IXFT50N20中文资料

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Symbol Test Conditions Maximum RatingsV DSS T J = 25°C to 150°C200V V DGR T J = 25°C to 150°C; R GS = 1 M W 200V V GS Continuous ±20V V GSM Transient ±30V I D25T C = 25°C42N2042A 50N2050A 58N2058A I DM T C = 25°C, pulse width limited by T JM 42N20168A 50N20200A 58N20232A I ART C = 25°C42N2042A 50N2050A 58N2058AE AR T C = 25°C30mJ dv/dt I S £ I DM , di/dt £ 100 A/m s, V DD £ V DSS ,5 V/nsT J £ 150°C, R G = 2 W P D T C = 25°C300W T J -55 ... +150°C T JM 150°C T stg -55 ... +150°C T L 1.6 mm (0.062 in.) from case for 10 s 300°CM d Mounting torque1.13/10Nm/lb.in.WeightTO-204 = 18 g, TO-247 = 6 gHiPerFET TMPower MOSFETsN-Channel Enhancement ModeHigh dv/dt, Low t rr, HDMOS TM FamilySymbolTest ConditionsCharacteristic Values(T J = 25°C, unless otherwise specified)min.typ.max.V DSS V GS = 0 V, I D = 250 m A 200V V GS(th)V DS = V GS , I D = 4 mA 24V I GSS V GS = ±20 V DC , V DS = 0±100nA I DSSV DS = 0.8 • V DSS T J = 25°C 200m A V GS = 0 VT J = 125°C1mAV DSSI D25R DS(on)200 V 42 A 60m W 200 V 50 A 45m W 200 V58 A 40m Wt rr £ 200 nsTO-247 AD (IXFH)TO-204 AE (IXFM)DGFeatures•International s tandard p ackages •Low R DS (on) HDMOS TM process•Rugged polysilicon gate cell structure •Unclamped Inductive Switching (UIS)rated•Low package inductance -easy to drive and to protect •Fast intrinsic RectifierApplications•DC-DC converters•Synchronous r ectification •Battery chargers•Switched-mode a nd r esonant-mode power supplies •DC choppers •AC motor control•Temperature a nd l ighting c ontrols •Low voltage relaysAdvantages•Easy to mount with 1 screw (TO-247)(isolated mounting screw hole)•High power surface mountable package •High power densityG = Gate, D = Drain,S = Source,TAB = Drain(TAB)STO-268 (D3) Case StyleIXFH/IXFM42N20IXFH/IXFM/IXFT50N20IXFH/IXFT58N20GSIXYS reserves the right to change limits, test conditions, and dimensions.91522H (2/98)(TAB)limeter InchesMin.Max.Min.Max.A19.8120.320.7800.800B20.8021.460.8190.845C15.7516.260.6100.640D 3.55 3.650.1400.144E 4.32 5.490.1700.216F 5.4 6.20.2120.244G 1.65 2.130.0650.084H- 4.5-0.177J 1.0 1.40.0400.055K10.811.00.4260.433L 4.7 5.30.1850.209M0.40.80.0160.031N 1.5 2.490.0870.102limeter InchesMin.Max.Min.Max.A38.6139.12 1.520 1.540B-22.22-0.875C 6.4011.400.2520.449D 1.45 1.600.0570.063E 1.52 3.430.0600.13530.15BSC 1.187BSCG10.6711.170.4200.440H 5.21 5.710.2050.22516.6417.140.6550.675K11.1812.190.4400.480Q 3.84 4.190.1510.165R25.1626.660.991 1.050 Min. Recommended FootprintFig. 1Output CharacteristicsFig. 2 Input AdmittanceFig. 3R DS(on) vs. Drain CurrentFig. 4 Temperature Dependenceof Drain to Source ResistanceFig. 5Drain Current vs.Fig. 6 Temperature Dependence ofCase TemperatureBreakdown and Threshold VoltageT J - Degrees C-50-250255075100125150B V /V G (t h ) - N o r m a l i z e d0.50.60.70.80.91.01.11.2V GS(th)BV DSST C - Degrees C -50-250255075100125150I D - A m p e r e s0102030405060708058N2042N2050N20T J - Degrees C-50-25255075100125150R D S (o n ) - N o r m a l i z e d0.500.751.001.251.501.752.002.252.50I D - Amperes 0255075100125150175R D S (o n ) - N o r m a l i z e d0.81.01.21.41.61.82.02.22.42.6V GS - Volts012345678910I D - A m p e r e s102030405060708090100V DS - Volts 012345678910I D - A m p e r e s102030405060708090100Fig.9Capacitance CurvesFig.10 Source Current vs. Sourceto Drain VoltageFig.7Gate Charge Characteristic CurveFig.8Forward Bias Safe Operating AreaFig.11 Transient Thermal ImpedanceV DS - Volts110100I D - A m p e r e s110100Gate Charge - nCoulombs255075100125150175200V G E - V o l t s02468101214V SD - Volts0.40.60.8 1.0 1.2 1.4I D - A m p e r e s01020304050V DS - Volts 0510152025C a p a c i t a n c e - p F050010001500200025003000350040004500Time - Seconds0.000010.00010.0010.010.1110T h e r m a l R e s p o n s e - K /W0.0010.010.1C rssC oss C iss200T J = 125°CT J = 25°Cf = 1MHz V DS = 25V。