Dell常用专有名词

DELL Visor知识点几个视觉技术的区分VR：进入一个完全虚拟的世界AR：利用虚拟信息增强现实世界MR:虚拟与现实的深度融合什么是虚拟现实（VR）虚拟现实技术——利用电脑或其他智能计算设备模拟产生一个三维空间的虚拟世界，提供用户关于视觉、听觉、触觉等感官的模拟，让用户如同身历其境一般的奇妙体验。

什么是混合现实（MR）MR是数字化现实加上虚拟数字画面，并且可以进行互动，在技术上结合了VR与AR的优势，而且仅需连接一个头显和一个遥控手柄即可体验MR，在便携性和体验上最到最佳平衡。

MR包含AR和VR，一副MR的眼镜可以做AR和VR的事情，而AR和VR显然做不到MR的好体验。

1、易于穿戴和摘下的“上掀式”镜头可以帮助您在虚拟世界和现实之间快速切换2、采用Inside-out 追踪定位技术的摄像头传感器不再需要外部摄像头和定位3、良好的衬垫和耐用的头带舒适地贴合在您的前额上4、精良的面部衬垫使得眼镜佩戴者也能够舒适地体验5、重量平衡头带能够避免鼻子和面颊承受的压力6、线缆管理夹能够确保线缆始终置于头带后方以利于佩戴者更好地移动7、拨轮的设计能方便快捷地按照头部尺寸调节舒适度卓越的视觉效果1、DELL Visor具有单眼1440 x 1440的分辨率和90Hz的刷新率，360度全方位观看画面不失帧2、两块SHARP 2.89英寸LCD 液晶显示屏和菲涅尔透镜组通过锐利的聚焦和出色的景深，能够呈现清晰透亮的画面效果。

符合人体工程学1、有效的平衡重量，避免鼻子和面颊承重，同时还方便掌握重心，移动自如2、上掀式MR镜头可以翻转90度，可以在虚拟世界和现实之间快速切换材质优良前后两侧的头部绑带海绵采用高密度材料制成，可有效减少摩擦，任意行动感觉依然舒适到位，佩戴头盔时，头带可以舒适地贴合在额头上，同时橡胶鼻垫可以避免光线射入。

高度集成根据具体需求，可自由调整头显松紧度，利用拇指操纵杆、触发按钮和触摸板能更加自由舒适地控制头显，在游戏过程中行动自如，例如：前行、后退、爬高、下降、左转、右转，符合人体工学设计，每种体验都更加真实。

Acronyms for SEQ SSM Class General Acronyms4MEP – Machines, Materials, Measurements, Methods, Environment, People. General cause categories. Also known as 5M’s or 6M’s.AIAG – Automotive Industry Action Group.AMF – (Dell) Americas Manufacturing Facility. Includes factories located in Austin, Nashville, and North CarolinaAPCC – (Dell) Asia-Pacific Customer Center. Factory located in Penang, MalaysiaAVL – Approved Vendor List. Sometimes ASL (Approved Suppliers List). Some interchange with BOM (Build of Materials or Bill of Materials), but BOM is different than AVL/ASL.BC – Business Contract.BPI –Business Process Improvement. Dell’s Quality philosophy, which includes Six Sigma tools and practices, Lean Technology principles, and other aspects of Quality Improvement. BST – Business Strategy Team.CA – Corrective Action.CCC – (Dell) China Customer Center. Factory located in Xiamen, ChinaCE – Customer Experience.CIP – Continual (or Continuous) Improvement Process.COC – Center of Competency.COS – Continuity of Supply.CTQ – Critical to Quality, usually referring to characteristics of the product or process.CLCA – Closed Loop Corrective Action. A methodology of characterizing, containing, resolving and reporting special cause events in a process.DES/DID – Design-Induced Damage.DFSS – Design for Six Sigma.DFX (or DFx) –Design for X, often called “Design for Everything.” Types of X’es include: Cost, Quality, Reliability, Manufacturing, Test, Service, Six SigmaDVT – Design Validation Testing.E2E – End to End, referring to a type of process flowchart or map.EBST – Executive Business Strategy Team.ECN – Engineering Change Notification.ECO – Engineering Change Order.EICC – Electronics Industry Code of Conduct.EMF – (Dell) Europe Manufacturing Center. Factory located in Limerick, Ireland. Will include new factory in Poland in the near future.EOL – End of Life. The end of warranty obligations (typically the same as EOSL).EOPL – End of Production Life. Dell factory stops manufacturing.EOS – Electrical Over Stress.EOSL – End of Service Life. Dell stops servicing (typically when warranty period complete). ESD – Electro Static Discharge.EVT – Engineering Validation Testing.FA – Failure Analysis.FAI – First Article Inspection.FIFO – First In First Out.FMEA – Failure Mode Effects Analysis.FPM – Functional Process Manual.GB/BB – Green Belt / Black Belt. Levels of skill and knowledge attainment within Six Sigma; often refers to specific certifications.GR&R – Gage Repeatability & Reproducibility.HALT – Highly Accelerated Life Test.HASS – Highly Accelerated Stress Screen.IQA – Incoming Quality Assurance.IQC – Incoming Quality Control.JMP – Name of a powerful statistical program used in data analysis. Began as “Jon’s Mac Project” in 1989.LOB – Line of Business.MARCOM – Marketing Communication.MQT – Manufacturing Quality and Test, another title for the QMP.MRB – Material Review Board.MSA – Measurement System Analysis.MSE – Measurement System Error.MTBF – Mean Time Between Failures.NPI – New Product Introduction.NPO – New Product Operations.NPP – New Product Process; also used for New Product Plan.NPRR – New Product Readiness Review. A review sequence that is mostly replaced by Safe Launch.OBA – Out of Box Audit.OHSAS – Occupational Health and Safety Assessment Series. A pair of standards, OHSAS 18001 and 18002, on OHS Management Systems (OHSMS).OPEX – Operating Expenses. Including headcount, travel expense, administrative expense, etc. OQC – Outgoing Quality Control.ODM – Original Design Manufacturer.ORT – Ongoing Reliability Test(ing).OSV – On-site Verification.PCN – Process Change Notification. Sometimes Product Change Notification, but not often. PDCA – Plan Do Check Act. An improvement methodology.PFG – Product Features Guide.PID – Process-Induced Damage, usually implying Dell process (but also widely used in industry). PG – (Dell) Product Group.PM – Program Manager.PMT – Process Maturity Testing.PO – Purchase Order.PRP – Phase Review Process.PWB – Printed Wiring Board. Also called PCB (Printed Circuit Board)QBR – Quarterly Business Review.QDS – Quality Data System.QMP – Quality Management Plan.QMS – Quality Management System.QPA – Quality Process Audit. Commodity specific tool/checklist at Dell.QS – Quality System.QSA – Quality Systems Audit. Standard (same for all commodities) tool/checklist at Dell. RACI – Responsible, Accountable, Consulted, Informed. Four categories of job responsibility involvement.R&R – Roles and Responsibilities.RFI – Request for Information.RFQ/RFP – Request for Quote / Request for Proposal. No significant difference within the Dell WWP system, but may mean different things in other companies.RTS – Ready to Ship. Some places use Release to Ship.SCAR – Supplier Corrective Action Request. Typical supplier response is done through 5C Process; some suppliers use 8D Process.SEQ – Supplier Engineering and Quality. A department inside a company; Dell SEQ is part of WWP (Worldwide Procurement). Many other companies in the industry use SQE (Supplier Quality Engineering).SOW – Statement of Work.SPC – Statistical Process Control. Often interchangeable with SQC (Statistical Quality Control) in Dell SEQ documentation.SPRT – Sequential Probability Ratio Test.SSM – Supplier Selection and Management. A training class, and a key business process. STSM – Sub-tier Supplier Management. Used to refer to a Dell initiative, and also used to label a specific quality conformance audit & checklist. Standard (same for all commodities)tool/checklist at DellTGT – Target.VOC – Voice of Customer.VID – Vendor-Induced Damage.WW – Worldwide, or World Wide.WWP – Worldwide Procurement.Quality Metrics90FIR – FIR in the first 90 days after product shipment from Dell factory.AFR – Annualized Failure Rate.ARR – Annualized Return Rate.CND – Can Not Duplicate.DPPM – Defective Parts Per Million.FIR – Field Incident Rate. Field Failures. Typically measured in dppm.IFIR – Initial Field Incident Rate. FIR in the first 30 days after product shipment from Dell factoryLRR – Line Reject Rate. Failure rate in the Dell factory. Typically measured in dppm. MDR – Manufacturing Defect Rate; also seen as Materials Defect Rate. Obsolete metric; no longer used in Dell.NFF – No Fault Found.NTF – No Trouble Found.SVLRR – Sub-tier VLRR. Component failure rate in the 1st tier supplier factory.VIFIR – Verified IFIR.VFIR – Verified FIR.VLRR – Verified LRR.Quality StandardsISO-9000 – A family of standards which define the requirements for a Quality Management System. These standards are owned and maintained by ISO (International Standards Organization).QS-9000 – Quality System 9000. A quality systems standard specific to the automotive industry. Covers supplier requirements for production parts, materials, and services. Built on ISO9001:1994, with additional requirements.TL-9000 – Telecom 9000. A quality systems standard based on ISO 9000, with additional requirements for the telecommunications industry.TS-16949 – Technical Specification 16949. Built by the IATF (International Automotive Task Force) in collaboration with ISO. Originally designed to align the quality system requirementsof the U.S. automotive industry with the German, French, and Italian automotive industries.Job Titles and RolesFAE/FAS – Failure Analysis Engineer / Failure Analysis Support. A supplier role at a Dell site. GCM – Global Commodity Manager. A Dell role. Business role managing contractual and commercial relationship with suppliers.GCQM – Global Commodity Quality Manager. A Dell role with global quality responsibilities within a commodity.GQAM – Global Quality Account Manager. A supplier role with global quality responsibilities within a commodity.GSQE – See SQE.GSQM – Global Supplier Quality Manager. A Dell Role with global quality responsibilities. JQE/JQM – Joint Quality Engineer / Joint Quality Manager. A supplier role, dedicated to supporting Dell quality performance, at a supplier site.SEQ (previously SQE and may still exist in older documents) – Supplier Engineering & Quality (Supplier Quality Engineering). A Dell field engineering role, collaborating with suppliers. GCT – Global Commodity Team. A cross-functional team within Dell that manages a commodity’s business.。

本文由纷飞的温柔贡献 ＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊ ＜计算机专业术语大全（中￣英文版）＞ ＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊ ＡＧＰ（Ａｃｃｅｌｅｒａｔｅｄ　Ｇｒａｐｈｉｃｓ　Ｐｏｒｔ）　－图形加速接口 Ａｃｃｅｓｓ　Ｔｉｍｅ－存取时间 Ａｄｄｒｅｓｓ－地址 ＡＮＳＩ　（Ａｍｅｒｉｃａｎ　Ｎａｔｉｏｎａｌ　Ｓｔａｎｄａｒｄｓ　Ｉｎｓｔｉｔｕｔｅ）　美国国家标准协会 ＡＳＣＩＩ　（Ａｍｅｒｉｃａｎ　Ｓｔａｎｄａｒｄ　Ｃｏｄｅ　ｆｏｒ　Ｉｎｆｏｒｍａｔｉｏｎ　Ｉｎｔｅｒｃｈａｎｇｅ） Ａｓｙｎｃ　ＳＲＡＭ－异步静态内存 ＢＳＢ　（Ｂａｃｋｓｉｄｅ　Ｂｕｓ） Ｂａｎｄｗｉｄｔｈ－带宽 Ｂａｎｋ　－内存库 Ｂａｎｋ　Ｓｃｈｅｍａ　－存储体规划 Ｂａｓｅ　Ｒａｍｂｕｓ　－初级的Ｒａｍｂｕｓ内存 Ｂａｕｄ　－波特 ＢＧＡ　（Ｂａｌｌ　Ｇｒｉｄ　Ａｒｒａｙ）－球状引脚栅格阵列封装技术 Ｂｉｎａｒｙ　－二进制 ＢＩＯＳ　（Ｂａｓｉｃ　Ｉｎｐｕｔ－Ｏｕｔｐｕｔ　Ｓｙｓｔｅｍ）　－基本输入／输出系统 Ｂｉｔ－位、比特 ＢＬＰ－底部引出塑封技术 Ｂｕｆｆｅｒ－缓冲区 Ｂｕｆｆｅｒｅｄ　Ｍｅｍｏｒｙ－带缓冲的内存 ＢＥＤＯ　（Ｂｕｒｓｔ　ＥＤＯ　ＲＡＭ）　－突发模式ＥＤＯ随机存储器 Ｂｕｒｓｔ　Ｍｏｄｅ－突发模式 Ｂｕｓ－总线 Ｂｕｓ　Ｃｙｃｌｅ－总线周期 Ｂｙｔｅ－字节 Ｃａｃｈｅａｂｉｌｉｔｙ－高速缓存能力 Ｃａｃｈｅ　Ｍｅｍｏｒｙ－高速缓存存储器 ＣＡＳ　（Ｃｏｌｕｍｎ　Ａｄｄｒｅｓｓ　Ｓｔｒｏｂｅ）－列地址选通脉冲 ＣＬ（ＣＡＳ　Ｌａｔｅｎｃｙ　）－列地址选通脉冲时间延迟 ＣＤＲＡＭ　（Ｃａｃｈｅ　ＤＲＡＭ）－快取动态随机存储器 Ｃｈｅｃｋｓｕｍ－检验和，校验和 Ｃｈｉｐｓｅｔ－芯片组 Ｃｈｉｐ－Ｓｃａｌｅ　Ｐａｃｋａｇｅ　（ＣＳＰ）－芯片级封装 Ｃｏｍｐａｃｔ　Ｆｌａｓｈ－紧凑式闪存 Ｃｏｎｃｕｒｒｅｎｔ　Ｒａｍｂｕｓ－并发式总线式内存 Ｃｏｎｔｉｎｕｉｔｙ　ＲＩＭＭ　（Ｃ－ＲＩＭＭ）－连续性总线式内存模组 ＣＭＯＳ（Ｃｏｍｐｌｅｍｅｎｔａｒｙ　Ｍｅｔａｌ－Ｏｘｉｄｅ－Ｓｅｍｉｃｏｍｄｕｃｔｏｒ）－互补金属氧化物半导体用于晶体管 ＣＰＵ　（Ｃｅｎｔｒａｌ　Ｐｒｏｃｅｓｓｉｎｇ　Ｕｎｉｔ）－中央处理单元 Ｃｒｅｄｉｔ　Ｃａｒｄ　Ｍｅｍｏｒｙ　－信用卡内存 ＤＤＲ（Ｄｏｕｂｌｅ　Ｄａｔａ　Ｒａｔｅ　ＳＤＲＡＭ）－　双数据输出同步动态存储器。

计算机术语大全1、CPU3DNow!（3D no waiting，无须等待的3D处理）AAM（AMD Analyst Meeting，AMD分析家会议）ABP（Advanced Branch Prediction，高级分支预测）ACG（Aggressive Clock Gating，主动时钟选择）AIS（Alternate Instruction Set，交替指令集）ALAT（advanced load table，高级载入表）ALU（Arithmetic Logic Unit，算术逻辑单元）Aluminum（铝）AGU（Address Generation Units，地址产成单元）APC（Advanced Power Control，高级能源控制）APIC（Advanced rogrammable Interrupt Controller，高级可编程中断控制器）APS（Alternate Phase Shifting，交替相位跳转）ASB（Advanced System Buffering，高级系统缓冲）ATC（Advanced Transfer Cache，高级转移缓存）ATD（Assembly Technology Development，装配技术发展）BBUL（Bumpless Build-Up Layer，内建非凹凸层）BGA（Ball Grid Array，球状网阵排列）BHT（branch prediction table，分支预测表）Bops（Billion Operations Per Second，10亿操作秒）BPU（Branch Processing Unit，分支处理单元）BP（Brach Pediction，分支预测）BSP（Boot Strap Processor，启动捆绑处理器）BTAC（Branch Target Address Calculator，分支目标寻址计算器）CBGA (Ceramic Ball Grid Array，陶瓷球状网阵排列)CDIP (Ceramic Dual-In-Line，陶瓷双重直线)Center Processing Unit Utilization，中央处理器占用率CFM（cubic feet per minute，立方英尺秒）CMT（course-grained multithreading，过程消除多线程）CMOS（Complementary Metal Oxide Semiconductor，互补金属氧化物半导体）CMOV（conditional move instruction，条件移动指令）CISC（Complex Instruction Set Computing，复杂指令集计算机）CLK（Clock Cycle，时钟周期）CMP（on-chip multiprocessor，片内多重处理）CMS（Code Morphing Software，代码变形软件）co-CPU（cooperative CPU，协处理器）COB（Cache on board，板上集成缓存，做在CPU卡上的二级缓存，通常是内核的一半速度））COD（Cache on Die，芯片内核集成缓存）Copper（铜）CPGA（Ceramic Pin Grid Array，陶瓷针型栅格阵列）CPI（cycles per instruction，周期指令）CPLD（Complex Programmable Logic Device，複雜可程式化邏輯元件）CPU（Center Processing Unit，中央处理器）CRT（Cooperative Redundant Threads，协同多余线程）CSP（Chip Scale Package，芯片比例封装）CXT（Chooper eXTend，增强形K6-2内核，即K6-3）Data Forwarding（数据前送）dB（decibel，分贝）DCLK（Dot Clock，点时钟）DCT（DRAM Controller，DRAM控制器）DDT（Dynamic Deferred Transaction，动态延期处理）Decode（指令解码）DIB（Dual Independent Bus，双重独立总线）DMT（Dynamic Multithreading Architecture，动态多线程结构）DP（Dual Processor，双处理器）DSM（Dedicated Stack Manager，专门堆栈管理）DSMT（Dynamic Simultaneous Multithreading，动态同步多线程）DST（Depleted Substrate Transistor，衰竭型底层晶体管）DTV（Dual Threshold Voltage，双重极限电压）DUV（Deep Ultra-Violet，纵深紫外光）EBGA（Enhanced Ball Grid Array，增强形球状网阵排列）EBL（electron beam lithography，电子束平版印刷）EC（Embedded Controller，嵌入式控制器）EDB（Execute Disable Bit，执行禁止位）EDEC（Early Decode，早期解码）Embedded Chips（嵌入式）EM64T（Extended Memory 64 Technology，扩展内存64技术）EPA（edge pin array，边缘针脚阵列）EPF（Embedded Processor Forum，嵌入式处理器论坛）EPL（electron projection lithography，电子发射平版印刷）EPM（Enhanced Power Management，增强形能源管理）EPIC（explicitly parallel instruction code，并行指令代码）EUV（Extreme Ultra Violet，紫外光）EUV（extreme ultraviolet lithography，极端紫外平版印刷）FADD（Floationg Point Addition，浮点加）FBGA（Fine-Pitch Ball Grid Array，精细倾斜球状网阵包装）FBGA（flipchip BGA，轻型芯片BGA）FC-BGA（Flip-Chip Ball Grid Array，翻转芯片球形网阵包装）FC-LGA（Flip-Chip Land Grid Array，翻转接点网阵包装）FC-PGA（Flip-Chip Pin Grid Array，翻转芯片球状网阵包装）FDIV（Floationg Point Divide，浮点除）FEMMS：Fast EntryExit Multimedia State，快速进入退出多媒体状态FFT（fast Fourier transform，快速热欧姆转换）FGM（Fine-Grained Multithreading，高级多线程）FID（FID：Frequency identify，频率鉴别号码）FIFO（First Input First Output，先入先出队列）FISC（Fast Instruction Set Computer，快速指令集计算机）flip-chip（芯片反转）FLOPs（Floating Point Operations Per Second，浮点操作秒）FMT（fine-grained multithreading，纯消除多线程）FMUL（Floationg Point Multiplication，浮点乘）FPRs（floating-point registers，浮点寄存器）FPU（Float Point Unit，浮点运算单元）FSUB（Floationg Point Subtraction，浮点减）GFD（Gold finger Device，金手指超频设备）GHC（Global History Counter，通用历史计数器）GTL（Gunning Transceiver Logic，射电收发逻辑电路）GVPP（Generic Visual Perception Processor，常规视觉处理器）HL-PBGA 表面黏著,高耐热、轻薄型塑胶球状网阵封装HTT（Hyper-Threading Technology，超级线程技术）Hz（hertz，赫兹，频率单位）IA（Intel Architecture，英特尔架构）IAA（Intel Application Accelerator，英特尔应用程序加速器）IATM（Intel Advanced Thermal Manager，英特尔高级热量管理指令集）ICU（Instruction Control Unit，指令控制单元）ID（identify，鉴别号码）IDF（Intel Developer Forum，英特尔开发者论坛）IDMB（Intel Digital Media Boost，英特尔数字媒体推进指令集）IDPC（Intel Dynamic Power Coordination，英特尔动态能源调和指令集）IEU（Integer Execution Units，整数执行单元）IHS（Integrated Heat Spreader，完整热量扩展）ILP（Instruction Level Parallelism，指令级平行运算）IMM Intel Mobile Module, 英特尔移动模块Instructions Cache，指令缓存Instruction Coloring（指令分类）IOPs（Integer Operations Per Second，整数操作秒）IPC（Instructions Per Clock Cycle，指令时钟周期）ISA（instruction set architecture，指令集架构）ISD（inbuilt speed-throttling device，内藏速度控制设备）ITC（Instruction Trace Cache，指令追踪缓存）ITRS（International Technology Roadmap for Semiconductors，国际半导体技术发展蓝图）KNI（Katmai New Instructions，Katmai新指令集，即SSE）Latency（潜伏期）LDT（Lightning Data Transport，闪电数据传输总线）LFU（Legacy Function Unit，传统功能单元）LGA（land grid array，接点栅格阵列）LN2（Liquid Nitrogen，液氮）Local Interconnect（局域互连）MAC（multiply-accumulate，累积乘法）mBGA (Micro Ball Grid Array，微型球状网阵排列)nm（namometer，十亿分之一米毫微米）MCA（Machine Check Architecture，机器检查架构）MCU（Micro-Controller Unit，微控制器单元）MCT（Memory Controller，内存控制器）MESI（Modified, Exclusive, Shared, Invalid：修改、排除、共享、废弃）MF（MicroOps Fusion，微指令合并）mm（micron metric，微米）MMX（MultiMedia Extensions，多媒体扩展指令集）MMU（Multimedia Unit，多媒体单元）MMU（Memory Management Unit，内存管理单元）MN（model numbers，型号数字）MFLOPS（Million Floationg PointSecond，每秒百万个浮点操作）MHz（megahertz，兆赫）mil（PCB 或晶片佈局的長度單位，1 mil = 千分之一英寸）MIMD（Multi Instruction Multiple Data，多指令多数据流）MIPS（Million Instruction Per Second，百万条指令秒）MOESI（Modified, Owned, Exclusive, Shared or Invalid，修改、自有、排除、共享或无效）MOF（Micro Ops Fusion，微操作熔合）Mops（Million Operations Per Second，百万次操作秒）MP（Multi-Processing，多重处理器架构）MPF（Micro processor Forum，微处理器论坛）MPU（Microprocessor Unit，微处理器）MPS（MultiProcessor Specification，多重处理器规范）MSRs（Model-Specific Registers，特别模块寄存器）MSV（Multiprocessor Specification Version，多处理器规范版本）MVP（Mobile Voltage Positioning，移动电压定位）IVNAOC（no-account OverClock，无效超频）NI（Non－Intel，非英特尔）NOP（no operation，非操作指令）NRE（Non-Recurring Engineering charge，非重複性工程費用）OBGA（Organic Ball Grid Arral，有机球状网阵排列）OCPL（Off Center Parting Line，远离中心部分线队列）OLGA（Organic Land Grid Array，有机平面网阵包装）OoO（Out of Order，乱序执行）OPC（Optical Proximity Correction，光学临近修正）OPGA（Organic Pin Grid Array，有机塑料针型栅格阵列）OPN（Ordering Part Number，分类零件号码）PAT（Performance Acceleration Technology，性能加速技术）PBGA（Plastic Pin Ball Grid Array，塑胶球状网阵排列）PDIP (Plastic Dual-In-Line，塑料双重直线)PDP（Parallel Data Processing，并行数据处理）PGA（Pin-Grid Array，引脚网格阵列）,耗电大PLCC (Plastic Leaded Chip Carriers，塑料行间芯片运载)Post-RISC（加速RISC，或后RISC）PPE（Power Processor Element，Power处理器元件）PPU（Physics Processing Unit，物理处理单元）PR（Performance Rate，性能比率）PIB（Processor In a Box，盒装处理器）PM（Pseudo-Multithreading，假多线程）PPGA（Plastic Pin Grid Array，塑胶针状网阵封装）PQFP（Plastic Quad Flat Package，塑料方块平面封装）PSN（Processor Serial numbers，处理器序列号）QFP（Quad Flat Package，方块平面封装）QSPS（Quick Start Power State，快速启动能源状态）RAS（Return Address Stack，返回地址堆栈）RAW（Read after Write，写后读）REE（Rapid Execution Engine，快速执行引擎）Register Contention（抢占寄存器）Register Pressure（寄存器不足）Register Renaming（寄存器重命名）Remark（芯片频率重标识）Resource contention（资源冲突）Retirement（指令引退）RISC（Reduced Instruction Set Computing，精简指令集计算机）ROB（Re-Order Buffer，重排序缓冲区）RSE（register stack engine，寄存器堆栈引擎）RTL（Register Transfer Level，暫存器轉換層。

常用的计算机专业术语+解释1、计算机网络：是利用通信设备和线路将地理位置不同的、功能独立的多个计算机系统互连起来，以功能完善的网总软件实现网络中资源共享和信息传递的系统。

2、联机系统：是由一台中央计算机连接大量的地理位置分散的终端而构成的计算机系统3、PDN：是公用数据网。

网中传输的是数字化的数据，属于通信子网的一种。

4、OSI：是开放系统互连参考模型。

为ISO（国际标准化组织）制订的七层网络模型。

5、数据通信：是一种通过计算机或其他数据装置与通信线路，完成数据编码信号的传输、转接、存储和处理的通信技术。

6、数据传输率：每秒能传输的二进制信息位数，单位为B/S.7、信道容量：是信息传输数据能力的极限，是信息的最大数据传输速率。

8、自同步法：是指接收方能从数据信号波形中提取同步信号的方法。

9、PCM：称脉码调制，是将模拟数据换成数字信号编码的最常用方法。

10、FDM：又称时分多路复用技术，是在信道带宽超过原始信号所需带宽情况下，将物理停产的总带宽分成若干个与传输单个信号带宽相同的子停产，每个子信息传输一路信号。

11、同步传输：是以一批字符为传输单位，仅在开始和结尾加同步标志，字符间和比特间均要求同步。

12、差错控制：是指在数据通信过程中能发现或纠正差错，把差错限制在尽可能小的允许范围内的技术和方法。

13、信号：是数据的电子或电磁编码。

14、MODEM：又称调制解调器。

其作用是完成数字数据和模拟信号之间的转换，使传输模拟信号的媒体能传输数字数据。

发送端MODEM将数字数据调制转换为模拟信号，接收端MODEM再把模拟信号解调还原为原来的数字数据。

15、信号传输速率：也称码元率、调制速率或波特率，表示单位时间内通过信道传输的码元个数，单位记做BAND.16、基带传输：是在线路中直接传送数字信号的电脉冲，是一种最简单的传输方式，适用于近距离通信的局域网。

17、串行通信：数据是逐位地在一条通信线上传输的，较之并行通信速度慢，传输距离远。

常见专有名词, 缩写列表AGP : Accelerate Graphics Port 加速繪圖阜= 加速绘图阜PCI Bus: Peripheral Component Interconnect Bus 週邊元件裝置連接匯流排= 外围组件装置连接总线ISA Bus : Industry Standard Architecture Bus 工業標準架構匯流排= 工业标准架构总线Device 裝置= 装置Bridge 橋接器= 桥接器P2P = PCI to PCI BridgeH2P = Host to PCI BridgeP2I Bridge = PCI to ISA BridgeConfiguration規劃= 规划\配置VID : Vendor ID 製造商識別碼= Vendor ID 制造商识别码DID : Device ID 裝置識別碼= Device ID 装置识别码SVID : Subsystem Vendor ID 次系統製造商識別碼= Subsystem Vendor ID 次系统制造商识别码SSID : Subsystem System ID次系統系統系統識別碼= Subsystem System ID次系统系统识别码CPU : Central Processing Unit 中央處理單元= 中央处理单元L1 = Level 1L2 = Level 2L3 = Level 3Cache Memory : 快取記憶體= 高速缓存BIOS : Basic Input and Output System 基本輸出入系統= 基本输出入系统Main Board : 主機板= 主板Chassis : 機殼, 電腦主機外殼. 殼子= 机壳, 计算机主机外壳, 壳子Case : 機殼, 電腦主機外殼. 殼子= 机壳, 计算机主机外壳, 壳子Interrupt 中斷= 中断Register暫存器= 缓存器ROM : Read Only Memory 唯讀記憶體= 只读存储器PROM : Programmable ROM 可程式唯讀記憶體= 可程序只读存储器EPROM: Erasable PROM可抹除可程式唯讀記憶體= 可抹除可程序只读存储器EEPROM : Electronic EEPROM = 電氣式可抹除可程式唯讀記憶體= 电气式可抹除可程序只读存储器RAM : Random Access Memory 隨機存取記憶體= 随机存取内存SDR : Single Data Rate 單倍資料傳輸率= 单倍数据传输率DDR : Double Data Rate 雙倍資料傳輸率= 双倍数据传输率QDR : Quad Data Rate 四倍資料傳輸率= 四倍数据传输率RISC : Reduced Instruction Set Computer 精簡指令集電腦= 精简指令集计算机CISC :Complex Instruction Set Computer 複雜指令集電腦= 复杂指令集计算机PSB : Processo r System Bus 處理器系統匯流排= 处理器系统总线FSB : Front Side Bus 前端匯流排= 前端总线USB : Universal Serial Bus 通用序列匯流排= 通用序列总线SMBus : System Management Bus 系統管理匯流排= 系统管理总线SMM : System Management Mode系統管理模式= 系统管理模式APIC : Advance Programmable Interrupt Controller 進階可程式中斷控制器= 进阶可程序中断控制器ACPI : Advance Configuration & Power Management Interface進階規劃及電源管理介面= 进阶规划及电源管理接口PS/2 : Personal System 2KB = Keyboard 鍵盤= 键盘MS = Mouse 滑鼠= 鼠标Cursor = 游標= 光标Transistor電晶體= 晶体管TTL = Transistor – Transistor Logic電晶體電晶體邏輯= 晶体管晶体管逻辑F.F. : Flip Flop正反器= 触发器GART : Graphics Address Remapping Table 繪圖地址映對表= 绘图地址映对表O/D : Open Drain 開汲集=开汲集O/C : Open Collector 開集極= 开集极T/S : Tri-State三態= 三态S/T/S : Sustain Tri-State維持三態= 维持三态HT : Hyper Threading超執行緒= 超执行绪HT : Hyper Transport 超傳輸阜= 超传输阜PIO : Programmed IO = 可程式輸出入= 可程序输出入DMA : Direct Memory Access = 直接記憶體存取= 直接内存存取UDMA : Ultra DMADBI : Dynamic Bus Inversion 動態匯流排反向= 动态总线反向BSP : Bootstrap Processor 啟動處理器= 激活处理器AP : Application Processor 應用處理器= 应用处理器RTC : Real Time Clock 即時時脈= 实时时脉IO : Input and Output 輸出入= 输出入DRAM : Dynamic Random Access Memory 動態隨機存取記憶體= 动态随机存取内存SRAM : Static Random Access Memory 靜態隨機存取記憶體= 静态随机存取内存UPS : Uninterruptible Power Supply 不斷電系統= 不断电系统Flash ROM 快閃記憶體= 闪存PnP : Plug & Play 即插即用= 即插即用ATA : Advanced Technology AttachmentSATA : Serial ATA (AT Attachment) = 序列ATA = 序列ATAPATA : Parallel ATA (AT Attachment) = 並列ATA = 并列ATANB : North Bridge 北橋= 北桥SB : South Bridge 南橋= 南桥Chipset : 晶片組= 芯片组FDD : 軟式磁碟機(軟碟) = 软式磁盘驱动器(软盘)Floppy : 軟式磁碟機(軟碟) = 软式磁盘驱动器(软盘)Floppy Disk軟式磁碟片(軟碟片) = 软式磁盘片(软盘片)Hard Driver : 硬式磁碟機(硬碟) = 硬式磁盘驱动器(硬盘)Controller 控制器= 控制器IDE: Integrated Drive ElectronicsIDE Controller = IDE 控制器= IDE 控制器FDC = Floppy Controller 軟式磁碟控制器= 软式磁盘控制器Memory Controller 記憶體控制器= 内存控制器Core Logic : 核心邏輯(指晶片組) = 核心逻辑(指芯片组)VGA :Video Graphic Adapter視訊繪圖裝置= 视讯绘图装置COM Port : Communication Port 通訊阜(Serial 序列阜) = Communication Port 通讯阜(Serial 序列阜)LPT Port : Local Printer Port (Parallel Port : 並列阜) = Local Printer Port (Parallel Port : 并列阜)OS: Operation System 作業系統= Operat ion System 操作系统H/W : Hardware 硬體= Hardware 硬件S/W : Software 軟體= Software 软件F/W : Firmware 韌體= Firmware 韧体IrDA : Infrared Data AssociationPAT : Performance Acceleration Technology = 效能加速技術= 效能加速技术ATAPI : Advanced Technology Attachment Packet InterfaceATA : Advanced Technology AttachmentIDE : Integrated Drive ElectronicsEIDE : Enhance IDEVRM : Voltage Regulator Module 電壓調節模組= 电压调节模块DIMM : Dual In-Line Memory ModuleSIMM : Single In-Line Memory ModuleDIP : 插件= 插件（双列直插式）SMT : Surface Mount Technology 表面黏著技術= 表面黏着技术SMD : Surface Mount Device表面黏著裝置= 表面黏着装置（贴片式）MOSFET : Metal Oxide Semiconductor Filed Effect Transistor 金屬氧化物半導體場效電晶體= 金属氧化物半导体场效晶体管CMOS : Complementary Metal Oxide Semiconductor 互補金屬氧化物半導體= 互补金属氧化物半导体DVMT : Dynamic Video Memory Technology 動態視訊記憶體技術= 动态视讯内存技术ESCD : Extended System Configuration Data = 延伸系統規劃資料= 延伸系统规划资料PLL : Phase Lock Loop 相鎖回路= 相锁回路PXI : PCI Extensions for InstrumentationProtocol通訊協定= 通讯协议GPIB : General-Purpose Interface Bus 通用介面匯流排= 通用接口总线EU : Exection Unit 执行部件IU : instruction unit 指令部件BU : bus unit 总线部件AU : Adress unit 地址部件MMU : 存储器管理部件BIU : 总线接口部件ALU : Arithmetical Logic Unit 算數邏輯單元= 算数逻辑单元FPU : Floating Point Unit 浮點運算單元= 浮点运算单元ISR : Interrupt Service Routine中斷向量服務常式= 中断向量服务例程T.P : Throttle Point 節流點= 节流点EDO : Extended Data Output 延伸資料輸出= 延伸资料输出FPM : Fast Page Mode 快速頁模式= 快速页模式PPM : Parts Per Million 百萬分之…= 百万分之….POST : Power On Self Test 開機自我測試= 开机自我测试IPMI : Intelligent Platform Management Interface 智慧平臺管理介面= 智能平台管理接口FRU : Field Replaceable UnitI2O : Intelligent Input/Output 智慧型輸出入= 智能型输出入PCB : Print Circuit Board 印刷電路板= 印刷电路板O.E.M. : Original Equipment Manufacturer客戶委託生産製造= 客户委托生产制造C.E.M. : Component Equipment Manufacturer客戶委託生産製造= 客户委托生产制造O.D.M. : Original Design Manufacturer客戶委託設計製造= 客户委托设计制造S.M.A.R.T. : Self-Monitoring Analysis and Reporting Technology 自我診斷分析回報技術=自我诊断分析回报技术(硬盘) 1X : 一倍速= 一倍速2X : 二倍速= 二倍速4X : 四倍速= 四倍速8X : 八倍速= 八倍速Connector 連結器= 连结器Socke t 插座= 插座Header 排針= 排针Slot插槽= 插槽Resistor 電阻器= 电阻器Capacitor 電容器= 电容器Inductor電感器= 电感器Transient暫態= 瞬时VTT : Voltage Transient ToolScope : 示波器= 示波器ECC = Error Checking and Correction 錯誤檢查與修正= 错误检查与修正LPC = Low Pin CountPjM : Project Manager 專案管理師= 项目管理师PM : Product Manager 產品管理師= 产品管理师PE : Production Engineer 產品工程師= 产品工程师ICT : In Circuit TestATE : Auto Test EquipmentSchematic線路圖= 线路图Layout 佈線= 布线Simulation模擬= 仿真Waveform 波形= 波形GerberTiming Measurement: 時序量測= 时序量测Rising TimeFalling TimeHigh TimeLow TimeSkewFlight TimeGlitchMonotonicNon-monotonicForm Factor :AT : Advance Technology進階技術= 进阶技术ATX : Advanced Technology ExpandingMicro ATXFlex ATXNLXChipset Vendor 晶片製造商= 芯片制造商Intel 美商英代爾= 美商英特尔AMD 美商超微= 美商超微VIA威盛電子= 威盛电子SiS矽統科技= 硅统科技Ali = 揚智科技= 扬智科技OEM/OEM Customer : OEM/OEM客戶IBM 國際商業機器公司= 国际商业机器公司DELL 戴爾電腦= 戴尔计算机New HP (HP + Compaq) 惠普科技= 惠普科技NEC 日电SONYFujitsu Siemens 富士SDRAM : Synchronous Dynamic Random Access Memory CSA : Communication Streaming ArchitectureHWM : Hardware MonitorByte : 字节Word : 字DWord : Double Word : 双字Unit :m = 10^(-3) => mini-u = 10^(-6) => micro-n = 10^(-9) => nano-p = 10^(-12) = pico-K = 10^3 = Kilo-M = 10^6 = Mega-G = 10^9 = Giga-T = 10^12 = Tera-DMA direct memory access 直接内存存取模式Dvice Driver (设备)驱动程序LSI 大规模集成电路VLSI 超大规模集成电路。

电脑操作术语电脑操作术语是指在使用计算机时经常会遇到的专业术语或名词，它们是计算机领域内的专有名词，用来描述计算机的各种功能、操作、性能等方面。

对于不了解这些术语的人来说，可能会感到困惑和茫然，因此了解和掌握这些术语是非常重要的。

下面将介绍一些常用的电脑操作术语。

1. 操作系统（Operating System）操作系统是一种系统软件，用来管理计算机的硬件资源和提供用户接口，使用户能够更方便地与计算机进行交互。

常见的操作系统有Windows、Mac OS、Linux等。

2. 文件系统（File System）文件系统是用来管理计算机硬盘上存储的文件和数据的一种系统。

它负责在硬盘上创建、删除、移动文件，提供文件的读写操作等功能。

3. 硬盘（Hard Disk）硬盘是计算机中用来存储数据的设备，它由一个或多个盘片组成，通过磁头在盘片上读写数据。

硬盘分为机械硬盘和固态硬盘两种类型，固态硬盘比机械硬盘读写速度更快。

4. 内存（Memory）内存是计算机中用来临时存储数据和程序的存储器，它通常被称为RAM（Random Access Memory）。

内存的速度比硬盘快，计算机运行时会将程序数据加载到内存中进行运行。

5. CPU（Central Processing Unit）CPU是计算机的中央处理器，它是计算机的核心组件，用来执行计算机程序的指令。

CPU 的速度和性能直接影响计算机的运行速度和效率。

6. BIOS（Basic Input/Output System）BIOS是计算机的基本输入输出系统，它位于主板上，是计算机启动时加载的固件，负责初始化硬件设备和提供基本输入输出功能。

7. 显卡（Graphics Card）显卡是负责显示计算机屏幕上图像的设备，它通常包含一个或多个GPU（Graphics Processing Unit），用来处理图像数据和渲染图像。

8. 驱动程序（Driver）驱动程序是一种软件，用来控制计算机硬件设备的工作。