2N3439中文资料

SOT-343Document Number 84031Rev. 1.1, 05-Feb-04Vishay Semiconductors 1SOT-343Package Dimensions in mm 2Document Number 84031 Rev. 1.1, 05-Feb-04SOT-343Vishay SemiconductorsOzone Depleting Substances Policy StatementIt is the policy of Vishay Semiconductor GmbH to1.Meet all present and future national and international statutory requirements.2.Regularly and continuously improve the performance of our products, processes, distribution andoperatingsystems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment.It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs).The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances.Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents.1.Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendmentsrespectively2.Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the EnvironmentalProtection Agency (EPA) in the USA3.Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively. Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances.We reserve the right to make changes to improve technical designand may do so without further notice.Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use.Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, GermanyTelephone: 49 (0)7131 67 2831, Fax number: 49 (0)7131 67 2423。

High-Precision, Low-Voltage, Current-Sense Amplifier with Current Output and Chip Select for Multiplexing MAX9934
ABSOLUTE MAXIMUM RATINGS
RS+, RS- to GND......................................................-0.3V to +6V VCC to GND ..............................................................-0.3V to +4V CS, OUT to GND (VCC = 0, or CS < VIL)..................-0.3V to +4V OUT to GND (CS > VIH)................................-0.3V to VCC + 0.3V Differential Input Voltage (RS+ - RS-) ....................................±6V Output Short-Circuit Current Duration OUT to GND or VCC ...............................................Continuous Continuous Input Current into Any Terminal.....................±20mA Continuous Power Dissipation (TA = +70°C) 8-Pin µMAX (derate multilayer 4.8mW/°C above +70°C).............................................................388mW Junction-to-Ambient Thermal Resistance (θJA) (Note 1) ....................................................................206°C/W Junction-to-Case Thermal Resistance (θJC) (Note 1) ......................................................................42°C/W 6-Pin µDFN (derate multilayer 4.5mW/°C above +70°C)..........................................................357.8mW Junction-to-Ambient Thermal Resistance (θJA) (Note 1 ) ................................................................223.6°C/W Junction-to-Case Thermal Resistance (θJA) (Note 1) ....................................................................122°C/W 6-Bump UCSP (derate multilayer 3.9mW/°C above +70°C).............................................................308mW Junction-to-Ambient Thermal Resistance (θJA) (Note 1) ....................................................................260°C/W Operating Temperature Range .........................-40°C to +125°C Junction Temperature ......................................................+150°C Storage Temperature Range .............................-65°C to +160°C Lead Temperature (soldering, 10s) .................................+300°C Reflow Soldering Temperature (UCSP, µDFN, and µMAX) ..........................................................................+260°C

ltc3789芯片中文资料及推荐参数LTC3789 是一款高性能、降压-升压型开关稳压控制器，可以在输入电压高于、低于或等于输出电压的情况下运作。

该器件运用了恒定频率、电流模式架构，故可提供一个高达600kHz 的可锁相频率，而一个输出电流反馈环路则提供了对电池充电的支持。

凭借4V 至38V （最大值为40V）的宽输入和输出范围以及工作区之间的无缝和低噪声转换，LTC3789 成为了汽车、电信和电池供电型系统的理想选择。

在降压或升压模式时，LTC3789 运用专有电流模式控制架构实现恒定频率工作，而且内置了4 个强大的N 沟道MOSFET 栅极驱动器。

LTC3789 还提供一个准确的恒定电流调节环路，用于在宽输入电压范围内调节输入或输出电流。

输入电流限制功能防止输入电源过载，输出电流限制为诸如电池充电器或LED 驱动器等稳定输出电流应用提供了非常容易的解决方案。

该器件在所有工作模式下为过压、过流和短路情况提供了故障保护。

此外，LTC3789 在停机时断开输入电压和输出电压的连接。

用户可以选择连续或脉冲跳跃模式，以最大限度地提高轻负载效率，并允许将IC 同步至一个外部时钟。

脉冲跳跃模式在轻负载条件下可实现最低的纹波，而强制连续模式则工作于一个恒定的频率以满足噪声敏感型应用的需要。

此外，LTC3789 具有可调软启动、电源良好输出，并在-40C 至125C 的工作结温范围内保持1.5% 的基准电压准确度。

当输出位于其设计设定点的10% 以内时，一个电源良好输出引脚将发生指示信号。

LTC3789 采用扁平的28 引脚4mm x 5mm QFN 封装和窄体SSOP 封装。

LTC3789引脚说明LTC3789引脚图1. VFB（PIN1/PIN26）：误差放大器反馈引脚。

LTC3789收到的反馈电压来自于外部电阻分压器输出的电压。

2. SS（PIN2/PIN27）：外部软启动输入引脚。

LTC3789调节VFB电压到较小的0.8V或SS 引脚上的电压。

TOSHIBA Field Effect Transistor Silicon N Channel MOS Type (π−MOSV)2SK3497High Power Amplifier Applicationz High breakdown voltage: VDSS = 180V z Complementary to 2SJ618Absolute Maximum Ratings (Ta = 25°C)Characteristics Symbol Rating UnitDrain −source voltage V DSS 180 VGate −source voltage V GSS ±12 V DC (Note1) I D 10 ADrain currentPulse (Note 1) I DP 30A Drain power dissipation (Tc = 25°C) P D 130 W Channel temperature T ch 150 °C Storage temperature rangeT stg−55~150 °CNote 1: Ensure that the channel temperature does not exceed 150°C.Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant changein temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).Thermal CharacteristicsCharacteristics Symbol Max UnitThermal resistance, channel to case R th (ch −c) 0.96 °C / W Thermal resistance, channel toambientR th (ch −a)50°C / WUnit: mm1.GATE 2. DRAIN (HEAT SINK)3. SOURCEJEDEC ― JEITA―TOSHIBA 2-16C1B Weight: 4.6 g (typ.)3Electrical Characteristics (Ta = 25°C)Characteristics SymbolTest ConditionMin Typ. Max Unit Gate leakage current I GSS V GS = ±12 V, V DS = 0 V — —10 μA Drain cut −off currentI DSS V DS = 180V, V GS = 0 V — — 100μA Drain −source breakdown voltage V (BR) DSS I D = 10 mA, V GS = 0 V 180 — — V Gate threshold voltage V th V DS = 10 V, I D = 1 mA 1.1 — 2.1 V Drain −source saturation voltage V DS (ON)V GS = 7 V, I D = 5 A— — 0.75V Forward transfer admittance |Y fs | V DS = 10 V, I D = 5 A6.012.0—SInput capacitanceC iss — 2400 —Reverse transfer capacitance C rss — 220 — Output capacitanceC ossV DS = 30 V, V GS = 0 V, f = 1 MHz — 30 —pF This transistor is an electrostatic-sensitive device. Please handle with caution.Markinglead (Pb)-free package or lead (Pb)-free finish.RESTRICTIONS ON PRODUCT USE20070701-EN •The information contained herein is subject to change without notice.•TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property.In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.• The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer’s own risk.•The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations.• The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties.• Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations.。