAINTAINABILITY PARAMETERS FOR REUSABLE LAUNCH VEHICLES USING DESIGN OF EXPERIMENTS //on precendence life testing//MEASUREMENT PRACTICES FOR RELIABILITY AND POWER QUALITY//POST PROGRAMMING BURN IN (PPBI) FOR RT54SX-S AND A54SX-A ACTEL FPGAS //Profile_PAL_draft_v1_3b//MINI DIN Series ConnectorProduct Specification(For Internal Use)// USB Series ConnectorProduct Specification(For Internal Use)//THE RETAIL ELECTRIC COMPETITION TASK FORCE//Reliability as a Systems Engineering Investment Not Just a Cost//Reliability Design Technology for Power Semiconductor Modules//Reliability Programs//Reliability Engineering Principles//Reliability Testing and Data Analysis of High-Density Packages’Le ad-Free Solder Joints//Dynamic reliability and risk assessment of the accident localization system of the Ignalina NPP RBMK-1500 reactor//Semiconductor Device Reliability Failure Models//Software Reliability Handbook Chaper11//SONY SS-00259-1第四版(英日)//SONY00254-5-R4//Standard Linear IC reliability//Stress test Qualification for Integrated Circuits//System A vailability Modelling//The Challenge of Supporting Aging Naval Weapon Systems Aging Naval Weapon Systems//Using Telcordia Calculation Methods to Adjust Failure Rates//Warranty Cost An Introduction//wetting balance theory//包装试验方法//产品的热设计方法无图//电子产品可靠性设计及预计//环境应力筛选（ESS）//基于模糊优化的零部件疲劳寿命可靠性分析//结构可靠性分析的区间方法//可靠性基本计算//可靠性预计方法及一点思考//可信性工程//零库存系统//潜在失效模式和效果分析//潜在失效模式和效果分析2//浅析2×xkW汽车电站双机组对可靠性的影响//塑膠產品外觀印刷品質檢驗標準//维护和可靠性//系统可靠性理论与工程实践//以可靠性为中心的维护保养//主板可靠性测试标准流程//半导体集成电路的可靠性设计//产品全寿命周期管理中的加速环境试验技术//当代质量观与可靠性//电子元器件的可靠性安装//电子元器件的运输、储存和测量//电子元器件的质量与可靠性军用标准体系//电子专用设备的可靠性试验//电阻器与电位器的可靠性//二十世纪留给二十一世纪可靠性工程热点问题//防止可靠性设计分析中的若干片面性//非工作期微电路的可靠性及其预计//高加速寿命试验（HALT）与高加速应力筛选（HASS）//功率模块可靠性//国外可靠性工程发展//国外直升机可靠性维修性和保障性发展综述//合理选择继电器提高家电可靠性//基于环境的大型结构物模态试验//几种电子元器件长期储存的失效模式和失效机理//可靠度保證-工程與管理技術之應用//可靠性工作主要内容//可靠性管理//可靠性试验的编码故障树分析//可靠性预计和分配的作用原理及预期效益//可靠性预计模型的参数敏感度分析//可靠性增长试验的体会//美国可靠性分析中心(RAC)的可靠性培训课程//美国可靠性强化试验技术发展点评//某平显可靠性鉴定试验及思考//失效率//失效率曲线的分析与新修正模型的建立//寿命数据分析理论参考英文版//台式电脑电子系统的驱动器可靠性评估//微电路的质量、可靠性等级//微电路降额设计指南//未来电子系统封装可靠性面临的困难//一种威布尔寿命分布模型//一种威布尔寿命分布模型//元件可靠性EMC//ＥＭＣ电磁屏蔽材料设计者指南//ＥＭＣ文章集合（共50篇）//如何尽量降低PCB板上的地噪声//防雷器在电源系统中的应用// 运算放大器的选择方法//新一代数字IC//电子设备、分系统和系统的电磁兼容设计中的可靠性考虑//射频屏蔽室屏蔽效能的测试技术//磁屏蔽理论和实践//局域网的电磁能量泄漏//开关电源ＥＭＩ滤波器的正确选择与使用//如何选择屏蔽外壳//ESD//Electronic Design//Electronic System Design//EMC design technology//High-Speed Board Design Techniques//集肤效应//Bus LVDS SER/DES FAQs//ACPI Component Architecture Programmer Reference//A critique of the EMC Directive//Abatement of Static Electricity//An EMC Directive for the Next Century//COMPLIANCE SYSTEMS CORPORA TION app_note_EN61000-4-5 //Australian EMC Regulation and Routes to Compliance//Building a Bridge Between Product Safety and EMC//Commercial Practices Standard Set to Replace MIL-STD 1686//Developments in Electrical Safety Testing//Electrical Safety Testing//Electromagnetic Compatibility//EMC & EMI of computer//What to look for in an emc amplifiers//EMC annata select//What to look for in an emc antennas//EMC base 基本概念//EMC Chamber Calibration//EMC Problems with Mobile Radio//EMC Shielding//信息技术设备的电磁兼容性标准//EMC Standards and Their Application//EMC standards of all//EMC Standards//EMC test and design The Impact of Emerging European Standards 、//Trends in EMC Testing of household appliance//智能型框架式断路器单片机系统的电磁兼容性分析//滤波器在抗EMI中的应用及发展//Selecting the Right Fabric-Over-Foam EMI Gasket//EMI Requirements in Japan//Electromagnetic Interference (EMI) Damage to Giant Magnetoresistive (GMR) Recording Heads //Evaluating the Nonmagnetic Shields//Explosion Protection—The New Approach in Europe//地线干扰与抑制//超大规模集成电路中的可靠性技术应用与发展//Medical EMC Standards//Minimizing EMI from Heat Sinks//Mitigating EMI in High-Speed Digital Transmission Networks//Performing Safety Tests to Comply with the Low V oltage Directive//Product Safety Standards//Product Safety: Requirements and Methods//Terminology for electromagnetic compatibility//The FCC in Action to Address New EMC ConcernsBA TTERY//Advanced Battery Engineering Facility//An Analysis and Performance Evaluation of a Passive Filter Design Technique for Charge Pump PLL’s AN-1001//Introduction to Power Supplies//Don''t Throw A way Those Batteries!//battery charging//Keep Batteriies Alliive Through Better Battery Chargiing//Demonstrates ACT battery chargers with enrev technology because ―Help Can’t Wait‖//Cycling Information//Efficiency and Power Utilization Data Guide DC DC Conversion Choices in Battery Operated Devices//DC/DC变换器中的噪声管理//DESIGN & SAFETY CONSIDERA TIONS//down the idle power DS92LV16 Design Guide//National Semiconductor DS92LV16 Design Guide//A USER GUIDE TO COMPENSA TING LOW-DROPOUT REGULA TORS//SWITCHING REGULA TORS//Buck-converter Charger also Provides System Power//Frequently Asked Questions About Regulators//Batteries The Achilles Heel in Wireless Communications//Radio Reliability Depends on Careful Planning and Better Battery Charging//锂离子电池知识汇萃//如何选择锂离子充电管理IC//功率因数校正在走向低端电源//LVDS FAQs Page//A Guiide to Battery Maiintenance//Consider the Complete Battery Management Process//Nickel-Metal Hydride Application Manual//Public Safety Stays Charged with Battery Equipment//SYS Dept/BIOS Training_1025//Power Management - Battery Monitoring//Power Management - Battery Power Supply//Power Management for Network Devices//Emergency Preparedness Gets ACTivated//Product Family Introduction Page//A Priimer on Battery Chargiing//CHARACTERISTICS OF RECHARGEABLE BA TTERIES//RZA Technology//Smart Battery Data Accuracy Testing Guidelines//Lower Operating V oltages Force Higher Efficiency Conversion in Battery Operated Appliances //Targeting the Audiences for New PC Designs//Temperature Effects//The Many Flavors of LVDS//thermal sensor of PC//V entationBIOS//BIOS development//bios function//bios ring//bios setup//softwarefmea//using_failure_mode_and_effects_analysis_in_healthcare//software reliability//Reliability Prediction of Substitute Parts Based on ComponentTemperature Rating and Limited Accelerated Test Data//Reliability Review of North American Gas/Electric SystemInterdependency//Semiconductor Device Reliability Failure Models//accelerated testing//A voiding Vibration in Odd-ShapedPrinted-Circuit Boards//Better Accelerated Tests//HALT AND HASS ON THE VOICEMEMO//Combining Moments of Inertia//Confidence_interval_of_proportions//Functional Requirements//Designing Electronics for High Vibration and Shock//SUMMARY OF HALT AND HASS RESULTS A T AN ACCELERA TED RELIABILITY TEST CENTER//Highly Accelerated Stressing of Products With V ery Low Failure Rates//HASS DEVELOPMENT METHODOLOGY HOW TO DEVELOP A SCREEN,WHEN TO CHANGE A SCREEN, AND WHEN TO RE-PROVE A SCREEN//honeywell reliability//How to Justify Machinery Improvements//IBM consulting-Becoming A Process Based Organization//IBM演示技巧教程//MTBF Report_13 October 04//MTBF_Paper//ACCELERA TED RELIABILITY TEST TECHNIQUES USED TO FIND DEFECTS WITHIN PRINTED CIRCUIT BOARDS//Potential Failure Mode and Effects Analysis//WHY HALT CANNOT PRODUCE A MEANINGFUL MTBF NUMBER AND WHY THIS SHOULD NOT BE A CONCERN//How to Use V isual Effects to Support Y our PresentationA PowerPoint Training//precautionsic for Use of High-V oltage Monolithic ICs//PRE-HALT ANALYSIS IS ESSENTIAL FOR A SUCCESSFUL HALT//Preventing Vibration Damage in Electronic Assemblies//Reliability and A vailability//An Extended Reliability Growth Model For Managing And Assessing Corrective Actions//Reliability Monitor Report//reliability tools and integration in the manufacting phase//SEMICONDUCTOR DEVICE RELIABILITY//An introdution to Reliability_and_availability//Reliability_Mathematics//reliability-pric ing-model-overview//rr_ed_fault_risk_reduction//software_reliability_measurement or Life Cycle Core Knowledge Requirements for Software Reliability Measurement//Taking Shake Out of Circuit Boards//THERMAL AND VIBRA TION ISOLA TION TECHNIQUES FOR HARD DRIVES AND PCI CARDS//Reliability, A vailability, and Operability//PROBABILISTIC ENGINEERING DESIGN//Where Is My Data For Making Reliability Improvements//可靠性技术的应用与发展//蒙特卡罗法在零件可靠性设计中的应用//Failure Mode and Effects Analysis (FMEA) A Guide for Continuous Improvement for the Semiconductor Equipment Industry//Automatic FMEA//Representation of Functional Relations among Parts and Its Application to Product Failure Reasoning//Design FMEA//FAILURE MODE AND EFFECTS ANALYSIS (FMEA)//FPU Failure Mode Effects and Criticallity Analysis//FAILURE MODE AND EFFECTS ANALYSIS IN MANUFACTURING AND ASSEMBLY PROCESSES//FAILURE MODE IDENTIFICA TION THROUGH CLUSTERING ANALYSIS//fmea di prodotto//FMEA TOOLS2//FMEA opdracht tuinsproeier//FMEA_Form//Failure Mode and Effect Analysis (FMEA) Packet//FLIGHT ASSURANCE PROCEDURE//fmea_presentation//Complying with the FMEA Requirements of the NewPatient Safety Standards//ANALISI DEI MODI E DEGLI EFFETTI DELLE A V ARIE//Risk –Informed Regulation of Marine Systems Using FMEA//Failure Mode and Effects Analysis//FAILURE MODES AND EFFECTS ANALYSIS (FMEA) WORKSHEET.//TOOLS OF RELIABILITY ANALYSIS -- Introduction and FMEAs//nasa fmea bibliography//Philips FMEA English//An Introduction to Risk/Hazard Analysis for Medical Devices//Using Failure Mode Effect Analysis (FMEA) to Improve Service Quality Service Operations Management//QUANTIFIED RISK ASSESSMENT TECHNIQUES (PART 1)//SURFACE VEHICLE RECOMMENDED PRACTICE//Scenario-based FMEA//PROCESS HAZARD ANALYSIS//software fmea//FMEA（umich）//FMEA（sverdrup）//using_failure_mode_and_effects_analysis_in_healthcare//Procedures for Assessing Risks//Incorporating a user-focused failure modes//DACTRON控制器簡介//包裝落下試驗機簡介//衝擊試驗機簡介//電磁式高頻振動試驗機//環境應力篩選隨機振動簡介//實驗室英文簡報資料//實驗室中文簡報資料//運輸型低頻振動試驗機//運輸型低頻振動試驗機//Ntuw_C防爆加热干燥烘箱//Hot Air Steriliser_C热空气消毒烘箱//TU 60_C干燥加热烘箱//Vht_C真空干燥箱//VTF_C洁净加热干燥烘箱//Vtl_C加热干燥烘箱//英国华莱氏公司产品浏览//BioLine V3.0_C_2003植物生长试验箱//Company Presentation V3.0_C_2003德国富奇介绍//Human Performance Testing V3.0_C_2003人体资源测试//IEC60068-3-5温度变化率//IP-Overview_C工业防护//Pharma V3.0_C_2003制药工业的药品稳定性试验//SC_C_2003阳光模拟试验箱//Thermalshock_C_2003温度冲击试验箱//V . T S C H - Climatic Test Cabinet 德国富奇公司-气候试验箱VC4018C //VP_C_2003药物稳定性试验//Vsc_C_2003盐雾试验//Vtsvcs_C_2003快速温度变化试验箱//Vtvc_detail_C_2003高低温试验箱//Vtvvcv_C_2003振动和更多的……//WALK_IN_APP步入式试验室//Walkin_C_2003步入式模拟环境试验室CD2Enviroment//How reverb chambers work//Chamber Temperature Uncertainty Analysis of the Thunder Scientific Model 2500 Two-Pressure Humidity Generator//Uncertainty_Analysis Thunder Scientific//SERIES 2500 BENCHTOP TWO-PRESSURE HUMIDITY GENERA TOR//About Temperature//Chamber Study//Circut enviroment test//Customers Seeking Environmental Testing//Enviroment test condition//environmental//HASS, HALT and ESS for electronics production//humidity temperature//TEMPERA TURE & HUMIDITYANDFAILURE ANALYSISBYRE ENVIRONMENT TEAM//Relative Humidity....Relative to What?//Introduction of temperature measure//Introduction of ThermalGGT/RE – Environment Test Team//USING THERMAL SHOCK//非密封性分系统热循环试验中的防结露问题//环境应力筛选有关问题的探讨//加速试验//热力学//温度试验中断处理的依据ESS//2002年度《RAMS》论文目录//国外CALS近期发展动态综述//国外CALS近期发展的三个新特点//CSP封装产品在热应力循环条件下的可靠性分析//环境应力筛选（ESS）//ESS//ESS_Fixture//《通信设备可靠性通用试验方法》YD/T 282-2000行业标准介绍//GJB150_19//HALT& HASS//国际电工委员会IEC/TC56（可信性技术委员会）颁发的“可信性”国际标准//Improper_ESS//Improper_ESS_part_2//MANAGING QUALITY//Managing Reliability and Maintainability (R&M)//quality and reliability//reliability develop//reliability training//以可靠性为中心的维修发展动态//SAE RCM标准的制订背景//Software Support Life Cycle Process Evaluation Guide//测试污染对测试结果的影响//测试技术要满足工程项目需求//Audit Report AA 00-341 High Level Architecture//Audit Report AA 01-128 Integrated System Control//Audit Report AA 01-23 Simulation High Level Architecture//Managing Reliability and Maintainability//Guidance on in-Service Reliability and Maintainability (R&M)//Intraoperability and Interoperability of Marine Corps Tactical C4I Systems//AF Instruction 33-133 Joint Technical Architecture -- Air Force//Promulgation of DOD Policy For Assessment, Test, and Evaluation of Information Technology System Interoperability//Compatibility, Interoperability, and Integration of Command, Control, Communications, and Computer (C4) Systems//Design Interface//Life Cycle Logistics Support and Materiel Fielding Process Technical Manual//Life Cycle Logistics Support and Materiel Fielding Process Technical Manual2//概率-物理方法——可靠性研究的新技术//环境应力筛选有关问题的探讨FMEA//01_fmea_example//failure analysis of semiconductor devices//FMEA1//FMEA Analysis Guidelines//潜在失效模式及后果分析//TOOLS OF RELIABILITY ANALYSIS -- Introduction and FMEAs//FMEA2//FMEA3//FMEA失效模式和效果分析//how to selling_root_cause to management//Philips FMEA//Potential Failure Mode and Effects Analysis//Random-Failure-Models/ROOT CAUSE ANALYSIS//root causea nalysis chapter1//SURFACE VEHICLE RECOMMENDED PRACTICE//WHA T MAKES A ROOT CAUSE FAILURE ANALYSIS PROGRAM SUCCESSFUL //故障模式影响分析//如何進行失效模式與影響分析ESD//Digital Phosphor Oscilloscopes//A Safety Standard for Electrosensitive Protective Equipment//Adding V alue through Accredited Testing//Littelfuse Cable Protectors for High Current Applications//CMOS集成电路的ESD设计技术//computer ESD solution//Fundamentals of Electrostatic Discharge An Introduction to ESD//ESD Suppression Technologies//ESD Suppression Technologies ec622a ec622a//Selecting an ESD Suppressor//ESD Protection Audio Input and Output Lines//Capacitance and Signal Integrity//ESD Protection Digital Visual Interface Data Lines//ESD Protection IEEE 1394 Data Lines//ESD Protection USB 1.1 Data Lines//ESD Protection USB 2.0 Data Lines//ESD Protection Video Input and Output Lines//General Purpose ESD Protection//ESD Journal - The ESD & Electrostatics Magazine//ESD protect//ESD Standards//Evaluation of Materials for Cleanliness and ESD Protective Properties//Electrostatic Discharge (ESD) in Magnetic Recording Past, Present and Future//Explosions and ESD//From Electrostatics to ESD//Fuse fact//Ground planes for low cost boards//Grounding Strategies for Printed Circuit Boards//How Is Static Electricity Generated//Is Static Electricity Static//Littelfuse Resistors for V oltage Suppression//SiV a ESD Demo//The Competitive Advantage of Standards//The Evolution of Guide into ISO 17025//What It Means to ESDHALT//ENVIRONMENTAL EFFECTS//笔记本电脑失效模式分析表//测试前笔记本性能测试//测试前后的机构电性功能验证//常见失效模式一览表//可靠性验证测试//失效分析是指研究产品潜在的或显在的失效机理//失效效应危害度一览表//ENVIRONMENTAL ENGINEERING CONSIDERA TIONS AND LABORA TORY TESTS//A fundamental overview of accelerated-testing analytic models//A5 P-FMEA//accelerated and classical reliability methods integrated//accelerated model//accelerated test reference1//accelerated test reference2//accelerated test reference3//accelerated test reference4//美国可靠性强化试验技术发展点评//An approach to designing accelerated life-testing experiments//Ast//BCC-4V Halt Test//Critical Analysis Team Report on Accelerated Waste Retrieval Final Design and Fixed Price Contracting//Don’t Let the Cost of HALT Stop Y ou//电子设备的可靠性设计技术//FEMMA Technology Overview FEMMA Technology Overview/fixturing China presentation 2-04//FMEA5//HALT & HASS1//HALT GUIDELINE 2004//HALT Guideline//HALT HASS SEMINAR PRESENTED BY ENVIROTRONICS//The Application of HALT for Increased Product Reliability//加速试验综述//HALT&HASS基础篇- 中文- 2003//HALT-HASS//HALT-Testing With a Different Purpose//Hass and Halt//HASS of Products With V ery Low Failure Rates//high reliability challenge of broadband equipment//Highly Accelerated Life Testing//紧凑型节能灯寿命的常规试验方法//Material failure mechanisms and damage models//MTBF Assurance test//PCB relia design//Quick guide Accelerated Life Testing Data Analysis Basics//quick guide life data analysis//可靠性设计//Reliability Glossary//reliability prediction VS HALT testing//Searching for appropriate humidity accelerated migration reliability tests methods//System reliability modeling considering the dependence of component environmental influences //understanding accelerated life testing analysis//what is HAST testing//why HALT cannot produce a meaningful MTBF number and why this should not be concern//高加速寿命试验(HALT)与高加速应力筛选(HASS)//失效率//用高压锅做测试//统计知识//概率与统计入门研究。

APPLICATION NOTES船舶市场改造方案 2009年12月，第一期巴斯勒电气数字式电压调节器DECS-100替换COSIMAT N+型调压器船舶市场介绍早期船舶市场随AVK 发电机一起进来的大多数配套COSIMAT N+调压器。

COSIMAT N+是一款模拟式调压器，开发年代比较久远。

随着船舶市场日新月异的发展，大量变频负载的广泛使用，广大客户对船用AVR 的性能要求越来越高，COSIMAT N+由于其自身的发展，并且目前市场上备件购买困难，已无法满足客户的需求。

巴斯勒电气(苏州)有限公司通过专业的技术分析，多次的现场试验数据采集，长时间性能对比试验等，提出可靠的替代方案。

即用高性能、数字式电压调节器DECS-100替代COSIMAT N+。

DECS-100是一款数字式的电压调节器，IGBT 控制，宽频输入，有效值检测，抗谐波干扰能力强，适合船上变频负载的使用。

并且改造起来极其方便，在不改动发电机外部任何接线的前提下，进行完全覆盖。

巴斯勒电气数字式励磁调压器DECS-100功能描述：1、 励磁控制单元：额定输出为7Adc@63Vdc ；2、 四种控制模式：自动电压调节(AVR)，励磁电流调节(FCR)，无功功率调节(VAR)，功率因数调节(PF)；3、 并车功能：DECS-100提供外部52L/M 接点，当接点打开时，启动DROOP(调差)功能。

DROOP 值可通过DECS-100软件设定，调试起来更便捷，可以很好的解决船上大量变频负载使用时无功不均的问题；4、 并网功能：DECS-100提供外部52J/K 接点，当节点打开并且软件功能同时激活时，启动VAR 或PF 功能。

并且可以通过软件设定，使并网后发电机运行在额定功率因数下；5、 发电机单机运行或并车运行时，DECS-100仅仅工作在自动电压调节(AVR)或者励磁电流调节(FCR)两种模式下。

当发电机与电网并联运行时，可以工作在无功功率调节(VAR)或功率因数调节(PF)模式下；6、 空载状态动态信息分析功能：此功能可以在发电机空载状态下，按一定比率提高或降低发电机的电压，并可记录发电机的波形。

Key Features:Power Rating:2600W,5200W,6500W,10400W,14500W, 15600WVoltage range: 1-80V/ 2.5-500VCurrent range: Up to 1000ACC, CR, CVMaster/Slave paralleling control mode, allow synchronous load control under static and dynamic loading modeDynamic loading: Up to 20KHzOnly need 1V to draw rated currentProgrammable slew rate, up to 41A/uS Measurement: Voltage / CurrentPower/ ResistanceLarge LED/LCD displayExternal loading waveform simulationShort circuit simulation and shortcircuit current measurementFull protection: OPreverse protectionVersatile remote controllerGPIB& RS-232C; RS-485 interfaceSurge load capabilityBattery discharge timerand therefore can test if the battery charger has correct charging current corresponding to its own out-put, or more precisely, the battery voltage. If the UUT is battery, the electronic load is able to simulate the behavior of the device that uses the battery. For most of the electronic and electrical devices, their power consumption patterns are more likely constant power devices.Consequently, CP mode simulation will be essential for a battery discharge load.2. LOW VOLTAGE OPERATING CHARACTERISTICSdirectly.1000A at only 1V input.3. MEASUREMENTSChroma 63200 series are built in the15-bits precision A/D converter, thus can achieve 0.05%F .S., 0.1%F .S. and 0.3%F .S. accuracy for voltage,current and power measurement respectively. And they can be shown simultaneously on three big LED displays for user's convenience. In additional to standard measurements, they also provide voltage and current monitor outputs, which are useful when user needs to monitor the voltage and current waveform via scope.4. DYNAMIC LOADING AND CONTROLparameters of the 63200 load modules. The programmable slew rate makes the simulation of transient load change demanded by the require-ment of real life application possible. The internal waveform generator of 63200 is capable of producing maximum slew rate at 25A/uS (63208),and dynamic cycling up to 20KHz. Its dedicated remote load senses and controls circuit guarantee the minimum waveform distortion during continuous load changes.5. MASTER / SLAVE PARALLEL CONTROLWhen higher power is required,it is common to parallel two elec-tronic loads together to draw higher current. 63200 series high power loads have smart Master / Slave control mode. When the loads are set to Master / Slave mode, users can program the load-ing (CC mode only) on master unit. The loading current values ofthe slave units will be calculated and downloaded by master unit automatically. In short, unlike the traditional design, users may consider several load units that work under Master / Slave mode as a single load unit. It simplifies the user operation dramatically.SIMULATIONThe CC and CR mode loading simula-tion is helpful to test whether the output voltage of the UUT remains stable or regulated under different loading cur-rent or resistance conditions. For bat-tery chargers, CV mode may help tochange the output voltage of a charger 1. APPLICATION SPECIFIC LOAD SIMULATIONChroma electronic loads 63200 series provide constant current, constant resistance, constant voltage and constant power modes for various application requirements.V I V I V I VIConstant current Constant resistance Constant voltage Constant power8. SURGE LOAD CAPABILITYChroma’s 63200 Series D C Loads provide a unique surge load simulation capability which allows users to overdrive the loads up to 2.7 times their rated power for short periods. This feature is ideal when the average power require by the UUT is low compared to short-term peak power demands. Plasma Display Panel (PDPs) testing is one typical applica-tion, others include battery 3C discharge, breaker & fuse over rating (300% to 1000%) tests, car engine startup simu-lation and DC motor startup simulation.The amount of surge loading available using the 63200 loads is related to the initial loading conditions. Figures 1 and 2 show the relationship of initial state (Load_Low under D ynamic mode) and the maximum acceptable overdrive power. Under this operation, the load will display an Over Power Protection Alarm (OPP) and will disable the load cur-rent if the user violates the maximum surge load capability showed in the figures.Note 1 :The Initial state under Static Mode should last at least 1 second. Note 2 :This surge load capability will be regulated by the temperature de-rat-ing characteristics. (Refer to Note 1 in Specifications)Note 3 :Examples below assume the use of the Model 63201 load with a con-tinuous rating of 2600W/300A/1-80VDC9. TIMER FUNCTION FOR BATTERY DISCHARGE TESTINGThe 63200 Loads include unique timing & measurement function allowing for precision time settings and measure-ments in the range of 1s to 99999s. This feature allows users to set a final voltage & timeout value for battery dis-charge testing and similar applications.For Example, Figure 3 below shows that the 63200’s internal timer can be initiated automatically when the battery voltage falls below a preset value. The timer will continue countinguntil the second preset voltage value is reached.Example 1: STATIC LOADINGThe Model 63201 can be overdriven to approximately 5200W (200% of its rated con-tinuous power rating) for 6.0 ms seconds when the starting power is 650W (25% of its rated power). This is represented by DOT on the blue curve in Figure 1.Example 2: DYNAMIC LOADINGThe Model 63201 is capable of a zero – to- 6500W (250%) pulse at a duty cycle of 5%. This is represented by the DOT on the purple curve in Figure 2.7. SHORT CIRCUIT SIMULATION63200 series electronic loads can also simulate short circuit condition. Owing to this capability, it can short DC power source or any power sup-plies that have built in current limit function, and measure their short circuit currents. So that users can verify if the UUT current limit is functional.APPLICATIONSof testing all sorts of DC output power supplies directly or via rectifier, they can also be used to test the AC output power supplies.CC & CR ModeA/ D Power supplyD/ D ConverterBattery chargerUPS/AVR4. SYSTEM INTEGRATIONChroma 63200 series electronic loads provide GPIB, RS-232C and RS-485 PC controllable interfaces. The external waveform simulation and voltage / current monitoring capability make Chroma 63200 family ideal for automatic system integration.Discharge by CR modeDischarge by CP mode1. Power Switch2. LED Display:Voltage read back.3. LED Display:Current/ ohm read back.4. LED Display:Power read back.5. LCD Display:For setting and editing.6. Rotary knob:T o adjust the loading and parameter setting.7. Numeric key:For data setting.8. Function key:T o select load mode, control mode, and define thereading specification.9. System key:For system config and data store, recall.10. Load terminal11. Voltage sense terminal12. RS-485 connector13. GPIB connector14. RS-232C connector15. Voltage monitor output:Analog output which indicates the voltage waveform.16. Current monitor output:Analog output which indicates the current waveform.17. External V reference:External programming voltage input.246351Model: 63203, 63204PANEL DESCRIPTIONModel 63208 / 63209 / 63210Model 63206 / 63207Model 63203 / 63204Model63201 / 63202Model 63205SPECIFICATIONSSPECIFICATIONSSe riesAll specifications are subject to change without notice.Note*1: The power rating specifications at ambient temperature=25. And see the diagram below for power derating. (Derate power by 1.53perfrom 25to 40)Note*2: The Vin is greater than min. operating voltage of each model.Note*3: The Vin is greater than 7V of each model.Note*4: Setting error will be 1% for R<0.005Ωat CRL range.SPECIFICATIONSV-I Curve:Model 63201/ 63203/ 63205/ 63206/ 63207/ 63208/ 63209Low Voltage Operating:Low Voltage & V-I Curve Operating Characteristics (Typical) of 63200 SeriesNote: All specifications are measured at load input terminals. (Ambient temperature of +25)Distributed by:Worldwide Distribution and Service Network63200-200607-PDFCHINACHROMA ELECTRONICS (SHENZHEN) CO., LTD.8F , No.4, Nanyou Tian An Industrial Estate, Shenzhen,China PC: 518054T el: +86-755-2664-4598Fax: +86-755-2641-9620EUROPECHROMA ATE EUROPE B.V.Max Planckstraat 4, 6716 BE Ede, The Netherlands T el: +31-318-648282Fax: +31-318-648288U.S.A.CHROMA ATE INC. (U.S.A.)7 Chrysler Irvine, CA 92618T el: +1-949-421-0355Fax: +1-949-421-0353T oll Free: +1-800-478-2026CHROMA ATE INC.HEADQUARTERS66, Hwa-Y a 1st Rd., Hwa-Y a T echnology Park, Kuei-Shan Hsiang, Taoyuan Hsien 333,TaiwanT el: +886-3-327-9999 Fax: +886-3-327-8898E-mail:*****************.twDeveloped and Manufactured by :63207 : DC Electronic Load 10.4KW/ 300A/ 80V 63208 : DC Electronic Load 15.6KW/ 600A/ 80V 63209 : DC Electronic Load 15.6KW/ 1000A/ 80V 63210 : DC Electronic Load 14.5KW/ 150A/ 500V A600009 : GPIB Cable (200 cm)A600010 : GPIB Cable (60 cm)A632001 :Remote Controller63201 : DC Electronic Load 2.6KW/ 300A/ 80V 63202 : DC Electronic Load 2.6KW/ 50A/ 500V 63203 : DC Electronic Load 5.2KW/ 600A/ 80V 63204 : DC Electronic Load 5.2KW/ 100A/ 500V 63205 : DC Electronic Load 6.5KW/ 180A/ 80V 63206 : DC Electronic Load 10.4KW/ 600A/ 80VA632001ORDERING INFORMATION15A 30A 45A 60A 75A 90A 105A 120A 135A 150A15A30A 45A60A 75A 90A 105A 120A 135A 150A。

AN-1338APPLICATION NOTEOne Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: 781.329.4700 • Fax: 781.461.3113 • ADM1278 Design Guideby Paul O’SullivanINTRODUCTIONThe following design guide is intended to be used with theADM1278 Microsoft® Excel®-based design tool, the ADM1278 Hot Swap Designer. The headings in this application note correspond to the numbered headings in the design tool.SYSTEM SPECIFICATIONSEnter the system specifications. For example, critical specifications can be as follows: • V IN = 12 V ± 5% (supply voltage)• I CB = 70 A (circuit breaker trip current) • C LOAD = 3000 µF (total load capacitance) •T A_MAX = 60°C (ambient temperature)UV PIN THRESHOLDAn internal comparator with a 1 V reference detects the UV pinfalling threshold.V 1×+=RUV2RUV2RUV1UV FALLINGwhere:RUV1 is the top resistor in the resistor divider string on the UV pin divider from V IN to ground.RUV2 is the bottom resistor in the resistor divider string on the UV pin divider from V IN to ground.The UV pin has 60 mV of hysteresis, so the rising threshold can also be calculated asUV RISING = UV FALLING + (UV FALLING × 60 mV)A decoupling capacitor can also be added to the UV pin if required. This capacitor extends the glitch filter time of the UV pin.OV PIN THRESHOLDAn internal comparator with a 1 V reference detects the OV pin rising threshold.V 1×+=ROV2ROV2ROV1OV RISINGwhere:ROV1 is the top resistor in the resistor divider string on the OV pin divider from V IN to ground.ROV2 is the bottom resistor in the resistor divider string on the OV pin divider from V IN to ground.The OV pin has 60 mV of hysteresis, so the falling threshold can also be calculated asOV FALLING = OV RISING − (OV RISING × 60 mV)A decoupling capacitor can be added to the OV pin if required. This capacitor extends the glitch filter time of the OV pin.CURRENT LIMIT SETTINGSThe sense voltage (V SENSE ) can be programmed within a 5 mV to 25 mV range using the ISET pin. The range of 15 mV to 25 mV is recommended for optimum accuracy.For example, to configure a regulation current limit (I REG ) of 73 A, the sense resistance (R SENSE ) is calculated asΩ≈==m 0.273A37V020.0REG SENSE SENSE I V R This R SENSE value is not a commonly available resistor, so the closest to consider is 0.25 mΩ (for example, two 0.5 mΩ resistors in parallel).V SENSE = R SENSE × I REG = 0.25 mΩ × 73 ≈ 18.25 mV V ISET = V SENSE × 50 = 18.25 mV × 50 = 0.912 VBecause the VCAP pin has a limited load current specification, the top ISET resistor (RISET1) is kept relatively large, (for example, 10 kΩ to 100 kΩ). The bottom resistor (RISET2) can then be adjusted to provide the required sense voltage limit. The ISET pin can be tied directly to the VCAP pin to configure the default 20 mV current limit. Enter 20 mV as the target V SENSE value to configure the default current limit.Up to four sense resistors can be selected in parallel. A general guideline is to allow a 10% imbalance between resistors. Resistors must also be sufficiently thermally derated. For example, a resistor that is rated for 2 W must not be dissipating more than ~1 W . The TT Electronics ULR3 series of resistors, or equivalent, is recommended. The ULR3 resistor is a 3 W , 2512 case size resistor. See the EV AL-ADM1278EBZ user guide for the recommended sense resistor footprint when using the ULR3 resistors. Averaging resistors are required when using multiple sense resistors. A 10 Ω averaging resistor at each sense resistor terminal is recommended.The minimum, maximum, and nominal circuit breaker current limits and regulation current limit are shown in the tool after the sense resistor and ISET resistor values are populated.AN-1338Application NoteFET SELECTIONGenerally, the maximum current must not exceed approximately 25 A to 30 A per field effect transistor (FET) for a typical power metal-oxide semiconductor field effect transistor (MOSFET) in an LFPAK case size. This guideline gives an indication of the number of FETs that are required.The first consideration as criteria for selection of a suitableMOSFET is the drain source on-resistance (R DSON ) specification. The R DSON value determines how much power is dissipated in the MOSFET when it is fully enhanced in normal operation. The ADM1278 features a high voltage gate drive which generates a minimum gate-to-source voltage (V GS ) of 10 V to achieve the lowest specified R DSON . The gate drive circuit is designed to achieve this gate drive while still ensuring the 20 V maximum V GS specification is not violated.The temperature rise in the MOSFET during normal operation is directly proportional to the R DSON of the MOSFET. This temperature rise impacts the derating factor required tomaintain the safe operating area (SOA) of the MOSFET. As the temperature of the MOSFET increases, its power rating is reduced, or derated. In addition, running MOSFETs at high temperatures may decrease their reliability.Begin by estimating the required R DSON . Check the maximum dc current calculated previously in Section 4 of the design tool (Current Limit Settings). Assume there is a maximum dc current of 75 A for the purposes of these calculations. Then, using the maximum ambient temperature specified in Section 1 (System Specifications), estimate the power loss in the MOSFET(s). First, make the following assumptions: • Junction to ambient thermal resistance of the MOSFET (R THJA ) = 40°C/W (this rating must not be exceeded) •T JMAX = 120°C (this is the maximum preferred MOSFET junction temperature, keeping well below any silicon limits)First, calculate the junction temperature rise.T RISE = T JMAX − T AMAX = 120°C − 60°C = 60°C Then, calculate the power for a single FET.W 5.1C/W 40C 60=°°==THJARISE MOSFET R T PThen, calculate the total R DSON .m 266.0A)75(W 5.122Ω===MAXDCMOSFET DSON I P RThis R DSON value is far too small for a single FET, so calculate it with three FETs in parallel, instead.() m 4.225W 5.13/22Ω===MAXDC MOSFETDSON I P RReduce this R DSON value by 10% to create a margin for imbalance, due to layout asymmetry, and a further 1.4 factor to allow some derating.m 5.14.19.0m 4.2Ω=×Ω=DSON RTaking this R DSON value as the target R DSON , search for suitable FETs. The search can be narrowed to FETs that fit the following profile: • V DS = 25 V to 30 V (20 V is possible, but is not preferred). • V GS = 20 V .• R DSON ≤ 1.4 mΩ.•T JMAX = 175°C (150°C is possible, but 175°C allows for a lower temperature derate factor. This is the silicon limit for the MOSFET. The maximum junction temperature is still targeted at 120°C to avoid thermal runaway).After selecting a suitable MOSFET , quantify the R DSON temperature derate required. There is typically a graph of R DSON vs. T J in the MOSFET data sheet. An example of normalized R DSON vs. T J is shown in Figure 1.12777-001N O R M A L I Z E D R D S O N (m Ω)JUNCTION TEMPERATURE (°C)2.01.51.00.50–60060120180Figure 1. Normalized R DSON vs Junction Temperature (T J )Using a T JMAX of 120°C, the R DSON increases by a factor of approximately 1.4. It is recommended to keep T J ≤ 120°C. After a suitable MOSFET is selected, the remainder of Section 5 (FET Selection) of the design tool can be populated. The threshold voltage (V GS(TH)), the reverse transfer capacitance (C RSS ), and the input capacitance (C ISS ) values can usually be found in the specification table or in the typical performance characteristics of the MOSFET data sheet.Application NoteAN-1338DETERMINE THERMAL POWER DERATING FACTORSThe worst case temperature rise is calculated based on dataentered previously. A derating factor (DF) of approximately 2 or less is recommended to avoid thermal runaway.CMAXJMAX CSOA JMAX T T T T DF −−=where:T CSOA is the SOA case temperature (for example, 25°C). T CMAX is the case temperature at T JMAX .V OUT RAMP TIMEThe gate capacitor (C GATE ) limits the inrush current and allows the output voltage to come up in a linear ramp. The capacitor must be large enough to ensure that the inrush current is low enough to not trip the circuit breaker threshold. Start with a 10 nF capacitor and increase its value until the inrush current is low enough and the tool no longer gives a warning. Typical values for the gate capacitor are 22 nF or 33 nF .The gate capacitor value can also be chosen to give a desired power-up ramp time. For example, to configure a power-up ramp of 20 ms,()FET PER RSS IN GATEUPGATE CNumFETs V I t C __×−×= where:t UP = 20 ms power-up ramp time. I GATE = 25 µA.V IN = nominal supply voltage.NumFETs is the number of MOSFETs.C RSS_PER_FET is the reverse transfer capacitance per FET. Round up the gate capacitor to the nearest available value.SOACopy the chosen MOSFET SOA into the FET SOA tab of the design tool. It is recommended to use the 1 ms SOA time for the calculations because SOA times are not easy to predict in between the characterized times on the SOA plot. Fill out the SOA values in the table for Section 8 of the FET SOA tab to allow the tool to calculate the maximum allowable power for each SOA time.PSETThe ADM1278 utilizes a constant power foldback technique to protect the MOSFETs in the event of overcurrent faults or short circuits. The V DS of the MOSFET is monitored. The current limit is adjusted based on the V DS of the MOSFET to maintain a constant power limit. See Figure 2 for an example of this relationship.12777-002F E T C U R R E N T (A ) A N D P O W E R (W )FET V DS (V)50024********Figure 2. Constant PowerThe ADM1278 design tool calculates the maximum constant power value to ensure that the MOSFET SOA is maintained. It also calculates the minimum constant power value to ensure that the constant power threshold is not tripped at power-up. Choose the power limit somewhere close to the center of this range to allow margin at each side. The typical value for the FET power limit in a design is 250 W .After the FET power limit is chosen, the PSET resistor divider from the VCAP pin to ground can be selected to give the required PSET voltage. The MOSFET SOA must be checked at the constant power setting selected. Click on the link in Section 9 of the FET SOA tab and enter the approximate SOA time at the derated constant power level. Check the design worksheet for any SOA warnings. The SOA time at this constant power level must be larger than the selected maximum SOA time (for example, the 1 ms SOA line that was recommended).ISTARTThe start-up current limit is a fixed current limit that is only active when PWRGD is bad (the PWRGD pin deasserted). Thiscurrent limit can therefore detect any unexpectedly large inrush current during dv/dt power-up. During dv/dt power-up, the inrush current is typically less than the active current limit determined by the ISET pin or constant power foldback.AN-1338Application NoteThe ISTART pin is used to select the start-up current limit. It can be tied high to disable the start-up current limit, tied low for a default V SENSE limit of 2 mV , or it can be configured with a resistor divider to the VCAP pin to configure a specific current limit.VCAP R R R V ISTART2ISTART1ISTART2ISTART ⨯+=where:R ISTART1 is the top resistor in the resistor divider string on the ISTART pin from the VCAP pin to ground.R ISTART2 is the bottom resistor in the resistor divider string on the ISTART pin from the VCAP pin to ground.SENSECSAMP ISTARTR AV V StartupCL ⨯=where:StartupCL is the start-up current limit at initial power-up. A V CSAMP = 50 V/V (gain of current sense amplifier).The start-up current limit must be greater than the maximum expected inrush current to ensure that the circuit breaker threshold is not tripped during a normal dv/dt power-up ramp. The start-up current-limit threshold is typically set in between the maximum expected inrush current and the minimum constant power current limit. If the maximum expected inrush current is 5 A, the start-up current limit is typically set to approximately 10 A. After a start-up current limit is selected, the ISTART resistor divider on the VCAP pin can be configured in the ADM1278 design tool.It is also possible to program the start-up current limit via the PMBus interface. See the ADM1278 data sheet for more details.MOSFET SOA ANALYSIS AT POWER-UPOne final MOSFET SOA check is required for the worst case FET power at power-up. The MOSFET SOA time for a power-up ramp is estimated in Section 10 of the FET SOA tab. After entering the appropriate time, check the design worksheet again for any warnings. The SOA time must be larger than the maximum power-up time that was calculated. TIMERThe TIMER pin capacitor (C TIMER ) is used for fault protection. When the ADM1278 is configured to power up in a linear ramp, the TIMER pin threshold is normally tripped only during a fault condition. As such, the regulation period of the TIMER pin can be considered as a glitch filter time for fault conditions. For high current designs, it is recommended to set this fault filter time to approximately 100 μs to 500 μs duration. A C TIMER capacitor value of 10 nF to 22 nF is recommended.PWGIN PINThe PWRGD pin is an open-drain output pin and is pulled low in the following cases: ∙ There is a fault condition that has not been cleared∙ The controller has not signaled that the hot swap can be enabled∙The power-good input threshold has not been exceededThe PWRGD falling threshold is set by a resistor divider on the PWGIN pin.V 1⨯+=RPWGIN2RPWGIN2RPWGIN1PWGIN FALLINGwhereRPWGIN1 is the top resistor in the resistor divider string on the PWGIN pin divider from V OUT to ground.RPWGIN2 is the bottom resistor in the resistor divider string on the PWGIN pin divider from V OUT to ground. The PWGIN pin has 60 mV of hysteresis, so the rising threshold can also be calculated asPWGIN RISING = PWGIN FALLING + (PWGIN FALLING × 60 mV)RECOMMENDED CIRCUITAssuming there are no warnings, the design is complete. Click on the link in the design tool to go to the tab with the schematic and the bill of materials that is generated from the design.©2014 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners.AN12777-0-12/14(0)。

© 2017 Kingbright. All Rights Reserved. Spec No: DSAF2378 / 1101001562 Rev No: V.6A Date: 07/18/2017 Page 1 / 5 DESCRIPTION zThe High Efficiency Red source color devices are made with Gallium Arsenide Phosphide on Gallium Phosphide Orange Light Emitting Diode

FEATURES zLow power consumption z Versatile mounting on P.C. board or pane

z T-1 3/4 diameter flangeless package

z Reliable and rugged

zRoHS compliant

APPLICATIONS zStatus indicator zIlluminator

zSignage applications

zDecorative and entertainment lighting

zCommercial and residential architectural lighting

PACKAGE DIMENSIONS WP1503EC T-1 3/4 (5mm) Solid State Lamp

Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.25(0.01") unless otherwise noted. 3. Lead spacing is measured where the leads emerge from the package. 4. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice.