常见的焊接缺陷的英文翻译

缺陷（中文）英文缺陷代号缺陷（英文）锡多ESExcess Solder装配错误AWAssembled Wrong分析错误ANAnalysis Incorrect锡连/短路SSSolder Short肮脏FMForeign Material焊球SBSolder Balls锡少ISInsufficient Solder锡盘抬起LPLifted Pads电子元件缺陷EMDElectrical Material Defect脚长LLLong Lead元件错WPWrong Part多打元件EPExtra Part元件反向RPReversed Part元件高/元件倾斜HPHigh Part元件损坏DPDamaged Part胶水多EGExcess Glue胶水少IGInsufficient Glue元件翻面IPInverted Part缺元件MPMissing Part竖立TPToinbstone Part漏焊NSNo Solder助焊剂残留板上FLFlux On Board漏盖章MSMissing Stamp脚歪BLBent Lead冷焊CSCold Solder元件偏移SKSkewed/Misalignment/Misplacement机械元件缺陷MMDMechanical Material Defect脚未过板LNPLead Not Protrusion软件错误WSWrong Software代分析TATo Be Analyzed调整错误TETurning Error安装不到位PAPoor Assembly铆接缺陷RDRivet Defects脚翘LFLead Lift缺标签MLMissing Label标签不一致LNCLabel Non-ConformityFLEXTRONICS 常见缺陷中英文对照表锡渣SRSolder Residue印章模糊SNCStamp Not Clear针歪BPBent Pin元件脱落CFOComponent Fall Off元件变形CDComponent Distortion印板开路POPCB Open焊点凹陷SUSSunken Solder插孔堵塞BHBlock Hole元件侧立POSPart On Side标签破损LDLabel Damaged标签划伤LSLabel Scratch标签模糊LILabel Indistinct线路断CB Cable Broken孔有锡BMHBlock Hole锡尖ICIcile无标识/色差NBMNo Body Marking/Discolored标签偏移LBPLabel Placement露铜EC Exposed Copper锡裂SCSolder Crack焊盘脱落PFOPad Fall Off面板刮伤PSPanel Scratch印板刮伤PBSPCB Scratch来料不良INDIncoming DefectBIOS不良BBBIOS Bad

PCB及PCBA缺陷中英文对照表

PCB及PCBA缺陷中英文对照表

1板面凹痕 dent 41漏印字符

skip

2内层白斑 I/L white spot 42金粗

Au too big

3线路缺口 circuit nick 43金簿

Au too thin

4蚀刻不净 undering etching 44金手指缺口

G/F voids/nick on G/F

5绿油剥离 S/M peel off 45金手指发黑

G/F too black

6显影不净 under developing 46字符印反

inverse C/M

7基 材 白 点 laminate measling 47金手指针孔

G/F pinholes

8铜面氧化 copper oxide 48标志不清

symbol unclear

9绿油上焊盘 s/m on pad 49标志错

symbol wrong

10白字上焊盘 c/m on pad 50绿油鬼影

ghost in S/M

11阻焊不良 poor S/M 51手指印

finger print

12线路擦花 track scratch 52补线不良

poor line repairing

13锡上线 sn on circuit 53锡高

exessive solder

1板面凹痕 dent

2内层白斑 I/L white spot

3线路缺口 circuit nick

4蚀刻不净 undering etching

5绿油剥离 S/M peel off

6显影不净 under developing

7基 材 白 点 laminate measling

8铜面氧化 copper oxi

9绿油上焊盘 s/m on pad

10白字上焊盘 c/m on pad

11阻焊不良 poor S/M

12线路擦花 track scratch

13锡上线 sn on circuit

14聚锡 sn mass

15锡灰 sn gray

16焊盘露铜 copper exposed on pad

17锡上金手指 sn on G/F

18金手指凹痕 G/F dent

19金手指擦花 G/F scratch

20金手指粗糙 G/F roughness

21v-cut不良 poor V-cut

22倒边不良 poor milling

23针床压伤 ET den

24拖锡不良 poor touch up

25补金不良 poor repairing Au

26补油不良 poor repairing s/m

27针孔 pinhole

28胶渍 paster stain

29k孔内毛刺 burrs in hole

30锡珠入孔 solder in hole

31露铜 expose Cu 40翘板 warp

41漏印字符 skip

42金粗 Au too big

43金簿 Au too thin

44金手指缺口 G/F voids/nick on G/F

45金手指发黑 G/F too black

46字符印反 inverse C/M

47金手指针孔 G/F pinholes

48标志不清 symbol unclear

49标志错 symbol wrong

50绿油鬼影 ghost in S/M

焊接缺陷中英文对照

焊接缺陷

1.裂缝：crack （焊缝/弧坑/热影响区裂纹:weld metal/crater/

heat-affected Zone (HAZ) crack）

2.焊瘤:overlap

3.冷隔：cold lap

4.未焊满: under fill / incompletely filled groove

5.咬边: undercut

6.道间没有圆滑过渡/焊缝凹陷：bum effect / Excessive concave

7.未溶合: lack of fusion / incomplete fusion

8.气孔:gas pore / blowhole (针尖状气孔:pinhole; 密集气

孔:porosity; 条虫状气孔:wormhole)

9.夹渣: slag inclusion (夹钨:tungsten inclusion; 夹杂

物:inclusion)

10.未焊透:incomplete penetration / lack of penetration

11.过度焊缝加强高：excessive reinforce / Excessive weld

metal

12.电弧烧伤：Arc strike / Arc burn

13.焊接变形: welding deformation

14.烧穿:burn through

15.塌陷: excessive penetration

16.凹坑:pit / dent

17.过度打磨：excessive grinding

18.焊疤：scar

19.飞溅：spatter

20.焊缝成行不好：poor profile

21.焊角不足：lack of weld leg

附录attachment

焊接工艺方法 1.熔焊:fusion welding 压焊:pressure welding 钎焊:brazing

welding