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Application Note: SY8079High Efficiency 6.5V, 2A continuous, 3A peak, 1MHz Synchronous Step Down Regulator Preliminary Specification General DescriptionThe SY8079 is a high-efficiency, high frequency synchronous step-down DC-DC regulator IC capable of delivering up to 2A output current. The SY8079 operates over a wide input voltage range from 2.7V to 6.5V and integrates main switch and synchronous switch with very low RDS(ON) to minimize the conduction loss. Low output voltage ripple and small external inductor and capacitor sizes are achieved with greater than 1MHz switching frequency.Features• Low RDS(ON) for internal switches (top/bottom):125mΩ/95mΩ • 2.7-6.5V input voltage range • 2A continuous, 3A peak load current capability • 1MHz switching frequency minimizes the external components • Internal softstart limits the inrush current • 100% dropout operation • RoHS Compliant and Halogen Free • Compact package: SOT23-5Ordering InformationSY8079 □(□□)□ Temperature Code Package Code Optional Spec Code.C onTypical ApplicationsVIN: 2.7-6.5V 4fidenOrdering Number SY8079AACPackage type SOT23-5Notetia l-P re pVOUT: 1.8V C1 22pF COUT 22µFх288• • • • •LCD TV Set Top Box Net PC Mini-Notebook PC Access Point RouterCo rpINLX3 L1:2.2µHCIN 22µFR1 200k 5 R2 100kFBON/ OFFer gy1EN GND 2ar ed96 92 84 80 0.01ApplicationsSilfoEfficiency vs. Load CurrentVIN=3.3V,VOUT=1.8V VIN=4.2V,VOUT=1.8V VIN=5.0V,VOUT=1.8V 0.10 1.00rrye10.00Load Current (A)Figure 1.Schematic diagramFigure 2. Efficiency vs Load CurrentAN_SY8079 Rev. 0.1Silergy Corp. Confidential- Prepared for Customer Use Only 1SY8079Pinout (top view)(SOT23-5)Top Mark: UHxyz (device code: UH, x=year code, y=week code, z= lot number code) Pin Name EN GND LX IN FB Pin Number 1 2 3 4 5 Pin Description Enable control. Pull high to turn on. Do not float. Ground pin. Inductor pin. Connect this pin to the switching node of inductor. Input pin. Decouple this pin to GND pin with at least 10µF ceramic cap. Output Feedback Pin. Connect this pin to the center point of the output resistor divider (as shown in Figure 1) to program the output voltage: Vout=0.6*(1+R1/R2).Supply Input Voltage ------------------------------------------------------------------------------------------------ 2.7V to 6.5V Enable, FB Voltage ------------------------------------------------------------------------------------------------------ VIN+0.3V Junction Temperature Range ------------------------------------------------------------------------------------ -40°C to 125°C Ambient Temperature Range ------------------------------------------------------------------------------------- -40°C to 85°CAN_SY8079 Rev. 0.1Siler gyRecommended Operating Conditions (Note 3)Co rp(Note 1) Supply Input Voltage, LX ----------------------------------------------------------------------------------------- -0.3V to 7.0V All other pins--------------------------------------------------------------------------------------------------------- -0.3V to7.0V Power Dissipation, PD @ TA = 25°C, SOT23-5 -------------------------------------------------------------------------------------------------------------- 0.6W Package Thermal Resistance (Note 2) θ JA --------------------------------------------------------------------------------------------------------------- 170°C/W θ JC ----------------------------------------------------------------------------------------------------------------130°C/W Junction Temperature Range ----------------------------------------- ------------------------------------------ -40°C to 150°C Lead Temperature (Soldering, 10 sec.) ----------------------------------------------------------------------------------- 260°C Storage Temperature Range ------------------------------------------------------------------------------------- -65°C to 150°CAbsolute Maximum Ratings.C onSilergy Corp. Confidential- Prepared for Customer Use Only 2fidentia l-P re par edforryeSY8079Block DiagramAN_SY8079 Rev. 0.1Siler gyCo rp.C onSilergy Corp. Confidential- Prepared for Customer Use Only 3fidentia l-P re par edforryeSY8079Electrical Characteristics(VIN = 5V, VOUT = 2.5V, L = 2.2µH, COUT = 22µF, TA = 25°C, unless otherwise specified)TSS RDISCH TSDtia l-P re pParameter Input Voltage Range Quiescent Current Shutdown Current Feedback Reference Voltage PFET RON NFET RON PFET Current Limit EN rising threshold EN falling threshold Input UVLO threshold UVLO hysteresis Oscillator Frequency Short Circuit Protection Threshold Min ON Time Max Duty Cycle Soft Start Time Output Discharge Switch On Resistance Thermal Shutdown Temperaturear edSymbol VIN IQ ISHDN VREF RDS(ON),P RDS(ON),N ILIM VENH VENL VUVLO VHYS FOSC VSCPTest Conditions IOUT=0, VFB=VREF ⋅ 105% EN=0Min 2.7Typ 55 0.1 0.6 125 95Max 6.5 1 0.6120.588ye0.2 1 0.3 75 1.0 50 1503.5 1.5IOUT=500mAforr1000.4 2.65Unit V µA µA V mΩ mΩ A V V V V MHz V ns % ms Ω °CNote 2: Test condition: Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground plane.AN_SY8079 Rev. 0.1Siler gyCo rpNote 3: The device is not guaranteed to function outside its operating conditions..C onNote 1: Stresses beyond the “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.Silergy Corp. Confidential- Prepared for Customer Use Only 4fidenSY8079Typical Performance CharacteristicsEfficiency vs. Load Current95 96Efficiency vs. Load Current90 92 85 88 80 VIN=3.3V,VOUT=1.2V VIN=4.2V,VOUT=1.2V VIN=5.0V,VOUT=1.2V 84 VIN=3.3V,VOUT=1.8V VIN=4.2V,VOUT=1.8V VIN=5.0V,VOUT=1.8V750.010.101.0010.000.01rr0.107080ye1.0010.00Load Current (A) Efficiency vs. Load Current98 96 94 92 90 88 86 84 82 80 0.01 0.10 1.00 VIN=4.2V,VOUT=3.3V VIN=5.0V,VOUT=3.3Vtia l-P re par ed en10.00fo fidLoad Current (A) Load Transient(VIN=5.0V, VOUT=1.8V, IOUT=0.2-2.0A)VOUT0.2V/divIL1A/div.C onTime (40µs/div)Load Current (A)AN_SY8079 Rev. 0.1Siler gySilergy Corp. Confidential- Prepared for Customer Use Only 5Co rpSY8079Short Circuit Protection(VIN=5.0V, VOUT=1.8V, 2A to Short)VOUT1V/divIL2A/divTime (4ms/div)Output Ripple(VIN=5.0V, VOUT=1.8V, IOUT=2.0A)∆VOUT10mV/divVLX2V/divIL2A/divTime (400ns/div)AN_SY8079 Rev. 0.1Siler gyCo rp.C onSilergy Corp. Confidential- Prepared for Customer Use Only 6fidentia l-P re par edforryeSY8079Operation PrincipleSY8079 is a synchronous buck regulator IC that integrates the PWM control, top and bottom switches on the same die to minimize the switching transition loss and conduction loss. With ultra low RDS(ON) power switches and proprietary PWM control, this regulator IC can achieve the highest efficiency and the highest switch frequency simultaneously to minimize the external inductor and capacitor size, and thus achieving the minimum solution footprint. Short Circuit Protection The frequency is folded back to about 30% of the nominal frequency and the current limit is folded back to 3.0A to prevent the inductor current from runaway and to reduce the power dissipation of the IC under short circuit conditions. This formula has a maximum at VIN=2VOUT condition, where ICIN_RMS=IOUT/2. This simple worst-case condition is commonly used for DC/DC design. With the maximum load current at 2.0A. A typical X5R or better grade ceramic capacitor with 10V rating and more than 1 pcs 22µ F capacitor can handle this ripple current well. To minimize the potential noise problem, ceramic capacitor should really be placed close to the IN and GND pins. Care should be taken to minimize the loop area formed by CIN, and IN/GND pins Output capacitor COUT: The output capacitor is selected to handle the output ripple noise requirements. Both steady state ripple and transient requirements must be taken into consideration when selecting this capacitor. For the best performance, it is recommended to use X5R or better grade ceramic capacitor with 6.3V rating and greater than 22µF capacitance. Output inductor L: There are several considerations in choosing this inductor. 1) Choose the inductance to provide the desired ripple current. It is suggested to choose the ripple current to be about 40% of the maximum output current. The inductance is calculated as:Applications InformationBecause of the high integration in the SY8079 IC, the application circuit based on this regulator IC is rather simple. Only input capacitor CIN, output capacitor COUT, output inductor L and feedback resistors (R1 and R2) need to be selected for the targeted applications specifications. Feedback resistor dividers R1 and R2: Choose R1 and R2 to program the proper output voltage. To minimize the power consumption under light loads, it is desirable to choose large resistance values for both R1 and R2. A value of between 10k and 1M is highly recommended for both resistors. If Vout is 1.8V, R1=100k is chosen, then R2 can be calculated to be 50k.:fiden.C onVOUT R1Siler gyFBGNDCo rpR2 =0.6V R 1 (Ω) . VOUT -0.6VR2tia l-P re pL=where Fsw is the switching frequency and IOUT,MAX is the maximum load current. The SY8079 regulator IC is quite tolerant of different ripple current amplitude. Consequently, the final choice of inductance can be slightly off the calculation value without significantly impacting the performance. 2) The saturation current rating of the inductor must be selected to be greater than the peak inductor current under full load conditions.ar edVOUT (1 − VOUT /VIN, MAX ) FSW × IOUT, MAX × 40%Input capacitor CIN: This ripple current through input capacitor is calculated as:ISAT, MIN > IOUT, MAX +ICIN_RMS =IOUT × D(1-D)3) The DCR of the inductor and the core loss at the switching frequency must be low enough to achieve the desired efficiency requirement. It isAN_SY8079 Rev. 0.1Silergy Corp. Confidential- Prepared for Customer Use Only 7forrVOUT(1-VOUT/VIN,MAX) 2 ⋅ FSW ⋅ LyeSY8079desirable to choose an inductor with DCR<50mΩ to achieve a good overall efficiency. Enable Operation Pulling the EN pin low (<0.4V) will shut down the device. During shut down mode, the SY8079 shutdown current drops to lower than 0.1uA. Driving the EN pin high (>1.5V) will turn on the IC again. Load Transient Considerations: The SY8079 regulator IC integrates the compensation components to achieve good stability and fast transient responses. In some applications, adding a 22pF ceramic cap in parallel with R1 may further speed up the load transient responses and is thus recommended for applications with large load transient step requirements. Layout Design: The layout design of SY8079 regulator is relatively simple. For the best efficiency and minimum noise problems, we should place the following components close to the IC: CIN, L, R1 and R2. 1) It is desirable to maximize the PCB copper area connecting to GND pin to achieve the best thermal and noise performance. If the board space allowed, a ground plane is highly desirable. 2) CIN must be close to Pins IN and GND. The loop area formed by CIN and GND must be minimized. 3) The PCB copper area associated with LX pin must be minimized to avoid the potential noise problem. 4) The components R1, R2, and the trace connecting to the FB pin must NOT be adjacent to the LX net on the PCB layout to avoid the noise problem. 5) If the system chip interfacing with the EN pin has a high impedance state at shutdown mode and the IN pin is connected directly to a power source such as a LiIon battery, it is desirable to add a pull down 1MΩ resistor between the EN and GND pins to prevent the noise from falsely turning on the regulator at shutdown mode.AN_SY8079 Rev. 0.1Siler gyCo rp.C onSilergy Corp. Confidential- Prepared for Customer Use Only 8fidentia l-P re par edforryeSY8079SOT23-5 Package outline & PCB layout design0.552.80 - 3.102.402.70 - 3.000.95 TYPar edfo0.30 - 0.50tia l-P re pRecommended Pad Layout0.80rr0.95 TYP 1.90 TYP 0.01 - 0.10.25 REF0.1 - 0.15AN_SY8079 Rev. 0.1Siler gyNotes: All dimensions are in millimeters. All dimensions don’t include mold flash & metal burr.Co rp.C onSilergy Corp. Confidential- Prepared for Customer Use Only 9fid0.3 - 0.6en1.0 - 1.3ye1.50 - 1.70SY8079Taping & Reel Specification1. Taping orientationSOT23-53.9/4.1 1.45/1.557.7/8.3Feeding direction2. Carrier Tape & Reel specification for packagestia l-P re pPackage types SOT23-5er gyCo rpTape width (mm) 8.C onReel SizePocket pitch(mm) 4fidenReel size (Inch) 7"Reel width(mm) 8.4ar edReel WidthTrailer length(mm) 280 Leader length (mm) 160foQty per reel 30003. Others: NAAN_SY8079 Rev. 0.1SilSilergy Corp. Confidential- Prepared for Customer Use Only 10rrye。

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SU-6908 eMMC Programmer Duplicator Software Manu

SU-6908 eMMC Programmer Duplicator Software Manu

SU-6908 eMMC Programmer / DuplicatorSoftware ManualContentsChapter 1 Introduction (4)Chapter 2 Usage Consideration (4)Chapter 3 Install and Connect SU-6908 (4)Chapter 4 Description of Software Function (4)4-1 File System (5)Simple management of files ( Only FAT32 ).4-2 Project Utility (5)Project file upload/download/comparison function.4-3 Open Project (5)Open and set the SDD ( Solid-State Disk ) project file.4-4 Update (6)Update SU-6908 System Firmware.4-5 Master Timing (7)To set the reading and writing parameter time sequence ofMaster Socket.4-6 Master Ext_CSD (7)To check and set the CID, CSD, and EXT_CSD parametersdata of the Master IC.4-7 Boot Partition Config (8)To check and set the Boot Partition parameters of the Master IC.9Contents4-8 GP Partition Config .......................................................................9 To Check and set the General Purpose Partition and ENH_ USR parameters of the Master IC.4-9 Clone Wizard ................................................................................. To copy the specification of eMMC on Master Socket and generate Project file.Chapter 5 Usage Example (11)5-1 To copy the project file of the master tape (11)5-2 To Produce the master IC by BIN file (11)5-3 To Modify partial data of the eMMC device .............................12 5-4 The reason why Check Sum are different and Verify Failbetween master tape IC and Clone copy IC (11)Chapter 1 IntroductionThis software allow connection of SU-6908 to PC. It can read/write/set the eMMC latch register inside, and read/ write eMMC Boot area and user data area.Chapter 2 Usage ConsiderationPlease use the software function carefully. Most important, the user must have professional knowledge of eMMC IC. For example, when setting and partitioning, the user has to know what influences will be caused by changing the parameters. Some setting or partitioning of eMMC can only execute once and can not resume again.When using SU-6908 or the software to produce Project files or Master tapes, you must program few master tapes first, then weld and assemble it to the product for the full test. You have to make sure the project file and the production of master tape are all correct. Or it may cause many losses when gang producing.Chapter 3 Install and link to SU-6908Please install this software and driver first, then connect PC and SU-6908 with USB cable. Turn on the SU-6908, and click [↑UP] or "4.Link to PC" on the main menu to execute this software.Chapter 4 Software FunctionThe operation interface is as below, you can use pull down menu or click ICON to execute the function. It will show "Device OK" on the left bottom if it is connected. If it's not, it will show "Device disconnected".SU-6908 eMMC Programmer4-1　File SystemProvide a simple interface for managing eMMC Programmer File System, which can process the eMMC IC on the Master Socket and the FAT32 file of the SDD. It can not be processed and checked if it is not FAT32 file.4-2　Project UtilityProject Upload/Download/Comparison function, you could upload the project files on SU-6908 SSD to PC or download the project files from PC to SU-6908 SDD or compare both project files.4-3　Open ProjectTo open and set SU-6908 SSD project file on Open File window. Choose project andclick "Open file".Software Description:SU-6908 eMMC Programmer SU-6908 eMMC ProgrammerSU-6908 eMMC ProgrammerProject set up is as below image:User Area (Including image file)Boot Partition;Choose□Boot Area and write in "Boot Partition Config" setting to the eMMC components;Process: Erase All; Program; Verify; Check CID;eMMC frequency, Bus width, and TCO parameters setting;General Purpose Partition;Project save file name:Click ok while finishing setting and save it to Project file. Click cancel to turn off the window.SU-6908 eMMC Programmer4-4　UpdateUpdate SU-6908 System firmware.SU-6908 eMMC Programmer4-5　Master TimingTo set the reading and writing of Master Socket. You can click "AUTO SELECT TIMING" and SU-6908 will search the best parameters automatically. It will also login this parameter for optimizing the control of reading the same master next time. You can also turn off Auto function and adjust it manually.4-6　Master Ext_CSDTo check and set the parameters of CID, CSD, EXT_CSD on the Master Socket.Note: Please check the eMMC specification, revise and verify it carefully when using this function.CID Window CSD Window SU-6908 eMMC ProgrammerSU-6908 eMMC ProgrammerEXT_CSD Window. If you want to change the content of the latch register, please choose the latch register from the left field and enter the right field.4-7 Boot Partition ConfigTo check and set Boot Partition of master tape on the Master Socket.EXT_CSD BOOT BUS CONDITION[177] is the setting of latch register, which is on the left side window.EXT_CSD Partition Config[179] is the setting of latch register, which is on the middle of the window.After finishing the setting, click "Write" and write it to the Master tape on the Master Socket. The Writer key of "Boot AREA1" and "Boot AREA2" Window is for writing BIN file of PC to Boot Area of the Master tape. "Save" press is for reading the Boot Area of Master tape and save it as BIN file.Note: Please check the eMMC specification, revise and verify it carefully while operating this function.SU-6908 eMMC Programmer4-8　GP Partition ConfigTo check and set General Purpose Partition and ENH_USR parameters of the Master tape on Master Socket.After finishing setting and make sure it is correct, please click the "Config", and the setting will be write to the master tape on the master socket. Modify these parameters will cause unpredictable changes of the data inside Master IC.Note: Please check the eMMC specification, revise and verify it carefully when using this function. eMMC chip can not be resume after writing Partition setting.4-9 Clone WizardCopy the data from Master tape on the master socket to generate the project file.Make Master:Write the BIN files from PC to the areas of Master tape, (such as Bootx, GPx and User...etc.) or read the the saved files.Note: Please check the eMMC specification, revise and verify it carefully when usingthis function. eMMC chip can not be resume after writing Partition setting.SU-6908 eMMC ProgrammerSU-6908 eMMC ProgrammerClone Master Function:[Clone] Copy chip data from Master Socket and buildProject file.You can choose "Auto" to scan each Partitionsequentially (Scan the whole areas in FAT32, Ext FAT,NTSF format.)If the format is different, please scan it bypure data. The system will save data and mark data areas,then build Project file.Make Master Function:[○Boot1 ○Boot2 ○GP1 ○GP2 ○GP3 ○GP1 ●User]Choose the Areas[Start Address] Choose the address of writing and reading.It has to be Hexadecimal and integer multiple of 0x200 (512).[Length] Set the Bytes of writing and reading.It has to be Hexadecimal and integer multiple of 0x200 (512).[Open File] Choose the BIN files which will write to the device.[Write] Select the BIN files to the select areas (Bootx; GPx; User), set address from Start Address field, write the Bytes data from Length field to the Master tape.[Verify] Verify the chosen BIN file, to check whether it is totally match to the data of the Master tape.[Save File] Choose the save file (BIN) name after reading the data from the IC.[Save] Read the Bytes of Length field from (Bootx; GPx; User) and Start Address, then save them to chosen BIN files."Global" mode is to scan the whole device by pure data , it includes the deleted files.[Down Load] Download the project file and write it to the Master tape.[Erase] Erase the data areas of the IC on the Master Socket, but it won't change the EXTM_CSD content and can't resume the Partition and some singular parameters.[Compare] Compare the project file from PC, Master tape and SSD. To see whether they are same or not.Chapter 5 Usage Example5-1. Copy the project file of the master tape1. Place the master tape which is verified, on the Master Socket of SU-6908. If the ICis taken from the board, please insert the solder ball first, to make sure the contact of socket and IC are in good condition.2. Use the "2.Make new project" function from main list:a. Choose "Auto Clone" mode, let the system search the best reading and writingparameters automatically and scan each partition sequentially. (Scan the data areas by FAT32, Ext FAT, NTSF formats.) If there are no such formats, please scan it by pure data. The system will save and mark the data area and build the project file on SSD of the programmer.b. Use "Clone From Master" mode, and get the parameters of Master IC from thedatabase. (Or set it manually.) There are two ways to scan -"Auto" and "Global".In "Auto Mode", it will scan each partition sequentially. (Scan the data areas by FAT32, Ext FAT, NTSF formats.) If there are no such formats, please scan it by pure data. The system will save and mark the data area and build the project file on SSD of the programmer."Global Mode"In "Global" Mode, it scan the whole device by pure data, which includes the files that are deleted.3. Use this Project file and program more than one Master tapes.4. Please weld the Master tape to the programmer and test it completely to make surethe production of Master tape is correct.5. You can also use the software to execute the Clone Master function, which cancopy the Project file of Master tape on the PC.5-2. Produce Master Tape in Bin format1. Place the target blank IC on the Master Socket.2. Turn on the software and execute the Master Ext CSD function for setting therelated register.3. Execute the "Boot Partition Config" function for setting the related register.4. If you need to Partition or ENH_USR, please execute GP Partition Config functionfor related register.5. Turn on the "Clone Wizard" function window.116. Write each BIN file to Boot 1, Boot 2, GPx and USER areas.7. All the write in action now are for the Master tape on the Master socket of SU-6908.You can Clone Master IC as a project file after writing in all the settings.8. Please weld the Master tape to the product and test it completely. Make sure theproduction of the Master tape is correct.9. If the testing is ok, you can use the project file (Step 7). But if the testing is fail,please delete the project file and make sure the setting and the source of BIN file are correct. Then choose a new target file and start again from step 1. The IC that are fail testing can be used for other purposes after inserting the solder balls. (However, the Partition setting can not be resume.)5-3. Change partial data of the eMMC(Only for replacing few Bytes value. If you want to replace the capacity or move it, you still have to modify it from Source Code.)1. Place the target IC on the Master Socket.2. Use the software to execute the Clone Wizard function.3. Choose User (or boot1/2, GPx), use [Save File] & [Save] to read the areas where youwant to modify and save it as BIN file.4. Use HEX Editor software to loading the BIN file. It can find the areas and edit it.However, it can only overwrite and modify the data, it can not increase nor decrease the capacity of the data. Please save the file or save as other file after modifying it.Note: Start Address / length has to be the integer multiple value of 0x200(512).5. Use SU-6908 connection software, choose [Open File] & [Write] to write themodified BIN files to the Master IC.6. Please weld the Master tape to the product and test it completely. Make sure theproduction of the master tape is correct.5-4. The reason why Check Sum are different and Verify Fail between master tape IC and Clone copy IC :1. The data types from Master and Slave IC are different, one could be 0x00 andanother could be 0xFF.2. While testing and producing Master IC on the PCB board, it could have executedDelete File function on File System. The usual Delete File function is just mark on the File system, it has not erased all contents. If you choose "Auto mode" while Clone Master, it will skip the delete files automatically. So the function is normal, but check sum is different. If you want them to be all the same, please choose "2. Clone from Master" \ "2. Global mode" while Clone Master. So that it can clone the data with the delete File data together.12Document No. 140515-V1.080500122016908WEB: E-MAIL:****************.twLEAP HeadquartersTEL: +886-2-2999-1860 #15FAX: +886-2-2999-98736F-4, No.4, Ln.609, Sec.5, Chongxin Rd., Sanchong Dist., New Taipei City 24159, Taiwan, ROCLEAPTRONIX HeadquartersTEL: +886-2-2999-3837FAX: +886-2-2999-77109F-4, No.18, Ln.609, Sec.5, Chongxin Rd., Sanchong Dist., New Taipei City 24159, Taiwan, ROC Shanghai Office (China)TEL: +86-21-5777-1796FAX: +86-21-5777-1796 #838Songjiang District, Shanghai Xin Brick Road, Room 301, 518, No. 24Beijing Office (China)TEL: +010-6265-2592FAX: +010-6265-5303No. 615, Apartment, No. 33 Suzhou St., Haidian District, BeijingDongguan Office (China)TEL: +0769-8534-9978FAX: +0769-8534-968612F, Hua’an Shangzhu Building, Changqing St., Chang'an Town, Dongguan。

MT6071 8071 8101iE Series HMI安装与启动指南说明书

MT6071 8071 8101iE Series HMI安装与启动指南说明书

Installation and Startup GuideThis document covers the installation of MT6071/8071/8101iE Series HMI, for the detailed specifications and operation, please refer to Brochure and EasyBuilder Pro User Manual. Install Environment:NEMA Rating The HMI product is NEMA 4 rated (Indoor Only).Electrical EnvironmentThe HMI product has been tested to conform to European CE requirements. This means that the circuitry is designed to resist the effects of electrical noise. This does not guarantee noise immunity in severe cases. Proper wire routing and grounding will insure proper operation.Environmental Considerations(1) Make sure that the displays are installed correctly and that the operatinglimits are followed. Avoid installing units in environments where severe mechanical vibration or shocks are present.(2)Do not operate the unit in areas subject to explosion hazards due toflammable gases, vapors or dusts. MT8071iE is certified in accordance with ATEX zone 2/22 categories 3 G/D. The unit has to be installed in an additional enclosure ensuring a minimal protection level for 3G/Dequipment. The enclosure equipped with the unit has to be certified and shouldn’t be opened when an explosive atmosphere is present. (3) Do not install the unit where acid gas, such as SO2 exists.(4) This device should be mounted in the vertical position and for use on the flatsurface enclosure.(5) Conform to UL508 (ISBN 0-7629-0404-6) machine safety for use inPollution Degree 2 Environment.Unpacking the UnitUnpack and check the delivery. If damage is found, notify the supplier.Installation InstructionsSecure the operator panel in position, using all the fastening holes and the provided bracketsand screws. Screw Torque: 2.6 ~ 3.9 lbf.in. (For reaching waterproof effect and preventing the panel from being deformed.)Type A(mm) B(mm) MT6071/8071iE192 138 MT8101iE260202USB Stick Clamp UsageCombining the USB Stick with the clamp and the tying strap can prevent USB stick from disconnecting with HMI when strong vibration is present.1. Insert the USB connector to the clamp and tie them together with the tying strap.2. Press the spring and insert the USB stick into HMI.Power ConnectionsMT6071/8071/8101iE seriesInstallation InstructionNOTE:Place the operator panel on a stable surface during installation. Dropping it or letting it fall may cause damage.NOTE:1. Conne ct positive DC line to the ‘+’ terminal and the DC ground to the ‘-’ terminal.2. When using a USB cable to download project file, please do not connect HMI with PLC and PC simultaneously to prevent potential difference from destroying USB ports of HMI and PC.(A)(B)Cutout3 4 (1)(2)(3)(5) (4) (6)(1) Installation Instruction, 2-sided A4 *1(2) Human Machine Interface *1(3) Power Connector *1(4) Brackets & Screws *1 pack (5) USB Stick Clamp & Tying Strap *1(6) Fuse 1.25A/250V 5*20mm *11 2System SettingsWhen HMI is powered up and displays image,click the system setting button.(Default System Password: 111111)It is necessary to connect the HMI toyour network through a RJ-45 cable.(N/A for MT6071iE)EasyBuilder Pro Software SettingsLaunch EasyBuilder Pro software, select yourproject file, press F7 shortcut key to openthe download dialog box:Select Ethernet > IP tab > Enter your HMI IP> Click Download to download this projectfile to HMI.If use MT6071iE, please select USB cable.( Please refer to EasyBuilder Pro User Manualfor software operation details )Communication ConnectionsCOM1 [RS232] 9 Pin, Male, D-sub COM2 / COM3 [RS485] 9 Pin, Female, D-subDIP SW Settings Limited WarrantyThis product is limited warranted against defects in design and manufacture.The proven defective product will either be repaired or replaced, at Weintek’s discretion.This warranty shall not cover any product which is(a) Out of warranty period which is 12 months from the manufacturing month of the HMI products.(b) Damage caused by Force Majeure, accident, negligence, improper installation or misuse.(c) Product has been repaired or taken apart by unauthorized technicians.(d) Products whose identification markings have been removed or damaged.PIN# COM1 [RS232]12 RxD3 TxD45 GND67 RTS8 CTS9PIN#COM2[RS485]2wCOM2[RS485]4wCOM3[RS485]1 Data- Rx-2 Data+ Rx+3 Tx-4 Tx+5 GND6 Data-789 Data+SW1 SW2 SW3 SW4 ModeON OFF OFF OFF Touch Screen Calibration ModeOFF ON OFF OFF Hide HMI System Setting BarOFF OFF ON OFF Boot Loader ModeOFF OFF OFF ON Not supportedOFF OFF OFF OFF Normalanywhere on the screen for more than 2 seconds when HMI starts.NOTE:COM2 and COM3 [RS485] 2W support MPI 187.5K, please use one at one time.Go to the Network tab, you may chooseto auto get DHCP IP, or designate yourown IP.678PowerThe unit can be powered by DC power only, voltage range: 24±20% Volts DC, compatible withmost controller DC systems. The power conditioning circuitry inside the unit is accomplished by aswitching power supply. The peak starting current can be as high as 2A.FusingRequire-mentsIf the display does not come on within 5 seconds of power up, remove power. An internal fuse willprevent damage if the polarity of the DC power is incorrect. Check wiring for proper connectionsand try to power up again.HighVoltageAn Internal fuse will prevent damage for overcurrent condition however it isn’t guaranteed. DCvoltage sources should provide proper isolation from main AC power and similar hazards.EmergencyStopA Hard-wired EMERGENCY STOP should be fitted in any system using HMI to comply with ICSSafety Recommendations.SupplyVoltageConditionDo not power the unit and inductive DC loads, or input circuitry to the controller, with the samepower supply. Note: The 24 VDC output from some controllers may not have enough current topower the unit.WireRoutinga. Power wire length should be minimized (Max: 500m shielded, 300m unshielded).b. Please use twisted pair cables for power wire and signal wire and conform to the impedancematching.c. If wiring is to be exposed to lightning or surges, use appropriate surge suppression devices.d. Keep AC, high energy, and rapidly switching DC power wiring separated from signal wires.e. Add a resistor and capacitor in the parallel connection between the ungrounded DC powersupply and the frame ground. This provides a path for static and high frequency dissipation.Typical values to use are 1M Ohm and 4700pF.CAUTIONNOTE: Make sure that all local and national electrical standards are met wheninstalling the unit. Contact your local authorities to determine which codes apply.HardwareConsiderationsThe system designer should be aware that devices in Controller systems could fail and therebycreate an unsafe condition. Furthermore, electrical interference in an operator interface can lead toequipment start-up, which could result in property damage and/or physical injury to the operator.If you use any programmable control systems that require an operator, be aware that this potentialsafety hazard exists and take appropriate precautions. Although the specific design steps depend onyour particular application, the following precautions generally apply to installation of solid-stateprogrammable control devices, and conform to the guidelines for installation of Controllersrecommended in NEMA ICS 3-304 Control Standards.ProgrammingConsiderationsTo conform with ICS Safety Recommendations, checks should be placed in the controller to ensurethat all writable registers that control critical parts of plant or machinery have limit checks built intothe program, with an out-of-limit safe shut down procedure to ensure safety of personnel.GME6871E0_MT6071_8071_8101iE1_Installation_160722DANGER5。

ARIES ARIES-P -Ver.04- 8 0 2 7 9 0 8 1 1 3 7 4 0 产

ARIES ARIES-P -Ver.04- 8 0 2 7 9 0 8 1 1 3 7 4 0 产

ISTRUZIONI D'USO E DI INSTALLAZIONE INSTALLATION AND USER'S MANUALINSTRUCTIONS D'UTILISATION ET D'INSTALLATION INSTALLATIONS-UND GEBRAUCHSANLEITUNG INSTRUCCIONES DE USO Y DE INSTALACION INSTRUÇÕES DE USO E DE INSTALAÇÃOCENTRALINA DI COMANDO D811184A ver. 04 08-02-02I CONTROL UNIT GB UNITÉ DE COMMANDE F STEUERZENTRALE D CENTRAL DE MANDO E CENTRAL DO MANDOP ARIES - ARIES P8027908113740a“WARNINGS” leaflet and an “INSTRUCTION MANUAL”.These should both be read carefully as they provide important information about safety, installation, operation and maintenance. This product complies with the recognised technical standards and safety regulations. We declare that this product is in conformity with the following European Directives: 89/336/EEC and 73/23/EEC (and subsequent amendments).1) GENERAL OUTLINEThe ARIES control unit has been designed for swing gates. It can be used for one or two gate controllers.The control unit mod. ARIES P can also be used to perform opening of a single actuator while keeping the other one closed (pedestrian access).2) FUNCTIONSSTOP: In all cases: it stops the gate until a new start command is given.PHOT:Functions can be set with Dip-Switch.Activated during closing.Activated during opening and closing.Rapid closingON: When the position of the gate photocells is exceeded, during both opening and closing, the gate automatically starts to close even if TCA is activated. We recommend setting DIP3 to ON (photocells only activated during closing).Blocks impulsesON: During opening, START commands are not accepted.OFF: During opening, START commands are accepted.PhotocellsON: Photocells only activated during closing.OFF: Photocells activated during opening and closing.Automatic closing time (TCA)ON: Automatic closing activated (can be adjusted from 0 to 90s)Preallarm (mod. ARIES P only)ON: The flashing light turns on abt 3 seconds before the motors start.FOR THE INSTALLER: check the boxes you are interested in.START:four-step logic Gate closedGate openDuring openingDuring closingAfter stop START: two-step logic SCA: Gate open indicating lightit opens it opensit stops and activates TCAit closesit stops and does not activate TCAit starts opening it stops and activats TCA (if activated)it closesit opensit opensoffononflashingATTENTION:Dip non used in mod. ARIES (always in OFF set).3) MAINTENANCE AND DEMOLITIONThe maintenance of the system should only be carried out by qualified personnel regularly. The materials making up the set and its packing must be disposed of according to the regulations in force.Batteries must be properly disposed of.WARNINGSCorrect controller operation is only ensured when the data contained in the present manual are observed. The company is not to be held responsible for any damage resulting from failure to observe the installation standards and the instructions contained in the present manual.The descriptions and illustrations contained in the present manual are not binding. The Company reserves the right to make any alterations deemed appropriate for the technical, manufacturing and commercial improvement of the product, while leaving the essential product features unchanged, at any time and without undertaking to update the present publication.D 811184A _04Thank you for buying this product, our company is sure that you will be more than satisfied with the product ’s performance. The product is supplied with a “WARNINGS ” leaflet and an “INSTRUCTION MANUAL ”.These should both be read carefully as they provide important information about safety, installation, operation and maintenance.This product complies with the recognised technical standards and safety regulations. We declare that this product is in conformity with the following European Directives: 89/336/EEC and 73/23/EEC (and subsequent amendments).1) GENERAL OUTLINEThe ARIES control unit has been designed for swing gates. It can be used for one or two gate controllers.The control unit mod. ARIES P can also be used to perform opening of a single actuator while keeping the other one closed (pedestrian access).2) GENERAL SAFETYWARNING! An incorrect installation or improper use of the product can cause damage to persons, animals or things.•The “Warnings ” leaflet and “Instruction booklet ” supplied with this product should be read carefully as they provide important information about safety, installation, use and maintenance.•Scrap packing materials (plastic, cardboard, polystyrene etc) according to the provisions set out by current standards. Keep nylon or polystyrene bags out of children ’s reach.•Keep the instructions together with the technical brochure for future reference.•This product was exclusively designed and manufactured for the use specified in the present documentation. Any other use not specified in this documentation could damage the product and be dangerous.•The Company declines all responsibility for any consequences resulting from improper use of the product, or use which is different from that expected and specified in the present documentation.•Do not install the product in explosive atmosphere.•The Company declines all responsibility for any consequences resulting from failure to observe Good Technical Practice when constructing closing structures (door, gates etc.), as well as from any deformation which might occur during use.•The installation must comply with the provisions set out by the following European Directives: 89/336/EEC, 73/23/EEC, 98/37/ECC and subsequent amendments.•Disconnect the electrical power supply before carrying out any work on the installation. Also disconnect any buffer batteries, if fitted.•Fit an omnipolar or magnetothermal switch on the mains power supply,having a contact opening distance equal to or greater than 3mm.•Check that a differential switch with a 0.03A threshold is fitted just before the power supply mains.•Check that earthing is carried out correctly: connect all metal parts for closure (doors, gates etc.) and all system components provided with an earth terminal.•The Company declines all responsibility with respect to the automation safety and correct operation when other manufacturers ’ components are used.•Only use original parts for any maintenance or repair operation.•Do not modify the automation components, unless explicitly authorised by the company.•Instruct the product user about the control systems provided and the manual opening operation in case of emergency.•Do not allow persons or children to remain in the automation operation area.•Keep radio control or other control devices out of children ’s reach, in order to avoid unintentional automation activation.•The user must avoid any attempt to carry out work or repair on the automation system, and always request the assistance of qualified personnel.•Anything which is not expressly provided for in the present instructions,is not allowed.3) TECHNICAL SPECIFICATIONSPower supply:...............................................................230V ±10% 50Hz Absorption on empty:.................................................................0.5A max Output power for accessories:..........................................24V~ 6VA max Max relay current:................................................................................8A Max power of motors:...............................................................300 W x 2Torque limiter:.................................................Self-transformer with 4 pos Limit switch:................................................................Adjustable run timePanel dimensions:.........................................................................See fig.1Cabinet protection:............................................................................IP55Working temperature:...............................................................-20 +55°C 4) TERMINAL BOARD CONNECTIONS(Fig.2)CAUTION: Keep the low voltage connections completely separated from the power supply connections.Fig.3 shows the fixing and connection method of the drive condensers whenever they are not fitted to the motor.JP51-2 Single-phase power supply 230V ±10%, 50 Hz (1=L/2=N).For connection to the mains use a multiple-pole cable with a minimum cross section of 3x1.5mm 2 of the type indicated in the above-mentioned standard (by way of example, if the cable is not shielded it must be at least equivalent to H07 RN-F while, if shielded, it must be at least equivalent to H05 VV-F with a cross section of 3x1.5mm 2).JP33-4 (mod.ARIES-P) 230V 40W max. blinker connection.5-6 (mod.ARIES) 230V 40W max. blinker connection.7-8-9 Motor M1 connection - 8 common, 7-9 start.10-11-12 Motor M2(r) connection - 11 common, 10-12 start.JP413-14 Open-close button and key switch (N.O.).13-15 Stop button (N.C.). If unused, leave bridged.13-16 Photocell or pneumatic edge input (N.C.). If unused, leave bridged.17-18 24V 3W max. gate open warning light.18-19 24V~ 0.25A max. (6VA) output (for supplying photocell or other device).20-21 Antenna input for radio-receiver board (20 signal - 21 braid).22 Common terminal (equivalent to terminal 13).23 Terminal for pedestrian control. It moves the leaf of motor M2 connected to terminal 10-11-12. This terminal is available only in ARIES-P control unit.JP225-26 2nd radio channel output of the double-channel receiver board (terminals not fitted on ARIES but fitted on ARIES-P) contact N.O.JP1 Radio-receiver board connector 1-2 channels.5) FUNCTIONSDL1:Power-on LedIt is switched on when the board is electrically powered.START: four-step logic: (DIP5 OFF)gate closed:..................................................................................it opens during opening:............................................... it stops and activates TCA gate open:................................................................................... it closes during closing:.................................... it stops and does not activate TCA after stop:.........................................................................it starts opening START: two-step logic: (DIP5 ON)gate closed:..................................................................................it opens during opening:................................it stops and activats TCA (if activated)gate open:....................................................................................it closes during closing:..............................................................................it opens after stop:.....................................................................................it opens STOP: In all cases: it stops the gate until a new start command is given.PHOT:Functions can be set with DIP-SWITCH.Activated during closing if DIP3-ON.Activated during opening and closing if DIP3-OFF.SCA: Gate open indicating light.with gate closed:...................................................................................off when gate is opening:...........................................................................on with gate open:.......................................................................................on when gate is closing:.....................................................................flashing 6) DIP-SWITCH SELECTION DIP1 Rapid closingON: When the position of the gate photocells is exceeded, during both opening and closing, the gate automatically starts to close even if TCA is activated. We recommend setting DIP3 to ON (photocells only activated during closing).OFF: Function not activated.DIP2 Blocks impulsesON: During opening, START commands are not accepted.OFF: During opening, START commands are accepted.DIP3 PhotocellsON: Photocells only activated during closing.OFF: Photocells activated during opening and closing.D 811184A _04DIP4 Automatic closing time (TCA)ON: Automatic closing activated (can be adjusted from 0 to 90s).OFF: Automatic closing not activated.DIP5 Control logicON: 2-step logic is activated (see start paragraph).OFF: 4-step logic is activated (see start paragraph).DIP6: Preallarm (mod.ARIES P only)ON: The flashing light turns on abt 3 seconds before the motors start.OFF The flashing light turns on simultaneously with the start of the motors.ATTENTION:Dip non used in mod. ARIES (always in OFF set).7) TRIMMER ADJUSTMENTTCA This adjusts the automatic closing time, after which time the gate automatically closes (can be adjusted from 0 to 90s).TW This adjusts the motor working time, after which time the motor stops (can be adjusted from 0 to 40s).TDELAY This adjusts the closing delay time of the second motor (M2).8) MOTOR TORQUE ADJUSTMENTThe ARIES control unit has electric torque adjustment which allows the motor force to be adjusted.The adjustment should be set for the minimum force required to carry out the opening and closing strokes completely.Adjustment is carried out by moving the connection 55 (fig.3) on the tran-sformer sockets as described below:Pos.T1 1st TORQUE (MINIMUM TORQUE)Pos.T2 2nd TORQUE Pos.T3 3rd TORQUEPos.T4 4th TORQUE (MAXIMUM TORQUE)4 motor torque values can be obtained.To gain access to the torque adjustment sockets, disconnect the mains supply and remove the protective case “P ” of the transfomer.CAUTION: Excessive torque adjustment may jeopardise the anti-squash safety function. On the other hand insufficient torque adjustment may not guarantee correct opening or closing strokes.9) MAINTENANCE AND DEMOLITIONThe maintenance of the system should only be carried out by qualified personnel regularly. The materials making up the set and its packing must be disposed of according to the regulations in force.Batteries must be properly disposed of.WARNINGSCorrect controller operation is only ensured when the data contained in the present manual are observed. The company is not to be held responsible for any damage resulting from failure to observe the installation standards and the instructions contained in the present manual.The descriptions and illustrations contained in the present manual are not binding. The Company reserves the right to make any alterations deemed appropriate for the technical, manufacturing and commercial improvement of the product, while leaving the essential product features unchanged, at any time and without undertaking to update the present publication.D811184A_04ARIES/ARIES-P - Ver. 04 -23。

Leshan Radio Company LBC807型号一般目的调制晶体管说明书

Leshan Radio Company LBC807型号一般目的调制晶体管说明书

1General Purpose TransistorsLBC807-16LT1G LBC807-25LT1G LBC807-40LT1GSOT–231. FR–5 = 1.0 x 0.75 x 0.062 in.2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina.PNP SiliconFEATUREƽCollector current capability I C =-500 mA.ƽCollector-emitter voltage V CEO (max) = -45 V.ƽGeneral purpose switching and amplification.ƽPNP complement: LBC807 Series.ƽDEVICE MARKING AND ORDERING INFORMATIONDeviceMarkingShipping LBC807-16LT1G 5A13000/Tape&Reel LBC807-16LT3G5A110000/Tape&Reel LBC807-25LT1G 5B13000/Tape&Reel LBC807-25LT3G5B110000/Tape&Reel LBC807-40LT1G 5C13000/Tape&Reel LBC807-40LT3G5C110000/Tape&ReelMAXIMUM RATINGSRatingSymbol Value Unit Collector–Emitter Voltage V CEO –45V Collector–Base Voltage V CBO –50V Emitter–Base VoltageVEBO–5.0V Collector Current — ContinuousI C–500mAdcTHERMAL CHARACTERISTICSCharacteristicSymbol MaxUnitTotal Device Dissipation FR– 5 Board, (1)P DT A = 25°C225mW Derate above 25°C1.8mW/°C Thermal Resistance, Junction to Ambient R θJA 556°C/WT otal Device DissipationP DAlumina Substrate, (2) T A = 25°C 300mW Derate above 25°C2.4mW/°C Thermal Resistance, Junction to Ambient R θJA 417°C/W Junction and Storage T emperatureT J , T stg–55 to +150°CEMITTER1We declare that the material of product compliance with RoHS requirements.23LBC807-16LT1G,LBC807-25LT1G,LBC807-40LT1GELECTRICAL CHARACTERISTICS(T A= 25°C unless otherwise noted.)Characteristic Symbol Min Typ Max UnitOFF CHARACTERISTICSCollector–Emitter Breakdown Voltage(I C= –10 mA)V(BR)CEO–45——VCollector–Emitter Breakdown Voltage(V EB= 0, I C = –10µA)V(BR)CES–50——VEmitter–Base Breakdown Voltage(I E= –1.0µA)V(BR)EBO–5.0——VCollector Cutoff Current I CBO(V CB= –20 V)——–100nA(V CB= –20 V, T J= 150°C)——–5.0µA ELECTRICAL CHARACTERISTICS(T A= 25°C unless otherwise noted)Characteristic Symbol Min Typ Max UnitON CHARACTERISTICSDC Current Gain h FE—(I C= –100 mA, V CE= –1.0 V) LBC807–16100—250LBC807–25160—400LBC807–40250—600(I C= –500 mA, V CE= –1.0 V) 40——Collector–Emitter Saturation VoltageV CE(sat)——–0.7 V(I C = –500 mA, I B = –50 mA)Base–Emitter On VoltageV BE(on) — — –1.2 V(I C = –500 mA, V CE= –1.0 V)SMALL–SIGNAL CHARACTERISTICSCurrent–Gain — Bandwidth Productf T100— — MHz(I C = –10 mA, V CE = –5.0 V dc, f = 100 MHz)Output Capacitance C—10—pFobo(V CB = –10 V, f = 1.0 MHz)LESHAN RADIO COMPANY, LTD.LBC807-16LT1G,LBC807-25LT1G,LBC807-40LT1GTYPICAL CHARACTERISTICS −LBC807−16LT1GFigure 1. DC Current Gain vs. CollectorCurrentFigure 2. Collector Emitter Saturation Voltagevs. Collector CurrentI C , COLLECTOR CURRENT (A)I C , COLLECTOR CURRENT (A)Figure 3. Base Emitter Saturation Voltage vs.Collector Current Figure 4. Base Emitter Voltage vs. CollectorCurrentI C , COLLECTOR CURRENT (A)I C , COLLECTOR CURRENT (A)h F E , D C C U R R E N T G A I NV C E (s a t ), C O L L E C T O R −E M I T T E RS A T U R A T I O N V O L T A G E (V )V B E (s a t ), B A S E −E M I T T E R S A T U R A T I O N V O L T A G E (V )V B E (o n ), B A S E −E M I T T E R V O L T A G E (V )LESHAN RADIO COMPANY, LTD.LBC807-16LT1G,LBC807-25LT1G,LBC807-40LT1GTYPICAL CHARACTERISTICS − LBC807−16LT1GI B , BASE CURRENT (mA)Figure 5. Saturation Region100101.0V R , REVERSE VOLTAGE (VOLTS)Figure 6. Temperature CoefficientsIC , COLLECTOR CURRENTFigure 7. CapacitancesV C E , C O L L E C T O R -E M I T T E R V O L T A G E (V O L T S )V , T E M P E R A T U R E C O E F F I C I E N T S (m V /C )°θC , C A P A C I T A N C E (p F )LESHAN RADIO COMPANY, LTD.LBC807-16LT1G,LBC807-25LT1G,LBC807-40LT1GTYPICAL CHARACTERISTICS − LBC807−25LT1GFigure 8. DC Current Gain vs. CollectorCurrentFigure 9. Collector Emitter Saturation Voltagevs. Collector CurrentI C , COLLECTOR CURRENT (A)I C , COLLECTOR CURRENT (A)100200300400500Figure 10. Base Emitter Saturation Voltage vs.Collector CurrentFigure 11. Base Emitter Voltage vs. CollectorCurrentI C , COLLECTOR CURRENT (A)I C , COLLECTOR CURRENT (A)0.20.30.50.60.70.81.01.1h F E , D C C U R R E N T G A I NV C E (s a t ), C O L L E C T O R −E M I T T E R S A T U R A T I O N V O L T A G E (V )V B E (s a t ), B A S E −E M I T T E R S A T U R A T I O N V O L T A G E (V )V B E (o n ), B A S E −E M I T T E R V O L T A G E (V )0.40.9Figure 12. Current Gain Bandwidth Productvs. Collector CurrentI C , COLLECTOR CURRENT (A)f T , C U R R E N T −G A I N −B A N D W I D T H P R O D U C T (M H z )LESHAN RADIO COMPANY, LTD.LBC807-16LT1G,LBC807-25LT1G,LBC807-40LT1GTYPICAL CHARACTERISTICS − LBC807−25LT1GI B , BASE CURRENT (mA)Figure 13. Saturation Region100101.0V R , REVERSE VOLTAGE (VOLTS)Figure 14. Temperature CoefficientsI C , COLLECTOR CURRENTFigure 15. CapacitancesV C E , C O L L E C T O R -E M I T T E R V O L T A G E (V O L T S )V , T E M P E R A T U R E C O E F F I C I E N T S (m V /C )°θC , C A P A C I T A N C E (p F )LBC807-16LT1G,LBC807-25LT1G,LBC807-40LT1GTYPICAL CHARACTERISTICS − LBC807−40LT1GFigure 16. DC Current Gain vs. CollectorCurrentFigure 17. Collector Emitter Saturation Voltagevs. Collector CurrentI C , COLLECTOR CURRENT (A)I C , COLLECTOR CURRENT (A)Figure 18. Base Emitter Saturation Voltage vs.Collector CurrentFigure 19. Base Emitter Voltage vs. CollectorCurrentI C , COLLECTOR CURRENT (A)I C , COLLECTOR CURRENT (A)h F E , D C C U R R E N T G A I NV C E (s a t ), C O L L E C T O R −E M I T T E R S A T U R A T I O N V O L T A G E (V )V B E (s a t ), B A S E −E M I T T E R S A T U R A T I O N V O L T A G E (V )V B E (o n ), B A S E −E M I T T E R V O L T A G E (V )Figure 20. Current Gain Bandwidth Productvs. Collector CurrentI C , COLLECTOR CURRENT (A)f T , C U R R E N T −G A I N −B A N D W I D T H P R O D U C T (M H z )LBC807-16LT1G,LBC807-25LT1G,LBC807-40LT1GTYPICAL CHARACTERISTICS − LBC807−40LT1GI B , BASE CURRENT (mA)Figure 21. Saturation RegionV R , REVERSE VOLTAGE (VOLTS)Figure 22. Temperature Coefficients +1.0I C , COLLECTOR CURRENTFigure 23. Capacitances-2.0-1.0V C E , C O L L E C T O R -E M I T T E R V O L T A G E (V O L T S )V , T E M P E R A T U R E C O E F F I C I E N T S (m V /C )°θC , C A P A C I T A N C E (p F )-1.0-0.8-0.6-0.4-0.2LESHAN RADIO COMPANY, LTD.LBC807-16LT1G,LBC807-25LT1G,LBC807-40LT1GTYPICAL CHARACTERISTICS −LBC807−16LT1G, LBC807−25LT1G, LBC807−40LT1GFigure 24. Safe Operating AreaV CE , COLLECTOR EMITTER VOLTAGE (V)I C , C O L L E C T O R C U R R E N T (A )LESHAN RADIO COMPANY, LTD.NOTES:1. DIMENSIONING AND TOLERANCING PER ANSIY14.5M, 1982.2. CONTROLLING DIMENSION: INCH.INCHES MILLIMETERSDIM MIN MAX MIN MAX A 0.11020.1197 2.80 3.04B 0.04720.0551 1.20 1.40C 0.03500.04400.89 1.11D 0.01500.02000.370.50G 0.07010.0807 1.78 2.04H 0.00050.00400.0130.100J 0.00340.00700.0850.177K 0.01400.02850.350.69L 0.03500.04010.89 1.02S 0.08300.1039 2.10 2.64V0.01770.02360.450.60SOT-23LBC807-16LT1G,LBC807-25LT1G,LBC807-40LT1G。