74ABT2244CMSA中文资料

DatasheetPRODUCT FEATURESUSB2244/USB2244IUltra Fast USB 2.0 SD/MMC Flash Media ControllerGeneral DescriptionThe SMSC USB2244/USB2244i is a USB 2.0 compliant,high speed Bulk Only Mass Storage Class Peripheral Controller intended for reading and writing to SD/MMC Flash Media Cards.The SMSC USB2244/USB2244i is a fully integrated, single chip solution capable of ultra high performance operation.Average sustained transfer rates exceeding 35MB/s are possible if the media and host can support those rates.Provisions to read/write secure media formats is also provided.General Features36-pin QFN (6x6mm) lead-free RoHS compliant package Hardware-controlled data flow architecture for all self-mapped mediaPipelined hardware support for access to non-self-mapped mediaProduct name with “i” denotes the version that supports the industrial temperature range of -40ºC to 85ºCSupport included for secure media format on a licensed, customized basis —SDSecureHardware FeaturesSingle Chip Flash Media Reader/Writer —Secure Digital 2.0–HS-SD, HC-SD, TransFlash™ and reduced form factor media —MultiMediaCard Specification 4.2–1/4/8 bit MMCSDIO and MMC Streaming Mode support Extended configuration options —Socket switch polarities, etc. Media Activity LEDGPIO configuration and polarity—Up to 8 GPIOs for special function use: LED indicators,power control to memory devices, etc. The number of actual GPIO’s depends on the implementation configuration used.—One GPIO with up to 200 mA drive On Board 24MHz Crystal Driver CircuitInternal Card Power FET —200mA—"Fold-back" short circuit current protected8051 8-bit microprocessor—60MHz - single cycle execution —64KB ROM; 14KB RAMInternal Regulator for 1.8V core operationOptimized pinout improves signal routing, easingimplementation and allowing for improved signal integrityMask Programmable FeaturesVID/PID/Language ID28-character Manufacturer ID and Product string 12-hex digit (max) Serial Number stringCustomizable Vendor specific data LED blink interval or durationSoftware FeaturesOptimized for low latency interrupt handling Reduced memory footprintPlease see the USB2244/USB2244i Software Release Notes for additional Software Features.ApplicationsFlash Media Card Reader/Writer PrintersDesktop and Mobile PCs Consumer A/VMedia Players/Viewers Vista ReadyBoost TMCompatible with Microsoft Vista, Windows XP , Windows ME, Windows 2K SP4, Apple OSx, and Linux Mass Storage Class DriversORDER NUMBER:USB2244/USB2244i-AEZG-XX for 36 pin, QFN Lead-Free RoHS Compliant Package “XX” in the order number indicates the internal ROM firmware revision level.Please contact your SMSC sales representative for more information.80 ARKAY DRIVE, HAUPPAUGE, NY 11788 (631) 435-6000, FAX (631) 273-3123Copyright © 2008 SMSC or its subsidiaries. All rights reserved.Circuit diagrams and other information relating to SMSC products are included as a means of illustrating typical applications. Consequently, complete information sufficient for construction purposes is not necessarily given. Although the information has been checked and is believed to be accurate, no responsibility is assumed for inaccuracies. SMSC reserves the right to make changes to specifications and product descriptions at any time without notice. Contact your local SMSC sales office to obtain the latest specifications before placing your product order. The provision of this information does not convey to the purchaser of the described semiconductor devices any licenses under any patent rights or other intellectual property rights of SMSC or others. All sales are expressly conditional on your agreement to the terms and conditions of the most recently dated version of SMSC's standard Terms of Sale Agreement dated before the date of your order (the "Terms of Sale Agreement"). The product may contain design defects or errors known as anomalies which may cause the product's functions to deviate from published specifications. Anomaly sheets are available upon request. SMSC products are not designed, intended, authorized or warranted for use in any life support or other application where product failure could cause or contribute to personal injury or severe property damage. Any and all such uses without prior written approval of an Officer of SMSC and further testing and/or modification will be fully at the risk of the customer. Copies of this document or other SMSC literature, as well as the Terms of Sale Agreement, may be obtained by visiting SMSC’s website at . SMSC is a registered trademark of Standard Microsystems Corporation (“SMSC”). Product names and company names are the trademarks of their respective holders.SMSC DISCLAIMS AND EXCLUDES ANY AND ALL WARRANTIES, INCLUDING WITHOUT LIMITATION ANY AND ALL IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, TITLE, AND AGAINST INFRINGEMENT AND THE LIKE, AND ANY AND ALL WARRANTIES ARISING FROM ANY COURSE OF DEALING OR USAGE OF TRADE. IN NO EVENT SHALL SMSC BE LIABLE FOR ANY DIRECT, INCIDENTAL, INDIRECT, SPECIAL, PUNITIVE, OR CONSEQUENTIAL DAMAGES; OR FOR LOST DATA, PROFITS, SAVINGS OR REVENUES OF ANY KIND; REGARDLESS OF THE FORM OF ACTION, WHETHER BASED ON CONTRACT; TORT; NEGLIGENCE OF SMSC OR OTHERS; STRICT LIABILITY; BREACH OF WARRANTY; OR OTHERWISE; WHETHER OR NOT ANY REMEDY OF BUYER IS HELD TO HAVE FAILED OF ITS ESSENTIAL PURPOSE, AND WHETHER OR NOT SMSC HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.Ultra Fast USB 2.0 SD/MMC Flash Media ControllerDatasheetUltra Fast USB 2.0 SD/MMC Flash Media ControllerDatasheetTable of ContentsChapter1Acronyms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6Chapter2Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7Chapter3Pin Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3.136-Pin Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8Chapter4Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9Chapter5Pin Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5.1Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5.2Buffer Type Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12Chapter6Pin Reset State Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 6.136-Pin Reset States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14Chapter7DC Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 7.1Maximum Guaranteed Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 7.2Recommended Operating Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 7.3DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 7.4Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19Chapter8AC Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 8.1Oscillator/Clock. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Chapter9Package Outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Chapter10GPIO Usage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22Ultra Fast USB 2.0 SD/MMC Flash Media ControllerDatasheet List of FiguresFigure2.1USB2244/USB2244i Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Figure4.1USB2244/USB2244i 36 Pin QFN Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Figure6.1Pin Reset States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure6.2Legend for Pin Reset States Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure7.1Supply Rise Time Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure8.1Typical Crystal Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Figure8.2Formula to Find Value of C1 and C2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Figure9.1USB2244/USB2244i 36-QFN, 6x6mm Body, 0.5mm Pitch . . . . . . . . . . . . . . . . . . . . . . . . . . 21Ultra Fast USB 2.0 SD/MMC Flash Media ControllerDatasheetList of TablesTable3.1USB2244/2244i 36-Pin QFN Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Table5.2USB2244/2244i 36-Pin QFN Pin Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Table5.3USB2244/USB2244i Buffer Type Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Table6.1USB2244/USB2244i Pin Reset States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Table7.1Pin Capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Table10.1USB2244/USB2244i GPIO Usage(ROM Rev 0x00). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22Ultra Fast USB 2.0 SD/MMC Flash Media ControllerDatasheetRevision 1.0 (05-27-08)6SMSC USB2244/USB2244iChapter 1 AcronymsMMC: MultiMediaCard PLL: Phase-Locked Loop QFN: Quad Flat no LeadsRoHS: Restriction of Hazardous Substances Directive SD: Secure DigitalSDIO: Secure Digital Input/Output SDC: Secure Digital Controllerl SIE: Serial Interface Engine*Note: In order to develop, make, use, or sell readers and/or other products using or incorporating any of the SMSC devices made the subject of this document or to use related SMSC software programs, technical information and licenses under patent and other intellectual property rights from or through various persons or entities, including without limitation media standard companies,forums, and associations, and other patent holders may be required. These media standard companies, forums, and associations include without limitation the following: Sony Corporation (Memory Stick, Memory Stick Pro); SD3 LLC (Secure Digital); MultiMedia Card Association (MultiMediaCard); the SSFDC Forum (SmartMedia); the Compact Flash Association (Compact Flash); and Fuji Photo Film Co., Ltd., Olympus Optical Co., Ltd., and Toshiba Corporation (xD-Picture Card). SMSC does not make such licenses or technical information available; does not promise or represent that any such licenses or technical information will actually be obtainable from or through the various persons or entities (including the media standard companies, forums, and associations), or with respect to the terms under which they may be made available; and is not responsible for the accuracy or sufficiency of, or otherwise with respect to, any such technical information.SMSC's obligations (if any) under the Terms of Sale Agreement, or any other agreement with any customer, or otherwise, with respect to infringement, including without limitation any obligations to defend or settle claims, to reimburse for costs, or to pay damages, shall not apply to any of the devices made the subject of this document or any software programs related to any of such devices, or to any combinations involving any of them, with respect to infringement or claimed infringement of any existing or future patents related to solid state disk or other flash memory technology or applications ("Solid State Disk Patents"). By making any purchase of any of the devices made the subject of this document, the customer represents, warrants, and agrees that it has obtained all necessary licenses under then-existing Solid State Disk Patents for the manufacture, use and sale of solid state disk and other flash memory products and that the customer will timely obtain at no cost or expense to SMSC all necessary licenses under Solid State Disk Patents; that the manufacture and testing by or for SMSC of the units of any of the devices made the subject of this document which may be sold to the customer, and any sale by SMSC of such units to the customer, are valid exercises of the customer's rights and licenses under such Solid State Disk Patents; that SMSC shall have no obligation for royalties or otherwise under any Solid State Disk Patents by reason of any such manufacture, use, or sale of such units; and that SMSC shall have no obligation for any costs or expenses related to the customer's obtaining or having obtained rights or licenses under any Solid State Disk Patents.SMSC MAKES NO WARRANTIES, EXPRESS, IMPLIED, OR STATUTORY, IN REGARD TO INFRINGEMENT OR OTHER VIOLATION OF INTELLECTUAL PROPERTY RIGHTS. SMSC DISCLAIMS AND EXCLUDES ANY AND ALL WARRANTIES AGAINST INFRINGEMENT AND THE LIKE.No license is granted by SMSC expressly, by implication, by estoppel or otherwise, under any patent, trademark, copyright, mask work right, trade secret, or other intellectual property right.**To obtain this software program the appropriate SMSC Software License Agreement must be executed and in effect. Forms of these Software License Agreements may be obtained by contacting SMSC.Ultra Fast USB 2.0 SD/MMC Flash Media Controller DatasheetSMSC USB2244/USB2244i 7Revision 1.0 (05-27-08)Chapter 2 Block DiagramFigure 2.1 USB2244/USB2244i Block DiagramUltra Fast USB 2.0 SD/MMC Flash Media ControllerDatasheetRevision 1.0 (05-27-08)8SMSC USB2244/USB2244iChapter 3 Pin Table3.136-Pin PackageTable 3.1 USB2244/2244i 36-Pin QFN PackageSD/MMC INTERFACE (12 Pins)SD_D0SD_D1SD_D2SD_D3SD_D4SD_D5SD_D6SD_D7SD_CLK SD_CMD SD_WP GPIO15 (SD_nCD)USB INTERFACE (7 PINS)USB+USB-RBIASXTAL1 (CLKIN)XTAL2VDDA33VDD18PLLMISC (13 PINS)GPIO1 (LED1)GPIO2 / RXD / SDA GPIO4GPIO7 / TXD / SCKGPIO10 (CRD_PWR)GPIO12GPIO14(4) NCTEST nRESETDIGITAL, POWER (4 PINS)(3)VDD33VDD18TOTAL 36Ultra Fast USB 2.0 SD/MMC Flash Media Controller DatasheetSMSC USB2244/USB2244i 9Revision 1.0 (05-27-08)Chapter 4 Pin ConfigurationFigure 4.1 USB2244/USB2244i 36 Pin QFN DiagramUltra Fast USB 2.0 SD/MMC Flash Media ControllerDatasheetRevision 1.0 (05-27-08)10SMSC USB2244/USB2244iChapter 5 Pin DescriptionsThis section provides a detailed description of each signal. The signals are arranged in functional groups according to their associated interface.The “n” symbol in the signal name indicates that the active, or asserted, state occurs when the signal is at a low voltage level. When “n” is not present before the signal name, the signal is asserted at the high voltage level.The terms assertion and negation are used exclusively. This is done to avoid confusion when working with a mixture of “active low” and “active high” signals. The term assert, or assertion, indicates that a signal is active, independent of whether that level is represented by a high or low voltage. The term negate, or negation, indicates that a signal is inactive.5.1 Pin DescriptionsTable 5.2 USB2244/2244i 36-Pin QFN Pin DescriptionsNAMESYMBOL36-PIN QFNBUFFER TYPEDESCRIPTIONSECURE DIGITAL INTERFACESD DataSD_D[7:0]781020232545I/O12PUThe bi-directional signals should have weak pull-up resistors. The register can be controlled by: SD_MMC_INTF_EN bit of SDC_MODE_CTLSD Clock SD_CLK 9O12This is an output clock signal to SD/MMC device.The clock frequency is software configurable.SD Command SD_CMD 11I/O12PUThis is a bi-directional signal that connects to the CMD signal of SD/MMC device. The bi-directional signal should have an internal weak pull-up resistor.The pull-up register can be controlled by:SD_MMC_INTF_EN bit of SDC_MODE CTLSD Write Protect SD_nWP 30I/O12This pin is designated as the Secure Digital card mechanical write detect pin.SD Card Detect GPIOGPIO15 (SD_nCD)26I/O12This is a GPIO designated as the Secure Digital card detection pin.USB INTERFACEUSB Bus Data USB+USB-23I/O-U These pins connect to the USB bus data signals.USB Transceiver BiasRBIAS35I-RA 12.0k , 1.0% resistor is attached from VSSA to this pin in order to set the transceiver's internal bias currents.24MHz Crystal or external clock inputXTAL1 (CLKIN)33ICLKxThis pin can be connected to one terminal of the crystal or it can be connected to an external 24 clock when a crystal is not used.24MHz CrystalXTAL232OCLKxThis is the other terminal of the crystal, or it can be left open when an external clock source is used to drive XTAL1(CLKIN). It may not be used to drive any external circuitry other than the crystal circuit.3.3V Analog PowerVDDA3336 3.3V Analog Power1.8V PLL PowerVDD18PLL34This pin is the 1.8V Power for the PLL.+1.8V Filtered analog power for internal PLL. This pin must have a 1.0μF(or greater) ±20% (ESR <0.1Ω) capacitor to VSS.MISCGeneral Purpose I/OGPIO1 (LED1)1I/O12This pin may be used either as input, edge sensitive interrupt input, or output.In addition, as an output, the GPIO1 can use output controlled by the LED1_GPIO1 register.General Purpose I/OGPIO2 / RXD / SDA27I/O12GPIO: This pin may be used either as input, edge sensitive interrupt input, or output.IRXD: In addition to the above, the signal can be used as input to the RXD of UART in the device, when the TXD_RXD_SEL bit in UTIL_CONFIG1 register is cleared to "0".I/O12SDA: This is the data pin when used with an external serial EEPROM.General Purpose I/OGPIO429I/O12This pin may be used either as input, edge sensitive interrupt input, or output.General Purpose I/OGPIO7 / TXD / SCK31I/O12GPIO: This pin may be used either as input, edge sensitive interrupt input, or output.O12TXD: In addition, as an output, the GPIO7 can be used as an output TXD of UART in the device, when the GPIO2/TXD bit in UTL_CONFIG register is set to "1"O12SCK: This is the clock output when used with an external EEPROM.General Purpose I/OGPIO10 (CRD_PWR)21I/O200GPIO: This pin may be used either as input, edge sensitive interrupt input, or output. CRD_PWR: Card Power drive of 3.3V @ either 100mA or 200mA.General Purpose I/OGPIO1419I/O12This pin may be used either as input, edge sensitive interrupt input, or output.RESET InputnRESET18ISThis active low signal is used by the system to reset the chip. The active low pulse should be at least 1μs wide.NAME SYMBOL 36-PIN QFN BUFFER TYPE DESCRIPTION5.2 Buffer Type DescriptionsTEST InputTEST28IThis signal is used for testing the chip. User should normally tie this pin low externally if the test function is not used.No Connects NCNo Connect. No trace or signal should be routed/attached to these pins.DIGITAL / POWER+1.8V Core powerVDD1813All VDD18 pins must be connected together on the circuit board.+1.8V core power. This pin must have a 1.0μF (or greater) ±20% (ESR <0.1Ω) capacitor to VSS.3.3V Power & Regulator Input.VDD3361422 3.3V Power & Regulator Input.GroundVSS SLUGGround ReferenceTable 5.3 USB2244/USB2244i Buffer Type DescriptionsBUFFERDESCRIPTIONI Input.IS Input with Schmitt trigger.I/O12Input/Output buffer with 12mA sink and 12mA source.I/O200Input/Output buffer 12mA with FET disabled, 100/200mA source only when the FET is enabled.I/O12PU Input/Output buffer with 12mA sink and 12mA source with a pull-up resistor.O12Output buffer with 12mA source.ICLKx XTAL clock input.OCLKx XTAL clock output.I/O-U Analog Input/Output Defined in USB specification.I-RRBIAS.NAME SYMBOL 36-PIN QFN BUFFER TYPE DESCRIPTIONChapter6 Pin Reset State TableFigure6.1 Pin Reset StatesLEGENDyes hardware enables function--hardware disables functionz hardware disables output driverpu hardware enables pulluppd hardware enables pulldownhw hardware controls function, but state is protocol dependent(fw)firmware controls function through registersVDD hardware supplies power through pin, applicable only to CARD_PWR pinsnone hardware disables padFigure6.2 Legend for Pin Reset States Table6.1 36-Pin Reset StatesTable6.1 USB2244/USB2244i Pin Reset StatesRESET STATE Post-Reset State SD ModePIN PIN NAME FUNCTION OUT-PUT PU/PDIN-PUT FUNCTIONOUT-PUTPU/PDIN-PUT8SD_D6none z----SD_D6hw pu yes 7SD_D7none z----SD_D7hw pu yes 5SD_D0none z----SD_D0hw pu yes 4SD_D1none z----SD_D1hw pu yes 30SD_WP SD_WP0----SD_WP(fw)(fw)(fw) 25SD_D2none z----SD_D2hw pu yes 23SD_D3none z----SD_D3hw pu yes 20SD_D4none z----SD_D4hw pu yes 9SD_CLK none z----SD_CLK hw--yes 10SD_D5none z----SD_D5hw pu yes 11SD_CMD none z----SD_CMD hw pu yes 19GPIO14GPIO z pu yes26GPIO15 (SD_nCD)GPIO z pu yes24GPIO12GPIO z pu yes27GPIO2 / RXD / SDA GPIO0----RXD z pu yes 29GPIO4GPIO0----31GPIO7 / TXD / SCK GPIO0----TXD hw----21GPIO10(CARD_PWR)GPIO z----PWR VDD----28TEST TEST z--yes18nRESET nRESET z--yes1GPIO1 (LED1)GPIO10----17:15NC none z----none z----12NC none z----none z----2USB+USB+z----3USB-USB-z----35RBIAS33XTAL1 (CLKIN)32XTAL2Chapter 7 DC Parameters7.1Maximum Guaranteed RatingsNote 7.1Stresses above the specified parameters may cause permanent damage to the device.This is a stress rating only and functional operation of the device at any condition above those indicated in the operation sections of this specification is not implied.Note 7.2When powering this device from laboratory or system power supplies, it is important that the Absolute Maximum Ratings not be exceeded or device failure can result. Some power supplies exhibit voltage spikes on their outputs when the AC power is switched on or off.In addition, voltage transients on the AC power line may appear on the DC output. When this possibility exists, it is suggested that a clamp circuit be used.PARAMETER SYMBOL MIN MAXUNITS COMMENTSStorage Temperature T A-55150°C LeadTemperature 325°C Soldering < 10 seconds3.3V supply voltage V DD33, V DDA33-0.5 4.0V Voltage on USB+ and USB- pins -0.5(3.3V supply voltage + 2) ≤ 6VVoltage on GPIO10-0.5V DD33 + 0.3VWhen internal power FET operation of this pin is enabled, this pin may be simultaneously shorted to ground or anyvoltage up to 3.63V indefinitely, without damage to the device as long as V DD33 and V DDA33 are less than 3.63V and T A is less than 70o C.Voltage on any signal pin -0.5V DD33 + 0.3V Voltage on XTAL1 -0.5 4.0V Voltage on XTAL2-0.5V DD18 + 0.3VFigure 7.1 Supply Rise Time Model7.2 Recommended Operating ConditionsNote 7.3A 3.3V regulator with an output tolerance of 1% must be used if the output of the internal power FET’s must support a 5% tolerance.PARAMETERSYMBOLMINMAXUNITSCOMMENTSOperating Temperature Commercial Part Industrial Part T A T A 0-407085°C °C 3.3V supply voltage V DD33, V DDA33 3.0 3.6V (Note 7.3)3.3V supply rise time tRT0400μs Voltage onUSB+ and USB- pins-0.35.5VIf any 3.3V supply voltage drops below 3.0V, then the MAX becomes:(3.3V supply voltage) + 0.5 ≤ 5.5Voltage on any signal pin-0.3V DD33V Voltage on XTAL1 -0.3V DDA33V Voltage on XTAL2-0.3V DD18V7.3 DC Electrical CharacteristicsPARAMETER SYMBOL MIN TYP MAX UNITS COMMENTS I, IPU, IPD Type Input BufferLow Input Level High Input Level Pull DownPull Up V ILIV IHIPDPU2.072580.8VVμAμATTL LevelsIS Type Input BufferLow Input Level High Input Level HysteresisV ILIV IHIV HYSI2.04200.8VVmVTTL LevelsICLK Input BufferLow Input Level High Input Level Input Leakage V ILCKV IHCKI IL1.4-100.5+10VVμA VIN = 0 to V DD33Input Leakage (All I and IS buffers)Low Input Leakage High Input Leakage I ILI IH-10-10+10+10μAμAV IN = 0V IN = V DD33O12 Type BufferLow Output Level High Output Level Output Leakage V OLV OHI OLV DD33- 0.4-100.4+10VVμAI OL = 12mA @V DD33= 3.3VI OH = -12mA @V DD33= 3.3VV IN = 0 to V DD33(Note7.4)Note 7.4Output leakage is measured with the current pins in high impedance.Note 7.5See The USB 2.0 Specification, Chapter 7, for USB DC electrical characteristics Note 7.6RBIAS is a 3.3V tolerant analog pin.Note 7.7Output current range is controlled by program software, software disables FET during short circuit condition.Note 7.8The assignment of each Integrated Card Power FET to a designated Card Connector is controlled by both firmware and the specific board implementation. Firmware will default toI/O12, I/O12PU & I/O12PD Type BufferLow Output LevelHigh Output LevelOutput LeakagePull Down Pull Up V OLV OHI OL PD PUV DD33 - 0.4-1072580.4+10VVµAμA μAI OL = 12mA @ V DD33= 3.3V I OH = -12mA @ V DD33= 3.3V V IN = 0 to V DD33(Note 7.4)IO-U(Note 7.5)I-R(Note 7.6)I/O200Integrated Power FET for GPIO10High Output Current Mode Low Output Current Mode (Note 7.7)On Resistance (Note 7.7)Output Voltage Rise Time I OUT I OUT R DSON t DSON 2001002.1800mA mAΩμs Vdrop FET = 0.46V Vdrop FET = 0.23V I FET = 70mA C LOAD = 10μFSupply Current Unconfigured I CCINIT 8090mA Supply Current Active Full Speed High SpeedI CC I CC 110135140165mA mA Supply Current Suspend I CSBY 350700µA Industrial Temperature SuspendI CSBYI350900µAPARAMETERSYMBOL MIN TYP MAX UNITS COMMENTSthe settings listed in Table10.1, “USB2244/USB2244i GPIO Usage(ROM Rev 0x00),” onpage22.Note7.9The 3.3V supply should be at least at 75% of its operating condition before the 1.8V supply is allowed to ramp up.7.4 CapacitanceT A = 25°C; fc = 1MHz; V DD, V DDP = 1.8VTable7.1 Pin CapacitancePARAMETER SYMBOLLIMITSUNIT TEST CONDITION MIN TYP MAXClock Input Capacitance C XTAL2pF All pins (except USB pinsand pins under test) are tiedto AC ground.Input Capacitance C IN10pFOutput Capacitance C OUT20pFChapter8 AC Specifications8.1 Oscillator/ClockCrystal:Parallel Resonant, Fundamental Mode, 24 MHz ± 100ppm.External Clock: 50% Duty cycle ± 10%, 24 MHz ± 100ppm, Jitter < 100ps rms.Figure8.1 Typical Crystal CircuitNote:C B equals total board/trace capacitance.Figure8.2 Formula to Find Value of C1 and C2。

TEST CONDITIONS
Tamb (°C)
SYMBOL PARAMETER
OTHER
25
−40 to +85 −40 to +125 UNIT
VCC (V)
MIN. TYP. MAX. MIN. MAX. MIN. MAX.
VIH
HIGH-level input
voltage
2.0
1.5 −
−
For TSSOP packages: above 60 °C the value of PD derates linearly with 5.5 mW/K.
1999 Sep 28
5
元器件交易网
Philips Semiconductors
Octal buffer/line driver; 3-state

CO
output capacitance
4.0 4.0 pF
CPD
power dissipation CL = 50 pF;
10
12
pF
capacitance
f = 1 MHz;
notes 1 and 2
Notes 1. CPD is used to determine the dynamic power dissipation (PD in µW).
IO
DC output source or sink current −0.5 V < VO < VCC + 0.5 V
ICC
DC VCC or GND current
Tstg
storage temperature range
PD
power dissipation per package for temperature range: −40 to +125 °C; note 2

HD74LVC2244AOctal Buffers / Line Drivers with 3–state OutputsADE-205-234 (Z)Preliminary1st. EditionDecember 1998 DescriptionThe HD74LVC2244A has eight line drivers with three state outputs in a 20 pin package. This device is a noninverting buffer and has two active low enables (1G and 2G). Each enable independently controls four buffers.All outputs, which are designed to sink up to 12 mA, include equivalent 26 Ω resistors to reduce overshoot and undreshoot.is between 0 and 1.5 V, the device is in the high impedance state during power up or power When VCCdown.Low voltage and high speed operation is suitable at battery drive product (note type personal computer) and low power consumption extends the life of a battery for long time operation.Features• V CC = 1.65 to 5.5 V• All inputs V IH (Max) = 5.5 V (@V CC = 0 to 5.5 V)• All outputs V O (Max) = 5.5 V (@V CC = 0 V or output off state)• Typical V OL ground bounce < 0.8 V (@V CC = 3.3 V, Ta = 25°C)• Typical V OH undershoot > 2.0 V (@V CC = 3.3 V, Ta = 25°C)• High output current ±12 mA (@V CC = 3.0 to 5.5 V)• All outputs have equivalent 26 Ω series resistors, so no external resistors are requiredHD74LVC2244AFunction TableInputs Output YG AH X ZL H HL L LH : High levelL : Low levelX : ImmaterialZ : High impedancePin Arrangement2HD74LVC2244A3Absolute Maximum RatingsItemSymbol Ratings Unit ConditionsSupply voltage V CC –0.5 to 7.0V Input voltage V I –0.5 to 7.0V Output voltage V O –0.5 to 7.0VOutput “Z” or V CC : OFF –0.5 to V CC +0.5Output “H” or “L”Input diode current I IK –50mA V I < 0Output diode current I OK –50mA V O < 0Output current I O±50mA V CC , GND current I CC or I GND ±100mA Storage temperatureTstg–65 to 150°C Note:The absolute maximum ratings are values which must not individually be exceeded, and furthermoreno two of which may be realized at the same time.Recommended Operating ConditionsItemSymbol Ratings Unit Conditions Supply voltage V CC 1.65 to 5.5VAt operation 1.5 to 5.5Data retention onlyInput voltage V I 0 to 5.5V Output voltage V O 0 to 5.5VOutput “Z” or V CC : OFF 0 to V CC Output “H” or “L”Output currentI OH–2mA V CC = 1.65 V –4V CC = 2.3 V –8V CC = 2.7 V –12V CC = 3.0 to 5.5 V I OL2V CC = 1.65 V 4V CC = 2.3 V 8V CC = 2.7 V 12V CC = 3.0 to 5.5 VInput rise / fall time t r , t f 0 to 6ns / V Operating temperatureTa–40 to +85°CHD74LVC2244A Logic Diagram4HD74LVC2244A5Electrical Characteristics (Ta = –40 to 85°C)Item Symbol V CC (V)Min Typ Max Unit Test Conditions Input voltageV IH1.65 to 1.95V CC ×0.65——V2.3 to 2.7 1.7——2.7 to3.6 2.0——4.5 to 5.5V CC ×0.7——V IL1.65 to 1.95——V CC ×0.352.3 to 2.7——0.72.7 to3.6——0.84.5 to5.5——V CC ×0.3Output voltageV OH1.65 to 5.5V CC –0.2——VI OH = –100 µA 1.65 1.2——I OH = –2 mA 2.3 1.7——I OH = –4 mA2.7 2.2——3.0 2.4——I OH = –6 mA 2.7 2.0——I OH = –8 mA 3.0 2.0——I OH = –12 mA4.53.6——V OL1.65 to 5.5——0.2I OL = 100 µA 1.65——0.45I OL = 2 mA 2.3——0.7I OL = 4 mA 2.7——0.43.0——0.55I OL = 6 mA 2.7——0.6I OL = 8 mA 3.0——0.8I OL = 12 mA 4.5——0.8Input current I IN 0 to 5.5——±5µA V IN = 0 to 5.5 V Off state output current I OZ1.65 to 5.5——±5µA V OUT = 0 to 5.5 V Output leak current I OFF 0——±5µA V IN or V O = 5.5 VQuiescent supply I CC1.65 to 3.6——10µA V IN = 3.6 to 5.5 V *1, I O = 0current1.65 to 5.5——10V IN = V CC or GND∆I CC 2.7 to 3.6——500V IN = one input at (V CC –0.6)V,other inputs at V CC or GND Input capacitance C IN 3.3—TBD —pF V IN = V CC or GND Output capacitance C O3.3—TBD—pFV OUT = V CC or GND Note:1.This applies in the disabled state only.HD74LVC2244A6Switching Characteristics (Ta = –40 to 85°C)ItemSymbol V CC (V)MinTyp Max Unit FROM (Input)TO(Output)Propagation delay timet PLH 1.8±0.15TBD TBD TBD nsAYt PHL2.5±0.2TBD TBD TBD 2.7—— 6.43.3±0.3 1.5— 5.55.0±0.5—— 4.1Output enable timet ZH 1.8±0.15TBD TBD TBD nsGYt ZL2.5±0.2TBD TBD TBD 2.7——8.13.3±0.3 1.0—7.15.0±0.5—— 5.6Output disable timet HZ 1.8±0.15TBD TBD TBD nsGYt LZ2.5±0.2TBD TBD TBD 2.7——7.33.3±0.3 1.5— 6.85.0±0.5—— 5.7Between output pin skew *1t OSLH1.8±0.15TBD TBD TBD ns t OSHL2.5±0.2TBD TBD TBD 2.7———3.3±0.3—— 1.05.0±0.5——1.0Note : 1.This parameter is characterized but not tested.t OSLH = |t PLHm –t PLHn |, t OSHL = |t PHLm –t PHLn |HD74LVC2244A7Test Circuit(V CC = 1.8±0.15 V, V CC = 2.5±0.2 V)HD74LVC2244A8(V CC = 2.7 V, V CC = 3.3±0.3 V, V CC = 5.0±0.5 V)HD74LVC2244A9(V CC = 1.8±0.15 V, V CC = 2.5±0.2 V)HD74LVC2244A10(V CC = 2.7 V, V CC = 3.3±0.3 V, V CC = 5.0±0.5 V)HD74LVC2244A Package DimensionsUnit : mm11HD74LVC2244A12Hitachi Code JEDEC EIAJWeight (reference value)TTP-20DA ——0.07 gUnit: mm*Dimension including the plating thicknessBase material dimension元器件交易网Cautions1.Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,copyright, trademark, or other intellectual property rights for information contained in this document.Hitachi bears no responsibility for problems that may arise with third party’s rights, includingintellectual property rights, in connection with use of the information contained in this document.2.Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use.3.Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,traffic, safety equipment or medical equipment for life support.4.Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installationconditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.5.This product is not designed to be radiation resistant.6.No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi.7.Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products.Hitachi, Ltd.Semiconductor & Integrated Circuits.Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.Hitachi Asia Pte. Ltd.16 Collyer Quay #20-00Hitachi TowerSingapore 049318Tel: 535-2100Fax: 535-1533URLNorthAmerica : http:/Europe : /hel/ecg Asia (Singapore): .sg/grp3/sicd/index.htm Asia (Taiwan): /E/Product/SICD_Frame.htm Asia (HongKong): /eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htmHitachi Asia Ltd.Taipei Branch Office3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105)Tel: <886> (2) 2718-3666Fax: <886> (2) 2718-8180Hitachi Asia (Hong Kong) Ltd.Group III (Electronic Components)7/F., North Tower, World Finance Centre,Harbour City, Canton Road, Tsim Sha Tsui,Kowloon, Hong Kong Tel: <852> (2) 735 9218Fax: <852> (2) 730 0281 Telex: 40815 HITEC HXHitachi Europe Ltd.Electronic Components Group.Whitebrook ParkLower Cookham Road MaidenheadBerkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000Fax: <44> (1628) 778322Hitachi Europe GmbHElectronic components Group Dornacher Stra§e 3D-85622 Feldkirchen, Munich GermanyTel: <49> (89) 9 9180-0Fax: <49> (89) 9 29 30 00Hitachi Semiconductor (America) Inc.179 East Tasman Drive,San Jose,CA 95134 Tel: <1> (408) 433-1990Fax: <1>(408) 433-0223For further information write to:。

HD74AC244/HD74ACT244Octal Buffer/Line Driver with 3-State OutputDescriptionThe HD74AC244/HD74ACT244 is an octal buffer and line driver designed to be employed as a memory address driver, clock driver and bus-oriented transmitter/receive which provides improved PC board density.Features• 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers• Outputs Source/Sink 24 mA• HD74ACT244 has TTL-Compatible InputsPin ArrangementHD74AC244/HD74ACT2442Truth TablesInputs OE 1D Outputs (Pins 12, 14, 16, 18)L L L L H H H XZInputs OE 2D Outputs (Pins 3, 5, 7, 9)L L L L H H H XZH :High Voltage Level L :Low Voltage Level X :ImmaterialZ:High ImpedanceDC Characteristics (unless otherwise specified)ItemSymbol Max Unit ConditionMaximum quiescent supply current I CC 80µA V IN = V CC or ground, V CC = 5.5 V,Ta = Worst caseMaximum quiescent supply current I CC 8.0µA V IN = V CC or ground, V CC = 5.5 V,Ta = 25°CMaximum additional I CC /input (HD74ACT244)I CCT1.5mAV IN = V CC – 2.1 V, V CC = 5.5 V,Ta = Worst caseHD74AC244/HD74ACT2443AC Characteristics: HD74AC244Ta = +25°C C L = 50 pFTa = –40°C to +85°C C L = 50 pF ItemSymbol V CC (V)*1Min Typ Max Min Max Unit Propagation delay t PLH3.3 1.0 6.59.0 1.010.0nsData to output 5.0 1.0 5.07.0 1.07.5Propagation delay t PHL 3.3 1.0 6.59.0 1.010.0ns Data to output 5.0 1.0 5.07.0 1.07.5Output enable time t PZH 3.3 1.0 6.010.5 1.011.0ns 5.0 1.0 5.07.0 1.08.0Output enable time t PZL 3.3 1.07.510.0 1.011.0ns 5.0 1.0 5.58.0 1.08.5Output disable time t PHZ 3.3 1.07.010.0 1.010.5ns 5.0 1.0 6.59.0 1.09.5Output disable time t PLZ 3.3 1.07.510.5 1.011.5ns 5.01.06.59.01.09.5Note:1.Voltage Range 3.3 is 3.3 V ± 0.3 VVoltage Range 5.0 is 5.0 V ± 0.5 VAC Characteristics: HD74ACT244Ta = +25°C C L = 50 pFTa = –40°C to +85°C C L = 50 pF ItemSymbol V CC (V)*1Min Typ Max Min Max Unit Propagation delay Data to output t PLH 5.0 1.0 6.59.0 1.010.0ns Propagation delay Data to output t PHL 5.0 1.07.09.0 1.010.0ns Output enable time t PZH 5.0 1.0 6.08.5 1.09.5ns Output enable time t PZL 5.0 1.07.09.5 1.010.5ns Output disable time t PHZ 5.0 1.07.09.5 1.010.5ns Output disable time t PLZ5.01.07.510.01.010.5nsNote:1.Voltage Range 5.0 is 5.0 V ± 0.5 VHD74AC244/HD74ACT2444CapacitanceItemSymbol Typ Unit Condition Input capacitanceC IN 4.5pF V CC = 5.5 V Power dissipation capacitanceC PD45.0pFV CC = 5.0 VHitachi Code JEDEC EIAJWeight (reference value)DP-20N —Conforms 1.26 gUnit: mm元器件交易网Hitachi Code JEDEC EIAJWeight (reference value)TTP-20DA ——0.07 gUnit: mm*Dimension including the plating thicknessBase material dimension元器件交易网Cautions1.Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,copyright, trademark, or other intellectual property rights for information contained in this document.Hitachi bears no responsibility for problems that may arise with third party’s rights, includingintellectual property rights, in connection with use of the information contained in this document.2.Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use.3.Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,traffic, safety equipment or medical equipment for life support.4.Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installationconditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.5.This product is not designed to be radiation resistant.6.No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi.7.Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products.Hitachi, Ltd.Semiconductor & Integrated Circuits.Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.Hitachi Asia Pte. Ltd.16 Collyer Quay #20-00Hitachi TowerSingapore 049318Tel: 535-2100Fax: 535-1533URLNorthAmerica : http:/Europe : /hel/ecg Asia (Singapore): .sg/grp3/sicd/index.htm Asia (Taiwan): /E/Product/SICD_Frame.htm Asia (HongKong): /eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htmHitachi Asia Ltd.Taipei Branch Office3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105)Tel: <886> (2) 2718-3666Fax: <886> (2) 2718-8180Hitachi Asia (Hong Kong) Ltd.Group III (Electronic Components)7/F., North Tower, World Finance Centre,Harbour City, Canton Road, Tsim Sha Tsui,Kowloon, Hong Kong Tel: <852> (2) 735 9218Fax: <852> (2) 730 0281 Telex: 40815 HITEC HXHitachi Europe Ltd.Electronic Components Group.Whitebrook ParkLower Cookham Road MaidenheadBerkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000Fax: <44> (1628) 778322Hitachi Europe GmbHElectronic components Group Dornacher Stra§e 3D-85622 Feldkirchen, Munich GermanyTel: <49> (89) 9 9180-0Fax: <49> (89) 9 29 30 00Hitachi Semiconductor (America) Inc.179 East Tasman Drive,San Jose,CA 95134 Tel: <1> (408) 433-1990Fax: <1>(408) 433-0223For further information write to:。