AutoTesterNet 自动化测试解决方案 技术白皮书

自动化测试整体解决方案西安绿点信息科技有限公司2013年7月文件状态 草 稿 正式发布文件标识 当前版本 作者审核人使用范围创建日期生效日期版本历史版本号修改点说明变更人变更日期审批人审批日期1.0 初始版本殷颉2013.7.121.1 整合整套解决方案版本殷颉2013.7.23一.客户端黑盒自动化测试方案一．黑盒自动化测试的目的1）黑盒自动化测试的目的是为了解决手工测试的重复工作。

尤其是进行回归测试时因为只要程序有改动，都无法保证其他的模块不出现问题，所以需要进行整个软件所有功能的遍历。

这样就造成了重复性测试工作繁多。

2）以往执行手机压力测试或性能测试，需要人工去不断点击，这样造成了人员的疲劳现象且重复的进行工作造成了人员人力成本的不断上升。

3）当应用程序需要适配多款手机时如果用手工测试，就需要人工去不同型号的手机中安装相应的被测试程序进行测试，这样就增加了测试时间，假设有10部需要做兼容性测试的手机，每部手机测试1小时，就需要测试10个小时才可以测试完成。

二．黑盒自动化测试的目标1）解决重复测试的问题，使得测试人员把有限的精力投入到更多新技术的研究中，这样从长远来看是降低成本的作法。

2）解决压力测试和性能测试问题，解决人工进行压力测试3）解决兼容性测试问题，通过自动化测试，自动进行相应APK的测试如果有10部手机可以同时进行测试，节省了大量时间。

三．移动客户端系统自身特点移动客户端是一个基于客户端和服务器架构的系统，客户端指的是手机中的APP程序，服务器指的是提供查询，办理业务以及存储用户信息和客户端进行交互，通过WIFI或移动3G 网络用户可以使用手机客户端进行话费流量套餐查询，套餐业务变更和办理，以及优惠活动查询等功能。

因为是一个和服务器有交互的程序，测试时就要重点关注如下几方面，1.交互数据的同步，例如在客户端办理或变更了一个套餐，服务器端是否收到办理业务的数据并进行相应的数据变更，返回到服务器，这个过程中要关注客户端页面业务套餐的功能，客户端发送变更清求后，服务器返回数据的响应时间以及数据的变更是否同步进行，如果不同步可能会出现客户端已经显示变更完成，但是服务器端未做更改现象2.界面UI的设计和显示是否适用于移动客户端，不应当出现过大，过小重叠现象。

T E C H N I C A L P A P E R TESTABILITYLEVEL FAULT DIAGNOSIS CAPABILITY- AND ITS SPEED.ICT checks each component on a PCB individually, delivering highly reliable results. Itdetects defects such as wrong or missing components, solder bridges and short circuits.While investing in this solution requires a larger initial upfront cost when compared toflying probe, the cost per unit is negligible - often less than £1 - due to the swift test time(less than one minute).The ICT method comprises a test fixture and program dedicated to the target test platformand unit under test (UUT). In order to optimise the effectiveness of the test, the circuit designand layout of the PCBA itself must be suitable for ICT. Therefore, design for test (DFT) is an integral stage of PCB realisation; without taking this phase into account, you will not be ableto get the most from your test strategy.This technical paper describes what should be taken into consideration, to help maximisethe achievable test coverage - and deliver the highest quality PCBAs to your customers.TEST METHODS AND PRACTICEFirstly, let’s look at the basics of ICT, as these provide a background to the design requirements detailed later.Computer-aided design (CAD) data, usually the ASCII file for the PCBA, is processed through an appropriate software package to produce the test fixture design files. It is also used, along with the bill of materials (BOM) and circuit diagrams, to create an automatictest equipment (ATE) input, which is used to generate and optimise the ICT program.The test program is firstly set to detect short circuits wherever test access is available; itthen features routines to measure the value of all testable discrete components, ensuringtheir correct measurement and isolated performance.Digital “vector” tests are used for all ICs where templates exist - for example, standardparts such as logic gates. Wherever possible, presence and orientation tests will beapplied to all ICs. “Vectorless testing”, such as Framescan TM or TestJet TM, can be used to detect dry joints on integrated circuits and connectors.Function tests can be set for powered or unpowered analogue devices. Crystal frequencies can also be measured where test access and type makes this possible.The fixture will comprise a “bed of nails” to probe the UUT, and usually feature a “hold down” gate on the top, to ensure that PCBs with open vias or irregular profiles are not susceptible to vacuum fixture sealing problems.When ICT development is completed, it is standard to produce a documentation package detailing:•C overage report listing tested, partially tested and untested components;•D etails of fixture wiring;•D etails of probe types used;•S oftware.Design guidelines for in-circuit testability 0304 Design guidelines for in-circuit testabilityCIRCUIT DESIGN CONSIDERATIONSThe aim of ICT is to individually test components in isolation from the rest of the circuitry.A “bed-of-nails” fixture is created, ideally having access to each electrical node/net on the UUT via a test pad, providing access to all signals to an individual component. If this is not possible then “cluster” testing groups of components can be performed. However, this increases programming and test time, as well as cost, as faults will be traced to a cluster of parts instead of the individual component fault.To maximise test coverage, the following points should be considered:•T est pads should appear as components in the CAD file, with unique identifiers and XY co-ordinates.•A ll digital devices that are controlled by a chip enable/select should have this pin connected to the power supply rail through a pull up/down resistor, not directly tied.Any resistor value from 100R to 100K is acceptable.•B atteries should not be fitted at in-circuit test. If they are fitted, a removable link must be provided to isolate the battery from the rest of the circuit.•A ll chips that have a RESET pin should also have this pin available for individual test control via a pull-up/down resistor. Try to avoid directly connecting the reset line of the microprocessor/microcontroller to another bussed integrated circuit. Use a low value resistor (approximately 100 ohms). This will allow the micro to be kept in reset while testing the other device.•W here a device is driven by an external clock circuit, this should be driven via a tri-state buffer (i.e. not directly) or an AND gate with its other signal controlled by a pull-up resistor. The oscillator can then be stopped from affecting the stability of other tests.•A ny unused inputs or outputs of devices should have their signals tied individually, preferably via a resistor, rather than directly to supply rails. This enables the use of standard library tests where available, making programming quicker and therefore less expensive.•S how the spare gates and unused pins of ICs on circuit diagrams. On surface mount (SMT) designs a test pad should ideally be provided for unused pins of ICs, as otherwise short circuits to pins with no test points will not be detected.•T o keep test times as short as possible try to use low capacitance values on control lines - e.g. power on reset. This enables all digital tests to be carried out at higher speeds.•T o help avoid unstable test results due to “back-driving”, where programmable devices are to be used:• D o not tie chip enable pins to supply rails, use pull-ups;• A ttempt to include a test vector that will either cause the output pins to become tri-state or active high;• P rogram a combination of input stimuli that will drive all output signals high.FIXTURING AND PCB LAYOUT CONSIDERATIONSThe minimum centre-to-centre spacing between test points is governed by the pitchlimitations of ICT probes. The following chart shows the pitch between test point centresthat are achievable using the three standard sizes of test probes:Where possible, try to keep the distance between test points/pads to a minimum of0.100”, so standard 100mil probes can be used. When this cannot be achieved thereare smaller probes that can be used down to 0.050” and specialist probes that will affordcontact on even closer pitch - but experience has shown that the smaller the probe, thelarger the probability of contact problems and reduced long-term reliability. However, itis possible to mix the various sizes on a single fixture. Another point to remember is thatsmaller probes tend to cost considerably more.PCB test pads must be at least 0.125” away from the edge of the PCB. If the PCBis mounted in a frame, the targets need to be within the inside edge of the frame bythis amount.Test pads should preferably be 0.05” in diameter, but can be reduced if absolutelynecessary by using alternative methods of tooling and fixture design. Square test padsare preferred as they have 27 per cent more target area over the round shape.T est pads can be placed over the top of vias, though the hole must not exceed 0.02”diameter and the wall thickness must be sufficient to withstand the probe pressure.Multiple test pads should be included for ground and power supply rails, and should be distributed across the PCB.Test targets should be at least 0.100” away from any components on the probing side ofthe PCB.Test pads should be distributed evenly over the surface of the PCB. Areas of highprobing density should be avoided as this may cause flexing of the PCB. This in turnmay cause flexing damage to components. If high-density areas do exist then the boardshould be stress analysed and/or redesigned.Design guidelines for in-circuit testability0506 Design guidelines for in-circuit testabilitySpace must be left on the component side of the board to allow “pusher rods” to press the board down. This is particularly important in areas of high probe density. Pusher rods are typically 2mm diameter, and one is required for approximately every 2in2 of PCB. Note fixtures for ICT are normally actuated by vacuum, but options for mechanical and pneumatically actuated fixtures are also available.Test pads must be provided on each net where tracks interconnect SMT devices. However, on mixed technology boards connection can often be made on conventional through-hole components. Although probing the legs of through-hole components is acceptable, more reliable results can be obtained with the use of dedicated test pads. Through-hole components should have controlled lead length, ideally no greater than 0.062”. Keeping the lead lengths the same will assist with an even compression of all test probes, resulting in consistent compression forces.Ensure that the solder resist does not cover any test pads or vias. Also ensure soldered test pads and particularly vias are domed with solder above the height of the solder resist mask. To ensure accurate positioning of the board in the fixture, the tooling holes in the PCB should be at least 3 or 4mm diameter (0.125”) - though 2mm is possible if essential. Tolerances should be +0.05mm, -0.0mm. The tooling holes must not be plated. Fit two tooling holes per PCB, ideally located in diagonally opposed corners (pitch tolerance±0.125mm), keeping the distance between them as great as possible but located a minimum distance of 3mm from the edge of the PCB. Tooling holes should appear in the CAD data as unique components with XY coordinates.There should be an area of at least 5mm diameter around the tooling hole, on the underside of the board, which is free of components and tracks. This allows good board support without the possibility of track shorts to the tooling pins.The minimum PCB thickness should be 0.062” inches (1.58 mm).It is preferable not to perform “cut and strap” wiring modifications on the underside of the board, as the wiring could obscure the test pads.Any components with a standoff height greater than 0.100” on the underside of the board will require milling of the fixture, which will add to the cost. Standard SMT devices are normally less than this and provide no problem.It is mandatory to keep component bodies at least 0.050” away from adjacent test pad centres but try to achieve 0.100” wherever possible.Probing on the component legs of SMT devices is highly undesirable as this could turn a potential dry joint into a good contact during test, as the probe tip in contact with the leg can compress the contact between the component leg and the solder pad, and thus a defective joint will pass undetected.The best layout configuration is to have all the components on one side of the board and all test pads on the other. Fixtures are available that will allow probing to both sides of the board, but this will increase the fixture cost and program debug time. If the only way to incorporate test pads is to use both sides of the board, then the minimum size test pad target for topside probing is 0.040”.Where functional testing is required as well as ICT on an in-circuit tester, it is essential to withdraw the probes that are used for ICT during the functional test cycle of the board. There are three options for dual stage contact within fixturing:a) S tandard vacuum fixture technology featuring a “shuttle plate” that controls the lengthof travel of the top plate during the ICT and functional test cycle. By using a mixture of standard and “long throw” probes, access can easily be modified to restrict in-circuit probe contact during functional testing.b) S tandard and long throw probes are used but fixture actuation is performed bypneumatic cylinders with two travel lengths. This proves to be a more robust, but more expensive solution.c) U se discrete pneumatic probes for functional test point access.Whichever solution is adopted it is advisable to take special care on the design of the test pads and their spacing. Long throw probes are readily available and reliable in 0.100” format. They are also available in 0.075” format but are perhaps not as reliable.Another point to consider is that while functionally testing the board, it is generally running at higher speed than at in-circuit and is thus more susceptible to noise caused by the wiring contained in the fixture. In order to minimise this effect, it is desirable to design a board with two test pads per functional net, so only the wiring associated with functionaltesting is connected to the board during this part of the test cycle.Design guidelines for in-circuit testability 07Test Pads PCBSolder Resist above TP NO Solder Resist below TPOK08 Design guidelines for in-circuit testabilityTo summarise:1. M inimum 0.035” diameter test pads on the bottom side of the PCB.2. M inimum 0.040” diameter test pads on the top side of the PCB.3. T est point pitch preferred at 0.100” as this is the most reliable and lowest cost.4. A t least 2x 0.125”, diagonally opposite non-plated through tooling holes in the PCB.5. T est pads on one side of the board only.6. A ll test pads/points a minimum of 0.125” away from the edge of the PCB.7. N o component more than 0.100” high on solder side of the PCB.8. N o wire links on the test access side of the PCB.9. T wo test points per functional test net.10. M inimum 0.075” probes for functional testing.MANUFACTURING TOLERANCES OF PCBS AND FIXTURES In order to achieve consistent test results and contact accuracy, both fixture and PCB manufacturing tolerances need to be controlled. The chart below outlines typical tolerances that can be expected in fixturing, and the desired tolerances of PCBs:The total tolerance stack up is double the sum of the individual tolerances, as the tolerances are ± (effectively doubling the size of tolerance error). It is most critical to control and monitor the PCB artwork tolerance, as in the above scenario there is only a margin of ± 0.0015” before the tolerance stack starts to exceed the theoretical limit ofcontact accuracy in a standard ICT fixture.INFORMATION REQUIRED TO PRODUCE ICT FIXTURESAND PROGRAMS•C AD data, usually in ASCII format, with identification of the version and format of the files.•A bill of materials, preferably in electronic format, (e.g. Word/Excel).•C ircuit diagrams / schematics, ideally in electronic format (JPG, TIFF, or PDF).•P opulated and bare PCBs of the revision level required for the fixture and test program.If these are not available, it may be acceptable to use older issue boards providedacetates of the current revision are supplied with the changes clearly identified.•D etails of the target test system type and configuration.•D atasheets on any non-standard components (e.g. ASICs).•T est programming protocol specifications.•F ixture default specifications.•D etails of any health and safety/compliance issues, especially relating to fixture handling or electrical test program operation.CONCLUSIONIn-circuit test is one of the most popular types of automated test equipment (ATE) usedin medium to high volume electronic PCB assembly. And while it delivers highly reliableresults, it is vital to ensure that your PCB is designed correctly, in order to achieve theoptimum results.You should ensure that you have the correct CAD data and schematics and test padsshould be designed into the PCB up front. Manufacturing tolerances need to be controlledfor both the fixture and the PCB.ICT tests every component individually, identifying issues such as wrong or missing components, solder bridges and short circuits. And with a test time typically less than oneminute and a cost per unit typically less than £1, it is a cost-effective method – which morethan recompenses for the initial upfront cost.Investing in an ICT solution can help your business to consistently deliver fully functionalPCBs, on time and to specification. The time and money saved can be redirected backinto other core aspects of your operation.Design guidelines for in-circuit testability 09Call us on +44 (0)1455 55 55 00 to discuss any points raised in the eBook or to talk through your own outsourcing requirements. We would be delighted to hear from you.ABOUTJJS MANUFACTURING IS AN ELECTRONICS MANUFACTURING SERVICES PARTNER, OFFERING LOW RISK, END-TO-END PROCUREMENT, MANUFACTURE AND SUPPLY CHAIN SOLUTIONS.10 Design guidelines for in-circuit testabilityRESOURCESGET A DEEPER UNDERSTANDING OFOUTSOURCING MANUFACTURING BYDOWNLOADING OUR INDUSTRY EBOOKSExecutive Guide toOutsourcing YourElectronics ManufacturingDownload NowuA Step-by-Step Guideto New ProductIntroduction (NPI)Download NowuThe definitive guide totest within electronicsmanufacturingDownload Now uIndustrial Automation:Your ultimate guideto outsourcingDownload Now uDownload Now uOutsourcing: A collectionof EMS case studies fromJJS ManufacturingDownload Now uSupply ChainExcellenceDownload Now uTest and Measurement:Outsourcing with precisionand accuracyDownload Now uOutsourcingProduct DesignDownload Now uAchieving quality,consistency and deliverywithin electronicsmanufacturingDownload Now uProcess Instrumentationand Control: Your guide toimplementing a successfuloutsourcing strategyDownload Now uAn Introduction toOutsourcing YourElectronics ManufacturingDownload Now uAn alternative viewof the traditionalEMS tier systemDownload Now uOutbound Logistics:The last piece of themanufacturing jigsawDownload Now uDesign guidelinesfor in-circuittestabilityDownload Now uThe first six months:Working in partnershipwith JJSDownload Now u10 Critical Steps toOutsourcing YourElectronics ManufacturingDownload Now uLaboratory Technology:Outsourcing, in orderto innovate。

Edge OTN 解决方案技术白皮书文档版本 V1.1 发布日期2021-03-20华为技术有限公司版权所有© 华为技术有限公司2021。

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华为技术有限公司地址：深圳市龙岗区坂田华为总部办公楼邮编：518129网址：https://客户服务邮箱：******************客户服务电话：4008302118文档版本V1.1 (2021-03-20) 版权所有© 华为技术有限公司第 2 共29目录1 FMEC网络融合的趋势与挑战 (4)1.1 品质业务需求快速增长 (4)1.2 融合业务成为趋势 (6)1.3 FMEC网络建设面临的挑战 (7)1.4 总结 (8)2 Edge OTN方案是FMEC融合建网的最佳选择 (9)2.1 Edge OTN架构 (9)2.2 基于价值区域的精准布局建网方式 (10)2.3 总结 (12)3 Edge OTN关键技术 (13)3.1 环境适应性增强技术 (13)3.2 灰光彩光混合传输 (13)3.3 Liquid OTN技术 (14)3.4 高精度时间同步 (15)4 华为Edge OTN解决方案 (16)4.1 精准规划工具 (16)4.2 全场景部署能力 (17)4.3 光层电层创新方案 (19)4.3.1 极简光层 (19)4.3.2 X+Y分布式电层 (20)4.3.3 创新线路速率 (22)4.3.4 平滑演进典型方案 (22)4.4 智慧运维 (23)4.4.1 NCE智能管控 (23)4.4.2 光层自动调测 (24)4.4.3 智能光纤管理 (24)4.4.4 智慧光性能管理 (24)5 总结 (26)A 缩略语 (27)1 FMEC网络融合的趋势与挑战1.1 品质业务需求快速增长宽带成为人们生产、生活必需的基础资源。

普坤PKItest自动化测试产品白皮书（Intelligent-Iteration-Integration Automation Test）智能持续集成测试突破性完全无编码的自动化测试产品目录软件质量：行业的隐痛 (3)质量和效率，我们追求了什么？ (3)质量问题影响了什么，是谁的错？ (4)我们该如何解决质量问题？ (5)PKITEST5.1产品组成及功能介绍 (7)PKI TEST5.1产品概述 (7)PKI TEST S ERVER（测试服务器） (9)PKI TEST C LIENT（测试客户端-IE浏览器） (12)PKI TEST C ONTROLLER（执行控制器） (13)PKI TEST A GENT（执行代理） (14)PKI TEST D ISTRIBUTOR（集成发布和任务分发子系统） (16)PKITEST5.1产品主要特性和优势 (18)无编码录制回放 (18)可视化业务场景用例编排 (18)业务贯穿集成测试 (18)高可控分布式测试执行 (19)多复用易维护测试架构 (19)附：关于普坤信息科技 (20)软件质量：行业的隐痛质量和效率，我们追求了什么？很多企事业单位的信息化主管部门都会听到各种各样的抱怨，这些抱怨来大多来自于业务部门。

业务部门是软件的使用者，他们拥有最真实的感受，不能否认他们指出的事实，虽然这些抱怨有可能夸大了质量问题的影响。

信息化主管部门负责企业信息系统的建设和维护，信息化系统一般会由第三方独立软件提供商来承接，甚至系统的运行维护也交由第三方软件公司负责。

信息化主管部门在接到业务部门的抱怨后，一般都起到了一个“传话筒”的作用，把压力转向了软件提供商。

软件提供商有自己的一套软件质量管理方法，单元测试、集成测试、迭代测试、回归测试和压力测试等等各种手段，但是产出软件系统的质量却大多不尽如人意。

这个时候，软件商会从质量和效率互相平衡的角度来解释质量出现问题的原因。

使⽤UIAutomation实现⾃动化测试--5-7在使⽤UI Automation对Winform和WPF的程序测试中发现有⼀些不同的地⽅，⽽这些不同来⾃于Winform与WPF的处理机制不同。

下⾯我们通过⼀个简单的实例来加以说明：实例描述我们使⽤InvokePattern来点击按钮弹出⼀个对话框，然后点击对话框中的“确定”按钮关闭对话框。

两种⽅式对⽐⾸先我们使⽤如下代码来针对Winfom和WPF分别进⾏测试：1public static void ClickButtonById(int processId, string buttonId)2{3 AutomationElement element = FindElementById(processId, buttonId);4 if (element == null)5 {6 throw new NullReferenceException(string.Format("Element with AutomationId '{0}' can not be find.", ));7 }8 InvokePattern currentPattern = GetInvokePattern(element);9 currentPattern.Invoke();10}上⾯的代码主要是⽤来点击按钮，我们的⽬的是点击按钮弹出MessageBox，然后点击MessageBox中的“OK”按钮关闭此对话框。

通过测试结果发现，上⾯的代码在WPF程序中完全可以通过，但是在Winform程序中，点击按钮弹出对话框之后发⽣阻塞现象，导致程序⽆法向下执⾏，所以我们通过如上代码视图点击MessageBox中的按钮来关闭此MessageBox将不可能实现，原因就在于Winform中的MessageBox弹出后就会出现阻塞现象，⽽WPF中使⽤了另⼀种处理⽅式（对此笔者解释的不够深刻，欢迎⼴⼤⾼⼿帮忙指正，另外，此问题在Windows 7操作系统上⾯不会呈现，也可能与操作系统中API对UI Automation的⽀持有关）。

捷普安全运维管理系统Jump Gatekeeper白皮书Version 2.0西安交大捷普网络科技有限公司2014年1月目录一、运维管理面临的安全风险 (1)1.运维操作复杂度高 (1)2.运维操作不透明 (1)3.误操作给企业带来严重损失 (2)4.IT运维外包给企业带来管理风险 (2)5.法律法规的要求 (2)6.人员流动性给企业带来未知风险 (2)二、运维审计势在必行 (3)1.设备集中统一管理 (3)2.根据策略实现对操作的控制管理 (3)3.实时的操作告警及审计机制 (3)4.符合法律法规 (3)5.易部署、高可用性 (4)三、安全运维管理方案 (5)1.捷普安全运维管理系统简介 (5)2.应用环境 (6)四、系统功能 (7)1.运维事件事前防范 (7)1）完整的身份管理和认证 (7)2）灵活、细粒度的授权 (7)3）后台资源自动登录 (7)2.运维事件事中控制 (8)1）实时监控 (8)2）违规操作实时告警与阻断 (8)3.运维事件事后审计 (9)1）完整记录网络会话过程 (9)2）详尽的会话审计与回放 (9)3）完备的审计报表功能 (9)五、系统部署 (11)六、系统特点 (13)1.全面的运维审计 (13)2.更严格的审计管理 (13)3.高效的处理能力 (13)4.丰富的报表展现 (14)5.完善的系统安全设计 (14)七、产品规格参数 (15)1.参数规格 (15)2.产品功能 (15)一、运维管理面临的安全风险随着IT建设的不断深入和完善，计算机硬软件系统的运行维护已经成为了各行各业各单位领导和信息服务部门普遍关注和不堪重负的问题。

由于这是随着计算机信息技术的深入应用而产生的，因此如何进行有效的IT 运维管理，这方面的知识积累和应用技术还刚刚起步。

对这一领域的研究和探索，将具有广阔的发展前景和巨大的现实意义。

大中型企业和机构纷纷建立起庞大而复杂的IT系统，IT系统的运营、维护和管理的风险不断加大。

附件二十九：产品方案技术白皮书一、背景概述 (2)1、研发背景 (2)2、产品定位 (2)二、产品方案功能介绍 (2)1、设计理念 (2)2、系统拓扑图 (2)3、系统构架描述 (2)4、系统功能介绍 (2)5、产品方案规格 (2)四、产品方案应用介绍 (3)1、应用模式 (3)2、应用流程 (3)3、应用环境 (3)五、产品方案特性介绍 (3)1、技术特性 (3)2、应用特性 (3)3、系统特性 (3)六、产品方案技术介绍 (3)1、相关技术 (3)2、技术指标 (4)七、产品方案测评数据 (4)八、实施运维方式说明 (4)九、售后服务方式说明 (4)一、背景概述1、研发背景介绍用户需求背景、该产品所在行业信息化建设背景、产品所涉及的相关政策简述等，以说明该产品的研发背景，以及满足的客户需求。

2、产品定位为了满足客户以上需求，该产品具有什么功能，能够解决什么问题。

二、产品方案功能介绍1、设计理念该产品方案的设计思路。

2、系统拓扑图使用统一的图标，制作系统拓扑图。

3、系统构架描述按照系统的构成，分类对系统进行描述。

4、系统功能介绍详细阐述系统的主要功能。

5、产品方案规格产品方案不同的规格介绍，或者对产品方案技术规格的介绍。

四、产品方案应用介绍1、应用模式该产品方案包括的应用模式类型，或者针对不同类型客户的解决方案。

2、应用流程该产品方案的应用流程。

3、应用环境描述该产品所运行的应用环境。

五、产品方案特性介绍1、技术特性主要是性能先进性、功能齐全性、系统兼容性、技术稳定性等。

2、应用特性主要是部署灵活性、可扩展性、管理方便性、易用性等。

3、系统特性对系统的主要特性进行描述，根据产品不同和竞争优势的不同而不同。

六、产品方案技术介绍1、相关技术主要应用技术的介绍，以及该技术的优势。

2、技术指标针对技术参数进行描述。

七、产品方案测评数据产品方案主要测评数据，可以是内部测评数据，也可以是第三方的测评数据。

聊聊车载以太网测试：（3）以太网如何测以太网是远比CAN总线历史更为悠久的通信技术，其行业体系更为完善。

所以在该领域专业的解决方案早已存在，只是对于车载以太网测试而言，其复杂度导致无人可在工具链层面一统江湖。

那么我们该如何选择方案，需要注意哪些问题？以太网如何测？如何选择方案？在保证测试结果专业正确性的前提下，测试方案应尽可能地做到自动化，具有易用性和可扩展性。

下图所示信息的整体工具链组成以及交付给不同OEM，覆盖以太网部件及系统级测试的典型系统实物图，即是基于上述原则而全面考虑的。

按照与测试规范体系的对应关系，从行业通用测试实现、OEM定制需求测试实现两个方面简要说明测试实现方案。

行业通用测试实现TC8-L1-PMA使用罗德施瓦茨的示波器、网络分析仪、夹具，时钟同步模块、专用以太网测试包，覆盖PMA 的测试。

以太网的物理层测试和传统CAN 测试差别很大，测试分析方法已从传统时域扩展到频域，难啃难懂，尤其对于我等学机械电子/自动化出身的放牛娃而言。

专业装备是基础，除此外，还需要留意哪些：● 被测节点PHY 必须可设置Test Mode ，这是测试前提条件之一●除了示波器自带的Test Fixture ，其它转接口也是必须的，例如对于模式转换相关的测试 ● 尽可能减少线束、连接器的中转环节●1000Base-T1将呼啸而至，专用设备的硬件特性上需考虑预留下图为对100Base-T1以太网节点功率谱密度、回损及定时抖动和时钟频率测试的实际场景及测试报告样本示意图。

TC8-L1-IOPTC8-L1-IOP需要Golden Device“理想设备（黄金的）”。

此设备的“特质”是绝对要比被测对象更为可靠，性能更高的以太网节点，不让DUT做小白鼠。

举几个例子：●设备需要通过继电器实现故障仿真，对继电器的接触阻抗有非常严格的要求●通信回路的Layout所用的连接器同样是高标准需要统计计算Link-up时间，对IOP设备的MCU处理能力要求更高，实时性更强北汇信息使用Technica的IOP设备，自带软件可实现手动测试，也可由北汇信息定制，通过CANoe CAPL编程控制实现自动化测试。

苏州东润E-Top前置应用平台v1.0 技术白皮书1 产品背景当前，银行IT应用系统在内部互联和外部联接方面出现了联接复杂化和需求多样化的趋势。

在内部，需要联接核心系统、前置系统、中间业务系统、文件服务系统等，满足不同的通信协议、通信方式、报文格式的要求；对外部，需要联接人行、银联、外管等机构，以及众多企事业单位，满足更加多样和复杂的通信协议、通信方式、报文格式、处理方式的要求。

根据银行内部和外部联接的要求，需实现的通信方式多种多样，包括同步短连接、异步短连接、异步长连接等，形形色色的连接方式不但在开发新产品时要花费较多的时间解决通信问题，也使后期运行和维护工作变得更加复杂。

同时，目前行业内还存在很多其他的通信方式和通信协议，包括一些中间件应用和衍生协议，其中一部分由于应用较广，已经成为事实上的行业技术标准，如Ftp、Http、Https、WebService、Tuxedo、CICS、MQ等，如何增加对这些新的协议的支持，不但关乎现有产品的改造，还涉及新产品的开发。

如果为每一个产品都单独开发，增加多种协议的支持，由此带来的工作将非常繁琐，运维也非常困难，运行风险此起彼伏。

2 产品目标基于银行IT应用系统在内部互联和外部联接方面出现的联接复杂化和需求多样化的需求，苏州东润以多年的行业技术积累和应用经验为基础，采用全新设计理念，突破关键技术，开发了东润E-T op前置应用平台1.0版本。

该平台是解决银行系统内部和外部的通信问题的一个统一框架，它是一个完整的应用系统，是一个即可面向开发人员也可以面向非技术业务人员的一个集开发、部署、运行平台为一体的通讯平台。

前置应用平台建立在Spring 核心思想之上，引入高度灵活的参数化配置功能，可以对行内通信以及第三方通信涉及的通信方式、通信报文等进行详细设定，从而实现端对端的通信转换服务。

同时，平台具有全面的开放性和适应性，为支持新的通信协议以及实现中间业务平台保留了灵活方便的扩展接口。