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1Features•7.4SPECint95,6.1SPECfp95at 300MHz (estimated)•Superscalar (3instructions per clock peak)•Dual 16KB Caches •Selectable Bus Clock•32-bit Compatibility PowerPC Implementation •On-chip Debug Support•P D typical =3.5Watts (266MHz),Full Operating Conditions •Nap,Doze and Sleep Modes for Power Savings •Branch Folding•64-bit Data Bus (32-bit Data Bus Option)•4-Gbytes Direct Addressing Range•Pipelined Single/Double Precision Float Unit •IEEE 754Compatible FPU•IEEE P 1149-1Test Mode (JTAG/C0P)•f INT max =300MHz •f BUS max =75MHz•Compatible CMOS Input/TTL OutputScreening/Quality/PackagingThis product is manufactured in full compliance with:•CI-CGA 255:MIL-STD-883class Q or According to A TMEL-Grenoble standards •CBGA 255:Upscreenings based upon A TMEL-Grenoble standards •Full Military Temperature Range (T c =-55°C,T c =+125°C)IndustriaL Temperature Range (T c =-40°C,T c =+110°C)•Internal/IO Power Supply =2.5±5%//3.3V ±5%•255-lead CBGA Package and 255-lead CBGA with SCI (CI-CGA)PackageDescriptionThe PID7t-603e implementation of PowerPC 603e (after named 603r)is a low-power implementation of reduced instruction set computer (RISC)microprocessors Pow-erPC äfamily.The 603r implements 32-bit effective addresses,integer data types of 8,16and 32bits,and floating-point data types of 32and 64bits.The 603r is a low-power 2.5/3.3-volt design and provides four software controllable power-saving modes.The 603r is a superscalar processor capable of issuing and retiring as many as three instructions per clock.Instructions can execute out of order for increased perfor-mance;however,the 603r makes completion appear sequential.The 603r integrates five execution units and is able to execute five instructions in parallel.The 603r provides independent on-chip,16-Kbyte,four-way set-associative,physically addressed caches for instructions and data and on-chip instruction and data Memory Management Units (MMUs).The MMUs contain 64-entry,two-way set-associative,data and instruction translation look aside buffers that provide support for demand-paged virtual memory address translation and variable-sized block translation.The 603r has a selectable 32-or 64-bit data bus and a 32-bit address bus.The 603r interface protocol allows multiple masters to complete for system resources through a central external arbiter.The 603r supports single-beat and burst data transfers for memory accesses,and supports memory-mapped I/O.2TSPC603R2125A–HIREL–04/02The 603r uses an advanced,2.5/3.3V CMOS process technology and maintains full interface compatibility with TTL devices.The 603r integrates in-system testability and debugging features through JTAG boundary-scan capability.General DescriptionFigure 1.BlockDiagram3TSPC603R2125A –HIREL –04/02IntroductionThe 603r is a low-power implementation of the PowerPC microprocessor family of reduced instruction set computer (RISC)microprocessors.The 603r implements the 32-bit portion of the PowerPC architecture,which provides 32-bit effective addresses,integer data types of 8,16and 32bits,and floating-point data types of 32and 64bits.For 64-bit PowerPC microprocessors,the PowerPC architecture provides 64-bit integer data types,64-bit addressing,and other features required to complete the 64-bit architecture.The 603r provides four software controllable power-saving modes.Three of the modes (the nap,doze,and sleep modes)are static in nature,and progressively reduce the amount of power dissipated by the processor.The fourth is a dynamic power manage-ment mode that causes the functional units in the 603r to automatically enter a low-power mode when the functional units are idle without affecting operational perfor-mance,software execution,or any external hardware.The 603r is a superscalar processor capable of issuing and retiring as many as three instructions per clock.Instructions can execute out of order for increased performance;however,the 603r makes completion appear sequential.The 603e integrates five execution units —an integer unit (IU),a floating-point unit (FPU),a branch processing unit (BPU),a load/store unit (LSU)and a system register unit (SRU).The ability to execute five instructions in parallel and the use of simple instructions with rapid execution times yield high efficiency and throughput for 603r-based systems.Most integer instructions execute in one clock cycle.The FPU is pipelined so a single-precision multiply-add instruction can be issued every clock cycle.The 603r provides independent on-chip,16-Kbyte,four-way set-associative,physically addressed caches for instructions and data and on-chip instruction and data memory management units (MMUs).The MMUs contain 64-entry,two-way set-associative,data and instruction translation look aside buffers (DTLB and ITLB)that provide support for demand-paged virtual memory address translation and variable-sized block translation.The TLBs and caches use a least recently used (LRU)replacement algorithm.The 603r also supports block address translation through the use of two independent instruction and data block address translation (IBAT and DBAT)arrays of four entries each.Effec-tive addresses are compared simultaneously with all four entries in the BAT array during block translation.In accordance with the PowerPC architecture,if an effective address hits in both the TLB and BAT array,the BAT translation takes priority.The 603r has a selectable 32-or 64-bit data bus and a 32-bit address bus.The 603r interface protocol allows multiple masters to compete for system resources through a central external arbiter.The 603r provides a three-state coherency protocol that sup-ports the exclusive,modified,and invalid cache states.This protocol as a compatible subset of the MESI (modified/exclusive/shared/invalid)four-state protocol and operates coherently in systems that contain four-state caches.The 603r supports single-beat and burst data transfers for memory accesses,and supports memory-mapped I/O.The 603r uses an advanced,0.29µm 5metal layer CMOS process technology and maintains full interface compatibility with TTL devices.4TSPC603R2125A –HIREL –04/02Pin AssignmentsCBGA 255and CI-CGA 255PackagesFigure 2(pin matrix)shows the pinout as viewed from the top of the CBGA and CI-CGA packages.The direction of the top surface view is shown by the side profile of the packages.Figure 2.CBGA 255and CI –CGA 255Top View5TSPC603R2125A –HIREL –04/02Pinout ListingDDDD Table 1.Power and Ground Pins6TSPC603R2125A –HIREL –04/02DD 2.NC (no-connect)in the 603e BGA package;internally tied to GND in the 603r BGA package to indicate to the power supplythat a low-voltage processor is present.Signal DescriptionFigure 3,Table 3and Table 4describe the signals on the TSPC603r and indicate signal functions.The test signals,TRST,TMS,TCK,TDI and TDO,comply with subset P-1149.1of the IEEE testability bus standard.The 3signals LSSD_MODE,LI_TSTCLK and L2_TSTCLK are test signals for factory use only and must be pulled up to V DD for normal machine operations.Table 2.Signal Pinout Listing7TSPC603R2125A –HIREL –04/02Figure 3.Functional Signal GroupsTable 3.Address and Data Bus Signal Index8TSPC603R2125A –HIREL –04/02Table 4.Signal Index9TSPC603R2125A –HIREL –04/02Table 4.Signal Index (Continued)10TSPC603R2125A –HIREL –04/02DetailedSpecificationsScopeThis drawing describes the specific requirements for the microprocessor TSPC603r,in compliance with MIL-STD-883class B or ATMEL-Grenoble standard screening.Applicable Documents -STD-883:T est methods and procedures for -PRF-38535:General specifications for microcircuits.Requirements GeneralThe microcircuits are in accordance with the applicable documents and as specified herein.Design and Construction•Terminal connectionsThe terminal connections shall be as shown in Figure 15and Figure 3.•Lead material and finishLead material and finish shall be as specified in MIL-STD-1835.Absolute Maximum RatingsAbsolute maximum ratings are stress rating only and functional operation at the maxi-mum is not guaranteed.Stresses beyond those listed may affect device reliability or cause permanent damage to the device.Notes:1.Functional operating conditions are given in AC and DC electrical specifications.Stresses beyond the absolute maximumslisted may affect device reliability or cause permanent damage to the device.2.Caution :Input voltage must not be greater than OV DD by more than 2.5V at any times,including during power-on reset.3.Caution :OV DD voltage must not be greater than V DD /AV DD by more than 1.2V at any times,including during power-on reset.4.Caution :V DD /AV DD voltage must not be greater than OV DD by more than 0.4V at any times,including during power-on reset.(1)(2)(3)(4)TSPC603RRecommended Operating Conditions These are the recommended and tested operating conditions.Proper device operation outside of these conditions is not guaranteed.Thermal Characteristics The data found in this section concerns603r’s packaged in the255-lead21mmmulti-layer ceramic(MLC),ceramic BGA package.Data is shown for the case of usingthe Thermalloy#2328B heat sink.The internal thermal resistance for this package is negligible due to the exposed diedesign.A thermal interface material is recommended at the package lid-to-heat sinkinterface to minimize the thermal contact resistance.Additionally,the CBGA package offers an excellent thermal connection to the card andpower planes.Heat generated at the chip is dissipated through the package,the heatsink(when used)and the card.The parallel heat flow paths result in the lowest overallthermal resistance as well as offer significantly better power dissipation capability if aheat sink is not used.The thermal characteristics for the flip-chip CBGA and CI-CGA packages are as follows:Thermal resistance(junction-to-case)=R jc orθjc=0.095°C/Watt for the2packages.Thermal resistance(junction-to-ball)=R jb orθjb=3.5°C/Watt for the CBGA package.Thermal resistance(junction-to-bottom SCI)=R js orθjs=3.7°C/Watt for the CI-CGA package.The junction temperature can be calculated from the junction to ambient thermal resis-tance,as follow:Junction temperature:T j=T a+(R jc+R cs+R sa)*PWhere:T a is the ambient temperature in the vicinityof the deviceR jc is the die junction-to-case thermalresistance of the deviceR cs is the case-to-heat sink thermalresistance of the interface materialR sa is the heat sink-to-ambientthermal resistanceP is the power dissipated by the deviceDuring operation,the die-junction temperatures(T j)should be maintained less than thevalue specified in Table6.The thermal resistance of the thermal interface material(R cs)is typically about1°C/Watt.Assuming a T a of85°C and a consumption(P)of3.6Watts,the junction temperature ofthe device would be as follow:T j=85°C+(0.095°C/Watt+1°C/Watt+R sa)*3.5Watts.For the Thermalloy heat sink#2328B,the heat sink-to-ambient thermal resistance(R sa)versus airflow velocity is shown in Figure4.Figure4.CBGA Thermal Management ExampleAssuming an air velocity of1.0m/sec,the associated overall thermal resistance andjunction temperature,found in Table7will result.Table7.Thermal Resistance and Junction TemperatureVendors such as Aavid Engineering Inc.,Thermalloy,and Wakefield Engineering cansupply heat sinks with a wide range of thermal performance.Power Consideration The PowerPC603r is a microprocessor specifically designed for low-power operation.As the603e microprocessor version,the603r provides both automatic and pro-gram-controllable power reduction modes for progressive reduction of powerconsumption.This chapter describes the hardware support provided by the603r forpower management.Dynamic Power Management Dynamic power management automatically powers up and down the individual execu-tion units of the603r,based upon the contents of the instruction stream.For example,ifno floating-point instructions are being executed,the floating-point unit is automaticallypowered down.Power is not actually removed from the execution unit;instead,eachexecution unit has an independent clock input,which is automatically controlled on aclock-by-clock basis.Since CMOS circuits consume negligible power when they are notswitching,stopping the clock to an execution unit effectively eliminates its power con-sumption.The operation of DPM is completely transparent to software or any externalhardware.Dynamic power management is enabled by setting bit11in HID0onpower-up,of following HRESET.TSPC603R Programmable Power Modes The603r provides four programmable power states—full power,doze,nap and sleep.Software selects these modes by setting one(and only one)of the three power savingmode bits.Hardware can enable a power management state through external asynchro-nous interrupts The hardware interrupt causes the transfer of program flow to interrupthandler code.The appropriate mode is then set by the software.The603r provides aseparate interrupt and interrupt vector for power management—the system manage-ment interrupt(SMI).The603r also contains a decrement timer which allows it to enterthe nap or doze mode for a predetermined amount of time and then return to full poweroperation through the decrementer interrupt(DI).Note that the603r cannot switch fromon power management mode to another without first returning to full on mode.The napand sleep modes disable bus snooping;therefore,a hardware handshake is provided toensure coherency before the603r enters these power management modes.Table8summarizes the four power states.Table8.Power PC603r Microprocessor Programmable Power ModesPower Management Modes The following sections describe the characteristics of the603r’s power managementmodes,the requirements for entering and exiting the various modes,and the systemcapabilities provided by the603r while the power management modes are active.FULL-Power Mode with DPM Disabled:Full-power mode with DPM disabled powermode is selected when the DPM enable bit(bit11)in HID0is cleared.•Default state following power-up and HRESET.•All functional units are operating at full processor speed at all times.FULL-Power Mode with DPM Enabled:Full-power mode with DPM enabled(HID0[11]=1)provides on-chip power management without affecting the functionality or perfor-mance of the603r.•Required functional units are operating at full processor speed.•Functional units are clocked only when needed.•No software or hardware intervention required after mode is set.•Software/hardware and performance transparent.Doze Mode:Doze mode disables most functional units but maintains cache coherencyby enabling the bus interface unit and snooping.A snoop hit will cause the603r toenable the data cache,copy the data back to memory,disable the cache,and fullyreturn to the doze state.•Most functional units disabled.•Bus snooping and time base/decrementer still enabled.•Dose mode sequence:-Set doze bit(HID0[8)=1).-603r enters doze mode after several processor clocks.•Several methods of returning to full-power mode:-Assert INT,SMI,MCP or decrementer interrupts.-Assert hard reset or soft reset.•T ransition to full-power state takes no more than a few processor cycles.•PLL running and locked to SYSCLK.Nap Mode:The nap mode disables the603r but still maintains the phase locked loop (PLL)and the time base/decrementer.The time base can be used to restore the603r to full-on state after a programmed amount of time.Because bus snooping is disabled for nap and sleep mode,a hardware handshake using the quiesce request and quiesce acknowledge signals are requires to maintain data coherency.The 603r will assert the signal to indicate that it is ready to disable bus snooping. When the system has ensured that snooping is no longer necessary,it will assertand the603r will enter the sleep or nap mode.•Time base/decrementer still enabled.•Most functional units disabled(including bus snooping).•All nonessential input receivers disables.•Nap mode sequence:-Set nap bit(HID0[9]=1)-603r asserts quiesce request signal-System asserts quiesce acknowledge signal-603r enters sleep mode after several processor clocks•Several methods of returning to full-power mode:-Assert INT,SPI,MCP or decrementer interrupts-Assert hard reset or soft reset•T ransition to full-power takes no more than a few processor cycles.•PLL running and locked to SYSCLK.Sleep Mode:Sleep mode consumes the least amount of power of the four modes since all functional units are disabled.To conserve the maximum amount of power,the PLL may be disabled and the SYSCLK may be removed.Due to the fully static design of the 603r,internal processor state is preserved when no internal clock is present.Because the time base and decrementer are disabled while the603r is in sleep mode,the603r’s time base contents will have to be updated from an external time base following sleep mode if accurate time-of-day maintenance is required.Before the603r enters the sleep mode,the603r will assert the QREQ signal to indicate that it is ready to disable bus snooping.When the system has ensured that snooping is no longer necessary,it will assert QACK and the603r will enter the sleep mode.•All functional units disabled(including bus snooping and time base).•All nonessential input receivers disabled:-Internal clock regenerators disabled-PLL still running(see below)•Sleep mode sequence:-Set sleep bit(HID0[10]=1)-603r asserts quiesce request-System asserts quiesce acknowledge-603r enters sleep mode after several processor clocksTSPC603R•Several methods of returning to full-power mode:-Assert INT ,SMI,or MCP interrupts -Assert hard reset or soft reset•PLL may be disabled and SYSCLK may be removed while in sleep mode.•Return to full-power mode after PLL and SYSCLK disabled in sleep mode:-Enable SYSCLK-Reconfigure PLL into desired processor clock mode-System logic waits for PLL startup and relock time (100µsec)-System logic asserts one of the sleep recovery signals (for example,INT or SMI)Power Management Software ConsiderationsSince the 603r is a dual issue processor with out-of-order execution capability,care must be taken in how the power management mode is entered.Furthermore,nap and sleep modes require all outstanding bus operations to be completed before the power management mode is entered.Normally during system configuration time,one of the power management modes would be selected by setting the appropriate HID0mode ter on,the power management mode is invoked by setting the MSR[POW]bit.To pro-vide a clean transition into and out of the power management mode,the stmsr [POW]should be preceded by a sync instruction and followed by an isync instruction.Power DissipationDD power (AV DD ).OV DD power is system dependent but is typically ≤10%of V DD .Worst-case AV DD =15mW.2.Typical power is an average value measured at V DD =AV DD =2.5V ,OV V =3.3V ,in a system executing typical applicationsand benchmark sequences.3.Maximum power is measured at V DD =2.625V using a worst-case instruction mix.4.To calculate the power consumption at low temperature (-55°C),use a factor of 1.25.Table 9.Power Dissipation (1)(2)(3)(4)V DD /A V DD =2.5±5%V,O V DD =3.3±5%V,GND =0V,0°C ≤T C ≤125°C CPU Clock FrequencyMarking Each microcircuit is legible and permanently marked with the following information asminimum:•A TMEL logo•Manufacturer’s part number•Class B identification if applicable•Date-code of inspection lot•ESD identifier if available•Country of manufacturingElectrical CharacteristicsGeneral Requirements All static and dynamic electrical characteristics specified for inspection purposes and therelevant measurement conditions are given below:•Table10:Static electrical characteristics for the electrical variants•Table11:Dynamic electrical characteristics for the603rThese specifications are for166MHz to300MHz processor core frequencies.The pro-cessor core frequency is determined by the bus(SYSCLK)frequency and the settings ofthe PLL_CFG0to PLL_CFG3signals.All timings are respectively specified to the risingedge of SYSCLK.Static CharacteristicsTable10.Electrical CharacteristicsV=A V=2.5V±5%;O V=3.3±5%V,GND=0V,-55°C≤TC≤125°C2.Capacitance is periodically sampled rather than100%tested.3.Leakage currents are measured for nominal OV DD and V DD or both OV DD and V DD.Same variation(for example,both V DDand OV DD vary by either+5%or-5%).TSPC603RDynamic Characteristics•Clock AC SpecificationsTable 11provides the clock AC timing specifications as defined in Figure 5.2.Cycle-to-cycle jitter is guaranteed by design.3.Timing is guaranteed by design and characterization,and is not tested.4.PLL relock time is the maximumamount of time required for PLL lock after a stable V DD ,OV DD ,AV DD and SYSCLK are reached during the power-on reset sequence.This specification also applies when the PLL has been disabled and subse-quently re-enabled during sleep mode.Also note that must be held asserted for a minimum of 255bus clocks after the PLL relock time (100µs)during the power-on reset sequence.5.Caution :The SYSCLK frequency and PLL_CFG[0-3]settings must be chosen such that the resulting SYSCLK (bus)fre-quency ,CPU (core)frequency,and PLL (VCO)frequency do not exceed their respective maximum or minimum operating frequencies.Refer to the PLL_CFG[0-3]signal description for valid PLL_CFG[0-3]settings.Figure 5.SYSCLK Input Timing DiagramTable 11.Clock AC Timing Specifications (1)(2)(3)(4)V V V•Input AC specificationsTable 12provides the input AC timing specifications for the 603r as defined in Figure 6and Figure 7.of the input SYSCLK.Both input and output timings are measured at the pin.See Figure 7.2.Address/data/transfer attribute input signals are composed of thefollowing:A[0-31],AP[0-3],TT[0-4],TC[0-1],TBST,TSIZ[0-2],DH[0-31],DL[0-31],DP[9-7].3.All other input signals are composed of the following:TS,ABB,DBB,ARTRY ,BG,AACK,DBG,DBWO,TA,DRTRY ,TEA,,TBEN,4.The setup and hold time is with respect to the rising edge of HRESET.See Figure 7.5.t sysclk is the period of the external clock (SYSCLK)in nanoseconds (ns).The numbers given in the table must be multipliedby the period of SYSCLK to compute the actual time duration (in nanoseconds)of the parameter in question.6.These values are guaranteed by design,and are not tested.7.This specification is for configuration mode only.Also note that HRESET must be held asserted for a minimum of 255busclocks after the PLL relock time (100µs)during the power-on reset sequence.Figure 6.Input Timing DiagramTable 12.Input AC Timing Specifications (1)V V VTSPC603R Figure7.Mode Select Input Timing Diagram•Output AC SpecificationsTable13provides the output AC timing specifications for the603r(shown in Figure8). Table13.Output AC Timing Specifications(1)(2)V=A V=2.5V±5%;O V=3.3±5%V,GND=0V,C=50pF,-55°C≤Tnal in question.Both input and output timings are measured at the pin.See Figure8.2.All maximum timing specifications assume C L=50pF.3.This minimum parameter assumes C L=0pF.4.SYSCLK to output valid(5.5V to0.8V)includes the extra delay associated with discharging the external voltage from5.5V to0.8V instead of from V DD to0.8V(5V CMOS levels instead of3.3V CMOS levels).5.t sysclk is the period of the external bus clock(SYSCLK)in nanoseconds(ns).The numbers given in the table must be multi-plied by the period of SYSCLK to compute the actual time duration(ns)of the parameter in question.6.Output signal transitions from GND to2.0V or V DD to0.8V.7.Nominal precharge width for ABB and DBB is0.5*t sysclk.8.Nominal precharge width for is1.0*t sysclk.Figure8.Output Timing DiagramJTAG AC TimingSpecificationsTable14.JTAG AC Timing Specifications(independent of SYSCLK)V=A V=2.5V±5%;O V=3.3±5%V,GND=0V,C=50pF,-55°C≤T21TSPC603R2125A –HIREL –04/022.Non-test signal input timing with respect to TCK.3.Non-test signal output timing with respect to TCK.Figure 9.Clock Input Timing DiagramFigure 10.TRST Timing DiagramTable 14.JTAG AC Timing Specifications (independent of SYSCLK)V =A V =2.5V ±5%;O V =3.3±5%V,GND =0V,C =50pF,-55°C ≤T22TSPC603R2125A –HIREL –04/02Figure 11.Boundary-scan Timing DiagramFigure 12.Test Access Port Timing DiagramFunctional DescriptionPowerPC Registers andProgramming Model The PowerPC architecture defines register-to-register operations for most computa-tional instructions.Source operands for these instructions are accessed from theregisters or are provided as immediate values embedded in the instruction opcode.Thethree-register instruction format allows specification of a target register distinct from thetwo source operands.Load and store instructions transfer data between registers andmemory.PowerPC processors have two levels of privilege -supervisor mode of operation (typi-cally used by the operating system)and user mode of operation (used by the applicationsoftware).The programming models incorporate 32GPRs,32FPRs,special-purposeregisters (SPRs)and several miscellaneous registers.Each PowerPC microprocessoralso has its own unique set of hardware implementation (HID)registers.23TSPC603R2125A –HIREL –04/02Having access to privilege instructions,registers,and other resources allows the operat-ing system to control the application environment (providing virtual memory andprotecting operating-system and critical machine resources).Instructions that controlthe state of the processor,the address translation mechanism,and supervisor registerscan be executed only when the processor is operating in supervisor mode.The following sections summarize the PowerPC registers that are implemented in the603r.General-Purpose Registers(GPRs)The PowerPC architecture defines 32user-level,general-purpose registers (GPRs).These registers are either 32bits wide in 32-bit PowerPC microprocessors and 64bitswide in 64-bit PowerPC microprocessors.The GPRs serve as the data source or desti-nation for all integer instructions.Floating-Point Registers(FPRs)The PowerPC architecture also defines 32user-level,64-bit floating-point registers (FPRs).The FPRs serve as the data source or destination for floating-point instructions.These registers can contain data objects of either single-or double-precision float-ing-point formats.Condition Register (CR)The CR is a 32-bit user-level register that consists of eight four-bit fields that reflect theresults of certain operations,such as move,integer and floating-point compare,arith-metic,and logical instructions,and provide a mechanism for testing and branching.Floating-Point Status andControl Register (FPSCR)The floating-point status and control register (FPSCR)is a user-level register that con-tains all exception signal bits,exception summary bits,exception enable bits,androunding control bits needed for compliance with the IEEE 754standard.Machine State Register (MSR)The machine state register (MSR)is a supervisor-level register that defines the state ofthe processor.The contents of this register are saved when an exception is taken andrestored when the exception handling completes.The 603r implements the MSR as a32-bit register,64-bit PowerPC processors implement a 64-bit MSR.Segment Registers (SRs)For memory management,32-bit PowerPC microprocessors implement sixteen 32-bitsegment registers (SRs).To speed access,the 603r implements the segment registersas two arrays;a main array (for data memory accesses)and a shadow array (for instruc-tion memory accesses).Loading a segment entry with the Move to Segment Register(STSR)instruction loads both arrays.。

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PC 6-16/ 6-G-10,16 Order No.: 1913688
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POWER COMBICON headers, 10.16 mm pitch, color: green, no. of positions 6, dimension a 50.80 mm

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