i3573s泉州市天益机电216
- 格式:pdf
- 大小:59.57 KB
- 文档页数:2
DIRECTORY PackingBrief IntroductionMotherboard Diagram Installation and Settings Installation of Drivers BIOS SettingsRear I/O panel (2)345671113Safety Precautions SAFETY PRECAUTIONSProducts could probably be damaged due to electrostatic discharge(ESD). Please follow these steps below for a success-ful computer assembly.Make sure all parts are firmly connected; otherwise, it might lead to the failure of recognizing components or starting the computer.In order to prevent products from being damaged by ESD, please make sure to discharge your body static by touching other metal objects before taking the motherboard out of box.Hold the border of motherboard when taking it out. Do not touch the sensitive parts of motherboard.Please put the motherboard in an anti-static container or on anti-static pad if not needed.Before turning on the computer, make sure all parts inside the case are firmly connected without any loose screws or metal components.Do not start the computer before installation finished, otherwise it might result in permanent damage to the computer parts or even injury to the user.If you need any assistance in the process of installation, please contact our after-sales customer service or reach us on HUANANZHI official Facebook for professional technical support.Prior to installation or disassembly, please switch off the power and unplug the computer.Liquid penetrated into the computer. Motherboard is exposed to moisture.Keep the motherboard away from moisture.Keep the user manual for future reference.Before plugging the power supply, please make sure the socket provides the corresponding voltage.In any of the following situations, please keep themotherboard and power cable in a safe place. Do not put anything onto the power cable.In the event of any of the following conditions, have the board checked by a service technician:BRIEF INTRODUCTIONFeaturesCPUs supported: Standard LGA2011-3 socketRAM supported: Supporting four channels of DDR4 1866/2133/2400MH z , with standard and ECC memoryI/O attributes: 10*SATA3.0(Max data transmission rate of 6GB/s)4*USB2.0 ports(Extensible 1xUSB2.0 interface in front )4*USB3.0 ports(Extensible 1xUSB3.0 interface in front) 1*M.2 NVME Interface 1*M.2 NGFF Interface1*RJ45 Gigabit Ethernet ports 1*Audio interfaceHD AUDIO sound effect:Supporting 7.1 soundtrack HI-FI audio input/output(ALC887) Providing audio input/microphone/front speaker/rear speaker and side speaker output portAudio output: this is the front speaker output port that stereo speakers or earphones can be plugged intoOnboard NIC: Motherboard has internal RTL8111H network interface cardExpansion slots:3*PCI Express x16 Accelerated Graphics PortMotherboard does not work even if you follow the instructions on user manual.Motherboard fell off to the ground and got damaged. Motherboard has clear signs of damage.PACKINGPlease confirm that the motherboard is properly packaged upon purchase of the product. If there is any damage to packaging or lack of accessories, contact us as soon as possible .1.1*HUANANZHI X99 F8D DUAL motherboard2.2*SATA data cable3.1* User manual4.1*Warranty CardRear I/O PanelUSB2.0USB3.0USB2.0MOTHER BOARD IMAGESATA3.0*6M.2 NGFF SATA3.0*43pin fan interface Gigabit nics(Under)PCIEX16 interfaceM.2 NVME interfaceAUDIOPCIEX16 interfacePCIEX16 interfaceCPU2CPU1DDR4*8Interface8PIN CPU Power Supply24PIN Power Supply8PIN CPU Power SupplyUSB3.0 Interface USB2.0Interface (on)Audio Port4pin fan interface3pin fan interfaceJUSB2.03pin fan interfacePower buttonReset button JUSB3.0Dial the code3pin fan interface 4pin fan interface1-1 X99-F8D motherboard illustrationLANLAN Audio Port1-2 Overall Rear I/O Panel DisplayStatusDescriptionTurn OffNetwork Not Connected Yellow Network Connected FlickerNetwork In UseSpeed SignalStatus DescriptionTurn OffTransmission rate Transmission rate Transmission rate10 Mbps Green 100 MbpsOrange1 GbpsConnection/Work Light1-3 LAN Port Status Table1-4 Audio Port ConfigurationAudio Port Audio InputAudio output/Front speaker outputRear speaker outputCenter/subwoofer output Side speaker output Microphone input Aisle2468PCIEx16PCIEx16PCIEx16135********Power PowerUSB3_RX_DN USB3_RX_DN USB3_RX_DP USB3_RX_DPGroundGroundGroundGround USB2.0-USB2.0-USB2.0+USB2.0+191220USB3_TX_C_DPUSB3_TX_C_DP USB3_TX_C_DNUSB3_TX_C_DN GND 11121314151617181920N.CInstallation And Settingsplease check the motherboard where all pins marked with number “1” or white bold line are position “1”.NOTICE13579246810VCC D-D+GND KEYVCC D-D+GND N.CN.C 109212-1 Clear CMOS Jumper CLR-CMOS2-2 Front Audio Output Ports2-5 USB Extension Interface2-4 PCI Expansion Slot13579246810MIC+KEY L_R_Out L_L_OutGround AuD_Vcc(AVCC)R_Out BackL_Out Back12910Vbias 246810HDD_LED-VCCPWR_LED-VCC RESETRESET PWR_LED-VCC PWR_LED-VCC PWR_SWPWR_SWN.C 219102-5 F_PANEL1 Boot InterfaceKEY2-6 USB3.0 Interface3. 4.5.1.2.XX XX5330°4121232In order to properly place the CPU in the motherboard, the surface of the LGA2011 CPU has two pairs of start-ing points and a golden triangle. Golden triangle indicates Pin12-7 CPU InstallationRemove the screw from the screw base Remove the scre w baseTighten the screw base screwed into the length M.2 module to the M.2 interface distance holeInsert your M.2 module into the M.2 interface at a 30 degree angle Place the screw on the trailing edge notch of your M.2 module and tighten to the screw base2-8 M.2 Interface Installation1.Pull the clips on both ends of the memory slot outward, and the memory strip corresponds to the protruding position of the slot to determine the direction of installa-tion.2.Align the memory module into the slot and press3.Let the snaps on both ends of the slot automatically bounce2-9 Memory Installation��������DIPON1.SATA available��������DIPON2.M.2NGFF available��������DIPON3.SATA/m. 2 NGFF both unavailable��������DIPON4.Do not dial all the code to the ON location, it will cause a short circuitNote :SATA0 3.0 interface and The M.2 NGFF interface only works Dial either one,Not used at the same time2 -10 Instruction of dial - code switch2 -11 Graphics Card Installation3e a screwdriver to remove the bezel and screws on the main unit2.Need to pick up the card slot of the card slot wheninstalling the graphics card 3.Insert the graphics card into the card slot of the graphics card1324.After the installation is in place, the chuck will automatically return to its position.5.Secure the graphics card to the chassis with screws6.Install the power cord5464.1Audio driver installation (take HD Audio series for example)Run "driver disk": /X99 SOUND CARD DRIVER/VISTA-WIN7-R267, take WDW-267 if OS is XPClick on "next"to continue,and then"finished"The system will automatically restart itself to finish the installation4.2 Uninstallation of audio driver(take HD Audio series for example)etting into Windows desktop, choose "setting"/ "con-trol",and then "add/remove programs". Later, choose "Re-altek High Definition Audio Driver" in the menu and click on "computer. The system will automatically search for devices. Installation finished.3.Directx11 driver installationRun driver disk: /Tools/Driverx11/DXSETUP, click on "Iaccept"and then "next" to continue. Click on "finished" and restart computer. The system will automatically search for devices. Installation finished.4.Audio driver installationBefore this installation, please check the model of the audio chip on the motherboard first(you may refer to this manual), Select the proper driver accordingly for installa-tion.Drivers installation1.Drivers listing:2.Intel Chip Information InstallationRun driver disk: X99 chipset driver/INF-X99, click on “yes”andthen“next”to continue. Click on“finished” and restart theDriver Directory Driver DescriptionOperating SystemX99 Chipset Driver Intel chipinformation installation INF_X99Tools\Directx11Directx11 installationDXSETUP X99 Suond Card DriverRealtek series sound card driver installationVista-win7-r267wdwX99 LAN DriverIntel chipNIC installation Win7 XP2 -13 SATA InterfaceSATA3.0SSATA3.05.Driver installation of external video cardRun "driver disk", take Setup.exe, Click on "next"- "yes”-"next"-"next"and"finished"hThe system will automatically search for devices to complete the installation6.Driver installation of networkRun "driver disk": X99 LAN DRIVER/WIN7 XP click on "next"-"installation"- "finished"and restart the computer, and restart the computer,The system will automatically search for devices to complete the installation.BIOS SettingsIn order to enable the computer to work well or execute specific functions, CMOS SETUP normally stores all kinds of data in CMOS SRAM of the motherboard. When the computer is shut down,mother-board `s battery will supply power to CMOS SRAM. When the comput-er is turned on and starts POST(Power On Self Test), press “Delete/Del” key to enter into AMI BIOS CMOS SETUP main page. Motherboard warm boot key is “F7”.add/remove"so thatthe driver will be automatically removed.。
Enterprise Development专业品质权威Analysis Report企业发展分析报告浙江金马逊智能制造股份有限公司免责声明:本报告通过对该企业公开数据进行分析生成,并不完全代表我方对该企业的意见,如有错误请及时联系;本报告出于对企业发展研究目的产生,仅供参考,在任何情况下,使用本报告所引起的一切后果,我方不承担任何责任:本报告不得用于一切商业用途,如需引用或合作,请与我方联系:浙江金马逊智能制造股份有限公司1企业发展分析结果1.1 企业发展指数得分企业发展指数得分浙江金马逊智能制造股份有限公司综合得分说明:企业发展指数根据企业规模、企业创新、企业风险、企业活力四个维度对企业发展情况进行评价。
该企业的综合评价得分需要您得到该公司授权后,我们将协助您分析给出。
1.2 企业画像类别内容行业空资质增值税一般纳税人产品服务:数控机床制造;智能基础制造装备制造;金属1.3 发展历程2工商2.1工商信息2.2工商变更2.3股东结构2.4主要人员2.5分支机构2.6对外投资2.7企业年报2.8股权出质2.9动产抵押2.10司法协助2.11清算2.12注销3投融资3.1融资历史3.2投资事件3.3核心团队3.4企业业务4企业信用4.1企业信用4.2行政许可-工商局4.3行政处罚-信用中国4.5税务评级4.6税务处罚4.7经营异常4.8经营异常-工商局4.9采购不良行为4.10产品抽查4.12欠税公告4.13环保处罚4.14被执行人5司法文书5.1法律诉讼(当事人)5.2法律诉讼(相关人)5.3开庭公告5.4被执行人5.5法院公告5.6破产暂无破产数据6企业资质6.1资质许可6.2人员资质6.3产品许可6.4特殊许可7知识产权7.1商标7.2专利7.3软件著作权7.4作品著作权7.5网站备案7.6应用APP7.7微信公众号8招标中标8.1政府招标8.2政府中标8.3央企招标8.4央企中标9标准9.1国家标准9.2行业标准9.3团体标准9.4地方标准10成果奖励10.1国家奖励10.2省部奖励10.3社会奖励10.4科技成果11 土地11.1大块土地出让11.2出让公告11.3土地抵押11.4地块公示11.5大企业购地11.6土地出租11.7土地结果11.8土地转让12基金12.1国家自然基金12.2国家自然基金成果12.3国家社科基金13招聘13.1招聘信息感谢阅读:感谢您耐心地阅读这份企业调查分析报告。
QY-9315S 主板硬件说明书版 本 号:V 1.1杭州启扬智能科技有限公司出品杭州启扬智能科技有限公司版权所有2008年7月杭州启扬智能科技有限公司目 录一、前言 (3)1、 公司简介........................................3 2、 QY-9315S 主板的使用建议. (3)二、系统组成 (4)2.1、主板资源.........................................4 2.2、主板接口及定义. (5)2.2.1、主板接口 (5)2.2.2、主板接口定义 (7)2.2.3、指示灯说明 (11)2.2.4、跳线说明....................................11 2.3、主板规格. (12)三、光盘...............................................14 四、软件描述.........................................14 五、附注. (14)杭州启扬智能科技有限公司一、 前言1、 公司简介:杭州启扬智能科技有限公司位于美丽的西子湖畔,是一家集研发、生产、销售为一体的高新技术产业。
公司致力于成为嵌入式解决方案的专业提供商,为嵌入式应用领域客户提供软硬件开发工具、嵌入式系统完整解决方案。
产品范围主要包括:Cirrus Logic EP9315系列ARM 主板/核心板、ATMEL 系列ARM 主板/核心板音/视频通用开发平台可运行Linux2.4/2.6、WinCE 4.2/5.0/6.0操作系统,并可根据客户需求开发各种功能组合的嵌入式硬件系统。
应用领域涉及:网络视频监控、网络视频点播、车载娱乐系统、手持娱乐系统客户的需求是公司发展的动力,公司将不断完善自身,与客户互助互惠,共同发展。
2、 QY-9315S 工业主板的使用建议:1) 使用主板之前,请务必首先阅读本说明书;2) 了解主板的基本结构和组成,包括硬件资源的分配,主板的各个引脚定义等等;3) 如果您需要在Linux 系统下进行设计开发,对主板进行程序烧录,除本文档外,还建议阅读另一篇文档《QY-9315S Linux 用户手册》;4) 如果您需要在WinCE 系统下进行设计开发,对主板进行程序烧录,除 本文档外,还建议阅读另一篇文档《QY-9315S WinCE 用户手册》;杭州启扬智能科技有限公司二、系统组成2.1、主板资源:QY-9315S 工业主板由单板结构构成。
31.5" LCD Monitor Dell S3221QSServiceServiceServiceSimplifiedImportant Safety NoticeProper service and repair is important to the safe, reliable operation of all DELL Company Equipment. The service procedures recommended by DELL and described in this service manual are effective methods of performing service operations. Some of these service operations require the use of tools specially designed for the purpose. The special tools should be used when and as recommended.It is important to note that this manual contains various CAUTIONS and NOTICES which should be carefully read in order to minimize the risk of personal injury to service personnel. The possibility exists that improper service methods may damage the equipment. It is also important to understand that these CAUTIONS and NOTICES ARE NOT EXHAUSTIVE. DELL could not possibly know, evaluate and advise the service trade of all conceivable ways in which service might be done or of the possible hazardous consequences of each way. Consequently, DELL has not undertaken any such broad evaluation. Accordingly, a servicer who uses a service procedure or tool which is not recommended by DELL must first satisfy himself thoroughly that neither his safety nor the safe operation of the equipment will be jeopardized by the service method selected.Hereafter throughout this manual, DELL Company will be referred to as DELL.WARNINGUse of substitute replacement parts, which do not have the same, specified safety characteristics may create shock, fire, or other hazards.Under no circumstances should the original design be modified or altered without written permission from DELL. DELL assumes no liability, express or implied, arising out of any unauthorized modification of design.Servicer assumes all liability.FOR PRODUCTS CONTAINING LASER:DANGER-Invisible laser radiation when open. AVOID DIRECT EXPOSURE TO BEAM.CAUTION-Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.CAUTION -The use of optical instruments with this product will increase eye hazard.TO ENSURE THE CONTINUED RELIABILITY OF THIS PRODUCT, USE ONLY ORIGINAL MANUFACTURER'S REPLACEMENT PARTS, WHICH ARE LISTED WITH THEIR PART NUMBERS IN THE PARTS LIST SECTION OF THIS SERVICE MANUAL.Take care during handling the LCD module with backlight unit-Must mount the module using mounting holes arranged in four corners.-Do not press on the panel, edge of the frame strongly or electric shock as this will result in damage to the screen. -Do not scratch or press on the panel with any sharp objects, such as pencil or pen as this may result in damage to the panel.-Protect the module from the ESD as it may damage the electronic circuit (C-MOS).-Make certain that treatment person’s body is grounded through wristband.-Do not leave the module in high temperature and in areas of high humidity for a long time.-Avoid contact with water as it may a short circuit within the module.-If the surface of panel becomes dirty, please wipe it off with a soft material. (Cleaning with a dirty or rough cloth may damage the panel.)1. Exploded view diagram with list of items3No. Description Q’ty1 PANEL 12 DECO_BEZEL 13 BEZEL_BTM 14 SPONGE 15 MIDDLE_FRAME 1BOARD 17 KEY8 KEY 19 KEY_POWER 1BOARD 110 CONVERTERBOARD 111 MAINBOARD 113 ADAPTER15 MAINFRAME 118 SPEAKER 1 No. PartNo. Description Q’ty21 Latch NA 1 6 Q01G6019 1 SCREW(MIDDLEFRAME/DECO BEZEL) 1222 SPRING 2 12 0D1G1030 6120 SCREW D3 6(MAIN BOARD/POWER BOARD/MAINFRAME) 1223 STAND_BUTTON 1 14 QM1G38400601200ARA SCREW -- 6mm(POWER BOARD/MAINFRAME) 124 BKT_HINGE 1 16 0M1G3030 4120 SCREW 3 4(MAINFRAME/PANEL) 425 REAR_COVER 1 17 0M1G3030 4120 SCREW 3 4 (MIDDLEFRAME/PANEL) 1527 stand ass'y 1 19 0Q1G2030 6120 SCREW M3 6(SPEAKER/PANEL) 428 BASE_ASS’Y 1 20 0Q1G2030 6120 SCREW M3 6(LATCH/REAR COVER) 329 LOGO DELL 1 26 0M1G2940 10125 SCREW M4 10(REAR COVER/MAINFRAME) 442. Wiring connectivity diagramConnector Ass’y PN:Connector Ass’y PN: 395G179X51N52700HFConnector Ass’y PN: Connector Ass’y PN: 395G076Q00852700HFConnector Ass’y PN:This Connector welding in Key Board3.Mechanical InstructionTools RequiredList the type and size of the tools that would typically can be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.Tool Description:- Phillip head Screwdriver- Hex Screwdriver- Penknife3.1 Disassembly Procedures:Step Figure RemarkS1.Before disassembleTurn off power, Unplug external cables from productS2.Remove the STAND-BASEASS’YP u sh the button to remove the stand-base assy.S3.Remove the REAR COVERUse a Philips-head screwdriver to remove 4 screws for unlockingmechanisms . (No.1~4 screw size=M4x10; Torque: 12±2kgf.cm)Use Penknife toseparate the bezel andrear cove follow thearrows in sequence,then you can take outrear cover.S4.T ear off thetapesT ear off 5 pieces ofaluminum foil a nd 2pieces of tapes.Disconnect the lampcable from theconnectors of thepower board and panelmodule. Use aPhilips-headscrewdriver to remove4 screws for unlockingthe speakers.(No.1~4 Screwsize=M3x6, Torque:4±1kgf.cm)S5.Remove main board and powerboardRemove the Mylar. Use a Philips-head screwdriver to remove 12 screws for unlocking the main board and the adapter board(No.1~11 screwsize=D3x6, Torque: 6±1kgf.cm)(No.12 screw size=M4x6, Torque: 6±1kgf.cm)D isconnect all of the cablesS6.Remove the bezel and panelUse a Philips-head screwdriver to remove 15 screws for unlocking the middle plastic bezelwith the whole unit, and then remove the middle plastic bezel carefully.(No.1~15 screw size=M3x4,Torque=3±0.5kgfxcm)S7.Remove the key boardUse a Philips-head screwdriver to remove 3screws to remove the key board.(No.1~3 screw size=M6x19,Torque=0.9±0.4kgf.cm)S8. Remove the BEZEL_BTMUse a Philips-head screwdriver to remove 7 screws for unlocking the BEZEL_BTM and the Panel.(No.1~7 screw size=M6x19,Torque=0.9±0.4kgf.cm)3.2 Assembly Procedures:Step Figure RemarkS1.Assembly the BEZEL_BTMUse a Philips-head screwdriver to tighten 7 screws for locking theBEZEL_BTM and the Panel.(No.1~7 screw size=M6x19,Torque=0.9±0.4kgf.cm)S2.Assembly the KEY BOARDUse a Philips-head screwdriver to tighten 3screws to locking the key board.(No.1~3 screw size=M6x19,Torque=0.9±0.4kgf.cm)S3.Assembly the Be zel and panelUse a Philips-head screwdriver to tighten 15 screws for locking the middle plastic bezelwith the whole unit, and then remove the middle plastic bezel carefully.(No.1~15 screw size=M3x4,Torque=3±0.5kgfxcm)S4. Assembly the MAIN board and power boardUse a Philips-head screwdriver to tighten 12 screws for locking the main board and the adapter board(No.1~11 screw size=D3x6, Torque:6±1kgf.cm)(No.12 screw size=M4x6, Torque: 6±1kgf.cm)Connect all of the cables And pasted the mylar sheetS5. Connect the FFC cable ,Pasted the TAPEsConnect the lamp cable from the connectors of the power board and panel module.Use a Philips-headscrewdriver to tighten 4 screws for locking the speakers.(No.1~4 Screw size=M3x6, Torque: 4±1kgf.cm)P asted 5 pieces ofaluminum foil a nd 2pieces of tapes.S6.A ssembly theR ear coverUse a Philips-headscrewdriver to tighten 4screws for lockingmechanisms.(No.1~4 screwsize=M4x10; Torque:12±2kgf.cm)S7.Assembly theStand4. Trouble shooting instructions。
S32R372141EVBQUICK START GUIDE (QSG)Ultra-Reliable MCUs for Industrial and Automotive ApplicationsS32R372141EVB WebpageContents•Quick Start Package Overview •Step-by-Step Installation Instructions •Hardware: S32R372141EVB Board −Features−S32R372141EVB Overview−S32R372141EVB Pinout Settings−Communication and Debug Interfaces−Power Supply•Software:−Software Development Tools−Pre-compiled Code Examples•Documentation•Radar Family Comparison •RecommendationsQuick Start Package OverviewBoard:S32R372141EVB S32R372 evaluation board for 141 BGA package. Can run standalone or with Radar front-end Documents:Name DescriptionQuick Start Guide(QSG)Detailed description on availability of Hardware,Software and Documents to quick start with S32R372project (this document)Software Installation Guide(SWIG)Detailed walk through on how to install and use S32 Design Studio for Power Architecture Application Notes Detailed documents covering topics from‘how to design hardware’ to ‘how to write software’Fact Sheets, Reference Manuals and Data Sheets Detailed manuals for S32R family of MCU and S32R372141EVB boardDownloads:Name DescriptionIntegrated Development Environment (IDE)Eclipse based S32DS IDE with free GCC compiler and Debugger supportS32R372141EVB Quick Start Package Software examples and supporting documents for getting started with the S32R372141EVBS32R372141EVB Schematics PDF schematic files for the S32R372141EVB boardS32R372141EVB PCB Design Package Gerber files and Bill of MaterialStep-by-Step Installation Instructions1Install Software and ToolsInstall S32 Design Studio IDE for Power Architecture.S32 Design Studio for PowerSee Software Installation Guide (SWIG) for detailed procedure2Connect the DebuggerConnect the debugger (e.g. P&E USB Multilink) to the board.3Observe the Default Program reactionThe pre-loaded example project utilizes the S32R’s multiple cores. Once the board is plugged in, the S32R’s PLLs will be programmed to max frequency. The CLKOUT pin will display the frequency of each PLL in a round-robin fashion as each core takes turns controlling CLKOUT.4Learn More About the S32R37x-141BGA Read release notes and documentation on the S32R372 Product PageS32R274RRUEVB Product PageIn this quick start guide,you will learn how to set up the S32R372141EVB board and run the default program.S32R372141EVB Board : Features•S32R27 has 2 x 240 MHz Power Architecture® e200Z7 computation cores•S32Rx qualified to AEC-Q100 Grade 1 and ambient temperature of -40 to+150 °C•S32R372141EVB is a low cost standalone radar EVB. Attach a radar transceiver to the MIPI-CSI2 connector to take advantage of its radar processing capability•Integrated JTAG interface for easy debugging•Easy access to the MCU I/O header pins for prototyping•Nexus traceport•Solder points for Gb Ethernet port•MIPI_CSI2 connector•Flexible power supply options•12V and GND pins to allow you to supply from DC generator •12V External power supply via barrel connector •Box includes:−S32R372141EVB Board •Downloads includes:−Quick Start Package−S32 Design Studio IDE−Application notesS32R372141EVB Board : OverviewThe S32R372141EVB is NXP’s evaluation board for the S32R372 radar processor. It is designed to be paired with an analog front end. NXP supports the TEF810 and MR3003 radartransceivers, but third-party options are possible.This EVB features I/O headers, trace ports, and CAN ports to meet any prototyping needs at a low cost.NXP MicrocontrollerS32R372JTAGEthernet Port (DNP)MIPI-CSI2 ConnectorGPIO PinsPower Supply CAN PHYNexus Trace PortReset ButtonNote: “DNP” stands for “Do not populate”, meaning pin is disconnected by default. You mustP3FUNCTION PORT PIN PIN PORT FUNCTION GND GND GND GND GPIO[62]PD14P4-16P4-15PD6GPIO[54]GPIO[51]PD3P4-14P4-13PD1ETIMER_ETC2ETIMER_ETC0PC15P4-12P4-11PC12ETIMER_ETC2GPIO[32]PC0P4-10P4-9PB15ADC1_AN2ADC1_AN0PB13P4-8P4-7PB6GPIO[22]_CLKOUT TDI PB5P4-6P4-5PB4TDO GPIO[19]PB3P4-4P4-3PB2GPIO[18]CAN0_RXDPB1P4-2P4-1PB0CAN0_TXDFUNCTIONPORT PIN PIN PORT FUNCTIONGND GND GND GND GPIO[15]PA15P3-16P3-15PA14SIUL_EIRQ13DSPI2_SIN PA13P3-14P3-13PA12DSPI2_SOUT DSPI2_SCK PA11P3-12P3-11PA10DSPI2_CS0GPIO[9]PA9P3-10P3-9PA8TX1_PS TX2_PS PA7P3-8P3-7PA6TX3_PS EIRQ_5PA5P3-6P3-5PA4ERROR_RST SSN-MEM PA3P3-4P3-3PA2SBC_FS0B EIRQ_1PA1P3-2P3-1PA0ERROR_NP3P4P4FUNCTIONPORT PIN PIN PORT FUNCTIONGND GND GND GND NCP5-16P5-15NCFCCU_1FCCU_F1P5-14P5-13FCCU_F0FCCU_0NMI NMI P5-12P5-11PI5CAN2_TXD RESETPI4P5-10P5-9PH7GPIO[119]GPIO[104]PG8P5-8P5-7PF15CAN2_RXD CTE_RCS PF0P5-6P5-5PE15GPIO[79]_CLKOUT GPIO[77]PE13P5-4P5-3PE6GPIO[70]GPIO[68]PE4P5-2P5-1PE2GPIO[66]P5P5CAN2CAN_2DESCRIPTION NAME PIN Port PI5 & PF15CANL J35-03GND J35-02CANH J35-01CAN_0DESCRIPTION NAME PIN Port PB0 & PB1CANLJ31-03GND J31-02CANHJ31-01CAN0EthernetEthernet (DNP)DESCRIPTION PORTMTI_P0_IUC MTI_P0MTI_N0_IUC MTI_N0MTI_N2_IUC MTI_N2MTI_P1_IUC MTI_P1MTI_N1_IUC MTI_N1MTI_P2_IUC MTI_P2MTI_N3_IUC MTI_N3MTI_P3_IUC MTI_P3*These pins map to special purpose pads on the S32R274 MCU instead of general purposeMIPI-CSI2MIPI-CSI2DESCRIPTION PORT GND GND ETIMER_ETC0PC15 GND GNDCTE_RCS PF0GND GNDCTE_RFS PE13 GND GND SIUL_EIRQ13PA14 GND GND DSPI2_SCK PA11 GND GND DSPI2_CS0PA10 GND GND DSPI2_SIN PA13 GND GND DSPI2_SOUT PA12 GND GND ETIMER_ETC2PD1 GND GND GND GND GND GND GND GND GND GND GND GNDADC1_AN_0PB13 GND GND GND GND GND GND GND GND GND GNDSD_0_ADCP TP4 (EVB Test Pt.) SD_0_ADCN TP3 (EVB Test Pt.) GND GND GND GND GND GND MCU_CLK_SE TP1 (EVB Test Pt.) GND GND GND GND MCU_CLK_N XOSC_XTAL MCU_CLK_P XOSC_EXTAL GND GND GND GND GND GND GND GNDMIPI-CSI2DESCRIPTION PORT GND GND GND GND GND GNDTX2_PS PA7 GND GNDTX3_PS PA6 GND GNDTX1_PS PA8 GND GND RESET PI4 GND GND ERROR_N PA1 GND GND ERROR_RST PA4 GND GND SSN_MEM PA3 GND GND GND GND RESET_B RESET_B GND GND GND GND GND GND GND GND GND GND GND GND EIRQ_5PA5 GND GND GND GND GND GNDCSI_LANE1P CSI_LANE1P CSI_LANE1N CSI_LANE1N GND GNDCSI_LANE0N CSI_LANE0N CSI_LANE0P CSI_LANE0P GND GNDCSI_CLKP CSI_CLKP CSI_CLKN CSI_CLKN GND GND FRNT_END_REG FRNT_END_REG FRNT_END_REG FRNT_END_REG FRNT_END_REG FRNT_END_REG FRNT_END_REG FRNT_END_REG FRNT_END_REG FRNT_END_REG GND GNDEthernet Ethernet (DNP)DESCRIPTION PORTMTI_P0_IUC MTI_P0MTI_N0_IUC MTI_N0MTI_N2_IUC MTI_N2MTI_P1_IUC MTI_P1MTI_N1_IUC MTI_N1 MTI_P2_IUC MTI_P2 MTI_N3_IUC MTI_N3 MTI_P3_IUC MTI_P3MIPI-CSI2MIPI-CSI2DESCRIPTION PORTETIMER2_ETC3PC12SD_0_ADCN*SDADC0 Neg. Inp.SD_0_ADCP*SDADC0 Pos. Inp.CTE_RFS PE13DSPI2_SOUT PA12DSPI2_SIN PA13DSPI2_CS0PA10DSPI2_SCK PA11SIUL_EIRQ5PA5MCU_CLK_P*XOSC_XTAL (DNP)MCU_CLK_N*XOSC_EXTAL (DNP)ETIMER2_ETC0PB2MCU_CLK_SE*XOSC_EXTAL (DNP)ADC0_AN_0PB7RESET_B*RESET_BCTE_RCS PF0CSI_LANE2N*Lane2 Neg. Inp.CSI_LANE2P*Lane2 Pos. Inp.CSI_LANE0P*Lane0 Neg. Inp.CSI_LANE0N*Lane0 Pos. Inp.CSI_CLKN*Clock Neg. Inp.CSI_CLKP*Clock Pos. Inp.CSI_LANE1P*Lane1 Pos. Inp.CSI_LANE1N*Lane1 Neg. Inp.CSI_LANE3N*Lane3 Neg. Inp.CSI_LANE3P*Lane3 Pos. Inp.*These pins map to special purpose pads on the S32R274 MCU instead of general purposeS32R372141EVB: Programing InterfaceJTAGDESCRIPTION PINSupport for JTAG-capabledebugger such as USB Multilink J28JTAGS32R372141EVB: Power SupplyThe S32R372141EVB supports two power options. You can generate 12V from a DC generator and connect that to P2; or you can plug in a 12V power supply through the barrel connector P1. NXP does not directly sell 12V power supplies. You can obtain a power supply through a third-party vendor.Power supply specifications:Fully regulated Switching Power Supply Input Voltage 100-240V AC 50/60Hz Output 12V 1A/2A DCPlug size: 5.5mm x 2.1 mm, Center PositiveP1P2Package Level Pinout Diagram –S32R372 (141 BGA)Software Development Tools•S32 Design Studio IDE for Power Architecture•IDE & Compilers−Free S32 Design Studio IDE with GCC compiler−GHS MULTI Integrated Development Environment−Cosmic IDE−iSystems winIDEA IDE−Sourcery TM CodeBench Development Tools•Debuggers−Free OpenSDA debugger on board and supported by S32DS IDE −P&E USB Multilink−iSystems iC6000−Lauterbach TRACE32 JTAG DebuggerPre-Compiled Code Examples •Quick start examples forS32R372141EVB are available in the Quick Start Package to help familiarize you to the board•The QSP also includes application examples that demonstrate theS32R37’s radar capabilities. These include tutorial videos and a radar transceiver (COMING SOON)List of code examples:1.Hello World2.Hello World + PLL3.Hello World + PLL +Interrupts4.FlexCAN(coming soon)NOTE: Run these examples with S32DS for Power Architecture v2017.R1 or laterDocumentation and Reference Material•Documentation Links−S32R372 Datasheet−S32R372 Factsheet•Application Notes−S32R Radar Signal Compression−S32R27/37 Hardware Design Guide−Clock Monitor Unit Guide−e200 Core Memory Protection Unit Guide •Reference Manuals−S32R372 Family Reference Manual−S32R372 Family Safety ManualRadar Family –Product Feature Differences•S32R372 is the low-cost counterpart to the S32R274 radar processor •Selected features belowMCUFEATURESFlash*RAMEEPROMSecurity Transceiver InterfaceS32R274 2.0MB 1.5MB Emulate Yes 1 x 4-lane MIPI-CSI2 S32R372*Differences in memory are all in the Large Flash BlockRecommendations•For faster debugging, debug from RAM, because this cuts down the lengthy Flash erase operation cycles. Follow the Software Integration Guide (SWIG) for details.•By default “New Project” in S32 Design Studio IDE makes application to run at 16 MHz Internal RC (IRC) oscillator. For faster performance, configure PLL to desired frequency and switch clock source to PLL before executing application code.•Keep S32 Design Studio IDE and OpenSDA firmware Up-to-date for best results•Post Technical Questions on NXP community for MPC5xxx.•Useful Links:−S32R372 Webpage−S32R372141EVB Webpage−/s32ds−/community。
Enterprise Development专业品质权威Analysis Report企业发展分析报告北京汉龙思琪数码科技有限公司福建分公司免责声明:本报告通过对该企业公开数据进行分析生成,并不完全代表我方对该企业的意见,如有错误请及时联系;本报告出于对企业发展研究目的产生,仅供参考,在任何情况下,使用本报告所引起的一切后果,我方不承担任何责任:本报告不得用于一切商业用途,如需引用或合作,请与我方联系:北京汉龙思琪数码科技有限公司福建分公司1企业发展分析结果1.1 企业发展指数得分企业发展指数得分北京汉龙思琪数码科技有限公司福建分公司综合得分说明:企业发展指数根据企业规模、企业创新、企业风险、企业活力四个维度对企业发展情况进行评价。
该企业的综合评价得分需要您得到该公司授权后,我们将协助您分析给出。
1.2 企业画像类别内容行业空资质空产品服务:软件开发;档案整理服务;技术服务、技术开1.3 发展历程2工商2.1工商信息2.2工商变更2.3股东结构2.4主要人员2.5分支机构2.6对外投资2.7企业年报2.8股权出质2.9动产抵押2.10司法协助2.11清算2.12注销3投融资3.1融资历史3.2投资事件3.3核心团队3.4企业业务4企业信用4.1企业信用4.2行政许可-工商局4.3行政处罚-信用中国4.5税务评级4.6税务处罚4.7经营异常4.8经营异常-工商局4.9采购不良行为4.10产品抽查4.12欠税公告4.13环保处罚4.14被执行人5司法文书5.1法律诉讼(当事人)5.2法律诉讼(相关人)5.3开庭公告5.4被执行人5.5法院公告5.6破产暂无破产数据6企业资质6.1资质许可6.2人员资质6.3产品许可6.4特殊许可7知识产权7.1商标7.2专利7.3软件著作权7.4作品著作权7.5网站备案7.6应用APP7.7微信公众号8招标中标8.1政府招标8.2政府中标8.3央企招标8.4央企中标9标准9.1国家标准9.2行业标准9.3团体标准9.4地方标准10成果奖励10.1国家奖励10.2省部奖励10.3社会奖励10.4科技成果11 土地11.1大块土地出让11.2出让公告11.3土地抵押11.4地块公示11.5大企业购地11.6土地出租11.7土地结果11.8土地转让12基金12.1国家自然基金12.2国家自然基金成果12.3国家社科基金13招聘13.1招聘信息感谢阅读:感谢您耐心地阅读这份企业调查分析报告。
杭州启扬智能科技有限公司QY-9263S 硬件说明手册版本号v2.82011/11/20杭州启扬智能有限公司版权所有QIYANG TECHNOLOGY Co., LtdCopyright Reserved目录前言 (1)一、使用建议 (2)二、系统组成 (2)2.1 系统资源 (2)2.2 机械参数 (3)三、主板接口 (3)三、硬件详细说明 (4)3.1 SDRAM存储器 (4)3.2 DateFlash存储器 (4)3.3 NandFlash存储器 (4)3.4 USB接口 (5)3.5以太网接口 (5)3.6音频模块 (5)3.7 LCD接口 (5)3.8 KEYBOARD接口 (5)3.9 PIO接口 (6)3.10 MISC接口 (6)3.11 CAN总线接口 (7)3.12 RTC (7)3.13串口 (7)3.14电源 (8)四、附录 (8)前言欢迎使用杭州启扬智能科技有限公司产品QY-9263S,本产品Linux部分主要包含3份手册:QY-9263S Linux 用户手册、QY-9263S 硬件说明手册以及QY-9263S Linux测试手册。
硬件相关部分可以参考QY-9263S 硬件说明手册,主板测试可以参考QY-9263S Linux测试手册。
使用之前请仔细阅读QY-9263S 用户手册以及QY-9263S 硬件说明手册!公司简介杭州启扬智能科技有限公司位于美丽的西子湖畔,是一家集研发、生产、销售为一体的高新技术产业。
公司致力于成为嵌入式解决方案的专业提供商,为嵌入式应用领域客户提供软硬件开发工具和嵌入式系统完整解决方案。
产品范围主要包括:Cirrus Logic EP93xx系列ARM9主板、ATMEL AT91SAM926x系列主板,FreeScale iMX系列主板,TI Davinci系列音/视频通用开发平台等等。
可运行Linux2.4/2.6、WinCE5.0/6.0操作系统,并可根据客户需求开发各种功能组合的嵌入式硬件系统。
Enterprise Development专业品质权威Analysis Report企业发展分析报告深圳安博电子有限公司免责声明:本报告通过对该企业公开数据进行分析生成,并不完全代表我方对该企业的意见,如有错误请及时联系;本报告出于对企业发展研究目的产生,仅供参考,在任何情况下,使用本报告所引起的一切后果,我方不承担任何责任:本报告不得用于一切商业用途,如需引用或合作,请与我方联系:深圳安博电子有限公司1企业发展分析结果1.1 企业发展指数得分企业发展指数得分深圳安博电子有限公司综合得分说明:企业发展指数根据企业规模、企业创新、企业风险、企业活力四个维度对企业发展情况进行评价。
该企业的综合评价得分需要您得到该公司授权后,我们将协助您分析给出。
1.2 企业画像类别内容行业计算机、通信和其他电子设备制造业-智能消费设备制造资质一般纳税人产品服务是:网络信息技术及软件的开发,技术咨询及1.3 发展历程2工商2.1工商信息2.2工商变更2.3股东结构2.4主要人员2.5分支机构2.6对外投资2.7企业年报2.8股权出质2.9动产抵押2.10司法协助2.11清算2.12注销3投融资3.1融资历史3.2投资事件3.3核心团队3.4企业业务4企业信用4.1企业信用4.2行政许可-工商局4.3行政处罚-信用中国4.4行政处罚-工商局4.5税务评级4.6税务处罚4.7经营异常4.8经营异常-工商局4.9采购不良行为4.10产品抽查4.11产品抽查-工商局4.12欠税公告4.13环保处罚4.14被执行人5司法文书5.1法律诉讼(当事人)5.2法律诉讼(相关人)5.3开庭公告5.4被执行人5.5法院公告5.6破产暂无破产数据6企业资质6.1资质许可6.2人员资质6.3产品许可6.4特殊许可7知识产权7.1商标信息最多显示100条记录,如需更多信息请到企业大数据平台查询7.2专利7.3软件著作权7.4作品著作权7.5网站备案7.6应用APP7.7微信公众号8招标中标8.1政府招标8.2政府中标8.3央企招标8.4央企中标9标准9.1国家标准9.2行业标准9.3团体标准9.4地方标准10成果奖励10.1国家奖励10.2省部奖励10.3社会奖励10.4科技成果11 土地11.1大块土地出让11.2出让公告11.3土地抵押11.4地块公示11.5大企业购地11.6土地出租11.7土地结果11.8土地转让12基金12.1国家自然基金12.2国家自然基金成果12.3国家社科基金13招聘13.1招聘信息感谢阅读:感谢您耐心地阅读这份企业调查分析报告。