HC1503 SOP8
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Features
VDS ID (at VGS=10V) RDS(ON) (at VGS=10V) RDS(ON) (at VGS=4.5V)
30V 13A 15mΩ(Max) 20mΩ(Max)
SOP8
DD D D
G
S SS
D
G S
Absolute Maximum Ratings TA=25°C unless otherwise noted
td(off)
tf
toff
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms L
2
EAR= 1/2 LIAR
Vds
Vgs
+
Vdd
VDC
-
Id
DUT Vgs
BVDSS I AR
Vds +
Diode Recovery Test Circuit & Waveforms
Td(off)
Tf Toff
Fig.7 Switching Time Waveform
10%
IAS
VGS
Fig.8 EAS Waveform
Hutchip Semiconductor Co.,Ltd
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V1.0
HC1503
+
VDC
-
Vgs Ig
Vds
Vgs Rg Vgs
Vds Id Vgs Rg Vgs
HC1503
30V N-Channel MOSFET
General Description
The HC1503 uses advanced trench technology and design to provide excellent RDS(ON) with low gate charge. This device is suitable for use in PWM, load switching and general purpose applications.
Hutchip Semiconductor Co.,Ltd
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V1.0
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
HC1503
Normalized On Resistance (mΩ)
ID , Continuous Drain Current (A)
1.050(BSC)
0°
8°
Dimensions In Inches
Min
Max
0.053
0.068
0.004
0.009
0.052
0.059
0.024
0.027
0.016
0.018
0.009
0.010
0.186
0.200
0.229
0.244
0.146
0.161
0.050(BSC)
0.010
0.019
Normalized Gate Threshold Voltage (V)
Normalized Thermal Response (RΘJA)
TC , Case Temperature (℃)
Fig.1 Continuous Drain Current vs. TC
TJ , Junction Temperature (℃)
0.019
0.031
0.041(BSC)
0°
8°
Hutchip Semiconductor Co.,Ltd
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V1.0
BVDSS IDSS IGSS VGS(th)
Drain-Source Breakdown Voltage VGS=0V ID=250μA 30
Zero Gate Voltage Drain Current
VDS=30V,VGS=0V
Gate-Body Leakage Current
VGS=±20V,VDS=0V
VDS=15V,VGS=0V, F=1.0MHz
V
1
μA
±100 nA
1.0 1.5
V
12
15
mΩ
14
20
mΩ
620
pF
85
pF
60
pF
SWITCHING PARAMETERS
td(on)
Turn-on Delay Time
tr
Turn-on Rise Time
td(off)
Turn-Off Delay Time
Parameter
PD TJ,TSTG
Symbol
2.1 -55 To 150
Typ
Max
Thermal Resistance junction-case
RθJc
7
Thermal Resistance unction-to-Ambient
RθJA
62
Hutchip Semiconductor Co.,Ltd
DUT
Q rr = - Idt Vgs
Vds Isd
L
Isd
IF
t rr
dI/dt
Vg
-
Vds
I RM Vdd
Hutchip Semiconductor Co.,Ltd
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V1.0
SOP8 PACKAGE INFORMATION
HC1503
Symbol
A A1 A2 A3 b c D E E1 e h L L1 θ
tf
Turn-Off Fall Time
Qg
Total Gate Charge
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
VSD
Diode Forward Voltage
Rg
Gate resistance
VGS=10V VDS=15V RL=2.6Ω RGEN=3Ω
Gate Charge Test Circuit & Waveform
+ Vds
VDC
DUT -
Vgs
10V Qgs
Qg Qgd
Resistive Switching Test Circuit & Waveforms
RL
Charge
Vds
DUT
+ Vdd
VDC
-
90% 10%
Vgs
td(on) tr ton
Dimensions In Millimeters
Min
Max
1.350
1.750
0.100
0.250
1.300
1.500
0.600
0.700
0.390
0.480
0.210
0.260
4.700
5.100
5.800
6.200
3.700
4.100
1.270(BSC)
0.250
0.500
0.500
0.800
Parameter
Symbol
Drain-Source Voltage
VDS
Maximum 30
Gate-Source Voltage
VGS
±20
TC=25°C
ID
13
Drain Current-Continuous
TC=100°C
ID
8.5
Drain Current – Pulsed
IDM
52
Maximum Power Dissipation Junction and Storage Temperature Range Thermal Characteristics
VDS=15V,ID=3A, VGS=4.5V
VGS=0V,ISD=1A VGS=0V, VDS=0V,
F=1MHz
2.6
nS
8.5
nS
18
nS
5
nS
7.1
nC
1.4
nC
1.5
nC
0.72 1.3
V
2
Ω
Note: 1. Repetitive Rating : Pulsed width limited by maximum junction temperature. 2. The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2%. 3. Essentially independent of operating temperature.
Fig.2 Normalized RDSON vs. TJ
VGS , Gate to Source Voltage (V)
TJ , Junction Temperature (℃)
Fig.3 Normalized Vth vs. TJ
Qg , Gate Charge (nC)
Fig.4 Gate Charge Waveform
1 of 6
Units V V A A A W ℃
Unit ℃ /W ℃ /W
V1.0
Electrical Characteristics (TJ=25℃ unless otherwise noted)
HC1503
Symbol Parameter
Condition
Min Typ Max Unit
STATIC PARAMETERS
Hutchip Semiconductor Co.,Ltd