BK1085 Datasheet v1.1

FeaturesAvailable in Adjust VersionSpace Saving TO-252 Package and TO-263 PackageInternal Short Circuit Current Limiting Internal Over Temperature ProtectionOutput Current 3AApplicationsPost Regulation for Switching DC/DC Con-verterHigh Efficiency Linear Regulator Battery ChargerBattery Powered InstrumentationMotherboardGeneral DescriptionThe G1085 is a low dropout linear regulator with a dropout of 1.2V at 3A of load current. It is avail-able in an adjustable version, which can set the output from 1.25V to 5V with only two external resistors.The G1085 provides over temperature and over current protection circuits to prevent it from being damaged by abnormal operating conditions. The G1085 is available in TO-252 package and TO- 263 packages. A minimum of 100µF tantalum electrolytic capacitor is required at the output to improve the transient response and stability.Ordering InformationPIN OPTIONORDER NUMBERORDER NUMBER(Pb free)MARKINGTEMP. RANGEPACKAGE1 2 3G1085T43U G1085T43Uf G1085 -40°C to +85°C TO-252 GND/ADJ V OUT V IN G1085T53U G1085T53UfG1085-40°C to +85°CTO-263GND/ADJV OUTV IN* For other package types and pin options, please contact us at sales @Order Number IdentificationType Pin Option TypePart NumberPACKAGE TYPE PIN OPTION PACKINGT4: TO-252 12 3 U & D: Tape & Reel Direction T5: TO-263 3: GND/ADJ V OUT V IN T: TubePackage Type Typical Application [Note 4]: Type of C OUTV V OUT123TO-252、TO-263Input Voltage…………………………….………………7V Power Dissipation Internally Limited (Note 2) Maximum Junction Temperature…...……………….150°C Storage Temperature Range…..…-65°C ≤ T J ≤+150°CReflow Temperature (soldering, 10sec)…………260°C Thermal Resistance Junction to AmbientTO-252(1)………………………………….………125°C/W TO-263(1)………………………………….………100°C/W Thermal Resistance Junction to CaseTO-252………….………………..………..….……10°C/W TO-263…..………………………...……..…………6°C/W ESD Rating (Human Body Model)……......................2kVNote (1): See Recommended Minimum Footprint(V IN -V ADJ ) Voltage………..…………...………..2.5V~5.5V Temperature Range……………..….….-40°C ≤ T A ≤85°C Electrical CharacteristicsOperating Conditions: V IN ≤ 7V, T A =T J = 25°C unless otherwise specified. [Note3]PARAMETER CONDITION MIN TYP MAX UNITReference Voltage V IN - V OUT = 2V, I OUT = 10mA1.2251.2501.275VLine Regulation(V OUT + 1.5V) < V IN < 7V, I OUT = 10mA --- 0.5 1 % Load Regulation (V IN - V OUT ) = 2V, 10mA < I OUT <3A --- 0.04 0.5 % Dropout Voltage ∆V OUT = 2%, I OUT = 3A --- 1.3 1.4 V Current Limit(V IN - V OUT ) = 2V---5.4---AAdjust Pin Current Change V IN - V OUT = 2V, 10mA < I OUT < 3A --- 0.15 --- µA Minimum Load Current 1.5V < (V IN - V OUT ) < 5.25V 10 --- --- mA Quiescent Current V IN - V OUT = 2V---80150µARipple Rejection f = 120Hz, C OUT = 10µF Tantalum,(V IN - V OUT ) = 3V, I OUT = 1A--- 48 --- dBTemperature StabilityV IN = 4V, I O =10mA --- 0.3 --- %RMS Output Noise (% of V OUT ) T A = 25°C, 10Hz < f < 10kHz, I LOAD = 10mA --- 0.007 --- %Thermal Shutdown Junction Temperature --- 150 --- °CThermal Shutdown Hysteresis--- 30 --- °CNote 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Con-ditions are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics.Note 2: The maximum power dissipation is a function of the maximum junction temperature, T Jmax ; total thermal re-sistance, θJA , and ambient temperature T A . The maximum allowable power dissipation at any ambient tem-perature is T jmax -T A / θJA . If this dissipation is exceeded, the die temperature will rise above 150°C and ICwill go into thermal shutdown.Note3: Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.Note4: The type of output capacitor should be tantalum or aluminum.Output VoltageThe G1085 provides an adjustable output voltage from 1.25V to 5V. with two external resistors. It can be for-mulated as:R2 V OUT = 1.25V x (1+R1) + IADJx R2I ADJ = 80µA (TYP)Dropout VoltageThe input/output Voltage differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 2% below its nominal value. Dropout voltage is affected by junction temperature, load cur-rent and minimum input supply requirements. Line RegulationThe change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that average chip temperature is not significantly af-fected.Load RegulationThe change in output voltage for a change in load current at constant chip temperature. The measure-ment is made under conditions of low dissipation or by using pulse techniques such that average chip tem-perature is not significantly affected.Maximum Power DissipationThe maximum total device dissipation for which the regulator will operate within specifications.Quiescent Bias CurrentCurrent which is used to operate the regulator chip and is not delivered to the load.(V IN -V OUT =3V, V OUT =1.25V, C IN =100µF, C OUT =100µF, T A =25°C, unless otherwise noted.)I L =100mALine Transient ResponseLoad Transient ResponseOutput NoiseShort Circuit-CurrentDropout Voltage vs. I OUTLoad RegulationOutput Voltage vs. TemperatureAdj Pin Current vs. TemperatureG1085T43(TO-252) Max. PowerDissipation vs. PCB Top CopperG1085T43(TO-252) Max. Power Dissipation vs. T AMB (still air)Recommend Minimum FootprintG1085T53(TO-263) Max. Power Dissipation vs. PCB Top Copper Area T = 25°C ; Still AirG1085T53(TO-263) Max. Power Dissipation vs. TAMB (still air)TO-252 (T4) PackageDIMENSION IN MILLIMETER DIMENSION IN INCHSYMBOLMIN. MAX. MIN. MAX.A 2.19 2.38 0.086 0.094 A1 0.89 1.27 0.035 0.050 b 0.64 0.89 0.025 0.035 C 0.46 0.58 0.018 0.023 D 5.97 6.22 0.235 0.245E 6.35 6.73 0.250 0.265 E1 5.21 5.46 0.2050.215 e 2.26 BSC 0.09 BSC e1 3.96 5.18 0.156 0.204 F 0.46 0.58 0.018 0.023 L1 0.89 2.03 0.035 0.080 L2 0.64 1.02 0.025 0.040 L3 2.40 2.80 0.095 0.110 H 9.40 10.40 0.370 0.410 θ 0° 4° 0° 4°TO-263 (T5) PackageMILLIMETER INCH SYMBOLMIN MAX MIN MAXA 4.30 4.70 0.169 0.185 A1 1.22 1.32 0.048 0.055 A2 2.45 2.69 0.104 0.106 b 0.69 0.94 0.027 0.037 b1 1.22 1.40 0.048 0.055 C 0.36 0.56 0.014 0.022 D 8.64 9.652 0.340 0.380 E 9.7010.54 0.382 0.415 e 2.29 2.79 0.090 0.110 e1 4.83 5.33 0.190 0.210 H 14.60 15.78 0.575 0.625 L 4.70 5.84 0.185 0.230 L1 1.20 1.778 0.047 0.070 L2 2.24 2.84 0.088 0.111 L3 1.40MAX 0.055MAXPackage OrientationPACKAGE Q’TY/REELTO-252 2,500 ea TO-263 1,000 eaGMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.TO-252 Package OrientationTO-263 Package OrientationFeed DirectionFeed Direction。

BK3515 A/D/HSpecificationsBeken Internal Data — Signed NDA Required for DistributionSingle Chip for Bluetooth and FM ReceiverBeken CorporationSuite 3A, No.1278 Keyuan Road, Zhangjiang High Tech Park, Pudong New District,Shanghai 201203, ChinaPHONE: (86)21 5108 6811FAX: (86)21 6087 1277This document contains information that may be proprietary to, and/or secrets of, Beken Corporation. The contents of this document should not be disclosed outside the companies without specific written permission.Disclaimer: Descriptions of specific implementations are for illustrative purpose only, actual hardware implementation may differ. © 2014 Beken Corporation Proprietary and Confidential Page 1 of 18Contents1.General Description (3)1.1.Features (3)1.1.1.BT Radio Features (3)1.1.2.BT Baseband Features (3)1.1.3.FM Features (3)1.1.4.Device Features (3)1.2.Applications (3)2.Pin Definition (4)3.Functional Description (7)3.1.Block Diagram (7)3.2.I2C bus mode (7)3.3.I2C Control Interface Characteristics (8)4.DC Electrical Characteristics (9)4.1.Absolute Maximum Ratings (9)4.2.Recommended Operating Conditions (9)4.3.Typical Power Consumption (9)5.Bluetooth AC Electrical Characteristics (10)5.1.RX AC Characteristics (10)5.1.1.Basic Data Rate mode RX AC Characteristics (10)5.1.2.Enhanced Data Rate mode RX AC Characteristics (10)5.2.TX AC Characteristics (11)5.2.1.Basic Data Rate mode TX AC Characteristics (11)5.2.2.Enhanced Data Rate mode TX AC Characteristics (12)6.FM Receiver Electrical Characteristics (13)7.Application Schematic (13)8.Package Information (14)9.Solder Reflow Profile (15)9.1.RoHS Compliant (16)9.2.ESD Sensitivity (16)9.3.Storage Caution (16)10.Order Information (17)11.Contact Information (17)12.Revision History (18)© 2014 Beken Corporation Proprietary and Confidential Page 3 of 181.General DescriptionThe BK3515 chip is mainly used for smart phone and smart PAD applications to provide Bluetooth 2.1 + EDR and FM radio. It can make the Bluetooth and FM operate simultaneously and independently.The BK315 has three versions as follows.● BK3515A: Active HIGH flow controlpins, and SINGLE active link● BK3515D: Active LOW flow controlpins, and up to FOUR active links● BK3515H: Add internal clock buffer tosupport 26M crystal based on BK3515D1.1. Features1.1.1. BT Radio Features ● On-chip TX/RX switch● Polar modulation transmitter architecturewith very low power consumption and high TX performance ● Near-Zero IF receiver architecture with -89 dBm sensitivity ● Support for class 1, class 2 and class 3transmitting power requirement ● Fully integrated synthesizer withoutexternal loop filter component1.1.2. BT Baseband Features● Fully compliant with Bluetooth 2.1 +EDR specification ● Support Bluetooth Piconet and Scatternet ● Support up to 3Mbps high speed UARTinterface ● Support Sniff mode, hold mode and parkmode ● Support A-law, μ-law and CVSD digitizeaudio CODEC in PCM interface ● Provide I2C interface1.1.3. FM Features ● Support 64~108 MHz band ● Automatic gain control ● Automatic frequency control ● Seek tuning● Receive signal strength indicator ● Channel quality assessment ● Stereo decoder● Automatic stereo/mono switching ● Automatic noise suppression ● 50 us/75 us de-emphasis● Wide range reference clock supported● 32.768 kHz crystal oscillator1.1.4. Device Features ●Enhanced support for WLAN/BT Co-existence● Standby and sleep modes to minimizepower consumption ● External 26 MHz reference clock input ● Support both H4 and BCSP HCI interface1.2. Applications● Mobile handset, especially for smartphone ● MP3, MP4 player and PMP ● Other portable devices2.Pin DefinitionC L K _32KGPIO5/BT_PRIORITY/UART_CTSL D O _E NGPIO2/BT_ACTIVEI 2C _S C LI 2C _S D AVDD18NCC L K _E NV B A TN CVIO NCX INC PCM_SDO PCM_SDI PCM_CLK PCM_SYNCRFP FMIP U A R T _T X DUART_RXDNC FMING P I O _F M 3F M _O U T LN CG P I O 4/W I F I _A C T I V E /U A R T _R T SV D D 12F M _O U T RG P I O _F M 2Figure 1 BK3515A PackageC L K _32KGPIO5/UART_CTS L D O _E NGPIO2/BT_ACTIVE I 2C _S C LI 2C _S D AVDD18NCC L K _E NV B A TN CVIO NCX INC PCM_SDO PCM_SDI PCM_CLK PCM_SYNCRFPFMIP U A R T _T X DUART_RXDGPIO0/BT_PRIORITY FMING P I O _F M 3F M _O U T LG P I O 1/W I F I _A C T I V E G P I O 4/U A R T _R T SV D D 12F M _O U T RG P I O _F M 2Figure 2 BK3515D Package© 2014 Beken Corporation Proprietary and Confidential Page 5 of 18C L K _32KGPIO5/UART_CTS L D O _E NGPIO2/BT_ACTIVE I 2C _S C LI 2C _S D AVDD18NCC L K _E NV B A TX OVIO NCX INC PCM_SDO PCM_SDI PCM_CLK PCM_SYNCRFPFMIP U A R T _T X DUART_RXDGPIO0/BT_PRIORITY FMING P I O _F M 3F M _O U T LG P I O 1/W I F I _A C T I V E G P I O 4/U A R T _R T SV D D 12F M _O U T RG P I O _F M 2Figure 3 BK3515H PackageTable 1 Pin Definition (3515D is Pin2Pin Compatible with 3515B)© 2014 Beken Corporation Proprietary and ConfidentialPage 7 of 183.Functional Description3.1. Block DiagramR F PX IG P I O 5G P I O 4G P I O 2G P I O 1G P I O _F M 3C L K _E N L D O _E NV B A T V D D 12V I OPCM_CLK PCM_SYNC PCM_SDI PCM_SDOUART_TXD UART_RXD G P I O _F M 2C L K _32KI2C_SCL I2C_SDAV D D 18F M I PF M I N F M _O U T RF M _O U T LG P I O 0Figure 4 BK3515 Block DiagramAs shown in the Figure 4, the BK3515 integrates the Bluetooth transceiver, FM receiver, Bluetooth baseband controller, FM baseband signal processor and MCU etc. The Bluetooth transceiver integrates the low-IF single conversion RX and Polar loop modulation TX. The FM receiver employs a digital low-IF architecture that reduces external components. The Bluetooth baseband controller carries out the baseband protocols and other low-level link routines such as modulation/demodulation, packets processing, bit stream processing, frequency hopping and so on.3.2. I2C bus modeI2C bus mode only uses I2C_SCL and I2C_SDA pins. A transaction begins with the start condition, which occurs when I2C_SDA falls while I2C_SCL is high. Next, user drivers an 8-bit device ID serially on I2C_SDA, which is captured by BK3515 at the rising edge of I2C_SCL. The device ID of BK3515 is 0x70 or 0x80.After driving the device ID, user drives an 8-bit control word on I2C_SDA. The control word consists of a 7-bit start register address, followed by a read/write bit (read = 1, write = 0).For I2C host reading, the host must give an ACK to BK3515 after each byte access, and should give a NACK to BK3515 after last byte read out.200ns.3.3.I2C Control Interface CharacteristicsTable 2 I2C Control Interface CharacteristicsDetails please refer to BK3515 programming guide, BK1080 programming guide and Datasheet.© 2014 Beken Corporation Proprietary and ConfidentialPage 9 of 184.DC Electrical Characteristics4.1. Absolute Maximum RatingsTable 3 Absolute Maximum Ratings4.2. Recommended Operating ConditionsTable 4 Recommended Operating Conditions4.3.Typical Power ConsumptionTable 5 Bluetooth Typical Power ConsumptionTable 6 FM Typical Power Consumption5.Bluetooth AC Electrical Characteristics5.1. RX AC Characteristics5.1.1. Basic Data Rate mode RX AC Characteristics Table 7 Basic Data Rate mode RX AC Characteristics5.1.2. Enhanced Data Rate mode RX AC Characteristics Table 8 Enhanced Data Rate mode RX AC Characteristics© 2014 Beken Corporation Proprietary and Confidential Page 11 of 185.2. TX AC Characteristics5.2.1. Basic Data Rate mode TX AC Characteristics Table 9 Basic Data Rate mode TX AC Characteristics5.2.2.Enhanced Data Rate mode TX AC Characteristics Table 10 Enhanced Data Rate mode TX AC Characteristics© 2014 Beken Corporation Proprietary and Confidential Page 13 of 186.FM Receiver Electrical CharacteristicsTable 11 FM Receiver Characteristics7. Application SchematicPlease refer to the separate hardware reference design.8. Package InformationFigure 5 QFN 4x4 32 Pin Package diagram Table 12 QFN 4x4 32 Pin Package Dimensions© 2014 Beken Corporation Proprietary and Confidential Page 15 of 18Table 13 Package Marking9.Solder Reflow ProfileFigure 6 Classification Reflow ProfileTable 14 Solder Reflow Profile9.1.RoHS CompliantThe product does not contain lead, mercury, cadmium, hexavalent chromium, PBB&PBDE content in accordance with directive 2002/95/EC(RoHS).9.2.ESD SensitivityIntegrated circuits are ESD sensitive and can be damaged by static electricity. Proper ESD techniques should be used when handling these devices.9.3.Storage Caution1.Calculated shelf life in vacuum sealed bag 12 months at<40℃ and 90% relativehumidity(RH).2.Peak package body temperature 260℃.3.After vacuum sealed bag is opened ,devices that will be subjected to reflow solder orother high temperature process musta)Mounted within 168 hours of factory conditions<40℃/60%.b)Stored at 10% RH.10.Order InformationTable 15 BK3515 Order InformationMPQ: Minimum Package Quantity11.Contact InformationBeken Corporation Technical Support CenterShanghai officeSuite 3A, 1278 Keyuan Road, Zhangjiang High-Tech Park,Pudong New District, Shanghai, P.R. ChinaPhone: 86-21-51086811, 60871276Fax: 86-21-60871277Postal Code: 201203Email: info@Website: Shenzhen officeRoom 718, Shenzhen High-Tech Industrial Estate,Nanshan, Shenzhen, P.R. ChinaPhone: 86-755-2655 1063Postal Code: 518057© 2014 Beken Corporation Proprietary and Confidential Page 17 of 1812.Revision History。

PARAMETER CONDITIONS MIN TYP MAX UNITS Load Regulation(V IN – V OUT) = 3V10mA ≤ I OUT≤ I FULL LOADT J = 25°C (Notes 2, 3, 4, 6)0.10.3%●0.20.4% Dropout Voltage∆V REF = 1%, I OUT = I FULLLOAD (Notes 5, 6, 8)● 1.3 1.5V Current LimitLT1083(V IN – V OUT) = 5V●8.09.5A(V IN – V OUT) = 25V●0.4 1.0A LT1084(V IN – V OUT) = 5V● 5.5 6.5A(V IN – V OUT) = 25V●0.30.6A LT1085(V IN – V OUT) = 5V● 3.2 4.0A(V IN – V OUT) = 25V●0.20.5A Minimum Load Current(V IN – V OUT) = 25V●510mA Thermal Regulation T A = 25°C, 30ms PulseLT10830.0020.010%/W LT10840.0030.015%/W LT10850.0040.020%/W Ripple Rejection f = 120Hz, C ADJ = 25µF, C OUT = 25µF TantalumI OUT = I FULL LOAD, (V IN – V OUT) = 3V (Notes 6, 7, 8)●6075dB Adjust Pin Current T J = 25°C55µA●120µA Adjust Pin Current Change10mA ≤ I OUT≤ I FULL LOAD1.5V ≤ (V IN – V OUT) ≤ 25V (Note 6)●0.25µA Temperature Stability●0.5% Long Term Stability T A = 125°C, 1000 Hrs0.31% RMS Output Noise (% of V OUT)T A = 25°C10Hz = ≤ f ≤ 10kHz0.003% Thermal Resistance Junction-to-Case Control Circuitry/Power TransistorLT1083K Package0.6/1.6°C/WP Package0.5/1.6°C/W LT1084K Package0.75/2.3°C/WP Package0.65/2.3°C/WT Package0.65/2.7°C/W LT1085K Package0.9/3.0°C/WM, T Packages0.7/3.0°C/W ELECTRICAL CHARACTERISTICSNote 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired.Note 2: See thermal regulation specifications for changes in output voltage due to heating effects. Load and line regulation are measured at a constant junction temperature by low duty cycle pulse testing.Note 3: Line and load regulation are guaranteed up to the maximum power dissapation (60W for the LT1083, 45W for the LT1084 (K, P), 30W for the LT1084 (T) and 30W for the LT1085). Power dissipation is determined by the input/output differential and the output current. Guaranteed maximum power dissipation will not be available over the full input/output voltage range.Note 4: I FULL LOAD is defined in the current limit curves. The I FULLLOAD curve is defined as the minimum value of current limit as a function of input-to-output voltage. Note that the 60W power dissipation for theLT1083 (45W for the LT1084 (K, P), 30W for the LT1084 (T), 30W for the LT1085) is only achievable over a limited range of input-to-output voltage. Note 5: Dropout voltage is specified over the full output current range of the device. Test points and limits are shown on the Dropout Voltage curve.Note 6: For LT1083 I FULL LOAD is 5A for –55°C ≤ T J < –40°C and 7.5A for T J≥ –40°C.Note 7: 1.7V ≤ (V IN – V OUT) ≤ 25V for LT1084 at –55°C ≤ T J≤–40°C. Note 8: Dropout is 1.7V maximum for LT1084 at –55°C ≤ T J≤ –40°C.The ● denotes the specifications which apply over the full operating temperature range, otherwise specifications are at T A = 25°C.108345feAPPLICATIO S I FOR ATIO W UU U Connected as shown, R P is not multiplied by the divider ratio. R P is about 0.004Ω per foot using 16-gauge wire.This translates to 4mV/ft at 1A load current, so it is important to keep the positive lead between regulator and load as short as possible and use large wire or PC board traces.Thermal ConsiderationsThe LT1083 series of regulators have internal power and thermal limiting circuitry designed to protect the device under overload conditions. For continuous normal load conditions however, maximum junction temperature rat-ings must not be exceeded. It is important to give careful consideration to all sources of thermal resistance from junction to ambient. This includes junction-to-case, case-to-heat sink interface, and heat sink resistance itself. New thermal resistance specifications have been developed to more accurately reflect device temperature and ensure safe operating temperatures. The data section for these new regulators provides a separate thermal resistance and maximum junction temperature for both the Control Sec-tion and the Power Transistor . Previous regulators, with a single junction-to-case thermal resistance specification,used an average of the two values provided here and therefore could allow excessive junction temperatures under certain conditions of ambient temperature and heat sink resistance. To avoid this possibility, calculations should be made for both sections to ensure that both thermal limits are met.Junction-to-case thermal resistance is specified from the IC junction to the bottom of the case directly below the die.This is the lowest resistance path for heat flow. Proper mounting is required to ensure the best possible thermal flow from this area of the package to the heat sink. Thermalcompound at the case-to-heat sink interface is strongly recommended. If the case of the device must be electri-cally isolated, a thermally conductive spacer can be used,as long as its added contribution to thermal resistance is considered. Note that the case of all devices in this series is electrically connected to the output.For example, using an LT1083CK (TO-3, Commercial) and assuming:V IN (max continuous) = 9V, V OUT = 5V, I OUT = 6A,T A = 75°C, θHEAT SINK = 1°C/W,θCASE-TO-HEAT SINK = 0.2°C/W for K package with thermal compound.Power dissipation under these conditions is equal to:P D = (V IN – V OUT )(I OUT ) = 24W Junction temperature will be equal to:T J = T A + P D (θHEAT SINK + θCASE-TO-HEAT SINK + θJC )For the Control Section:T J = 75°C + 24W (1°C/W + 0.2°C/W + 0.6°C/W) = 118°C 118°C < 125°C = T JMAX (Control Section Commercial Range)For the Power Transistor:T J = 75°C + 24W (1°C/W + 0.2°C/W + 1.6°C/W) = 142°C 142°C < 150°C = T JMAX (Power Transistor Commercial Range)In both cases the junction temperature is below the maximum rating for the respective sections, ensuring reliable operation.11121314Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.1516LT/LT 0505 REV E • PRINTED IN USA© LINEAR TECHNOLOGY CORPORA TION 1994Linear Technology Corporation1630 McCarthy Blvd., Milpitas, CA 95035-7417(408) 432-1900 ● F AX: (408) 434-0507 ● 。