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Rev. 0.4 11/14Copyright © 2014 by Silicon LaboratoriesC8051F53x/52xEVELOPMENT IT SER S UIDE1. Relevant DevicesThe C8051F530 Development Kit is intended as a development platform for microcontrollers in the C8051F53x/52x MCU family. Code developed on the C8051F530 can be easily ported to the other members of this MCU family.2. Kit ContentsThe C8051F530 Development Kit contains the following items:⏹ C8051F530A Target Board⏹ C8051Fxxx Development Kit Quick-Start Guide ⏹ AC to DC Power Adapter⏹ USB Debug Adapter (USB to Debug Interface)⏹ USB CableThe development kit target board contains two C8051F530 microcontrollers that can communicate through an LIN network. One of the C8051F530 (U2) can also be connected to a CP2102 USB to UART bridge and directly connected to two analog signals and a Voltage Reference Signal Input.3. Hardware Setup Using a USB Debug AdapterThe target board is connected to a PC running the Silicon Laboratories IDE via the USB Debug Adapter as shown in Figure 1.1. Connect the USB Debug Adapter to one of the DEBUG connectors on the target board (HDR1 or HDR2) with the 10-pin ribbon cable. The recommended connection is to the HDR2 (connected to U2) as this microcontroller can be connected to the CP2102 USB to UART bridge.2. Verify that shorting blocks are installed on J13 and J14 to supply power to the target devices.3. Connect one end of the USB cable to the USB connector on the USB Debug Adapter.4. Connect the other end of the USB cable to a USB Port on the PC.5. Connect the ac/dc power adapter to power jack P5 on the target board.D 1D 2H H D 4C8051F53x/52xNotes:e the Reset button in the IDE to reset the target when connected using a USB Debug Adapter.2. Remove power from the target board and the USB Debug Adapter before connecting or disconnecting theribbon cable from the target board. Connecting or disconnecting the cable when the devices have power can damage the device and/or the USB Debug Adapter.4. Software SetupSimplicity Studio greatly reduces development time and complexity with Silicon Labs EFM32 and 8051 MCU products by providing a high-powered IDE, tools for hardware configuration, and links to helpful resources, all in one place.Once Simplicity Studio is installed, the application itself can be used to install additional software and documentation components to aid in the development and evaluation process.Figure 2.Simplicity StudioThe following Simplicity Studio components are required for the C8051F530 Development Kit:⏹ 8051 Products Part Support ⏹ Simplicity Developer PlatformDownload and install Simplicity Studio from /8bit-software or /simplicity-studio .Once installed, run Simplicity Studio by selecting Start →Silicon Labs →Simplicity Studio →Simplicity Studio from the start menu or clicking the Simplicity Studio shortcut on the desktop. Follow the instructions to install the software and click Simplicity IDE to launch the IDE.The first time the project creation wizard runs, the Setup Environment wizard will guide the user through the process of configuring the build tools and SDK selection.C8051F53x/52xIn the Part Selection step of the wizard, select from the list of installed parts only the parts to be used during development. Choosing parts and families in this step affects the displayed or filtered parts in the later device selection menus. Choose the C8051F53x/52x family by checking the C8051F53x/52x check box. Modify the part selection at any time by accessing the Part Management dialog from the Window →Preferences →Simplicity Studio →Part Management menu item.Simplicity Studio can detect if certain toolchains are not activated. If the Licensing Helper is displayed after completing the Setup Environment wizard, follow the instructions to activate the toolchain.4.1. Running BlinkyEach project has its own source files, target configuration, SDK configuration, and build configurations such as the Debug and Release build configurations. The IDE can be used to manage multiple projects in a collection called a workspace. Workspace settings are applied globally to all projects within the workspace. This can include settings,such as key bindings, window preferences, and code style and formatting options. Project actions, such as build and debug, are context-sensitive. For example, the user must select a project in the Project Explorer view in order to build that project.To create a project based on the Blinky example, perform the following steps:1. Click the Software Examples tile from the Simplicity Studio home screen.2. In the Kit drop-down, select C8051F530A Development Kit ; in the Part drop-down, select C8051F530, and in the SDK drop-down, select the desired SDK. Click Next .3. Select Example , and click Next .4. Under C8051F530A Development Kit , select F52x-53x Blinky ; click Next , and click Finish .5. Click on the project in the Project Explorer , and click Build (the hammer icon in the top bar). Alternatively, go to Project →Build Project .6. Click Debug to download the project to the hardware and start a debug session.7. Press the Resume button to start the code running. The LED should blink.8. Press the Suspendbutton to stop the code.9. Press the Reset the devicebutton to reset the target MCU.10. Press the Disconnectbutton to return to the development perspective.4.2. Simplicity Studio HelpSimplicity Studio includes detailed help information and device documentation within the tool. The help containsdescriptions for each dialog window. To view the documentation for a dialog, click the question mark icon in the window:This will open a pane specific to the dialog with additional details.The documentation within the tool can also be viewed by going to Help →Help Contents or Help →Search .C8051F53x/52x4.3. CP210x USB to UART VCP Driver InstallationThe Target Board includes a Silicon Labs CP210x USB-to-UART Bridge Controller. Device drivers for the CP210x need to be installed before the PC software can communicate with the MCU through the UART interface.1. After opening Simplicity Studio for the first time, a dialog will prompt to install the CP210x drivers. Click Yes . The drivers can also be installed at any time by going to Help →Install Drivers →CP210x VCP USB Drivers .2. Accept the license agreement and follow the steps to install the driver on the system. The installer will let you know when your system is up to date. The driver files included in this installation have been certified by Microsoft.3. To complete the installation process, connect the included USB cable between the host computer and the USB connector (P4) on the Target Board. Windows will automatically finish the driver installation. Information windows will pop up from the taskbar to show the installation progress.4. If necessary, the driver files can be uninstalled by selecting Windows Driver Package—Silicon Laboratories...option in the Programs and Features window.4.4. Configuration Wizard 2The Configuration Wizard 2 is a code generation tool for all of the Silicon Laboratories devices. Code is generated through the use of dialog boxes for each of the device's peripherals.Figure 3.Configuration Wizard 2 UtilityThe Configuration Wizard 2 utility helps accelerate development by automatically generating initialization source code to configure and enable the on-chip resources needed by most design projects. In just a few steps, the wizard creates complete startup code for a specific Silicon Laboratories MCU. The program is configurable to provide the output in C or assembly language. For more information, refer to the Configuration Wizard documentation.Documentation and software is available on the kit CD and from the downloads web page: /mcudownloads .C8051F53x/52x 5. Target BoardThe C8051F52xA-53xA Development Kit includes a target board with two C8051F530A devices preinstalled for evaluation and preliminary software development. Numerous input/output (I/O) connections are provided to facilitate prototyping using the target board. Refer to Figure4 for the locations of the various I/O connectors.Table 1. Target Board Part SummaryPart DescriptionP5 Power connector (Accepts input from 7 to 15VDC unregulated power adapter.)PWR Red Power-on LED (D3)TB1 LINconnectorU55V Voltage RegulatorA SideJ2 28-pin Expansion I/O connector for U2HDR2 Debug connector for Debug Adapter Interface(D2)P1.3_A GreenLEDbuttonReset_A ResetbuttonP1.4_A PushR32Potentiometer for P1.2_AJ6, J8Connects R32 (potentiometer) to U2 and +5 VJ13Connects power to U2J11, J12Connects external crystal to U2 pins P0.7_A and P1.0_AJ3 Connects analog channel 1 to U2 P1.6_AJ4 Connects analog channel 2 to U2 P1.7_AJ5 Connects VREFIN to U2 P0.0_AconnectorTB2 AnaloginputHDR4 Connector block for serial port connection, Green LED, and push-buttonU3Silicon Laboratories CP2102 USB-to-UART BridgeP1 USB connector to serial interface (CP2102)USB ACTIVE Red USB Active LED (D4) (CP2102)T2 LINtransceiverU2 C8051F530A “A” SideC8051F53x/52x5.1. Target Board Shorting Blocks: Factory DefaultsThe C8051F530A target board comes from the factory with preinstalled shorting blocks on many headers. Figure 4shows the positions of the factory default shorting blocks.B SideJ1 26-pin Expansion I/O connector for U1HDR1Debug connector for Debug Adapter InterfaceP1.3_B Green LED (D1)Reset_B Reset button P1.4_B Push button J14Connects power to U1J9, J10Connects external crystal to U1 pins P0.7_B and P1.0_B HDR3Green LED and push-button connector blockT1 LIN transceiver U1C8051F530A “B” SideTable 1. Target Board Part SummaryPart DescriptionP1.4_BPWRUSB ACTIVE P1.3_AP1.3_B D2D1D4Pin 1C8051F53x/52x5.2. System Clock SourcesThe C8051F530A device installed on the target board features a calibrated programmable internal oscillator that is enabled as the system clock source on reset. After reset, the internal oscillator operates at a frequency of 191.4kHz (±0.5%) by default but may be configured by software to operate at other frequencies. Therefore, in many applications, an external oscillator is not required. However, if you wish to operate the C8051F530A device at a frequency not available with the internal oscillator, an external crystal may be used. Refer to the C8051F52x/ 52xA/53x/53xA data sheet for more information on configuring the system clock source.The target board is designed to facilitate the installation of external crystals. Install the crystals at the pads marked Y1 or Y2. Install a 10M resistor at R17 or R22, and install capacitors at C29 and C30 or C34 and C35 using values appropriate for the crystals selected. Headers J9, J10, J11, and J12 connect the external crystal pins to the general purpose I/O headers (J1 and J2). If the external crystal is in use, these headers should not be populated. Refer to the C8051F52x/52xA/53x/53xA data sheet for more information on the use of external oscillators.5.3. Switches and LEDsFour switches are provided on the target board.Switch RESET_A is connected to the RESET pin of the C8051F530A A-Side (U2).Switch RESET_B is connected to the RESET pin of the C8051F530A B-Side (U1).Pressing RESET_A or RESET_B puts the attached device into its hardware-reset state.Switches P1.4_A and P1.4_B are connected to the C8051F530A parts (U1 and U2) general purpose I/O (GPIO) pins through headers. Pressing P1.4_A or P1.4_B generates a logic low signal on the port pin of the respective microcontroller.Remove the shorting block from the header to disconnect P1.4_A or P1.4_B from the port pins. The port pin signals are also routed to pins on the J1 and J2 I/O connectors. See Table2 for the port pins and headers corresponding to each switch.Four LEDs are also provided on the target board. The red LED labeled PWR is used to indicate a power connection to the target board. The green LEDs labeled D1 and D2 are connected to the C8051F530A's GPIO pins through headers. Remove the shorting blocks from the headers to disconnect the LEDs from the port pins. The port pin signals are also routed to pins on the J1 and J2 I/O connectors. The red LED labeled USB ACTIVE is used to indicate that the CP2102 USB-to-UART bridge is properly connected to a PC and is ready for communication. See Table2 for the port pins and headers corresponding to each LED.A potentiometer (R32) is provided on the target board. Header J8 connects the potentiometer to +5V, and header J6 connects the potentiometer to the P1.2_A pin of the U2 A-Side C8051F530A microcontroller.Table 2. Target Board I/O DescriptionsDescription I/O HeaderReset_A U2-Reset noneReset_B U1-Reset noneP1.4_A U2-P1.4HDR4[3–4]P1.4_B U1-P1.4HDR3[3–4]Green LED D2U2-P1.3HDR4[1–2]Green LED D1U1-P1.3HDR3[1–2]Red LED D3PWR noneRed LED D4USB ACTIVE nonePotentiometer R32U2-P1.2J6, J8C8051F53x/52x5.4. Expansion I/O Connectors (J1, J2)The two Expansion I/O connectors J1 (26pins) and J2 (28pins) provide access to all signal pins of the C8051F530A devices. Pins for V DD, GND, 5V, Reset, Vbat, LIN, 3.3V, and VREFIN are also available. A small through-hole prototyping area is also provided.All I/O signals routed to connectors J1 and J2 are also routed to through-hole connection points between J1 and J2 and the prototyping area (see Figure4). Each connection point is labeled indicating the signal available at the connection point. Table3 lists the pin descriptions for J1 and J2.Table 3. Pin Descriptions for J1 and J2J1J2Pin #Description Pin #Description Pin #Description Pin #Description 1P0.0_B14P1.5_B1P0.0_A15P1.6_A 2P0.1_B15P1.6_B2P0.1_A16P1.7_A 3P0.2_B16P1.7_B3P0.2_A17+5V4P0.3_B17+5V4P0.3_A18RST/C2CLK_A 5P0.4_B18RST/C2CLK_B5P0.4_A19VBAT 6P0.5_B19VBAT6P0.5_A20LIN7P0.6_B20LIN7P0.6_A21VREFIN 8P0.7_B21NC8P0.7_A22VREGOUT_A 9P1.0_B22VREGOUT_B9P1.0_A23+3.3V 10P1.1_B23NC10P1.1_A24NC11P1.2_B24NC11P1.2_A25NC12P1.3_B25GND12P1.3_A26NC13P1.4_B26GND13P1.4_A27GND14P1.5_A28GND5.5. Target Board DEBUG Interface (HDR1, HDR2)The DEBUG connectors (HDR1 and HDR2) provide access to the DEBUG (C2) pins of the C8051F530A parts. They are used to connect the USB Debug Adapter to the target board for in-circuit debugging and Flash programming. Table4 shows the DEBUG pin definitions.Table 4. DEBUG Connector Pin DescriptionsPin #Description1+3VD(+3.3VDC)2, 3, 9GND (Ground)4C2D5RST (Reset)6P0.67C2CK8Not Connected10USB PowerC8051F53x/52x5.6. USB to Serial Connector (P1, HDR4)A USB-to-Serial bridge interface is provided. A B-type USB connector (P1), a CP2102, and related circuits are provided to facilitate the serial connection between a PC and the U2 A-Side C8051F530A microcontroller on the target board. The RX, TX, CTS, and RTS signals of the UART side of the Bridge (CP2102) may be connected to the microcontroller by installing shorting blocks on HDR4 as shown in Table5.Table 5. UART ConnectionsHDR3Connection Signals5–6P0.4_A to TX_A7–8P0.5_A to RX_A9–10P1.1_A to RTS_A11–12P1.2_A to CTS_AThe BUS-Powered CP2102 uses the 5V provided by the USB interface.5.7. Analog I/O (TB2, J3, J4, J5)The Analog connector block (TB2) and headers J3, J4, and J5 provide Analog inputs to the C8051F530A (U2) as shown in Table6. Headers J3, J4, and J5 connect the inputs from the Analog connector to the microcontroller pins.Table 6. Analog I/O ConnectionsTB2Signal Connection I/O Shorting Block Vrefin External Reference Input or Internal Reference Output P0.0_A J5CH1Analog Input 1P1.6_A_MC J3CH2Analog Input 1P1.7_A_MC J4GND Ground GND—5.8. Power Supply Options (P5, TB1, J13, J14)The target board provides two options of power supply. The first option is to use the provided 9V power supply attached to the P5 connector. The second option is to use an external 12V (7.5V minimum) connected to the TB1 terminal block (pins 1 and 3).Headers J13 and J14 connect the +5V power supply to the VREGIN pins on U1 and U2. These headers can be populated to supply power directly or depopulated to measure the operating current drawn by the corresponding C8051F530A device.C8051F53x/52x5.9. LIN Connectivity (TB1)The C8051F530A Target Board has two C8051F530A devices (U1 and U2) and two LIN transceivers (T1 and T2) to provide LIN connectivity on the target board. These devices can also be interfaced to another LIN bus using the TB1 terminal block.Table 7. LIN ConnectionsTB1Signal Connection+12V Supplies 12V (7.5V minimum) to the target board. This can be connected to the power supply of another LIN bus or any external supply.LIN Connects the 12V LIN bus signal to the T1 and T2 LIN transceivers.GND GroundC8051F53x/52x6. SchematicsF i g u r e 5.C 8051F 530A T a r g e t B o a r d S c h e m a t i c (1 o f 3)C8051F53x/52xF i g u r e 6.C 8051F 530A T a r g e t B o a r d S c h e m a t i c (2 o f 3)C8051F53x/52xF i g u r e 7.C 8051F 530A T a r g e t B o a r d S c h e m a t i c (3 o f 3)C8051F53x/52xD OCUMENT C HANGE L IST Revision 0.2 to Revision 0.3⏹Updated for C8051F530A TB.⏹Added "LIN Connectivity (TB1)‚" on page 10. Revision 0.3 to Revision 0.4⏹Updated "Software Setup‚" on page 2.DisclaimerSilicon Laboratories intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Laboratories products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Laboratories reserves the right to make changes without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Silicon Laboratories shall have no liability for the consequences of use of the information supplied herein. This document does not imply or express copyright licenses granted hereunder to design or fabricate any integrated circuits. The products must not be used within any Life Support System without the specific written consent of Silicon Laboratories. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Laboratories products are generally not intended for military applications. Silicon Laboratories products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons.Trademark InformationSilicon Laboratories Inc., Silicon Laboratories, Silicon Labs, SiLabs and the Silicon Labs logo, CMEMS®, EFM, EFM32, EFR, Energy Micro, Energy Micro logo and combinations thereof, "the world’s most energy friendly microcontrollers", Ember®, EZLink®, EZMac®, EZRadio®, EZRadioPRO®, DSPLL®, ISOmodem ®, Precision32®, ProSLIC®, SiPHY®, USBXpress® and others are trademarks or registered trademarks of Silicon Laboratories Inc. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited. All other products or brand names mentioned herein are trademarks of their respective holders.Silicon Laboratories Inc.400 West Cesar Chavez Austin, TX 78701USAIoT Portfolio /IoTSW/HW/simplicityQuality/qualitySupport and Community。

I DContinuous Drain Current(A)70°Micro3Surface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPartNumberPD Max.PowerDissipation (W)N-ChannelLogic LevelIRLML2402*912570.54200.25 1.20.95230H1IRLML2803912580.54300.251.20.93230P-ChannelLogic LevelIRLML6302*912590.54-200.6-0.62-4.8230H1IRLML5103912600.54-300.6-0.61-4.8230* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-PakD -PakSOT-227Micro6SOT-223Micro82 Illustrations not to scaleI DContinuous Drain Current(A)70°Micro6Surface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPartNumberPD Max.PowerDissipation (W)N-ChannelLogic LevelIRLMS1902915401.7200.10 3.2 2.675H2IRLMS1503915081.7300.103.22.675P-ChannelLogic LevelIRLMS6702*914141.7-200.20-2.3-1.975H2IRLMS5703914131.7-300.20-2.3-1.975* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-PakD -PakSOT-227Micro6SOT-223Micro82 Illustrations not to scaleI DContinuous Drain Current(A)70°Micro8Surface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart NumberP D Max.PowerDissipation (W)N-Channel Logic LevelIRF7601* 912611.820 0.035 5.7 4.6 70 H3IRF7603 912621.830 0.035 5.6 4.5 70Dual N-Channel Logic LevelIRF7501* 912651.220 0.135 2.4 1.9 100 H3IRF7503 912661.2530 0.135 2.4 1.9 100P-Channel Logic LevelIRF7604* 912631.8-20 0.09 -3.6 -2.9 70 H3IRF7606 912641.8-30 0.09 -3.6 -2.9 70Dual P-Channel Logic LevelIRF7504* 912671.25-20 0.27 -1.7 -1.4 100 H3IRF7506 912681.25-30 0.27 -1.7 -1.4 100Dual N- and P-Channel Logic LevelIRF7507* 912691.2520 0.1352.4 1.9 100 H3-20 0.27 -1.7 -1.4IRF7509 912701.2530 0.135 2.4 1.9 100-30 0.27 -1.7 -1.4* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-Pak D -PakSOT-227Micro6SOT-223Micro8 2 Illustrations not to scaleI DContinuous Drain Current(A)70°SO-8Surface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)N-ChannelIRF7413913302.5300.011139.250H4IRF7413A 916132.5300.0135128.450IRF9410915622.5300.0375.850Dual N-ChannelIRF7311914352.0200.029 6.6 5.362.5H4IRF7313914802.0300.029 6.5 5.262.5IRF7333917002.0300.10 3.5 2.862.5917002.0300.050 4.9 3.962.5IRF9956915592.0300.103.52.862.5Dual P-ChannelIRF7314914352.0-200.058-5.3-4.362.5H4IRF7316915052.0-300.058-4.9-3.962.5IRF9953915602.0-300.25-2.3-1.862.5* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-PakD -PakSOT-227Micro6SOT-223Micro82 Illustrations not to scaleI DContinuous Drain Current(A)70°SO-8Surface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)RΘMax.ThermalResistance(°C/W)1FaxonDemand Number Case Outline KeyPart NumberP D Max.PowerDissipation (W)Dual N- and P-ChannelIRF7317 915682.020 0.029 6.6 5.3 62.5 H42.0-20 0.058 -5.3 -4.3 62.5IRF9952 915622.030 0.103.5 2.8 62.5915622.0-30 0.25 -2.3 -1.8 62.5IRF7319 916062.030 0.029 6.5 5.2 62.52.0-30 0.058 -4.9 -3.9 62.5* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-Pak D -PakSOT-227Micro6SOT-223Micro8 2 Illustrations not to scaleI DContinuous Drain Current(A)70°SO-8Surface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)N-ChannelLogic LevelIRF7401912442.5200.0228.77.050H4IRF7201911002.5300.0307.0 5.650IRF7403912452.5300.0228.55.450Dual N-ChannelLogic LevelIRF7101908712.0200.10 3.5 2.362.5H4IRF7301912382.0200.050 5.2 4.162.5IRF7303912392.0300.050 4.9 3.962.5IRF7103910952.0500.1303.02.362.5P-ChannelLogic LevelIRF7204911032.5-200.060-5.3-4.250H4IRF7404912462.5-200.040-6.7-5.450IRF7205911042.5-300.070-4.6-3.750IRF7406912472.5-300.045-5.8-3.750IRF7416913562.5-300.02-10-7.150* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-PakD -PakSOT-227Micro6SOT-223Micro82 Illustrations not to scaleI DContinuous Drain Current(A)70°SO-8Surface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)Dual P-ChannelLogic LevelIRF7104910962.0-200.250-2.3-1.862.5H4IRF7304912402.0-200.090-4.3-3.462.5IRF7306912412.0-300.10-3.6-2.962.5Dual N- and P-Channe Logic LevelIRF7307912421.4200.050 4.3 3.490H4-200.090-3.6-2.9IRF7105910972.0250.1093.5 2.862.52-250.25-2.3-1.862IRF7309912432.0300.050 4.9 3.962.5-300.10-3.6-2.9* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-PakD -PakSOT-227Micro6SOT-223Micro82 Illustrations not to scaleI DContinuous Drain Current(A)70°SOT-223Surface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)N-ChannelIRFL4105913812.1550.045 3.7 3.060H6IRFL110908612.01000.54 1.50.9660IRFL4310913682.11000.20 1.6 1.360IRFL21090868 2.02001.50.960.660IRFL214908622.02502.00.790.560P-ChannelIRFL9110908642.0-1001.2-1.1-0.6960H6N-ChannelLogic LevelIRLL3303913792.1300.031 4.6 3.760H6IRLL014N 914992.1550.14 2.0 1.660IRLL2705913802.1550.043.83.060* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-PakD -PakSOT-227Micro6SOT-223Micro82 Illustrations not to scaleI DContinuous Drain Current(A)100°D-PakSurface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)N-ChannelIRFR33039164257300.0313321 2.2H7IRFR024N9133638550.0751610 3.3IRFR41059130248550.0452516 2.7IRFR12059131869550.0273723 1.8IRFR11090524251000.54 4.3 2.75IRFR120N 91365391000.219.1 5.8 3.2IRFR391091364521000.11159.5 2.4IRFR2109052625200 1.5 2.6 1.75IRFR22090525422000.8 4.833IRFR21490703252502 2.2 1.45IRFR2249060042250 1.1 3.8 2.43IRFR3109059725400 3.6 1.7 1.15IRFR3209059842400 1.8 3.123IRFR42090599425003 2.4 1.53IRFRC2090637426004.421.33* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-PakD -PakSOT-227Micro6SOT-223Micro82 Illustrations not to scaleI DContinuous Drain Current(A)100°D-PakSurface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)P-ChannelIRFR55059161057-550.11-18-11 2.2H7IRFR53059140289-550.065-28-18 1.4IRFR90149065425-600.5-5.1-3.25IRFR90249065542-600.28-8.8-5.63IRFR91109051925-100 1.2-3.1-25IRFR91209052042-1000.6-5.6-3.63IRFR9120N 9150739-1000.48-6.5-4.1 3.2IRFR92109052125-2003-1.9-1.25IRFR92209052242-200 1.5-3.6-2.33IRFR92149165850-250 3.0-2.7-1.7 2.5IRFR93109166350-4007.0-1.8-1.12.5* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-PakD -PakSOT-227Micro6SOT-223Micro82 Illustrations not to scaleI DContinuous Drain Current(A)100°D-PakSurface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)N-ChannelLogic LevelIRLR27039133538300.0452214 3.3H7IRLR33039131657300.0313321 2.2IRLR31039133369300.0194629 1.8IRLR024N 9136338550.0651711 3.3IRLR27059131746550.042415 2.7IRLR29059133469550.0273623 1.8IRLR120N 91541391000.18511 6.9 3.2IRLR341091607521000.10159.52.4* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-PakD -PakSOT-227Micro6SOT-223Micro82 Illustrations not to scaleI DContinuous Drain Current(A)100°D 2PakSurface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart NumberP D Max.PowerDissipation (W)N-ChannelIRFZ24NS 913554555 0.07 17 12 3.3 H10IRFZ34NS 913116855 0.04 29 20 2.2IRFZ44NS 9131511055 0.022 49 35 1.4IRFZ46NS 9130512055 0.020 53 37 1.3IRFZ48NS 9140814055 0.016 64 45 1.1IRF1010NS 913723.855 0.011 84 60 40IRF3205S 9130420055 0.008 110 80 0.75IRFZ44ES 9171411060 0.023 48 34 1.4IRF1010ES 9172017060 0.012 83 59 0.90IRF2807S 9151815075 0.013 71 50 1.0IRF520NS 9134047100 0.2 9.5 6.7 3.2IRF530NS 9135263100 0.11 15 11 2.4IRF540NS 91342110100 0.052 27 19 1.6IRF1310NS 91514120100 0.036 36 25 1.3IRF3710S 91310150100 0.028 46 33 1.0IRF3315S 9161794150 0.082 21 15 1.6IRF3415S 91509150150 0.042 37 26 1.0IRFBC20S 9.101450600 4.4 2.2 1.4 2.5IRFBC30S 9101574600 2.2 3.6 2.3 1.7IRFBC40S 91016130600 1.2 6.2 3.9 1.0* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-Pak D -PakSOT-227Micro6SOT-223Micro8 2 Illustrations not to scaleI DContinuous Drain Current(A)100°D 2PakSurface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemandNumberCase Outline KeyPart NumberP D Max.PowerDissipation (W)IRFBF20S 9166554900 8.0 1.7 1.1 2.3 H10P-ChannelIRF5305S 91386110-55 0.06 -31 -22 1.4 H10IRF4905S 914783.8-55 0.02 -74 -52 40IRF9520NS 9152247-100 0.48 -6.7 -4.8 3.2IRF9530NS 9152375-100 0.20 -14 -9.9 2.0IRF9540NS 9148394-100 0.117 -19 -13 1.6IRF5210S 91405150-100 0.06 -35 -25 1.0* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-Pak D -PakSOT-227Micro6SOT-223Micro8 2 Illustrations not to scaleI DContinuous Drain Current(A)100°D 2PakSurface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart NumberP D Max.PowerDissipation (W)N-Channel Logic LevelIRL3302S 916925720 0.020 39 25 2.2 H10IRL3202S916756920 0.016 48 30 1.8IRL3102S 916918920 0.013 61 39 1.4IRL3402S 9169311020 0.01 85 54 1.1IRL3502S 9167614020 0.007 110 67 0.89IRL2703S 913604530 0.04 24 17 3.3IRL3303S 913236830 0.026 38 27 2.2IRL3103S 9133811030 0.014 64 45 1.4IRL2203NS 9136717030 0.007 116 82 0.90IRL3803S 9131920030 0.006 140 98 0.75IRLZ24NS 913584555 0.06 18 13 3.3IRLZ34NS 913086855 0.035 30 21 2.2IRLZ44NS 9134711055 0.022 47 33 1.4IRL3705NS 9150217055 0.01 89 63 0.90IRL2505S 9132620055 0.008 104 74 0.75IRLZ44S 9090615060 0.028 50 36 1.0IRL530NS 9134963100 0.1 15 11 2.4IRL2910S 91376150100 0.026 48 34 1.0* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-Pak D -PakSOT-227Micro6SOT-223Micro8 2 Illustrations not to scaleI DContinuous Drain Current(A)100°SOT-227Surface Mount PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous DrainCurrent 25°C(A)RΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)N-ChannelFully Isolated Low ChargeFA38SA50LC 916155005000.1338240.25H21FA57SA50LC916506255000.0857360.20* Indicates low VGS(th), which can operate at VGS = 2.7VMeasured at ambient for Micro3, Micro6, Micro8, SO-8, and SOT-223 package styles. All others measured at case.1Micro3SO-8D-PakD -PakSOT-227Micro6SOT-223Micro82 Illustrations not to scaleI DContinuous Drain Current(A)100°I-PakThrough-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)N-ChannelIRFU33039164257300.0313321 2.2H8IRFU024N 9133638550.0751610 3.3IRFU41059130248550.0452519 2.7IRFU12059131869550.0273723 1.8IRFU11090524251000.54 4.3 2.7 5.0IRFU120N 91365391000.219.1 5.8 3.2IRFU391091364521000.11159.5 2.4IRFU2109052625200 1.5 2.6 1.7 5.0IRFU22090525422000.80 4.8 3.0 3.0IRFU2149070325250 2.0 2.2 1.4 5.0IRFU2249060042250 1.1 3.8 2.4 3.0IRFU3109059725400 3.6 1.7 1.1 5.0IRFU3209059842400 1.8 3.1 2.0 3.0IRFU4209059942500 3.0 2.4 1.5 3.0IRFUC2090637426004.42.01.33.0I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not ratedI DContinuous Drain Current(A)100°I-PakThrough-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)P-ChannelIRFU55059161057-550.11-18-11 2.2H8IRFU53059140289-550.065-28-18 1.4IRFU90149065425-600.50-5.1-3.2 5.0IRFU90249065542-600.28-8.8-5.6 3.0IRFU91109051925-100 1.2-3.1-2.0 5.0IRFU91209052042-1000.60-5.6-3.6 3.0IRFU9120N 9150739-1000.48-6.5-4.1 3.2IRFU92109052125-200 3.0-1.9-1.2 5.0IRFU92209052242-200 1.5-3.6-2.3 3.0IRFU92149165850-2503.0-2.7-1.7 2.5IRFU93109166350-4007.0-1.8-1.12.5N-ChannelLogic LevelIRLU27039133538300.0452214 3.3H8IRLU33039131657300.0313321 2.2IRLU31039133369300.0194629 1.8IRLU024N 9136338550.0651711 3.3IRLU27059131746550.04241715IRLU29059133469550.0273623 1.8IRLU120N 91541391000.18511 6.9 3.2IRLU341091607521000.10159.52.4I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not ratedI DContinuous Drain Current(A)100°HEXDIPThrough-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)N-ChannelIRFD014907001.3600.2 1.7 1.2120H9IRFD024906991.3600.1 2.5 1.8120IRFD110903281.31000.54 1.00.71120IRFD120903851.31000.27 1.30.94120IRFD210903861.3200 1.50.60.38120IRFD220904171.32000.80.80.50120IRFD214912711.3250 2.00.570.32120IRFD224912721.3250 1.10.760.43120IRFD310912251.3400 3.60.420.23120IRFD320912261.3400 1.80.600.33120IRFD420912271.3500 3.00.460.26120IRFDC20912281.36004.40.320.21120I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not ratedI D Continuous Drain Current (A)100°TO-220Qg TotalGate Charge(nC)Through-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C (A)R ΘMax.Thermal Resistance(°C/W)1Faxon Demand Number Case OutlineKeyPart Number P D Max.Power Dissipation (W)N-ChannelLow ChargeIRF737LC91314743000.75 6.1** 1.7 3.9H11IRF740LC 910681254000.5510** 1.039IRF840LC 910691255000.858.0** 1.039IRFBC40LC910701256001.26.2**1.039I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not ratedI DContinuous Drain Current(A)100°TO-220ABThrough-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)N-ChannelIRFZ24N 9135445550.071712 3.3H12IRFZ34N9127656550.042618 2.7IRFZ44N 9130383550.0244129 1.8IRFZ46N 9127788550.024633 1.7IRFZ48N 9140694550.0165337 1.6IRF1010N 91278130550.0127251 1.2IRF320591279150550.0089869 1.0IRFZ34E 9167268600.0422820 2.2IRFZ44E 91671110600.0234834 1.4IRF1010E 91670170600.01281570.90IRF280791517150750.0137150 1.0IRF520N 91339471000.209.5 6.79.5IRF530N 91351601000.111511 2.4IRF540N 91341941000.0522719 1.6IRF1310N 916111201000.0363625 1.3IRF3710913091501000.0284633 1.0IRF331591623941500.0822115 1.6IRF3415914771501500.0423726 1.0IRFBC209062350600 4.4 2.2 1.4 2.5IRFBC309048274600 2.2 3.6 2.3 1.7IRFBC4090506125600 1.2 6.2 3.9 1.0IRFBE2090610548006.51.81.22.3I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not ratedI DContinuous Drain Current(A)100°TO-220ABThrough-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)IRFBE3090613125800 3.0 4.1 2.6 2.0H12IRFBF3090616125900 3.7 3.6 2.3 1.0IRFBG209060454100011 1.40.86 2.3IRFBG309062012510005.03.12.01.0P-ChannelIRF9Z24N 9148445-550.175-12-8.53.3H12IRF9Z34N 9148556-550.10-17-12 2.7IRF530591385110-550.06-31-22 1.4IRF490591280150-550.02-64-45 1.0IRF9530N 9148275-1000.20-13-9.2 2.0IRF9540N 9143794-1000.117-19-13 1.6IRF521091434150-1000.06-35-25 1.0IRF62159147983-1500.29-11-7.81.8I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not ratedI DContinuous Drain Current(A)100°TO-220ABThrough-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart NumberP D Max.PowerDissipation (W)N-Channel Logic LevelIRL3302 916965720 0.020 39 25 2.2 H12IRL3202 916956920 0.016 48 30 1.8IRL3102 916948920 0.013 61 39 1.4IRL3402 9169711020 0.01 85 54 1.1IRL3502 9169814020 0.007 110 67 0.89IRL2703 913594530 0.04 24 17 3.3IRL3303 913225630 0.026 34 24 2.7IRL3103 913378330 0.014 56 40 1.8IRL2203N 9136613030 0.007 100 71 1.230 0.007 61 43 3.2IRL3803 9130115030 0.006 120 83 1.0IRLZ24N 913574555 0.06 18 13 3.3IRLZ34N 913075655 0.035 27 19 2.7IRLZ44N 913468355 0.022 41 29 1.8IRL3705N 9137013055 0.01 77 54 1.2IRL2505 9132520055 0.008 104 74 0.75IRL520N 9149447100 0.18 10 7.1 3.2IRL530N 9134863100 0.10 15 11 2.4IRL540N 9149594100 0.044 30 21 1.6IRL2910 91375150100 0.026 48 34 1.0I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not ratedI D Continuous Drain Current (A)100°TO-220 FullPak (Fully Isolated)Qg TotalGate Charge(nC)Through-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous DrainCurrent 25°C(A)R ΘMax.Thermal Resistance (°C/W)1Fax on Demand Number Case OutlineKeyPart Number P D Max.Power Dissipation (W)N-ChannelLow ChargeIRFI740GLC91209404000.55 6.0** 3.139H13IRFI840GLC 91208405000.85 4.8** 3.139IRFIBC40GLC91211406001.24.0**3.139I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not ratedI DContinuous Drain Current(A)100°TO-220 FullPak (Fully Isolated)Through-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)N-ChannelIRFIZ24N 9150126550.07139.2 5.8H14IRFIZ34N9148931550.041913 4.8IRFIZ44N 9140338550.02428200.024IRFIZ46N 9130640550.023122 3.8IRFIZ48N 9140742550.0163625 3.6IRFI1010N 9137347550.0124431 3.2IRFI32059137448550.0085640 3.1IRFIZ24E 9167329600.071149.6 5.2IRFIZ34E 9167437600.0422115 4.1IRFI510G 90829271000.54 4.5 3.2 5.5IRFI520N 91362271000.207.2 5.1 5.5IRFI530N 91353331000.11117.8 4.5IRFI540N 91361421000.0521813 3.6IRFI1310N 91611451000.0362216 3.3IRFI371091387481000.0252820 3.1IRFI620G 90832302000.8 4.1 2.6 4.1IRFI630G 90652322000.4 5.9 3.7 3.6IRFI640G 90649402000.189.8 6.2 3.1IRFI614G 9083123250 2.0 2.1 1.3 5.5IRFI624G 9083330250 1.1 3.4 2.2 4.1IRFI634G 90738322500.45 5.6 3.5 3.6IRFI644G 90739402500.287.953.1I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not ratedI DContinuous Drain Current(A)100°TO-220 FullPak (Fully Isolated)Through-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)IRFI720G 9083430400 1.8 2.6 1.7 4.1H14IRFI730G 9065032400 1.0 3.7 2.3 3.6IRFI740G 90651404000.55 5.4 3.4 3.1IRFI734G 9100135450 1.2 3.4 2.1 3.6IRFI744G 91002404500.63 4.9 3.1 3.1IRFI820G 9064130500 3.0 2.1 1.3 4.1IRFI830G 9064632500 1.5 3.12 3.6IRFI840G 90642405000.85 4.6 2.9 3.1IRFIBC20G 90850306004.41.71.1 4.1IRFIBC30G 90851356002.2 2.5 1.63.6IRFIBC40G 9085240600 1.2 3.5 2.2 3.1IRFIBE20G 9085330800 6.5 1.4.86 4.1IRFIBE30G 9085435800 3.0 2.1 1.4 3.6IRFIBF20G 90855309008.0 1.2.79 4.1IRFIBF30G90856359003.71.91.23.6P-ChannelIRFI9Z24N 9152929-550.175-9.5-6.7 5.2H14IRFI9Z34N 9153037-550.10-14-10 4.1IRFI49059152663-550.02-41-29 2.4IRFI9540G 9083742-1000.117-13-9.2 3.6IRFI9540N 9148742-1000.117-13-9.2 3.6IRFI52109140448-1000.06-20-14 3.1IRFI9634G 9148835-2501.0-4.1-2.63.6I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not ratedI DContinuous Drain Current(A)100°TO-220 FullPak (Fully Isolated)Through-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C(A)R ΘMax.Thermal Resistance (°C/W)1FaxonDemand Number Case Outline KeyPart Number P D Max.PowerDissipation (W)N-ChannelLogic LevelIRLI2203N 9137847300.0076143 3.2H14IRLI38039132048300.0066747 3.1IRLIZ24N 9134426550.06149.9 5.8IRLIZ34N 9132931550.0352014 4.8IRLIZ44N 9149838550.0222820 4.0IRLI3705N 9136947550.014733 3.2IRLI25059132763550.00858412.4IRLI520N 91496271000.187.7 5.4 5.5IRLI530N 91350331000.10117.8 4.5IRLI540N 91497421000.04420143.6IRLI291091384481000.02627193.1P-ChannelLogic LevelIRFI9520G 9083537-1000.6-5.2-3.6 4.1H14IRFI9530G 9083638-1000.03-7.7-5.4 3.6IRFI9620G 9087430-200 1.5-3.0-1.9 4.1IRFI9630G 9083840-2000.8-4.3-2.7 3.6IRFI9640G9083940-2000.5-6.1-3.93.1I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not ratedI D Continuous Drain Current (A)100°TO-247Qg TotalGate Charge(nC)Through-Hole PackagesV (BR)DSSDrain-to-Source Breakdown Voltage (V)R DS(on)On-State Resistance ()ΩI D Continuous Drain Current 25°C (A)R ΘMax.Thermal Resistance (°C/W)1Fax on Demand Number Case OutlineKeyPart Number P D Max.Power Dissipation (W)1N-ChannelLow ChargeIRFP350LC912291904000.3018**0.6570H16IRFP360LC 912302804000.2023**0.4598IRFP450LC 912311905000.4016**0.6570IRFP460LC 912322805000.2720**0.4598IRFPC50LC 912331906000.6013**0.6570IRFPC60LC912342806000.4016**0.4598I-PakTO-220 FullPakTO-262TO-247HEXDIPTO-220AB Illustrations not to scale** Not rated。

Eaton 259622Eaton Moeller series NZM - Molded Case Circuit Breaker. Undervoltage release, 208-240VAC, +2early N/O, 1, 20LEaton Moeller series NZM release 25962237 mm 66 mm 32 mm 0.169 kg Eaton Selling Policy 25-000, one (1) year from the date of installation of the Product or eighteen (18) months from the date of shipment of the Product, whichever occurs first.UL/CSA IECRoHS conformUL (File No. E140305) IEC60947CSA (File No. 22086)UL (Category Control Number DIHS) CSA certified UL listedCSA (Class No. 1437-01) CSA-C22.2 No. 5-09 UL489 CE markingNZM1-XUHIV20L208-240ACProduct NameCatalog Number Product Length/Depth Product Height Product Width Product Weight WarrantyCompliancesCertificationsModel CodeIs the panel builder's responsibility. The specifications for the switchgear must be observed.208 VMeets the product standard's requirements.10 msIs the panel builder's responsibility. The specifications for the switchgear must be observed.Does not apply, since the entire switchgear needs to be evaluated.1.5 VAMeets the product standard's requirements.0 VTwo separate early-make auxiliary contacts0.8 W240 VIs the panel builder's responsibility.15 ms M1-XUHIV20L208-240AC IL01203002ZProduct Data Sheet - 25962210.11 Short-circuit ratingRated control supply voltage (Us) at AC, 50 Hz - min 10.4 Clearances and creepage distancesMinimum command time - min10.12 Electromagnetic compatibility10.2.5 LiftingPick-up power consumption at AC (undervoltage release) 10.2.3.1 Verification of thermal stability of enclosures Rated control supply voltage (Us) at DC - minFitted with:Pick-up power consumption at DC (undervoltage release) Rated control supply voltage (Us) at AC, 50 Hz - max 10.8 Connections for external conductorsMinimum command time - maxSpecial features eCAD model Installeringsinstruksjoner Specifications and datasheetsUndervoltage release with 2 early-make auxiliary contacts, e.g., for early-make connection ofundervoltage release inmain switch applications, aswell as for interlock and loadshedding circuits.For use with emergency-stop devices in connectionwith an emergency-stopbutton.When the under-voltage tripis switched off, accidentalcontact with the circuitbreaker’s primary contacts isprevented when switchedon.Early make of auxiliarycontacts on switching onand off (manual operation):approx. 20 msCannot be used inconjunction with NZM...-XR... remote operator.Undervoltage releasescannot be installedsimultaneously with NZM...-XHIV... early-make auxiliarycontact or NZM...-XA...shunt release.Rated control supply voltage (Us) at DC - max0 V10.9.3 Impulse withstand voltageIs the panel builder's responsibility.Rated control supply voltage208 - 240 V 50/60 Hz10.6 Incorporation of switching devices and components Does not apply, since the entire switchgear needs to be evaluated.10.5 Protection against electric shockDoes not apply, since the entire switchgear needs to be evaluated.Used withNZM1(-4), N(S)1(-4)Electric connection typeScrew connection10.13 Mechanical functionThe device meets the requirements, provided the information in the instruction leaflet (IL) is observed.10.2.6 Mechanical impactDoes not apply, since the entire switchgear needs to be evaluated.10.9.4 Testing of enclosures made of insulating materialIs the panel builder's responsibility.Number of contacts (normally closed contacts)10.3 Degree of protection of assembliesDoes not apply, since the entire switchgear needs to be evaluated.Voltage typeACDrop-out voltage of undervoltage release AC/DC - min0.35 x UsFrameNZM1Reaction time19 msSuitable forOff-load switchVoltage tolerance - min.85Rated control voltage (relay contacts)208 V AC240 V ACPower consumption0.8 W (sealing DC)1.5 VA (sealing AC)10.2.3.2 Verification of resistance of insulating materials to normal heatMeets the product standard's requirements.Drop-out voltage of undervoltage release AC/DC - max0.7 x Us10.2.3.3 Resist. of insul. mat. to abnormal heat/fire by internal elect. effectsMeets the product standard's requirements.Connection typeWith 3 m connection cable instead of screw termination10.9.2 Power-frequency electric strengthIs the panel builder's responsibility.Voltage tolerance - max1.1Undelayed short-circuit release - min0 ARated control supply voltage (Us) at AC, 60 Hz - min208 V10.7 Internal electrical circuits and connectionsIs the panel builder's responsibility.Terminal capacity (solid/flexible conductor)0.75 mm² - 2.5 mm² (2x) at shunt release with ferrule18 - 14 AWG (1x) at shunt release18 - 14 AWG (2x) at shunt release0.75 mm² - 2.5 mm² (1x) at shunt release with ferrule0.75 mm² - 2.5 mm² (1x) for undervoltage releases, off-delayed with ferrule18 - 14 AWG (2x) for undervoltage releases, off-delayed0.75 mm² - 2.5 mm² (2x) for undervoltage releases, off-delayed with ferrule18 - 14 AWG (1x) for undervoltage releases, off-delayed10.10 Temperature riseThe panel builder is responsible for the temperature rise calculation. Eaton will provide heat dissipation data for the devices.TypeAccessoryUndervoltage release withearly-make auxiliary contact10.2.2 Corrosion resistanceMeets the product standard's requirements.10.2.4 Resistance to ultra-violet (UV) radiationMeets the product standard's requirements.10.2.7 InscriptionsMeets the product standard's requirements.Rated control supply voltage (Us) at AC, 60 Hz - max240 VEaton Corporation plc Eaton House30 Pembroke Road Dublin 4, Ireland © 2023 Eaton. Med enerett.Eaton is a registered trademark.All other trademarks are property of their respectiveowners./socialmedia20 ANumber of contacts (normally open contacts)Undelayed short-circuit release - max Number of contacts (change-over contacts)。