HCF4020BEY中文资料

AXIS A4020-E Reader Manual del usuarioInstalaciónInstalaciónPara ver este vídeo,vaya a la versión web de este documento./?&piaId=70685&section=installVídeo de instalación del dispositivo.CableadoConecte los cables del lector al controlador de puerta como se indica en la tabla.AXIS A4020-EAXIS A1001Otros controladores de puerta de Axis AXIS A4120-EB A BA B A+12V12V---Configure su dispositivoConfigure su dispositivoEl dispositivo funciona como lector OSDP estándar listo para usarse.Puede acceder a características específicas y cambiar los ajustes en AXIS Camera Station Secure Entry.A continuación se muestra un ejemplo de cómo configurar el dispositivo mediante AXIS Camera Station Secure Entry.Comunicación cifradaCanal seguro OSDPAXIS Camera Station Secure Entry admite el canal seguro OSDP(Protocolo abierto de dispositivos supervisados)para activar el cifrado de la línea entre el controlador y los lectores de Axis.Para activar OSDP Secure Channel en todo el sistema:1.Vaya a Configuration>Access control>Encrypted communication(Configuración>Control de acceso>Comunicación cifrada).2.Especifique la clave de cifrado principal y haga clic en OK(Aceptar).Para cambiar la clave de cifrado principal,hagaclic en.3.Active OSDP Secure Channel(Canal seguro OSDP).Esta opción solo estádisponible una vez que haya establecido laclave de cifrado principal.4.De forma predeterminada,la clave del canal seguro OSDP es generada por la clave de cifrado principal.Para configurarmanualmente la clave de canal seguro OSDP:4.1En OSDP Secure Channel(Canal seguro OSDP),haga clic en.4.2Elimine Use main encryption key to generate OSDP Secure Channel key(Utilice la clave de cifrado principalpara generar la clave de canal seguro OSDP).4.3Introduzca la clave de canal seguro OSDP y haga clic en OK(Aceptar).Para encender o apagar el canal seguro OSDP para un lector específico,consulte Doors and zones(Puertas y zonas).Solución de problemasSolución de problemasRestablecimiento a la configuración predeterminada de fábricaTodos los valores se restablecen a la configuración predeterminada de fábrica.Para ver este vídeo,vaya a la versión web de este documento./?&piaId=70685&section=install1.Quite el dispositivo de la placa posterior.Se desconecta la alimentación del dispositivo.2.Extraiga el conector de la placa posterior.3.Utilice un instrumento sin punta para mantener pulsado el botón de control mientras vuelve a conectar la alimentaciónuniendo el bloque de terminales a los pines del dispositivo.Consulte Información general del producto en la página5.Cuando vuelva a haber alimentación,oiráun breve sonido.Indica que se ha pulsado el botón.4.Mantenga pulsado el botón de control durante unos segundos.5.Suelte el botón de control.Oiráun sonido que indica que el dispositivo se ha restablecido a la configuraciónpredeterminada de fábrica.6.Coloque el bloque de terminales en su sitio en la placa posterior.7.Enganche el dispositivo a la placa posterior y cierre la unidad lentamente.EspecificacionesEspecificacionesInformación general del producto1Banda del indicador del lector2Switches DIP3Botón de controlBanda del indicador del lectorComportamiento EstadoRojo intermitente En espera de la conexión con el controlador Switches DIPSwitch DIP Ajuste predeterminado Función1Desactivado 2Desactivado Dirección OSDP: Desactivado+Desactivado=0* Desactivado+Activado=1 Activado+Desactivado=2 Activado+Activado=33Desactivado Terminación RS485,Desactivado=activo 4Desactivado-5Desactivado-Especificaciones6Desactivado Modo seguro*Cuando los conmutadores1y2estén desactivados,puede usar el comando osdp_COMSET para cambiar la dirección.BotonesBotón de controlEl botón de control se utiliza para lo siguiente:•Restablecer el producto a los ajustes predeterminados de fábrica.Consulte Restablecimiento a la configuración predeterminada de fábrica en la página4.Velocidad en baudiosLa velocidad en baudios predeterminada es de9600.Para cambiarla,utilice el comando osdp_COMSET.Manual del usuario Ver.M5.2 AXIS A4020-E Reader Fecha:Julio2023©Axis Communications AB,2021-2023N.ºde pieza T10171378。

PC4020 v3.0 中文说明书图文PC4020 v3.0 ? 安装说明DLS-2 v1.3警告：本说明包括产品使用、功能和关于制造商责任方面的内容。

应仔细完整阅读本说明。

警告请仔细阅读安装者请注意此警告包括重要的资料。

作为与系统用户联系的唯一个体，您有责任使系统用户了解此警告的每个项目。

系统故障此系统经过认真设计，尽可能达到有效。

会出现某些情况，包括火警、盗警或其他不能提供保护的紧急情况。

任何类型的任何报警系统会考虑妥协，或由于种种原因而不能如期望般操作。

这些原因可能是：安装不当为了能够提供适当的保护，安防系统必须正确安装。

每次安装都必须由安防专业人员进行评估，以确保能覆盖所有访问点的区域。

门和窗上的锁和闩都必须是安全的，而且能正常操作。

窗、门、墙、天花板和其他建筑材料必须有足够的强度，而且建筑能够达到期望的保护水平。

在进行建筑活动期间或建筑活动后必须进行评估。

如果此设备可用的话，建议由消防队和/或警察局进行评估。

犯罪提示此系统的安防性能是十分可靠的。

有犯罪意向的人可能会从事降低这些安防性能有效性的研究。

定期检查安防系统是很重要的，可以确保性能保持有效，如果发现系统不能提供有效的保护，必须进行更新或替换。

侵入者的访问侵入者可以避开传感设备，从覆盖不足、断开连接警告设备的区域移动，或干涉及妨碍系统的正常运作，通过为被保护的访问点进入。

电源故障控制设备、入侵探测器、烟感探测器和许多其他的安防设备都需要适当的电源供应，便于正确操作。

如果设备用电池操作，电池可能出现故障。

即使电池不出故障，也必须充电、情况要良好以及安装正确。

如果只使用交流电，假设电流断开，哪怕只是暂时的，也会使设备在断电期间不能正常运作。

不同时间长度的电源中断往往伴随着会导致破坏电力设备如安防系统的电压波动。

发生电源中断后，要立即进行一次完整的系统测试，确保系统运作正常。

可替换电池的故障本系统的无线传送器经过特别设计，在一般情况下，电池寿命可达几年。

有 D.测试方法—萃取液的外观………………………………………….28 m E.测试方法—水生微观有机物的生长……………………………….32 询 o F.测试方法—萃取液的细胞毒素活动……………………………….40 c G.测试方法—萃取液的诱变活动..…………………………………..46 咨 . H.测试方法—金属萃取物…………………………………………….51 h I.测试方法—终端装置中金属萃取测试……………………………..56 务 s m J.高温测试……………………………………………………………..59 - o K.所列产品提交表…………………………………………………….61 上海海萨商www.hwywswa.hysash.c 03
限 (c) 试验时,从金属产品中萃取的金属一般是与饮用水接触产品的部件
不同于原版的内容如下: (i) 附录内容阐述的是换算系数的推导与应用. (ii) 对产品的测试是在高水温中进行.
有 (iii) 对诱变活动测试的校订内容,根据需要,为了使此测试与细胞毒素活动的测试更加准确,也 m 可将测试结果报告给此研究领域内的专家进行解释. 询 o (iv) 在水生微观有机物生长测试内容中取消了有关假单胞菌属氧化铜与大肠杆菌有机物的最 c 大允许量之规定. 咨 . 需要注意的是所有符合澳标 AS 3855(即与可饮用水接触的管类与供水类产品之适用性)的内 h 容,在 AS 3855 作为一个完整标准出版两年后会隶属于本标准.在此两年期间,一系列产品会依 务 s m 本标准进行测试,将这些测试结果之消息收集起来就可建立一个有关各类产品的数据库,并为 - o 标准中的其它测试提供精确数据,同时对产品可不经测试便能列出其清单,而且这样还可使标 商 a c 准经常受到审核,即使这样一来会超出澳标与新西兰标准与年审定一次的惯例,但该标准的修 s . 订版仍可发行.最终 CH/34 委员会将会每六个月开一次会,如果情况需要,也可是少于 6 个月来 萨 y h 审阅标准成员所需信息,从而对本标准进行适当的调整. h s “标准”与“非标准”在此标准中用来确定如何使用附录, 标准”附录只本标准内容的不可分割 上海海 www.www.hysa 部分,而“非标准”附录只用作提供信息与起指导作用.

HEF4020B14-stage binary counterRev. 04 — 4 December 2008Product data sheet1.General descriptionThe HEF4020B is a 14-stage binary counter with a clock input (CP), an overridingasynchronous master reset input (MR) and twelve fully buffered outputs (Q0, and Q3 toQ13).The counter advances on the HIGH to LOW transition of CP.A HIGH on MR clearsall counter stages and forces all outputs LOW, independent of the state of CP. Eachcounter stage is a static toggle flip-flop. A feature of the device is its high speed(typ.35MHz at V DD=15V).It operates over a recommended V DD power supply range of3V to15V referenced to V SS(usually ground). Unused inputs must be connected to V DD, V SS, or another input. It isalso suitable for use over the full industrial (−40°C to +85°C) temperature range.2.FeaturesI High speed operationI Fully static operationI 5 V, 10 V, and 15 V parametric ratingsI Standardized symmetrical output characteristicsI Operates across the full industrial temperature range−40°C to +85°CI Complies with JEDEC standard JESD 13-BI ESD protection:N HBM JESD22-A114E exceeds 2000VN MM JESD22-A115-A exceeds 200V3.ApplicationsI Industrial4.Ordering informationTable 1.Ordering informationAll types operate from−40°C to +85°C.Type number PackageName Description Version HEF4020BP DIP16plastic dual in-line package; 16-leads (300 mil)SOT38-4 HEF4020BT SO16plastic small outline package; 16 leads; body width 3.9mm SOT109-15.Functional diagramFig 1.Functional diagram001aad72214-STAGE COUNTER9Q07Q35Q44Q56Q613Q712Q814Q915Q101Q112Q123Q131011T C D MRCP Fig 2.Logic symbol Fig 3.IEC Logic symbol001aad723Q0911MR10CPQ37Q45Q54Q66Q713Q812Q914Q1015Q111Q122Q133001aad724911CT+ 10CTR14CT75461312141512133Fig 4.Logic diagram001aad725CPMRFF 0QT RDQ0Q FF 2QT RDQFF 7QT RDQ7Q FF 9QT RDQ9QFF 1QT RDQFF 8QT RDQ8QFF 10QT RDQ10QFF 11QT RDQ11QFF 12QT RDQ12QFF 13QT RDQ13QFF 3QT RDQ3QFF 4QT RDQ4Q FF 5QT RDQ5QFF 6QT RDQ6Q6.Pinning information6.1Pinning6.2Pin description7.Functional description[1]H = HIGH voltage level; L = LOW voltage level; X = don’t care;↑ = positive-going transition;↓ = negative-going transition.Fig 5.Pin configurationHEF4020BQ11V DD Q12Q10Q13Q9Q5Q7Q4Q8Q6MR Q3CP V SSQ0001aaj10112345678109121114131615Table 2.Pin descriptionSymbol PinDescriptionQ3 to Q137, 5, 4, 6, 13, 12, 14, 15, 1, 2, 3parallel output (Q3 to Q13)V SS 8ground supply voltage Q09parallel outputCP 10clock input (HIGH-to-LOW edge triggered)MR 11master reset input (active HIGH)V DD16supply voltageTable 3.Functional table [1]Input OutputCPMR Q0, Q3 to Q13↑L no change ↓L count XHL8.Limiting values[1]For DIP16 package: P tot derates linearly with 12 mW/K above 70°C.[2]For SO16 package: P tot derates linearly with 8 mW/K above 70°C.Fig 6.Timing diagram001aad7261248163264128256512102420484096CP input MR inputQ0Q3Q4Q5Q6Q7Q8Q9Q10Q11819216384Q12Q13Table 4.Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).Symbol Parameter ConditionsMin Max Unit V DD supply voltage −0.5+18V I IK input clamping current V I <0.5V or V I >V DD + 0.5 V -±10mA V I input voltage−0.5V DD + 0.5V I OK output clamping current V O <0.5V or V O >V DD +0.5V-±10mA I I/O input/output current -±10mA I DD supply current -50mA T stg storage temperature −65+150°C T amb ambient temperature −40+85°C P tottotal power dissipationT amb −40°C to +85°C DIP16 package [1]-750mW SO16 package[2]-500mW Ppower dissipation per output-100mW9.Recommended operating conditionsTable 5.Recommended operating conditionsSymbol Parameter Conditions Min Typ Max UnitV DD supply voltage3-15VV I input voltage0-V DD VT amb ambient temperature in free air−40-+85°C∆t/∆V input transition rise and fall rate V DD = 5 V-- 3.75ns/VV DD = 10 V--0.5ns/VV DD = 15 V--0.08ns/V 10.Static characteristicsTable 6.Static characteristicsV SS = 0 V; V I = V SS or V DD; unless otherwise specified.Symbol Parameter Conditions V DD T amb =−40°C T amb = 25°C T amb = 85°C UnitMin Max Min Max Min MaxV IH HIGH-level input voltage|I O| < 1µA 5 V 3.5- 3.5- 3.5-V10 V7.0-7.0-7.0-V15 V11.0-11.0-11.0-VV IL LOW-level input voltage|I O| < 1µA 5 V- 1.5- 1.5- 1.5V10 V- 3.0- 3.0- 3.0V15 V- 4.0- 4.0- 4.0VV OH HIGH-level output voltage|I O| < 1µA 5 V 4.95- 4.95- 4.95-V10 V9.95-9.95-9.95-V15 V14.95-14.95-14.95-VV OL LOW-level output voltage|I O| < 1µA 5 V-0.05-0.05-0.05V10 V-0.05-0.05-0.05V15 V-0.05-0.05-0.05VI OH HIGH-level output current V O = 2.5 V 5 V−1.7-−1.4-−1.1-mAV O = 4.6 V 5 V−0.52-−0.44-−0.36-mAV O = 9.5 V10 V−1.3-−1.1-−0.9-mAV O = 13.5 V15 V−3.6-−3.0-−2.4-mA I OL LOW-level output current V O = 0.4 V 5 V0.52-0.44-0.36-mAV O = 0.5 V10 V 1.3- 1.1-0.9-mAV O = 1.5 V15 V 3.6- 3.0- 2.4-mA I I input leakage current15 V-±0.3-±0.3-±1.0µAI DD supply current I O = 0A 5 V-20-20-150µA10 V-40-40-300µA15 V-80-80-600µAC I input capacitance----7.5--pF11.Dynamic characteristics[1]The typical values of the propagation delay and transition times are calculated from the extrapolation formulas shown (C L in pF).Table 7.Dynamic characteristicsV SS = 0 V; T amb = 25°C; for test circuit see Figure 8.Symbol Parameter Conditions V DD Extrapolation formula [1]Min Typ Max Unit t PHLHIGH to LOW propagation delayCP to Q0;see Figure 75 V 78 ns + (0.55 ns/pF) C L -105210ns 10 V 34 ns + (0.23 ns/pF) C L -4590ns 15 V22 ns + (0.16 ns/pF) C L -3065ns Qn to Qn +15 V 53 ns + (0.55 ns/pF) C L -80160ns 10 V 19 ns + (0.23 ns/pF) C L -3060ns 15 V12 ns + (0.16 ns/pF) C L -2040ns MR to Qn;see Figure 75 V 153 ns + (0.55 ns/pF) C L -180360ns 10 V 79 ns + (0.23 ns/pF) C L -90180ns 15 V62 ns + (0.16 ns/pF) C L -70140ns t PLHLOW to HIGH propagation delayCP to Q0;see Figure 75 V 78 ns + (0.55 ns/pF) C L -105210ns 10 V 39 ns + (0.23 ns/pF) C L -5095ns 15 V27 ns + (0.16 ns/pF) C L -3570ns Qn to Qn +15 V 43 ns + (0.55 ns/pF) C L -70140ns 10 V 14 ns + (0.23 ns/pF) C L -2550ns 15 V12 ns + (0.16 ns/pF) C L -2040ns t ttransition timesee Figure 75 V 10 ns + (1.00 ns/pF) C L -60120ns 10 V 9 ns + (0.42 ns/pF) C L -3060ns 15 V6 ns + (0.28 ns/pF) C L-2040ns t Wpulse widthCP = HIGH;minimum width;see Figure 7 5 V 5025-ns 10 V 2515-ns 15 V 2010-ns MR = HIGH;minimum width;see Figure 75 V 13065-ns 10 V 9550-ns 15 V 9045-ns t recrecovery timeMR input;see Figure 75 V 11560-ns 10 V 6535-ns 15 V5525-ns f maxmaximum frequencysee Figure 75 V 510-MHz 10 V 1325-MHz 15 V1835-MHz12.WaveformsTable 8.Dynamic power dissipation P DP D can be calculated from the formulas shown. V SS = 0 V; t r = t f ≤ 20 ns; T amb = 25°C.Symbol Parameter V DD Typical formula for P D (µW)where:P Ddynamic power dissipation5V P D = 600× f i +Σ(f o × C L )× V DD 2f i = input frequency in MHz,f o = output frequency in MHz,C L = output load capacitance in pF ,V DD = supply voltage in V ,Σ(C L × f o ) = sum of the outputs.10V P D = 2800× f i +Σ(f o × C L )× V DD 215VP D = 8200× f i +Σ(f o × C L )× V DD 2Measurement points are given in Table 9.Fig 7.Propagation delays,minimum pulse widths,transition and recovery times and maximum clock frequency MR INPUTV IQ0 or Qn OUTPUTt Wt PHLt rec 1/f maxV MV MV M001aae591t PLH t Wt tt tt PHLCP INPUTV IV OHV OLV SS V SSTable 9.Measurement pointsSupply voltage Input Output V DDV M V M 5 V to 15 V0.5V DD0.5V DDTest data is given in T able 10.Definitions for test circuit:DUT = Device Under Test.C L =load capacitance including jig and probe capacitance.R T =termination resistance should be equal to the output impedance Z o of the pulse generator.Fig 8.Test circuitV DDV IV O001aag182DUTC LR TGTable 10.Test dataSupply voltage Input Load V DD V I t r, t f C L5V to 15V V SS or V DD≤20ns50 pF13.Package outlineFig 9.Package outline SOT38-4 (DIP16)REFERENCESOUTLINE VERSION EUROPEAN PROJECTIONISSUE DATE IECJEDECJEITASOT38-495-01-1403-02-13M Hc(e )1M EALs e a t i n g p l a n eA 1w Mb 1b 2eDA 2Z16198Epin 1 indexb0510 mmscaleNote1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.UNIT Amax.12b 1(1)(1)(1)b 2c D E e M Z H L mm DIMENSIONS (inch dimensions are derived from the original mm dimensions)A min. A max.b max.w M E e 11.731.300.530.380.360.2319.5018.55 6.486.20 3.603.050.2542.547.628.257.8010.08.30.764.20.51 3.2inches0.0680.0510.0210.0150.0140.0091.250.850.0490.0330.770.730.260.240.140.120.010.10.30.320.310.390.330.030.170.020.13DIP16: plastic dual in-line package; 16 leads (300 mil)SOT38-4Fig 10.Package outline SOT109-1 (SO16)Xw MθAA 1A 2b pD H EL pQdetail XE Z ecL v M A(A )3A89116ypin 1 indexUNIT Amax.A 1A 2A 3b p c D (1)E (1)(1)e H E L L p Q Z y w v θREFERENCESOUTLINE VERSION EUROPEAN PROJECTIONISSUE DATE IEC JEDEC JEITAmm inches1.750.250.101.451.250.250.490.360.250.1910.09.84.03.8 1.27 6.25.80.70.60.70.380oo 0.250.1DIMENSIONS (inch dimensions are derived from the original mm dimensions)Note1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.1.00.4 SOT109-199-12-2703-02-19076E07MS-0120.0690.0100.0040.0570.0490.010.0190.0140.01000.00750.390.380.160.150.051.050.0410.2440.2280.0280.0200.0280.0120.010.250.010.0040.0390.0160 2.5 5 mmscaleSO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-114.Abbreviations15.Revision historyTable 11.AbbreviationsAcronym Description DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MMMachine ModelTable 12.Revision historyDocument ID Release date Data sheet status Change notice Supersedes HEF4020B_420081204Product data sheet-HEF4020B_CNV_3Modifications:•The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors.•Legal texts have been adapted to the new company name where appropriate.•Parallel output pins renamed Q0 to Q13 throughout.•T emperature statement added to Section 1 “General description”.•Section 2 “Features” added.•Table 1 “Ordering information” restructured.•Package version SOT38-1 changed to SOT38-4 in Section 4, and Figure 9. Package SOT74 removed from Section 4.•Figure 1 “Functional diagram”,Figure 4 “Logic diagram”,Figure 5 “Pin configuration”,Figure 7 “Propagation delays, minimum pulse widths, transition and recovery times and maximum clock frequency” and Figure 6 “Timing diagram” changed for pin name changes.•Figure 2 “Logic symbol” and Figure 3 “IEC Logic symbol” added.•Table 2 “Pin description” edited for pin name changes.•Section 7 “Functional description” added.•Section 8 “Limiting values” and Section 10 “Static characteristics” added, taken from the HE4000B Family Specifications data sheet.•t RMR , t WCPH and t WMRH changed to t rec and t W for Table 7 “Dynamic characteristics” and Figure 7 “Propagation delays, minimum pulse widths, transition and recovery times and maximum clock frequency”.•50% replaced by V M for Figure 7 “Propagation delays, minimum pulse widths, transition and recovery times and maximum clock frequency”.•Table 9 “Measurement points”,Figure 8 “T est circuit” and Table 10 “T est data” added.HEF4020B_CNV_319950101Product specification -HEF4020B_CNV_2HEF4020B_CNV_219950101Product specification--16.Legal information16.1Data sheet status[1]Please consult the most recently issued document before initiating or completing a design.[2]The term ‘short data sheet’ is explained in section “Definitions”.[3]The product status of device(s)described in this document may have changed since this document was published and may differ in case of multiple devices.The latest product status information is available on the Internet at URL .16.2DefinitionsDraft —The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness ofinformation included herein and shall have no liability for the consequences of use of such information.Short data sheet —A short data sheet is an extract from a full data sheet with the same product type number(s)and title.A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.16.3DisclaimersGeneral —Information in this document is believed to be accurate andreliable.However,NXP Semiconductors does not give any representations or warranties,expressed or implied,as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.Right to make changes —NXP Semiconductors reserves the right to make changes to information published in this document, including withoutlimitation specifications and product descriptions, at any time and without notice.This document supersedes and replaces all information supplied prior to the publication hereof.Suitability for use —NXP Semiconductors products are not designed,authorized or warranted to be suitable for use in medical, military, aircraft,space or life support equipment, nor in applications where failure ormalfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage.NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.Applications —Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.Limiting values —Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134)may cause permanent damage to the device.Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in theCharacteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability.Terms and conditions of sale —NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale,as published at /profile/terms , including those pertaining to warranty,intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail.No offer to sell or license —Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant,conveyance or implication of any license under any copyrights,patents or other industrial or intellectual property rights.16.4TrademarksNotice:All referenced brands,product names,service names and trademarks are the property of their respective owners.17.Contact informationFor more information, please visit:For sales office addresses, please send an email to:salesaddresses@Document status [1][2]Product status [3]DefinitionObjective [short] data sheet Development This document contains data from the objective specification for product development.Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.Product [short] data sheetProductionThis document contains the product specification.18.Contents1General description. . . . . . . . . . . . . . . . . . . . . . 12Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . 14Ordering information. . . . . . . . . . . . . . . . . . . . . 15Functional diagram . . . . . . . . . . . . . . . . . . . . . . 26Pinning information. . . . . . . . . . . . . . . . . . . . . . 36.1Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36.2Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 37Functional description . . . . . . . . . . . . . . . . . . . 38Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 49Recommended operating conditions. . . . . . . . 510Static characteristics. . . . . . . . . . . . . . . . . . . . . 511Dynamic characteristics . . . . . . . . . . . . . . . . . . 612Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 713Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 914Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 1115Revision history. . . . . . . . . . . . . . . . . . . . . . . . 1116Legal information. . . . . . . . . . . . . . . . . . . . . . . 1216.1Data sheet status . . . . . . . . . . . . . . . . . . . . . . 1216.2Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1216.3Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 1216.4T rademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 1217Contact information. . . . . . . . . . . . . . . . . . . . . 1218Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13Please be aware that important notices concerning this document and the product(s)described herein, have been included in section ‘Legal information’.© NXP B.V.2008.All rights reserved.For more information, please visit: For sales office addresses, please send an email to: salesaddresses@Date of release: 4 December 2008。