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D-10General InformationWIRING, GROUNDING, AND SHIELDING TECHNIQUESProper wiring, grounding, and shielding techniques are important in obtaining proper servo operation and performance. Incorrect wiring, grounding, or shielding can cause erratic servoperformance or even a complete lack of operation. This note summarizes the proper techniques and is intended as a supplement to the information contained in the controller instruction manuals.MOTOR POWER WIRINGPacific Scientific motors are three phase and hence have three terminals. These three motor terminals are labeled R, S, and T. It is imperative that the R, S, and T motor terminals be connected to the respective R, S, and T outputs of the controller. Improper phasing of these terminals will result in erratic motor operation including “deadspots,” runaway, or stall.Another important aspect of motor wiring is grounding of the motor. There is capacitive coupling between the motor’s three phase winding and the motor’s case. When PWM voltages are applied to the motor terminals, the motor case tends to follow these voltages because of the coupling capacitance. If the motor is not grounded, Fig. D-1a, a shock hazard is present because of capacitively coupled voltage on the motor case. Therefore, motor wiring should be viewed as a four wire connection rather than a three wire connection with the fourth wire being motor ground as shown in D-1b. The motor must be properly grounded to insure proper operation and to prevent shock hazard.When the motor is grounded, pulses of current flow in the ground wire due to the motor’s winding-case capacitance. These pulses are short in duration and occur at the PWM frequency. Electrical noise due to these pulses can be radiated if proper techniques are not used. To prevent radiated noise, the motor ground wire should be tightly bundled or twisted with the three wires connected to the motor terminals as shown in D-1c. This will typically reduce radiated noise to an acceptable level.If desired or required, two other techniques can be applied to attenuate noise further. Both techniques are shown in D-1d. The first is shielding the four motor wires. The shield should be connected at the controller end only. As a general rule a shield should only be connected at one end to prevent ground loops. The second technique is the insertion of a common mode choke in the three wires connecting the motor terminals to the controller. This common mode choke is simply 10 turns of each motor terminal wire on a Ferroxcube 510-00003-00 ferrite toroidal core. Thischoke acts to reduce the amplitude of the current pulses flowing in the motor ground wire.As a general rule, the motor wiring should be kept as far away as possible from the feedback transducer wiring and any other signal level wiring. In addition, all signal level wiring should be done using shielded cable to reduce the risk of noise problems.BRUSHLESS SERVO CONTROLLERBRUSHLESS SERVO MOTOR(a) UNACCEPTABLER S TMOTOR OR CHASSIS GND(b) ACCEPTABLE-POTENTIAL RADIATED NOISE SOURCER S TMOTOR OR CHASSIS GNDR ST CASE GNDR ST CASE GND(d) ACCEPTABLE-MINIMUM RADIATED NOISEFigure D-1. Motor WiringD-11General Information BRUSHLESS SERVO CONTROLLERHALL-EFFECT SENSORBRUSHLESS SERVO CONTROLLERTACHSYN RFEEDBACK TRANSDUCER WIRINGPacific Scientific brushless servo systems use three standard feedback devices. For a torque only control system, Hall-effect devices are used. These devices provide motor commutation information to the brushless servo contoller. For analog velocity control systems, a Tachsyn ®is used. This device provides motor commutation information and motor velocity information. Finally, for position control systems and some velocity control systems a resolver is used. This device provides motor commutation information, motor velocity information, and motor position information.Each of the feedback devices described above must be properly wired to insure proper operation of the servo system. The wiring practices for each device are described below.HALL-EFFECT DEVICESThree Hall-effect devices are required to provide commutation information for Pacific Scientific three-phase brushless servo motors. The Hall-effect outputs are open collector transistors.These outputs drive the brushless servo controller sensor inputs which have resistor pull-ups.Wiring for the Hall-effect devices consists of one wire for each of the three sensor signals and two wires which provide power to the Hall-effect devices. The three sensor signal wires should be twisted together and the two power wires should be twisted together as shown in D-2a.For improved noise immunity, the five wires can be placed in a shield which is connected to the 12V RTN at the controller as shown in D-2b. This is especially important if the motor wiring is run near (within 12 inches) of the sensor wiring. The shield should only be connected at the controller end.Figure D-2. Hall-Effect Sensor WiringTACHSYN ®WIRINGThe Tachsyn ®is a five wire device that operates similar to aresolver. Two of the Tachsyn ®wires are a high frequency excitation signal. The remaining three wires are outputs which supplycommutation and velocity information to the controller. Both sets of wires must be shielded and the two excitation wires must bein separate shield from the output wires. If they are not placed in separate shields, the motor will not operate or will operate erratically.The Tachsyn ®must always be wired as shown in Figure D-3b. Any other wiring scheme will result in improper motor operation.Figure D-3. Tachsyn ®WiringRESOLVER WIRINGThe resolver is a six wire device. As with the Tachsyn®, two of the wires are a high frequency excitation signal. The remaining four wires are outputs which supply commutation, velocity, and position information to the controller. These four wires are separated into two distinct pairs: sine (S1 and S3) and cosine (S2 and S4). Hence the six wires are segregated into three pairs. Each pair must be run in a separate shield to insure proper motor operation.The resolver must always be wired as shown in Figure D-4b. Any other wiring scheme may result in improper motor operation.Figure D-4. Resolver WiringGROUNDINGThe grounding procedures listed in the controller instructions should be followed. In general, the following rules should be observed.All component chassis ground points and signal ground or common points should be tied together at a single point (star connection). This point should then be tied with a single conductor to an earth ground point. This form of grounding prevents ground loops and insures that all components are properly grounded against shock hazard.SHIELDINGIn general, it is good practice to shield all wires carrying low level signals. This is especially important if the signal level wires are run near power level wiring such as motor wires or relay wires. When shielding wires, connect only one end of the shield, preferably the source end. Connecting both ends of a shield will result in ground loops. It is recommended that the unconnected end of the shield be insulated to prevent accidental connection.(a)UNACCEPTABLED-12General Information。
wiring中断实现方式以wiring中断实现方式为标题，我们将探讨不同的方法来实现wiring中的断开连接。
wiring是一种常用的电路连接方式，用于将不同的电子元件连接在一起以实现所需的功能。
在某些情况下，我们可能需要在电路中断连接，以便在特定的条件下停止或改变电路的工作状态。
下面将介绍几种常见的wiring中断实现方式。
一、开关中断开关是一种常见的用于中断电路连接的元件。
通过打开或关闭开关，我们可以实现电路的连接或断开。
开关可以是机械式的，如按钮或切换开关，也可以是电子式的，如晶体管开关。
机械式开关通过机械接触来打开或关闭电路。
当我们按下按钮或切换开关时，机械接触会断开或连接电路，从而中断或恢复电路连接。
电子式开关使用晶体管等电子元件来控制电路连接。
当我们给电子开关施加适当的电压或信号时，它会打开或关闭，从而中断或恢复电路连接。
无论是机械式开关还是电子式开关，都可以灵活地实现wiring中的断开连接，并根据需要进行控制。
二、继电器中断继电器是一种电磁开关，可以通过电磁力打开或关闭电路。
继电器由线圈和触点组成。
当电流通过线圈时，线圈会产生磁场，吸引触点闭合，从而连接电路。
当电流停止通过线圈时，线圈的磁场消失，触点打开，中断电路连接。
继电器常用于需要较大电流或电压的电路中。
通过控制继电器的线圈电流，我们可以实现wiring中的断开连接。
三、断路器中断断路器是一种用于保护电路的装置，可以检测电路中的电流超过额定值时自动中断电路连接。
断路器通常包含一个电磁式触发器和一个可重复的开关装置。
当电路中的电流超过断路器的额定值时，触发器会被触发，断开电路连接。
一旦问题解决，我们可以通过手动操作断路器的开关装置来重新连接电路。
断路器是一种可靠的wiring中断实现方式，常用于家庭、工业和商业电路中，以保护电路和设备免受过载或短路的损坏。
四、保险丝中断保险丝是一种安全装置，可以中断电路连接以保护电路和设备。
保险丝由导体丝或带有特定电流额定值的融断器组成。
一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：multilayer printed board(mlb)13、多层印制电路板：multilayer printed circuit board14、多层印制线路板：multilayer printed wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed broad17、刚性双面印制板：rigid double-sided printed broad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (fpc)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：multi-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electro conductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated multilayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：build-up printed board40、积层多层印制板：build-up multilayer printed board (bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs)45、层间全内导通多层印制板：alivh multilayer printed board46、载芯片板：chip on board (cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive face34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad laminates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材的材料1、a阶树脂：a-stage resin2、b阶树脂：b-stage resin3、c阶树脂：c-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline phenomena20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (wpe)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adhesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaque34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (pi)38、聚四氟乙烯：polytetrafluoetylene (ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、e玻璃纤维：e-glass fibre43、d玻璃纤维：d-glass fibre44、s玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whiteness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ed copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (rcc)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：elements diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrate manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae)10、计算机辅助测试：computer-aided test.(cat)11、电子设计自动化：electric design automation .(eda)12、工程设计自动化：engineering design automaton .(eda2)13、组装设计自动化：assembly aided architectural design. (aaad)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display .(ccd)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circuit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout efficiency26、机器描述格式：machine description format .(mdf)27、机器描述格式数据库：mdf database28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics display40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digital52、设计规则检查：design rule checking53、走（布）线器：router (cad)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (pdp)59、交互式制图设计：interactive drawing design60、费用矩阵：cost matrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：maze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：Manhantton distance70、欧几里德距离：Euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、v形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：nonfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (pth)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (alivh)36、全部钻孔：all drilled hole37、定位孔：tooling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearance hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum reference。
wiringpi使用方法WiringPi是一个用于Raspberry Pi的GPIO库，它允许您以编程方式使用和控制Raspberry Pi的GPIO引脚。
下面是使用WiringPi的一些基本方法和示例：1. 安装WiringPi库：- 编译和安装WiringPi库：`cd wiringPi && ./build`2. 引入WiringPi库：```c#include <wiringPi.h>```3. 初始化WiringPi库：```cint wiringPiSetup(void);```-初始化成功返回0，失败返回-14.设置GPIO引脚的模式：```cvoid pinMode(int pin, int mode);```- `pin`是GPIO引脚的编号，可以是物理引脚编号(如18)，也可以是GPIO库定义的编号(WiringPi编号，如1)。
- `mode`有三种：INPUT（输入）、OUTPUT（输出）和PWM_OUTPUT （PWM输出）。
5.读取输入引脚的状态：```cint digitalRead(int pin);```6.写入输出引脚的状态：```cvoid digitalWrite(int pin, int value);```7.设置GPIO引脚的上拉/下拉电阻：```cvoid pullUpDnControl(int pin, int pud);```- `pud`有三种：PUD_OFF（不启用上拉/下拉电阻）、PUD_UP（使用上拉电阻）和PUD_DOWN（使用下拉电阻）。
8.设置软件PWM输出：```cvoid softPwmCreate(int pin, int initialValue, int pwmRange);void softPwmWrite(int pin, int value);void softPwmStop(int pin);```- `initialValue`为PWM输出的初始值，`pwmRange`为PWM输出的范围(最大值)。
各种外贸付款方式目前，国际贸易的结算方式有多种方式,即，汇款、信用证、托收、保函和保理，网络支付等。
一、汇款结算方式（Bank Transfer/Wiring/Telegraphic Transfer）电汇是古老的一种结算方式，但是在今天在外贸活动中仍得到广泛的运用。
“汇款结算”又根据其性质，分为“前T/T”（PAYMENT IN ADVANCE）和“后T/T”(DEFFERRED PAYMENT)两种。
所谓“前T/T”，即“预付货款”，对于出口商较为主动有利的结算品种。
汇款的另一种结算方式“后T/T”，又称“货到付款”，是一种有利于进口商，而不利于出口商的结算方式。
按照操作和付账方式又分为记帐(open account)、分期付款(installment) 寄售(consignment)。
当前，采用最普遍的汇款结算方式是定金+见提单复印件付清余款。
即，买、卖双方在签订合同以后，由买方先付一定比例的订金。
工厂先开工生产，等到货物出运后，再以交付提单为凭据（即，象征*货”），支付余下货款。
所付“定金”数额的多寡，要视买、卖双方的信任程度而定，有相当的伸缩余地，还有产品非常特殊的，比例要高，如果原材料所占比重很大，就要客户多付定金，减轻工厂压力。
如果双方是“老客户”，对方所付定金也可在30-40%之间。
不少出口商甚至允许进口商在收货、检货之后，再支付余下的货款。
“分批发货、分批收汇”，可以降低结汇风险程度。
在实务中，是一个可以考虑“规避风险”的结汇模式。
西联汇款(WESTERN UNION)可以在全球大多数国家的西联代理所在地汇出和提款，客户可以按照以下提供的方法办理西联汇款业务，如果有任何不清楚的地方可以登录西联网站()或直接联系其美国客户服务部。
西联国际汇款公司（Western Union）是世界上领先的特快汇款公司，迄今已有150年的历史，它拥有全球最大最先进的电子汇兑金融网络，代理网点遍布全球近200个国家和地区。
插线板英文插线板英文的相关文章：插线板的英文怎么说?问：就是那种一排好几个插插线板英文座的那种插线板,它的英文怎么说?答：wiring board插座，插头，托线板，插线板用英语怎么说问：这方面的词汇越多越好答：插座:socket/electrical outlet插线板英文插头:plug插线板:pinboard 插脚引线:pinouts插排、插线板用英语怎么说？答：插排；插线板power strip A:I think we need a power strip.B:Okay. I'll get one right now.A:我想我们需要一个电源插排。
B：好的，我现在就去拿一个。
插线板英文翻译问：thanks插线板英文翻译答：extension cord powe插线板英文r extender extension lead插线板是谁发明的问：插线板是谁发明的答：爱迪生发明的白炽灯把世界带入了电气时代，但墙壁插座并非与灯泡同时出现。
考虑成本因素，当电扇、电烤面包机、吸尘器、电吹风出现时，它们仍然沿袭了灯泡的供电方式——接到灯头座上。
尽管Harvey Hubbell在1904年发明了更方便的2芯插头/座，但采拖线板的英文怎么说啊?插线板英文问：RT答：connector插线板adaptor电源转换器插线板上的“I O”分别是哪两个英语单词的缩写？问：拜谢。
、。
、答：楼主脑残不是你的错插线板英文，出来瞎鉴定，你说的过去吗你。
轰天雷G3HDP-9020的插线板与插线如何插？答：主板上有英文，对应的线插上去就可以了比如HDD LED硬盘运行指示灯，power sw接开机键，白色线对开机键那边，有颜色的对显卡这边插线板选购要注意什么？问：之前买的插线板质量都不怎么好，用了没多久就坏了，求插线板质量鉴别方法。
答：一是买的时挑有品牌。
大品牌值得信赖。
还需要有3c的标志（CCC是“中国强制认证”（china compulsory certi插线板英文fication)的英文缩写）二看外观，这个还是比较直接的，好的插线板接缝处光滑平整，外壳四周无毛刺飞边。
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wc电气符号
WC电气符号是指"Wiring Diagram Code"（接线图代码）中采用的一种电气符号系统，常用于工业控制系统、机械设备等的接线图中，用于表示不同元件、设备和电路之间的连接关系。
WC电气符号在不同国家和地区可能有一些细微差异，下面是一些常见的WC电气符号示例：
1. 开关符号：用于表示开关元件，通常是一个连接断开的线条或是一个可活动的切换按钮。
常见的符号包括普通开关（一字型）、双刀双掷开关（两字型）等。
2. 电源符号：用于表示电源，通常是一个有凹角的矩形，内部是一个带有正负号的加号（+、-），表示正极和负极。
3. 电动机符号：用于表示电动机，通常是一个带有箭头的圆圈，箭头指示电动机的旋转方向。
4. 继电器符号：用于表示继电器，通常是一个矩形，内部有一个或多个标示继电器触点的线条。
5. 传感器符号：用于表示传感器元件，通常是一个圆圈内部有一个标示传感器类型的标志，如温度传感器、压力传感器等。
这些仅是WC电气符号的一些常见示例，具体的符号可以根据实际的使用和所处的国家或地区的标准来确定。
在阅读和绘制接线图时，可以参考相关的电气工程标准和规范，以确保使用正确的符号和表示方式。
一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：mulitlayer printed board(mlb) 13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (fpc)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs)45、层间全内导通多层印制板：alivh multilayer printed board46、载芯片板：chip on board (cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board 54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材的材料1、 a阶树脂：a-stage resin2、 b阶树脂：b-stage resin3、 c阶树脂：c-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (wpe)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (pi)38、聚四氟乙烯：polytetrafluoetylene (ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、 e玻璃纤维：e-glass fibre43、 d玻璃纤维：d-glass fibre44、 s玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn 49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure 58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ed copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (rcc)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing 104、双面处理铜箔：double treated foil 四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae)10、计算机辅助测试：computer-aided test.(cat)11、电子设计自动化：electric design automation .(eda)12、工程设计自动化：engineering designautomaton .(eda2)13、组装设计自动化：assembly aided architectural design. (aaad)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display .(ccd)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine descripttionm format .(mdf)27、机器描述格式数据库：mdf databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database 38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router (cad)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (pdp)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、 v形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole 28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (pth)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (alivh)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referance电路板术语总整理 *****A*****Abietic Acid松脂酸. Abrasion Resistance耐磨性. Abrasives磨料,刷材.ABS树脂.Absorption吸收(入).Ac Impedance交流阻抗. Accelerated Test(Aging)加速老化(试验). Acceleration速化反应.Accelerator 加速剂,速化剂. Acceptability,Acceptance 允收性,允收. Access Hole露出孔,穿露孔. Accuracy准确度.Acid Number (Acid Value)酸值.Acoustic Microscope (AM)感音成像显微镜. Acrylic压克力(聚丙烯酸树脂).Actinic Light (or Intensity, or Radiation)有效光. Activation活化.Activator活化剂.Active Carbon活性炭.Active Parts(Devices)主动零件.Acutance解像锐利度.Addition Agent添加剂.Additive Process加成法.Adhesion附着力.Adhesion Promotor附着力促进剂.Adhesive胶类或接着剂.Admittance导纳(阻抗的倒数).Aerosol喷雾剂,气熔胶,气悬体.Aging老化.Air Inclusion气泡夹杂.Air Knife风刀.Algorithm算法.Aliphatic Solvent脂肪族溶剂.Aluminium Nitride(AlN)氮化铝.Ambient Tamp环境温度.Amorphous无定形,非晶形.Amp-Hour安培小时.Analog Circuit/Analog Signal模拟电路/模拟讯号. Anchoring Spurs着力爪.Angle of Contack接触角. Angle of Attack攻角.Anion阴离子.Anisotropic异向性,单向的.Anneal 韧化(退火).Annular Ring孔环.Anode阳极.Anode Sludge阳极泥.Anodizing阳极化.ANSI美国标准协会.Anti-Foaming Agent消泡剂.Anti-pit Agent抗凹剂.AOI自动光学检验.Apertures开口,钢版开口.AQL品质允收水准.AQL(Acceptable Quality Level)允收品质水准. Aramid Fiber聚醯胺纤维.Arc Resistance耐电弧性.Array排列.Artwork底片.ASIC特定用途绩体电路器.Aspect Ratio纵横比.Assembly组装装配.A-stage A阶段.ATE自动电测设备.Attenuation讯号衰减.Autoclave压力锅.Axial-lead轴心引脚.Azeotrope共沸混合液.*****B*****Back Light (Back Lighting)背光法.Back Taper反锥斜角.Backpanels, Backplanes支撑板.Back-up 垫板.Balanced Transmission Lines平衡式传输线.Ball Grid Array球脚数组(封装).Bandability弯曲性.Banking Agent护岸剂.Bare Chip Assembly裸体芯片组装.Barrel孔壁,滚镀.Base Material基材.Basic Grid基本方格.Batch批.Baume波美度(凡液体比重比水重则 Be=145-(145÷Sp.Gr) 凡液体比重比水轻则 Be=140÷(Sp.Gr-130) *Sp.Gr 为比重即同体绩物质对"纯水"1g/cm的比值). Beam lead光芒式的平行密集引脚.Bed-of-Nail Testing针床测试.Bellows Conact弹片式接触.Beta Ray Backscatter贝他射线反弹散射. Bevelling切斜边.Bias斜张纲布,斜纤法.Bi-Level Stencil]双阶式钢板.Binder粘结剂.Bits头(Drill Bits).Black Oxide黑氧化层.Blanking冲空断开.Bleack 漂洗.Bleeding溢流.Blind Via Hole肓通孔.Blister局部性分层或起泡.Block Diagram电路系统块图 . Blockout封纲.Blotting干印.Blotting Paper吸水纸.Blow Hole吹孔.Blue Plaque蓝纹(锡面钝化层).Blur Edge (Circle)模糊边带(圈). Bomb Sight弹标.Bond Strength结合强度. Bondability结合性.Bonding Layer结合层接着层. Bonding Sheet(Layer)接合片. Bonding Wire结合线.Bow, Bowing板弯.Braid编线.Brazing硬焊(用含银的铜锌合金焊条). 在425℃~870℃下进行熔接的方式). Break Point显像点.Break-away Panel可断开板. Breakdown Voltage崩溃电压. Break-out破出.Bridging搭桥.Bright Dip光泽浸渍处理. Brightener光泽剂.Brown Oxide棕氧化.Brush Plating刷镀.B-stageB阶段.Build Up Process增层法制程. Build-up堆积.Bulge鼓起.Bump 突块.Bumping Process凸块制程. Buoyancy浮力.Buried Via Hole埋导孔. Burn-in高温加速老化试验. Burning烧焦.Burr毛头.Bus Bar汇电杆.Butter Coat 外表树脂层.*****C*****C4 Chip JointC4芯片焊接.Cable电缆.CAD计算机辅助设计.Calendered Fabric轧平式纲布.Cap Lamination帽式压合法.Capacitance电容.Capacitive Coupling电容耦合.Capillary Action毛细作用.Carbide碳化物.Carbon Arc Lamp碳弧灯.Carbon Treatment, Active活化炭处理.Card卡板.Card Cages/Card Racks电路板构装箱. Carlson Pin卡氏定位稍.Carrier载体.Cartridge滤心.Castallation堡型绩体电路器.Catalyzed Board, Catalyzed Substrate催化板材. Catalyzing催化.Cathode阴极.Cation阴向离子, 阳离子.Caul Plate隔板.Cavitation空泡化半真空.Center-to-Center Spacing中心间距. Ceramics陶瓷.Cermet陶金粉.Certificate证明书.CFC氟氢碳化物.Chamfer倒角.Characteristic Impedance特性阻抗. Chase纲框.Check List检查清单.Chelate螯合.Chemical Milling化学研磨.Chemical Resistance抗化性. Chemisorption化学吸附.Chip芯片(粒).Chip Interconnection芯片互连.Chip on Board芯片粘着板.Chip On Glass晶玻接装(COG).Chisel钻针的尖部.Chlorinated Solvent含氯溶剂,氯化溶剂. Circumferential Separation环状断孔. Clad/Cladding披覆.Clean Room无尘室.Cleanliness清洁度.Clearance余地,余环.Clinched Lead Terminal紧箝式引脚.Clinched-wire Through Connection通孔弯线连接法 . Clip Terminal绕线端接.Coat, Coating皮膜表层.Coaxial Cable同轴缆线.Coefficient of Thermal Expansion热膨胀系数.Co-Firing共绕.Cold Flow冷流.Cold Solder Joint冷焊点.Collimated Light平行光.Colloid胶体.Columnar Structure柱状组织.Comb Pattern梳型电路.Complex Ion错离子.Component Hole零件孔.Component Orientation零件方向.Component Side组件面.Composites,(CEM-1,CEM-3)复合板材. Condensation Soldering凝热焊接,液化放热焊接. Conditioning整孔.Conductance导电.Conductive Salt导电盐.Conductivity导电度.Conductor Spacing导体间距.Conformal Coating贴护层.Conformity吻合性, 服贴性.Connector连接器.Contact Angle接触角.Contact Area接触区.Contact Resistance接触电阻.Continuity连通性.Contract Service协力厂,分包厂.Controlled Depth Drilling定深钻孔. Conversion Coating 转化皮膜. Coplanarity共面性.Copolymer共聚物.Copper Foil铜皮.Copper Mirror Test铜镜试验. Copper Paste铜膏.Copper-Invar-Copper (CIC)综合夹心板. Core Material内层板材,核材.Corner Crack 通孔断角.Corner Mark板角标记. Counterboring方型扩孔. Countersinking锥型扩孔.Coupling Agent 偶合剂.Coupon, Test Coupon板边试样. Coverlay/Covercoat表护层.Crack裂痕.Crazing白斑.Crease皱折.Creep潜变.Crossection Area截面积. Crosshatch Testing十字割痕试验. Crosshatching十字交叉区. Crosslinking, Crosslinkage交联,架桥. Crossover越交,搭交.Crosstalk噪声, 串讯.Crystalline Melting Point晶体熔点.C-Stage C阶段.Cure硬化,熟化.Current Density电流密度.Current-Carrying Capability载流能力. Curtain Coating濂涂法.*****D*****Daisy Chained Design菊瓣设计. Datum Reference基准参考. Daughter Board子板.Debris碎屑,残材.Deburring去毛头. Declination Angle斜射角. Definition边缘逼真度. Degradation 劣化. Degrasing脱脂.Deionized Water去离子水. Delamination分离. Dendritic Growth 枝状生长.Denier丹尼尔(是编织纺织所用各种纱类直径单位, 定义9000米纱束所具有的重量(以克米计)). Densitomer透光度计.Dent凹陷.Deposition 皮膜处理.Desiccator干燥器.Desmearing去胶渣.Desoldering解焊.Developer显像液,显像机.Developing显像 .Deviation偏差.Device电子组件.Dewetting缩锡.D-glassD玻璃.Diaze Film偶氮棕片.Dichromate重铬酸盐.Dicing芯片分割.Dicyandiamide(Dicy)双氰胺.Die 冲模.Die Attach晶粒安装.Die Bonding晶粒接着.Die Stamping冲压.Dielectric 介质.Dielectric Breakdown Voltage介质崩溃电压.Dielectric Constant介质常数.Dielectric Strength介质强度.Differential Scanning Calorimetry(DSC)微差扫瞄热卡分析法. Diffusion Layer扩散层.Digitizing数字化.Dihedral Angle双反斜角.Dimensional Stability尺度安定性.Diode二极管.Dip Coating浸涂法.Dip Soldering浸焊法.DIP(Dual Inline Package)双排脚封装体.Dipole偶极,双极.Direct / Indirect Stencil直接/间接版膜.Direct Emulsion直接乳胶.Direct Plating直接电镀. Discrete Compenent散装零件. Discrete Wiring Board散线电路板,复线板. Dish Down碟型下陷.Dispersant分散剂.Dissipation Factor散失因素. Disspation Factor散逸因子.Disturbed Joint受扰焊点.Doctor Blade修平刀,刮平刀.Dog Ear狗耳.Doping掺杂.Double Layer双电层.Double Treated Foil双面处理铜箔.Drag In / Drag Out带[进/带出.Drag Soldering拖焊.Drawbridging吊桥效应.Drift漂移.Drill Facet钻尖切削面.Drill Pointer钻针重磨机.Drilled Blank已钻孔的裸板.Dross浮渣.Drum Side铜箔光面.Dry Film干膜.Dual Wave Soldering 双波焊接. Ductility展性.Dummy Land假焊垫.Dummy, Dummying假镀(片). Durometer橡胶硬度计.DYCOstrate电浆蚀孔增层法.Dynamic Flex(FPC)动态软板.*****E*****E-Beam (Electron Beam)电子束.Eddy Current涡电流.Edge Spacing板边空地.Edge-Board Connector板边(金手指)承接器. Edge-Board Contact板边金手指.Edge-Dip Solderability Test板边焊锡性测试. EDTA乙二胺四乙酸.Effluent排放物.E-glass电子级玻璃.Elastomer弹性体.Electric Strength(耐)电性强度. Electrodeposition电镀.Electro-deposition Photoresist电着光阻, 电泳光阻. Electroforming电铸. Electroless-Deposition无电镀. Electrolytic Tough Pitch电解铜.. Electrolytic-Cleaning电解清洗.Electro-migration电迁移.Electro-phoresis电泳动, 电渗.Electro-tinning镀锡.Electro-Winning电解冶炼.Elongation 延伸性, 延伸率.Embossing凸出性压花.EMF(Electromotive Force)电动势.EMI(Electromagnetic Interference)电磁干扰. Emulsion乳化.Emulsion Side药膜面.Encapsulating胶囊.Encroachment沾污,侵犯. End Tap封头.Entek有机护铜处理. Entrapment夹杂物. Entry Material盖板. Epoxy Resin环氧树脂. Etch Factor蚀刻因子. Etchant蚀刻剂(液). Etchback回蚀.Etching Indicator蚀刻指针. Etching Resist蚀刻阻剂. Eutetic Composition共融组成. Exotherm放热(曲线). Exposure曝光.Eyelet铆眼.*****F*****Fabric纲布.Face Bonding反面朝下结合.Failure故障.Fan Out Wiring/Fan In Wiring扇出布线/扇入布线. Farad 法拉.Farady法拉第.Fatigue Strength抗疲劳强度.Fault缺陷.Fault Plane断层面.Feed Through Hole导通孔.Feeder 进料器.Fiber Exposure玻纤显露.Fiducial Mark基准记号.Filament纤丝.Fill纬向.Filler填充料.Fillet内圆填角.Film底片.Film Adhesive接着膜,粘合膜.Filter过滤器.Fine Line细线.Fine Pitch密脚距,密线距,密垫距.Fineness粒度, 纯度.Finger手指.Finishing终修(饰).Finite Element Method有限要素分析法.First Article首产品.First Pass-Yield初检良品率.Fixture夹具.Flair刃角变形.Flame Point自燃点.Flame Resistant耐燃性.Flammability Rate燃性等级.Flare扇形崩口.Flash Plating闪镀. Flashover闪络.Flat Cable扁平排线.Flat Pack扁平封装(之零件).Flatness平坦度.Flexible Printed Circuit (FPC)软板. Flexural Failure挠曲损坏.Flexural Module弯曲模数, 抗挠性模数 . Flexural Strength抗挠强度.Flip Chip覆晶,扣晶.Flocculation絮凝.Flood Stroke Print覆墨冲程印刷.Flow Soldering (Wave Soldering)流焊. Fluorescence荧光.Flurocarbon Resin碳氟树脂.Flush Conductor嵌入式线路 , 贴平式导体. Flush Point闪火点.Flute退屑槽.Flux助焊剂.Foil Burr铜箔毛边.Foil Lamination铜箔压板法.Foot残足(干膜残余物).Foot Print (Land Pattern)脚垫.Foreign Material 外来物,异物.Form-to-List布线说明清单.Four Point Twisting四点扭曲法.Free Radical自由基.Freeboard干舷.Frequency频率.Frit 玻璃熔料.Fully-Additive Process全加成法.Fungus Resistance抗霉性.Fused Coating熔锡层.Fusing熔合.Fusing Fluid助熔液*****G*****G-10由连续玻纤所织成的玻纤布与环氧树脂粘结剂所复合成的材料.Gage, Gauge量规.Gallium Arsenide (GaAs)砷化镓.Galvanic Corrosion贾凡尼式腐蚀(电解式腐蚀). Galvanic Series贾凡尼次序(电动次序).Galvanizing镀锌.GAP第一面分离,长刃断开.Gate Array闸列,闸极数组.Gel Time胶化时间.Gelation Particle胶凝点.Gerber Data ,Gerber File格博档案(是美商Gerber公司专为PCB面线路图形与孔位,所发展一系列完整的软件档案).Ghost Image阴影.Gilding镀金 (现为:Glod Plating). Glass Fiber玻纤.Glass Fiber Protrusion/Gouging, Groove玻纤突出/挖破. Glass Transition Temperature, Tg玻璃态转化温度. Glaze釉面,釉料.Glob Top圆顶封装体.Glouble Test球状测试法.Glycol (Ethylene Glycol)乙二醇.Golden Board测试用标准板.Grain Size结晶粒度.Grass Leak 大漏.Grid标准格.Ground Plane /Earth Plane接地层.Ground Plane Clearance接地空环.Guide Pin导针.Gull /Wing Lead鸥翼引脚.*****H*****Halation环晕.Half Angle半角.Halide卤化物.Haloing白圈,白边.Halon海龙,是CFC"氟碳化物"的一种商品名.Hard Anodizing硬阳极化.Hard Chrome Plating镀硬铬.Hard Soldering硬焊.Hardener (Curing Agent)硬化剂(或Curing Agent). Hardness硬度.Haring-Blum Cell海固槽.Harness电缆组合.Hay Wire跳线.Heat Cleaning烧洁.Heat Dissipation散热.Heat Distortion Point (Temp)热变形点(温度).Heat Sealing热封.Heat Sink Plane散热层.Heat Transfer Paste导热膏.Heatsink Tool散热工具.Hertz(Hz)赫.High Efficiency Particulate Air Filter (HEPA)高效空气尘粒过泸机.Hipot Test 高压电测. Hi-Rel高度靠度.Hit 击(钻孔时钻针每一次"刺下"的动作). Holding Time停置时间.Hole Breakout孔位破出.Hole Counter数孔机.Hole Density孔数密度.Hole Preparation通孔准备.Hole Pull Strength孔壁强度.Hole Void破洞.Hook 切削刀缘外凸.Hot Air Levelling喷锡.Hot Bar Soldering热把焊接.Hot Gas Soldering热风手焊.HTE(High Temperature Elongation)高温延伸性. Hull Cell哈氏槽.Hybrid Integrated Circuit混成电路. Hydraulic Bulge Test液压鼓起试验. Hydrogen Embrittlement氢脆.Hydrogen Overvoltage氢过(超)电压. Hydrolysis水解.Hydrophilic亲水性.Hygroscopic吸湿性.Hypersorption超吸咐.*****I*****I.C. Socket绩体电路器插座. Icicle锡尖.Illuminance照度.Image Transfer影像转移. Immersion Plating浸镀. Impedance阻抗.Impedance Match阻抗匹配. Impregnate含浸.In-Circuit Testing组装板电测. Inclusion异物,夹杂物. Indexing Hole基准孔. Inductance(L)电感.Infrared(IR)红外线.Input/Output输入/输出. Insert, Insertion插接. Inspection Overlay套检底片. Insulation Resistance绝缘电阻. Integrated Circuit(IC)绩体电路器. Inter Face接口.Interconnection互连.Intermetallic Compound (IMC)接口共化物.Internal Stress内应力.Interposer互边导电物.Interstitial Via-Hole(IVH)局部层间导通孔.Invar殷钢(63.8%Fe,36%Ni,0.2%C).Ion Cleanliness离子清洁度.Ion Exchange Resins离子交换树脂.Ion Migration离子迁移.Ionizable (Ionic) Contaimination离子性污染.Ionization游离,电离.Ionization Voltage (Corona Level)电离化电压(电缆内部狭缝空气中,引起其电离所施加之最小电压).IPC美国印刷电路板协会.Isolation隔离性,隔绝性.*****J*****JEDEC(Joint Electronic Device 联合电子组件工程委员会. Engineering Council)J-LeadJ型接脚.Job Shop专业工厂. Joule焦耳.Jumper Wire跳线.Junction接(合)面,接头.Just-In-Time(JIT)适时供应,及时出现.*****K*****Kapton聚亚醯胺软板.Karat克拉 (1克拉(钻石)=0.2g 纯金则24k金为100%的钝金.Kauri-Butanol Value考立丁醇值(简称K.B.值). Kerf.切形,裁剪.Kevlar聚醯胺纤维.Key电键Key Board键盘.Kiss Pressure吻压, 低压.Knoop Hardness努普硬度.Known Good Die(KGD)已知之良好芯片. Kovar科伐合金(Fe53%,Ni29%,Co17%). Kraft Paper牛皮纸.*****L*****Lamda Wave延伸平波. Laminar Flow平流. Laminar Structure片状结构. Laminate Void板材空洞. Laminate(s)基板. Lamination Void压合空洞. Laminator压膜机.Land孔环焊垫,表面焊垫.Landless Hole无环通孔.Laser Direct Imaging (LDI)雷射直接成像.Laser Maching雷射加工法.Laser Photogenerator(LPG), Laser Photoplotter雷射曝光机.Laser Soldering雷射焊接法.Lay Back 刃角磨损.Lay Out布线,布局.Lay Up 叠合.Layer to Layer Spacing层间距离Leaching焊散漂出,熔出.Lead 引脚.Lead Frame脚架.Lead Pitch脚距.Leakage Current漏电电流.Legend文字标记.Leveling整平.Lifted Land孔环(焊垫)浮起.Ligand错离子附属体.Light Emitting Diodes (LED)发光二极管. Light Integrator光能累积器.Light Intensity光强度.Limiting Current Density极限电流密度.Liquid Crystal Display (LCD)液晶显示器.Liquid Dielectrics液态介质.Liquid Photoimagible Solder Mask, (LPSM)液态感光防焊绿漆.Local Area Network区域性网络.Logic 逻辑.Logic Circuit 逻辑电路.Loss Factor损失因素.Loss Tang ent (TanδDK)损失正切.Lot Size批量.Luminance发光强度.Lyophilic亲水性胶体.*****M*****Macro-Throwing Power巨观分布力.Major Defect主要(严重)缺点.Major Weave Direction主要织向.Margin刃带(钻头尖部).Marking标记.Mask阻剂.Mass Finishing大量整面(拋光).Mass Lamination大型压板.Mass Transport质量输送.Master Drawing主图.Mat席(用于CEM-3(Composite Epoxy Material)的复合材料.)Matte Side毛面(电镀铜皮(ED Foil)之粗糙面). Mealing泡点.Mean Time To Failure (MTTF)故障前可用之平均时数. Measling白点.Mechanical Stretcher机械式张网机.Mechanical Warp机械式缠绕.Mechanism机理.Membrane Switch薄膜开关.Meniscograph Test弧面状沾锡试验.Meniscus弯月面.Mercury Vaper Lamp汞气灯.Mesh Count纲目数.Metal Halide Lamp 金属卤素灯.Metallization金属化.Metallized Fabric金属化纲布.Micelle微胞. Micro Wire Board微封线板.Micro-electronios微电子.Microetching微蚀.Microsectioning微切片法.Microstrip 微条.Microstrip Line微条线,微带线.Microthrowing Power微分布力.Microwave微波.Migration迁移.Migration Rate迁移率.Mil英丝.Minimum Annular Ring孔环下限.Minimum Electrical Spacing电性间距下限.Minor Weave Direction次要织向.Misregistration 对不准度.Mixed Componmt Mounting Technology混合零件之组装技术.Modem调变及解调器.Modification修改.Module模块.Modulus of Elasticity弹性系数.Moisture and Insulation Resistance Test湿气与绝缘电阻试验.Mold Release 脱模剂,离型剂.Mole摩尔.Monofilament单丝.Mother Board主机板,母板.Moulded Circuit模造立体电路机.Mounting Hole安装孔.Mounting Hole组装孔,机装孔.Mouse Bite鼠齿(蚀刻后线路边缘出现不规则缺口). Multi-Chip-Module(MCM)多芯片芯片模块. Multiwiring Board (or Discrete Wiring Board)复线板.*****N*****N.C.数值控制.Nail Head钉头.Near IR近红外线.Negative负片,钻尖的第一面外缘变窄. Negative Etch-back反回蚀.Negative Stencil负性感光膜.Negative-Acting Resist负性作用之阻剂. Network纲状元件.Newton牛顿.Newton Ring 牛顿环.Newtonian Liquid牛顿流体.Nick缺口.N-Methyl Pyrrolidine (NMP)N-甲基四氢哔咯. Noble Metal Paste贵金属印膏. Node节点.Nodule节瘤.Nomencleature标示文字符号.Nominal Cured Thickness标示厚度.Non-Circular Land非圆形孔环焊垫.Non-flammable非燃性.Non-wetting不沾锡.Normal Concentration (Strength)标准浓度,当量浓度. Normal Distribution常态分布.Novolac酯醛树脂.Nucleation , Nucleating核化.Numerical Control数值控制.Nylon尼龙.*****O*****Occlusion吸藏.Off-Contact架空.Offset第一面大小不均.OFHC(Oxyen Free High Conductivity)无氧高导电铜. Ohm欧姆.Oilcanning盖板弹动.OLB(Outer Lead Bond)外引脚结合.Oligomer寡聚物.Omega Meter离子污染检测仪.Omega Wave振荡波.On-Contact Printing密贴式印刷.Opaquer不透明剂,遮光剂.Open Circuits断线.Optical Comparater光学对比器(光学放大器.) Optical Density光密度. Optical Inspection光学检验.Optical Instrument光学仪器.Organic Solderability Preservatives (OSP)有机保焊剂. Osmosis渗透.Outgassing出气,吹气.Outgrowth悬出,横出,侧出.Output产出,输出.Overflow溢流.Overhang总悬空.Overlap 钻尖点分离.Overpotantial(Over voltage)过电位,过电压. Oxidation氧化.Oxygen Inhibitor氧化抑制剂.Ozone Depletion臭氧层耗损.*****P*****Packaging封装,构装. Pad焊垫,圆垫.Pad Master圆垫底片. Pads Only Board唯垫板. Palladium钯.Panel制程板.Panel Plating全板镀铜. Panel Process全板电镀法.。
专利名称：FORMATION OF WIRING发明人：TAGUCHI MITSURU,KOYAMA KAZUHIDE 申请号：JP4542291申请日：19910219公开号：JPH04264719A公开日：19920921专利内容由知识产权出版社提供摘要：PURPOSE:To improve barrier properties by coating a bottom and side wall of a connection hole with a barrier metal which is formed by laminating a first Ti layer, Ti compound layer and a second Ti layer one by one and by forming an Al material layer so as to charge a connection hole while heating a substrate. CONSTITUTION:A layer insulating film 3 which consists of silicon oxide, etc., is laminated on a silicon substrate 1 wherein an impurity diffusion region 2 is formed in advance. A substrate is prepared which is formed by opening a contact hole 4 facing the impurity diffusion region 2 in the layer insulating film 3. A first Ti layer 5, a TiON layer 6 and a second Ti layer 7 are laminated one by one by a successive process all over to form a barrier metal 8. Thereby, good burying can be attained without generating whiskers.申请人：SONY CORP更多信息请下载全文后查看。
