脂肪乳氨基酸(17)葡萄糖(11%)注射液说明书--卡文

感謝您採用台達高功能.迷你型交流電機驅動器VFD-M系列。

VFD-M係採用高品質的元件、材料及融合最新的微電腦控制技術製造而成。

此產品說明提供給使用者安裝、參數設定、異常診斷、排除及日常維護交流電機驅動器相關注意事項。

為了確保能夠正確地安裝及操作交流電機驅動器，請在裝機之前，詳細閱讀本產品說明，並請妥善保存隨機附贈之光碟內容及交由該機器的使用者。

交流電機驅動器乃精密的電力電子產品，為了操作者及機械設備的安全，請務必交由專業的電機工程人員安裝試車及調整參數，本產品說明中有[ 危險] 、[ 注意] 等符號說明的地方請務必仔細研讀，若有任何疑慮的地方請連絡本公司各地的代理商咨詢，我們的專業人員會樂于為您服務。

以下各事項請使用者在操作本產品時特別留意DANGER..本驅動器在使用前，務必正確可靠接地。

..實施配線，務必關閉電源。

.切斷交流電源后，交流電機驅動器READY指示燈未熄滅前，表示交流電機驅動內部仍有高壓十分危險，請勿觸摸內部電路及零組件。

.交流電機驅動器的內部電路板有CMOS IC極易受靜電的破壞，故在未做好防靜電措施前請勿用手觸摸電路板。

.絕對不可以自行改裝交流電機驅動器內部的零件或線路。

..交流電機驅動器端子E務必正確的接地。

230V系列以第三種接地，460V系列以特種接地。

..本系列是用于控制三相感應電機的變速運轉，不能用于單相電機或作其它用途。

.本系列不能使用危及人身安全的場合。

.請防止小孩或一般無關民眾接近交流電機驅動器。

.交流電源絕不可輸入至交流電機驅動器輸出端子U/T1、V/T2、W/T3中。

.請勿對交流電機驅動器內部的零組件進行耐壓測試，因交流電機驅動器所使用的半導體易受高壓擊穿而損壞。

.即使三相交流電機是停止的，交流電機驅動器的主回路端子仍然可能帶有危險的高.只有合格的電機專業人員才可以安裝、配線及修理保養交流電機驅動器。

.當交流電機驅動器使用外部端子為運轉命令來源時，可能在輸入電源后會立即讓電機開始運轉，此時若有人員在現場易造成危險。

16-11-08 08:31D a t e o f i s s u e : 2016-11-08250940_e n g .x m lInstructionManual electrical apparatus for hazardous areas Device category 1Gfor use in hazardous areas with gas, vapour and mist EC-T ype Examination CertificateCE marking ATEX marking ¬ II 1G Ex ia IIC T6…T1 G aThe Ex-related marking can also be printed on the enclosed label.Standards EN 60079-0:2012+A11:2013 EN 60079-11:2012 Ignition protection "Intrinsic safety"Use is restricted to the following stated conditions Appropriate typeNJ 10-30GK-SN...Effective internal inductivity C i ≤ 120 nF ; a cable length of 10 m is considered.Effective internal inductance L i≤ 150 µH ; a cable length of 10 m is considered.G eneralThe apparatus has to be operated according to the appropriate data in the data sheet and in this instruction manual. The EU-type examination certificate has to beobserved. The special conditions must be adhered to! The ATEX directive and there-fore the EU-type-examination certificates generally apply only to the use of electrical apparatus under atmospheric conditions.The device has been checked for suitability for use at ambient temperatures of > 60 °C by the named certification authority. The surface temperature of the device remains within the required limits.For the use of apparatus outside of atmospheric conditions, a reduction of the per-missible minimum ignition energies may need to be considered.Ambient temperatureDetails of the correlation between the type of circuit connected, the maximum per-missible ambient temperature, the temperature class, and the effective internal reac-tance values can be found on the EC-type examination certificate. Note: Use the temperature table for category 1 The 20 % reduction in accordance with EN 1127-1 has already been applied to the temperature table for category 1.Installation, commissioningLaws and/or regulations and standards governing the use or intended usage goal must be observed. The intrinsic safety is only assured in connection with an appro-priate related apparatus and according to the proof of intrinsic safety. The associated apparatus must satisfy the requirements of category ia. Because of the risk of igni-tion, which can occur due to faults and/or transient currents in the equipotential bonding system, galvanic isolation is preferable in the supply and signal circuits. Associated apparatus without electrical isolation can only be used if the correspond-ing requirements of IEC 60079-14 are satisfied. If the Ex-related marking is printed only on the supplied label, then this must be attached in the immediate vicinity of the sensor. The sticking surface for the label must be clean and free from grease. The attached label must be legible and indelible, including in the event of possible chem-ical corrosion.Maintenance No changes can be made to apparatus, which are operated in hazardous areas.Repairs to these apparatus are not possible.Special conditionsProtection from mechanical dangerWhen using the device in a temperature range of -60 °C to -20 °C, protect the sensor against the effects of impact by installing an additional enclosure. The information regarding the minimum ambient temperature for the sensor as provided in the datasheet must also be observed.Electrostatic chargeWhen used in group IIC non-permissible electrostatic charges should be avoided on the plastic housing parts. Avoid electrostatic charges that can cause electrostatic dis-charge when installing or operating the device. Information on electrostatic hazards can be found in the technical specification IEC/TS 60079-32-1.Degree of protection required when installing connecting componentsThe connecting parts of the sensor must be set up in such a way that degree of pro-tection IP20, in accordance with lEC 60529, is achieved as a minimum.R e l e a s e d a t e : 2016-11-08 08:31D a t e o f i s s u e : 2016-11-08250940_e n g .x m lInstructionManual electrical apparatus for hazardous areas Device category 2Gfor use in hazardous areas with gas, vapour and mist EC-T ype Examination CertificateCE marking ATEX marking ¬ II 1G Ex ia IIC T6…T1 G aThe Ex-related marking can also be printed on the enclosed label.Standards EN 60079-0:2012+A11:2013 EN 60079-11:2012 Ignition protection "Intrinsic safety"Use is restricted to the following stated conditions Appropriate typeNJ 10-30GK-SN...Effective internal inductivity C i≤ 120 nF ; a cable length of 10 m is considered.Effective internal inductance L i ≤ 150 µH ; a cable length of 10 m is considered.G eneralThe apparatus has to be operated according to the appropriate data in the data sheet and in this instruction manual. The EU-type examination certificate has to beobserved. The special conditions must be adhered to! The ATEX directive and there-fore the EU-type-examination certificates generally apply only to the use of electrical apparatus under atmospheric conditions.The device has been checked for suitability for use at ambient temperatures of > 60 °C by the named certification authority. The surface temperature of the device remains within the required limits.For the use of apparatus outside of atmospheric conditions, a reduction of the per-missible minimum ignition energies may need to be considered.Maximum permissible ambient temperature T amb Details of the correlation between the type of circuit connected, the maximum per-missible ambient temperature, the temperature class, and the effective internal reac-tance values can be found on the EC-type examination certificate.Installation, commissioningLaws and/or regulations and standards governing the use or intended usage goal must be observed. The intrinsic safety is only assured in connection with an appro-priate related apparatus and according to the proof of intrinsic safety. If the Ex-related marking is printed only on the supplied label, then this must be attached in the imme-diate vicinity of the sensor. The sticking surface for the label must be clean and free from grease. The attached label must be legible and indelible, including in the event of possible chemical corrosion.Maintenance No changes can be made to apparatus, which are operated in hazardous areas.Repairs to these apparatus are not possible.Special conditionsProtection from mechanical dangerWhen using the device in a temperature range of -60 °C to -20 °C, protect the sensor against the effects of impact by installing an additional enclosure. The information regarding the minimum ambient temperature for the sensor as provided in the datasheet must also be observed.Degree of protection required when installing connecting componentsThe connecting parts of the sensor must be set up in such a way that degree of pro-tection IP20, in accordance with lEC 60529, is achieved as a minimum.16-11-08 08:31D a t e o f i s s u e : 2016-11-08250940_e n g .x m lInstructionManual electrical apparatus for hazardous areas Device category 3G (nA) for use in hazardous areas with gas, vapour and mist Certificate of ComplianceCE marking ATEX marking ¬ II 3G Ex nA IIC T6 GcThe Ex-related marking can also be printed on the enclosed label.Standards EN 60079-0:2012+A11:2013, EN 60079-15:2010 Ignition protection category "n"Use is restricted to the following stated conditionsG eneralThe apparatus has to be operated according to the appropriate data in the data sheet and in this instruction manual. The data stated in the data sheet are restricted by this operating instruction! The special conditions must be observed!Installation, commissioningLaws and/or regulations and standards governing the use or intended usage goal must be observed. If the Ex-related marking is printed only on the supplied label, then this must be attached in the immediate vicinity of the sensor. The sticking surface for the label must be clean and free from grease. The attached label must be legible and indel-ible, including in the event of possible chemical corrosion.MaintenanceNo changes can be made to apparatus, which are operated in hazardous areas.Repairs to these apparatus are not possible.Special conditionsMinimum series resistance R V A minimum series resistance R V is to be provided between the power supply voltage and the proximity switch in accordance with the following list. This can also be assured by using a switch amplifier.Maximum operating voltage U BmaxThe maximum permissible operating voltage UB max is restricted to the values in the following list. T olerances are not permissible.Maximum permissible ambient temperature T Umax Values can be obtained from the following list, depending on the max. operating voltage Ub max and the minimum series resistance Rv. at U Bmax =9 V , R V =562 Ω58 °C (136.4 °F) using an amplifier in accordance with EN 60947-5-6 58 °C (136.4 °F)Protection from mechanical danger The sensor must not be exposed to ANY FORM of mechanical danger.Protection from UV lightThe sensor and the connection cable must be protected from damaging UV-radiation. This can be achieved when the sensor is used in internal areas.Protection of the connection cable The connection cable must be prevented from being subjected to tension and torsional loading.Protection against transients Ensure transient protection is provided and that the maximum value of the transient pro-tection (140% of 85 V) is not exceeded.Material selection accessoriesWhen selecting accessories, ensure that the material allows the temperature of the enclosure to rise to up to 70 °C.R e l e a s e d a t e : 2016-11-08 08:31D a t e o f i s s u e : 2016-11-08250940_e n g .x m lInstructionManual electrical apparatus for hazardous areas Device category 1Dfor use in hazardous areas with combustible dust EC-T ype Examination CertificateCE marking ATEX marking ¬ II 1D Ex ia IIIC T135°C DaThe Ex-related marking can also be printed on the enclosed label.Standards EN 60079-0:2012+A11:2013 EN 60079-11:2012Ignition protection "Intrinsic safety" Use is restricted to the following stated condi-tionsAppropriate typeNJ 10-30GK-SN...Effective internal inductivity C i≤ 120 nF ; a cable length of 10 m is considered.Effective internal inductance L i ≤ 150 µHA cable length of 10 m is considered.G eneralThe apparatus has to be operated according to the appropriate data in the data sheet and in this instruction manual. The EU-type examination certificate has to beobserved. The ATEX directive and therefore the EU-type-examination certificates generally apply only to the use of electrical apparatus under atmospheric conditions.The device has been checked for suitability for use at ambient temperatures of > 60 °C by the named certification authority. The surface temperature of the device remains within the required limits.For the use of apparatus outside of atmospheric conditions, a reduction of the per-missible minimum ignition energies may need to be considered.Permissible ambient temperature rangeDetails of the correlation between the type of circuit connected, the maximum per-missible ambient temperature, the surface temperature, and the effective internal reactance values can be found on the EC-type-examination certificate. The maxi-mum permissible ambient temperature of the data sheet must be noted, in addition, the lower of the two values must be maintained.Installation, commissioningLaws and/or regulations and standards governing the use or intended usage goal must be observed. The intrinsic safety is only assured in connection with an appro-priate related apparatus and according to the proof of intrinsic safety. If the Ex-related marking is printed only on the supplied label, then this must be attached in the imme-diate vicinity of the sensor. The sticking surface for the label must be clean and free from grease. The attached label must be legible and indelible, including in the event of possible chemical corrosion.Maintenance No changes can be made to apparatus, which are operated in hazardous areas.Repairs to these apparatus are not possible.Special conditionsProtection from mechanical dangerWhen using the device in a temperature range of -60 °C to -20 °C, protect the sensor against the effects of impact by installing an additional enclosure. The information regarding the minimum ambient temperature for the sensor as provided in the datasheet must also be observed.Electrostatic chargeAvoid electrostatic charges that can cause electrostatic discharge when installing or operating the device. Information on electrostatic hazards can be found in the techni-cal specification IEC/TS 60079-32-1. Do not attach the nameplate provided in areas where electrostatic charge can build up.Degree of protection required when installing connecting componentsThe connecting parts of the sensor must be set up in such a way that degree of pro-tection IP20, in accordance with lEC 60529, is achieved as a minimum.16-11-08 08:31D a t e o f i s s u e : 2016-11-08250940_e n g .x m lInstructionManual electrical apparatus for hazardous areas Device category 3D for use in hazardous areas with combustible dust Certificate of ComplianceCE marking ATEX marking ¬ II 3D Ex tc IIIC T80°C DcThe Ex-related marking can also be printed on the enclosed label.Standards EN 60079-0:2012+A11:2013, EN 60079-31:2014Protection by enclosure "tc" Some of the information in this instruction manual is more specific than the information provided in the datasheet.G eneralThe corresponding datasheets, declarations of conformity, EC-type examination certifi-cates, certifications, and control drawings, where applicable (see datasheets), form an integral part of this document. These documents can be found at . The maximum surface temperature of the device was determined without a layer of dust on the apparatus. Some of the information in this instruction manual is more specific than the information provided in the datasheet.Installation, commissioningLaws and/or regulations and standards governing the use or intended usage goal must be observed. If the Ex-related marking is printed only on the supplied label, then this must be attached in the immediate vicinity of the sensor. The sticking surface for the label must be clean and free from grease. The attached label must be legible and indel-ible, including in the event of possible chemical corrosion.MaintenanceNo changes can be made to apparatus, which are operated in hazardous areas.Repairs to these apparatus are not possible.Special conditionsMinimum series resistance R V A minimum series resistance RV is to be provided between the power supply voltage and the proximity switch in accordance with the following list. This can also be assured by using a switch amplifier.Maximum operating voltage U BmaxThe maximum permissible operating voltage UBmax must be restricted to the values given in the following list. T olerances are not permitted.Maximum permissible ambient temperature T Umax Values can be obtained from the following list, depending on the max. operating voltage Ub max and the minimum series resistance Rv. at U Bmax =9 V , R V =562 Ω58 °C (136.4 °F) using an amplifier in accordance with EN 60947-5-6 58 °C (136.4 °F)Protection from mechanical danger The sensor must not be exposed to ANY FORM of mechanical danger.Protection from UV lightThe sensor and the connection cable must be protected from damaging UV-radiation. This can be achieved when the sensor is used in internal areas.Protection of the connection cable The connection cable must be prevented from being subjected to tension and torsional loading.Electrostatic chargeAvoid electrostatic charges that can cause electrostatic discharge when installing or operating the device. Information on electrostatic hazards can be found in the technical specification IEC/TS 60079-32-1. Do not attach the nameplate provided in areas where electrostatic charge can build up.。

INTERFACE APPLICATION NOTEAPPLICABILITY TABLEPRODUCTSLE866-SV1 SW VER.: 23.00.003NOTE:The features described in the present document are provided by the productsequipped with the software versions equal or higher than the versions shown inthe table. See also the Document History chapter.DISCLAIMERLEGAL NOTICEThese Specifications are general guidelines pertaining to product selection and application and may not be appropriate for your particular project. Telit (which hereinafter shall include, its agents, licensors and affiliated companies) makes no representation as to the particular products identified in this document and makes no endorsement of any product. Telit disclaims any warranties, expressed or implied, relating to these specifications, including without limitation, warranties or merchantability, fitness for a particular purpose or satisfactory quality. Without limitation, Telit reserves the right to make changes to any products described herein and to remove any product, without notice.It is possible that this document may contain references to, or information about Telit products, services and programs, that are not available in your region. Such references or information must not be construed to mean that Telit intends to make available such products, services and programs in your area.USE AND INTELLECTUAL PROPERTY RIGHTSThese Specifications (and the products and services contained herein) are proprietary to Telit and its licensors and constitute the intellectual property of Telit (and its licensors). All title and intellectual property rights in and to the Specifications (and the products and services contained herein) is owned exclusively by Telit and its licensors. Other than as expressly set forth herein, no license or other rights in or to the Specifications and intellectual property rights related thereto are granted to you. Nothing in these Specifications shall, or shall be deemed to, convey license or any other right under Telit’s patents, copyright, mask work or other intellectual property rights or the rights of others.You may not, without the express written permission of Telit: (i) copy, reproduce, create derivative works of, reverse engineer, disassemble, decompile, distribute, merge or modify in any manner these Specifications or the products and components described herein; (ii) separate any component part of the products described herein, or separately use any component part thereof on any equipment, machinery, hardware or system; (iii) remove or destroy any proprietary marking or legends placed upon or contained within the products or their components or these Specifications; (iv) develop methods to enable unauthorized parties to use the products or their components; and (v) attempt to reconstruct or discover any source code, underlying ideas, algorithms, file formats or programming or interoperability interfaces of the products or their components by any means whatsoever. No part of these Specifications or any products or components described herein may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means, without the prior express written permission of Telit.HIGH RISK MATERIALSComponents, units, or third-party products contained or used with the products described herein are NOT fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control equipment in the following hazardous environments requiring fail-safe controls: the operation of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic Control, Life Support, or Weapons Systems (“High Risk Activities"). Telit, its licensors and its supplier(s) specifically disclaim any expressed or implied warranty of fitness for such High Risk Activities. TRADEMARKSYou may not and may not allow others to use Telit or its third party licensors’ trademarks. To the extent that any portion of the products, components and any accompanying documents contain proprietary and confidential notices or legends, you will not remove such notices or legends.THIRD PARTY RIGHTSThe software may include Third Party Right software. In this case you agree to comply with all terms and conditions imposed on you in respect of such separate software. In addition to Third Party Terms, the disclaimer of warranty and limitation of liability provisions in this License shall apply to the Third Party Right software.TELIT HEREBY DISCLAIMS ANY AND ALL WARRANTIES EXPRESS OR IMPLIED FROM ANY THIRD PARTIES REGARDING ANY SEPARATE FILES, ANY THIRD PARTY MATERIALS INCLUDED IN THE SOFTWARE, ANY THIRD PARTY MATERIALS FROM WHICH THE SOFTWARE IS DERIVED (COLLECTIVELY “OTHER CODE”), AND THE USE OF ANY OR ALL THE OTHER CODE IN CONNECTION WITH THE SOFTWARE, INCLUDING (WITHOUT LIMITATION) ANY WARRANTIES OF SATISFACTORY QUALITY OR FITNESS FOR A PARTICULAR PURPOSE.NO THIRD PARTY LICENSORS OF OTHER CODE SHALL HAVE ANY LIABILITY FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING WITHOUT LIMITATION LOST PROFITS), HOWEVER CAUSED AND WHETHER MADE UNDER CONTRACT, TORT OR OTHER LEGAL THEORY, ARISING IN ANY WAY OUT OF THE USE OR DISTRIBUTION OF THE OTHER CODE OR THE EXERCISE OF ANY RIGHTS GRANTED UNDER EITHER OR BOTH THIS LICENSE AND THE LEGAL TERMS APPLICABLE TO ANY SEPARATE FILES, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.Copyright © Telit Communications PLC.CONTENTS1Introduction 6Scope 6Audience 6Contact Information, Support 6List of acronyms 7Text Conventions 81.6.Related Documents 8 2Overview 9 3DVI OVERVIEW 10 4DVI BUS 11DVI PIN LIST 115DVI AT COMMANDS 12AT#DVI 12AT#DVIEXT 136DVI Setting Examples 15Normal (I2S) Mode 16Module is Master 16Configure the module in Master/Normal (I2S) Mode (DVI Bus) 16 Configure the codec in Slave/Normal (I2S) Mode (I2C Bus) 17 7Annex 19I2S Bus Overview 19Schematic 208Document History 21Revisions 211 INTRODUCTIONScopeThe present document provides the reader with a guideline concerning the setting and use of the Digital Voice Interface developed on the Telit’s LE866 modules shown in the Applicability Table.This Application Note covers the configurations of the Digital Voice Interface, e.g.: the selections of the voice sampling frequency, the bit number of the voice sample, the audio formats, etc. In addition, the document shows some configurations of a popular Audio Codec connected to the module. These activities are accomplished via I2S and I2C buses; the hardware characteristics of the two buses are beyond the scope of the document.AudienceThe document is intended for those users that need to develop applications dealing with signal voice in digital format.Contact Information, SupportFor general contact, technical support services, technical questions and report documentation errors contact Telit Technical Support at:*******************************************************Alternatively, use:/supportFor detailed information about where you can buy the Telit modules or for recommendations on accessories and components visit:Our aim is to make this guide as helpful as possible. Keep us informed of your comments and suggestions for improvements.Telit appreciates feedback from the users of our information.List of acronymsAcronym DescriptionTTSC Telit Technical Support CentreUSB Universal Serial BusDVI Digital Voice InterfaceDTE Data Terminal EquipmentLTE Long Term EvolutionI2C Inter-Integrated CircuitI2S Inter-IC SoundMSB Most Significant BitSIM Subscriber Identification ModuleADC Analog – Digital ConverterDAC Digital – Analog ConverterI/O Input OutputGPIO General Purpose Input OutputCMOS Complementary Metal – Oxide Semiconductor CLK ClockCS Chip SelectRTC Real Time ClockPCB Printed Circuit BoardESR Equivalent Series ResistanceVSWR Voltage Standing Wave RadioVNA Vector Network AnalyzerText ConventionsDanger – This information MUST be followed or catastrophic equipment failureor bodily injury may occur.Caution or Warning – Alerts the user to important points about integrating themodule, if these points are not followed, the module and end user equipmentmay fail or malfunction.Tip or Information – Provides advice and suggestions that may be useful whenintegrating the module.All dates are in ISO 8601 format, i.e. YYYY-MM-DD.1.6. Related Documents∙LE866 HW User Guide 1VV0301210∙LE866 AT Commands Reference Guide 80471ST10691A∙Telit EVK2 User Guide 1vv0300704∙MAX9867 Ultra-Low Power Stereo Audio Codec documentation ref to MAXIM2 OVERVIEWThe aim of this document is the description of some hardware solutions useful for developing a product with the Telit LE866 module.In this document all the basic functions of a mobile phone will be taken into account; for each one of them a proper hardware solution will be suggested and eventually the wrong solutions and common errors to be avoided will be evidenced. Obviously this document cannot embrace the whole hardware solutions and products that may be designed. The wrong solutions to be avoided shall be considered as mandatory, while the suggested hardware configurations shall not be considered mandatory, instead the information given shall be used as a guide and a starting point for properly developing your product with the Telit LE866 module. For further hardware details that may not be explained in this document refer to the Telit LE866 Product Description document where all the hardware information is reported.NOTICE:(EN) The integration of the LTE LE866 cellular module within user applicationshall be done according to the design rules described in this manual.(IT) L’integrazione del modulo cellulare LTE LE866all’interno dell’applicazionedell’utente dovrà rispettare le indicazioni progettuali descritte in questomanuale.(DE) Die Integration des LE866 LTE Mobilfunk-Moduls in ein Gerät mußgemäß der in diesem Dokument beschriebenen Kunstruktionsregeln erfolgen.(SL) Integracija LTE LE866 modula v uporabniški aplikaciji bo moralaupoštevati projektna navodila, opisana v tem priročniku.(SP) La utilización del modulo LTE LE866 debe ser conforme a los usos paralos cuales ha sido deseñado descritos en este manual del usuario.(FR) L’intégration du module cellulaire LTE LE866 dans l’application del’utilisateur sera faite selon les règles de conception décrites dans ce manuel.(HE)LE866The information presented in this document is believed to be accurate and reliable. However, no responsibility is assumed by Telit Communications S.p.A. for its use, nor any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent rights of Telit Communications S.p.A. other than for circuitry embodied in Telit products. This document is subject to change without notice.3 DVI OVERVIEWBefore dealing with the configuration and technical aspects of the Telit’s Digital Voice Interface (DVI) it is useful to illustrate briefly how this interface can be used, refer to fig. 1.The voice coming from the downlink, in digital format, is captured by the dedicated software running on the Telit’s module and directed to t he Digital Voice Interface. The Audio Codec decodes the voice and sends it to the speaker. The voice captured by the microphone is coded by the Audio Codec and directed through the Digital Voice Interface to the module that collects the received voice, in digital format, and sends it on the uplink.fig. 1: Example of Digital Voice Interface UseNOTE:The Digital Voice Interface supports the Echo canceller functionality, which is beyond the scope of the present document. Refer to the AT Commands specification for the specific AT commands.Audio CodecTelit ModuleDigital Voice InterfaceUplinkDownlink4DVI BUSDVI PIN LISTThe physical DVI interface provided by the Telit’s modules is based on the standard I2S Bus. An overview of the standard I2S Bus is described in chapter 6.1.The following Table summarizes the DVI signals and a short description for each one of them; refer to Telit Hardware User Guide, in accordance with the used module, to have information on electrical characteristics and signals pin-out.The figures below show the two configurations of the DVI interface relating to the Word Alignment and Clock signals. When the module is Master the Clock and Word Alignment signals (also called Word Alignment Output WAO) are generated by the module itself, otherwise, when it is Slave, both signals are generated by the connected Audio Device Codec.In general, before establishing a voice call it is possible to select one of the two configurations and in accordance with the selected setting, configure the module and the codec via the AT commands described in At User Guide.The next pages describe the use of these AT commands.fig. 2: Master and Slave ConfigurationsSignal Function Description DVI_CLK ClockData ClockDVI_WAO Word Alignment Frame Synchronism DVI_RX Serial audio data input Received Data DVI_TX Serial audio data outputTransmitted Data5 DVI AT COMMANDSSeveral DVI audio bus configurations are available via AT#DVI and AT#DVIEXT commands. The tables in the following sub-sections summarize their parameters; refer to the AT Commands User Guide for the syntax details.AT#DVIThe DVI signals are Alternate functions of GPIOs 1, 2, 3 and 4.The AT#DVI command enables/disables the DVI interface, selects the DVI port, and sets the module in Master or Slave configuration. The table below shows the AT command parameters values.NOTE:<mode> =2 and <clockmode>=0 not supported on LE866AT#DVI =<mode>,<dviport>,<clockmode><mode><dviport><clockmode>0: disable DVI interface, factory setting 1: enable DVI interface 2: reserved 2: select DVI port 2, factory setting0: DVI slave1: DVI master, factory settingAT#DVIEXTAT#DVIEXT command sets the module in Normal or Burst DVI Audio Format:∙ In Normal DVI Audio Format the WAO signal defines the left and right audio channel. ∙ In Burst DVI Audio Format the WAO signal defines the beginning of the audio frame.The following table shows the AT command parameters values.Tab. 1: DVI Audio Format configuration via AT#DVIEXT commandNOTE:The preferred setting for LE866 is AT#DVIEXT=1,1,1 Please avoid using #DVIEXT command when a call is activeAT#DVIEXT <config>,<samplerate>,<samplewidth>,<audiomode>,<edge>DVI Audio Format (mode)<config><samplerate><samplewidth><audiomode><edge> Normal (I2S) 1(factory setting)0: 8 [KHz] sample rate1: 16 [KHz] sample rate 0: 8 bits per sample1: 16 bits per sample0: Mono Mode0: data is transmitted on the falling edge of the clock and sampled on its rising edge, factory setting.1: data is transmitted on the rising edge of the clock and sampled on its falling edge. Burst (PCM)0: 8 [KHz] sample rate factory setting1: 16 [KHz] sample rate0: 8 bits per sample1: 16 bit per sampledon’t care if the <edge> value is 1 or 0, data isalways transmitted on the rising edge of the clock and sampled on its falling edge6 DVI SETTING EXAMPLESThe next chapters show examples concerning the audio formats supported by the DVI audio bus in Master and Slave configurations. All the following setting examples are performed using the hardware configuration shown in fig. 3. I2C bus is used to configure the MAX9867 Codec: the user by means of AT commands can control the codec. The DVI bus provides the voice connection between the two devices.fig. 3: Telit Module/Codec ConnectionsThe setting examples are organized as shown in the figure below.fig. 4: DVI ConfigurationsNOTE:The examples use the MAX9867 Codec, see chapter 6.2 for a schematic reference design. In general, the user can use any codec compliant with the technical requirements of the used module.Normal ModeBurst ModeAudio Format ModeModule MasterModule SlaveModule MasterModule SlaveNormal (I2S) ModeModule is MasterIn this configuration the WAO and CLK signals are generated by the module. The WAO signal defines the frame of the two audio channels: left and right, refer to fig. 5. The BitClockFrequency (CLK) is provided by the following expression:eRate AudioSampl ber ChannelNum t DataWordBi equency BitClockFr ⨯⨯=The BitClockFrequency values are shown in Tab. 4.Tab. 2: BitClockFrequency generated by the module in Master/Normal ModeHere are the lists of AT commands used to set the module in Master/Normal (I2S) Mode, andconfigure the codec in accordance with the module setting. The meanings of the used parameters values are described after each commandConfigure the module in Master/Normal (I2S) Mode (DVI Bus)AT#DVI=1,2,1 OK 1 enable DVI interface 2 use DVI port 2 1 set the module as Master (factory setting)Setting for BitClockFrequency = 512 KHzAT#DVIEXT=1,1,1,0,0 OK 1 Normal Mode 1 sample rate 16 KHz 1 16 bits per sample 0 Mono 0 data is transmitted on the falling edge of clock and sampled on the rising edge<samplewidth>DataWordBitAudio ChannelsAudioSampleRate8 KHz16 KHz0 8 2 128 256 1162256512Configure the codec in Slave/Normal (I2S) Mode (I2C Bus)AT#I2CWR=X,Y,30,4,19>00109000100A330000330C0C09092424400060OKX GPIO number used as SDA, refer to AT User GuideY GPIO number used as SCL, refer to AT User Guide30 Device address on I2C, refer to MAX9867 documentation4 Register address from which start the writing, refer to MAX9867 documentation 19 number of bytes to write>00109000….. refer to MAX9867 documentationAT#I2CWR=X,Y,30,17,1>8AOKX GPIO number used as SDA, refer to AT User GuideY GPIO number used as SCL, refer to AT User Guide30 Device address on I2C, refer to MAX9867 documentation17 Register address where write data, refer to MAX9867 documentation1 number of bytes to write>8A refer to MAX9867 documentationThe fig. 5 shows the screenshot of the timing diagram, captured by a logic analyzer, using the above described module/codec setting. The CLK (512 KHz) and WAO signals are generated by the module, data is transmitted on the rising edge of clock and sampled on the falling edge.Left channel:: Data transitions occur on the rising edge of the CLK: Data are latched on the falling edge of the CLKRight channel:: Data transitions occur on the rising edge of the CLK: Data are latched on the falling edge of the CLKfig. 3: Module is Master/Normal mode/16 bits per sample/Mono/<edge> = 07ANNEXI 2S Bus OverviewThis chapter provides a short description of the standard I2S bus. This standard suitably modified is used by the DVI interface implemented on the Telit modules.The standard I2S is an electrical serial bus designed for connecting digital audio devices. This popular serial bus has been developed by Philips® in 1986 as a 3-wire bus for interfacing to audio chips such as codecs. It is a simple data interface, without any form of address or device selection.Refer to fig. 9: the I2S design handles audio data separately from clock signals. On an I2S bus, there is only one bus master and one transmitter.In high-quality audio applications involving a codec, the codec is typically the master so that it has precise control over the I2S bus clock.An I2S bus design consists of the following serial bus lines: • SD: Serial Data • WS:Word Select • Serial Clock:SCKThe I2S bus carries two channels (left and right) 8 bit long, which are typically used to carry stereo audio data streams. The data alternates between left and right channels, as controlled by the word select signal driven by the bus master.fig. 4: I2S Bus Configurationsword select WSdata SDword select WS data SDSchematicA schematic example of an interface between a Telit Module and the MAX9867 Codec could be the following:LE866 DIGITAL VOICE INTERFACE APPLICATION NOTE80471NT11521A Rev.0 • 2017-01-1621 of 22Reproduction forbidden without Telit Communications S.p.A. written authorization – All Rights Reserved 8DOCUMENT HISTORYRevisions RevisionDate Changes 02017-01-16 Initial Version。

iPhone15会全系使用A17芯片吗_苹果iPhone15系列尺寸iPhone15会全系使用A17芯片吗iPhone 14系列，只有Pro 系列采用了全新的A16 芯片，iPhone 14 系列仍然继续使用 A15 芯片。

尽管与此前的iPhone 13 系列相比，在 GPU 性能方面有所提升，但因为成本等问题，iPhone 14系列只有部分采用了最新芯片。

传闻称九月发布的iPhone 15 系列将引入全新的 A17 芯片，苹果今年会延续以往的策略吗?A17初期将采用N3B工艺，据说是专门为苹果设计的，苹果独享，对比N5工艺全方位提升，但缺点是成本高、良率低。

所以iPhone 15系列苹果可能会延续以往的策略，为不同系列的 iPhone 配备不同的芯片。

iPhone 15 Pro、iPhone 15 Pro Max首发将使用的A17;iPhone 15、iPhone 15 Plus则继续使用A16，这种差异化的处理器配置也有助于满足不同用户对手机性能的需求。

苹果今年发布的 iPhone 15 Pro 和 iPhone 15 Pro Max 中将使用 A17 芯片，明年发布的 iPhone 16 标准版也将使用 A17 芯片。

但两代 A17 芯片属于两个版本，存在根本性不同。

今年亮相的 A17 芯片预计将成为苹果首款采用 3nm 工艺制造的芯片，与A14、A15 和 A16 芯片所使用的 5nm 技术相比，性能和效率将得到重大改进。

这一代 A17 芯片使用的是台积电的 N3B 工艺，但苹果计划在明年将 A17 切换到 N3E 工艺。

而 N3E 工艺被认为是 N3B 工艺的简化版，此举是苹果采取的一项削减成本的措施，但可能会以降低能效为代价。

苹果iPhone15系列尺寸重量曝光据数码博主最新发布的信息显示，与此前曝光的消息基本一致，全新的iPhone 15系列依旧将推出四款机型，入门版的iPhone 15的尺寸为147.6_71.6_7.8mm，重171g，与iPhone 14相似;但两个Pro版本的长度、宽度都比14 Pro、14 Pro Max有所缩减，但厚度有所增加。

Y-C17产品手册电子元件和电路对静电放电很敏感，虽然本公司在设计电路板卡产品时会对板卡上的主要接口做防静电保护设计，但很难对所有元件及电路做到防静电安全防护。

因此在处理任何电路板组件时，建议遵守防静电安全保护措施。

防静电安全保护措施包括但不限于以下几点：运输、存储过程中应将板卡放在防静电袋中，直至安装部署时再拿出板卡。

在身体接触板卡之前应将身体内寄存的静电释放掉：佩戴放电接地腕带。

仅在静电放电安全区域内操作电路板卡。

避免在铺有地毯的区域搬移电路板。

通过板边接触来避免直接接触板卡上的电子元件。

目录1 产品介绍 (5)1.1 产品特性 (5)1.2 订货信息 (6)2 对外接口功能及位置 (7)2.1 功能连接器 (8)2.2 LED指示灯 (8)3 安装与使用 (9)3.1 安装效果图 (9)3.2 板卡使用方法 (9)4 板卡接口定义描述 (10)4.1 核心模块接口（J1） (10)4.2 Type-C 连接器（J2） (10)4.3 电源输出接口（J3） (10)4.4 PSDK信号连接器（J4） (10)4.5 Type-C 连接器（J5） (11)4.6 M Key M.2扩展接口（J6） (12)4.7 B key M.2连接器扩展接口（J7） (13)4.8 SIM卡连接器（J8） (13)4.9 Mini PCI 连接器（J9） (14)4.10 MIPI CSI连接器（J10） (15)4.11 调试串口UART2插针（J11） (16)4.12 多功能拓展连接器（J12） (16)4.14 供电DC连接器（J15） (17)4.15 RTC电池输入连接器（J16） (17)1 产品介绍Y-C17是适配搭载Jetson Xavier NX/ Orin NX / Orin Nano 模块的接口载板。

全板器件均采用宽温工业级型号，主要接口进行了静电安全保护设计，采用了高可靠性的电源应用方案，输入电源具有过压与反极性保护功能，具有丰富的对外接口。

KEY FEATURES• P rogram advanced experimental protocols with enhanced Protocol Editor • A nalyze data more accurately with new Population Spike and Action Potential Analyses • A ccelerate your results with the new Automated Event Detection and Batch Data Analysis Macros in the new Clampfit AdvancedAnalysis ModuleFlexible data acquisition, smart data analysisThe Axon™ pCLAMP™ Software Suite from Molecular Devices is the most widely-used electrophysiology data acquisition and analysis program for control andrecording of voltage-clamp, current-clamp, and patch-clamp experiments. The Axon pCLAMP 11 Software Suite consists of Clampex 11 Software for data acquisition, AxoScope 11 Software for background recording, Clampfit 11 Software for dataanalysis, and now the new optional Clampfit Advanced Analysis Module for a more sophisticated and streamlined analysis.Clampex 11 Software:flexible electrophysiology data acquisitionThe focus of the Axon pCLAMP 11 Software Suite is to provide users with greater flexibility in controlling acquisition of electrophysiology data. The previousClampex 10 version already has a powerful built-in feature set including flexible Protocol Editor, Membrane T est, P/N leak subtraction, User List and Sequencing Keys, etc. InClampex 11, we enhance this flexibility even more with a new Protocol Editor featuring an increased number of Epochs and increased sweep duration in Episodic Stimulationacquisition mode. Gap-free mode isgreatly improved with the ability to execute episodic-style Epochs and programming of digital and analog outputs. The new Membrane T est in Clampex 11 now allows viewing of multiple channels simultaneously. Independent voltage output at different stage configurations is enabled in each recorded cell. These new features provide Clampex 11 Software unparalleled ease-of-use, which makes it the software-of-choice for controlling experiments.Episodic and continuous recording modesClampex 11 Software is a superior program for stimulating cellular preparations in a sweep-oriented “episodic” mode. Stimulus waveforms can be created from a variety of sources, such as the Protocol Editor in Clampex 11 Software, pCLAMP Software ABF data files, and ASCII text files. The new Protocol Editor (Fig. 1) has been enhanced to allow 50 Epochs in episodic stimulation, and the maximum sweep duration has been extended to 516 seconds at 10 KHz sampling. Gap-free recording (Fig. 2) now features the ability to execute waveforms as well as the ability to program analogand digital output signals. Standard protocol patterns include steps, ramps, cosines, trains of pulses (biphasic), sinusoidal, or triangular patterns. Waveform stimulation utilizes a variety of timing and triggering aids, including software protocol controls and sequencing, hardware, software, and manual triggering options. Clampex 11 Software supports eight digital output bits during sweeps and eight simultaneous waveforms when used with the Digidata® 1550B digitizer. Advanced “split-clock” capability allows users to shift the sampling rate on a per-Epoch basis during sweeps, such as slowly changing conditioning or recovery phases of cell stimulation. For ease-of-use, all protocol durations aredefined in terms of time and sampling rates in terms of frequencies.For continuous recording, four different modes are available.Gap-free recording is a simple continuous “chart-recorder”recording mode useful for monitoring single channel events, minis,and other spontaneous activity. New in Clampex 11, users can nowexecute protocol-editor-style Epochs and program digital or analogoutputs in Gap-free recording. Fixed- and Variable-Length EventDetection modes are suitable for recording spontaneous eventsof regular length or varying length that are separated by longperiods of inactivity. The high-speed oscilloscope mode works likea storage oscilloscope to capture triggered fixed-length sweepsof data. By providing all of these recording modes, Clampex 11Software provides the functionality necessary for a variety of simpleand complex experimental protocols.Filtering and corrections to dataClampex 11 Software can be used to offset voltage level differencesbetween connected instruments, correct liquid junction potentialerrors arising from ionic solutions, compensate passive leakcurrents with P/N leak subtraction, or reduce high-frequency noisespikes and slow baseline drift with highpass and lowpass filtering.Clampex 11 Software works to compensate for a wide variety ofintroduced noise sources. Amplifier gain and filter settings for theAxoclamp™ 900A and MultiClamp™ 700B microelectrode amplifiersare software-telegraphed so microelectrode amplifier settingsare stored with the data. With Clampex 11 Software, the latestBNC-telegraphed amplifiers are also supported.Cell monitoringThe Membrane T est window (Fig. 3) in Clampex 11 Software allowsexperimenters to monitor pipette resistance in the bath, formationof high-resistance seals between a cell and a pipette, and tomeasure cell capacitance (Cm), membrane resistance (Rm), andaccess resistance (Ra). In Clampex 11, Membrane T est has beengreatly enhanced. When using multiple channels, all MembraneT est channels will be displayed on a window simultaneously,allowing experimenters to view the status of each channel in oneview. Independent voltage output at different stage configurationsis enabled in each recorded cell. These features allow an entireexperiment to be recorded in a single file while simultaneouslymonitoring crucial cell parameters in real time.Online analysisT o analyze data in real-time, the Clampex 11 Software featuresonline analysis. With online analysis, multiple regions can besimultaneously analyzed by an extensive set of peak-basedmeasurements, such as peak amplitude, area, mean, and standarddeviation. Measurement regions can be adjusted in real time forLTP experiments. Several measurements, such as half-width, riseand decay times, and rise and decay slopes, are useful for cardiacanalyses. Measurements are displayed in their own windows, anddifferent trace colors are used to identify each search region tosimplify interpretation.Sequencing KeysSequencing Keys control the setup and timing of operations,including loading protocols, recording data, setting analog and/or digital holding levels, running the Membrane T est, insertingcomments into the Lab Book and data file, and linking to the nextoperation. By using Sequencing Keys, complex experiments caneasily be automated, providing a powerful way to link the actions ofan entire experiment.Figure 1. The enhanced Protocol Editor is shown here.Figure 3. A screenshot of the Membrane Test.Figure 2. A screenshot of the Gap-free mode.Clampfit 11 Software: smart data preparationand analysisThe Clampfit 11 Software offers dedicated functions to quickly prepare and analyze data. Noise can be removed from signals using highpass, lowpass, and bandpass filters with Bessel, Butterworth, Chebyshev, Gaussian, or RC responses. Specialized notch and electrical interference filters can be used to remove specific noise frequencies and harmonics from recorded signals. Several different methods are available to adjust the baselines of recordings: constant values or averages can be subtracted fromall points of the recording, linear drifting baselines can be adjusted by applying a slope correction, or, for unstable baselines, a manual correction using a poly-line can be applied. Additional data analysis functions are averaging, normalization, control subtraction, and peak alignment.Data analysisIncluded with Clampfit 11 Software is a comprehensive paletteof tools for analyzing and graphing electrophysiological data.For curve fitting, users can select from 37 pre-defined functionsor define their own. Fits can be customized by selecting fitting methods and applying fitting seeds, models can be comparedwith different terms, and fits can be extrapolated to view curves, components, residuals, taus, etc. Specialized analysis tools include Fast Fourier Transform, Variance-Mean analysis, Perievent analysis, Burst analysis, and other statistical analyses. T o display results and data, a range of graph types are available in theGraph windows. Graphs are dynamically linked to their Results window so any manipulations made in the Results window updates the corresponding data in the Graph window. Numerous peak statistics can be directly measured. In this latest version, experimenters can select 24 separate regions of interest as wellas a baseline region, thus enabling the analysis of complex data. Online statistics can be recreated during offline review, eliminating the need to save separate statistics files during acquisition.A power spectrum (FFT) for noise analysis can be applied to individual, averaged, or segmented spectra and produces a log-scaled graph of the results. Standard auto and cross-correlation analyses provide the means to compare data for patterns withinor across populations. For synaptic modulation studies, the V-M analysis in Clampfit 11 Software provides a robust method forpre-/post-synaptic site identification.Event detection analysisClampfit 11 Software has extremely flexible event detection that analyzes spontaneous and evoked action potentials and post-synaptic data. Events are detected by either crossing a threshold or through a pattern-matching T emplate Search. T emplate Searches are designed for analyzing spontaneous events, such as miniature synaptic EPSPs and IPSPs. These events vary in amplitude but not shape, and thus are ideal for detection by the Clampfit 11 Software scalable shape-based algorithm. For added flexibility, multiple categories of events can be simultaneously detected and sorted for secondary analysis. The integrated environment of Clampfit 11 Software links the detected events in the data to the spreadsheet and graph windows to enable quick evaluation of the information within the context of the entire dataset. Single-channel analysisThe Clampfit 11 Software single-channel analysis allows full processing of up to 1 million events on continuous and episodic data. Open, closed and sub-conductance states of ion channels in natural or artificial membranes are detected and measured. Up to eight levels of open states are supported.An adjustment for baseline drift can be automatically applied, and an idealized record of the channel activity created. Amplitude and dwell-time histogram plots, including log and cumulative plots, can be created. Clampfit 11 Software also has specialized analyses, such as P(open), burst analysis, latency analysis, evoked response analysis, and nonstationary fluctuation analysis to estimate channel conductance.Spreadsheet analysisPrimary analysis results populate a spreadsheet where secondary analyses can be performed. These results can be analyzed within Clampfit 11 Software or exported to Microsoft Excel for further analysis. The secondary analyses available within Clampfit 11 Software are analysis of variance, F-test, Chi-squared, Kolmogorov-Smirnov, rank correlations, and Student’s t-T est. Graphing secondary data can be as easy as selecting a data column and clicking on the Create Graph button. Available graphing options include line, scatter and various histogram plots (e.g., normalized, frequency, log [square root] and cumulative).Clampfit Advanced Analysis ModuleThe Clampfit Advanced Analysis Module is a set of tools that expands the capabilities of Clampfit to combine powerful analyses with ease-of-use. Data analysis has traditionally been a bottleneck in the patch-clamp experimentation workflow. The Batch Analysis Macros within the Clampfit Advanced Analysis Module solvethis problem by applying automation principals to analyze similar data sets. Additionally, the Clampfit Advanced Analysis Module has specialized algorithms to extend the capabilities of Event Detection. Use the enhanced Automated Event Detection to eliminate the need for cumbersome third-party data analysis packages and go from data acquisition to results quickly and easily, in one simple-to-use software, without data file conversion. Automated Event DetectionThe Clampfit Advanced Analysis module provides an enhancement to the already-sophisticated Automated Event Detection engine built into Clampfit. Simply load your data file in Clampfit and highlight the portion of your data file to search. AutomatedEvent Detection will identify events based on user-defined parameters. Event detection has been enhanced to provide automated detection and measurement of population spikes and paired pulses. During detection, programmatically-determined measurements can be edited by graphically repositioning the peaks and end points of the events. If included in an optionally specified search region, stimulus artifacts are automatically detected and used to determine latency times. Multiple spike responses and paired pulse data are processed with no additional set-up requirements.Contact UsPhone: +1-800-635-5577Web: Email: ***************Check our website for a current listing of worldwide distributors.The trademarks used herein are the property of Molecular Devices, LLC or their respective owners. Specifications subject to change without notice. Patents: /productpatents FOR RESEARCH USE ONL Y. NOT FOR USE IN DIAGNOSTIC PROCEDURES. ©2017 Molecular Devices, LLC 11/17 2155A Printed in USAAction potential detection and measurement has beenconsiderably enhanced and assigned to a separate detection option which allows for the selective measurement of all action potential properties such as rise and decay times, thresholdpotentials, after-potentials duration and amplitude, and many more.Population Spike AnalysisPopulation spike recordings (Fig. 4) and paired-pulse experiments, while simple to collect, have traditionally been difficult to analyze. That changes with the Advanced Analysis Module in Clampfit 11. The Population Spike Analysis tool uses interface where the experimenter can choose the direction of the spike and specify the area to be analyzed. This tool will automatically calculate the amplitude, area under the curve, half-width, rise time, decay time, rise slope, decay slope, coastline of population spikes, and paired-pulses. These values will be populated in the Result sheet where they can be used for downstream analysis.batch analysis, simply turn on the macro capture feature, analyze your data, and save the macro. When you have additional data to analyze which have been collected with the same protocol, simply apply the saved macro and your data is analyzed automatically.*Supports all previous versions in a model line.Action Potential AnalysisAction Potential Analysis uses the Automated Event Detection engine to detect all action potentials in the data file. The Action Potential Analysis tool then automatically analyzes the data file determining the amplitude, APD90, rise time, decay time, rise slope, decay slope, peak-to-peak frequency, peak-to-peak time, change in amplitude per peak, afterpotential amplitude, afterpotential duration, and threshold potential. The ActionPotential Analysis tool can also be used analyze action potential pulse train with the same ease.Batch Data Analysis MacrosThe Clampfit Advanced Analysis Module contains a Batch Data Analysis Macro (Fig. 5) that allows experimenters to apply macros to analyze acquired data. Batch analysis saves time by analyzing abundant amounts of data created by the same protocol. Just set up your analysis once and apply it to newly-acquired data. T o useFigure 4. A screenshot of the Population Spike Analysis.Figure 5. A screenshot of the Batch Data Analysis Macros.。