ZXT2M322TA;中文规格书,Datasheet资料
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SUMMARY
VCEO= 20V;RSAT= 64m;IC= -3.5A
DESCRIPTION
Packagedintheinnovative2mmx2mmMLP(MicroLeadedPackage)outline,
thisnew4thgenerationlowsaturationtransistorsoffersextremelylowonstate
lossesmakingitidealforuseinDC-DCcircuitsandvariousdrivingandpower
management functions.
Additionally users will also gain several otherkey benefits:
Performance capability equivalent to much larger packages
Improved circuit efficiency & power levels
Lower package height (nom 0.9mm)
PCB area and device placement savings
Reduced component count
FEATURES
•Low Equivalent On Resistance
•Extremely Low Saturation Voltage(-220mV @-1A)
•hFEcharacterised up to -6A
•IC= -3.5A Continuous Collector Current
•2mm x 2mmMLP
APPLICATIONS
•DC - DC Converters (FET Drivers)
•Charging Circuits
•Power switches
•Motor control
ORDERING INFORMATION
DEVICE MARKING
S2ZXT2M322
ISSUE 3 - JANUARY 2007
1MPPS™
Miniature Package Power Solutions20V PNP LOW SATURATION SWITCHING TRANSISTOR
2mm x 2mm SingleMLP
underside viewPINOUTDEVICEREELTAPE
WIDTHQUANTITY
PERREEL
ZXT2M322TA78mm3000
ZXT2M322TC138mm
100002mm x 2mmMLP
(single die)
BC
E
http://oneic.com/ZXT2M322
ISSUE 3 - JANUARY 2007
2PARAMETERSYMBOLVALUEUNIT
JunctiontoAmbient(a)RθJA83°C/W
JunctiontoAmbient(b)RθJA51°C/W
JunctiontoAmbient(d)RθJA125°C/W
JunctiontoAmbient(e)RθJA42°C/WTHERMAL RESISTANCE
NOTES
(a) For a single device surface mounted on 10sq cm1oz copper on FR4 PCB in still air conditionswith all exposed pads attached.
(b) For a single device surface mounted on 10sq cm1oz copper on FR4 PCB in still air conditions measured at tр5 secswith all exposed padsattached.
(c) Repetitive rating - pulse width limited by max junction temperature. refer to Transient Thermal Impedance graph.
(d) For a single device surface mounted on 10sq cm1oz copper on FR4 PCB in still air conditionswith minimal lead connections only.
(e) For a single device surface mounted on 65sq cm2oz copper on FR4 PCB in still air conditionswith all exposed pads attached.
(f) The minimum copper dimensions required for mounting are no smaller than the exposed metal pads on the base of the device, as shown inthe package dimensions data. The thermal resistance for a device mounted on 1.5mm thick FR4 board using minimum copper of 1oz weight isRth=300°C/W giving a power rating ofPtot=420mW.PARAMETERSYMBOLLIMITUNIT
Collector-BaseVoltageVCBO-25V
Collector-EmitterVoltageVCEO-20V
Emitter-BaseVoltageVEBO-7.5V
PeakPulseCurrent(c)ICM-6A
ContinuousCollectorCurrent(a)IC-3.5A
BaseCurrentIB-1000mA
PowerDissipationatTA=25°C(a)
LinearDeratingFactorPD1.5
12W
mW/°C
PowerDissipationatTA=25°C(b)
LinearDeratingFactorPD2.45
19.6W
mW/°C
PowerDissipationatTA=25°C(d)
LinearDeratingFactorPD1
8W
mW/°C
PowerDissipationatTA=25°C(e)
LinearDeratingFactorPD3
24W
mW/°C
OperatingandStorageTemperatureRangeTj:Tstg-55 to +150°CABSOLUTE MAXIMUM RATINGS.
http://oneic.com/ZXT2M322
ISSUE 3 - JANUARY 2007
3
0.11100.010.1110
02550751001251500.00.51.01.52.02.53.03.5
100µ1m10m100m1101001k020406080
0.11101000255075100125150175200225
0.11101000.00.51.01.52.02.53.03.5100us100ms1sVCE(SAT)Limited
1ms
SafeOperatingAreaSinglePulse,Tamb=25°CDC
10ms
ICCollectorCurrent(A)
VCECollector-EmitterVoltage(V)1ozCu
Note:a2ozCu
Note:e
DeratingCurveTamb=25°C
MaxPowerDissipation(W)
Temperature(°C)
D=0.2D=0.5
D=0.1
TransientThermalImpedanceSinglePulse
D=0.05
ThermalResistance(°C/W)
PulseWidth(s)
ThermalResistancevBoardArea1ozcopper
2ozcopperThermalResistance(°C/W)
BoardCuArea(sqcm)
1ozcopper2ozcopper
PowerDissipationvBoardAreaTamb=25°C
Tjmax=150°C
Continuous
PDDissipation(W)
BoardCuArea(sqcm)CHARACTERISTICSCHARACTERISTICS
http://oneic.com/ZXT2M322
ISSUE 3 - JANUARY 2007
4PARAMETERSYMBOLMIN.TYP.MAX.UNITCONDITIONS.
Collector-BaseBreakdown
VoltageV(BR)CBO-25-35VIC=-100A
Collector-EmitterBreakdown
VoltageV(BR)CEO-20-25VIC=-10mA*
Emitter-BaseBreakdownVoltageV(BR)EBO-7.5-8.5VIE=-100A
CollectorCut-OffCurrentICBO-25nAVCB=-20V
EmitterCut-OffCurrentIEBO-25nAVEB=-6V
CollectorEmitterCut-OffCurrentICES-25nAVCES=-16V
Collector-EmitterSaturation
VoltageVCE(sat)-19
-170
-190
-240
-225-30
-220
-250
-350
-300mV
mV
mV
mV
mVIC=-0.1A,IB=-10mA*
IC=-1A,IB=-20mA*
IC=-1.5A,IB=-50mA*
IC=-2.5A,IB=-150mA*
IC=-3.5A,IB=-350mA*
Base-EmitterSaturationVoltageVBE(sat)-1.01-1.075VIC=-3.5A,IB=-350mA*
Base-EmitterTurn-OnVoltageVBE(on)-0.87-0.95VIC=-3.5A,VCE=-2V*
StaticForwardCurrentTransfer
RatiohFE300
300
150
15475
450
230
30IC=-10mA,VCE=-2V*
IC=-0.1A,VCE=-2V*
IC=-2A,VCE=-2V*
IC=-6A,VCE=-2V*
TransitionFrequencyfT150180MHzIC=-50mA,VCE=-10V
f=100MHz
OutputCapacitanceCobo2130pFVCB=-10V,f=1MHz
Turn-OnTimet(on)40nsVCC=-10V,IC=-1A
IB1=IB2=10mATurn-OffTimet(off)670nsELECTRICAL CHARACTERISTICS(atTamb= 25°C unless otherwise stated).
*Measured under pulsed conditions. Pulse width=300µs. Duty cycle≤2%
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