FDPF13N50FT中文资料
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Drain to Source Breakdown Voltage Breakdown Voltage Temperature Coefficient
IDSS
Zero Gate Voltage Drain Current
IGSS
Gate to Body Leakage Current
ID = 250µA, VGS = 0V, TJ = 25oC
FDP13N50F FDPF13N50FT
0.65
3.0
0.5
-
62.5
62.5
Units oC/W
©2007 Fairchild Semiconductor Corporation
1
FDP13N50F / FDPF13N50FT Rev. A
FDP13N50F / FDPF13N50FT N-Channel MOSFET
100
150oC
25oC 10
*Notes:
1. VGS = 0V
2. 250µs Pulse Test 1
0.0
0.5
1.0
1.5
2.0
2.5
VSD, Body Diode Forward Voltage [V]
5.5 V
ID,Drain Current[A]
RDS(ON) [Ω], Drain-Source On-Resistance
*Notes:
1. 250µs Pulse Test
2. TC = 25oC
1
1
10
20
VDS,Drain-Source Voltage[V]
Figure 3. On-Resistance Variation vs. Drain Current and Gate Voltage
Ciss 1500
*Note: 1. VGS = 0V 2. f = 1MHz
Crss
0
0.1
1
10
30
VDS, Drain-Source Voltage [V]
Capacitances [pF]
VGS, Gate-Source Voltage [V]
IS, Reverse Drain Current [A]
VGS = VDS, ID = 250µA VGS = 10V, ID = 6A VDS = 20V, ID = 6A
3.0
-
(Note 4)
-
Dynamic Characteristics
Ciss Coss Crss Qg(tot) Qgs
Qgd
Input Capacitance Output Capacitance Reverse Transfer Capacitance Total Gate Charge at 10V Gate to Source Gate Charge
元器件交易网
FDP13N50F / FDPF13N50FT N-Channel MOSFET
FDP13N50F / FDPF13N50FT
N-Channel MOSFET
500V, 12A, 0.54Ω
Features
• RDS(on) = 0.42Ω ( Typ.)@ VGS = 10V, ID = 6A • Low gate charge ( Typ. 30nC) • Low Crss ( Typ. 14.5pF) • Fast switching • 100% avalanche tested • Improved dv/dt capability • RoHS compliant
-
-
10 100 ±100
V V/oC
µA nA
5.0
V
0.54
Ω
-
S
1930 pF
265 pF
22
pF
39
nC
-
nC
-
nC
65
ns
120
ns
160
ns
105
ns
12
A
48
A
1.5
V
-
ns
-
µC
FDP13N50F / FDPF13N50FT Rev.
2
元器件交易网
VDD = 250V, ID = 13A RG = 25Ω
-
-
-
(Note 4, 5)
-
Drain-Source Diode Characteristics
IS ISM VSD trr Qrr
Notes:
Maximum Continuous Drain to Source Diode Forward Current
Gate to Drain “Miller” Charge
VDS = 25V, VGS = 0V f = 1MHz
VDS = 400V, ID = 13A VGS = 10V
-
(Note 4, 5)
-
Switching Characteristics
td(on) tr td(off) tf
Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt Power Dissipation
(TC = 25oC) - Derate above 25oC
TJ, TSTG TL
Operating and Storage Temperature Range Maximum Lead Temperature for Soldering Purpose, 1/8” from Case for 5 Seconds
*Drain current limited by maximum junction temperature
Thermal Characteristics
FDP13N50F FDPF13N50FT
500
±30
12
12*
7.2
7.2*
(Note 1)
48
48*
(Note 2)
684
(Note 1)
12
元器件交易网
Package Marking and Ordering Information TC = 25oC unless otherwise noted
Device Marking FDP13N50F
Device FDP13N50F
Package TO-220
Reel Size -
Drain to Source Voltage
Gate to Source Voltage Drain Current Drain Current
-Continuous (TC = 25oC) -Continuous (TC = 100oC)
- Pulsed
Single Pulsed Avalanche Energy
FDP13N50F / FDPF13N50FT N-Channel MOSFET
Typical Performance Characteristics
Figure 1. On-Region Characteristics
30 VGS = 15.0 V
10.0 V
8.0 V
7.0 V
6.5 V
10
6.0 V
Maximum Pulsed Drain to Source Diode Forward Current
Drain to Source Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge
VGS = 0V, ISD = 12A
VGS = 0V, ISD = 12A dIF/dt = 100A/µs
1. Repetitive Rating: Pulse width limited by maximum junction temperature
2. L = 9.5mH, IAS = 12A, VDD = 50V, RG = 25Ω, Starting TJ = 25°C 3. ISD ≤ 12A, di/dt ≤ 200A/µs, VDD ≤ BVDSS, Starting TJ = 25°C 4. Pulse Test: Pulse width ≤ 300µs, Duty Cycle ≤ 2%
ID,Drain Current[A]
Figure 2. Transfer Characteristics
50 *Notes: 1. VDS = 20V 2. 250µs Pulse Test
10
150oC
25oC
1
3
4
5
6
7
8
VGS,Gate-Source Voltage[V]
Figure 4. Body Diode Forward Voltage Variation vs. Source Current and Temperature
500
ID = 250µA, Referenced to 25oC
-
VDS = 500V, VGS = 0V
-
VDS = 400V, TC = 125oC
-
VGS = ±20V, VDS = 0V
-
On Characteristics
VGS(th) RDS(on) gFS
Gate Threshold Voltage Static Drain to Source On Resistance Forward Transconductance