ASM内部资料

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Standard Wire Bond to Heavy Wire Bond Conversion Procedure
(For Motorola)
1.Ensure bonder s/w version is the same stated below:
2.Dismantle the EFO module cover and locate the JP9 at the control board. Then disconnect
the JP9 by pulling off the jumper.
3.Change EFO cable from Standard 100mA EFO cable to 200mA EFO cable.
4.Replace the Standard B/H & W/C Driver to 1kgf B/H & W/C Driver.
5.Change Wire Clamp from Standard Wire Clamp, 100g; to Heavy Wire Clamp, 400g.
6.Restore the calibration data from floppy disk (saved before).
7.Ensure all FL Filter Block Parameter at FTN16 (password 2009) –Servo Parameter –Z-
8.Ensure the Force Ratio is within 1.24 – 1.36 range (inside FTN 900).
9.Change E-Torch tip from stainless steel 0.5mm diameter tip to stainless steel or platinum
1.0mm diameter tip
10.No need to do AFT Tuning after changing of driver.
Note: For first time conversion or do not have the back-up calibration data in floppy disk, need to carry out bond force calibration and wire clamp calibration.
Bond force calibration:
ing Force Calibrator & Force Control Adjustment Unit.
2.Setup > Calibration > Bond Force Calibration > Force Calibration Snr > Calibration.
Wire clamp calibration:
1.Setup > Calibration > Wire clamp Calibration.
2.Ensure clamp gap are set to a desired gap according to wire size, and clamp force are within
specification
The 2kgf B/H & W/C driver are only meant for4mil and above wire size bonding only. Mainly for Cu wire bonding only. This 2kgf B/H&W/C driver is also compatible in bonding 3mil wire size Cu bonding.。