High Performance Computing Accelerators AcceleratorPublic_Nov07_v11

RFProElectromagnetic (EM)–Circuit co-simulation environment for RF circuit designersIntroductionKeysight RFPro is an EM (electromagnetic) design environment for RF circuit designers. It automates EM-circuit co-simulation to account for EM effects on RF circuit performance in 3D IC layouts, packaging, interconnects, transitions, and PCB boards. RFPro enables interactive access to EM analysis for tuning and optimization of RF circuits during design just like circuit simulators.Figure 1. RFPro automates EM-circuit co-simulation for interactive tuning and optimization to account for EM effects of physical structures on RF circuit performance in RF Modules, RFICs, MMICs and RF Boards.Using these tools to eliminate one design spin in the fab can save us $1.5M in expenses and14 months of development time.Keysight High Frequency Technology Center R&DRFPro Capabilities for RF Circuit Designers Integration•IC and packaging EM-circuit analysis in single environment with interactive 3D view•Same interface for Keysight ADS, Cadence Virtuoso, Synopsys Design Compiler & Mentor Tanner •Preserves OpenAccess (OA) design database integrity with no need for file translations•Maintains full traceability of EM data origin from design changes and simulator usedSolver•Full 3D FEM and planar 3D Momentum solvers from same environment•Automatic expert setup of EM and EM-circuit analysis ensures trustworthy results•Sweep physical and electrical parameters easily from same environment•Same interface to launch HFSS solverLayout•Interactive EM simulation on any section of layout without manual isolation (“cookie cut”).•No need to manually extract EM and circuit components for separate simulation.•Automatic data stitching of EM ports to circuit nodes for error free EM-circuit co-simulation. RFPro Application ExamplesHere are some current application examples that RFPro and ADS are deployed to develop complex multi-technology designs that must consider EM effects of the physical structure along with circuit component behavior to make them work.Complex RF Module andEvaluation BoardFigure 2. RFPro preserves designdatabase integrity and traceability toany design changes because nomanual “cookie-cutting” and exportingto a separate EM simulator is needed.Keysight ADS enables error-freeassembly and 3D routing of complexmulti-technology RF module, includingits PCB eval board for in-situ EM-circuitsimulation by RFPro.5G/6G Antenna-Circuit InteractionsFigure 3. Nonlinear circuit excitation of integrated phased array antenna in RF module analyzes impedance change vs. beam scan angle in RFPro EM-circuit co-simulation.60GHz WiGig Wafer Level Packaging with Integrated AntennaFigure 4. Multi-technology 60 GHz WiGig module with beam forming IC, 3D feed network and phased array antenna packaging are assembled in ADS for EM analysis of any chosen RF signal paths with RFPro automatic net extraction.Acknowledgement:Designed by Fraunhofer Institute and fabricated by Global Foundries.MEMs switch and Evaluation BoardFigure 5. Ultra-low loss MEMs switch integratedonto PCB evaluation board with dimensionsranging from microns to centimeters is efficientlymeshed and accurately simulated with RFPro toachieve one-pass success.Acknowledgment: Designed and fabricated byMenloMicro.Complex RF Module AssemblyFigure 6. Complex multi-technology RF modulecontaining RFICs,MMICs, packaging,laminates, antennas, andPCBs are assembled inAdvanced Design System(ADS) for RFPro EMsimulation of any selectedRF paths withouttraditional manual“cookie-cutting.”Keysight enables innovators to push the boundaries of engineering by quickly solving design, emulation, and test challenges to create the best product experiences. Start your innovation journey at .This information is subject to change without notice. © Keysight Technologies, 2018 – 2023, Published in USA, March 31, 2023, 5992-3333ENRFPro Product ConfigurationsFigure 7. RFPro includes Full 3D FEM and Planar 3D Momentum solvers launched through an intelligent RFPro UI to automate EM-circuit analysis. EM parallel high performance computing accelerators can be added to speed up simulation from 5x to 20x. HFSS link enables HFSS as a solver (separate license required).RFPro Bundles and Element as upgrades for Momentum, HFSS, Virtuoso, Custom Compiler and Tanner users•RFPro bundles along with powerful ADS multi-technology 3D assembly layout for RF modules and RF packaging:o W3604B PathWave ADS Core, EM Design, Layout, RFProo W3606B PathWave ADS Core, EM Design, Layout, RFPro, RF Ckt Sim o W3607B PathWave ADS Core, EM Design, Layout, RFPro, RF Ckt Sim, Sys-Ckt Verificationo W3608B PathWave ADS Core, EM Design, Layout, RFPro, RF Ckt Sim, Sys-Ckt Verification, VTBs o W3615B PathWave ADS Core, EM Design Core, Layout, RFPro, HB • RFPro element W3030E shown in Figure 6 is purchased as an add-on element to an existing ADS, Virtuoso, or Custom Compiler environment•RFPro EM HPC accelerator W3039E enables parallel EM simulation to speed up analysis. Multiple accelerators can be added to increase speedup from 5x to 20x depending on nature of problem.Take the Next Step with RFProFor more information or to request a free trial of RFPro and ADS, visit • https:///zz/en/lib/resources/software-releases/whats-new-in-rf-microwave.html • https:///products/W3030E。

Cortex-A53处理器简介The Cortex-A53 processor is ARM's most efficient application processor ever, delivering today's mainstream smartphone experience in a quarter of the power in the respective process nodes.The Cortex-A53 extremely power efficient ARMv8 processor is capable of supporting 32-bit ARMv7 code and 64-bit code in the AArch64 execution state. It delivers more performance at higher power efficiency than the Cortex-A7 processor, and is capable of being deployed as a standalone main applications processor or as a companion to Cortex-A57 in a big.LITTLE processor.The Cortex-A53 processor can be implemented individually or paired with the Cortex-A57 processor in a big.LITTLE configuration for optimum performance, scalability and energy efficiency.图1.Cortex-A53处理器图片为什么选择Cortex-A53处理器Using ARM's big.LITTLE technology the Cortex-A53 processor will efficiently run your connected life. This connected life will notjust be the social media, news and email updates that you receive today, but will also enable devices to be contextually aware and connect to the Internet of things. Contextual awareness is already happening in smartphones today, but with the Cortex-53 processor's ultra efficiency will allow your smartphone to use its sensor information, calendar, contact information and location-based services to provide relevant information.The Cortex-A53 processor∙Ca n deliver the compute power of today’s high-end smartphone, in lowest power and area footprint, enabling all-day batterylife for typical device uses∙Eficiently run legacy ARM 32-bit applications∙Features cache coherent interoperability with ARM Mali family graphics processing units (GPUs) for GPU compute applications ∙Offers optional reliability and scalability features for high-performance enterprise applications∙Connects seamlessly to ARMs interconnect with up to 16 cores configurations with more in the futureCortex-A53处理器性能The Cortex-A53 processor delivers significantly more performance than its predecessors at a higher level of power efficiency, effectively taking the performance of the LITTLE core above that of the Cortex-A9 processor, which defines today's high-end mobile platforms.The performance graph below shows measured results on Cortex-A9 and early Cortex-A7 test platforms. The results are projected to deliver performance in a quad-core configuration on a "rate" benchmark that tests integer and some floating-point performance with a mix of large and medium data sets. These stress the memory system of each CPU andthe L2 cache. The "rate" portion of the benchmark duplicates the same code on the 2nd, 3rd, and 4th CPUs in each system, and measures the delivered aggregate performance. Rate benchmarks like this evaluate the ability of the multi-processing system to handle memory traffic and coherence requirements in a multiprocessing context.图2.The Cortex-A53 is able to deliver more performance than Cortex-A9 systems of comparable speed on this benchmark. The performance graph below shows measure results running various Android benchmarks on dual-core Cortex-A9, dual-core Cortex-A7, and projected results on dual-core Cortex-A53 platforms based on measured uplift vs. Cortex-A7 on similar types of code. The results show that Cortex-A53 delivers comparable but slightly lower performance relative to Cortex-A9 running at the same frequency, while Cortex-A53 delivers higher performance than Cortex-A9 at the same frequency.表1.* Estimated** Provisonal图3. Cortex-A53处理器产品规格Cortex-A53处理器相关产品The Cortex-A53 MPCore processor incorporates a broad range of ARM technology including System IP, Physical IP, and development tools that also provide support. A broad range of SoC and software designsolutions, tools and services from the ARM Connected Community compliment this technology. That provides ARM Partners with a smooth path through the development, verification and production of full function, compelling devices while significantly reducing time-to-market.系统 IPThe ARM interconnect and memory controller IP addresses the critical challenge of efficiently moving and storing data between up to 16 Cortex-A50 MPCore processors, high performance media processors and dynamic memories to optimize the system performance and power consumption of the SoC. The CoreLink system IP enables SoC designers to maximize the utilization of system memory bandwidth and reduce static and dynamic latencies. While the ARM CoreSight technology provides complete on-chip debug and correlated, real-time trace visibility for all cores of the Cortex-A53 MPCore processor, reducing risk and speeding development of high quality multiprocessing software. The new AMBA 4 Cache Coherent Network (CCN) provides Optimum system bandwidth and latency. The CCN provides AMBA 4 AXI Coherency Extensions (ACE) compliant ports for full coherency between multiple Cortex-A53 MPCore processors, better utilizing caches and simplifying software development. This feature is essential for high bandwidth applications including gaming, servers and networking that require clusters of coherent single and multicore processors. Combined with the ARM CoreLink network interconnect and memory controller IP, the CCN increases system performance and power efficiency.物理 IPARM Physical IP Platforms deliver process optimized IP, for best-in-class implementations of the Cortex-A53 processor at 40nm and below.A set of high performance Optimization Packs (POP) containing advanced ARM Physical IP for 28nm technologies supports the Cortex-A53, to enabling rapid development of leadership physical implementations. ARM is also working early to assure a roadmap to20nm optimizations. Optimization packs support ARM’s strategy of offering specifically targeted Physical IP to enable Partners to achieve tuned implementations of ARM cores. ARM is uniquely able to design the optimization packs in parallel with the Cortex-A53 MPCoreprocessor architecture, enabling the processor and physical IP combination to deliver workstation class performance in a mobilepower envelope while facilitating rapid time-to-market.工具支持The ARM Development Suite 5 (DS-5) tool suite fully supports all ARM processors as well as a wide range of third party tools, operating systems and EDA flows. ARM DS-5 software development tools are unique in their ability to provide solutions that take full advantage of the complete ARM technology portfolio. The ARM Development Studio 5 (DS-5) provides a complete range of software tools to create, debug and optimize systems based on the Cortex-A53 MPCore processor. It incorporates the DS-5 Debugger, whose powerful and intuitivegraphical environment enables fast debugging of bare metal, Linux and Android native applications. In addition, its new ARM Streamline Performance Analyzer simplifies the identification of hot spots in software and load balancing between cores. The ARM Compiler, which already includes specific optimizations for the Cortex-A15 MPCore processor, enables early software development before silicon availability and an ARM Versatile Reference Virtual Platform built on ARM Fast Models technology. This Virtual Platform is available for a free 6-month evaluation.图形处理器The Mali family of products combine to provide the complete graphics stack for all embedded graphics needs, enabling device manufacturers and content developers to deliver the highest quality, cutting edge graphics solutions across the broadest range of consumer devices.支持ARM training courses and Active Assist on-site system-design advisory services enable licensees to integrate efficiently the Cortex-A53 MPCore processor into their design to realize maximum system performance with lowest risk and fastest time-to-market.推荐阅读：∙ARM Cortex-A57与Cortex-A53整体概述摘要：新款ARMv8架构ARM Cortex-A50处理器系列产品，进一步扩大ARM在高性能与低功耗领域的领先地位。

中国各类科研基金项目中英文翻译名称写法国家自然科学基金委员会基金项目中英文名称翻译国家自然科学基金National Natural Science Foundation of China 国家自然科学基金重大项目Major Program of National Natural Science Foundation of China国家自然科学基金重点项目the State Key Program of National Natural Science Foundation of China国家自然科学基金国际合作与交流项目Projects of International Cooperation and Exchanges NSFC国家杰出青年科学基金National Natural Science Funds for Distinguished Young Scholar海外及香港、澳门青年学者合作研究基金Joint Research Fund for Overseas Chinese, Hong Kong and Macao Young Scholars国家自然科学基金重大研究计划the Major Research plan of the National Natural Science Foundation of China科技部基金项目中英文翻译国家科技部基金State Commission of Science Technology of China （科委）Ministry of Science and Technology of China国家重点基础研究发展规划项目 (973计划项目) National Key Basic Research Program of China (973 Program)国家高技术研究发展计划(863计划)National High Technology Research and Development Program of China国家重大新药创制项目National Major Scientific and Technological Special Project for “Significant New Drugs Development”“十二五”国家科技支撑计划重点项目” Key Projects in the National Science & Technology Pillar Program during the Twelfth Five-year Plan Period“重大新药创制”科技重大专项“十二五”计划National Major Scientific and TechnologicalSpecial Project for “Significant New Drugs Development” during the Twelfth Five-year Plan Period国科技部“十一五”科技计划项目：The National Key Technology R&D Program国家科技攻关计划National Key Technologies R & D Program of China “十一五”国家科技支撑计划（原科技攻关计划）：The National Key Technology R&D Program国家重大科学工程二期工程基金National Important Project on Science-Phase Ⅱof NSRL国家攀登计划—B课题National Climb—B Plan国家985重点建设项目Key Construction Program of the National “985” Project“九五”攻关项目National Key Technologies R & D Program of China during the 9th Five-Year Plan Period国家基础研究计划National Basic Research Priorities Program ofChina;国家攀登计划—B课题资助National Climb—B Plan国家重大科学工程二期工程基金资助National Important Project on Science-Phase Ⅱof NSRL国家科技部攀登计划二号重点项目基金a Grant for Key Research Items No.2 in “Climbing” Program from the Ministry of Science and Technology of China国家科技部攀登计划重点研究项目基金a Grant for Key Research Items in “Climbing” Program from the Ministry of Science and Technology of China国家攀登计划(纳米晶体材料)the National “Climbing”Program for Nanocrystalline Materials, China国家攀登计划the National“Climbing”Program of China国家攀登计划基础研究the National Basic Res earch in “Climbing” Program of China科技部重大基础研究前期研究专项基金the Special Program for Key Basic Research of the Ministry of Science and Technology,China国家国防基金the National Defense Foundation of China国防预研究基金the National Defense Pre-Research Foundation of China国家核科学基金the Nuclear Science Foundation of China核工业科学基金Science Foundation of Chinese Nuclear Industry 国家创新研究群体科学基金the Funds for Creative Research Groups of China 国家高技术项目联合基金the National High Technology Joint Research Program of China国家高技术研究发展计划(863)新材料领域the National High Technology Research and Development Program for Advanced Materials of China国家高技术研究发展计划(863)惯性约束聚变领域the National High Technology Research and Development Program for Inertial Confinement Fusion of China国家高性能计算基金the National High Performance Computing Foundation of China国家基础研究“非线性科学”基金the National Basic Research Foundation for “Nonlinear Science” of China政策引导类科技计划及专项基金星火计划：China Spark Program火炬计划：Chinatorch Program国家重点新产品计划：The National New Products Program国家软科学研究计划：The National Soft Science Research Program教育部资助的基金“长江学者奖励计划”the Cheung Kong Scholars Programme of China国家教育部科学基金资助Science Foundation of Ministry of Education of China教育部科学技术研究重点(重大)项目资助Key (Key grant) Project of Chinese Ministry of Education国家教育部博士点基金资助项目Ph.D. Programs Foundation of Ministry of Education of China高等学校博士学科点专项科研基金Research Fund for the Doctoral Program of Higher Education of China (缩写RFDP)国家教育部博士点专项基金资助Doctoral Fund of Ministry of Education of China 国家教育部回国人员科研启动基金资助Scientific Research Foundation for Returned Scholars, Ministry of Education of China国家教育部留学回国人员科研启动金Scientific Research Foundation for the Returned Overseas Chinese Scholars, State Education Ministry (SRF for ROCS, SEM)霍英东教育基金会青年教师基金资助the Fok Ying-Tong Education Foundation, China跨世纪优秀人才计划国家教委《跨世纪优秀人才计划》基金Trans-Century Training Programme Foundation for the Talents by the State Education Commission 国家教育部优秀青年教师资助计划Excellent Young Teachers Program of MOE高等学校骨干教师资助计划Foundation for University Key Teacher by the Ministry of Education of China中央高校基本科研业务费专项资金资助the Fundamental Research Funds for the Central Universities人事部基金项目中国博士后科学基金China Postdoctoral Science Foundation千人计划The Recruitment Program of Global Experts中国科学院各类基金中国科学院基金Science Foundation of The Chinese Academy ofSciences中国科学院九五重大项目Major Subject of The Chinese Academy of Sciences 中国科学院院长基金特别Special Foundation of President of The Chinese Academy of Sciences中国科学院国际合作局重点项目Bureau of International Cooperation, The Chinese Academy of Sciences中国科学院百人计划经费100 Talents Programme of The Chinese Academy of SciencesOne Hundred Person Project of The Chinese Academy of Sciences中国科学院知识创新工程重大项目Knowledge Innovation Project of The Chinese Academy of SciencesKnowledge Innovation Program of The Chinese Academy of Sciences中国科学院西部之光基金West Light Foundation of The Chinese Academy of Sciences中国科学院上海分院择优资助项目(No. )This work was supported by a grant from Advanced Programs of Shanghai Branch, the Chinese Academy of Sciences教育部及国家重点实验室及开放基金教育部磁学与磁性材料重点实验室the Key Laboratory for Magnetism and Magnetic Material of the Education Ministry of China教育部量子光学重点实验室the Key Laboratory of Quantum Optics, Ministry of Education, China教育部留学回国人员科研启动基金the Scientific Research Starting Foundation for Returned Overseas Chinese Scholars, Ministry of Education ,China教育部重大项目基金Project the Research Foundation from Ministry of Education of China 空间研究基金the Aerospace Research Foundation of China人工微结构和介观物理国家重点实验室the State Key Laboratory for ArtificialMicrostructure and Mesoscopic Physics, Peking University, Beijing, China国家重点实验室(光技术应用于微加工实验室)，上海光学及电子研究所the State Key Laboratory of Optical Technology for Micro-fabrication, Shanghai Institute of Optics and Electronics, China北京正负电子对撞机国家实验室重点课题BEPC National Laboratory兰州重离子加速器国家实验室原子核理论中心基金Center of Theoretical Nuclear Physics, National Laboratory of Heavy Ion Accelerator of Lanzhou其它省部及地方科学基金资助项目中英文翻译对照广州市科技计划项目Science and Technology Program of Guangzhou, China对外科技合作项目（国际科技项目）International Science & Technology Cooperation Program产业技术研究与开发资金项目Industrial Technology Research and Development Funds海峡两岸自然科学基金Science Foundation of Two sides of Strait广东省自然科学基金National Natural Science Foundation of Guangdong, China广东省高等学校珠江学者岗位计划资助项目Project Supported by Guangdong Province Universities and Colleges Pearl River Scholar Funded Scheme广东高校优秀青年创新人才培养计划（育苗工程）项目Foundation for Distinguished Young Talents in Higher Education of Guangdong, China广东省教育厅高等学校高层次人才项目Foundation for High-level Talents in Higher Education of Guangdong, China广东省教育部产学研结合重大科技专项项目Special Project on the Integration of Industry, Education and Research of Guangdong Province北京市自然科学基金Beijing Municipal Natural Science Foundation 上海市科技启明星计划Shanghai Science and Technology Development Funds日本科学技术厅科学家交流项目Japan STA Scientist Exchange Program黑龙江省自然科学基金Natural Science Foundation of Heilongjiang Province of China湖北省教育厅重点项目Educational Commission of Hubei Province of China 河南省杰出青年基金（9911）Excellent Youth Foundation of He’nan Scientific Committee河南省教育厅基金Foundation of He’nan Educatio nal Committee山西省青年科学基金Shanxi Province Science Foundation for Youths 山西省归国人员基金Shanxi Province Foundation for Returness江苏省科委应用基础基金资助项目This work was supported by a grant from theApplied Basic Research Programs of Science and Technology Commission Foundation of Jiangsu Province天津大学自主创新基金Supported by Seed Foundation of Tianjin University天津市科技支撑计划the key technologies R & D program of Tianjin 华北电力大学青年科研基金Youth Foundation of North-China Electric Power University华中师范大学自然科学基金Natural Science Foundation of Central China Normal University东南大学基金Foundation of Southeast of University西南交通大学基础学科研究基金Foundation Sciences Southwest Jiaotong University。

计算机术语大全1、CPU3DNow!（3D no waiting，无须等待的3D处理）AAM（AMD Analyst Meeting，AMD分析家会议）ABP（Advanced Branch Prediction，高级分支预测）ACG（Aggressive Clock Gating，主动时钟选择）AIS（Alternate Instruction Set，交替指令集）ALA T（advanced load table，高级载入表）ALU（Arithmetic Logic Unit，算术逻辑单元）Aluminum（铝）AGU（Address Generation Units，地址产成单元）APC（Advanced Power Control，高级能源控制）APIC（Advanced rogrammable Interrupt Controller，高级可编程中断控制器）APS（Alternate Phase Shifting，交替相位跳转）ASB（Advanced System Buffering，高级系统缓冲）A TC（Advanced Transfer Cache，高级转移缓存）A TD（Assembly Technology Development，装配技术发展）BBUL（Bumpless Build-Up Layer，内建非凹凸层）BGA（Ball Grid Array，球状网阵排列）BHT（branch prediction table，分支预测表）Bops（Billion Operations Per Second，10亿操作秒）BPU（Branch Processing Unit，分支处理单元）BP（Brach Pediction，分支预测）BSP（Boot Strap Processor，启动捆绑处理器）BTAC（Branch Target Address Calculator，分支目标寻址计算器）CBGA (Ceramic Ball Grid Array，陶瓷球状网阵排列)CDIP (Ceramic Dual-In-Line，陶瓷双重直线)Center Processing Unit Utilization，中央处理器占用率CFM（cubic feet per minute，立方英尺秒）CMT（course-grained multithreading，过程消除多线程）CMOS（Complementary Metal Oxide Semiconductor，互补金属氧化物半导体）CMOV（conditional move instruction，条件移动指令）CISC（Complex Instruction Set Computing，复杂指令集计算机）CLK（Clock Cycle，时钟周期）CMP（on-chip multiprocessor，片内多重处理）CMS（Code Morphing Software，代码变形软件）co-CPU（cooperative CPU，协处理器）COB（Cache on board，板上集成缓存，做在CPU卡上的二级缓存，通常是内核的一半速度））COD（Cache on Die，芯片内核集成缓存）Copper（铜）CPGA（Ceramic Pin Grid Array，陶瓷针型栅格阵列）CPI（cycles per instruction，周期指令）CPLD（Complex Programmable Logic Device，複雜可程式化邏輯元件）CPU（Center Processing Unit，中央处理器）CRT（Cooperative Redundant Threads，协同多余线程）CSP（Chip Scale Package，芯片比例封装）CXT（Chooper eXTend，增强形K6-2内核，即K6-3）Data Forwarding（数据前送）dB（decibel，分贝）DCLK（Dot Clock，点时钟）DCT（DRAM Controller，DRAM控制器）DDT（Dynamic Deferred Transaction，动态延期处理）Decode（指令解码）DIB（Dual Independent Bus，双重独立总线）DMT（Dynamic Multithreading Architecture，动态多线程结构）DP（Dual Processor，双处理器）DSM（Dedicated Stack Manager，专门堆栈管理）DSMT（Dynamic Simultaneous Multithreading，动态同步多线程）DST（Depleted Substrate Transistor，衰竭型底层晶体管）DTV（Dual Threshold V oltage，双重极限电压）DUV（Deep Ultra-Violet，纵深紫外光）EBGA（Enhanced Ball Grid Array，增强形球状网阵排列）EBL（electron beam lithography，电子束平版印刷）EC（Embedded Controller，嵌入式控制器）EDB（Execute Disable Bit，执行禁止位）EDEC（Early Decode，早期解码）Embedded Chips（嵌入式）EM64T（Extended Memory 64 Technology，扩展内存64技术）EPA（edge pin array，边缘针脚阵列）EPF（Embedded Processor Forum，嵌入式处理器论坛）EPL（electron projection lithography，电子发射平版印刷）EPM（Enhanced Power Management，增强形能源管理）EPIC（explicitly parallel instruction code，并行指令代码）EUV（Extreme Ultra Violet，紫外光）EUV（extreme ultraviolet lithography，极端紫外平版印刷）FADD（Floationg Point Addition，浮点加）FBGA（Fine-Pitch Ball Grid Array，精细倾斜球状网阵包装）FBGA（flipchip BGA，轻型芯片BGA）FC-BGA（Flip-Chip Ball Grid Array，翻转芯片球形网阵包装）FC-LGA（Flip-Chip Land Grid Array，翻转接点网阵包装）FC-PGA（Flip-Chip Pin Grid Array，翻转芯片球状网阵包装）FDIV（Floationg Point Divide，浮点除）FEMMS：Fast EntryExit Multimedia State，快速进入退出多媒体状态FFT（fast Fourier transform，快速热欧姆转换）FGM（Fine-Grained Multithreading，高级多线程）FID（FID：Frequency identify，频率鉴别号码）FIFO（First Input First Output，先入先出队列）FISC（Fast Instruction Set Computer，快速指令集计算机）flip-chip（芯片反转）FLOPs（Floating Point Operations Per Second，浮点操作秒）FMT（fine-grained multithreading，纯消除多线程）FMUL（Floationg Point Multiplication，浮点乘）FPRs（floating-point registers，浮点寄存器）FPU（Float Point Unit，浮点运算单元）FSUB（Floationg Point Subtraction，浮点减）GFD（Gold finger Device，金手指超频设备）GHC（Global History Counter，通用历史计数器）GTL（Gunning Transceiver Logic，射电收发逻辑电路）GVPP（Generic Visual Perception Processor，常规视觉处理器）HL-PBGA表面黏著,高耐热、轻薄型塑胶球状网阵封装HTT（Hyper-Threading Technology，超级线程技术）Hz（hertz，赫兹，频率单位）IA（Intel Architecture，英特尔架构）IAA（Intel Application Accelerator，英特尔应用程序加速器）IA TM（Intel Advanced Thermal Manager，英特尔高级热量管理指令集）ICU（Instruction Control Unit，指令控制单元）ID（identify，鉴别号码）IDF（Intel Developer Forum，英特尔开发者论坛）IDMB（Intel Digital Media Boost，英特尔数字媒体推进指令集）IDPC（Intel Dynamic Power Coordination，英特尔动态能源调和指令集）IEU（Integer Execution Units，整数执行单元）IHS（Integrated Heat Spreader，完整热量扩展）ILP（Instruction Level Parallelism，指令级平行运算）IMM Intel Mobile Module, 英特尔移动模块Instructions Cache，指令缓存Instruction Coloring（指令分类）IOPs（Integer Operations Per Second，整数操作秒）IPC（Instructions Per Clock Cycle，指令时钟周期）ISA（instruction set architecture，指令集架构）ISD（inbuilt speed-throttling device，内藏速度控制设备）ITC（Instruction Trace Cache，指令追踪缓存）ITRS（International Technology Roadmap for Semiconductors，国际半导体技术发展蓝图）KNI（Katmai New Instructions，Katmai新指令集，即SSE）Latency（潜伏期）LDT（Lightning Data Transport，闪电数据传输总线）LFU（Legacy Function Unit，传统功能单元）LGA（land grid array，接点栅格阵列）LN2（Liquid Nitrogen，液氮）Local Interconnect（局域互连）MAC（multiply-accumulate，累积乘法）mBGA (Micro Ball Grid Array，微型球状网阵排列)nm（namometer，十亿分之一米毫微米）MCA（Machine Check Architecture，机器检查架构）MCU（Micro-Controller Unit，微控制器单元）MCT（Memory Controller，内存控制器）MESI（Modified, Exclusive, Shared, Invalid：修改、排除、共享、废弃）MF（MicroOps Fusion，微指令合并）mm（micron metric，微米）MMX（MultiMedia Extensions，多媒体扩展指令集）MMU（Multimedia Unit，多媒体单元）MMU（Memory Management Unit，内存管理单元）MN（model numbers，型号数字）MFLOPS（Million Floationg PointSecond，每秒百万个浮点操作）MHz（megahertz，兆赫）mil（PCB 或晶片佈局的長度單位，1 mil = 千分之一英寸）MIMD（Multi Instruction Multiple Data，多指令多数据流）MIPS（Million Instruction Per Second，百万条指令秒）MOESI（Modified, Owned, Exclusive, Shared or Invalid，修改、自有、排除、共享或无效）MOF（Micro Ops Fusion，微操作熔合）Mops（Million Operations Per Second，百万次操作秒）MP（Multi-Processing，多重处理器架构）MPF（Micro processor Forum，微处理器论坛）MPU（Microprocessor Unit，微处理器）MPS（MultiProcessor Specification，多重处理器规范）MSRs（Model-Specific Registers，特别模块寄存器）MSV（Multiprocessor Specification V ersion，多处理器规范版本）MVP（Mobile V oltage Positioning，移动电压定位）IVNAOC（no-account OverClock，无效超频）NI（Non－Intel，非英特尔）NOP（no operation，非操作指令）NRE（Non-Recurring Engineering charge，非重複性工程費用）OBGA（Organic Ball Grid Arral，有机球状网阵排列）OCPL（Off Center Parting Line，远离中心部分线队列）OLGA（Organic Land Grid Array，有机平面网阵包装）OoO（Out of Order，乱序执行）OPC（Optical Proximity Correction，光学临近修正）OPGA（Organic Pin Grid Array，有机塑料针型栅格阵列）OPN（Ordering Part Number，分类零件号码）PA T（Performance Acceleration Technology，性能加速技术）PBGA（Plastic Pin Ball Grid Array，塑胶球状网阵排列）PDIP (Plastic Dual-In-Line，塑料双重直线)PDP（Parallel Data Processing，并行数据处理）PGA（Pin-Grid Array，引脚网格阵列）,耗电大PLCC (Plastic Leaded Chip Carriers，塑料行间芯片运载)Post-RISC（加速RISC，或后RISC）PPE（Power Processor Element，Power处理器元件）PPU（Physics Processing Unit，物理处理单元）PR（Performance Rate，性能比率）PIB（Processor In a Box，盒装处理器）PM（Pseudo-Multithreading，假多线程）PPGA（Plastic Pin Grid Array，塑胶针状网阵封装）PQFP（Plastic Quad Flat Package，塑料方块平面封装）PSN（Processor Serial numbers，处理器序列号）QFP（Quad Flat Package，方块平面封装）QSPS（Quick Start Power State，快速启动能源状态）RAS（Return Address Stack，返回地址堆栈）RAW（Read after Write，写后读）REE（Rapid Execution Engine，快速执行引擎）Register Contention（抢占寄存器）Register Pressure（寄存器不足）Register Renaming（寄存器重命名）Remark（芯片频率重标识）Resource contention（资源冲突）Retirement（指令引退）RISC（Reduced Instruction Set Computing，精简指令集计算机）ROB（Re-Order Buffer，重排序缓冲区）RSE（register stack engine，寄存器堆栈引擎）RTL（Register Transfer Level，暫存器轉換層。